CN113825320B - Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board - Google Patents
Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board Download PDFInfo
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- CN113825320B CN113825320B CN202111402391.6A CN202111402391A CN113825320B CN 113825320 B CN113825320 B CN 113825320B CN 202111402391 A CN202111402391 A CN 202111402391A CN 113825320 B CN113825320 B CN 113825320B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Abstract
The whole board electrogilding of printed circuit board and local thickening gold manufacturing method and printed circuit board, the method includes: cutting, drilling, depositing copper and electroplating the whole plate; pasting an anti-electroplating dry film on two sides of the circuit board, exposing and developing to expose a circuit area needing electrogilding; carrying out pattern copper electroplating, and thickening the exposed circuit to a preset copper thickness; performing electrogilding surface treatment, namely electroplating a nickel layer on the thickened line surface and then electroplating a thin gold layer; removing the dry film; filling the silk-screen photosensitive wet film in the circuit gap thickened by pattern electroplating; drying the wet film after silk-screen printing; adhering an anti-electroplating dry film on the surface of the wet film, exposing and developing to expose the area needing to be plated with thick gold; electroplating thick gold on the exposed area; removing the dry film and the wet film, and etching with an alkaline etching solution to obtain a required circuit pattern and an electric gold layer; normally performing solder mask and subsequent processes. The problem of among the prior art paste the dry film for the second time make the first dry film hardening crisp lead to can't hugging closely the face, cause the electroplating thick gold process to appear oozing gilt is solved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a whole printed circuit board by using an electrogilding and local thickening gold and a printed circuit board.
Background
With the continuous upgrade of electronic devices, the performance requirements for printed circuit boards are also higher and higher. Therefore, in order to meet the requirement that the PCB can meet various electrical performance requirements, the design requirement that the whole PCB is plated with thin gold and then the thick gold is plated locally appears. The design has the advantages that the thin gold plating area can be used for welding, the thick gold area can be used for binding or plugging, and the whole plate electrogilding process does not need to additionally increase a lead.
The current processing flow of whole plate electrogilding and then local thick gold electroplating is drilling, copper/plate plating, first outer layer circuit, pattern electroplating (copper plating), gold plating, second circuit, thick gold plating, film stripping, etching, resistance welding and post-processing. In the process, the first outer-layer circuit is pasted with a dry film and exposed and developed to expose the area needing electrogilding, and the second outer-layer circuit is pasted with a dry film on the first dry film and exposed and developed to expose the area needing thick gold plating.
In the prior art, when the above steps are performed, for example, in the manufacturing method of the partially-plated gold plate provided in patent document with publication number CN109688719A, the dry films attached for the first and second times are removed together in the film removing process, then the circuit is etched by using an alkaline etching solution, the electrogilding gate is protected and remained, and other areas are etched away, so as to obtain the required circuit pattern of the whole plate of electrogilding and partially-plated gold. The main disadvantage of the above process is that in the second outer layer circuit processing process, the dry film pasted for the first time is hot pressed again in the second dry film pasting process, so that the dry film pasted for the first time becomes hard and brittle, and cannot be tightly pasted on the board surface, and the problem of gold penetration and gold plating occurs in the thick gold electroplating process.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for manufacturing a whole-board electrogilding and local thickening gold of a printed circuit board and the printed circuit board, aiming at solving the problem that the plate surface cannot be tightly attached due to the fact that a dry film is pasted for the first time and becomes brittle for the second time, and the problem of gold infiltration and gold plating is caused in the process of electroplating the thick gold.
