CN101378635A - Method for producing circuit board with local electric thick gold - Google Patents
Method for producing circuit board with local electric thick gold Download PDFInfo
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- CN101378635A CN101378635A CNA2008102161892A CN200810216189A CN101378635A CN 101378635 A CN101378635 A CN 101378635A CN A2008102161892 A CNA2008102161892 A CN A2008102161892A CN 200810216189 A CN200810216189 A CN 200810216189A CN 101378635 A CN101378635 A CN 101378635A
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- thick gold
- circuit board
- electric thick
- copper
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Abstract
The invention discloses a production method of a circuit board provided with local electric thick gold, comprising the steps as follows: internal layer picture transfer is carried out and all layers of circuits are printed and layer-compressed so as to form a multi-layer circuit board; copper settling and full-plate electro-plating are carried out on the multi-layer circuit board; furthermore, requirement of the thickness of the surface copper and the hole copper are layered enough in one-step; a first external layer picture transfer is carried out, windowing is carried out on corresponding local electric thick golden positions and electric thick gold disposal of the corresponding locals is carried out; a second external layer picture transfer is carried out, furthermore, the surface copper of the non-external layer circuit is removed in a negative-film etching type; soldering-resistance, surface disposal, forming, testing, packaging and the like are carried out on the multi-layer circuit board. The production method of the circuit board provided with the local electric thick gold adopts the disposable enough thickness of surface copper and hole copper by electro-plating and carries out the electric thick gold disposal in the subsequent transfer of the external layer picture, thus realizing the production process which requires no leads at the center of the circuit board and electro-plates the thick gold patterns, with convenient preparation process and simple production process.
Description
Technical field
The present invention relates to a kind of board production technology, in particular a kind of production method that forms the local electric thick gold plate.
Background technology
At first describe as follows to the used technical terms of the present invention:
Figure transfer: be meant by copper-clad plate carried out pre-treatment (use polish-brush+abrasive with the alligatoring of copper face microcosmic), applied sensitization medicine film (have and press dry film and be coated with two kinds of operating types of wet film), exposure (use exposure machine by optionally make the sex change of sensitization medicine film with the figure transfer on the egative film to copper-clad plate), develop and (use weak base Na
2CO
3Solution with exposure operation after the sensitization medicine film of unexposed portion dissolve and expose the copper face that is covered) in copper-clad plate, form the process of the line pattern of needs, the process of this figure transfer is arranged respectively when the inside and outside layer line of making road;
Window: be meant the design that the visuals that will need on the circuit board exposes, other locality protection is got up;
It is pre-big: because liquid medicine can cause the line pattern after the etching less than normal than the line pattern after developing to the etching action of copper layer side in the etching process, for reaching the line pattern size of former customer requirement, when making, engineering data needs the line pattern size is compensated.
Production process to multilayer circuit board (for example gold finger plate) that the electric thick gold requirement is arranged in the prior art comprises: the circuit board raw material is left material; Because circuit board is multilayer circuit technology normally, for example 6 layers, have nothing in common with each other at the circuit-line of different layers, therefore, need at first carry out the internal layer figure transfer to of the control of its circuit-line on each layer by production equipment, promptly make the line pattern of internal layer earlier; Circuit central layer with each internal layer carries out pressing then, makes it to become the multilayer circuit board that each interlayer aligns; Carry out drilling operation in pre-designed position,, carry out UNICOM between the circuit with layer and layer so that according to different circuit requirements, and the fixing pin of wiring harness components and parts etc. later on; Then circuit board is placed into and sinks copper, plate electric current journey in the electroplate liquid, in the hole, form conductive layer; Carry out outer graphics again and shift, promptly make the outer-layer circuit figure, make it with plate on corresponding, the coupling in hole of having bored.
For carrying out the gold finger plate production of prior art, need outwards draw lead-in wire in the grafting Pin locations of following circuit board and in electroplating process, conduct electricity to keep golden finger, therefore, this lead-in wire promptly plays the effect of energising conduction.Be convenient and produce, on a big raw material substrate, can this lead-in wire be set between the polylith circuit board unit again according to side circuit board size a plurality of circuit board units of arranging, should lead-in wire after golden finger is finished thick gold and electroplated need be cut.
