CN113556874B - Manufacturing method for bonding pad plated with thick gold - Google Patents
Manufacturing method for bonding pad plated with thick gold Download PDFInfo
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- CN113556874B CN113556874B CN202110777311.9A CN202110777311A CN113556874B CN 113556874 B CN113556874 B CN 113556874B CN 202110777311 A CN202110777311 A CN 202110777311A CN 113556874 B CN113556874 B CN 113556874B
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- gold
- copper
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- dry film
- film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
The invention provides a manufacturing method of bonding pad plated with thick gold, which comprises the following procedures of cutting, drilling, copper/board deposition, VCP (vertical continuous plating) electroplating, external light imaging 1, nickel/gold plating, film stripping 2, solder mask printing 2, external light imaging 2, local thick gold plating, film stripping/solder mask stripping, outer layer etching, solder mask/character printing and post-processing. The method comprises the steps of firstly plating nickel gold on the whole board, then removing a film, covering the bonding pad which does not need to be plated with thick gold in a green solder resisting mode with a printing surface, exposing the thick gold bonding pad which needs to be plated with thick gold, protecting the bonding pad at the position where the thick gold is plated and the bonding pad through a solder resisting bridge, and ensuring that the distance capacity between the bonding pads at the position where the thick gold is plated can be larger than or equal to 3 mil.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing bonding pads plated with thick gold.
Background
The COB (Chip-on-Board) technology is also called Chip direct mounting technology, and refers to a technology in which a bare Chip is directly attached to a printed circuit Board, then wire bonding is performed, and the Chip and a wire are encapsulated and protected by an organic adhesive. COB is the simplest bare chip mounting technology, and has the advantages of loading, packaging, assembly density, reliability, smaller volume, low manufacturing cost and the like, so that COB is favored. And use printed circuit board on COB encapsulation, the finished product surface treatment in binding pad position must be the gilt, and general gold that will plate thickness moreover just can provide Diebinding's energy needs, forms aluminium or golden total gold.
The manufacturing methods of the printed circuit board are divided into three types, one is a conventional manufacturing process of local thick gold plating after the whole circuit pattern is plated with nickel and gold, the other is an acidic manufacturing process of local thick gold plating after the local nickel and gold plating, and the other is a printing and selecting oil manufacturing process of local thick gold plating.
a. The conventional process comprises the following steps:
the process comprises the following steps: cutting → drilling → copper deposition/plate plating → VCP plating → external light imaging 1 → Ni-Au plating → external light imaging 2 → local thick Au plating → external layer etching → post process
The disadvantages are as follows: the spacing capacity of the bonding pads at the position of the plated thick gold is limited to be more than or equal to 5mil, when the spacing is less than or equal to 5mil, the appearance and the function of the printed circuit board can be influenced by film falling and diffusion plating short circuit caused by long liquid medicine attack due to the electric gold plating time when the local plated thick gold is 50-80 u', and small-spacing products cannot be manufactured.
b. The acid etching process comprises the following steps:
the process comprises the following steps: cutting → drilling → copper deposition/plate plating → VCP plating → external light imaging 1 → nickel-plated gold → external light imaging 2 → local thick gold plating → film removing 1 → external light imaging → acid etching → film removing → post process
Limitation: the position spacing capacity of the bonding pad for plating thick gold is limited to be more than or equal to 5mil, when the spacing is less than 5mil, film falling, diffusion plating and short circuit caused by long-time chemical attack of electrolytic gold time can affect the appearance and the function of the printed circuit board when the local plating thick gold is 50-80 u', and small-spacing products cannot be manufactured.
c. Preparing a printing and selecting oil process:
the process comprises the following steps: cutting → drilling → copper deposition 1/plate plating 1 → VCP plating → external light imaging 1 → acid etching → copper deposition 2/plate plating 2 → printing oil selection → external light imaging 2 → nickel plating → local gold plating → film removal → copper reduction etching → post process
Limitation: although the process flow can be used for manufacturing products with the bonding pad plating position spacing not less than 3mil, the process flow is only suitable for the process of local gold plating and gold immersion for surface treatment, and when the circuit finished product connected with the bonding pad plating position also needs windowing for surface treatment, the circuit finished product cannot be manufactured by the process flow.
Disclosure of Invention
The invention provides a manufacturing method for plating thick gold on a bonding pad, which aims to solve at least one technical problem.