In order to achieve the above object, the present invention employs the following techniques:
the method for manufacturing the whole printed circuit board by electroplating gold and then locally thickening the gold comprises the following steps:
s1, pre-processing: cutting, drilling and copper deposition are carried out in sequence, and the whole printed circuit board is electroplated;
s2, first circuit: pasting an anti-electroplating dry film on two sides of the printed circuit board, and then carrying out exposure and development to expose a circuit area needing electrogilding;
s3, pattern electroplating: carrying out pattern copper electroplating, and thickening the exposed circuit to a preset copper thickness;
s4, electro-thin gold: performing electrogilding surface treatment, namely electroplating a nickel layer on the thickened line surface and then electroplating a thin gold layer;
s5, removing the film: removing the dry film stuck in the first circuit;
s6, printing a wet film: silk-screen printing a photosensitive wet film, wherein the silk-screen printing wet film is filled in the gaps of the circuit which is thickened by pattern electroplating; drying the wet film after silk-screen printing;
s7, second circuit: adhering an anti-electroplating dry film on the surface of the wet film, exposing a region needing to be plated with thick gold after exposure and development, wherein the region needing to be plated with thick gold belongs to a part of circuit regions in the circuit region electroplated with thin gold;
s8, electroplating thick gold: electroplating thick gold on the exposed area of the second circuit;
s9, stripping and etching: removing the dry film adhered to the second circuit and the wet film printed by silk screen printing, and etching with alkaline etching solution to obtain a required circuit pattern and an electric gold layer;
and S10, normally performing solder mask and subsequent processes.
In step S2, the dry film attached to the first circuit is an acid-resistant dry film, and the developing reagent is a sodium carbonate solution with a concentration of 1.5% to 2.0%.
In step S4, the thickness of the electroplated nickel is 4 μm to 6 μm, and the thickness of the electroplated thin gold is 0.025 μm to 0.075 μm.
The thickness of the electroplated thick gold in step S8 is 0.375 μm to 0.5 μm.
In step S6, the silk-screen photosensitive wet film includes a first silk-screen and a second silk-screen, after the first silk-screen is completed, the wet film of the first silk-screen is dried by hot air for a predetermined time, and then the second silk-screen is performed, where the second silk-screen is perpendicular to the stroke direction of the silk-screen scraper of the first silk-screen. The lower portion of the silk-screen scraping plate in the first silk-screen printing is obliquely arranged towards the back, the lower portion of the silk-screen scraping plate in the first silk-screen printing is vibrated from the back of the silk-screen scraping plate, and the vibration frequency is 6000 times/min-20000 times/min.
The invention has the beneficial effects that:
1. in the processing flow of electroplating thick gold on the whole plate and then locally electroplating thick gold, the problems that the dry film for the second time is pasted on the basis of the dry film for the first time, the dry film for the first time is hot pressed again, so that the dry film for the first time is hardened and embrittled and cannot be tightly pasted on the plate surface, and the infiltration gold plating is caused in the thick gold electroplating process in the prior art are solved by the mode of removing the dry film for the first time, silk-printing the wet film, drying and then pasting the dry film for the second time;
2. aiming at that local lines are thickened to form bulges to a certain degree, the step of screen printing wet films is optimized to be screen printing with two times of vertical stroke directions, and the hot air drying step is arranged in the middle of the wet films at intervals, so that the screen printing wet films can effectively and fully fill the gaps of the lines thickened for the first time, the conditions that screen printing is hollowed out or is not full due to the thickening of the local line bulges are avoided, the problems that gaps exist between the screen printing wet films and the dried wet films after the second dry films are attached are avoided, and the infiltration gilding is avoided;
3. the screen printing process is optimized, the scraper plate keeps vibration with a certain frequency during the first screen printing, the liquid filling sufficiency of the wet film in the screen printing is improved, and particularly, the screen printing scraper plate can be used for correspondingly filling the screen printing of gaps with thicker lines and improving the screen printing filling efficiency and the filling rate;
4. the two-time silk-screen printing is integrated to one operation working position to be finished, the fixing table is improved, the first silk-screen printing, the hot air drying and the second silk-screen printing can be finished by fixing the printed circuit board once, and the hot air drying at intervals in the middle can be automatically finished, so that the operation efficiency is improved; meanwhile, the wet film after the first silk-screen printing is subjected to hot air drying for a preset time, so that a foundation can be provided for the second silk-screen printing, and the defect that the second silk-screen printing causes disturbance in a filling area to the wet film after the first silk-screen printing to cause gap filling is avoided.
