KR100248471B1 - Manufacturing method of ball grid array printed circuit board - Google Patents
Manufacturing method of ball grid array printed circuit board Download PDFInfo
- Publication number
- KR100248471B1 KR100248471B1 KR1019960053906A KR19960053906A KR100248471B1 KR 100248471 B1 KR100248471 B1 KR 100248471B1 KR 1019960053906 A KR1019960053906 A KR 1019960053906A KR 19960053906 A KR19960053906 A KR 19960053906A KR 100248471 B1 KR100248471 B1 KR 100248471B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- printed circuit
- bga
- printing
- via hole
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
본 발명은 실크스크린 인쇄방법을 사용하여 BGA(ball grid array)인쇄회로기판상에 레지스트 잉크를 인쇄함에 있어서, BGA 인쇄회로 기판상에 형성된 비아홀(H)과 동일한 위치에 홀을 뚫은 더미 동박적층판(6)을 스크린 인쇄기테이블(7)과 상기 BGA 인쇄회로기판(10)사이에 개재시켜 레지스트 잉크(8)를 인쇄하도록 함으로써 BGA 인쇄회로기판(10)상의 비아홀(H)을 레지스트잉크(8)로 전부 채움과 동시에 BGA 인쇄회로기판(10)의 제조에서 요구되는 일정두께 이상의 균일한 레지스트두께를 얻을 수 있도록 한 것이다.According to the present invention, in printing resist ink on a BGA (ball grid array) printed circuit board using a silk screen printing method, a dummy copper clad laminate having holes formed at the same position as a via hole (H) formed on a BGA printed circuit board ( 6) is interposed between the screen printer table 7 and the BGA printed circuit board 10 to print the resist ink 8 so that the via hole H on the BGA printed circuit board 10 is transferred to the resist ink 8. At the same time, it is possible to obtain a uniform resist thickness of a predetermined thickness or more required in the manufacture of the BGA printed circuit board 10 at the same time.
Description
본 발명은 박판형 인쇄회로기판의 제조에 관한 것으로, 더욱 상세하게는 BGA(ball grid array)인쇄 회로기판의 제조공정에 있어서 비아홀(via hole)을 레지스트 잉크로 완전히 채움과 동시에 일정두께 이상의 균일한 레지스트 두께를 갖도록 한 BGA 인쇄회로기판의 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a thin printed circuit board, and more particularly, in the manufacturing process of a ball grid array (BGA) printed circuit board, the via hole is completely filled with resist ink and at the same time, a uniform resist having a predetermined thickness or more. The present invention relates to a method for manufacturing a BGA printed circuit board having a thickness.
BGA보드는 제조공정이 단순하고 작은 면적에 많은 수의 리드를 뽑아낼 수 있으므로 IC칩, VLSI등 고집적화에 따라 최근 사용증가 추세에 있다.BGA boards have a simple manufacturing process and can draw a large number of leads in a small area, and thus the use of BGA boards is increasing due to the high integration of IC chips and VLSI.
BGA보드는 도 1에서 보는 바와같이 내층코아(1)에 비아홀(H)가공을 위한 드릴, 도금, 에칭등의 공정을 거쳐 회로패턴(2)을 형성한후 솔더마스크(solder mask)인 감광 솔더 레지스트(photosensitive solder resist : 이하 PSR이라고 함)(3) 인쇄공정, 칩의 와이어 본딩을 위한 와이어 본딩패드(4) 및 볼 본딩(ball bonding)을 위한 패드(5)를 형성하여서 된 것이다.As shown in FIG. 1, the BGA board forms a circuit pattern 2 through a process such as drilling, plating, and etching for processing a via hole (H) in the inner core 1, and then forming a photoresist solder, which is a solder mask. A photosensitive solder resist (hereinafter referred to as a PSR) 3 is formed by forming a printing process, a wire bonding pad 4 for wire bonding of a chip, and a pad 5 for ball bonding.
