CN104981115B - The processing method and golden finger circuit board of circuit edge connector - Google Patents
The processing method and golden finger circuit board of circuit edge connector Download PDFInfo
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- CN104981115B CN104981115B CN201410149118.0A CN201410149118A CN104981115B CN 104981115 B CN104981115 B CN 104981115B CN 201410149118 A CN201410149118 A CN 201410149118A CN 104981115 B CN104981115 B CN 104981115B
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Abstract
The invention discloses a kind of processing method of circuit edge connector and golden finger circuit board, and to solve existing for existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technical problem of the wasting of resources and cost.Method includes：Multi-layer sheet is pressed, the outermost layer on multi-layer sheet two sides is golden finger copper-clad plate, and golden finger copper-clad plate inner surface has multiple golden finger figures and connected edges of boards gold plated lead；Outer-layer circuit is made on multiple-plate surface, wherein, form the multiple golden finger figures corresponding with inner surface and connected edges of boards gold plated lead in golden finger copper-clad plate outer surface；It is gold-plated to the multiple golden finger figure using the gold plated lead, form required golden finger；Controlled depth milling is carried out, the other parts beyond multiple-plate shaping area, in addition to the golden finger are removed, golden finger circuit board is made, the golden finger circuit board includes circuit board body and the more golden fingers to be extended out from circuit board body.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to processing method and the golden finger electricity of a kind of circuit edge connector
Road plate.
Background technology
At present, the printed circuit board (PCB) with golden finger（PCB）Plate, generally using golden finger is related to online in its structure design
Mode within the shaping area of road plate top layer.And the golden finger of plug function is provided, it should be matched with the size of connecting-disconnecting interface, golden finger
The thickness of circuit board should be consistent with the open height of connecting-disconnecting interface, when the open height of connecting-disconnecting interface is fixed, golden finger
The circuit plate thickness at place is also just therefore fixed.
When golden finger circuit board will realize multi-functional demand and need to increase thickness of slab, then supporting connecting-disconnecting interface equipment
Do whole conversion, very waste of resource and cost；Golden finger circuit board is fixed due to thickness, it is impossible to applied to various sizes of
Connecting-disconnecting interface, cause the versatility of golden finger circuit board very poor；When same equipment has multiple connecting-disconnecting interfaces, it is necessary to design multiple
The golden finger circuit board of corresponding thickness, can influence the assembly space of product, and cause the wasting of resources and cost.
To sum up, existing golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the wasting of resources and cost
Lifting.
The content of the invention
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technology of the wasting of resources and cost to be asked
Topic.
First aspect present invention provides a kind of processing method of circuit edge connector, it may include：
Multi-layer sheet is closed, the outermost layer on the multi-layer sheet two sides is golden finger copper-clad plate, table on the inside of the golden finger copper-clad plate
The golden finger area in face there are multiple golden finger figures and be connected with golden finger figure and positioned at edges of boards gold plated lead, inner side table
Other regions in face have time outer-layer circuit figure, and the outer surface of the golden finger copper-clad plate has outer layer metal layer；Two
Pad is provided between the golden finger area of golden finger copper-clad plate；
Outer-layer circuit is made on multiple-plate surface, wherein, in the golden finger area of golden finger copper-clad plate outer surface
Domain, form multiple the golden finger figures and gold plated lead corresponding with inner surface；
Remove the pad；
It is gold-plated to the multiple golden finger figure using the gold plated lead, form required golden finger；
Controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger circuit is made
Plate, the golden finger circuit board include circuit board body and the more golden fingers to be extended out from circuit board body.
Second aspect of the present invention provides a kind of circuit board with hanging structure golden finger, it may include：
Circuit board body, in the side of circuit board body, two groups of gold are each extended over out from the two sides of the circuit board body
Finger, each of which group include at least one golden finger, and the golden finger is structure for covering copper plate.
Therefore the embodiment of the present invention uses and presses golden finger copper-clad plate in multilayer plate surface, in golden finger copper-clad plate
Forming area beyond form golden finger, and carry out the technical scheme that controlled depth milling makes golden finger be extended out from circuit board body,
Achieve following technique effect：
Golden finger thickness design can be carried out according to the open height of connecting-disconnecting interface, and then meet different connecting-disconnecting interface plugs
Demand；Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered limitation quilt
Reduce, versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of flow chart of the processing method of hanging structure golden finger provided in an embodiment of the present invention；
Fig. 2 a to 2h are the schematic diagrames using each stage of present invention method processing circuit board.