Drawings
FIG. 1 is a flow chart of a method according to an embodiment of the present application.
FIG. 2 is a flow chart of the wet film printing process according to an embodiment of the present disclosure.
FIG. 3 is a schematic diagram of the whole plate of the present application with the formation of the metal layer being thickened locally.
Fig. 4 is a perspective view of a screen printing squeegee according to an embodiment of the present application.
Fig. 5 is a side view of a screen squeegee according to an embodiment of the present application.
Fig. 6 is a complete view of the screen squeegee according to the embodiment of the present application.
Fig. 7 is a perspective view of a stationary stage according to an embodiment of the present application.
Fig. 8 is a sectional view of a stationary stage according to an embodiment of the present application.
Fig. 9 is a schematic view of a squeegee implementation of the first screen printing according to an embodiment of the present application.
Fig. 10 is a schematic diagram illustrating an embodiment of the first screen printing of the present application in which the squeegee is used in pairs.
Reference numerals: 1 a-thickened copper, 1 b-electroplated nickel, 1 c-electroplated thin gold, 1 d-electroplated thick gold, 20-a fixed table, 21-a printed board support table, 22-a printed board placing identification area, 23-a limiting table, 24-a lifting mechanism, 3-a hot air dryer, 5-a fixed plate, 51-a clamping groove, 6-a clamping board, 61-a clamping part, 7-a vibration motor, 71-a transverse frame, 72-a vibration transmission rod, 8-a bottom scraping rod and 81-a vertical frame.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
This embodiment provides a method for manufacturing a printed circuit board by electroplating gold on the whole board and then locally thickening the gold, as shown in fig. 1, comprising the following steps:
s1, pre-processing: cutting, drilling, depositing copper and electroplating the whole printed circuit board.
S2, first circuit: pasting electroplating-resistant dry films on two sides of the printed circuit board, wherein the dry films are acid-resistant dry films, and the developing reagent is a sodium carbonate solution with the concentration of 1.5-2.0%; and then carrying out exposure and development to expose the circuit area needing the electrogilding.
S3, pattern electroplating: patterned copper electroplating is performed to thicken the exposed lines to a predetermined copper thickness, resulting in thickened copper 1a as shown in fig. 3.
S4, electro-thin gold: and (3) carrying out gold electroplating surface treatment, electroplating a nickel layer on the thickened line surface to obtain electroplated nickel 1b shown in the figure 3, wherein the thickness of the electroplated nickel 1b is 4-6 mu m, and then electroplating a thin gold layer to obtain electroplated thin gold 1c shown in the figure 3, wherein the thickness of the electroplated thin gold is 0.025-0.075 mu m.
S5, removing the film: and removing the dry film stuck in the first circuit.
S6, printing a wet film: silk-screen printing a photosensitive wet film, wherein the silk-screen printing wet film is filled in the gaps of the circuit which is thickened by pattern electroplating; and drying the wet film after silk-screen printing of the wet film.
S7, second circuit: and sticking an anti-electroplating dry film on the surface of the wet film, exposing an area needing to be plated with thick gold after exposure and development, wherein the area needing to be plated with thick gold belongs to a part of circuit area in the circuit area electroplated with the thin gold layer.
S8, electroplating thick gold: and electroplating thick gold on the exposed area of the second circuit to obtain the electroplated thick gold with the thickness of 0.375-0.5 μm shown in figure 3, wherein part of the thickened area of the finally obtained product is shown as the left side in figure 3, and part of the electroplated thick gold is arranged on the left area and is shown as the right side in figure 3.
S9, stripping and etching: and removing the dry film adhered to the second circuit and the wet film printed by silk screen printing, and etching by using alkaline etching liquid to obtain the required circuit pattern and the gold layer.
