CN102014577B - Process for manufacturing local gold-plated board - Google Patents
Process for manufacturing local gold-plated board Download PDFInfo
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- CN102014577B CN102014577B CN2010105571542A CN201010557154A CN102014577B CN 102014577 B CN102014577 B CN 102014577B CN 2010105571542 A CN2010105571542 A CN 2010105571542A CN 201010557154 A CN201010557154 A CN 201010557154A CN 102014577 B CN102014577 B CN 102014577B
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- gold
- plated
- conductive ink
- dry film
- zone
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Abstract
The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board and a conductive auxiliary frame on the periphery of a circuit board on the circuit board once; screen-printing conductive printing ink; sticking a protective dry film to a non-gold-plated area; adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; removing the protective dry film on the non-gold-plated area; and removing the conductive printing ink, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; and the conductive printing ink ensures the leads in all the gold-plated areas to be electrically conducted with the conductive auxiliary frame. Different from the condition in the prior art that the local gold-plated board is difficult in counterpoint of secondary patterns and poor in gold plating quality, in the invention, by etching all the patterns in the circuit board once, counterpoint precision deviation between the gold-plated areas and the non-gold-plated area can not exist on the circuit board.
Description
Technical field
The present invention relates to a kind of circuit board processing technology, relate in particular to a kind of manufacture craft of partially plating gold plate.
Background technology
The manufacture craft flow process of existing partially plating gold plate is following: blanking-internal layer processing-lamination-boring-heavy copper-platings-first time outer graphics (with gold-plated zone develop out carry out gold-plated)-according to the first time outer graphics make glodclad wire with the big copper face of circuit board, to substrate carry out partially plating gold make gold-plated regional graphics-striping (removing gold-plated protection dry film)-second time outer graphics make non-gold-plated regional graphics-to the second time outer graphics position carry out alkali etching, acid etching (the interior figure of making plate)-outward inspection-resistance weldering-print character-surface-coated-profile-electrical measurement-one-tenth inspection-packing.
Yet, there is following defective when for the first time figure is with figure for the second time in the manufacture craft of above-mentioned existing partially plating gold plate:
1, figure contraposition difficulty: the junction in gold-plated zone and non-gold-plated zone because have for the first time graphic making go out gold-plated regional graphics and for the second time graphic making go out the aligning accuracy deviation that has 2～4mil between the non-gold-plated regional graphics;
2, gold plating quality is poor: because gold-plated peripheral region is connected with figure layer, outside carrying out in the etching making plate during figure, the copper layer that occurs easily below the Gold plated Layer is snapped eating away, the situation that gilding subsides occurs.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of manufacture craft of partially plating gold plate, can avoid figure the situation that contraposition deviation and gilding subside to occur.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of manufacture craft of partially plating gold plate is provided, comprises the steps:
Once property is made the auxiliary frame of the conduction on the figure and circuit board periphery in all plates with gold-plated zone and non-gold-plated zone on the surface of circuit board, and gold-plated zone passage lead-in wire is connected with non-gold-plated zone;
Silk screen printing electrically conductive ink, silk screen printing zone cover the lead-in wire and the auxiliary frame of conduction in all gold-plated zones, and electrically conductive ink makes the lead-in wire in all gold-plated zones and conducts electricity and conducts each other between the auxiliary frame;
Stick the protection dry film in non-gold-plated zone, to protect non-gold-plated zone;
Utilize electrically conductive ink to carry out gold-plated to gold-plated zone on the circuit board as glodclad wire;
Remove the protection dry film on the non-gold-plated zone;
Remove electrically conductive ink, promptly be immersed in the conductive ink layer on the circuit board in the alkaline solution that concentration is 5-15%, soak time is 5-15 minute.
Wherein, behind the silk screen printing electrically conductive ink, comprise step: the oven dry electrically conductive ink, bake out temperature is 120 ℃, the time is 30 minutes.
