CN105682384B - A kind of flexible multi-layered wiring board and preparation method thereof - Google Patents
A kind of flexible multi-layered wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN105682384B CN105682384B CN201610206004.4A CN201610206004A CN105682384B CN 105682384 B CN105682384 B CN 105682384B CN 201610206004 A CN201610206004 A CN 201610206004A CN 105682384 B CN105682384 B CN 105682384B
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- Prior art keywords
- layer
- flexible multi
- middle layer
- layered
- circuit board
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
This application discloses a kind of flexible multi-layered wiring boards and preparation method thereof, wherein the flexible multi-layered method for manufacturing circuit board cuts middle layer by preparing middle layer first, make the middle layer the first predeterminable area and function distinguishing from；Then it is bonded top line and wiring underlayer in the interlayer surfaces, and the routing layer of the top line and wiring underlayer is performed etching；Finally the wiring underlayer is cut, make the wiring underlayer the second predeterminable area and its function distinguishing from, the second predeterminable area of the wiring underlayer plate and the first predeterminable area of the middle layer complete the production with the flexible multi-layered wiring board of partial mono-layer structure due to gravity Automatic-falling at this time.Have the manufacture difficulty of the flexible multi-layered wiring board of partial mono-layer structure lower with the flexible multi-layered method for manufacturing circuit board production, improves the production yield of the flexible multi-layered wiring board with partial mono-layer structure.
Description
Technical field
The present invention relates to circuit board making technical fields, more specifically to a kind of flexible multi-layered wiring board and its system
Make method.
Background technique
First choice of the advantages that flexible circuit board is at low cost, flexibility is high with its as each electronic equipment production firm.At certain
A little electronic products, such as mobile phone need to take the flexible multi-layered route with partial mono-layer structure due to the needs of self structure
Plate realizes the setting of its internal electronic element.The structure of flexible multi-layered wiring board with partial mono-layer structure is as shown in Figure 1, existing
Have in technology and carries out route system from middle layer to outer layer in the production flexible multi-layered wiring board with partial mono-layer structure
It is standby, it is bonded between adjacent lines by pure glue 13, due to the single layer of the flexible multi-layered wiring board with partial mono-layer structure
Thickness at 11 position of region is smaller, and the single layer region 11 and 12 junction of multi-layer area be there are biggish difference in height, because
This is easy to damage the region when the single layer region 11 carries out route production in the prior art, so that described have
The production yield of the flexible multi-layered wiring board of partial mono-layer structure is very low.
Therefore, a kind of production side of the higher flexible multi-layered wiring board with partial mono-layer structure of production yield is needed
Method.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of flexible multi-layered wiring board and preparation method thereof, to solve
The lower problem of the production yield of the flexible multi-layered wiring board of partial mono-layer structure.
In order to solve the above technical problems, the embodiment of the invention provides following technical solutions:
A kind of flexible multi-layered method for manufacturing circuit board, the flexible multi-layered method for manufacturing circuit board include:
Prepare middle layer, the middle layer includes at least one layer of route, and every sandwich circuit includes substrate and is located at the base
The routing layer through over etching of plate surface；
The middle layer is cut, make the middle layer the first predeterminable area and function distinguishing from；
Bonding agent is coated on the functional areas surface of the middle layer both side surface, and in the routing layer of the interlayer surfaces
Surface covers a sandwich circuit, as the top line of the multilayer circuit board, covers in the substrate surface of the interlayer surfaces
One sandwich circuit is carried out as the wiring underlayer of the multilayer circuit board, and to the routing layer of the top line and wiring underlayer
Etching；
The wiring underlayer is cut, the second predeterminable area and its function distinguishing for making the wiring underlayer are from institute
The area for stating the second predeterminable area is greater than first predeterminable area.
Preferably, preparation middle layer includes:
Middle layer is prepared using double-faced flexible substrate.
Preferably, preparation middle layer includes:
Middle layer is prepared using single-sided flexible substrate.
Preferably, the technique that cutting uses is carried out to the middle layer and cuts technique or laser cutting work for clicking technique or knife
Skill.
Preferably, to the second predeterminable area of the wiring underlayer carry out the technique that uses of cutting for laser cutting parameter or
Knife cuts technique.
Preferably, the bonding agent is pure glue.
Preferably, first predeterminable area includes multiple the first subregions being separated from each other；
Second predeterminable area includes the second subregion identical with the first subregion quantity；
The position of second subregion and first subregion corresponds, and the area of second subregion is big
In the area of the first corresponding subregion.
Preferably, after being performed etching to the routing layer of the top line, in the substrate surface of the interlayer surfaces
Before covering a sandwich circuit further include:
One layer of insulating protective film is bonded away from the middle layer side in the top line.