And S10, normally performing solder mask and subsequent processes.
Preferably, when the step S6 is performed, part of the line regions are thickened through a preceding procedure, and to fill the thickened line gaps, the filling effectiveness and filling rate must be ensured to make an effective basis for the subsequent second dry film application.
Specifically, in step S6, the first screen printing and the second screen printing are performed on the same screen printing operation table, where the screen printing operation table includes a fixed table, a screen printing frame plate located above the fixed table and capable of moving up and down, a first screen printing scraper located in the screen printing frame plate and capable of moving along the length direction of the screen printing frame plate, and a second screen printing scraper located in the screen printing frame plate and capable of moving along the width direction of the screen printing frame plate, where the first screen printing scraper and the second screen printing scraper have stroke directions perpendicular to each other, as shown in fig. 7 to 8, the fixed table 20 has multiple support legs, a table top is provided on the support legs, a lifting hole is provided in the middle of the fixed table 20, the lifting hole is located on the table top, a printed board support table 21 is provided in the lifting hole, and a printed board placement identification area 22 is provided on the printed board support table for placing the printed boards, and after placing, the printed boards are fixed by adhering adhesive tapes. The bottom surface of the printed board support table 21 is connected with a pair of lifting mechanisms 24, a pair of hot air dryers 3 are arranged on two sides of each lifting mechanism 24, and the hot air dryers 3 are fixed at the bottom of the fixed table 20; the bottom of the printed board support table 21 is provided with a limit table 23, which is used for contacting with the table top of the fixed table 20 when the printed board support table 21 is lifted to the highest position by the lifting mechanism 24 to limit the lifting position, and when the limit table 23 contacts with the table top of the fixed table 20, the top surface of the printed board support table 21 is flush with the table top. The lift mechanism 24 may employ a lift cylinder.
Specifically, step S6 includes the flow shown in fig. 2:
and S61, carrying out first silk-screen printing, wherein the lower part of the adopted silk-screen scraper is obliquely arranged towards the back, and the lower part of the adopted silk-screen scraper is vibrated from the back of the silk-screen scraper in the first silk-screen printing, and the vibration frequency is 6000 times/min-20000 times/min.
Specifically, as shown in fig. 4 to 5, a screen printing scraper applied to this step is provided, and the screen printing scraper includes a fixed plate 5 and an obliquely arranged clamping plate 6, wherein a clamping groove 51 is formed in the bottom surface of the fixed plate 5 in an upward concave manner, a clamping portion 61 is provided at the top of the clamping plate 6, and the clamping portion 61 is clamped in the clamping groove 51 and fixed by bolts. The intermediate plate 6 is inclined from the joint with the fixed plate 5 toward the back. The top of the fixing plate 5 is connected to a stroke assembly of the silk-screen printing machine and is used for moving along the designated direction along with the stroke assembly. The back of the fixing plate 5 is connected with a plurality of vibration motors 7 through a cross frame 71 and is used for providing vibration with the frequency of 6000 times/min-20000 times/min, the vibration ends of the vibration motors 7 are connected with vibration transmission rods 72, and the bottoms of the vibration transmission rods 72 are abutted against the back of the clamping plate 6. During the application, press from both sides the front surface of establishing portion 61 and be used for contacting wet membrane liquid, and along with stroke propelling movement wet membrane liquid, through silk screen printing framed panel to printed circuit board silk screen printing wet membrane, because erect portion 61 for the slope design, compare in the straight board scraper blade of prior art, it can only provide forward force, and in this example as shown in fig. 9, can make partial printing ink hold in silk screen printing framed panel and erect the region between the portion 61 front surface, as in the picture in the h scope, in the stroke process, not only can provide forward force through erecting portion 61, still in the propelling movement process, through constantly extrudeing wet membrane liquid, make the inclined plane give the power of slope downside, local circuit thickening in the whole board electrogold that should this example again local thickening gold, when the circuit clearance becomes dark, have better pan feeding effect, improve the silk screen printing filling rate. Furthermore, in the process of the stroke, the stroke speed of the silk screen is reduced, so that the stroke speed is lower than the silk screen speed in the prior art, meanwhile, the vibration output by the vibration motor 7 is transmitted to the back of the erection part 61 through the vibration transmission rod 72, so that the erection part 61 performs high-frequency vibration, and the sufficiency of the wet film passing through the silk screen frame plate can be improved through the high-frequency vibration. In order to ensure the effectiveness of silk-screen printing, as shown in fig. 6, a bottom scraping rod 8 is arranged on the back side of the bottom of the clamping part 61, and the bottom scraping rod 8 is connected with the transverse frame 71 through a vertical frame 81, so that the bottom can be always in contact with the silk-screen frame plate through the scraping plate 8 in the process of stroke although vibration exists, and the silk-screen effect is maintained.