상기에서의 BGA보드 제조공정중에서 가장 중요한 공정의 하나는 PSR 인쇄공정인바, PSR 인쇄공정에서는 드릴 가공된 상기 비아홀(H)의 내부가 레지스트 잉크로 완전히 채워져야 한다.One of the most important processes in the BGA board manufacturing process is a PSR printing process. In the PSR printing process, the inside of the drilled via hole H must be completely filled with resist ink.
또한 도 2에서 보는 것처럼 BGA 인쇄회로 기판(10)을 솔더 법프(solder bump)를 이용하여 PCB기판(11)에 실장할때 솔더볼(solder ball)(13)을 솔더 레지스트(solder resist)층(14)이 오픈된 부분(14a)에 안정적으로 수용하고 인근의 솔더 범프와 브리지가 발생하는 것을 방지하기 위해서는 통상적인 인쇄회로기판의 솔더 레지스트보다 두꺼운 두께를 요구한다.Also, as shown in FIG. 2, when the BGA printed circuit board 10 is mounted on the PCB board 11 by using solder bumps, the solder ball 13 is attached to the solder resist layer 14. In order to stably accommodate the open portion 14a and to prevent the occurrence of nearby solder bumps and bridges, a thickness thicker than that of a conventional printed circuit board solder resist is required.
반도체 칩을 에폭시 오버몰드(epoxy overmold)(15)를 사용하여 BGA 인쇄회로기판(10)에 몰딩할 때 솔더 레지스트층(16) 두께에 편차가 있으면 두꺼운 부분과 얇은 부분의 몰딩 압력이 달라지므로 압력을 많이 받은 두꺼운 부분에 크랙(crack)이 발생할 우려가 있다. 따라서 BGA 인쇄회로의 기판 제조에는 통상적인 인쇄회로기판에서 요구되는 것보다 균일한 두께의 솔더 레지스트층(14)이 요구된다.When molding a semiconductor chip on a BGA printed circuit board 10 using an epoxy overmold 15, if the thickness of the solder resist layer 16 varies, the molding pressure of the thick and thin portions is changed. There is a risk of cracking in the thick part that receives a lot. Therefore, the manufacturing of the substrate of the BGA printed circuit requires a solder resist layer 14 having a uniform thickness than that required for a conventional printed circuit board.
도면에서 미설명부호 17, 18은 반도체다이 및 본딩와이어이다.In the drawings, reference numerals 17 and 18 denote semiconductor dies and bonding wires.
PSR 인쇄공정에서 요구되는 상기 조건을 만족 시키기 위한 종래 방법으로는 실크스크린 인쇄에 의한 방법으로 스크린(9)의 메쉬를 통상적인 인쇄에 비해 낮은 것을 사용하고 잉크의 점도를 적절히 조정하여 스퀴지(12)가 실크스크린(9)상을 왕복할 때 많은 양의 잉크가 인쇄되도록 한다. 이때 스퀴지(12)의 압력에 의해 잉크가 비아홀(H) 속으로 채워지게 된다. 실크스크린(9) 이외의 방법으로는 커턴코터(curtain coater), 스프레이 코터(spray coater)등을 이용하여 인쇄하는 방법이 있다.As a conventional method for satisfying the above conditions required in the PSR printing process, the mesh of the screen 9 is lower than that of the conventional printing by the silk screen printing method, and the viscosity of the ink is adjusted appropriately so that the squeegee 12 can be used. A large amount of ink is printed when is reciprocated on the silkscreen 9. At this time, the ink is filled into the via hole H by the pressure of the squeegee 12. As a method other than the silk screen 9, there is a method of printing using a curtain coater, a spray coater, or the like.
그러나 상기 전자의 실크스크린 인쇄의 경우 한번의 인쇄로는 일정두께이상의 레지스트 두께를 얻기 힘들고 레지스트잉크의 칙소트로피(thixotropy)로 인해 홀주위는 레지스트 잉크(8)가 얇게 된다. 또한 후자의 방법으로 인쇄 할 경우에는 한번의 인쇄로도 일정두께 이상의 레지스트층을 충분히 얻을 수 있으나 사용되는 잉크의 점도가 일반적으로 낮기 때문에 비아홀(H)속으로 흘러 내림으로써 BGA 인쇄회로기판(10)내의 비아홀(H)을 레지스트잉크(8)로 완전히 채우기가 불가능하여 비아홀(H)속으로 빨려들어간 잉크로 인해 비아홀(H)주위의 레지스트두께는 비아(H)홀에서 멀리 떨어진 부위에 비해 두께가 얇아지게 된다.However, in the case of the former silk screen printing, it is difficult to obtain a resist thickness of more than a predetermined thickness in one printing, and the resist ink 8 becomes thin around the hole due to thixotropy of the resist ink. In the latter method, the BGA printed circuit board 10 can be obtained by flowing into the via hole H because the viscosity of the ink used is generally low, although a sufficient thickness of a resist layer can be obtained even with one printing. The resist thickness around the via hole (H) is thicker than the area far away from the via (H) hole due to the ink drawn into the via hole (H) because it is impossible to completely fill the via hole (H) in the resist ink (8). Thinner.
레지스트잉크를 한번에 너무 두껍게 인쇄할 경우 후공정인 노광시 표면에서 깊은 부분은 노광기의 자외선(UV)이 닿지않기 때문에 감광성 레지스트의 경화가 일어나지 않아 이것이 이후 현상공정에서 현상되어 언더컷팅(undercutting)이 발생하기 쉬운 문제점도 있다.If the resist ink is printed too thick at one time, the deep part of the surface during the post-exposure exposure does not reach the ultraviolet light (UV) of the exposure machine, so curing of the photosensitive resist does not occur. Some problems are easy to do.
본 발명은 BGA 인쇄회로 기판을 제조함에 있어서 종래 레지스트 인쇄공정에서 발생하는 문제점을 해결하기 위한 것으로, BGA 인쇄회로 기판상에 형성된 비아 홀을 레지스트 잉크로 완전히 채움과 동시에 BGA 인쇄회로 기판에서 요구되는 일정두께의 레지스트층을 가진 BGA 인쇄회로 기판을 제조하는 방법을 제공하는데 그 목적이 있다.The present invention is to solve the problems occurring in the conventional resist printing process in manufacturing a BGA printed circuit board, the via hole formed on the BGA printed circuit board completely filled with resist ink and at the same time required for the BGA printed circuit board It is an object of the present invention to provide a method for manufacturing a BGA printed circuit board having a thick resist layer.
상기 목적을 달성하기 위한 본 발명의 GBA 인쇄회로기판의 제조방법은 실크스크린 인쇄방법을 사용하여 BGA 인쇄회로기판상에 리지스트잉므를 인쇄함에 있어서, BGA 보드 인쇄회로기판상에 형성된 비아홀과 동일한 위치에 홀을 뚫은 더비(dummy)동장적층판(copper clad laminate)지그를 인쇄기와 BGA 인쇄회로 기판 사이에 개재시켜 레지스트 잉크를 인쇄하도록 하는 것을 특징으로 하고 있다.The method for manufacturing the GBA printed circuit board of the present invention for achieving the above object is the same position as the via hole formed on the BGA board printed circuit board in printing the resisting on the BGA printed circuit board using the silk screen printing method. It is characterized in that a resist ink is printed by interposing a dummy copper clad laminate jig having a hole in it between a printing machine and a BGA printed circuit board.
도 1은 통상의 BGA 인쇄회로의 기판의 단면도.1 is a cross-sectional view of a substrate of a conventional BGA printed circuit.
도 2는 통상의 PCB기판에 BGA인쇄회로기판을 실장한 상태의 단면도.2 is a cross-sectional view of a state in which a BGA printed circuit board is mounted on a conventional PCB board.
도 3은 종래의 BGA 인쇄회로기판의 제조방법을 설명하기 위한 개략도.Figure 3 is a schematic diagram for explaining a manufacturing method of a conventional BGA printed circuit board.
도 4는 본 발명의 BGA 인쇄회로기판의 제조방법을 설명하기 위한 개략도이다.4 is a schematic view for explaining a method of manufacturing a BGA printed circuit board of the present invention.
이하 본 발명을 도 1및 도 4을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIGS. 1 and 4.
상기에서 언급한 바와같이 BGA 보드인쇄회로기판(10)은 통상적으로 0.2mm이하의 박판의 내층코아(1)에 드릴 또는 컴퓨터 수치제어(computer numeric control)방식으로 비아홀(H)을 가공하고 도금, 에칭등의 공정을 통해 회로패턴(2)을 형성한다. 그후 PSR 레지스트를 인쇄하여 상기 비아홀(H)을 레지스트 잉크로 완전히 채우게 된다.As mentioned above, the BGA board printed circuit board 10 is typically drilled and plated via-holes (H) by a drill or computer numeric control method on an inner layer core 1 of a thin plate of 0.2 mm or less. The circuit pattern 2 is formed through a process such as etching. The PSR resist is then printed to completely fill the via hole H with resist ink.
상기 비아홀(H)속을 레지스트 잉크로 완전히 채우기 위해서는 실크스크린 인쇄시 인쇄면 반대쪽에서 공기를 흡입하면서 인쇄하는 방법을 사용한다.In order to completely fill the via hole H with the resist ink, a method of printing by sucking air from the opposite side of the printing surface is used during silk screen printing.
즉, 실크스크린상(9)을 스퀴지(12)가 왕복이동하면서 비아홀(H) 주위에 인쇄된 잉크가 공기흡입에 의해 비아홀(H)속으로 빨려들와 비아홀(H)속에 레지스트 잉크로 채워지게 되는 것이다.That is, as the squeegee 12 reciprocates the silkscreen image 9, the ink printed around the via hole H is sucked into the via hole H by air suction and filled with the resist ink in the via hole H. will be.
이때 BGA보드 처럼 일정두께, 예를들면 0.2mm이하의 경우 비아홀(H)속으로 빨려들어온 과잉의 레지스트 잉크가 비아홀(H)의 반대면쪽으로 흘러내려 인쇄기의 공기 흡입구멍을 막게 되거나 인쇄시 바닥에 묻어 다음 인쇄시 인쇄회로기판에 묻게 되어 불량을 유발하게 되는 것을 방지하기위해서At this time, if BGA board has a certain thickness, for example, less than 0.2mm, excess resist ink sucked into the via hole (H) flows to the opposite side of the via hole (H) to block the air intake hole of the printer or to print on the floor. Buried on the printed circuit board during the next printing to prevent the defects from being caused
본 발명에서는 이와같은 문제점을 해결하기 위해 실제의 BGA보드 인쇄회로기판(10)에 형성된 비아홀(H)과 같은 위치에 홀(H)을 뚫은 일정두께의 더미 동박적층판 지그(6)를 인쇄기 테이블(7)과 BGA보드 인쇄회로기판(10)사이에 개재시켜 레지스트잉크(8)를 인쇄하도록 하였다. 상기 더미 동박적층판 지그(6)는 BGA보드인쇄회로기판(10)보다 두꺼운, 예를 들면 본 발명에서는 1.6mm 두께의 것으로 실제 BGA보드인쇄회로기판(10)에 형성된 비아홀(H)과 동일한 위치에 홀(H')을 형성하되 비아홀(H')의 크기보다 일정 칫수, 예를 들면 0.2mm정도 크게 홀(H')을 형성한 것이다.In the present invention, in order to solve such a problem, the dummy copper foil laminated plate jig 6 having a predetermined thickness through which the hole H is drilled at the same position as the via hole H formed on the actual BGA board printed circuit board 10 is printed on a printing machine table ( 7) and the BGA board printed circuit board 10 is interposed between the resist ink 8 to be printed. The dummy copper-clad laminate jig 6 is thicker than the BGA board printed circuit board 10, for example, 1.6 mm thick in the present invention, and is located at the same position as the via hole H formed in the actual BGA board printed circuit board 10. The hole H 'is formed, but the hole H' is formed by a certain dimension, for example, about 0.2 mm larger than the size of the via hole H '.
