TW504814B - Manufacturing method of caving type IC package carry board - Google Patents

Abstract

A kind of manufacturing method for caving type IC package carry board contains the following steps. A multi-layer circuit board and an opening-hole board are manufactured, respectively. The multi-layer circuit board and the opening-hole board are stacked and pressed to form a caving type multi-layer board. A drilling-hole process is conducted onto the caving type multi-layer board to form several through-holes. A coating film process is then conducted onto several caves of the opening-hole board such that each cave is covered with a protection film. The inner wall of the through hole is electroplated with a copper foil layer to conduct each circuit layer. The protection film of the cave is stripped to expose the inner portion of the cave. After that, the continuing process such as the anti-soldering process is performed onto the caving-type multi-layer board, and a caving-type IC package carry board is completed.

Description

504814 V. Description of the invention (1) [Field of the invention] The present invention relates to a method for manufacturing a _ cave hole type κ package carrier board, and specifically relates to manufacturing a multilayer circuit substrate and an open-hole substrate separately, and then stacking them, Forming-hole-type multi-layer substrate, the open-hole substrate is used for the core of the wafer to form a module [module] to reduce the printed circuit board area of electronic products. [Previous technology] Traditionally, printed circuit board electrical components [such as integrated circuits] Components] Welding is provided to form appliances with various functions. Generally, a printed circuit board is composed of a multilayer board, which is made of an organic material or an inorganic material and is provided with an inner layer circuit, a layer circuit, etc., so as to provide appropriate mechanical support and electrical connection of electronic components. The development of printed circuit board manufacturing technology tends to increase levels, increase through-hole density, reduce line width, etc., in order to handle the number of electronic component settings on a limited number of printed circuit board tables. A hole ^ is set on a traditional printed circuit board and the chip group is fixed. The two are electrically connected to each other. It is necessary to place the chip group in the hole to reduce the use of electronic components on the surface of the printed circuit board. 'When the multi-layer printed circuit board is subjected to a hole-opening process, many technical problems arise, which often makes the printed circuit board process have a processing margin problem. Traditionally, a method for manufacturing an open-hole multi-layer circuit substrate is to make holes at a fixed depth. The bottom of the hole is not suitable for wiring, and cannot be used for chip wiring. Therefore, the shortcoming of signal connection between the layers of the circuits and the waste of space on the substrate surface occur. Number! The figure reveals a cross-sectional view of a conventional cavity type 1 (: package carrier board structure. Please refer to Figure 1. The hole type 1C package carrier board 1 includes a circuit layer la and a

Opening layer lb. The multi-layer printed circuit board manufacturing method has a main hole ice and a plurality of holes of size and size c. However, the bottom ld of the hole lc formed with this stop is not suitable for setting a precision circuit; =, generally, it is only suitable for setting a low-precision copper sheet. Because when the hole hole is made-when electroplating or manufacturing the outer circuit layer, the bottom layer of the hole hole must be destroyed unless the hole with the bottom id line is properly applied before the outer circuit layer. More μ Zhaha

， 1, if the hole is too deep, the hole at the bottom of ld is provided with line work is destroyed, if the hole is too shallow, the hole at the bottom of the hole 丨 c is exposed by the method, resulting in failure Plays normal functions or has poor product reliability. Generally, unless the line at the bottom of the hole 1 c is not damaged in the manufacturing process, the manufacturing of the hole-type IC package carrier board is bound to be limited by the hole. The end of 1 c and 1 d are not suitable for wiring. Generally speaking, if the hole 丨 c bottom 丨 d is not good enough for the above-mentioned drilling to damage the precision wiring problem, the position of the bottom 丨 d is still logically suitable for setting precision wiring. It is used for chip wiring connection, thus reducing the space utilization of printed circuit boards.

In the manufacture of multi-layer printed circuit boards, it is assumed that the improved process method is used at the bottom d position of the hole 1 c. When it is appropriately improved as the position of the circuit, a manufacturing method with a large opening processing margin is required to overcome the bottom of the hole. The technical problem of the circuit 'enables the multilayer printed circuit board to improve wiring utilization and manufacturing efficiency. In view of this, in the method for manufacturing a printed circuit board, the present invention separately manufactures a multilayer circuit substrate and an open-hole substrate, and then arranges and stacks them to form a cavity type.