In order to solve the above problems, as an aspect of the present invention, there is provided a method for manufacturing a bonding pad plated with thick gold, comprising the steps of:
step 1, cutting:
cutting the copper-clad plate into a designed size through a cutting machine;
step 2, drilling:
processing on a plate by a drilling machine;
step 3, copper deposition 1/plate plating:
removing the drill hole drilling dirt in the hole by removing the glue residues in the front to clean the hole, activating the drill hole, adsorbing colloidal palladium on the surface and in the hole, and performing redox reaction in a copper deposition cylinder to form a copper layer; then, thickening the hole copper and the surface copper by 5-8um in a whole-plate electroplating mode; connecting the hole with the outer layer copper;
step 4, VCP electroplating:
plating hole copper and surface copper on the copper-clad plate by using a whole-plate copper electroplating mode to meet the requirements of customers;
step 5, external light imaging 1:
adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film with a negative plate, irradiating the dry film on an exposure machine by using ultraviolet light to react the dry film which is not shielded by the negative plate to form a required circuit pattern on the board surface, dissolving the film which is not irradiated by light under the action of a developing solution through a developing section, and exposing a region which needs nickel plating and thin gold;
step 6, nickel and gold plating:
depositing a nickel layer and a thin gold layer with the thickness required by a client in a nickel groove and a gold groove by electroplating, wherein the thickness of the nickel layer is controlled to be 130-200u ", and the thickness of the thin gold layer is controlled to be 1-3 u";
step 7, removing the film 2:
removing the dry film on the plate to expose the metal layer;
step 8, solder mask printing 2:
printing bright green solder resist mud on the board surface by using a silk screen, removing volatilization by pre-drying to form a semi-cured film layer, performing alignment exposure, performing cross-linking reaction on the solder resist film at the illuminated place, developing the unexposed place under the action of alkali liquor, and exposing the bonding pad area needing thick gold plating; under high temperature, the solder resist is completely solidified and attached to the board surface;
step 9, external light imaging 2:
adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film with a negative plate, irradiating the dry film on an exposure machine by using ultraviolet light to enable the dry film which is not shielded by the negative plate to react, forming a preset required pattern on the board surface, dissolving the film which is not irradiated by the light under the action of a developing solution through a developing section, forming a square window at the position of a bonding pad, and exposing the region of the bonding pad which needs to be plated with thick gold;
step 10, local plating thick gold:
electroplating thick gold on the PAD at the windowing position in a gold groove in an electroplating deposition mode, so that the thin gold layer is thickened to 50-80u ";
step 11, removing the film/solder mask:
soaking the board in a strong alkali NaOH solution for 1.5H under the conditions of certain temperature and concentration, and enabling the dry film and the ink cured at high temperature to perform chemical reaction with the dry film and the ink, so that the dry film and the ink are dissolved and separated from the PCB, and exposing the nickel-gold electroplating pad and the copper surface to be etched;
step 12, outer layer etching:
copper reacts with copper ions in the etching cylinder to generate cuprous, so that the etching effect is achieved, and the circuit bonding pad patterns plated with nickel thin gold and local thick gold are exposed;
and step 13, printing solder mask/characters.
Compared with the prior art, the method has the advantages that the whole board is plated with nickel and gold and then the film is removed, then the pad which does not need to be plated with thick gold is covered by adopting a printing surface green resistance welding mode, the thick gold pad which needs to be plated with thick gold is exposed, the thick gold position bonding pad and the pad are protected by the welding resistance bridge, and the distance capacity between the thick gold position bonding pads can be larger than or equal to 3 mil.
Detailed Description
The following detailed description of embodiments of the invention, but the invention can be practiced in many different ways, as defined and covered by the claims.
The invention belongs to the field of printed circuit board manufacturing, and provides a manufacturing method for plating thick gold on a bonding pad, which is suitable for nickel-gold plating and local thick gold plating (thick hard gold or thick soft gold), and is particularly suitable for products which require a finished thick gold bonding pad connecting line to be subjected to a surface treatment process by customers.
The invention selects a corresponding plate, then drilling, copper deposition, plate plating and VCP plating are carried out to enable hole copper and surface copper to meet the requirements of customers, an outer layer circuit graph is made, the whole plate circuit graph and a pad are exposed, then nickel-gold plating is carried out, a film is removed after nickel-gold plating, the advantage of strong smooth green solder resistance adhesive force is utilized to manufacture an IC solder bridge of 3mil, a screen printing smooth green solder resistance mode is adopted to cover the pad which does not need thick gold plating, a thick gold pad which needs thick gold plating is exposed, then the solder resistance is completely solidified at high temperature and attached to the plate surface, a primary outer layer circuit graph is made, an area which needs thick gold plating is exposed, then thick gold plating is carried out, dry film and solder resistance are removed after thick gold plating is finished, and then etching and other flows are carried out to realize, thereby solving the problems of diffusion plating existing in the conventional process manufacturing and the process of printing and selecting oil process manufacturing, ensuring good appearance and performance of a PCB, the quality of the circuit board is improved. The small-spacing capacity of the bonding pads at the thick gold plating position can reach 3mil, and meanwhile, the invention can be used for manufacturing the finished product of the thick gold bonding pad which is designed to need the surface treatment process.
