CN106550555B - A kind of odd number layer package substrate and its processing method - Google Patents
A kind of odd number layer package substrate and its processing method Download PDFInfo
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- CN106550555B CN106550555B CN201510602942.1A CN201510602942A CN106550555B CN 106550555 B CN106550555 B CN 106550555B CN 201510602942 A CN201510602942 A CN 201510602942A CN 106550555 B CN106550555 B CN 106550555B
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- layer
- copper foil
- foil layer
- insulating layer
- odd number
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The embodiment of the invention provides a kind of odd number layer package substrate and its processing methods, and the warpage issues occurred for solving the prepared odd number layer package substrate of the prior art improve the product quality of odd number layer package substrate.The method comprise the steps that providing copper-clad plate, copper-clad plate has the first copper foil layer and external copper foil layer, has the first insulating layer between the first copper foil layer and external copper foil layer；Showing methods are carried out to external copper foil layer, obtain the first outer graphics；The first exposed insulating layer is removed, and the first exposed copper foil layer and the external copper foil layer are etched, obtains inner figure；Increasing layer pressing is carried out, second copper foil layer on second insulating layer and second insulating layer surface is formed；It is processed, form the second outer graphics and connects the first intercommunicating pore of the first copper foil layer and the second copper foil layer, obtain the first odd number layer package substrate.
Description
Technical field
The present invention relates to circuit board technology fields, and in particular to a kind of odd number layer package substrate and its processing method.
Background technique
Currently, existing odd number layer package substrate is as shown in Figure 1, with two layers of layers of copper 101 and layers of copper 102, it is three ply board,
Insulating layer 104 between layers of copper with insulating layer 103 and outside, and so on know the knot of other odd number layer package substrates
Structure.
The processing method of existing odd number layer package substrate are as follows: as shown in Figure 2 a, insulating layer 201 is formed on support plate 202,
Layers of copper 101 is formed on the insulating layer；As shown in Figure 2 b, insulating layer 103a is formed in layers of copper 101, is formed on insulating layer 103a
Layers of copper 102；As shown in Figure 2 c, route production is carried out to layers of copper 102；As shown in Figure 2 d, insulating layer 103b is formed, in insulating layer
Another layers of copper 101 is formed on 103b, and insulating layer 201 is formed in layers of copper 101；As shown in Figure 2 e, by support plate 202 and insulating layer
201 removings carry out route production to external copper layer 101, and produce interlayer intercommunicating pore, and layers of copper 101 and layers of copper 102 are connected
It connects, obtains three ply board.
The odd number layer package substrate that the processing method of existing odd number layer package substrate obtains is due to insulating layer 103b needs
It causes the thickness degree of insulating layer 103b and insulating layer 103a inconsistent, and insulate in gap between the route of fill copper layer 102
Layer 103a by pressing twice, and insulating layer 103b passes through one step press, and internal stress is different between two bonding sheets, therefore results in
Odd number layer package substrate there are warpage issues.
Summary of the invention
The embodiment of the invention provides a kind of odd number layer package substrate and its processing methods, for solving prior art production
The warpage issues that obtained odd number layer package substrate occurs, improve the product quality of odd number layer package substrate.
In view of this, first aspect present invention provides a kind of processing method of odd number layer package substrate, which is characterized in that packet
It includes:
There is provided copper-clad plate, the copper-clad plate has the first copper foil layer and external copper foil layer, first copper foil layer and described
There is the first insulating layer between external copper foil layer；
Showing methods are carried out to the external copper foil layer, obtain the first outer graphics；
Exposed first insulating layer is removed, and to exposed first copper foil layer and the external copper foil layer into
Row etching, obtains inner figure；
Increasing layer pressing is carried out, second copper foil layer on second insulating layer and the second insulating layer surface is formed；
It is processed, form the second outer graphics and connection first copper foil layer and second copper foil layer first is mutual
Join hole, obtains the first odd number layer package substrate.
Second aspect of the present invention provides a kind of odd number layer package substrate characterized by comprising
First copper foil layer, the first insulating layer, second insulating layer, the second copper foil layer and the first intercommunicating pore；
First copper foil layer has inner figure, and first insulating layer is in the first copper foil layer surface, described
Second insulating layer is in the body structure surface of first insulating layer and first copper foil layer, and second copper foil layer is in described
Second insulating layer surface, second copper foil layer have the second outer graphics, and second copper foil layer is interconnected by described first
Hole is connected with first copper foil layer.
As can be seen from the above technical solutions, the embodiment of the present invention has the advantage that
By controlling the showing methods of the first outer graphics and the formation of second insulating layer, can odd-level be encapsulated
The second insulating layer up and down of substrate is full symmetric, and the first insulating layer and second insulating layer are pressed simultaneously, stress
Direction is consistent, does not exhibit warpage macroscopically, therefore the effective solution warpage issues of the prior art, improves odd-level envelope
Fill the product quality of substrate.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of existing odd number layer package substrate in the embodiment of the present invention；
Fig. 2 a- Fig. 2 e is the schematic diagram of existing odd number layer package substrate process in the embodiment of the present invention；
Fig. 3 is the flow diagram of the processing method of odd number layer package substrate in the embodiment of the present invention；
Fig. 4 a- Fig. 4 f is the schematic diagram of odd number layer package substrate process in the embodiment of the present invention；
Fig. 5 is another embodiment schematic diagram of odd number layer package substrate in the embodiment of the present invention；
Specific embodiment
The embodiment of the invention provides a kind of odd number layer package substrate and its processing methods, for solving prior art production
The warpage issues that obtained odd number layer package substrate occurs, improve the product quality of odd number layer package substrate.
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Referring to Fig. 3, the embodiment of the present invention provides a kind of processing method of the processing method of odd number layer package substrate, packet
It includes:
301, copper-clad plate is provided；
As shown in fig. 4 a, copper-clad plate 40 has the first copper foil layer 401 and external copper foil layer 402, the first copper foil layer and outside
There is the first insulating layer 403 between copper foil layer, the copper thickness of the first copper foil layer 401 requires to select according to product internal layer copper thickness,
The thickness of insulating layer and model of first insulating layer 403 are selected according to product requirement, and the copper foil of external copper foil layer 402 can be according to technique
Selection, the material of the first insulating layer 403 are the insulating materials with glass structure or pure resin structure.
302, showing methods are carried out to external copper foil layer, obtains the first outer graphics；
As shown in Figure 4 b, in external 402 the first light-sensitive surface of surface mount of copper foil layer, felt according to predefined figure to first
Light film is exposed, develops and etches, and remaining first light-sensitive surface is removed, and obtains the first outer graphics 404, outside first
The purpose of layer pattern 404 be in order to protect the first insulating layer of part 403 for not needing to be removed, for guarantee plate stability and
Prevention and treatment is damaged, and the position of upper and lower figure is not reproducible, to prevent and treat plate warpage, needs to guarantee the residual copper ratio design one of upper and lower figure
It causes.
303, the first exposed insulating layer is removed, and the first exposed copper foil layer and external copper foil layer is etched,
Obtain inner figure；
First insulating layer 403 of exposure in Fig. 4 b is removed using laser or other modes, so that partial first
Copper foil layer 401 is exposed, and obtained structure is etched using etching solution as illustrated in fig. 4 c, to structure shown in Fig. 4 c,
Exposed the first copper foil layer of part 401 and external copper foil layer 402 are etched away, inner figure 405 as shown in figure 4d is obtained.
304, increasing layer pressing is carried out, second copper foil layer on second insulating layer and second insulating layer surface is formed；
As shown in fig 4e, increasing layer pressing is carried out to structure shown in Fig. 4 d, in the first exposed copper foil layer 401 and the first insulation
403 surface of layer form second insulating layer 406, and the material of second insulating layer 406 is with glass structure or pure resin structure
Insulating materials forms the second copper foil layer 407 on the surface of second insulating layer 406.
305, it is processed, form the second outer graphics and connects the first interconnection of the first copper foil layer and the second copper foil layer
Hole obtains the first odd number layer package substrate.
As shown in fig. 4f, showing methods are carried out to structure shown in Fig. 4 e, forms the second outer layer on the second copper foil layer 407
Figure 408 drills in scheduled position, obtains via hole, carries out heavy copper to via hole, and paste the second light-sensitive surface, right
Second light-sensitive surface is developed and is electroplated, and remaining second light-sensitive surface is removed, and carry out fast-etching, is obtained the first intercommunicating pore
409, the first intercommunicating pore forms the first odd number layer package substrate for connecting the first copper foil layer 401 and the second copper foil layer 407.
Optionally, as shown in figure 5, in some embodiments of the present invention, the substrate of more layers is formed, it is only necessary to first
Increasing layer is carried out on odd number layer package substrate, is carried out increasing layer pressing on the first odd number layer package substrate shown in Fig. 4, is formed
The third copper foil layer 502 on 501 surface of third insulating layer 501 and third insulating layer, is processed, the shape on third copper foil layer 502
At third outer graphics 503, production obtains the second intercommunicating pore 504 of connection the second copper foil layer 407 and third copper foil layer 502, obtains
To the second odd number layer package substrate.
In conclusion the embodiment of the present invention has the advantage that
By controlling the showing methods of the first outer graphics 404 and the formation of second insulating layer 406, odd number can be made
The second insulating layer up and down 406 of layer package substrate is full symmetric, and the first insulating layer 403 and second insulating layer 406 are simultaneously
It is pressed, stress direction is consistent, does not exhibit warpage macroscopically, therefore the warpage of the effective solution prior art is asked
Topic, improves the product quality of odd number layer package substrate, in addition in the technique of the prior art, needs using expensive extra thin copper foil
Material, and production cost is reduced using conventional copper foil in the embodiment of the present invention.
Embodiment two,
Fig. 4 f is please referred to, the embodiment of the present invention provides a kind of odd number layer package substrate, comprising:
First copper foil layer 401, the first insulating layer 403, second insulating layer 406, the second copper foil layer 407 and the first intercommunicating pore
409；
First copper foil layer 401 has inner figure, and the first insulating layer 403 is in 401 surface of the first copper foil layer, the second insulation
Layer 406 is in the body structure surface of the first insulating layer 403 and the first copper foil layer 401, and the second copper foil layer 407 is in second insulating layer
406 surfaces, the second copper foil layer 407 have the second outer graphics 408, and the second copper foil layer 407 passes through the first intercommunicating pore 409 and first
Copper foil layer 401 connects.
Optionally, as shown in figure 5, in some embodiments of the present invention, further includes:
Third insulating layer 501, third copper foil layer 502 and the second intercommunicating pore 504；
Third copper foil layer 502 is in 501 surface of third insulating layer, and third copper foil layer 502 has third outer graphics 503,
Third copper foil layer 502 is connect by the second intercommunicating pore 504 with the second copper foil layer 407.
Optionally, in some embodiments of the present invention,
The material of first insulating layer 403, second insulating layer 406 and third insulating layer 501 is with glass structure or pure tree
The insulating materials of rouge structure.
In conclusion the embodiment of the present invention has the advantage that
By controlling the showing methods of the first outer graphics 404 and the formation of second insulating layer 406, odd number can be made
The second insulating layer up and down 406 of layer package substrate is full symmetric, and the first insulating layer 403 and second insulating layer 406 are simultaneously
It is pressed, stress direction is consistent, does not exhibit warpage macroscopically, therefore the warpage of the effective solution prior art is asked
Topic, improves the product quality of odd number layer package substrate, in addition in the technique of the prior art, needs using expensive extra thin copper foil
Material, and production cost is reduced using conventional copper foil in the embodiment of the present invention.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for the various method embodiments described above, for simple description, therefore, it is stated as a series of
Combination of actions, but those skilled in the art should understand that, the present invention is not limited by described sequence of movement because according to
According to the present invention, certain steps can use other sequences or carry out simultaneously.Secondly, those skilled in the art should also know that,
The embodiments described in the specification are all preferred embodiments, and not necessarily the present invention must for related actions and modules
Must.
Be provided for the embodiments of the invention above a kind of odd number layer package substrate processing method and its processing method into
It has gone and has been discussed in detail, but the above description of the embodiment is only used to help understand the method for the present invention and its core ideas, do not answered
It is interpreted as limitation of the present invention.Those skilled in the art, according to the thought of the present invention, the invention discloses technology
In range, any changes or substitutions that can be easily thought of, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of processing method of odd number layer package substrate characterized by comprising
There is provided copper-clad plate, the structure of the copper-clad plate is to stack gradually external copper foil layer, the first insulating layer, the first copper foil layer, the
The structure of one insulating layer and external copper foil layer；
Showing methods are carried out to the external copper foil layer, obtain the first outer graphics；
Exposed first insulating layer is removed, and exposed first copper foil layer and the external copper foil layer are lost
It carves, obtains inner figure；
Increasing layer pressing is carried out, second copper foil layer on second insulating layer and the second insulating layer surface is formed；
It is processed, form the second outer graphics and connects the first interconnection of first copper foil layer and second copper foil layer
Hole obtains the first odd number layer package substrate.
2. processing method according to claim 1, which is characterized in that the processing method further include:
Increasing layer pressing is carried out to the first odd number layer package substrate, forms third insulating layer and the third insulating layer table
The third copper foil layer in face；
It is processed, form third outer graphics and connects the second interconnection of second copper foil layer and the third copper foil layer
Hole obtains the second odd number layer package substrate.
3. processing method according to claim 1, which is characterized in that described to add to the external copper foil layer progress figure
Work, obtaining the first outer graphics includes:
In external copper foil layer first light-sensitive surface of surface mount；
First light-sensitive surface is exposed, developed and etched according to predefined, remaining first light-sensitive surface is carried out
Removal, obtains the first outer graphics.
4. processing method according to claim 1, which is characterized in that it is described to be processed, formed the second outer graphics and
The first intercommunicating pore for connecting first copper foil layer and second copper foil layer, obtaining the first odd number layer package substrate includes:
Showing methods are carried out to second copper foil layer, obtain the second outer graphics；
It carries out interconnection hole machined, forms the first intercommunicating pore for connecting first copper foil layer and second copper foil layer, obtain the
One odd number layer package substrate.
5. processing method according to claim 4, which is characterized in that it is described to carry out interconnection hole machined, it is formed described in connection
First intercommunicating pore of the first copper foil layer and second copper foil layer includes:
It drills in scheduled position, obtains via hole；
Heavy copper is carried out to the via hole, and pastes the second light-sensitive surface；
Second light-sensitive surface is developed and is electroplated, remaining second light-sensitive surface is removed, and carry out fast-etching,
Obtain the first intercommunicating pore.
6. a kind of odd number layer package substrate characterized by comprising
The second copper foil layer, second insulating layer, the first insulating layer, the first copper foil layer, the first insulating layer, the second insulation stacked gradually
Layer and the second copper foil layer；
The first copper foil layer in the odd number layer package substrate has inner figure, and first in the odd number layer package substrate is absolutely
Edge layer is in the first copper foil layer surface in the odd number layer package substrate, the first copper foil layer in the odd number layer package substrate
It is obtained with the first insulating layer by following technique:
Showing methods are carried out to the external copper foil layer of copper-clad plate, obtain the first outer graphics, the structure of the copper-clad plate is successively
The structure of external copper foil layer, the first insulating layer, the first copper foil layer, the first insulating layer and external copper foil layer is laminated, by exposed institute
The first insulating layer removal in copper-clad plate is stated, and the first copper foil layer in the exposed copper-clad plate is carried out with external copper foil layer
Etching, obtains inner figure；
The second insulating layer is in the body structure surface of the first insulating layer and the first copper foil layer in the odd number layer package substrate,
Second copper foil layer is in the second insulating layer surface, and second copper foil layer has the second outer graphics, and described second
Insulating layer and second copper foil layer are obtained by following technique:
The body structure surface of the first insulating layer and the first copper foil layer in the odd number layer package substrate carries out increasing layer pressing, is formed
Second copper foil layer on the second insulating layer and the second insulating layer surface；
Second copper foil layer is connected by the first intercommunicating pore with the first copper foil layer in the odd number layer package substrate.
7. odd number layer package substrate according to claim 6, which is characterized in that the odd number layer package substrate further include:
Third insulating layer, third copper foil layer and the second intercommunicating pore；
The third copper foil layer is in the third surface of insulating layer, and the third copper foil layer has third outer graphics, described
Third copper foil layer is connect by second intercommunicating pore with second copper foil layer.
8. odd number layer package substrate according to claim 6 or 7, which is characterized in that
The material of first insulating layer, the second insulating layer and the third insulating layer is with glass structure or pure resin
The insulating materials of structure.
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| CN201510602942.1A CN106550555B (en) | 2015-09-21 | 2015-09-21 | A kind of odd number layer package substrate and its processing method |
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| CN201510602942.1A CN106550555B (en) | 2015-09-21 | 2015-09-21 | A kind of odd number layer package substrate and its processing method |
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| CN106550555A CN106550555A (en) | 2017-03-29 |
| CN106550555B true CN106550555B (en) | 2019-05-24 |
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| CN107613665B (en) * | 2017-08-11 | 2020-08-21 | 惠州市超频三全周光智能照明科技有限公司 | Multilayer conduction structure processing method, linear circuit board processing method and linear light source |
| CN112739020A (en) * | 2020-12-15 | 2021-04-30 | 广德宝达精密电路有限公司 | Method for manufacturing gold-plated circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194703A (en) * | 2010-03-16 | 2011-09-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
| CN104244616A (en) * | 2014-08-27 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for thin coreless substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4576480B1 (en) * | 2010-01-18 | 2010-11-10 | 新光電気工業株式会社 | Multilayer wiring board |
| KR20150064976A (en) * | 2013-12-04 | 2015-06-12 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194703A (en) * | 2010-03-16 | 2011-09-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
| CN104244616A (en) * | 2014-08-27 | 2014-12-24 | 华进半导体封装先导技术研发中心有限公司 | Manufacturing method for thin coreless substrate |
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