This step of this embodiment, through the portion 61 of erectting of slope and carry out high-frequency vibration to its back, reduce certain silk screen printing stroke speed simultaneously for in the whole board electrogilding that this example relates to is local thickening gold technical environment again, can ensure to carry out the silk screen printing filling to the clearance between the circuit of thickening, guarantee the first rate of being full of. The squeegee of the present example, in the first screen printing, may be run only once for each printed circuit board; the scrapers of the embodiment can also be used in pairs and symmetrically arranged in use, as shown in fig. 10, the double-sided use can be realized, and when the scrapers are used on the double sides, the reciprocating stroke silk screen printing can be carried out in the first silk screen printing.
And S62, after the first silk screen printing is finished, hot air drying is carried out on the wet film subjected to the first silk screen printing for a preset time.
Specifically, after the first screen printing is completed, the printed board support table 21 on which the printed boards are fixed is lowered to a position below the bottom surface of the fixed table 20 by using the lifting mechanism 24, hot air is supplied to the printed board support table 21 by using the hot air dryers 3 on both sides, and the hot air acts on the printed circuit board of the printed board support table 21 to dry the wet film of the first screen printing for a predetermined period of time; then, the elevating mechanism 24 raises the printed board support table 21 until it is restored to the uppermost position, and prepares for the second screen printing.
And S63, carrying out secondary screen printing on the printed circuit board supporting table 21 by using the second screen printing scraper, wherein the stroke directions of the second screen printing scraper and the first screen printing scraper are vertical, and drying the wet film again after finishing the secondary screen printing. And filling the line gaps with most of depth by primary screen printing, carrying out secondary screen printing after slightly drying the wet film of the primary screen printing, and refilling the line gaps on the basis of the primary screen printing to ensure the filling rate. Meanwhile, the wet film after the first silk-screen printing is subjected to hot air drying for a preset time, so that a foundation can be provided for the second silk-screen printing, and the defect that the second silk-screen printing causes disturbance in a filling area to the wet film after the first silk-screen printing to cause gap filling is avoided.
