CN104981113B - The processing method and golden finger circuit board of circuit edge connector - Google Patents
The processing method and golden finger circuit board of circuit edge connector Download PDFInfo
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- CN104981113B CN104981113B CN201410148928.4A CN201410148928A CN104981113B CN 104981113 B CN104981113 B CN 104981113B CN 201410148928 A CN201410148928 A CN 201410148928A CN 104981113 B CN104981113 B CN 104981113B
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- golden finger
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Abstract
The invention discloses a kind of processing method of circuit edge connector and golden finger circuit board, and to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.Method includes:The golden finger copper-clad plate with golden finger figure and gold plated lead is provided, the non-golden finger area of its outer surface subtracts thickness by controlled depth milling;Subtract thick region in controlled depth milling, be laminated outer dielectric layer and outer layer metal layer;Internal layer circuit layer and interlevel dielectrics layer are laminated between the non-golden finger area of two golden finger copper-clad plates;Pad is set between the golden finger area of two golden finger copper-clad plates;Then, pressing forms multi-layer sheet;Make outer-layer circuit;It is gold-plated to golden finger figure, form golden finger;Controlled depth milling removes the non-golden finger part beyond multiple-plate shaping area, and golden finger circuit board is made, and golden finger circuit board includes circuit board body and the more golden fingers to extend out.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to processing method and the golden finger electricity of a kind of circuit edge connector
Road plate.
Background technology
At present, the printed circuit board (PCB) with golden finger(PCB)Plate, generally using golden finger is related to online in its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost;Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, cause the versatility of golden finger circuit board very poor;When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technology of the wasting of resources and cost to be asked
Topic.
First aspect present invention provides a kind of processing method of circuit edge connector, it may include:
Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate have multiple golden finger figures and with gold
Finger figure is connected and is etched positioned at the gold plated lead of edges of boards, the metal level of the non-golden finger area of the golden finger copper-clad plate
Remove, and the non-golden finger area of the golden finger copper-clad plate outer surface subtracts thickness by controlled depth milling;
Subtracted the non-golden finger graphics field of thickness by controlled depth milling in the golden finger copper-clad plate outer surface, be laminated outer media
Layer and outer layer metal layer;Internal layer circuit layer and interlevel dielectrics are laminated between the non-golden finger area of two golden finger copper-clad plates
Layer;Pad is set between the golden finger area of two golden finger copper-clad plates;Then, pressing forms multi-layer sheet;
One layer of electrodeposited coating is formed respectively on multiple-plate two sides that pressing is formed;And made on multiple-plate surface outer
Sandwich circuit;
Remove the pad;
It is gold-plated to the golden finger figure using the gold plated lead, form required golden finger;
Controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger circuit is made
Plate, the golden finger circuit board include circuit board body and the more golden fingers to be extended out from circuit board body.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include:
Circuit board body, in the side of circuit board body, two groups of gold are each extended over out from the two sides of the circuit board body
Finger, each of which group include at least one golden finger, and the golden finger is structure for covering copper plate.
Therefore the embodiment of the present invention uses and presses golden finger copper-clad plate in multilayer plate surface, in golden finger copper-clad plate
Forming area beyond form golden finger, and carry out the technical scheme that controlled depth milling makes golden finger be extended out from circuit board body,
Achieve following technique effect:
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand;Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation quilt
Reduce, versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost;
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention;
Fig. 2 a to 2h are the schematic diagrames using each stage of present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technology of the wasting of resources and cost to be asked
Topic.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of circuit edge connector, it may include:
The 110th, golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate have multiple golden finger figures and
It is connected with golden finger figure and positioned at the gold plated lead of edges of boards, the metal level quilt of the non-golden finger area of the golden finger copper-clad plate
Etching removes, and the non-golden finger area of the golden finger copper-clad plate outer surface subtracts thickness by controlled depth milling.
, as shown in figures 2 a and 2b, can be according to the opening of equipment connecting-disconnecting interface in a kind of embodiment of the embodiment of the present invention
Highly, the golden finger copper-clad plate 20 of respective thickness is prepared, the golden finger copper-clad plate can be specifically double face copper;Figure can be used
Shape forwarding function, make golden finger figure 202 in the both side surface of golden finger copper-clad plate 20 and be connected with golden finger figure 202
And positioned at the gold plated lead 203 of edges of boards, wherein, the figure on the two sides of golden finger copper-clad plate 20 is symmetrical.
After producing figure, controlled depth milling can be carried out to the non-golden finger area of the outer surface of golden finger copper-clad plate 20, will
The region subtracts thickness.
120th, subtracted the non-golden finger graphics field of thickness by controlled depth milling in the golden finger copper-clad plate outer surface, be laminated outer layer
Dielectric layer and outer layer metal layer;Internal layer circuit layer is laminated between the non-golden finger area of two golden finger copper-clad plates and internal layer is situated between
Matter layer;Pad is set between the golden finger area of two golden finger copper-clad plates;Then, pressing forms multi-layer sheet.
