CN105934094B - A kind of built-in capacity wiring board and preparation method thereof - Google Patents
A kind of built-in capacity wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN105934094B CN105934094B CN201610448393.1A CN201610448393A CN105934094B CN 105934094 B CN105934094 B CN 105934094B CN 201610448393 A CN201610448393 A CN 201610448393A CN 105934094 B CN105934094 B CN 105934094B
- Authority
- CN
- China
- Prior art keywords
- built
- capacity
- plate
- core plate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention discloses a kind of built-in capacity wiring board and preparation method thereof.Production method includes: step A, the built-in capacity core plate for selecting thickness≤50 μm；Step B, the built-in capacity core plate is cut into required size；Step C, FR4 plate is cut, adjacent built-in capacity core plate is separated using FR4 plate；Step D, figure is made in two times to the built-in capacity core plate；Step E, brownification processing is carried out to the built-in capacity core plate；Step J, after brownification processing, the built-in capacity core plate is made to the finished product present invention to thin, the no thin easy breakage of copper Qu Jicai that can effectively solve built-in capacity core plate plate, the problems such as conductor and substrate junction are easily broken off, to improve production yield, reduction is scrapped；In addition the present invention can effectively solve because of substrate breakage, after pressing, it is possible that improving the long-term reliability of product the problem of the influence reliability such as two sandwich circuit boards are short-circuit, electric leakage.
Description
Technical field
The present invention relates to built-in capacity wiring board production field more particularly to a kind of built-in capacity wiring board and its production sides
Method.
Background technique
Embedded built-in capacity wiring board has used the core plate with ceramic material, by the prototype part with capacity effect
Inside capacitor embedment or lamination to printed board, a big plane capacitance is formed, improves circuit board interconnection density to realize
And reduce PCB size, it reduces separation capacitor dosage and reduces attachment cost, improve place and route, improve attachment reliability etc.
Effect.
In order to improve the capacitance of built-in capacity, meets the demand of conventional design capacitance, generally require and reduce core plate thickness
Degree improves filler and resin specific gravity, such as the built-in capacity core material of current 3M manufacturer production, realizes capacitance density 10nF/
in2, buried capacitor thickness of dielectric layers only has 12 μm, and without glass cloth reinforcing material in core plate, only epoxy resin and filler is formed,
Material is crisp, and fracture is easy in manufacturing process.And conventional minimum 50 μm of core thickness for making wiring board, practical major part work
Factory is all unable to reach this ability, can only produce the core plate of 100 μ m thicks or more, can even produce, and scrappage is also very high.
So perplexing such product batch production at present, one of most important problem of industrialization is that built-in capacity core
Plate is thin, and no glass cloth backing material improves intensity.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of built-in capacity wiring board and its production
Method, it is intended to solve existing built-in capacity core plate is easy to happen the disconnected plate of folded plate, substrate is damaged, manufacture difficulty is big, scrappage is high etc.
Problem.
Technical scheme is as follows:
A kind of production method of built-in capacity wiring board, wherein include:
If step A, selecting the built-in capacity core plate of dry thickness≤50 μm；
Step B, the built-in capacity core plate is cut into required size；
Step C, FR4 plate is cut, adjacent built-in capacity core plate is separated using FR4 plate；
Step D, figure is made in two times to the built-in capacity core plate；
Step E, brownification processing is carried out to the built-in capacity core plate；
Step J, after brownification processing, the built-in capacity core plate is made to finished product.
The production method of the built-in capacity wiring board, wherein in the step C, the FR4 plate thickness after cutting is
0.1-2mm is unilateral 0.5-20mm bigger than built-in capacity core plate.
The production method of the built-in capacity wiring board, wherein in the step D, when making figure, development and erosion
Spray pressure≤the 1.5kg/cm at quarter3。
The production method of the built-in capacity wiring board, wherein in the step E, spray pressure when brownification≤
1.5kg/cm3。
The production method of the built-in capacity wiring board, wherein in the step C, the FR4 plate passes through etching solution
Method by plate face copper etch remove, obtain the FR4 plate of no copper.
The production method of the built-in capacity wiring board, wherein in the step A, the built-in capacity core plate is being schemed
When shape designs, edges of boards two sides carries out copper billet and is arranged in a staggered manner.
The production method of the built-in capacity wiring board, wherein before the step of production figure successively includes: figure
Reason, contraposition exposure, development, etching, striping and optical detection.
The production method of the built-in capacity wiring board, wherein the number of plies >=3 layer of the built-in capacity core plate.
The production method of the built-in capacity wiring board, wherein the built-in capacity core plate is double face copper.
A kind of built-in capacity wiring board, wherein the production method in use.