Embodiment
The embodiment of the present invention provides a kind of processing method and golden finger circuit board of circuit edge connector, existing to solve
Existing for golden finger circuit board, limitation is very strong, and versatility is very poor, easily causes the technology of the wasting of resources and cost to be asked
Topic.
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 1 is refer to, the embodiment of the present invention provides a kind of processing method of circuit edge connector, it may include：
110th, multi-layer sheet is pressed, the outermost layer on the multi-layer sheet two sides is golden finger copper-clad plate, the golden finger copper-clad plate
The golden finger area of inner surface there are multiple golden finger figures and be connected with golden finger figure and positioned at edges of boards gold plated lead,
Other regions of inner surface have time outer-layer circuit figure, and the outer surface of the golden finger copper-clad plate has outer layer metal
Layer；Pad is provided between the golden finger area of two golden finger copper-clad plates.
, as shown in figures 2 a and 2b, can be according to the opening of equipment connecting-disconnecting interface in a kind of embodiment of the embodiment of the present invention
Highly, the golden finger copper-clad plate 20 of respective thickness is prepared, the golden finger copper-clad plate can be specifically double face copper；Figure can be used
Shape forwarding function, time outer-layer circuit figure is made in the inner surface of golden finger copper-clad plate 20, wherein, by golden finger copper-clad plate 20
The golden finger figure 202 of inner surface, including edges of boards auxiliary gold plated lead 203, make, and made normally in other regions
Secondary outer-layer circuit figure 201.The outer surface of golden finger copper-clad plate 20 is outer layer metal layer 204.
As shown in Figure 2 c, other level inner figures of multi-layer sheet normally make, and then, matching board stacking are carried out, by two gold
Finger copper-clad plate 20 is pressed as the outermost layer on multi-layer sheet two sides.Wherein, the golden finger area of two golden finger copper-clad plates 20
Part between domain, groove is opened up in advance on each layer of corresponding internal layer, and the part is provided with pad 304；And in gold
The inner surface of finger copper-clad plate 20, i.e., towards taping 305 on the golden finger figure 202 of the pad, so as to golden finger figure
Shape 202 is protected.Described pad can be false core plate（It has been etched the copper-clad plate for removing copper foil layer）Or duroplasts
Or Teflon etc..After pressing, multi-layer sheet 30 as shown in Figure 2 d is obtained.The thickness of two golden finger copper-clad plates on its two sides can
With identical, can also differ.
In order to meet the connecting-disconnecting interface of different-thickness, two golden finger copper-clad plates of the embodiment of the present invention, there can be difference
Thickness, to meet various sizes of connecting-disconnecting interface.
For pad 304 along the direction of golden finger figure 202, size exceeds the length 5-10mm of golden finger figure 202, convenient follow-up plating
The making of gold wire.
Pad between two golden finger copper-clad plates 20 adds the thickness of adhesive tape, required design between equal to two layers golden finger
Difference in height, i.e., the vertical drop of two layers slotting of connecting-disconnecting interface of corresponding equipment.The fixed bonding of pad, a part lean on adhesive tape
Bond, a part leans on the prepreg of dielectric layer（That is PP pieces）Bond.
One end of the adhesive tape pasted on golden finger figure 202 extends slightly into pressing area, the adhesive tape other end and golden finger figure
202 is concordant.
120th, outer-layer circuit is made on multiple-plate surface, wherein, in the golden hand of golden finger copper-clad plate outer surface
Refer to region, form multiple the golden finger figures and gold plated lead corresponding with inner surface.
As shown in figure 2 e and 2f, this step uses outer graphics technology, by the step such as pattern transfer and etching, by multilayer
The outer layer metal layer 204 of the outer layer metal layer of plate surface, i.e. golden finger copper-clad plate outer surface, is processed as outer-layer circuit, wherein,
In the golden finger area of the outer surface of golden finger copper-clad plate 20, the multiple golden finger figures 302 corresponding with inner surface are formed
And connected edges of boards gold plated lead 303, normal outer-layer circuit figure 301 is formed in other regions.In concrete application, make outer
After sandwich circuit, solder mask can be also set in outer-layer circuit.Cover the part that solder mask is used to that outer-layer circuit need not to be appeared
Lid protection.
In some embodiments of the invention, before outer-layer circuit is made, it can also make on multilayer boards as needed various
Through hole or blind hole etc., and heavy copper and plating can be carried out to the hole for wherein needing to metallize as needed.
130th, the pad is removed.
As shown in figure 2f, the operation of first time milling profile is carried out in this step to multi-layer sheet 30.To remove the multi-layer sheet 30
In pad 304 and adhesive tape 305, and the part beyond the shaping area of the multi-layer sheet 30 of the level of pad 304.
140th, it is gold-plated to multiple golden finger figures using gold plated lead, form required golden finger.
It is gold-plated to golden finger figure 202 and 302 in this step, make to form required golden hand in golden finger copper-clad plate 20
Refer to.When gold-plated, the plating resist films such as adhesive tape can be used, multiple-plate other region overlays are protected, expose the He of golden finger figure 202
302；Using gold plated lead 203 and 303, plating gold is carried out to the golden finger figure 202 and 302 revealed, required for formation
Golden finger 37.Now, each golden finger 37 is connected still through the insulating medium layer among golden finger copper-clad plate 20.
150th, controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger is made
Circuit board, the golden finger circuit board include circuit board body and the more golden fingers to be extended out from circuit board body.
As shown in Figure 2 g, second of milling profile operation is carried out in this step.Including：Controlled depth milling removes the multi-layer sheet 30
Other parts beyond shaping area, in addition to the golden finger 37 remove, and golden finger circuit board is made.The golden finger circuit
Plate includes circuit board body and the more golden fingers 37 to be extended out from circuit board body, and more golden fingers 37 are hanging knot
Structure, the circuit board with hanging structure golden finger 37 is made.Golden finger 37 can be protected with adhesive tape, controlled during controlled depth milling
Deep milling removes adhesive tape after terminating.
It is the top view of the final obtained circuit board with hanging structure golden finger 37 as shown in fig. 2h.From Fig. 2 g and 2h
As can be seen that the side of obtained circuit board extend two layers have different-thickness golden finger 37, and each layer can have it is more
Individual golden finger 37.The golden finger thickness of same layer is identical, but the golden finger thickness of different layers can differ.Multiple gold in same layer
The width of finger can be with identical, can also be different.
More than, the embodiments of the invention provide a kind of processing method of hanging structure golden finger, this method is used in multilayer
Plate surface presses golden finger copper-clad plate, golden finger is formed beyond the forming area of golden finger copper-clad plate, and carry out controlled depth milling to make
The technical scheme that golden finger extends out from circuit board body, achieve following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
Embodiment two,
Fig. 2 g and 2h are refer to, the embodiment of the present invention provides a kind of golden finger circuit board, it may include：
Circuit board body 30, two groups are each extended over out in the side of circuit board body, from the two sides of the circuit board body
Golden finger, each of which group include at least one golden finger 37, and the golden finger 37 is gold-plated structure for covering copper plate.
The circuit board body may include multilayer line layer（The multilayer line layer of internal layer is not shown in figure）.
The golden finger 37 can be connected with the outer-layer circuit 301 of the circuit board.
Circuit board provided in an embodiment of the present invention can be made using the method for embodiment one.More detailed description refer to implementation
Example one.
More than, the embodiments of the invention provide a kind of golden finger circuit board, is covered using in multilayer plate surface pressing golden finger
Copper coin, golden finger is formed beyond the forming area of golden finger copper-clad plate, and carry out controlled depth milling to make golden finger from circuit board body
The technical scheme to extend out, achieve following technique effect：
Golden finger thickness design can be carried out by the open height according to connecting-disconnecting interface, and then meet different connecting-disconnecting interfaces
Plug demand；Because golden finger is the hanging structure that extends, golden finger thickness is unrelated with circuit plate thickness, therefore suffered office
Limit is reduced, and versatility is stronger, it is not easy to causes the wasting of resources and cost.
When circuit board will realize multi-functional demand and increase thickness of slab, because golden finger is the standalone module of hanging structure,
Will not therefore it change, it is not necessary to change original connecting-disconnecting interface equipment, saved resource and cost；
When various sizes of connecting-disconnecting interface is needed with a circuit board, it is only necessary to increase or decrease the golden finger of implantation
Thickness, it is simple and convenient without changing circuit plate thickness, it is versatile.