Wherein, Stick the protection dry film in non-gold-plated zone,, comprise step: at first the entire circuit plate is sticked photosensitive dry film to protect in the non-gold-plated regional step; Adopt the exposure of egative film selectivity; The dry film that promptly blocks gold-plated zone makes its not sensitization, and the dry film that does not block on the non-gold-plated zone makes its sensitization, then the Na through 0.8-1.2%
2CO
3Alkaline medicinal liquid drip washing is soaked 1-2 minute removing the dry film that does not have sensitization on the gold-plated zone, thereby keeps the photosensitive dry film on the non-gold-plated zone.
Wherein, in the protection dry film step on removing non-gold-plated zone, adopt the NaOH strong alkali solution of 3%-5%, drip washing was soaked 3-7 minute.
Wherein, said electrically conductive ink printing width is 3mm-10mm.
Wherein, said electrically conductive ink printing width is 5mm.
Wherein, said electrically conductive ink layer thickness is 75-100 μ m.
Wherein, said alkaline solution is a NaOH solution.
The invention has the beneficial effects as follows: be different from the partially plating gold plate secondary figure contraposition difficulty of prior art and the situation of gold plating quality difference; The present invention etches all figures in the circuit board through disposable, so just can not have the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board.In addition, the whole explained hereafter cycle is short, owing to printing conductive inks, removal electrically conductive ink all only need about ten minutes time, compares prior art efficient and improves very obvious; Cost is low, and printing conductive inks, to remove the electrically conductive ink cost very low, and reduces flow process, shortens the production cycle and also further reduced the time cost of producing; Make the supply of material rapider; Scheduling of production is more flexible, and according to practical production experience, total cost reduces more than 5%.
Description of drawings
Fig. 1 is the flow chart of the manufacture craft of partially plating gold plate of the present invention;
Fig. 2 is the structural representation of all figures in the partially plating gold plate etching ejecting plate of the present invention;
Fig. 3 is the structural representation behind the circuit board printing conductive inks among Fig. 2;
Fig. 4 is the structural representation that non-gold-plated locality protection among Fig. 3 is got up;
Fig. 5 carries out gold-plated structural representation to the gold-plated zone among Fig. 2;
Fig. 6 is the structural representation that removes the protection dry film in non-gold-plated zone among Fig. 4;
Fig. 7 is a structural representation of getting rid of electrically conductive ink among Fig. 3.
1, non-gold-plated zone; 2, gold-plated zone; 3, the auxiliary frame of conduction; 4, electrically conductive ink; 5, dry film.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, the manufacture craft embodiment of partially plating gold plate of the present invention comprises the steps:
Step 1: blanking, promptly choose the substrate of forming circuit plate;
Step 2: the substrate to the forming circuit plate carries out internal layer processing;
Step 3: circuit board is carried out lamination, boring;
Step 4: to sinking copper, plating on the circuit board after lamination, the boring;
Step 5: see also Fig. 2, on the surface of circuit board once property make have gold-plated regional 2 with non-all plates of gold-plated regional 1 in the auxiliary frame 3 of conduction on figure and the circuit board periphery, gold-plated regional 2 are connected with non-gold-plated zone through lead-in wire; Promptly on circuit board, need make in the plate zone of figure and stick the layer of protecting dry film; And the copper layer that pastes protection dry film zone on the circuit board etched away, make figure and the auxiliary frame 3 of conduction in all plates;
Step 6: please combine Fig. 1 and consult Fig. 3; Silk screen printing electrically conductive ink 4 on circuit board; The silk screen printing zone covers all gold-plated regional 2 lead-in wires and the auxiliary frame 3 of conduction, and electrically conductive ink 4 makes between all gold-plated regional 2 lead-in wires and the auxiliary frame 3 of conduction and conducts each other; Behind the silk screen printing electrically conductive ink, for the shortening time, generally need dry electrically conductive ink, bake out temperature is 120 ℃, the time is 30 minutes