The utility model has the advantages that the present invention can effectively solve built-in capacity core plate plate thin, no thin easy breakage of copper Qu Jicai, conductor with
The problems such as substrate junction is easily broken off, to improve production yield, reduction is scrapped；In addition the present invention can effectively solve because of substrate
Breakage, after pressing, it is possible that improving the long-term of product the problem of the influence reliability such as two sandwich circuit boards are short-circuit, electric leakage
Reliability.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the production method preferred embodiment of built-in capacity wiring board of the present invention.
Fig. 2 is the schematic diagram for separating built-in capacity core plate in the present invention using FR4.
Specific embodiment
The present invention provides a kind of built-in capacity wiring board and preparation method thereof, for make the purpose of the present invention, technical solution and
Effect is clearer, clear, and the present invention is described in more detail below.It should be appreciated that specific embodiment described herein
It is only used to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the production method preferred embodiment of built-in capacity wiring board of the present invention,
As shown, comprising:
If step S101, selecting the built-in capacity core plate of dry thickness≤50 μm；
Step S102, the built-in capacity core plate is cut into required size；
Step S103, FR4 plate is cut, adjacent built-in capacity core plate is separated using FR4 plate；
Step S104, figure is made in two times to the built-in capacity core plate；
Step S105, brownification processing is carried out to the built-in capacity core plate；
Step S106, after brownification processing, the built-in capacity core plate is made to finished product.
In the present invention, due to be using secondary image production method, so when first time making a face figure, in addition one
Face is needed except contraposition, to be opened a window in edges of boards contraposition place outer, all other stays auxiliary copper, and (this copper can be arbitrary shape and size
), to increase intensity.
Meanwhile the design for edges of boards figure, two-side graph are designed as when complementation, i.e. one side graphic designs with staying copper
Side, is just staggered in other one side graphic designs and copper is stayed to design, so that two-side graph stays formation complementation at copper, to increase
The intensity of built-in capacity core plate avoids two-side graph consistent, and it is big to will lead to overlapping position weight, generates stress with substrate area around,
Copper and substrate engagement edge is set substrate damaging problem occur.
Specifically, it first internally to bury capacitor core plate and carry out engineering data design, including layout design, technique edges figure are set
Meter, line build-out design etc., while carrying out copper billet in edges of boards when being included in graphic designs and being staggered design (the i.e. auxiliary on edges of boards two sides
Copper billet is arranged in a staggered manner) area He Wutong stay as far as possible copper design etc..Copper size is stayed not limit, as long as not influencing contraposition and production figure
Shape needs, then all stays copper.There is copper region to be designed according to design configuration requirement the design that is staggered.
Then in step s101, select a kind of core thickness≤50 μm built-in capacity core plate several；It is buried in described
Capacitor core plate is preferably double face copper.
In the step S102, the built-in capacity core plate is cut into as requested and needs size.Electricity is buried in described
The ingredient for holding core plate is epoxy resin and silicon carbide, such as by mass percentage, epoxy resin accounts for 60%, silicon carbide 40%.
Step S103, FR4 plate is cut, adjacent built-in capacity core plate is separated using FR4 plate；FR4 plate used in the present invention,
Epoxy resin board for a kind of plate face without copper, using preceding needs by cutting to obtain required size.FR4 plate in the present invention
Its thickness is preferably 0.1-2mm, such as 1mm, and single side size is preferably 0.5-20mm bigger than built-in capacity core plate, such as unilateral big
10mm.In FR4 plate before use, then can be gone the etching of plate face copper by the method for etching solution according to normal method sawing sheet
It removes, becomes the epoxy resin board of no copper, and the plate is applied in process of the invention.As shown in Fig. 2, electricity can be buried inside
The upper and lower surface for holding core plate 10 covers a FR4 plate 20, so that adjacent built-in capacity core plate 10 be separated.
Further, in the step S104, figure is made in two times.I.e. first only make a face figure, comprise the concrete steps that by
The built-in capacity core plate makes according to normal flow to AOI, normal flow successively include figure pre-treatment, contraposition exposure,
Development, etching, striping and AOI (optical detection).In above-mentioned figure development and etching process, for the spray pressure for preventing liquid medicine
Power is too big, and inherently thin built-in capacity core plate is broken through or substrate splits, and in development and etching, adjusts the spray pressure of liquid medicine
Power, guarantee≤1.5kg/cm3, for example, 1.2 kg/cm3.After the completion of first face graphic making, continuation makes according to normal flow
, when making the second face figure, in development and etching, liquid medicine (development institute is adjusted to AOI to produce the second face figure
Liquid medicine and the used liquid medicine of etching are all satisfied following requirements) spray pressure, guarantee≤1.5kg/cm3, for example, 1.2
kg/cm3, broken through prevented also from built-in capacity core plate or substrate split.
In the step S105, after AOI test passes, internally buries capacitor core plate and carry out brownification processing, liquid medicine when brownification
Spray pressure with aforementioned, adjust the spray pressure of liquid medicine (i.e. liquid medicine used in spraying step), guarantee≤1.5 kg/
cm3, for example, 1.2 kg/cm3, to prevent, built-in capacity core plate from breaking through or substrate splits.
It after brownification processing, makes according to normal flow to finished product, these processes successively include pressing, drilling, heavy copper sheet
Electricity, figure, graphic plating, etching, anti-welding, surface treatment, molding, electrical measurement, FQC/FQA are examined, are packed shipment.In manufacturing process
In, it needs the mode of transport for internally burying capacitor core plate, controlled by processes such as plate modes, prevent manufacturing process interruption board from rolling over
Plate, or the problems such as cause substrate damaged.
In the present invention, the number of plies >=4 layer of built-in capacity core plate, built-in capacity core plate plate thickness≤50 μ that the present invention selects
M, actual built-in capacity core plate are pressed together on internal layer, and final finished is >=3 layers, such as 6 layers.By increasing auxiliary copper
Block is staggered and is separated with FR4 without bronzing plate between complementary design, plate and plate, improves the production intensity of built-in capacity core plate, has
Effect solves the problems, such as that disconnected plate folded plate, substrate breakage occurs in the production of built-in capacity core plate, improves production yield, obtains reliability
To being effectively ensured.
The present invention also provides a kind of built-in capacity wiring board preferred embodiments, use production method as described above.
In conclusion the present invention can effectively solve built-in capacity core plate plate thin, no thin easy breakage of copper Qu Jicai, conductor with
The problems such as substrate junction is easily broken off, to improve production yield, reduction is scrapped；In addition the present invention can effectively solve because of substrate
Breakage, after pressing, it is possible that improving the long-term of product the problem of the influence reliability such as two sandwich circuit boards are short-circuit, electric leakage
Reliability.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of production method of built-in capacity wiring board characterized by comprising
If step A, selecting the built-in capacity core plate of dry thickness≤50 μm；
Step B, the built-in capacity core plate is cut into required size；
Step C, FR4 plate is cut, adjacent built-in capacity core plate is separated using FR4 plate；
Step D, figure is made in two times to the built-in capacity core plate；
Step E, brownification processing is carried out to the built-in capacity core plate；
Step F, after brownification processing, the built-in capacity core plate is made to finished product；
When first time making a face figure, in addition one side is removed contraposition and is needed, and to open a window in edges of boards contraposition place outer, all other
Stay auxiliary copper；
Design for edges of boards figure, two-side graph is designed as staying copper local when complementation, i.e. one side graphic designs, in addition
Just being staggered when graphic designs on one side stays copper to design；
The FR4 plate is FR4 without bronzing plate.
2. the production method of built-in capacity wiring board according to claim 1, which is characterized in that in the step C, cut
FR4 plate thickness afterwards is 0.1-2mm, unilateral 0.5-20mm bigger than built-in capacity core plate.
3. the production method of built-in capacity wiring board according to claim 1, which is characterized in that in the step D, making
When making figure, spray pressure≤1.5kgf/cm of development and etching2。
4. the production method of built-in capacity wiring board according to claim 1, which is characterized in that in the step E, brownification
When spray pressure≤1.5kgf/cm2。
5. the production method of built-in capacity wiring board according to claim 1, which is characterized in that described in the step C
Plate face copper is etched by the method for etching solution and is removed by FR4 plate, obtains the FR4 plate of no copper.
6. the production method of built-in capacity wiring board according to claim 1, which is characterized in that described in the step A
In graphic designs, edges of boards two sides carries out copper billet and is arranged in a staggered manner built-in capacity core plate.
7. the production method of built-in capacity wiring board according to claim 1, which is characterized in that production figure the step of according to
Secondary includes: figure pre-treatment, contraposition exposure, development, etching, striping and optical detection.
8. the production method of built-in capacity wiring board according to claim 1, which is characterized in that the built-in capacity core plate
The number of plies >=3 layer.
9. the production method of built-in capacity wiring board according to claim 1, which is characterized in that the built-in capacity core plate
For double face copper.
10. a kind of built-in capacity wiring board, which is characterized in that use the described in any item production methods of claim 1 ~ 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448393.1A CN105934094B (en) | 2016-06-21 | 2016-06-21 | A kind of built-in capacity wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610448393.1A CN105934094B (en) | 2016-06-21 | 2016-06-21 | A kind of built-in capacity wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105934094A CN105934094A (en) | 2016-09-07 |
| CN105934094B true CN105934094B (en) | 2019-04-16 |
Family
ID=56830468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610448393.1A Active CN105934094B (en) | 2016-06-21 | 2016-06-21 | A kind of built-in capacity wiring board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105934094B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107046778A (en) * | 2017-03-04 | 2017-08-15 | 吉安市满坤科技有限公司 | A kind of preparation method of buried capacitor printed circuit board |
| CN107683032A (en) * | 2017-08-31 | 2018-02-09 | 江苏普诺威电子股份有限公司 | Two-sided etching burying capacitance circuit board manufacture craft |
| CN109661113B (en) * | 2018-12-29 | 2020-06-26 | 苏州群策科技有限公司 | Preparation method and device of ultrathin embedded circuit board |
| CN116709658A (en) * | 2023-07-26 | 2023-09-05 | 清远市富盈电子有限公司 | Copper deposition method of embedded element PCB and PCB manufactured by copper deposition method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049054A (en) * | 2007-08-14 | 2009-03-05 | Enrei Yu | Structure of capacitor embedded in printed circuit board |
| KR20100003060A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 심텍 | Printed circuit board comprising embedded capacitor and method for fabricating the same |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN103298274A (en) * | 2012-02-24 | 2013-09-11 | 北大方正集团有限公司 | Manufacturing method for capacitor-buried printed-circuit board and capacitor-buried printed-circuit board |
| CN203407070U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Thin core plate laminating structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7886414B2 (en) * | 2007-07-23 | 2011-02-15 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing capacitor-embedded PCB |
| KR100966638B1 (en) * | 2008-03-25 | 2010-06-29 | 삼성전기주식회사 | Printed circuit board having capacitor and manufacturing method thereof |
-
2016
- 2016-06-21 CN CN201610448393.1A patent/CN105934094B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009049054A (en) * | 2007-08-14 | 2009-03-05 | Enrei Yu | Structure of capacitor embedded in printed circuit board |
| KR20100003060A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 심텍 | Printed circuit board comprising embedded capacitor and method for fabricating the same |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| CN103298274A (en) * | 2012-02-24 | 2013-09-11 | 北大方正集团有限公司 | Manufacturing method for capacitor-buried printed-circuit board and capacitor-buried printed-circuit board |
| CN203407070U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Thin core plate laminating structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105934094A (en) | 2016-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105934094B (en) | A kind of built-in capacity wiring board and preparation method thereof | |
| CN103687347B (en) | A kind of manufacture method of partial hybrid printed circuit board | |
| CN107222983A (en) | The pcb board and preparation method of a kind of embedded AlN ceramic insulating radiation module | |
| CN102686029A (en) | Method for manufacturing blind slot of circuit board | |
| CN103906371B (en) | Circuit board with embedded element and preparation method thereof | |
| CN102917554B (en) | Manufacturing method of multilayer double-copper conductor plate | |
| CN103187311A (en) | Fabrication method of package substrate | |
| CN107241876A (en) | A kind of processing method for printed circuit board of being sunken cord without core plate one side | |
| CN107613647A (en) | A kind of preparation method of new energy intelligent charging system wiring board | |
| CN102045964B (en) | Making method of circuit board | |
| TW201624577A (en) | Package structure and method of manufacture | |
| CN103298274B (en) | A kind of bury hold printed circuit board manufacture method and bury appearance printed circuit board | |
| CN103985647A (en) | Method for preparing copper cylinder salient points | |
| CN104051278B (en) | The molding milling method of DBC ceramic substrate | |
| CN103025085A (en) | Copper deposition method for double-faced aluminum substrate | |
| WO2018115625A3 (en) | Method for the integration of power chips and bus-bars forming heat sinks | |
| CN107683032A (en) | Two-sided etching burying capacitance circuit board manufacture craft | |
| CN101847600A (en) | Method for producing a number of integrated semiconductor components | |
| US20110079919A1 (en) | Electrical connection via for the substrate of a semiconductor device | |
| JP2005080281A (en) | Ultrahigh frequency multilayer circuit structure and method for manufacturing the same | |
| CN101699930A (en) | Glue filling and laminating method of circuit board | |
| US20160183371A1 (en) | Microvia structure of flexible circuit board and manufacturing method thereof | |
| CN105810596A (en) | Fabrication method of etched surface acoustic filter chip package structure | |
| CN110113877A (en) | A kind of method of laser cutting method production metal base circuit board | |
| CN104284530B (en) | The method that no core plate technique makes printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |