CN102686029A - Method for manufacturing blind slot of circuit board - Google Patents
Method for manufacturing blind slot of circuit board Download PDFInfo
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- CN102686029A CN102686029A CN201210123484XA CN201210123484A CN102686029A CN 102686029 A CN102686029 A CN 102686029A CN 201210123484X A CN201210123484X A CN 201210123484XA CN 201210123484 A CN201210123484 A CN 201210123484A CN 102686029 A CN102686029 A CN 102686029A
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- blind groove
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Abstract
The invention provides a method for manufacturing a blind slot of a circuit board. The manufacturing method comprises the following steps: providing a first substrate and a second substrate, wherein the first substrate and the second substrate form the circuit board with a manufactured circuit; forming a first opening on the second substrate; providing a metal block corresponding to the first opening, and arranging a conductive bonding layer on the metal block; providing a prepreg, wherein the prepreg comprises a first open window corresponding to the first opening; embedding the metal block into the first opening; and sequentially stacking the second substrate, the prepreg and the first substrate, and pressing to enable the second substrate, the prepreg and the first substrate to become a whole. Depth-control milling is adopted for enabling the circuit board after pressing to form the blind slot in a region corresponding to the first opening. According to the manufacturing method disclosed by the invention, the electrical properties and the heat radiation performance requirements of the blind slot can be also realized without performing electroplating on the blind slot; and in addition, the problem of the point effect of a rabbet caused by the electroplating is also solved, and the depth-control manufacturing of the blind slot, which meets the ultra-high-precision dimensional requirements, can be realized.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to the manufacture method of the blind groove of circuit board.
Background technology
The packing density of electronic equipment constantly increases; Function constantly promotes and downsizing; Cause pcb board spare heat generation density increasingly high, for some power amplifier formula high frequency communication products, rely on package design enough heats that can't leave merely; Must strengthen radiating effect by the design of PCB, the blind technology of burying of big copper block has obtained effective application under this situation.The blind technology of burying of big copper block is that earlier the mode through lamination embeds copper billet and specifies in the lamination area, mills blind groove and metallized mode deeply through controlling then, and that realizes blind groove is electrically connected performance and heat dispersion.
Because follow-up blind groove can be installed power discharging device, for better heat radiation, the dimension precision requirement of blind groove is increasingly high.Blind groove metallization is the decision operation of the blind groove dimensional accuracy of influence; In the metallized process of blind groove; Influence electroplating evenness because blind groove graphic designs is different with the plating point effect; Cause that easily the notch electro-coppering is thicker, cause some power discharging device of special size requirement to be difficult to be installed in the groove and form and scrap.
Summary of the invention
Based on this, provide a kind of and need not to carry out blind groove metallization making, thereby eliminate the manufacture method of electroplating process the blind groove of circuit board of blind groove precision influence.
The manufacture method of the blind groove of a kind of circuit board may further comprise the steps, and first substrate, second substrate are provided, and said first substrate, second substrate are the circuit board of the circuit made.Offer first opening on second substrate.Provide and the corresponding metal derby of said first opening, the conduction tack coat is arranged on the said metal derby.Prepreg is provided, and said prepreg has with said first opening corresponding first windows.Said metal derby is embedded in said first opening.Stack gradually said second substrate, prepreg, first substrate, and pressing makes its one-tenth as a whole.Adopt control to mill deeply above-mentioned pressing circuit board is later formed blind groove in the said first opening corresponding region.
Therein among embodiment, pressing electric conducting material on the said metal derby, said electric conducting material and said metal derby press together through said conduction tack coat.
Among embodiment, said metal derby carries out preliminary treatment therein, and said preliminary treatment comprises that carrying out brown on the said metal derby handles.
Therein among embodiment, window harmomegathus coefficient according to said second substrate of said first opening and first carries out the different processing of putting in advance, and said metal derby, conduction bonding sheet carry out handled on the size basis of said first opening.The manufacture method of the blind groove of foregoing circuit plate embeds said first opening with said metal derby.And pile up said second substrate, first substrate, prepreg, and pressing makes its one-tenth as a whole.Adopt control to mill deeply above-mentioned pressing circuit board is later formed blind groove in the said first opening corresponding region.Need not to carry out blind groove in this method and electroplate, solve the problem of electroplating the notch point effect that causes, satisfy the dark blind groove of control of superhigh precision dimensional requirement and make.
On the surface of metal derby, carry out brown and handle, make its rough surface, favourable enhancing metal derby surface and other surperficial combining.
Said metal derby, conduction tack coat on the size basis of said first opening by its separately the difference expansion factor that contracts carry out handled.Harmomegathus between the consideration different materials is also handled accordingly, is beneficial between each material to cooperate.