, only need to be at one of the present invention without providing multiple corresponding circuit boards when same equipment has multiple interfaces
The golden finger of multiple hanging structures is designed on circuit board, thus the assembly space of product can be saved, reduces cost and resource
Waste.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because according to
According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
The processing method and golden finger circuit board of the circuit edge connector provided above the embodiment of the present invention are carried out
It is discussed in detail, but the explanation of above example is only intended to help the method and its core concept for understanding the present invention, should not be understood
For limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should all be included within the scope of the present invention.
Claims (6)
- A kind of 1. processing method of circuit edge connector, it is characterised in that including：Multi-layer sheet is pressed, the outermost layer on the multi-layer sheet two sides is golden finger copper-clad plate, the golden finger copper-clad plate inner surface Golden finger area there are multiple golden finger figures and be connected with golden finger figure and positioned at edges of boards gold plated lead, inner surface Other regions there is time outer-layer circuit figure, the outer surface of the golden finger copper-clad plate has outer layer metal layer；Two gold Pad is provided between the golden finger area of finger copper-clad plate；Wherein, described two golden finger copper-clad plates have different thickness；Outer-layer circuit is made on multiple-plate surface, wherein, in the golden finger area of golden finger copper-clad plate outer surface, shape Into multiple the golden finger figures and gold plated lead corresponding with inner surface；Remove the pad；It is gold-plated to the multiple golden finger figure using the gold plated lead, form required golden finger；Controlled depth milling is carried out, the non-golden finger part beyond multiple-plate shaping area is removed, golden finger circuit board, institute is made Stating golden finger circuit board includes circuit board body and the more golden fingers to be extended out from circuit board body.
- 2. according to the method for claim 1, it is characterised in that：In the multiple-plate step of pressing, taped on the golden finger figure towards the pad.
- 3. according to the method for claim 1, it is characterised in that before multiple-plate surface makes outer-layer circuit also Including：Drilled in the multi-layer sheet, and carry out heavy copper and plating.
- 4. according to the method for claim 1, it is characterised in that before removing the pad, in addition to：Solder mask is set in the outer-layer circuit.
- A kind of 5. method golden finger circuit board using described in claim 1, it is characterised in that including：Circuit board body, in the side of circuit board body, two groups of golden fingers are each extended over out from the two sides of the circuit board body, Each of which group includes at least one golden finger, and the golden finger is gold-plated structure for covering copper plate.
- 6. circuit board according to claim 5, it is characterised in that：The golden finger is connected with the outer-layer circuit of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410149118.0A CN104981115B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of circuit edge connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410149118.0A CN104981115B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of circuit edge connector |
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| Publication Number | Publication Date |
|---|---|
| CN104981115A CN104981115A (en) | 2015-10-14 |
| CN104981115B true CN104981115B (en) | 2018-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410149118.0A Active CN104981115B (en) | 2014-04-14 | 2014-04-14 | The processing method and golden finger circuit board of circuit edge connector |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105979703B (en) * | 2016-06-28 | 2018-05-18 | 广东欧珀移动通信有限公司 | Pcb board component and with its mobile terminal |
| CN112312665B (en) * | 2020-10-29 | 2021-11-09 | 惠州市特创电子科技股份有限公司 | Circuit board and manufacturing method thereof |
| CN114760760A (en) * | 2022-04-12 | 2022-07-15 | 胜宏科技（惠州）股份有限公司 | Double-sided lead drilling method for inner pull finger |
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|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN202524638U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board hollow-out golden finger adhesive pasting structure |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0837380A (en) * | 1994-07-21 | 1996-02-06 | Hitachi Chem Co Ltd | Multilayred wiring board with terminal |
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2014
- 2014-04-14 CN CN201410149118.0A patent/CN104981115B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5444188A (en) * | 1992-01-14 | 1995-08-22 | Nippon Mektron, Ltd. | Flexible circuit wiring board and method of producing the same |
| CN102458056A (en) * | 2010-10-25 | 2012-05-16 | 矢崎总业株式会社 | Method for manufacturing wiring substrate |
| CN202524638U (en) * | 2012-03-09 | 2012-11-07 | 昆山亿富达电子有限公司 | Flexible circuit board hollow-out golden finger adhesive pasting structure |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
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| CN104981115A (en) | 2015-10-14 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |