CN102686029B - The manufacture method of blind slot of circuit board - Google Patents
The manufacture method of blind slot of circuit board Download PDFInfo
- Publication number
- CN102686029B CN102686029B CN201210123484.XA CN201210123484A CN102686029B CN 102686029 B CN102686029 B CN 102686029B CN 201210123484 A CN201210123484 A CN 201210123484A CN 102686029 B CN102686029 B CN 102686029B
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- substrate
- opening
- metal derby
- blind slot
- circuit board
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a kind of manufacture method of blind slot of circuit board, comprise the following steps, provide first substrate, second substrate, described first substrate, second substrate are the circuit board of the circuit made.Second substrate is offered the first opening.The metal derby corresponding with described first opening is provided, described metal derby has conductive adhesion layer.There is provided prepreg, described prepreg has corresponding with described first opening first and windows.Described metal derby is embedded in described first opening.Stack gradually described second substrate, prepreg, first substrate, and pressing becomes an entirety.Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot in described first opening corresponding region.This method, without the need to carrying out blind slot plating, can realize electric property and the heat dispersion requirement of blind slot equally, solves the problem of electroplating the notch point effect caused in addition, and the dark blind slot of control meeting superhigh precision dimensional requirement makes.
Description
Technical field
The present invention relates to field of circuit boards, particularly relate to the manufacture method of blind slot of circuit board.
Background technology
The packing density of electronic equipment constantly increases, function constantly promotes and downsizing, cause pcb board part heat generation density more and more higher, for some power amplifier formula high frequency communications products, simple dependence package design cannot leave enough heats, must strengthen radiating effect by the design of PCB, the blind technology of burying of big copper block obtains effective application in this case.The blind technology of burying of big copper block is first embedded in appointment lamination area by copper billet by the mode of lamination, then by the dark milling blind slot of control and metallized mode, realizes electrical connection performance and the heat dispersion of blind slot.
Because follow-up blind slot can install power discharging device, in order to better heat radiation, the dimension precision requirement of blind slot is more and more higher.Blind slot metallization is the decision operation affecting blind slot dimensional accuracy, in the metallized process of blind slot, because blind slot graphic designs is different and plating point effect affects electroplating evenness, easily cause notch electro-coppering thicker, cause some power discharging device of special size requirement to be difficult to be installed into formation in groove and scrap.
Summary of the invention
Based on this, provide a kind of and make without the need to carrying out blind slot metallization, thus eliminate electroplating process to the manufacture method of the blind slot of circuit board of blind slot Accuracy.
A manufacture method for blind slot of circuit board, comprises the following steps, and provides first substrate, second substrate, and described first substrate, second substrate are the circuit board of the circuit made.Second substrate is offered the first opening.The metal derby corresponding with described first opening is provided, described metal derby has conductive adhesion layer.There is provided prepreg, described prepreg has corresponding with described first opening first and windows.Described metal derby is embedded in described first opening.Stack gradually described second substrate, prepreg, first substrate, and pressing becomes an entirety.Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot in described first opening corresponding region.
Wherein in an embodiment, pressing electric conducting material on described metal derby, described electric conducting material and described metal derby are pressed together by described conductive adhesion layer.
Wherein in an embodiment, described metal derby carries out preliminary treatment, and described preliminary treatment comprises on described metal derby carries out brown process.
Wherein in an embodiment, the harmomegathus coefficient that described first opening and first is windowed according to described second substrate carries out different preliminary treatment, and described metal derby, conductive bond sheet carry out respective handling on the size basis of described first opening.The manufacture method of foregoing circuit plate blind slot, embeds described first opening by described metal derby.And stacking described second substrate, first substrate, prepreg, and pressing becomes an entirety.Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot in described first opening corresponding region.Without the need to carrying out blind slot plating in this method, solve the problem of electroplating the notch point effect caused, the dark blind slot of control meeting superhigh precision dimensional requirement makes.
Brown process is carried out on the surface of metal derby, makes its rough surface, the combination on favourable enhancing metal derby surface and other surfaces.
Described metal derby, conductive adhesion layer on the size basis of described first opening by its separately different contracting expansion factor carry out respective handling.Harmomegathus between consideration different materials also processes accordingly, is beneficial between each material and coordinates.
Accompanying drawing explanation
Fig. 1 is the first substrate of the manufacture method embodiment of blind slot of circuit board, the profile figure of second substrate;
Fig. 2 be the manufacture method embodiment of blind slot of circuit board there is tack coat metal derby cut open figure;
Fig. 3 is the profile with the prepreg that first windows of the manufacture method embodiment of blind slot of circuit board;
Fig. 4 is the profile carried out after pressing of the manufacture method embodiment of blind slot of circuit board;
Fig. 5 is the profile that the blind slot of the manufacture method embodiment of blind slot of circuit board is formed;
Description of reference numerals:
1, first substrate, 2, second substrate, the 3, first opening, 4, metal derby, 5, conductive adhesion layer, 6, prepreg, 7, first windows, and 8, blind slot.
Embodiment
Below in conjunction with drawings and Examples, the technical program is described further.
A manufacture method for blind slot of circuit board, comprises the following steps.
Refer to Fig. 1, first provide first substrate 1, second substrate 2, first substrate 1, second substrate 2 are the circuit board of the circuit made.First substrate 1, second substrate 2 can be that two-ply also can multi-layer sheet.Second substrate 2 is offered the first opening 3.
Refer to the metal derby that Fig. 2 provides corresponding with the first opening 3, metal derby has conductive adhesion layer 5.Also can on metal derby pressing layer of conductive material again, electric conducting material and metal derby are pressed together by conductive adhesion layer.Metal derby 4 carries out preliminary treatment, and preliminary treatment comprises on metal derby carries out brown process.In the present embodiment, the preferred copper billet of metal derby.
Refer to Fig. 3, provide prepreg 6, prepreg 6 has corresponding with the first opening 3 first and windows 7.In the present embodiment, prepreg is PP.
Metal derby 4 is embedded in the first opening 3, metal derby 4 and the first opening 3 are closely cooperated.When anticipating, the first opening 3 and first is windowed and 7 is needed carry out different preliminary treatment according to the harmomegathus coefficient of second substrates; Metal derby 4 and conductive bond sheet 5 carry out respective handling on the size basis of the first opening 3.
Refer to Fig. 4 and Fig. 5, stack gradually second substrate 2, prepreg 6, first substrate 1, and pressing becomes an entirety.Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot 8 in the first opening 3 corresponding region.The size of blind slot 8 is less than the size of the first opening 3.The manufacture method of foregoing circuit plate blind slot, embeds the first opening by metal derby.And stacking second substrate, first substrate, prepreg, and pressing becomes an entirety.Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot in the first opening corresponding region.Without the need to carrying out blind slot plating in this method, solve the problem of electroplating the notch point effect caused, the dark blind slot of control meeting superhigh precision dimensional requirement makes.
Brown process is carried out on the surface of metal derby, makes its rough surface, the combination on favourable enhancing metal derby surface and other surfaces.
Metal derby, conductive adhesion layer on the size basis of the first opening by its separately different contracting expansion factor carry out respective handling.Harmomegathus between consideration different materials also processes accordingly, is beneficial between each material and coordinates.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (1)
1. a manufacture method for blind slot of circuit board, is characterized in that, comprises the following steps,
There is provided first substrate, second substrate, described first substrate, second substrate are the circuit board of the circuit made;
Second substrate is offered the first opening;
The metal derby corresponding with described first opening is provided, described metal derby has conductive adhesion layer; Pressing electric conducting material on described metal derby, described electric conducting material and described metal derby are pressed together by described conductive adhesion layer;
There is provided prepreg, described prepreg has corresponding with described first opening first and windows;
Described metal derby is embedded in described first opening;
Stack gradually described second substrate, prepreg, first substrate, and pressing becomes an entirety;
Adopt the dark milling of control that the circuit board after above-mentioned pressing is formed blind slot in described first opening corresponding region;
Described metal derby carries out preliminary treatment, and described preliminary treatment comprises on described metal derby carries out brown process;
And the harmomegathus coefficient that described first opening and first is windowed according to described second substrate carries out different preliminary treatment, and described metal derby, conductive bond sheet carry out respective handling on the size basis of described first opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123484.XA CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123484.XA CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102686029A CN102686029A (en) | 2012-09-19 |
| CN102686029B true CN102686029B (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210123484.XA Expired - Fee Related CN102686029B (en) | 2012-04-24 | 2012-04-24 | The manufacture method of blind slot of circuit board |
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| CN103781273A (en) * | 2012-10-19 | 2014-05-07 | 深南电路有限公司 | Embedded metal-base PCB and processing method thereof |
| CN103079350B (en) * | 2012-12-28 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN103152987B (en) * | 2013-02-17 | 2014-04-09 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
| CN104125714B (en) * | 2013-04-28 | 2017-05-31 | 深南电路有限公司 | The processing method and high current printed circuit board (PCB) of high current printed circuit board (PCB) |
| CN103402324B (en) * | 2013-08-02 | 2016-04-06 | 高德（无锡）电子有限公司 | A kind ofly improve blind production technology of dragging for depth accuracy |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
| CN105392275B (en) * | 2015-11-30 | 2019-03-08 | 珠海方正科技多层电路板有限公司 | Wiring board, its production method and radio-frequency devices |
| CN105555067A (en) * | 2016-02-19 | 2016-05-04 | 周跃 | Fabrication method of circuit board |
| CN105792548B (en) * | 2016-05-23 | 2018-12-14 | 上海美维科技有限公司 | A method of ladder slot structure printed circuit board is made with plating and engraving method |
| CN107787128A (en) * | 2016-08-24 | 2018-03-09 | 深南电路股份有限公司 | A kind of PCB processing methods |
| CN107734859B (en) * | 2017-11-20 | 2020-05-22 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN108834335B (en) * | 2018-07-10 | 2020-03-27 | 生益电子股份有限公司 | PCB manufacturing method and PCB |
| CN110267430B (en) * | 2019-06-12 | 2021-08-13 | 惠州市盈帆实业有限公司 | Circuit board for blind groove coating and preparation process thereof |
| CN110381666B (en) * | 2019-06-27 | 2021-07-06 | 沪士电子股份有限公司 | Groove-type copper block-embedded multilayer PCB manufacturing method |
| CN111113549B (en) * | 2019-12-16 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | Ultra-thick core plate punching system and ultra-thick core plate punching method |
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| US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| CN101288350A (en) * | 2005-10-14 | 2008-10-15 | 揖斐电株式会社 | Multilayered printed circuit board and method for manufacturing the same |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
| CN201947535U (en) * | 2011-01-14 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | A mixed-voltage high frequency printed circuit board with locally planted metal blocks |
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2012
- 2012-04-24 CN CN201210123484.XA patent/CN102686029B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6518514B2 (en) * | 2000-08-21 | 2003-02-11 | Matsushita Electric Industrial Co., Ltd. | Circuit board and production of the same |
| CN101288350A (en) * | 2005-10-14 | 2008-10-15 | 揖斐电株式会社 | Multilayered printed circuit board and method for manufacturing the same |
| CN101772279A (en) * | 2009-12-21 | 2010-07-07 | 艾默生网络能源有限公司 | Method for manufacturing PCB plate with blind holes |
| CN201947535U (en) * | 2011-01-14 | 2011-08-24 | 深圳市兴森快捷电路科技股份有限公司 | A mixed-voltage high frequency printed circuit board with locally planted metal blocks |
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| CN102686029A (en) | 2012-09-19 |
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