The process flow of the invention is as follows: cutting → drilling → copper deposition/plate plating → VCP plating → external light imaging 1 → nickel plating gold → film removal 2 → solder mask printing 2 → external light imaging 2 → local gold plating → film removal/solder mask removal → external layer etching → solder mask printing/characters → post process.
In a specific embodiment, the present invention comprises the steps of:
1. cutting material
And cutting the copper-clad plate into designed sizes through a cutting machine.
2. Drilling holes
According to the requirement of a client, the drilling machine is used for processing on the plate, and preparation is made for facilitating the conduction of the inner layer and the outer layer in the post process
3. Copper deposition 1/plate plating
And removing the drill hole drilling dirt in the hole by removing the glue residues, cleaning the hole, activating the hole, adsorbing colloidal palladium on the surface and in the hole, and performing redox reaction in a copper deposition cylinder to form a copper layer. Then, thickening the hole copper and the surface copper by 5-8um in a whole-plate electroplating mode; the hole is connected to the outer layer of copper.
4. VCP plating
And the hole copper and the surface copper on the copper-clad plate are plated by using a whole-plate copper electroplating mode to meet the requirements of customers.
5. External light imaging 1
And adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film with a negative film, irradiating the dry film on an exposure machine by using ultraviolet light to react the dry film which is not shielded by the negative film to form a required circuit pattern on the board surface, and dissolving the film which is not irradiated by light under the action of a developing solution through a developing section to expose a region which needs nickel plating and thin gold.
6. Nickel-plated gold
And depositing a nickel layer and a thin gold layer with the thickness required by a client in the nickel groove and the gold groove by electroplating, wherein the thickness of the nickel layer is controlled to be 130-200u ", and the thickness of the thin gold layer is controlled to be 1-3 u".
7. Film removing 2
And removing the dry film on the plate to expose the metal layer.
8. Solder resist 2
And (3) printing the bright green solder mask mud on the board surface by using a silk screen, removing volatilization by pre-baking to form a semi-cured film layer, performing cross-linking reaction on the solder mask at the illuminated place by counterpoint exposure, developing the unexposed place under the action of alkali liquor, and exposing the bonding pad area needing thick gold plating. And (4) completely curing the solder resist at high temperature and attaching the solder resist to the board surface.
9. External light imaging 2
And adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film by using a negative plate, irradiating the dry film on an exposure machine by using ultraviolet light to enable the dry film which is not shielded by the negative plate to react, forming a preset required pattern on the board surface, dissolving the film which is not irradiated by the light under the action of a developing solution through a developing section, forming a square window at the position of the bonding pad, and exposing the region of the bonding pad which needs to be plated with thick gold.
10. Local plating thick gold
And electroplating thick gold on the PAD at the windowing position by electroplating deposition in the gold groove, so that the thin gold layer is thickened to 50-80u ″.
11. Film/solder resist stripping
Soaking the board in a strong alkali NaOH solution for 1.5H under the conditions of certain temperature and concentration, and enabling the dry film and the ink cured at high temperature to perform chemical reaction with the dry film and the ink, so that the dry film and the ink are dissolved and separated from the PCB, and exposing the nickel-gold electroplating pad and the copper surface to be etched.
12. Outer layer etching
And (3) reacting copper with copper ions in the etching cylinder to generate cuprous, so as to achieve the etching effect and expose the circuit bonding pad patterns plated with the nickel thin gold and the local plated with the thick gold.
13. Solder mask/character printing
Resistance welding: printing solder resist mud on the board surface by a screen printing net, removing volatilization by pre-drying to form a semi-cured film layer,
through contraposition exposure, the solder mask at the illuminated place is subjected to cross-linking reaction, and the unexposed place is developed under the action of alkali liquor. And (4) completely curing the solder resist at high temperature and attaching the solder resist to the board surface.
Character: the manufacturing method is similar to that of the solder resist.
