The manufacture craft of full plate coated plate
Technical field
The present invention relates to a kind of manufacture craft of full plate coated plate.
Background technology
The manufacture craft of existing full plate coated plate adopts the preceding craft of gilding of figure; Its technological process is following: blanking-internal layer processing-lamination-boring-heavy copper-plating-outer graphics (is made glodclad wire with big copper face; With gold-plated zone develop out carry out gold-plated)-full plate is gold-plated-outer alkali erosion (remove all dry films, etch away non-gold-plated zone)-outer inspection-resistance weldering-character-surface-coated-profile-electrical measurement-one-tenth inspection-packing.
Yet technology has following defective before the figure:
A. easy gold-plated plating and etching are unclean: with big copper face as glodclad wire; Cover non-gold-plated zone because there are certain problem in dry film and copper face adhesion with dry film; When gold-plated; Dry film comes off or liquid medicine infiltrates under the dry film easily easily around the gold-plated zone, causes with the big copper face that is connected around the gold-plated zone plating gold to occur, and it is unclean because of gold-plated etching when etching, to occur gold-plated regional copper face easily;
B. gold plating quality is poor, occurs gold-plated zone easily and subsides: gold-plated peripheral region is because be connected with the copper layer, and when outside carrying out, losing in the etched plate figure, the copper layer that occurs easily below the Gold plated Layer is snapped eating away, gilding occurs and subsides.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of manufacture craft of full plate coated plate, the defective that this technology can overcome that gold-plated plating, etching are clean, gold plating quality difference and gold-plated zone subside.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of manufacture craft of full plate coated plate is provided, may further comprise the steps:.
A. produce the internal layer lead-in wire at the circuit board internal layer;
B. on the outer field surface of circuit board once property make in all plates with gold-plated zone figure and the auxiliary frame of conduction; A go between end and gold-plated zone of said internal layer conducts; The other end conducts with the auxiliary frame of conduction, and all gold-plated zone passage internal layer lead-in wires conduct with the auxiliary frame of conduction each other;
C. utilize the internal layer lead-in wire to carry out gold-plated to gold-plated zone on the circuit board as glodclad wire;
D. remove the auxiliary frame of conduction, make mutually insulated between the gold-plated zone.
Wherein, in step b, on the coated plate skin, via is set, auxiliary frame of conduction and internal layer lead-in wire is conducted each other through said via.
Wherein, in step a, the width of said internal layer lead-in wire is 0.08-0.2mm.
Wherein, in step a, said internal layer lead-in wire is arranged on the different internal layers.
Wherein, between step b and step c, also comprise step: to inspection outside figure carries out in all plates of making.
Wherein, between step b and step c, also comprise step: coated plate is hindered welder's operation of planting.
The invention has the beneficial effects as follows: the defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: because this method is a internal layer through circuit board the internal layer lead-in wire is set; Utilize the internal layer lead-in wire to couple together the auxiliary frame of all gold-plated zones and conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board; There is not big copper layer around it, so there is not the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: the internal layer lead-in wire is set because this method is a internal layer through circuit board; Utilize the internal layer lead-in wire to couple together the auxiliary frame of all gold-plated zones and conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board; So around its gold-plated zone and side has all plated the nickel gold when gold-plated, so gilding can not subside.
Three, gold-plated pattern precision is high: because this method is a internal layer through circuit board the internal layer lead-in wire is set; Utilize the internal layer lead-in wire to couple together the auxiliary frame of all gold-plated zones and conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board, have higher precision so can guarantee gold-plated figure.
In addition because internal layer lead-in wire is not independent operation makes, but when making the circuitous pattern of internal layer, make, so can not increase flow process along band.
Description of drawings
Fig. 1 makes the gold-plated zone of internal layer lead-in wire, superficies and the coated plate sketch map behind the auxiliary frame of conduction in the embodiment of the invention;
Fig. 2 utilizes internal layer lead-in wire to carry out the coated plate sketch map after gold-plated as glodclad wire in the embodiment of the invention;
Fig. 3 is the coated plate sketch map behind the auxiliary frame of mill off conduction in the embodiment of the invention.
Wherein, 1, gold-plated zone; 2, the auxiliary frame of conduction; 3, internal layer lead-in wire.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1 to Fig. 3, the embodiment as the manufacture craft of the full plate coated plate of the present invention may further comprise the steps:
A. produce internal layer lead-in wire 3 at the circuit board internal layer;
B. on the outer field surface of circuit board once property make and have figure and the auxiliary frame 2 of conduction in all plates of gold-plated regional 1; Said internal layer 3 one ends and gold-plated regional 1 that go between conduct; The other end conducts with the auxiliary frame 2 of conduction, and all gold-plated regional 1 conduct through the auxiliary frame 2 of internal layer lead-in wire 3 and conduction each other;
C. utilize internal layer lead-in wire 3 as glodclad wire on the circuit board gold-plated regional 1 carry out gold-plated;
D. remove the auxiliary frame 2 of conduction, make gold-plated regional 1 between mutually insulated.
The defective that the gold-plated plating, etching that is different from prior art is clean, gold plating quality difference and gold-plated zone subside, the present invention has following advantage:
The first, it is unclean to have solved gold-plated plating and etching: because this method is a internal layer through circuit board internal layer lead-in wire 3 is set; Utilize internal layer lead-in wire 3 gold-plated regional 1 to couple together all with the auxiliary frame 2 of conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board; There is not big copper layer around it, so there is not the unclean problem of plating and etching.
The second, solved the problem that gold-plated golden face subsides: internal layer lead-in wire 3 is set because this method is a internal layer through circuit board; Utilize internal layer lead-in wire 3 gold-plated regional 1 to couple together all with the auxiliary frame 2 of conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board; So when gold-plated its all to have plated nickel golden with the side around gold-plated regional 1, so gilding can not subside.
Three, gold-plated pattern precision is high: because this method is a internal layer through circuit board internal layer lead-in wire 3 is set; Utilize internal layer lead-in wire 3 gold-plated regional 1 to couple together all with the auxiliary frame 2 of conduction; The disposable whole etchings of figure are come out in the outer field plate of circuit board, have higher precision so can guarantee gold-plated figure.
In addition because internal layer lead-in wire 3 is not independent operation makes, but when making the circuitous pattern of internal layer, make, so can not increase flow process along band.
In step b, on the coated plate skin, via is set, through said via auxiliary frame of conduction and internal layer lead-in wire are conducted each other.
In another embodiment, remove and conduct electricity when assisting frame, adopt the mode of falling the auxiliary side milling of conduction.
In another embodiment; In step a; Said internal layer lead-in wire can be arranged by any one deck in the circuit board internal layer, but the internal layer of preferentially selecting figure to evacuate, said internal layer lead-in wire can be arranged on the different internal layers; Said internal layer wire widths is generally selected 0.08-0.2mm, and length is then not limited basically.
In one embodiment, between step b and step c, also comprise step: to inspection outside figure carries out in all plates of making.
In one embodiment, between step b and step c, also comprise step: coated plate is hindered welder's operation of planting.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.