But because part client's board design has the local electric thick lsp request, the i.e. thick golden figure that need touch repeatedly in the figure central design of circuit board, because at the thick golden figure of circuit board central design, can't when producing, increase electric gold wire, so in the board production mode of prior art, can't realize this kind production technology.Have yet to be improved and developed.
Summary of the invention
The object of the present invention is to provide a kind of production method,, realize under the no electric gold wire situation production the local thick golden figure in the circuit board by improving the technological process of production of circuit board with local electric thick gold circuit board.
Technical scheme of the present invention comprises:
A kind of production method with local electric thick gold circuit board, it may further comprise the steps:
A, carry out the internal layer figure transfer and print each layer circuit and lamination and form multilayer circuit board;
B, multilayer circuit board is sunk copper and plate electricity, and table copper, the hole copper thickness of the enough customer requirements of disposable electricity;
C, carry out first time outer graphics and shift, corresponding local electric thick gold graph position is windowed, this correspondence figure is carried out electric thick gold handle;
D, carry out second time outer graphics and shift, and etch away the table copper of non-lamina rara externa circuit according to the negative film film;
E, multilayer circuit board carried out welding resistance is handled and machine-shaping.
In the above-mentioned production method, the alkali etching mode is adopted in the etching among the described step D.
In the above-mentioned production method, also comprise among the described step C: to the connecting portion of electric thick gold position and non-electric thick gold position lead, window and prolong the predetermined alignment tolerance size of twice at least to described non-electric thick gold position lead in described electric thick gold position.
In the above-mentioned production method, also comprise among the described step C: there is the connecting portion of via the electric thick gold position, and the described multilayer circuit board corresponding via of side is in addition windowed and is set to than described via monolateral little one predetermined tolerance size.
In the above-mentioned production method, described predetermined tolerance size is 0.05 millimeter.
In the above-mentioned production method, described step D also comprises: to the connecting portion of electric thick gold position and non-electric thick gold position lead, conductor width is designed to more described electric thick gold position conductor width and dwindles the predetermined alignment tolerance size of twice.
A kind of production method provided by the present invention with local electric thick gold circuit board, owing to adopted disposable plating enough to show copper and hole copper thickness, and after outer graphics carry out electric thick gold earlier in shifting and handle, realized not needing to rely on the production technology of the local thick golden figure of lead-in wire in circuit board central authorities, its implementation procedure is convenient, and production technology is simple.
Description of drawings
Fig. 1 is the schematic flow sheet of the inventive method;
Fig. 2 is the circuit board partial schematic diagram of the inventive method.
Embodiment
Below in conjunction with accompanying drawing, will be described in more detail preferred embodiment of the present invention:
The present invention has the production method of local electric thick gold circuit board, as shown in Figure 1, has comprised the production craft step of part prior art, and it comprises:
At first, each layer circuit board raw material is opened material as the circuit production process of prior art; Each inner layer circuit board is carried out the internal layer figure transfer, form inner line figure; Then each layer circuit board is carried out lamination, to form multilayer circuit board; Again circuit board is holed, then circuit board is put into electroplating bath and sunk copper, whole plate and electroplate, and conditions such as control electroplating time, current density, disposablely be electroplated onto table copper and the hole copper requirement of satisfying customer requirement.
Carry out the outer graphics transfer first time then, with apply circuit board behind the sensitization medicine film by exposure, develop form local electric thick gold line pattern, window with realization local electric thick carat (measure of the purity of gold), as shown in Figure 2, the setting of the position of windowing all realizes by control program; Need the position of electric thick gold to carry out figure nickel gold earlier to this then, carry out the electric thick gold operation again, the thick gold plating that is implemented in corresponding topical position 110 is finished, owing to carried out heavy copper, whole plate plating earlier, just can realize conductive processing very easily for the thick gold of parcel plating in the inventive method like this.
Remove the sensitization medicine film of coating by moving back membrane operations, carry out second time outer graphics again and shift (needing to adopt the negative film film to carry out figure transfer), select alkali etching afterwards.It should be noted that, the inventive method is once to plate earlier enough to show copper and hole copper thickness requirement on the multilayer circuit board behind the lamination, finish behind the local electric thick gold again selection, fall logicalnot circuit on the circuit board is partially-etched, be different from the operation that prior art is carried out graphic plating by the negative film film.
