CN102014575B - Process for manufacturing local gold-plated board - Google Patents
Process for manufacturing local gold-plated board Download PDFInfo
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- CN102014575B CN102014575B CN2010105570874A CN201010557087A CN102014575B CN 102014575 B CN102014575 B CN 102014575B CN 2010105570874 A CN2010105570874 A CN 2010105570874A CN 201010557087 A CN201010557087 A CN 201010557087A CN 102014575 B CN102014575 B CN 102014575B
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- gold
- plated
- circuit board
- wire
- manufacture craft
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Abstract
The invention discloses a process for manufacturing a local gold-plated board. The process comprises the following steps: making all the patterns in the board on a circuit board once; simultaneously manufacturing an outer layer lead and conductive auxiliary edges as the gold-plated leads; sticking protective dry films to non-gold-plated areas and the outer layer lead for protection; using the outer layer lead as the gold-plated lead to plate gold on gold-plated areas; removing the protective dry films on the non-gold-plated areas; and removing the outer layer lead by adopting the laser fixed spot fuse process, wherein the patterns in the board are provided with the gold-plated areas and the non-gold-plated areas; the two ends of the outer layer lead are connected with the conductive auxiliary frame and the gold-plated areas; and the temperature of the laser fixed spot fuse is 1100 DEG C. By etching all the patterns in the board once, manufacturing the outer layer lead as the gold-plated lead and carrying out laser ablation on the outer layer lead after completing local gold plating of the circuit board, counterpoint precision deviation between the gold-plated areas and the non-gold-plated areas can not exist on the circuit board.
Description
Technical field
The present invention relates to a kind of wiring board processing technology, relate in particular to a kind of manufacture craft of partially plating gold plate.
Background technology
The manufacture craft flow process of existing partially plating gold plate is following: blanking-internal layer processing-lamination-boring-heavy copper-platings-first time outer graphics (with gold-plated zone develop out carry out gold-plated)-according to the first time outer graphics make glodclad wire with the big copper face of circuit board, to substrate carry out partially plating gold make gold-plated regional graphics-striping (removing gold-plated protection dry film)-second time outer graphics make non-gold-plated regional graphics-to the second time outer graphics position carry out alkali etching, acid etching (the interior figure of making plate)-outward inspection-resistance weldering-print character-surface-coated-profile-electrical measurement-one-tenth inspection-packing.
Yet, there is following defective when for the first time figure is with figure for the second time in the manufacture craft of above-mentioned existing partially plating gold plate:
1, figure contraposition difficulty: the junction in gold-plated zone and non-gold-plated zone because have for the first time graphic making go out gold-plated regional graphics and for the second time graphic making go out the aligning accuracy deviation that has 2～4mil between the non-gold-plated regional graphics;
2, gold plating quality is poor: because gold-plated peripheral region is connected with figure layer, outside carrying out in the etching making plate during figure, the copper layer that occurs easily below the Gold plated Layer is snapped eating away, the situation that gilding subsides occurs.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of manufacture craft of partially plating gold plate, can avoid figure contraposition deviation and the situation that improves gold plating quality to occur.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of manufacture craft of partially plating gold plate is provided, comprises the steps:
Once property is made figure in all plates with gold-plated zone and non-gold-plated zone on circuit board; Make the auxiliary limit of outer lead-in wire and conduction simultaneously as glodclad wire, and the two ends of outer lead-in wire are connected with gold-plated zone with the auxiliary limit of conduction;
On non-gold-plated zone and outer lead-in wire, sticking the protection dry film protects;
As glodclad wire, carry out gold-plated with outer lead-in wire to gold-plated zone;
Remove the protection dry film in non-gold-plated zone;
Adopt laser fixed point fuse technology to remove outer lead-in wire, the temperature of said laser fixed point fuse is 1100 degree.
Wherein, said on circuit board once in the property making ejecting plate step of figure comprise: on circuit board, carry out outer graphics and carry out the figure etching, produce figure in all plates.
Wherein, the said step that on circuit board, once comprises before the step of figure in the property making ejecting plate: circuit board is sunk copper, plating.