Preferably, after being performed etching to the routing layer of the wiring underlayer, before being cut to the wiring underlayer
Further include:
One layer of insulating protective film is bonded away from one side surface of middle layer in the wiring underlayer.
A kind of flexible multi-layered wiring board, the flexible multi-layered wiring board utilize flexible multi-layered route described in above-described embodiment
Board manufacturing method is made.
It can be seen from the above technical proposal that the embodiment of the invention provides a kind of flexible multi-layered wiring board and its production sides
Method, wherein the flexible multi-layered method for manufacturing circuit board cuts middle layer by preparing middle layer first, makes institute
State middle layer the first predeterminable area and function distinguishing from；Then top line and bottom line are bonded in the interlayer surfaces
Road, and the routing layer of the top line and wiring underlayer is performed etching；Finally the wiring underlayer is cut, makes institute
The second predeterminable area and its function distinguishing for stating wiring underlayer are from the second predeterminable area of the wiring underlayer plate and described at this time
First predeterminable area of middle layer completes the system with the flexible multi-layered wiring board of partial mono-layer structure due to gravity Automatic-falling
Make.Through above-mentioned production process it can be found that when etching the routing layer of the top line, the first of the middle layer is default
Region is supported local single-layer area, to reduce the single layer area of the flexible multi-layered wiring board with single layer structure
The difference in height in domain and multi-layer area thereby reduces the difficulty of local single-layer area route production and in route manufacturing process
The probability that damage or breakage are caused to single layer region improves the life of the flexible multi-layered wiring board with partial mono-layer structure
Produce yield.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the flexible multi-layered wiring board with partial mono-layer structure；
Fig. 2 is a kind of flow diagram of flexible multi-layered method for manufacturing circuit board provided by the embodiments of the present application；
Fig. 3-7 is the structural schematic diagram in flexible multi-layered wiring board manufacturing process provided by the embodiments of the present application.
Specific embodiment
As described in background, in the prior art in the list of the flexible multi-layered wiring board with partial mono-layer structure
Layer region carries out being easy to damage the region when route production, so that described flexible multi-layered with partial mono-layer structure
The production yield of wiring board is very low.
In view of this, the embodiment of the present application provides a kind of flexible multi-layered method for manufacturing circuit board, the flexible multi-layered line
Road board manufacturing method includes:
Prepare middle layer, the middle layer includes at least one layer of route, and every sandwich circuit includes substrate and is located at the base
The routing layer of plate surface；
The middle layer is cut, make the middle layer the first predeterminable area and function distinguishing from；
Bonding agent is coated on the functional areas surface of the middle layer both side surface, and in the routing layer of the interlayer surfaces
Surface covers a sandwich circuit, as the top line of the multilayer circuit board, covers in the substrate surface of the interlayer surfaces
One sandwich circuit is carried out as the wiring underlayer of the multilayer circuit board, and to the routing layer of the top line and wiring underlayer
Etching；
The wiring underlayer is cut, the second predeterminable area and its function distinguishing for making the wiring underlayer are from institute
The area for stating the second predeterminable area is greater than first predeterminable area.
Correspondingly, the flexible multi-layered wiring board utilizes the embodiment of the present application also provides a kind of flexible multi-layered wiring board
Flexible multi-layered method for manufacturing circuit board described in above-described embodiment is made.
It can be seen from the above technical proposal that the embodiment of the invention provides a kind of flexible multi-layered wiring board and its production sides
Method, wherein the flexible multi-layered method for manufacturing circuit board cuts middle layer by preparing middle layer first, makes institute
State middle layer the first predeterminable area and function distinguishing from；Then top line and bottom line are bonded in the interlayer surfaces
Road, and the routing layer of the top line and wiring underlayer is performed etching；Finally the wiring underlayer is cut, makes institute
The second predeterminable area and its function distinguishing for stating wiring underlayer are from the second predeterminable area of the wiring underlayer plate and described at this time
First predeterminable area of middle layer completes the system with the flexible multi-layered wiring board of partial mono-layer structure due to gravity Automatic-falling
Make.Through above-mentioned production process it can be found that when etching the routing layer of the top line, the first of the middle layer is default
Region is supported local single-layer area, to reduce the single layer area of the flexible multi-layered wiring board with single layer structure
The difference in height in domain and multi-layer area carries out reducing the difficulty of local single-layer area route production and in route manufacturing process
The probability that damage or breakage are caused to single layer region improves the life of the flexible multi-layered wiring board with partial mono-layer structure
Produce yield.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present application provides a kind of flexible multi-layered method for manufacturing circuit board, as shown in Fig. 2, the flexible multi-layered line
Road board manufacturing method includes:
S101: preparation middle layer, the middle layer include at least one layer of route, and every sandwich circuit includes substrate and is located at institute
State the routing layer through over etching of substrate surface.The structure of the flexible multi-layered wiring board is as shown in Figure 3 after the step is completed.
On the basis of the above embodiments, the specific embodiment of the application provides a kind of with three layers of routing layer
The preparation flow of middle layer, comprising:
A: providing single-sided flexible substrate, and the single-sided flexible substrate includes substrate, and is located at one side surface of substrate
Routing layer, the routing layer be not etched metal layer or conductive membrane layer；
B: performing etching the routing layer, obtains the cabling layer pattern of needs, the second layer as the middle layer；
C: bonding agent is coated in the second layer routing layer upper and lower surface, respectively covers one layer of single-sided flexible in its both side surface
Substrate, and the routing layer of other layers in addition to the second layer is performed etching, obtaining the middle layer first layer and third layer needs
The cabling layer pattern wanted.
In the present embodiment, the bonding agent is insulating adhesive, insulated from each other between each layer routing layer to guarantee.At this
In one embodiment of invention, the routing layer is copper foil.The application to the specific material of the routing layer and without limitation, tool
Depending on stereoscopic actual conditions.Due to the method and process of the cabling layer pattern for performing etching to be needed to the routing layer
It has been be well known to those skilled in the art that, this will not be repeated here by the application.
It should be noted that in the present embodiment, the middle layer is prepared using single-sided flexible substrate, but the present invention
To this and without limitation, a double-faced flexible substrate can also be used and a single-sided flexible substrate preparation is described with three layers of cabling
The middle layer of layer, specifically depending on actual conditions.
On the basis of the above embodiments, another specific embodiment of the application is with the middle layer with two layers of routing layer
For, provide a kind of preparation flow of middle layer, comprising:
A1: providing double-faced flexible substrate, and the double-faced flexible substrate includes substrate, and is located at the substrate both side surface
Routing layer, the routing layer is not etched metal layer or conductive coating layer；
B1: performing etching the routing layer of the double-faced flexible substrate, obtains the cabling layer pattern of needs, completes in described
The preparation of interbed.
It should be noted that in the present embodiment, the middle layer is prepared using double-faced flexible substrate, but the present invention
To this and without limitation, in the other embodiments of the application, it is described with two that two single-sided flexible substrate preparations can also be used
The middle layer of layer routing layer, specifically depending on actual conditions.
On the basis of the above embodiments, in the preferred embodiment of the application, in the routing layer for completing middle layer
After etching operation, insulating protective film is covered away from the substrate side in the routing layer, to enhance the flexible multi-layered line
Insulation performance between each floor routing layer of road plate.
It should be noted that the routing layer of the middle layer deviates from the substrate in another embodiment of the application
Side simultaneously needs to cover the insulating protective film, and the application to this and without limitation, specifically regards the flexible multi-layered wiring board
Depending on specific structure.
It should also be noted that, in one embodiment of the application, the value for the cabling number of plies that the middle layer has
Range is 1-10, including endpoint value, and the application does not limit the cabling number of plies that the middle layer has, the specific practical feelings of view
Depending on condition.
On the basis of the above embodiments, in one embodiment of the application, the substrate is polyimides
(Polyimide) or polyethylene terephthalate (PET).
S102: cutting the middle layer, make the middle layer the first predeterminable area and function distinguishing from.The step
The structure of the flexible multi-layered wiring board is as shown in figure 4, figure label 100 indicates first predeterminable area after the completion of rapid, mark
Numbers 200 indicate the functional areas.
It should be noted that the first predeterminable area of the middle layer has the flexible multi-layered of partial mono-layer structure with described
The single layer region of wiring board is corresponding.
On the basis of the above embodiments, in another embodiment of the application, cutting is carried out to the middle layer and is adopted
Technique is clicking technique or knife cuts technique or laser cutting parameter.The application is to used by the cutting middle layer
Specific method and technique and without limitation, specifically depending on actual conditions.
S103: bonding agent is coated on the functional areas surface of the middle layer both side surface, and in the interlayer surfaces
Cabling layer surface covers a sandwich circuit, as the top line of the multilayer circuit board, in the substrate table of the interlayer surfaces
Face covers a sandwich circuit, as the wiring underlayer of the multilayer circuit board, and to the cabling of the top line and wiring underlayer
Layer performs etching.The structure of the flexible multi-layered wiring board after the completion of the step is as shown in Figure 5.
It should be noted that being not to avoid institute in the purpose of the first predeterminable area surface of middle layer coating bonding agent
The first predeterminable area is stated to bond together with the top line.
On the basis of the above embodiments, in another embodiment of the application, the bonding agent is pure glue.The application
Specific type to the bonding agent and without limitation, specifically depending on actual conditions.