상기 더미 동박적층판 지그(6)를 사용하여 실크스크린 인쇄방법으로 PSR잉크를 인쇄할 경우 BGA보드 인쇄회로기판(10)에서 요구되는 0.06mm 이상의 레지스트 두께를 얻기 위해서는 두번에 나누어 인쇄를 한다.When the PSR ink is printed by the silk screen printing method using the dummy copper-clad laminate jig 6, the printing is divided in two to obtain a resist thickness of 0.06 mm or more required by the BGA board printed circuit board 10.
처음 인쇄시 0.03mm정도의 두께로 인쇄로 한후 노광, 현상 공정을 거쳐 본딩패드(4),(5) 같은 노출동박부위의 레지스트 잉크를 제거한 후 동일한 방법으로 다시 0.03mm 정도의 레지스트 잉크를 인쇄하여 원하는 두께의 레지스트층을 얻는다.When printing for the first time, after printing with thickness of about 0.03mm, remove the resist ink on exposed copper parts such as bonding pads (4) and (5) through exposure and development process, and then print the resist ink of about 0.03mm again in the same way. A resist layer of the desired thickness is obtained.
그러나 두번째 인쇄의 경우는 첫번째 인쇄된 부분과의 위치 정도 어긋납에 의해 본딩패드(4),(5) 부위의 정확한 노출동박 면적을 얻기가 어렵다. 이러한 문제를 해결하기 위해서 첫번째 인쇄의 경우는 본딩패드(4),(5) 부위의 레지스트 잉크(8)의 개구부분을 원래의 크기보다 약간 크게하고, 두번째 인쇄시는 알맞은 크기로 레지스트잉크(8)를 인쇄하여 본딩패드(4)(5)부위의 정확한 노출동박 면적을 얻을 수 있다. 즉, 상기 첫번째 인쇄시 본딩패드(4),(5)등의 노출동박부분의 레지스트를 제거하기 위한 개구부분의 크기는 실크스크린 인쇄의 인쇄정밀도를 감안하여 원래의 크기보다 0.01mm 정도 큰것이 적당하다.However, in the case of the second printing, it is difficult to obtain an accurate exposed copper foil area of the bonding pads 4 and 5 by shifting the position with respect to the first printed portion. In order to solve this problem, in the case of the first printing, the opening portion of the resist ink 8 in the bonding pads 4 and 5 is slightly larger than the original size. ), The accurate exposed copper foil area of the bonding pads (4) and (5) can be obtained. That is, the size of the opening for removing the resist of the exposed copper portions such as the bonding pads 4 and 5 during the first printing is preferably about 0.01 mm larger than the original size in consideration of the printing precision of silk screen printing. Do.
상기에서 설명한 바와 같이 BGA보드 인쇄회로기판(10)의 레지스트 인쇄공정시 실크스크린인쇄기테이블(7)와 BGA보드 인쇄회로기판(10)사이에 실제 BGA보드에인쇄회로기판(10)에 형성된 비아홀(H)과 동일한 위치에 홀(H')을 뚫은 더미 동박적층판지그(6)를 개재하여 인쇄함으로써 BGA보드 인쇄회로기판(10)상의 비아홀(H)에 레지스트잉크(8)를 전부채움과 동시에 BGA보드 인쇄회로기판(10)에서 요구되는 일정 두께 이상의 레지스트층을 가진 BGA보드 인쇄회로기판(10)을 제작할 수 있다.As described above, the via hole formed in the printed circuit board 10 on the actual BGA board between the silk screen printer table 7 and the BGA board printed circuit board 10 during the resist printing process of the BGA board printed circuit board 10 ( BGA is filled in the via hole H on the BGA board printed circuit board 10 by printing through the dummy copper-clad laminate jig 6 having holes H 'formed at the same position as H). A BGA board printed circuit board 10 having a resist layer having a predetermined thickness or more required by the board printed circuit board 10 may be manufactured.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960053906A KR100248471B1 (en) | 1996-11-14 | 1996-11-14 | Manufacturing method of ball grid array printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960053906A KR100248471B1 (en) | 1996-11-14 | 1996-11-14 | Manufacturing method of ball grid array printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980035536A KR19980035536A (en) | 1998-08-05 |
| KR100248471B1 true KR100248471B1 (en) | 2000-03-15 |
Family
ID=19481769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960053906A KR100248471B1 (en) | 1996-11-14 | 1996-11-14 | Manufacturing method of ball grid array printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100248471B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200072071A (en) | 2018-12-12 | 2020-06-22 | 인천대학교 산학협력단 | Steel pipe propulsion excavation tunneling using liquid nitrogen |
-
1996
- 1996-11-14 KR KR1019960053906A patent/KR100248471B1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200072071A (en) | 2018-12-12 | 2020-06-22 | 인천대학교 산학협력단 | Steel pipe propulsion excavation tunneling using liquid nitrogen |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19980035536A (en) | 1998-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100295732B1 (en) | Method for filling holes in printed wiring boards | |
| US7506437B2 (en) | Printed circuit board having chip package mounted thereon and method of fabricating same | |
| US6598291B2 (en) | Via connector and method of making same | |
| KR100633850B1 (en) | Method for manufacturing a substrate with cavity | |
| US6759318B1 (en) | Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process | |
| KR20040111198A (en) | Printed wiring board for mounting semiconductor | |
| US6303881B1 (en) | Via connector and method of making same | |
| KR100248471B1 (en) | Manufacturing method of ball grid array printed circuit board | |
| KR20040001048A (en) | PCB having a fine pitch circuit pattern making method | |
| KR100905568B1 (en) | Printed circuit board and method of manufacturing the same | |
| CN113543483B (en) | Solder resist hole plugging method for printed circuit board | |
| KR100490973B1 (en) | Metal mask and method of manufacture thereof, and method of manufacturing multi-layered printed circuit board using thereof | |
| KR100914892B1 (en) | Ball grid array package and manufacturing method thereof | |
| JP4738368B2 (en) | Wiring board manufacturing method | |
| JP3883948B2 (en) | Multilayer wiring board and flip chip semiconductor package | |
| KR100425728B1 (en) | Hole plugging method for printed circuit boards and hole plugging device thereof and manufacturing mathod thereof | |
| KR100305570B1 (en) | A printed circuit board and a method of manufacturing there of | |
| KR100516762B1 (en) | Method for manufatureing c2bga printed circuit board using solder plating | |
| JP4388927B2 (en) | Wiring board manufacturing method | |
| KR20010019763A (en) | Printed circuit board | |
| JP2003324168A (en) | Printed wiring board for mounting semiconductor integrated circuit | |
| JPH04152692A (en) | Manufacture of printed wiring board | |
| JPH05110234A (en) | Manufacture of printed wiring board | |
| KR20060014642A (en) | Making method of printed circuit board | |
| KR20080078429A (en) | Apparatus and method of printing the pattern on the substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20071217 Year of fee payment: 9 |
|
| LAPS | Lapse due to unpaid annual fee |