As shown in Figure 2 c, other level inner figures of multi-layer sheet normally make, and then, carry out matching board stacking, including:Institute
State the non-golden finger graphics field that the outer surface of golden finger copper-clad plate 20 is subtracted thickness by controlled depth milling, stacking outer dielectric layer 306 and outer
Layer metal level 307;Internal layer circuit layer 309 and interlevel dielectrics are laminated between the non-golden finger area of two golden finger copper-clad plates 20
Layer 308;Pad 304 is set between the golden finger area of two golden finger copper-clad plates 20;Then, pressing forms multi-layer sheet 30.
Optionally, also tape 305 on the golden finger figure 202 of the direction pad 304 of golden finger copper-clad plate 20, protected
Shield.
Described pad can be false core plate(It has been etched the copper-clad plate for removing copper foil layer)Either duroplasts or iron
Fluorine dragon etc..The internal layer circuit layer 309 and interlevel dielectrics layer 308 pressed may each comprise multilayer, in a kind of embodiment, specifically
It can include:Double face copper and the dielectric layer for being layered in double face copper two sides, and the metal level on double face copper two sides
It has been processed into internal layer circuit layer.After pressing, multi-layer sheet 30 as shown in Figure 2 d is obtained.
In order to meet the connecting-disconnecting interface of different-thickness, in the embodiment of the present invention, two golden fingers on the two sides of multi-layer sheet 30 cover
Copper coin, there can be identical or different thickness, to meet various sizes of connecting-disconnecting interface.
Pad 304 is along the direction of golden finger figure 202, and size can exceed the length 5-10mm of golden finger figure 202, after facilitating
The making of continuous gold plated lead.
Pad between two golden finger copper-clad plates 20 adds the thickness of adhesive tape, required design between equal to two layers golden finger
Difference in height, i.e., the vertical drop of two layers slotting of connecting-disconnecting interface of corresponding equipment.The fixed bonding of pad, a part lean on adhesive tape
Bond, a part leans on the prepreg of dielectric layer(That is PP pieces)Bond.
One end of the adhesive tape pasted on golden finger figure 202 extends slightly into pressing area, the adhesive tape other end and golden finger figure
202 is concordant.
130th, one layer of electrodeposited coating is formed respectively on multiple-plate two sides that pressing is formed;And in multiple-plate surface system
Make outer-layer circuit;Remove the pad.
As shown in Figure 2 d, the multi-layer sheet that can be formed to pressing carries out heavy copper and plating, distinguishes shape on the two sides of multi-layer sheet 30
Into one layer of electrodeposited coating 301, to realize being reliably connected for outer layer metal layer 307 and outer layer golden finger figure 202.Some realities of the invention
Apply in example, before heavy copper and plating step, can also drill on multilayer boards, various blind holes or through hole required for processing,
And can be in heavy copper and plating step, it would be desirable to blind hole or via metal.
As shown in figure 2 e and 2f, this step can use outer graphics technology, will be more by the step such as pattern transfer and etching
The outer layer metal layer 307 of lamina surface is processed as outer-layer circuit 307.In concrete application, after making outer-layer circuit 307, may be used also
Solder mask is set in outer-layer circuit 307.Solder mask is used for the part covering protection that need not appear to outer-layer circuit.
As shown in figure 2f, the operation of first time milling profile can be carried out in this step to multi-layer sheet 30.To remove the multi-layer sheet
Pad 304 and adhesive tape 305 in 30, and the part beyond the shaping area of the multi-layer sheet 30 of the level of pad 304.
140th, it is gold-plated to multiple golden finger figures using gold plated lead, form required golden finger.
It is gold-plated to golden finger figure 202 in this step, required golden finger is formed in golden finger copper-clad plate 20.Plating
Jin Shi, the plating resist films such as adhesive tape can be used, multiple-plate other region overlays are protected, expose golden finger figure 202;Using gold-plated
Lead 203, plating gold is carried out to the golden finger figure 202 revealed, forms required golden finger 37.Now, Ge Gejin
Finger 37 is connected still through the insulating medium layer among golden finger copper-clad plate 20.
150th, controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger is made
Circuit board, the golden finger circuit board include circuit board body and the more golden fingers to be extended out from circuit board body.
As shown in Figure 2 g, second of milling profile operation is carried out in this step.Including:Controlled depth milling removes the multi-layer sheet 30
Other parts beyond shaping area, in addition to the golden finger 37 remove, and golden finger circuit board is made.The golden finger circuit
Plate includes circuit board body and the more golden fingers 37 to be extended out from circuit board body, and more golden fingers 37 are hanging knot
Structure, the circuit board with hanging structure golden finger 37 is made.Golden finger 37 can be protected with adhesive tape, controlled during controlled depth milling
Deep milling removes adhesive tape after terminating.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in fig. 2h.From Fig. 2 g and 2h
As can be seen that the side of obtained circuit board extend two layers have different-thickness golden finger 37, and each layer can have it is more
Individual golden finger 37.The golden finger thickness of same layer is identical, but the golden finger thickness of different layers can differ.Multiple gold in same layer
The width of finger can be with identical, can also be different.
More than, the embodiments of the invention provide a kind of processing method of hanging structure golden finger, this method is used in multilayer
Plate surface presses golden finger copper-clad plate, golden finger is formed beyond the forming area of golden finger copper-clad plate, and carry out controlled depth milling to make
The technical scheme that golden finger extends out from circuit board body, achieve following technique effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand;Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost;
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 g and 2h are refer to, the embodiment of the present invention provides a kind of golden finger circuit board, it may include:
Circuit board body 30, two groups are each extended over out in the side of circuit board body, from the two sides of the circuit board body
Golden finger, each of which group include at least one golden finger 37, and the golden finger 37 is gold-plated structure for covering copper plate.
The circuit board body may include multilayer line layer(The multilayer line layer of internal layer is not shown in figure).
The golden finger 37 can be connected with the outer-layer circuit 307 of the circuit board.
Circuit board provided in an embodiment of the present invention can be made using the method for embodiment one.More detailed description refer to implementation
Example one.
More than, the embodiments of the invention provide a kind of golden finger circuit board, achieve following technique effect:
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand;Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost;
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and golden finger circuit board of the circuit edge connector provided above the embodiment of the present invention are carried out
It is discussed in detail, but the explanation of above example is only intended to help the method and its core concept for understanding the present invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should all be included within the scope of the present invention.
Claims (7)
- A kind of 1. processing method of circuit edge connector, it is characterised in that including:Golden finger copper-clad plate is provided, the golden finger area of the golden finger copper-clad plate has multiple golden finger figures and and golden finger Figure is connected and is etched positioned at the gold plated lead of edges of boards, the metal level of the non-golden finger area of the golden finger copper-clad plate Remove, and the non-golden finger area of the golden finger copper-clad plate outer surface subtracts thickness by controlled depth milling;The golden finger copper-clad plate outer surface by controlled depth milling subtract thickness non-golden finger graphics field, stacking outer dielectric layer and Outer layer metal layer;Internal layer circuit layer and interlevel dielectrics layer are laminated between the non-golden finger area of two golden finger copper-clad plates; Pad is set between the golden finger area of two golden finger copper-clad plates;Then, pressing forms multi-layer sheet;One layer of electrodeposited coating is formed respectively on multiple-plate two sides that pressing is formed;And make outer layer line on multiple-plate surface Road;Remove the pad;It is gold-plated to the golden finger figure using the gold plated lead, form required golden finger;Controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger circuit board, institute is made Stating golden finger circuit board includes circuit board body and the more golden fingers to be extended out from circuit board body.
- 2. according to the method for claim 1, it is characterised in that:In the multiple-plate step of pressing, taped on the golden finger figure towards the pad.
- 3. according to the method for claim 1, it is characterised in that before multiple-plate surface makes outer-layer circuit also Including:Drilled in the multi-layer sheet, and carry out heavy copper and plating.
- 4. according to the method for claim 1, it is characterised in that before removing the pad, in addition to:Solder mask is set in the outer-layer circuit.
- 5. according to the method for claim 2, it is characterised in that:The thickness of two golden finger copper-clad plates is different.
- A kind of 6. golden finger circuit board, it is characterised in that adding based on the circuit edge connector described in claim any one of 1-5 Work method is made, including:Circuit board body, in the side of circuit board body, two groups of golden fingers are each extended over out from the two sides of the circuit board body, Each of which group includes at least one golden finger, and the golden finger is gold-plated structure for covering copper plate.
- 7. circuit board according to claim 6, it is characterised in that:The outer-layer circuit phase of the golden finger and the circuit board Even.
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CN201410148928.4A CN104981113B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of circuit edge connector |
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CN201410148928.4A CN104981113B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of circuit edge connector |
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CN104981113B true CN104981113B (en) | 2017-12-29 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105792543A (en) * | 2016-04-29 | 2016-07-20 | 深圳崇达多层线路板有限公司 | Method of improving golden finger broken section position gold seeping |
CN105979703B (en) * | 2016-06-28 | 2018-05-18 | 广东欧珀移动通信有限公司 | Pcb board component and with its mobile terminal |
CN114080118B (en) * | 2020-08-12 | 2024-03-12 | 宏恒胜电子科技(淮安)有限公司 | Manufacturing method of stepped golden finger circuit board and circuit board |
CN113708112B (en) * | 2021-07-30 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Board ladder connection structure and signal connector |
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GB2124035B (en) * | 1982-07-15 | 1985-07-31 | Standard Telephones Cables Ltd | Printed circuit boards |
US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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