Description of drawings
Fig. 1 is first substrate of the manufacture method embodiment of the blind groove of circuit board, the profile figure of second substrate;
Fig. 2 is the figure that cuts open with tack coat metal derby of the manufacture method embodiment of the blind groove of circuit board;
Fig. 3 is the profile with first prepreg of windowing of the manufacture method embodiment of the blind groove of circuit board;
Fig. 4 is the profile after the pressing that carries out of the manufacture method embodiment of the blind groove of circuit board;
Fig. 5 is the profile that the blind groove of the manufacture method embodiment of the blind groove of circuit board forms;
Description of reference numerals:
1, first substrate, 2, second substrate, 3, first opening, 4, metal derby, 5, the conduction tack coat, 6, prepreg, 7, first windows, and 8, blind groove.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present technique scheme is done further explanation.
The manufacture method of the blind groove of a kind of circuit board may further comprise the steps.
See also Fig. 1, the circuit board of first substrate 1, second substrate, 2, the first substrates 1, second substrate 2 circuit for having made at first is provided.First substrate 1, second substrate 2 can be that two-ply also can multi-layer sheet.Offer first opening 3 on second substrate 2.
See also Fig. 2 the metal derby corresponding with first opening 3 is provided, conduction tack coat 5 is arranged on the metal derby.Also can be on metal derby pressing layer of conductive material again, electric conducting material and metal derby press together through the conduction tack coat.Metal derby 4 carries out preliminary treatment, and preliminary treatment comprises that carrying out brown on the metal derby handles.In the present embodiment, the preferred copper billet of metal derby.
See also Fig. 3, prepreg 6 is provided, prepreg 6 has with first opening 3 corresponding first windows 7.In the present embodiment, prepreg is PP.
Metal derby 4 is embedded in first opening 3, make the metal derby 4 and first opening 3 closely cooperate.When anticipating, first opening 3 and first is windowed and 7 is needed harmomegathus coefficient according to second substrate carry out the different processing of putting in advance; Metal derby 4 carries out handled with 5 of bonding sheets of conduction on the size basis of first opening 3.
See also Fig. 4 and Fig. 5, stack gradually second substrate 2, prepreg 6, first substrate 1, and pressing makes its one-tenth as a whole.Adopt control to mill deeply above-mentioned pressing circuit board is later formed blind groove 8 in first opening, 3 corresponding regions.The size of blind groove 8 is less than the size of first opening 3.The manufacture method of the blind groove of foregoing circuit plate embeds first opening with metal derby.And pile up second substrate, first substrate, prepreg, and pressing makes its one-tenth as a whole.Adopt control to mill deeply above-mentioned pressing circuit board is later formed blind groove in the first opening corresponding region.Need not to carry out blind groove in this method and electroplate, solve the problem of electroplating the notch point effect that causes, satisfy the dark blind groove of control of superhigh precision dimensional requirement and make.
On the surface of metal derby, carry out brown and handle, make its rough surface, favourable enhancing metal derby surface and other surperficial combining.
Metal derby, conduction tack coat on the size basis of first opening by its separately the difference expansion factor that contracts carry out handled.Harmomegathus between the consideration different materials is also handled accordingly, is beneficial between each material to cooperate.
The above embodiment has only expressed several kinds of execution modes of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with accompanying claims.
Claims (4)
1. the manufacture method of the blind groove of circuit board is characterized in that, may further comprise the steps,
First substrate, second substrate are provided, and said first substrate, second substrate are the circuit board of the circuit made;
Offer first opening on second substrate;
Provide and the corresponding metal derby of said first opening, the conduction tack coat is arranged on the said metal derby;
Prepreg is provided, and said prepreg has with said first opening corresponding first windows;
Said metal derby is embedded in said first opening;
Stack gradually said second substrate, semi-solid preparation, first substrate film, and pressing makes its one-tenth as a whole;
Adopt control to mill deeply above-mentioned pressing circuit board is later formed blind groove in the said first opening corresponding region.
2. the manufacture method of the blind groove of circuit board as claimed in claim 1 is characterized in that, pressing electric conducting material on the said metal derby, and said electric conducting material and said metal derby press together through said conduction tack coat.
3. the manufacture method of the blind groove of circuit board as claimed in claim 2 is characterized in that said metal derby carries out preliminary treatment, and said preliminary treatment comprises that carrying out brown on the said metal derby handles.
4. the manufacture method of the blind groove of circuit board as claimed in claim 3; It is characterized in that; Window harmomegathus coefficient according to said second substrate of said first opening and first carries out the different processing of putting in advance, and said metal derby, conduction bonding sheet carry out handled on the size basis of said first opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123484.XA CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123484.XA CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN102686029A true CN102686029A (en) | 2012-09-19 |
| CN102686029B CN102686029B (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210123484.XA Expired - Fee Related CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
| CN103402324A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Production process for improving blind routing depth accuracy |
| CN103781273A (en) * | 2012-10-19 | 2014-05-07 | 深南电路有限公司 | Embedded metal-base PCB and processing method thereof |
| CN104125714A (en) * | 2013-04-28 | 2014-10-29 | 深南电路有限公司 | Large current printed circuit board and machining method thereof |
| CN105392275A (en) * | 2015-11-30 | 2016-03-09 | 珠海方正科技多层电路板有限公司 | Circuit board, production method thereof and radio frequency (RF) device |
| CN105555067A (en) * | 2016-02-19 | 2016-05-04 | 周跃 | Fabrication method of circuit board |
| CN105792548A (en) * | 2016-05-23 | 2016-07-20 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with stepped slot structure through electroplating and etching method |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
| CN107734859A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN107787128A (en) * | 2016-08-24 | 2018-03-09 | 深南电路股份有限公司 | A kind of PCB processing methods |
| CN108834335A (en) * | 2018-07-10 | 2018-11-16 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN110267430A (en) * | 2019-06-12 | 2019-09-20 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process for blind slot film |
| CN110381666A (en) * | 2019-06-27 | 2019-10-25 | 沪士电子股份有限公司 | A kind of groove type buries the multi-layer PCB board production method of copper billet |
| CN111113549A (en) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
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| US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| CN101288350A (en) * | 2005-10-14 | 2008-10-15 | 揖斐电株式会社 | Multilayered printed circuit board and method for manufacturing the same |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
| CN201947535U (en) * | 2011-01-14 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | A mixed-voltage high frequency printed circuit board with locally planted metal blocks |
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- 2012-04-24 CN CN201210123484.XA patent/CN102686029B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| CN101288350A (en) * | 2005-10-14 | 2008-10-15 | 揖斐电株式会社 | Multilayered printed circuit board and method for manufacturing the same |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
| CN201947535U (en) * | 2011-01-14 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | A mixed-voltage high frequency printed circuit board with locally planted metal blocks |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103781273A (en) * | 2012-10-19 | 2014-05-07 | 深南电路有限公司 | Embedded metal-base PCB and processing method thereof |
| CN103079350B (en) * | 2012-12-28 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103079350A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
| CN104125714A (en) * | 2013-04-28 | 2014-10-29 | 深南电路有限公司 | Large current printed circuit board and machining method thereof |
| CN103402324B (en) * | 2013-08-02 | 2016-04-06 | 高德（无锡）电子有限公司 | A kind ofly improve blind production technology of dragging for depth accuracy |
| CN103402324A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Production process for improving blind routing depth accuracy |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
| CN105392275A (en) * | 2015-11-30 | 2016-03-09 | 珠海方正科技多层电路板有限公司 | Circuit board, production method thereof and radio frequency (RF) device |
| CN105392275B (en) * | 2015-11-30 | 2019-03-08 | 珠海方正科技多层电路板有限公司 | Wiring board, its production method and radio-frequency devices |
| CN105555067A (en) * | 2016-02-19 | 2016-05-04 | 周跃 | Fabrication method of circuit board |
| CN105792548B (en) * | 2016-05-23 | 2018-12-14 | 上海美维科技有限公司 | A method of ladder slot structure printed circuit board is made with plating and engraving method |
| CN105792548A (en) * | 2016-05-23 | 2016-07-20 | 上海美维科技有限公司 | Method for manufacturing printed circuit board with stepped slot structure through electroplating and etching method |
| CN107787128A (en) * | 2016-08-24 | 2018-03-09 | 深南电路股份有限公司 | A kind of PCB processing methods |
| CN107734859A (en) * | 2017-11-20 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB manufacture method and PCB |
| CN107734859B (en) * | 2017-11-20 | 2020-05-22 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN108834335A (en) * | 2018-07-10 | 2018-11-16 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN110267430A (en) * | 2019-06-12 | 2019-09-20 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process for blind slot film |
| CN110267430B (en) * | 2019-06-12 | 2021-08-13 | 惠州市盈帆实业有限公司 | Circuit board for blind groove coating and preparation process thereof |
| CN110381666A (en) * | 2019-06-27 | 2019-10-25 | 沪士电子股份有限公司 | A kind of groove type buries the multi-layer PCB board production method of copper billet |
| CN111113549A (en) * | 2019-12-16 | 2020-05-08 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
| CN111113549B (en) * | 2019-12-16 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
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| Publication number | Publication date |
|---|---|
| CN102686029B (en) | 2015-09-02 |
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