Step 7: see also Fig. 4, on non-gold-plated regional 1, carry out outer graphics, promptly stick protection dry film 5 to protect non-gold-plated regional 1; Comprise step in this step: at first photosensitive dry film is sticked on entire circuit plate surface; Adopt the exposure of egative film selectivity; The dry film that promptly blocks gold-plated zone makes its not sensitization; The dry film that does not block on the non-gold-plated zone makes its sensitization, and the Na2CO3 alkaline medicinal liquid drip washing through 0.8-1.2% is soaked 1-2 minute removing the dry film that does not have sensitization on the gold-plated zone then, thereby keeps the photosensitive dry film on the non-gold-plated zone;
Step 8: see also Fig. 5, utilize electrically conductive ink 4 as glodclad wire to gold-plated regional 2 carrying out gold-platedly on the circuit board, the auxiliary frame 3 of conduction is connected with the negative pole of gold-plated equipment, gold-plated liquid medicine be just grade;
Step 9: see also Fig. 6, remove non-gold-plated regional 1 protection dry film 5, promptly adopt the NaOH strong alkali solution of 3%-5%, drip washing was soaked 3-7 minute;
Step 10: see also Fig. 7, remove electrically conductive ink 4, promptly be immersed in the electrically conductive ink on the circuit board 4 in the alkaline solution that concentration is 5-15%, soak time is 5-15 minute;
Step 11: hinder weldering;
Step 12: carry out print character then;
Step 13: leveling circuit board;
Step 14: circuit board is carried out profile detect;
Step 15: circuit board is carried out electrical testing;
Step 16: finished product detection;
Step 17: packing.
In the present embodiment, said alkaline solution is a NaOH solution; The thickness of said electrically conductive ink 4 is generally selected 75-100 μ m for use; Width is generally selected 3mm-10mm for use; In this thickness and width; Can guarantee that electrically conductive ink 4 can make the effect that conducts that reaches gold-plated requirement between gold-plated zone and the auxiliary frame of conduction, can avoid too thick too wide waste that causes or poor, the processing technology difference problem of the too thin too narrow conduction that causes again.For mill run, the conductive ink layer width more preferably is worth and is 5mm.
The present invention etches all figures in the circuit board through disposable; So just can there be the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board; And circuit board of the present invention only need be immersed in the alkaline solution 5-15 minute in gold-plated back; Need not carry out a large amount of etch processs, the heavy copper under the Gold plated Layer can not be snapped eating away, thereby the situation that gilding subsides can not occur.
There is the situation of contraposition difficulty and gold plating quality difference in the partially plating gold plate that is different from prior art when carrying out secondary image; The present invention etches all figures in the circuit board through disposable, so just can not have the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board.In addition, the whole explained hereafter cycle is short, owing to printing conductive inks, removal electrically conductive ink all only need about ten minutes time, compares prior art efficient and improves very obvious; Cost is low, and printing conductive inks, to remove the electrically conductive ink cost very low, and reduces flow process, shortens the production cycle and also further reduced the time cost of producing; Make the supply of material rapider; Scheduling of production is more flexible, and according to practical production experience, total cost reduces more than 5%.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (8)
1. the manufacture craft of a partially plating gold plate is characterized in that, comprises the steps:
Once property is made conductive pattern and the auxiliary frame of the conduction on the circuit board periphery in all surface scope with gold-plated zone and non-gold-plated zone on the surface of circuit board, and gold-plated zone passage lead-in wire is connected with non-gold-plated zone;
Silk screen printing electrically conductive ink, silk screen printing zone cover the lead-in wire and the auxiliary frame of conduction in all gold-plated zones, and electrically conductive ink makes the lead-in wire in all gold-plated zones and conducts electricity and conducts each other between the auxiliary frame;
Stick the protection dry film in non-gold-plated zone, to protect non-gold-plated zone;
Utilize electrically conductive ink to carry out gold-plated to gold-plated zone on the circuit board as glodclad wire;
Remove the protection dry film on the non-gold-plated zone;
Remove electrically conductive ink, promptly be immersed in the conductive ink layer on the circuit board in the alkaline solution that concentration is 5-15%, soak time is 5-15 minute.
2. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: behind the silk screen printing electrically conductive ink, comprise step: the oven dry electrically conductive ink, and bake out temperature is 120 ℃, the time is 30 minutes.
3. the manufacture craft of partially plating gold plate according to claim 1; It is characterized in that: stick the protection dry film in non-gold-plated zone; To protect in the non-gold-plated regional step, comprise step: at first the entire circuit plate is sticked photosensitive dry film, adopt the exposure of egative film selectivity; The dry film that promptly blocks gold-plated zone makes its not sensitization; The dry film that does not block on the non-gold-plated zone makes its sensitization, and the Na2CO3 alkaline medicinal liquid drip washing through 0.8-1.2% is soaked 1-2 minute removing the dry film that does not have sensitization on the gold-plated zone then, thereby keeps the photosensitive dry film on the non-gold-plated zone.
4. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that:
Remove in the protection dry film step on the non-gold-plated zone, adopt the NaOH strong alkali solution of 3%-5%, drip washing was soaked 3-7 minute.
5. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: said electrically conductive ink printing width is 3mm-10mm.
6. the manufacture craft of partially plating gold plate according to claim 5 is characterized in that: said electrically conductive ink printing width is 5mm.
7. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: said electrically conductive ink layer thickness is 75-100 μ m.
8. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: said alkaline solution is a NaOH solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571542A CN102014577B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105571542A CN102014577B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102014577A CN102014577A (en) | 2011-04-13 |
| CN102014577B true CN102014577B (en) | 2012-03-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105571542A Expired - Fee Related CN102014577B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821553B (en) * | 2012-08-06 | 2015-02-25 | 深圳崇达多层线路板有限公司 | Method for manufacturing key position partial electro-gold-plated PCB (printed circuit board) |
| CN103716988A (en) * | 2013-10-30 | 2014-04-09 | 胜宏科技（惠州）股份有限公司 | Multi-coating circuit board and production method thereof |
| CN105282985A (en) * | 2014-05-26 | 2016-01-27 | 深圳崇达多层线路板有限公司 | Circuit board single-sided local gold plating method and circuit board |
| CN107645844B (en) * | 2017-08-25 | 2019-11-08 | 深南电路股份有限公司 | A kind of production method gold-plated for the part the BGA pad of PCB |
| CN108235591B (en) * | 2018-01-08 | 2020-08-18 | 昆山首源电子科技有限公司 | 5G communication high-frequency signal plate gold-plating etching process |
| CN111542174B (en) * | 2020-03-08 | 2021-09-14 | 苏州浪潮智能科技有限公司 | Leadless electrogilding method and system for circuit board |
| CN114672863A (en) * | 2021-12-28 | 2022-06-28 | 杭州安费诺飞凤通信部品有限公司 | Anodic oxidation process for manufacturing mirror surface pattern on aluminum alloy surface |
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| JP2006100300A (en) * | 2004-09-28 | 2006-04-13 | Shindo Denshi Kogyo Kk | Printed wiring board and manufacturing method therefor |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN101275257A (en) * | 2007-03-30 | 2008-10-01 | 富港电子（东莞）有限公司 | Method for electroplating gold on surface of circuit board |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
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2010
- 2010-11-24 CN CN2010105571542A patent/CN102014577B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100300A (en) * | 2004-09-28 | 2006-04-13 | Shindo Denshi Kogyo Kk | Printed wiring board and manufacturing method therefor |
| CN101275257A (en) * | 2007-03-30 | 2008-10-01 | 富港电子（东莞）有限公司 | Method for electroplating gold on surface of circuit board |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
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| CN102014577A (en) | 2011-04-13 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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Granted publication date: 20120328 Termination date: 20151124 |
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