CN113194616A - Method for manufacturing resin plug hole without plating filling - Google Patents
Method for manufacturing resin plug hole without plating filling Download PDFInfo
- Publication number
- CN113194616A CN113194616A CN202110555479.5A CN202110555479A CN113194616A CN 113194616 A CN113194616 A CN 113194616A CN 202110555479 A CN202110555479 A CN 202110555479A CN 113194616 A CN113194616 A CN 113194616A
- Authority
- CN
- China
- Prior art keywords
- hole
- copper
- resin
- plating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Abstract
The invention provides a method for manufacturing resin plug holes without plating filling, which comprises the following steps: step 1, drilling holes in resin; step 2, copper deposition/negative film electroplating; step 3, plating a hole dry film; step 4, plating holes; step 5, plugging holes with resin; step 6, resin polishing; step 7, drilling; step 8, milling a metal slot (including a covered edge); step 9, copper deposition/plate plating; step 10, plating a hole dry film; step 11, plating holes; step 12, polishing the hole mantle; step 13, DES copper reduction; and step 14, external light imaging. According to the invention, selective resin plugging is not required to be carried out after all holes and the covered edges are metalized, the problem of substrate exposure caused by over polishing of the orifice position of the metal slotted hole (including the covered edges) is avoided, and the quality of the printed circuit board of the resin plugging process without electroplating and leveling is improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing resin plug holes without filling by electroless plating.
Background
With the increasing lightness and miniaturization of electronic products and the increasing perfection of the functions of the electronic products, the PCB is required to have higher wiring density. In order to make the wiring space between layers wider and have a greater degree of freedom, many designs directly arrange via holes or micro blind holes in a connecting disc when space utilization is considered, and the structure refers to a disc center hole. When the hole resin plugging in the disc is not used for an electroplating filling process, the manufacturing modes commonly used in the industry are divided into three modes, one mode is that selective resin plugging is adopted, a resin hole and a non-resin hole are drilled firstly, then the hole is metallized and plated (resin hole), and then the resin hole is selectively plugged through an aluminum sheet; secondly, semi-plug resistance welding, wherein the hole plug is subjected to resistance welding in an aluminum sheet hole plugging mode; and the last method is to fill holes in the disc with resin through electroplating (commonly called POVF process), design a cover film at the position of the copper of the hole cover of the external gloss resin, and remove the cover copper at the top of the resin hole by a plating stripping etching mode.
Selective resin hole plugging manufacturing process: the front process → drilling → milling metal slot hole (containing edge iron) → copper deposition 2 → negative electroplating 2 → dry film for plating hole 2 → resin hole (selective) → external light imaging → rear process, which has the following disadvantages: when the design of board bordure is more than or equal to 70% and the board thickness is less than or equal to 0.5mm, if the selective resin hole plugging manufacturing is adopted, the difficulty of resin polishing is increased due to the thin board and the small bridging, and the base material is exposed due to the bridging broken board caused by the clamping board and the over-polishing position of the board bordure, so that the quality is influenced.
Semi-plug hole solder mask manufacturing flow: the front process → drilling → milling metal slot hole (containing edge iron) → copper deposition → plate plating → external light imaging → image plating → external layer etching → aluminum sheet hole plugging → solder mask → rear process, the defects are as follows: after the solder mask hole plugging is performed, because the solvent in the ink is not completely volatilized, the ink is influenced by thermal stress due to overhigh temperature during curing, the ink in the hole flows, and after the board is baked, the PAD on the oil leads to false soldering and the white light with insufficient hole fullness leads to the risk of solder mask complaint.
The manufacturing process of the mode of etching the cover copper of the cover film after the POVF process comprises the following steps: the former process → resin drilling → copper deposition 2 → negative plating 2 → dry film plating hole 2 → resin plugging hole → resin polishing → drilling → milling metal slot (including edge covering) → copper deposition → plate plating → external light imaging → the latter process, the disadvantages are: the copper of the resin hole is broken after the cover copper is etched off due to the alignment offset of the cover film, so that the reliability of the board is influenced.
Disclosure of Invention
The present invention provides a method for manufacturing resin plug holes without electroless filling, so as to solve at least one technical problem.
To solve the above problems, as one aspect of the present invention, there is provided a method for fabricating resin via holes without filling by electroless plating, comprising:
step 1, drilling resin: processing a board by a drilling machine, and drilling a hole needing to be plugged by the resin;
step 2, copper deposition/negative film electroplating: removing the drilling dirt in the hole by removing the glue residues, activating the surface and the hole to adsorb colloidal palladium, performing redox reaction in a copper deposition cylinder to form a copper layer, thickening the hole copper and the surface copper by 12 microns in a whole-plate electroplating mode, and connecting the hole with the outer-layer copper;
step 3, plating a hole dry film: attaching a layer of photosensitive dry film on a plate after negative electroplating, selectively exposing by using a plating hole film to form a required pattern, developing by using weak alkaline liquid medicine to expose holes needing resin hole plugging, and covering a copper surface without copper plating by the dry film;
step 4, hole plating: electroplating copper thickening is carried out on the plate with the plated hole dry film in an electroplating mode to meet the requirements of customers;
step 5, plugging holes with resin: under a vacuum state and a certain pressure, filling resin ink into holes needing resin hole plugging;
step 6, resin polishing: grinding off resin adhered to the copper surface and the orifice in a ceramic plate grinding mode;
step 7, drilling: processing on a plate by a drilling machine, and drilling holes which are not plugged by resin;
step 8, milling a metal slot (including a wrapping edge): milling a plate milling machine on the plate, and milling the slotted hole and the covered edge;
step 9, copper deposition/plate plating: removing the drilling dirt in the hole by removing the glue residues, then activating the surface and the hole to adsorb colloidal palladium, performing redox reaction in a copper deposition cylinder to form a copper layer, thickening the hole copper, the position of the edge and the surface copper by 5-8 mu m by using a whole-plate electroplating mode, and connecting the hole and the edge with the outer-layer copper;
step 10, plating a hole dry film: attaching a layer of photosensitive dry film on a plated plate, selectively exposing by using a plating hole film to form a required pattern, developing by using weak alkaline liquid medicine, exposing holes needing copper plating and thickening and covered edges, and covering a copper surface without copper plating by the dry film;
step 11, hole plating: electroplating copper on the plate plated with the hole dry film in an electroplating mode to thicken the plate to be more than or equal to 20 um;
step 12, polishing the aperture mantle: polishing the copper layer protruding from the orifice to be flat;
step 13, DES copper reduction: removing a copper covering layer with the thickness of 5-8um at the top of the resin hole in a uniform chemical copper biting mode, and reducing the hole copper to 12-15 um;
step 14, external light imaging: at a certain temperature and under a certain pressure, a dry film is pasted on the board surface, the negative film is aligned, finally, the dry film which is not shielded by the negative film is made to react by utilizing the irradiation of ultraviolet light on an exposure machine, a required circuit pattern is formed on the board surface, then the film which is not irradiated by the light is dissolved under the action of a developing solution through a developing section, and the area which needs to be plated with copper and tin is exposed.
According to the invention, selective resin plugging is not required to be carried out after all holes and the covered edges are metalized, the problem of substrate exposure caused by over polishing of the orifice position of the metal slotted hole (including the covered edges) is avoided, and the quality of the printed circuit board of the resin plugging process without electroplating and leveling is improved.
Detailed Description
The following detailed description of embodiments of the invention, but the invention can be practiced in many different ways, as defined and covered by the claims.
The invention is suitable for products which do not need to be electroplated and filled and plugged by the resin in the disk mesopores and the resin in the non-disk mesopores, and is particularly suitable for products which do not need to be electroplated and filled and plugged by the resin in the disk mesopores with the edge covering design of more than or equal to 70 percent and the plate thickness of less than or equal to 0.5 mm.
The invention firstly drills the hole needing resin hole plugging, metallizes the hole through a copper deposition/negative film electroplating mode, plates the hole needing resin hole plugging to the copper thickness needed by a customer through a hole plating dry film and a hole plating mode, then coats resin on the hole plug through a whole plate hole plugging mode, polishes after the resin is cured at high temperature, drills a non-resin hole and mills a metal slot hole (including an edge covering), metallizes the hole through the copper deposition, then copper plates the hole of the non-resin hole and the metal slot hole (including the edge covering) to more than or equal to 20 mu m through the hole plating dry film and the hole plating mode, and finally achieves the purpose through the processes of burr grinding plate, DES copper reduction and the like.
The process flow of the manufacturing method of the resin plug hole filling process without electroplating filling process of the invention is described in detail by a specific embodiment: front process → resin drilling → copper deposition → negative plating → plated hole dry film → plated hole → resin plug hole → resin grinding → drilling → milling metal slot hole (including edge wrapping) → copper deposition → plate plating → plated hole dry film → plated hole → flash grinding plate → DES copper reduction → external light imaging → back process
1. Resin drilling
According to the requirement of a client, a drilling machine is used for processing on the plate, holes needing resin hole plugging are drilled, and preparation is made for facilitating the conduction of the inner layer and the outer layer in the subsequent process.
2. Copper deposition/negative plating
Removing the drilled hole dirt in the hole by the above desmearing residue to clean the hole, and activating
The surface and the hole absorb colloid palladium, and oxidation-reduction reaction is carried out in the copper deposition cylinder to form a copper layer. And then the hole copper and the surface copper are thickened by 12um in a whole-plate electroplating mode, and the hole is connected with the outer-layer copper.
3. Dry film for plating hole
Attaching a layer of photosensitive dry film on the plate after the negative film is electroplated, selectively exposing by using a plating hole film to form a required pattern, developing by using weak alkaline liquid medicine, exposing the hole needing to be plugged with resin, and covering the copper surface without being plated with copper by the dry film.
4. Plated hole
And electroplating copper thickening is carried out on the plate with the plated hole dry film by using an electroplating mode to meet the requirements of customers.
5. Resin plug hole
Under vacuum state and certain pressure, resin ink is filled into the hole to be plugged.
6. Resin grinding
And grinding off the resin adhered to the copper surface and the orifice in a ceramic plate grinding mode.
7. Drilling holes
According to the requirement of a client, a drilling machine is used for processing on the plate, holes which are not filled with resin are drilled, and preparation is made for facilitating the conduction of the inner layer and the outer layer in the subsequent process.
8. Milling metal slot (with wrapping)
And (4) milling a plate machine on the plate according to the requirements of customers, milling the slotted hole and the covered edge, and preparing for facilitating the conduction of the inner layer and the outer layer in the subsequent process.
9. Copper/plate deposition
And removing the drill hole drilling dirt in the hole by removing the glue residues, cleaning the hole, activating the surface and the hole to adsorb colloidal palladium, and performing redox reaction in a copper deposition cylinder to form a copper layer. And then, thickening the hole copper and the position and surface copper of the edge covering by 5-8um in a whole-plate electroplating mode, and connecting the hole and the edge covering with the outer-layer copper.
10. Dry film for plating hole
A layer of photosensitive dry film is attached to a plated plate, selective exposure is carried out by using a plating hole film to form a required pattern, then development is carried out by using weak alkaline liquid medicine, holes needing copper plating and thickening and covered edges are exposed, and a copper surface without copper plating is covered by the dry film.
11. Plated hole
And electroplating copper is carried out on the plate with the plated hole dry film in an electroplating mode to thicken the plate to be more than or equal to 20 um.
12. Aperture mantle of polishing
And polishing the copper layer protruding from the hole opening to be flat.
13. DES copper reduction
The copper covering layer with the thickness of 5-8um at the top of the resin hole is removed by a uniform chemical copper biting mode, and the copper of the hole is reduced to 12-15 um.
14. External light imaging
At a certain temperature and under a certain pressure, a dry film is pasted on the board surface, the negative film is aligned, finally, the dry film which is not shielded by the negative film is made to react by utilizing the irradiation of ultraviolet light on an exposure machine, a required circuit pattern is formed on the board surface, then the film which is not irradiated by the light is dissolved under the action of a developing solution through a developing section, and the area which needs to be plated with copper and tin is exposed.
The invention adds plated holes to non-resin holes and metal slotted holes (including covered edges) and DES copper reduction processes on the basis of a POVF process. The resin holes are separately manufactured with the non-resin holes and the metal slotted holes (including the covered edges), the non-resin holes and the metal slotted holes (including the covered edges) are processed after the resin holes are processed, and selective resin plugging is performed after all the holes and the covered edges are metalized. The process of milling the metal slot (including the covered edge) is manufactured after resin polishing, so that the problem of substrate exposure caused by excessive polishing of the orifice position of the metal slot (including the covered edge) is avoided, and the quality of the printed circuit board of the resin plug hole without electroplating filling process is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A method for electroless via fill resin via formation, comprising:
step 1, drilling resin: processing a board by a drilling machine, and drilling a hole needing to be plugged by the resin;
step 2, copper deposition/negative film electroplating: removing the drilling dirt in the hole by removing the glue residues, activating the surface and the hole to adsorb colloidal palladium, performing redox reaction in a copper deposition cylinder to form a copper layer, thickening the hole copper and the surface copper by 12 microns in a whole-plate electroplating mode, and connecting the hole with the outer-layer copper;
step 3, plating a hole dry film: attaching a layer of photosensitive dry film on a plate after negative electroplating, selectively exposing by using a plating hole film to form a required pattern, developing by using weak alkaline liquid medicine to expose holes needing resin hole plugging, and covering a copper surface without copper plating by the dry film;
step 4, hole plating: electroplating copper thickening is carried out on the plate with the plated hole dry film in an electroplating mode to meet the requirements of customers;
step 5, plugging holes with resin: under a vacuum state and a certain pressure, filling resin ink into holes needing resin hole plugging;
step 6, resin polishing: grinding off resin adhered to the copper surface and the orifice in a ceramic plate grinding mode;
step 7, drilling: processing on a plate by a drilling machine, and drilling holes which are not plugged by resin;
step 8, milling a metal slot (including a wrapping edge): milling a plate milling machine on the plate, and milling the slotted hole and the covered edge;
step 9, copper deposition/plate plating: removing the drilling dirt in the hole by removing the glue residues, then activating the surface and the hole to adsorb colloidal palladium, performing redox reaction in a copper deposition cylinder to form a copper layer, thickening the hole copper, the position of the edge and the surface copper by 5-8 mu m by using a whole-plate electroplating mode, and connecting the hole and the edge with the outer-layer copper;
step 10, plating a hole dry film: attaching a layer of photosensitive dry film on a plated plate, selectively exposing by using a plating hole film to form a required pattern, developing by using weak alkaline liquid medicine, exposing holes needing copper plating and thickening and covered edges, and covering a copper surface without copper plating by the dry film;
step 11, hole plating: electroplating copper on the plate plated with the hole dry film in an electroplating mode to thicken the plate to be more than or equal to 20 um;
step 12, polishing the aperture mantle: polishing the copper layer protruding from the orifice to be flat;
step 13, DES copper reduction: removing a copper covering layer with the thickness of 5-8um at the top of the resin hole in a uniform chemical copper biting mode, and reducing the hole copper to 12-15 um;
step 14, external light imaging: at a certain temperature and under a certain pressure, a dry film is pasted on the board surface, the negative film is aligned, finally, the dry film which is not shielded by the negative film is made to react by utilizing the irradiation of ultraviolet light on an exposure machine, a required circuit pattern is formed on the board surface, then the film which is not irradiated by the light is dissolved under the action of a developing solution through a developing section, and the area which needs to be plated with copper and tin is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110555479.5A CN113194616A (en) | 2021-05-21 | 2021-05-21 | Method for manufacturing resin plug hole without plating filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110555479.5A CN113194616A (en) | 2021-05-21 | 2021-05-21 | Method for manufacturing resin plug hole without plating filling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113194616A true CN113194616A (en) | 2021-07-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110555479.5A Pending CN113194616A (en) | 2021-05-21 | 2021-05-21 | Method for manufacturing resin plug hole without plating filling |
Country Status (1)
| Country | Link |
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| CN (1) | CN113194616A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114599162A (en) * | 2022-03-25 | 2022-06-07 | 景旺电子科技(龙川)有限公司 | Circuit board burr processing method and circuit board |
| CN114807934A (en) * | 2022-05-06 | 2022-07-29 | 深圳市迅捷兴科技股份有限公司 | Processing method of class carrier plate with minimum line width spacing of 2/2mil |
| CN115348757A (en) * | 2022-09-16 | 2022-11-15 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method of step blind slot circuit board with plug-in hole |
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| CN107613671A (en) * | 2017-08-02 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of circuit board plated hole |
| CN112261788A (en) * | 2020-10-22 | 2021-01-22 | 江门崇达电路技术有限公司 | Manufacturing method of thick copper high-density interconnection printed board |
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2021
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| US4605471A (en) * | 1985-06-27 | 1986-08-12 | Ncr Corporation | Method of manufacturing printed circuit boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905521A (en) * | 2021-09-17 | 2022-01-07 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing circuit board with two different hole copper thicknesses |
| CN114599162A (en) * | 2022-03-25 | 2022-06-07 | 景旺电子科技(龙川)有限公司 | Circuit board burr processing method and circuit board |
| CN114807934A (en) * | 2022-05-06 | 2022-07-29 | 深圳市迅捷兴科技股份有限公司 | Processing method of class carrier plate with minimum line width spacing of 2/2mil |
| CN115348757A (en) * | 2022-09-16 | 2022-11-15 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method of step blind slot circuit board with plug-in hole |
| CN115348757B (en) * | 2022-09-16 | 2024-04-16 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method of step blind slot circuit board with plug-in hole |
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Application publication date: 20210730 |