Wherein, saidly in that being sunk, circuit board comprises step before the step of copper, plating: circuit board is carried out lamination, boring.
Wherein, the said step that before circuit board being carried out lamination, boring step, comprises: the substrate to the forming circuit plate carries out internal layer processing.
Wherein, said in the disposable plate of making figure in all plates and making the non-gold-plated zone of figure stick between the step of protection dry film and comprise step: examine figure carries out in to all plates of making outside.
Wherein, saidly adopting laser fixed point fuse to comprise step after removing the step of outer lead-in wire: to hinder weldering, print character.
Wherein, the said step that after the step of print character, comprises: profile detects, carries out electrical testing.
Wherein, comprise step after the said step that detects, carries out electrical testing in profile: carry out finished product detection.
The invention has the beneficial effects as follows: be different from the partially plating gold plate secondary figure contraposition difficulty of prior art and the situation of gold plating quality difference; The present invention etches all figures in the circuit board through disposable; And make outer lead-in wire as glodclad wire; After the partially plating gold operation of accomplishing circuit board, fall through laser ablation, so just can there be the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board.
Description of drawings
Fig. 1 is the flow chart of the manufacture craft of partially plating gold plate of the present invention;
Fig. 2 is the structural representation of all figures in the partially plating gold plate etching ejecting plate of the present invention;
Fig. 3 is the structural representation that non-gold-plated locality protection among Fig. 2 is got up;
Fig. 4 carries out gold-plated structural representation to gold-plated zone among Fig. 2;
Fig. 5 is the structural representation that removes non-gold-plated locality protection film among Fig. 3;
Fig. 6 adopts laser fuse method to remove the structural representation of outer lead-in wire.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, the manufacture craft of partially plating gold plate of the present invention comprises the steps:
The substrate of forming circuit plate is promptly chosen in blanking;
Substrate to the forming circuit plate carries out internal layer processing;
Circuit board is carried out lamination, boring;
To sinking copper, plating on the circuit board after lamination, the boring;
See also Fig. 2, once property is made figure 100 in all plates with gold-plated zone and non-gold-plated zone on circuit board; Outer graphics is carried out in the zone that promptly on circuit board, need make figure 100 in the plate, and etches figure in all plates; Make outer lead-in wire 10 simultaneously and conduct electricity auxiliary limit 20, and make the two ends of outer lead-in wire 10 assist limit 20 to be connected with conduction as glodclad wire;
Figure in all plates that etch is carried out outer inspection;
See also Fig. 3, non-gold-plated zone and outer lead-in wire are sticked the protection dry film protect;
See also Fig. 4, go between 10 as glodclad wire, carry out gold-plated gold-plated zone with outer;
See also Fig. 5, remove the protection dry film in non-gold-plated zone;
See also Fig. 6, adopt laser fixed point fuse technology to remove outer lead-in wire 10, said laser fuse temperature is concrete 1100 degree, comprises that specifically step passes through the side and cut off being connected of copper cash and gold-plated zone, and the time is 1min 300 points that can point break;
Hinder weldering;
Carry out print character then;
Leveling circuit board;
Circuit board is carried out profile to be detected;
Circuit board is carried out electrical testing;
Finished product detection;
Packing.
The present invention etches all figures in the circuit board through disposable, so just can not have the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board, and the present invention etches all figures 100 in the circuit board through disposable; And with the auxiliary limit 20 of outer lead-in wire 10 and conduction as glodclad wire; Can all plate nickel-gold layer all around in gold-plated zone, can protect gold-plated zone like this, improve gold plating quality; Only need fall outer lead-in wire in gold-plated back simultaneously through laser ablation; Need not carry out a large amount of etch processs, the heavy copper under the Gold plated Layer can not be snapped eating away, thereby the situation that gilding subsides can not occur.
There is the situation of contraposition difficulty and gold plating quality difference in the partially plating gold plate that is different from prior art when carrying out secondary image; The present invention etches all figures in the circuit board through disposable; And make skin lead-in wire 10 as glodclad wire; After the partially plating gold operation of accomplishing circuit board, fall outer lead-in wire 10 through laser ablation, so just can there be the situation that occurs the aligning accuracy deviation between gold-plated zone and the non-gold-plated zone on the circuit board.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (9)
1. the manufacture craft of a partially plating gold plate is characterized in that, comprises the steps:
Once property is made the conductive pattern in all surface scope with gold-plated zone and non-gold-plated zone on circuit board; Make the auxiliary limit of outer lead-in wire and conduction simultaneously as glodclad wire, and the two ends of outer lead-in wire are connected with gold-plated zone with the auxiliary limit of conduction;
On non-gold-plated zone and outer lead-in wire, sticking the protection dry film protects;
As glodclad wire, carry out gold-plated with outer lead-in wire to gold-plated zone;
Remove the protection dry film in non-gold-plated zone;
Adopt laser fixed point fuse technology to remove outer lead-in wire, the temperature of said laser fixed point fuse is 1100 degree.
2. the manufacture craft of partially plating gold plate according to claim 1; It is characterized in that: once the property step of producing the conductive pattern in the surface range comprises on circuit board: on circuit board, carry out outer graphics processing and carry out the figure etching, produce the conductive pattern in all surface scope.
3. the manufacture craft of partially plating gold plate according to claim 2 is characterized in that: once property is produced and is comprised step before the step of the conductive pattern in the surface range on circuit board: circuit board is sunk copper, plating.
4. the manufacture craft of partially plating gold plate according to claim 3 is characterized in that: comprise step before the step of copper, plating in that circuit board is sunk: circuit board is carried out lamination, boring.
5. the manufacture craft of partially plating gold plate according to claim 4 is characterized in that: before circuit board being carried out lamination, boring step, comprise step: the substrate to the forming circuit plate carries out internal layer processing.
6. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: the non-gold-plated zone of figure is sticked between the step of protecting dry film and is comprised step in the disposable plate of making the conductive pattern in all surface scope and making: inspection outside the conductive pattern in all surface scope of making is carried out.
7. the manufacture craft of partially plating gold plate according to claim 1 is characterized in that: after the step that adopts the outer lead-in wire of laser fixed point fuse removal, comprise step: hinder weldering, print character.
8. the manufacture craft of partially plating gold plate according to claim 7 is characterized in that: after the step of print character, comprise step: profile detects, carries out electrical testing.
9. the manufacture craft of partially plating gold plate according to claim 8 is characterized in that: detect, carry out in profile to comprise step after the step of electrical testing: carry out finished product detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105570874A CN102014575B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105570874A CN102014575B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102014575A CN102014575A (en) | 2011-04-13 |
| CN102014575B true CN102014575B (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105570874A Expired - Fee Related CN102014575B (en) | 2010-11-24 | 2010-11-24 | Process for manufacturing local gold-plated board |
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| Country | Link |
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| CN (1) | CN102014575B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780710B (en) * | 2014-01-15 | 2018-06-15 | 深圳崇达多层线路板有限公司 | Printed wiring board and preparation method thereof |
| CN103796433B (en) * | 2014-01-16 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
| CN112218437B (en) * | 2020-10-19 | 2022-06-03 | 西安空间无线电技术研究所 | Method for removing electroplating connection line of thin film circuit pattern |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN114501814B (en) * | 2022-01-27 | 2023-06-02 | 深圳市景旺电子股份有限公司 | Method for removing gold-plated lead of printed circuit board and method for manufacturing golden finger |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006100300A (en) * | 2004-09-28 | 2006-04-13 | Shindo Denshi Kogyo Kk | Printed wiring board and manufacturing method therefor |
| CN100585022C (en) * | 2007-03-30 | 2010-01-27 | 富港电子（东莞）有限公司 | Method for electroplating gold on surface of circuit board |
| CN101267713B (en) * | 2008-04-30 | 2011-04-06 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
| CN101626664A (en) * | 2008-07-11 | 2010-01-13 | 惠阳科惠工业科技有限公司 | Process flow for electroplating Ni/Au and selectively electroplating thick gold without lead wire |
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2010
- 2010-11-24 CN CN2010105570874A patent/CN102014575B/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN102014575A (en) | 2011-04-13 |
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| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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Granted publication date: 20120704 Termination date: 20151124 |
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