C: \ Logo-5 \ Five Continents \ PK8202.ptd Page 6 504814 V. Description of the invention (3) Multi-layer substrates and circuits, which are omitted to rely on the hole bottom ratio and process efficiency [Summary of the invention, the main method of the invention, The protective film is laminated with a protective layer, and the board is manufactured. This method of the present invention first divides and combines to form a circuit board cloth for a hole-into-precise circuit. According to the present method, a multilayer printed circuit with a poorly stacked substrate and a poor opening is first layered as follows: Holes have traditionally been poorly set line rate and production] The purpose is to form a hole line to cover the hole with a protective film to protect the wire of the multi-layer substrate. The problem that the line cannot be set at the bottom of the hole 8 is the same as the multi-layer substrate. Hole process, so it is applicable to improve the reliability of wiring utilization products of multilayer printed circuit boards. · To provide a hole-type I c package carrier board for manufacturing square-hole multi-layer substrates. The holes are covered with a protective film. The subsequent processes such as electroplating and manufacturing external circuits are used to provide hole-type multilayer substrates at the bottom of the holes. The purpose is to provide a special manufacturing multilayer hole-type multilayer circuit base substrate. The multilayer substrate has a line utilization rate and a process efficiency. The purpose is to provide a hole manufacturing press-fit multilayer base circuit board. After opening the substrate, a hole-type multi-plate fixed-depth hole-opening process for a hole-type IC package hole-type 1C board and a method for making the hole are suitable for the present invention and the product hole-type 1C. Cavity process, the efficiency of the carrier board, the production of a multilayer circuit board and a substrate stacked to form a load board manufacturing side substrate, and then stacked and pressed for the bottom of the opening to improve the reliability of multi-layer printing . Manufacturing method of U package carrier board Multilayer circuit substrate and development method The manufacturing method omits the messenger method of the present invention. The manufacturing method includes a step opening substrate; the multi-hole type multilayer substrate;

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μ = drilling through a multi-layer substrate to form several through holes; covering the opening base with t holes, and covering each hole with a protective film; plating the wall of the through hole to form a hole The copper foil layer conducts each circuit layer; removes the protective film of the hole eight to expose the inside of the hole; and then performs subsequent processes such as solder masking on the hole-type multilayer substrate to complete a hole-type IC package carrier board. [Explanation of the Invention] In order to make the above and other objects, features, and advantages of the present invention more clearly understood, the preferred embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings' as follows. The method for manufacturing a hole-type IC package carrier board according to the present invention includes the main steps as follows: manufacturing a multilayer circuit substrate and an open-hole substrate separately; stacking and pressing the multilayer circuit f-board and the open-hole substrate to form a cavity. The multi-layer substrate is completed, and a plurality of lines on the surface of the multi-layer circuit substrate are correspondingly combined with a plurality of holes of the open-hole substrate, so that the chip is wired into the hole after subsequent packaging processes to connect the lines; the number of the open-hole substrate Each hole is covered with a film, and each of these holes is covered with a protective film, which protects the circuit for the 彳 g reading process such as electroplating and manufacturing the outer circuit layer. The manufacturing method is suitable for the hole-type multilayer of the circuit at the bottom of the opening Substrate. The present invention appropriately discloses the foregoing main technical content in the following examples of Jiaguan implementations, and uses the preferred embodiment in conjunction with related technologies to appropriately implement the main technical content of the present invention. Figures 2a to 2f show the manufacturing method of the first preferred embodiment of the present invention. Please refer to FIG. 2a, the manufacturing method of the first preferred embodiment of the present invention

C: \ Logo-5 \ Five Continents \ PK8202.ptd Page 8 504814 V. Description of the invention (5) Firstly, a hole 21 is mechanically opened on a hole substrate 20 to form several holes 21 'The hole 21 is in the structure The upper surface and the lower surface of the opening substrate 20 communicate with each other. Since the hole-making substrate 20 is previously holed in the hole 21, the first hole-opening process in the manufacturing of the multilayer printed circuit board necessarily increases the hole-processing margin relative to the latter hole-opening process. At the same time, the manufacturing method omits the process of setting the depth and opening holes of a multi-layer substrate with poor reliability. Therefore, the multi-layer substrate must be suitable for setting the circuit at the bottom of the hole.凊 Refer to Figure 2b, the manufacturing method of the first preferred embodiment of the present invention then stacks and press-fits a multilayer circuit substrate 10 and the open-hole substrate 20 to form / hole-type multilayer substrate 1. The multilayer The surface of the circuit substrate 10 is provided with a plurality of precise and precise lines 11 in advance, so that the plurality of lines 11 on the surface of the multilayer circuit substrate 1 Q correspond to the holes 21 of the open-hole substrate 20. In the printed circuit board structure, a bond is formed between the multilayer circuit board 10 and the opening substrate 20. At this time, 'the bottom of the hole 21 has the multi-layer circuit board 丨 〇 the pre-set circuit 11', so each hole 21 has a specific circuit 1 丨, so that the wafer is inserted into the hole 21 in the subsequent p-assembly process and wired. Connect this line 11. (1 Please refer to FIG. 2c. The manufacturing method of the first preferred embodiment of the present invention is followed by drilling through the hole-type multilayer substrate 1 by laser or mechanical means to form a plurality of through holes at predetermined positions. 2. The through hole 2 is structurally connected to the upper surface and the lower surface of the hole-type multi-layer substrate 1, and at the same time passes through several layers of lines and 4 layers of layers (not labeled). Please refer to FIG. 2d. The manufacturing method of the preferred embodiment then covers a plurality of holes 21 of the open-hole substrate 20, and forms a protective film 22 on each of the holes 21, and the protective film 22 is made of a polymer material.

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It is formed so that the inside of the cavity 21 is covered by the protective film 22 so that the cavity-type multilayer substrate 1 can be subjected to subsequent processes. The film coating method of the present invention preferably uses screen printing, curtain coatmg, spray coating, spray coating, etc. On a conventionally manufactured multi-layer open circuit substrate with a hole, since the coating technology is not easy to form a protective film, the bottom of the hole is not suitable for setting the line 0. Referring to FIG. 2e, the manufacturing method of the first preferred embodiment of the present invention then inserts the hole into the hole. The inner peripheral surface of the through hole 2 of the multi-layer substrate 丨 is electroplated to form a copper foil layer so as to conduct the circuit layers [not labeled] of the multilayer circuit substrate 丨 and the open-hole substrate 20. Therefore, in addition to the multi-layer circuit substrate 10 completing the signal connection between the layers, an electrical connection is formed between the multi-layer circuit substrate 10 and the open-hole substrate 20. Please refer to FIG. 2f. After the hole-type multi-layer substrate i is manufactured as an outer circuit layer, the manufacturing method of the first preferred embodiment of the present invention will finally make the protective film 22 of the holes 21 of the open-hole substrate 20 It is removed by an appropriate method to form an open space inside the hole 21 for chip placement, and at the same time, the line 11 of the hole 2 is used for wire connection of the wafer, thereby reducing the volume of the combined structure of the printed circuit board and the electronic component. Next, the hole-type multilayer substrate 1 is subjected to subsequent processes such as soldering prevention as necessary to complete the hole-type C package carrier. The manufacturing method of the hole-type IC package carrier board of the present invention is compared with the conventional method. The manufacturing method of the hole-type IC package carrier board of the present invention is that the multilayer circuit substrate and the open-hole substrate are separately manufactured in advance, and then stacked and pressed. Combined to form a hole-type multi-layer substrate, which is specially combined with the use of several holes in the open-hole substrate.

504814 V. Description of Invention (7)

"Line film" covers each of the holes with a protective film, which protects the circuit at the bottom of the hole for subsequent processes such as electroplating and manufacturing the outer circuit layer. The manufacturing method is suitable for the hole-in multilayer of the circuit at the bottom of the opening. The substrate is used to improve the process efficiency of the multilayer printed circuit board and the working margin of the opening processing [such as convenience and high efficiency]; in contrast, the conventional method only directly drills holes on the multilayer printed circuit board to form holes, which is relative to the present invention. In the manufacturing method and the conventional method, the direct hole method is easy to damage and wiring, and is not suitable for setting a precise circuit at the bottom of the hole like the method of the present invention. X Although the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to define or use the present invention. Any person skilled in the art can make various changes and modifications without departing from the scope of the present invention within the M limit. ^ RS >% Shenhewei Dang shall be determined by the scope of the attached patent application. μ edge dry

504814

[Illustration of drawing number] Simple explanation of the drawing [Explanation of drawing] Fig. 1 · A cross-sectional view of a conventional multilayer printed circuit board structure. Fig. 2a: A cross-sectional schematic diagram of a method for manufacturing a hole-type 1C package carrier board according to the first preferred embodiment of the present invention for manufacturing a multilayer circuit substrate and an open-hole substrate, respectively. Fig. 2b: A first preferred embodiment of the present invention. Schematic cross-sectional view of the manufacturing method of the hole-type I c package carrier board. Fig. 2c: A schematic cross-sectional view of a drilled hole in the manufacturing method of the hole-type I c package carrier board according to the first preferred embodiment of the present invention. Second d: A schematic cross-sectional view of a method for manufacturing a hole-type I c package carrier board according to the first preferred embodiment of the present invention. Fig. 2e: Hole-in type 1 of the first preferred embodiment of the present invention: (Cross-section schematic drawing of a copper plated copper foil manufacturing method for a package carrier. Fig. 2f: Hole-in type of the first preferred embodiment of the present invention Schematic cross-sectional view of a method for manufacturing an IC package substrate without a protective film.

1 Hole-type multilayer substrate la Circuit layer lb Hole layer lc Hole Id Bottom 2 Through hole 10 Multilayer circuit substrate 11 Circuit 20 Hole substrate 21 Hole 22 Protective film

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Claims (1)

504814 VI. Patent application method for manufacturing a hole-entry IC packaging carrier board, including the steps of manufacturing a layered circuit board and an open-hole substrate respectively; stacking and pressing the multilayer circuit board and the open-hole substrate to form a Hole-type multi-layer substrate; drilling through the hole-type multi-layer substrate to form several through holes; covering the holes of the open-hole substrate, forming a protective film on each of the holes to protect the bottom of the hole Forming a copper foil layer on the inner peripheral surface of the through hole by electroplating; and removing the protective film of the hole. 4 ^ 2. According to the manufacturing method of the hole-in-line c package carrier board according to item 1 of the scope of the patent application, wherein a plurality of holes of the open-hole substrate are first drilled and then correspondingly bonded to the multilayer circuit substrate. In accordance with the manufacturing method of the hole-type IC package carrier board according to item 2 of the scope of patent application, the hole is formed by mechanical drilling. 4. The manufacturing method of the hole-in-line c package carrier according to item 1 of the scope of the patent application, wherein the through hole electrically connects the multilayer circuit substrate and the open-hole substrate. 5. According to the manufacturing method of the hole-type IC package carrier board according to item 1 of the scope of the patent application, the holes of the open-hole substrate are covered with a film, and then the outer circuit layer is manufactured, and then the holes are protected. Membrane removal. 6. The manufacturing method of the hole-type IC package carrier according to item 1 of the scope of patent application, wherein after the protective film of the hole is removed, the subsequent process of solder resist is performed. C: \ Logo-5 \ Five Continents \ PK8202.ptd Page 13 504814 6. Scope of patent application To complete the hole type I c package carrier board. 7. The manufacturing method of the 1C package carrier according to item 1 of the scope of the patent application, wherein the cover film is formed of a polymer material. 8. According to the manufacturing method of the hole-type IC package carrier board according to item 1 of the scope of the patent application, the film coating method is screen printing, curtain coating, spray coating, and injection coating. C: \ Logo-5 \ Five Corninents \ PK8202.ptd Page 14