CN102076175A - Full gold-plated board manufacturing technology - Google Patents
Full gold-plated board manufacturing technology Download PDFInfo
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- CN102076175A CN102076175A CN 201010557166 CN201010557166A CN102076175A CN 102076175 A CN102076175 A CN 102076175A CN 201010557166 CN201010557166 CN 201010557166 CN 201010557166 A CN201010557166 A CN 201010557166A CN 102076175 A CN102076175 A CN 102076175A
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- gold
- wire
- plated
- outer lead
- circuit board
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a full gold-plated board manufacturing technology, which comprises the following steps of: a) making all in-board patterns with gold plating areas and outer leads on the surface of a circuit board at one step, wherein all gold plating areas are interconnected through the outer leads; b) attaching protective dry films onto the outer leads to protect the outer leads; c) plating gold on the gold plating areas on the circuit board by taking the outer leads as gold plating conducting wires; d) removing the protective dry films on the outer leads; and e) removing the outer leads. The manufacturing technology disclosed by the invention solves the problems of gold seepage plating, under etching and gold-plated surface collapse. Moreover, by adopting the technology, since the outer leads are made on the surface of the circuit board, all gold plating areas are connected by using the outer leads and the in-board patterns on the outer layer of the circuit board are fully etched at one step, the precision of the gold-plated patterns can be ensured to be high.
Description
Technical field
The present invention relates to a kind of manufacture craft of full plate coated plate.
Background technology
The manufacture craft of existing full plate coated plate adopts the preceding craft of gilding of figure, its technological process is as follows: blanking-internal layer processing-lamination-boring-heavy copper-plating-outer graphics (is made glodclad wire with big copper face, with gold-plated zone develop out carry out gold-plated)-full plate is gold-plated-outer alkaline etching (remove all dry films, etch away non-gold-plated zone)-outer inspection-welding resistance-character-surface-coated-profile-electrical measurement-one-tenth inspection-packing.
Yet technology has following defective before the figure:
A. easy gold-plated plating and etching are unclean: with big copper face as glodclad wire, cover non-gold-plated zone because there are certain problem in dry film and copper face adhesion with dry film, when gold-plated, dry film comes off or liquid medicine infiltrates under the dry film easily easily around the gold-plated zone, cause with the big copper face that is connected around the gold-plated zone plating gold to occur, it is unclean because of gold-plated etching to occur gold-plated regional copper face when etching easily;
B. gold plating quality is poor, occurs gold-plated zone easily and subsides: gold-plated peripheral region is because be connected with the copper layer, and when losing in the etched plate figure outside carrying out, the copper layer that occurs easily below the Gold plated Layer is snapped eating away, gilding occurs and subsides.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of manufacture craft of full plate coated plate, the defective that this technology can overcome that gold-plated plating, etching are clean, gold plating quality difference and gold-plated zone subside.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of manufacture craft of full plate coated plate is provided, may further comprise the steps:
A. on the surface of circuit board once property make figure in all plates with gold-plated zone and outer lead-in wire, all gold-plated zones interconnect by the skin lead-in wire;
B. stick the protection dry film at skin lead-in wire place, to protect outer lead-in wire;
C. utilize outer lead-in wire to carry out gold-plated to gold-plated zone on the circuit board as glodclad wire;
D. remove the protection dry film on the outer lead-in wire;
E. remove outer lead-in wire.
Wherein, in step a, the width of described outer lead-in wire is 0.08-0.2mm.
Wherein, in step e, adopt etching mode to remove outer lead-in wire.
Wherein, after step e, comprise step: the whole plate of coated plate is carried out the welding resistance technological operation.
Wherein, between step a and step b, also comprise step: to inspection outside figure carries out in all plates of making.
The invention has the beneficial effects as follows: the defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: make outer lead-in wire because this method is surface by circuit board, utilize outer lead-in wire that all gold-plated zones are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, there is not big copper layer around it, have only the very thin skin of minority lead-in wire,, also only can appear on the outer lead-in wire even plating occurs or etching is unclean, other place can not occur, so there is not the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: because this method is the outer lead-in wire of surface making by circuit board, utilize outer lead-in wire that all gold-plated zones are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, so around its gold-plated zone and side has all plated the nickel gold when gold-plated, so gilding can not subside.
Three, gold-plated pattern precision height: because this method is the outer lead-in wire of surface making by circuit board, utilize outer lead-in wire that all gold-plated zones are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, have higher precision so can guarantee gold-plated figure.
Description of drawings
Fig. 1 makes the coated plate schematic diagram behind the figure in gold-plated zone and the outer plate that goes between in the embodiment of the invention;
Fig. 2 is the coated plate schematic diagram behind covering protection dry film on the skin lead-in wire in the embodiment of the invention;
Fig. 3 utilizes outer lead-in wire to carry out coated plate schematic diagram after gold-plated as glodclad wire in the embodiment of the invention;
Fig. 4 is the coated plate schematic diagram behind the gold-plated back removal protection dry film that finishes in the embodiment of the invention;
Fig. 5 is the coated plate schematic diagram that etches away in the embodiment of the invention after skin goes between.
Wherein, 1, gold-plated zone; 2, outer lead-in wire; 3, dry film.
Embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1 to Fig. 5, the embodiment as the manufacture craft of the full plate coated plate of the present invention may further comprise the steps:
A. on the surface of circuit board once property make have gold-plated regional 1 and all plates of outer lead-in wire 2 in figure, all gold-plated regional 1 interconnect by skin lead-in wire 2, as shown in Figure 1;
B. stick protection dry film 3 at skin 2 places that go between, to protect outer lead-in wire 2, as shown in Figure 2;
C. utilize outer lead-in wire 2 as glodclad wire on the circuit board gold-plated regional 1 carry out gold-plated, as shown in Figure 3;
D. remove the protection dry film 3 on the outer lead-in wire 2, as shown in Figure 4;
E. remove outer lead-in wire 2, as shown in Figure 5.
The defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: make outer lead-in wire 2 because this method is surface by circuit board, utilize outer lead-in wire 2 that all gold-plated regional 1 are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, there is not big copper layer around it, have only the very thin skin of minority lead-in wire 2,, also only can appear on the outer lead-in wire 2 even plating occurs or etching is unclean, other place can not occur, so there is not the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: because this method is the outer lead-in wire 2 of surface making by circuit board, utilize outer lead-in wire 2 that all gold-plated regional 1 are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, so its around gold-plated regional 1 and side has all plated the nickel gold when gold-plated, so gilding can not subside.
Three, gold-plated pattern precision height: because this method is the outer lead-in wire 2 of surface making by circuit board, utilize outer lead-in wire 2 that all gold-plated regional 1 are coupled together, the disposable whole etchings of figure are come out in the outer field plate of circuit board, have higher precision so can guarantee gold-plated figure.
In one embodiment, in step e, adopt etching mode to remove outer lead-in wire.
In one embodiment, in step a, the width of described outer lead-in wire generally is designed to 0.08-0.2mm.
In one embodiment, after step e, comprise step: the whole plate of coated plate is carried out the welding resistance technological operation.
In one embodiment, between step a and step b, also comprise step: to inspection outside figure carries out in all plates of making.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. the manufacture craft of a full plate coated plate is characterized in that, may further comprise the steps:
A. on the surface of circuit board once property make figure in all plates with gold-plated zone and outer lead-in wire, all gold-plated zones interconnect by the skin lead-in wire;
B. stick the protection dry film at skin lead-in wire place, to protect outer lead-in wire;
C. utilize outer lead-in wire to carry out gold-plated to gold-plated zone on the circuit board as glodclad wire;
D. remove the protection dry film on the outer lead-in wire;
E. remove outer lead-in wire.
2. the manufacture craft of full plate coated plate according to claim 1 is characterized in that: in step a, the width of described outer lead-in wire is 0.08-0.2mm.
3. the manufacture craft of full plate coated plate according to claim 2 is characterized in that: in step e, adopt etching mode to remove outer lead-in wire.
4. the manufacture craft of full plate coated plate according to claim 3 is characterized in that: after step e, comprise step: the whole plate of coated plate is carried out the welding resistance technological operation.
5. the manufacture craft of full plate coated plate according to claim 4 is characterized in that: also comprise step between step a and step b: to inspection outside figure carries out in all plates of making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010557166 CN102076175A (en) | 2010-11-24 | 2010-11-24 | Full gold-plated board manufacturing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010557166 CN102076175A (en) | 2010-11-24 | 2010-11-24 | Full gold-plated board manufacturing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102076175A true CN102076175A (en) | 2011-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010557166 Pending CN102076175A (en) | 2010-11-24 | 2010-11-24 | Full gold-plated board manufacturing technology |
Country Status (1)
| Country | Link |
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| CN (1) | CN102076175A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992464A (en) * | 2015-02-06 | 2016-10-05 | 常熟精元电脑有限公司 | Electroplating circuit board and manufacturing method thereof |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN111315151A (en) * | 2020-04-01 | 2020-06-19 | 江苏苏杭电子有限公司 | Processing technology of leadless plug electrogilding and plate surface gilding printed circuit board |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256702A (en) * | 1997-03-11 | 1998-09-25 | Sumitomo Kinzoku Electro Device:Kk | Manufacture of ceramic board |
| US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
-
2010
- 2010-11-24 CN CN 201010557166 patent/CN102076175A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256702A (en) * | 1997-03-11 | 1998-09-25 | Sumitomo Kinzoku Electro Device:Kk | Manufacture of ceramic board |
| US20080302468A1 (en) * | 2007-06-06 | 2008-12-11 | Rajwant Singh Sidhu | Multilayer printed wiring boards with holes requiring copper wrap plate |
| CN101643927A (en) * | 2008-08-05 | 2010-02-10 | 北大方正集团有限公司 | Method for manufacturing printed circuit board edge connector |
| CN101378635A (en) * | 2008-09-19 | 2009-03-04 | 深圳崇达多层线路板有限公司 | Method for producing circuit board with local electric thick gold |
| CN101699940A (en) * | 2009-11-10 | 2010-04-28 | 广州兴森快捷电路科技有限公司 | Manufacture method of golden finger printed board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992464A (en) * | 2015-02-06 | 2016-10-05 | 常熟精元电脑有限公司 | Electroplating circuit board and manufacturing method thereof |
| CN111065210A (en) * | 2019-12-25 | 2020-04-24 | 上海嘉捷通电路科技股份有限公司 | Method for replacing manual PCB (printed circuit board) process lead wire picking |
| CN111315151A (en) * | 2020-04-01 | 2020-06-19 | 江苏苏杭电子有限公司 | Processing technology of leadless plug electrogilding and plate surface gilding printed circuit board |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
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Application publication date: 20110525 |