Compared with the prior art, the method has the advantages that the whole board is plated with nickel and gold and then the film is removed, then the pad which does not need to be plated with thick gold is covered by adopting a printing surface green resistance welding mode, the thick gold pad which needs to be plated with thick gold is exposed, the thick gold position bonding pad and the pad are protected by the welding resistance bridge, and the distance capacity between the thick gold position bonding pads can be larger than or equal to 3 mil.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. A manufacturing method for plating thick gold on a bonding pad is characterized by comprising the following steps:
step 1, cutting:
cutting the copper-clad plate into a designed size through a cutting machine;
step 2, drilling:
processing on a plate by a drilling machine;
step 3, copper deposition 1/plate plating:
removing the drill hole drilling dirt in the hole by removing the glue residues in the front to clean the hole, activating the drill hole, adsorbing colloidal palladium on the surface and in the hole, and performing redox reaction in a copper deposition cylinder to form a copper layer; then, thickening the hole copper and the surface copper by 5-8 μm in a whole-plate electroplating way; connecting the hole with the outer layer copper;
step 4, VCP electroplating:
plating hole copper and surface copper on the copper-clad plate by using a whole-plate copper electroplating mode to meet the requirements of customers;
step 5, external light imaging 1:
adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film with a negative plate, irradiating the dry film on an exposure machine by using ultraviolet light to react the dry film which is not shielded by the negative plate to form a required circuit pattern on the board surface, dissolving the film which is not irradiated by light under the action of a developing solution through a developing section, and exposing a region which needs nickel plating and thin gold;
step 6, nickel and gold plating:
depositing a nickel layer and a thin gold layer with the thickness required by a client in a nickel groove and a gold groove by electroplating, wherein the thickness of the nickel layer is controlled to be 130-200u ", and the thickness of the thin gold layer is controlled to be 1-3 u";
step 7, removing the film 2:
removing the dry film on the plate to expose the metal layer;
step 8, solder mask printing 2:
printing bright green solder resist mud on the board surface by using a silk screen, removing volatilization by pre-drying to form a semi-cured film layer, performing alignment exposure, performing cross-linking reaction on the solder resist film at the illuminated place, developing the unexposed place under the action of alkali liquor, and exposing the bonding pad area needing thick gold plating; under high temperature, the solder resist is completely solidified and attached to the board surface;
step 9, external light imaging 2:
adhering a dry film on the board surface under the preset temperature and pressure, aligning the dry film with a negative plate, irradiating the dry film on an exposure machine by using ultraviolet light to enable the dry film which is not shielded by the negative plate to react, forming a preset required pattern on the board surface, dissolving the film which is not irradiated by the light under the action of a developing solution through a developing section, forming a square window at the position of a bonding pad, and exposing the region of the bonding pad which needs to be plated with thick gold;
step 10, local plating thick gold:
electroplating thick gold on the welding pad at the windowing position in a gold groove in an electroplating deposition mode, so that the thin gold layer is thickened to 50-80u ";
step 11, removing the film/solder mask:
soaking the board in a strong alkali NaOH solution for 1.5H under the conditions of certain temperature and concentration, and enabling the dry film and the ink cured at high temperature to perform chemical reaction with the dry film and the ink, so that the dry film and the ink are dissolved and separated from the PCB, and exposing the nickel-gold electroplating pad and the copper surface to be etched;
step 12, outer layer etching:
copper reacts with copper ions in the etching cylinder to generate cuprous, so that the etching effect is achieved, and the circuit bonding pad patterns plated with nickel thin gold and local thick gold are exposed;
and step 13, printing solder mask/characters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110777311.9A CN113556874B (en) | 2021-07-09 | 2021-07-09 | Manufacturing method for bonding pad plated with thick gold |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110777311.9A CN113556874B (en) | 2021-07-09 | 2021-07-09 | Manufacturing method for bonding pad plated with thick gold |
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| Publication Number | Publication Date |
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| CN113556874A CN113556874A (en) | 2021-10-26 |
| CN113556874B true CN113556874B (en) | 2022-05-20 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113825320B (en) * | 2021-11-24 | 2022-02-11 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
| CN114585175B (en) * | 2022-04-29 | 2022-07-15 | 广东科翔电子科技股份有限公司 | Method for heightening Mini-LED bonding pad |
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| JPH1112783A (en) * | 1997-06-24 | 1999-01-19 | Ngk Spark Plug Co Ltd | Masking method for plating of wiring board |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN102946693A (en) * | 2012-12-11 | 2013-02-27 | 桂林电子科技大学 | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
| CN105682380A (en) * | 2016-02-03 | 2016-06-15 | 江门崇达电路技术有限公司 | Manufacturing method for PCB electroplated with thick-gold partially |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
| CN110351955A (en) * | 2019-06-17 | 2019-10-18 | 江门崇达电路技术有限公司 | A kind of production method of the PCB with local electric thick gold PAD |
-
2021
- 2021-07-09 CN CN202110777311.9A patent/CN113556874B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112783A (en) * | 1997-06-24 | 1999-01-19 | Ngk Spark Plug Co Ltd | Masking method for plating of wiring board |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN102946693A (en) * | 2012-12-11 | 2013-02-27 | 桂林电子科技大学 | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
| CN105682380A (en) * | 2016-02-03 | 2016-06-15 | 江门崇达电路技术有限公司 | Manufacturing method for PCB electroplated with thick-gold partially |
| CN109688719A (en) * | 2019-01-29 | 2019-04-26 | 深圳市迅捷兴科技股份有限公司 | The production method that thick golden plate is plated in part |
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