On circuit board, apply welding resistance printing ink then, carry out the processing of circuit board surface, and the corresponding expression of printing literal, for example various components and parts characters and indication explanation etc.; Again the process adhesive tape is carried out in the electric thick gold position and handle protecting thick carat (measure of the purity of gold), and proceed surface treatment, forming operation; and circuit board carried out performance and quality test; pack after qualified, operation such as shipment, these are operating as prior art knows, and therefore repeats no more.
The present invention has the production method of local electric thick gold circuit board, and its process modification mainly exists:
When the first time, outer graphics shifted, isolated local electric thick carat (measure of the purity of gold) was not done pre-big; When the electric thick gold position has lead to be connected design with non-electric thick gold position, the electric thick gold position film is windowed and will be prolonged 0.1mm at least to the lead of non-electric thick gold, i.e. at least 2 times of alignment tolerance sizes, in the time of could guaranteeing like this after the second time, outer graphics shifted, to carry out etching, can to cause connecting the position lead etched and cause circuit board defective because of the erosion of oozing of etching solution; And the live width of electric thick gold position is not done in advance greatly; When the electric thick gold position has via to be connected with another side, unless the client has the requirement of electric thick gold orifice ring, another side all is designed to window than the hole point film of hole monolateral little one predetermined alignment tolerance size as 0.05mm, cause defectives such as orifice ring is damaged, neck position open circuit to avoid the press mold quality in the outer graphics transfer for the second time of electric thick gold orifice ring thickness effect, to produce oozing erosion.
In the second time, outer graphics shifted, as shown in Figure 2, independently dry film was not covered in the electric thick gold position; The electric thick gold position that links to each other with non-electric thick gold position is designed to part lid dry film, monolaterally dwindles 0.1mm than the electric thick gold position; Cancel this electric thick gold position lid dry film design when the width of dry film is less than 0.08mm after dwindling; Other zone is by normal pre-big.
Graphic designs, the production method that the present invention has a local electric thick gold circuit board can prevent the electric thick gold position with neck position, non-electric thick gold position open circuit, is connected problems such as dislocation, electric thick gold position dew copper.The inventive method is enough shown the thickness requirement of copper and hole copper by heavy copper, the disposable plating of plate electricity, both realized that circuit board figure central authorities did not have the conduction requirement of the local electric thick gold of finger lead-in wire position, can use the negative film etching mode directly to form the outer-layer circuit figure again, its flow process is succinct, and it is convenient to realize.
Should be understood that above-mentioned description at preferred embodiment of the present invention is comparatively detailed, can not therefore think the restriction to scope of patent protection of the present invention, scope of patent protection of the present invention should be as the criterion with claims.
Claims (6)
1, a kind of production method with local electric thick gold circuit board, it may further comprise the steps:
A, carry out the internal layer figure transfer and print each layer circuit and lamination and form multilayer circuit board;
B, multilayer circuit board is sunk copper, plate electricity, and disposable electricity the table copper, the hole copper thickness that enough require;
C, carry out first time outer graphics and shift, corresponding local electric thick carat (measure of the purity of gold) is windowed, and carry out electric thick gold and handle;
D, carry out second time outer graphics and shift, remove the table copper of non-outer-layer circuit according to the negative film etching mode;
E, multilayer circuit board is carried out welding resistance, surface treatment, moulding, test and packing.
2, production method according to claim 1 is characterized in that, the alkali etching mode is adopted in the etching among the described step D.
3, production method according to claim 1, it is characterized in that, also comprise among the described step C: to the graphic designs of electric thick gold position and wire interconnecting piece position, non-electric thick gold position, window and prolong a predetermined alignment tolerance size of twice at least to described non-electric thick gold position lead in described electric thick gold position.
4, production method according to claim 1, it is characterized in that, also comprise among the described step C: there is the connecting portion of via the electric thick gold position, and the described multilayer circuit board corresponding via of side is in addition windowed and is designed to than described via monolateral little one predetermined tolerance size.
According to claim 3 or 4 described production methods, it is characterized in that 5, described predetermined tolerance size is 0.05 millimeter.
6, production method according to claim 3, it is characterized in that, described step D also comprises: to the connecting portion of electric thick gold position and non-electric thick gold position lead, the local dry film of described electric thick gold position is set to more described electric thick gold position and dwindles the predetermined alignment tolerance size of twice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102161892A CN101378635B (en) | 2008-09-19 | 2008-09-19 | Method for producing circuit board with local electric thick gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102161892A CN101378635B (en) | 2008-09-19 | 2008-09-19 | Method for producing circuit board with local electric thick gold |
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| Publication Number | Publication Date |
|---|---|
| CN101378635A true CN101378635A (en) | 2009-03-04 |
| CN101378635B CN101378635B (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008102161892A Expired - Fee Related CN101378635B (en) | 2008-09-19 | 2008-09-19 | Method for producing circuit board with local electric thick gold |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
| CN102076175A (en) * | 2010-11-24 | 2011-05-25 | 深南电路有限公司 | Full gold-plated board manufacturing technology |
| CN102821553A (en) * | 2012-08-06 | 2012-12-12 | 深圳崇达多层线路板有限公司 | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
| CN105682380A (en) * | 2016-02-03 | 2016-06-15 | 江门崇达电路技术有限公司 | Manufacturing method for PCB electroplated with thick-gold partially |
| CN105764270A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
| CN106682269A (en) * | 2016-11-29 | 2017-05-17 | 深圳崇达多层线路板有限公司 | PCB drilling tool diameter hole count comparison method |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
| CN110519931A (en) * | 2019-08-28 | 2019-11-29 | 内蒙古民族大学 | A kind of production method of circuit board |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111010812A (en) * | 2019-12-25 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN113556874A (en) * | 2021-07-09 | 2021-10-26 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method for bonding pad plated with thick gold |
| CN113825320A (en) * | 2021-11-24 | 2021-12-21 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
-
2008
- 2008-09-19 CN CN2008102161892A patent/CN101378635B/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056417A (en) * | 2010-11-24 | 2011-05-11 | 深南电路有限公司 | Process for manufacturing partially gold-plated board |
| CN102076175A (en) * | 2010-11-24 | 2011-05-25 | 深南电路有限公司 | Full gold-plated board manufacturing technology |
| CN102821553A (en) * | 2012-08-06 | 2012-12-12 | 深圳崇达多层线路板有限公司 | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
| CN102821553B (en) * | 2012-08-06 | 2015-02-25 | 深圳崇达多层线路板有限公司 | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
| CN105682380B (en) * | 2016-02-03 | 2018-11-06 | 江门崇达电路技术有限公司 | A kind of production method of the thick gold PCB of parcel plating |
| CN105682380A (en) * | 2016-02-03 | 2016-06-15 | 江门崇达电路技术有限公司 | Manufacturing method for PCB electroplated with thick-gold partially |
| CN105764270A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
| CN106682269A (en) * | 2016-11-29 | 2017-05-17 | 深圳崇达多层线路板有限公司 | PCB drilling tool diameter hole count comparison method |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
| CN111491464A (en) * | 2019-01-29 | 2020-08-04 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of PCB with convex welding plate |
| CN110519931A (en) * | 2019-08-28 | 2019-11-29 | 内蒙古民族大学 | A kind of production method of circuit board |
| CN110944454A (en) * | 2019-12-19 | 2020-03-31 | 黄石星河电路有限公司 | Circuit board production process |
| CN111010812A (en) * | 2019-12-25 | 2020-04-14 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| CN111010812B (en) * | 2019-12-25 | 2021-05-11 | 珠海杰赛科技有限公司 | Manufacturing method of circuit board with dot plating pattern |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
| CN113556874A (en) * | 2021-07-09 | 2021-10-26 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method for bonding pad plated with thick gold |
| CN113556874B (en) * | 2021-07-09 | 2022-05-20 | 深圳市迅捷兴科技股份有限公司 | Manufacturing method for bonding pad plated with thick gold |
| CN113825320A (en) * | 2021-11-24 | 2021-12-21 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
| CN113825320B (en) * | 2021-11-24 | 2022-02-11 | 四川英创力电子科技股份有限公司 | Method for manufacturing whole printed circuit board by electric gold plating and local thickening gold and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101378635B (en) | 2012-07-25 |
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