In above-mentioned preferred step S6, form the arch of certain degree through the thickening to local circuit, wet membrane step optimization of silk screen printing is twice stroke direction vertically silk screen printing, and in middle interval hot-blast stoving step, make the wet membrane of silk screen printing can be effective, the first circuit clearance of thickening of abundant packing, avoid causing the silk screen printing fretwork or not be full of the circumstances such as because the protruding thickening of local circuit, in order to ensure that the second time dry film pastes the back, can not exist and the wet membrane of drying between have the space scheduling problem, ensure to avoid oozing the gild.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (6)
1. The method for manufacturing the whole printed circuit board by electroplating gold and then locally thickening the gold is characterized by comprising the following steps of:
s1, pre-processing: cutting, drilling and copper deposition are carried out in sequence, and the whole printed circuit board is electroplated;
s2, first circuit: pasting an anti-electroplating dry film on two sides of the printed circuit board, and then carrying out exposure and development to expose a circuit area needing electrogilding;
s3, pattern electroplating: carrying out pattern copper electroplating, and thickening the exposed circuit to a preset copper thickness;
s4, electro-thin gold: performing electrogilding surface treatment, namely electroplating a nickel layer on the thickened line surface and then electroplating a thin gold layer;
s5, removing the film: removing the dry film stuck in the first circuit;
s6, printing a wet film: silk-screen printing photosensitive wet film, wherein the silk-screen printing photosensitive wet film is filled in the circuit gap thickened by electroplating of the pattern, and the silk-screen printing photosensitive wet film comprises the first silk-screen printing and the second silk-screen printing which are all finished on the same silk-screen printing operation table; the screen printing scraper plate in the first screen printing comprises a fixed plate and an obliquely arranged clamping plate, wherein the bottom surface of the fixed plate is upwards sunken to form a clamping groove, the top of the clamping plate is provided with a clamping part, the clamping part is clamped in the clamping groove, the clamping plate inclines from the joint with the fixed plate and inclines to the back, the back of the fixed plate is connected with a plurality of vibration motors through cross frames and is used for providing vibration, the vibration ends of the vibration motors are connected with vibration transmission rods, the bottoms of the vibration transmission rods are abutted to the back of the clamping plate, bottom scraping rods are arranged on the back sides of the bottoms of the clamping parts, and the bottom scraping rods are connected with the cross frames through vertical frames; after the first silk-screen printing is finished, the printed board supporting table fixed with the printed boards is lowered to be below the bottom surface of the silk-screen operation table by using the lifting mechanism, hot air is supplied towards the printed board supporting table by using a hot air dryer which is fixed to the bottom surface of the silk-screen operation table and is positioned at two sides of the lifting mechanism, and the wet films subjected to the first silk-screen printing are dried by hot air for a preset time; then the lifting mechanism lifts the printed board support table until the printed board support table returns to the highest position, then the printed circuit board on the printed board support table is subjected to secondary silk-screen printing, and the stroke directions of the secondary silk-screen printing and the silk-screen scraper blade of the primary silk-screen printing are vertical; drying the wet film after silk-screen printing;
s7, second circuit: adhering an anti-electroplating dry film on the surface of the wet film, exposing a region needing to be plated with thick gold after exposure and development, wherein the region needing to be plated with thick gold belongs to a part of circuit regions in the circuit region electroplated with thin gold;
s8, electroplating thick gold: electroplating thick gold on the exposed area of the second circuit;
s9, stripping and etching: removing the dry film adhered to the second circuit and the wet film printed by silk screen printing, and etching with alkaline etching solution to obtain a required circuit pattern and an electric gold layer;
and S10, normally performing solder mask and subsequent processes.
2. The method of claim 1, wherein in step S2, the dry film attached to the first trace is an acid-resistant dry film, and the developing agent is a sodium carbonate solution with a concentration of 1.5% to 2.0%.
3. The method of claim 1, wherein in step S4, the thickness of the electroplated nickel is 4 μm to 6 μm, and the thickness of the electroplated thin gold is 0.025 μm to 0.075 μm.
4. The method of claim 1, wherein the thickness of the electroplated gold in step S8 is 0.375-0.5 μm.
5. The method of claim 1, wherein in step S6, the vibration frequency is 6000 to 20000 times/min.
6. A printed circuit board with whole board plated with gold and then locally thickened gold is obtained by the method for manufacturing the whole board plated with gold and then locally thickened gold of the printed circuit board according to any one of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111402391.6A CN113825320B (en) | 2021-11-24 | 2021-11-24 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111402391.6A CN113825320B (en) | 2021-11-24 | 2021-11-24 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
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| CN113825320A CN113825320A (en) | 2021-12-21 |
| CN113825320B true CN113825320B (en) | 2022-02-11 |
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| CN116153791A (en) * | 2023-04-18 | 2023-05-23 | 圆周率半导体(南通)有限公司 | Copper column expanding process for IC carrier plate |
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