Likewise, being not to avoid described first in the purpose of the first predeterminable area surface of middle layer coating bonding agent
Predeterminable area bonds together with the wiring underlayer.
S104: cutting the wiring underlayer, makes the second predeterminable area and its function distinguishing of the wiring underlayer
From the area of second predeterminable area is greater than first predeterminable area.
It should be noted that in the preferred embodiment of the application, it is right before being cut to the wiring underlayer
The flexible multi-layered wiring board upper and lower surface carries out the processes such as insulation processing, the surface treatment of surface pads, electric performance test,
The single layer region of top line is avoided to be damaged in above-mentioned manufacturing procedure.But the application is suitable to the specifically processing of above-mentioned operation
Sequence and without limitation, specifically depending on actual conditions.Due to the flexible multi-layered wiring board upper and lower surface carry out insulation processing,
The surface treatment of surface pads, the concrete operations process of electric performance test process have been well known to those skilled in the art, this
This will not be repeated here for application.
It should also be noted that, the purpose that the area of second predeterminable area is greater than first predeterminable area is to keep away
When exempting to cut wiring underlayer, cutting tool causes the case where damaging appearance to the top line by gap, and
After the wiring underlayer is cut, second predeterminable area and the first predeterminable area may be implemented due to gravity
Automatic-falling.The structure of flexible multi-layered wiring board after cutting to the wiring underlayer is as shown in fig. 6, label in figure
300 indicate second predeterminable area.The structure of flexible multi-layered wiring board after the completion of step S104 is as shown in Figure 7.
In the preferred embodiment of the application, second predeterminable area and first predeterminable area are about simultaneously
The straight line for crossing second predeterminable area and the first predeterminable area center is symmetrical, in this way can be default by second compared with small area
Take out the first predeterminable area of the middle layer in region.
On the basis of the above embodiments, in another embodiment of the application, first predeterminable area includes more
A the first subregion being separated from each other；
Second predeterminable area includes the second subregion identical with the first subregion quantity；
The position of second subregion and first subregion corresponds, and the area of second subregion is big
In the area of the first corresponding subregion, first subregion is taken out will pass through second subregion.
It should be noted that in the present embodiment, the multi-layer flexible circuit board has multiple local single-layer areas, these
Local single-layer area and first subregion correspond.
On the basis of above-described embodiment, in one embodiment of the application, to the second preset areas of the wiring underlayer
Domain carries out the technique that cutting uses and cuts technique for laser cutting parameter or knife.To this and without limitation, specific view is practical by the application
Depending on situation.
On the basis of the above embodiments, in the particular preferred embodiment of the application, to the top line
After routing layer performs etching, before the substrate surface of the interlayer surfaces covers a sandwich circuit further include:
One layer of insulating protective film is bonded away from one side surface of middle layer in the top line.
It should be noted that being bonded one layer of insulating protective film both away from one side surface of middle layer in the top line
The insulation performance of the flexible multi-layered wiring board is enhanced, in turn avoids dust, impurity etc. to the routing layer of the top line
Pollution and corrosion.
On the basis of the above embodiments, in one embodiment of the application, to the routing layer of the top line into
After row etching, before the substrate surface of the interlayer surfaces covers a sandwich circuit further include:
Deviate from the middle layer side surface printing solder mask in the top line.
It should be noted that the solder mask and the insulating protective film all play the insulation to the top line
Protective effect.The application to the insulation processing mode of the top line and without limitation, specifically depending on actual conditions.
On the basis of the above embodiments, in another particular preferred embodiment of the application, to the wiring underlayer
Routing layer perform etching after, before being cut to the wiring underlayer further include:
One layer of insulating protective film is bonded away from one side surface of middle layer in the wiring underlayer.
Likewise, the cabling layer surface in the wiring underlayer is bonded one layer of insulating protective film both to have enhanced the flexibility more
The insulation performance of sandwich circuit board in turn avoids the pollution to the routing layer of the wiring underlayer such as dust, impurity.The application's
In one embodiment, it can also be played away from middle layer side printing solder mask to the bottom in the wiring underlayer
The insulation protection of route.The application to the insulation processing mode of the wiring underlayer and without limitation, the specific practical feelings of view
Depending on condition.
Correspondingly, the flexible multi-layered wiring board utilizes the embodiment of the present application also provides a kind of flexible multi-layered wiring board
Flexible multi-layered method for manufacturing circuit board described in any of the above-described embodiment is made.
In conclusion the embodiment of the present application provides a kind of flexible multi-layered wiring board and preparation method thereof, wherein described soft
Property manufacturing method of multi-layer circuit board by preparing middle layer first, and middle layer is cut, makes the first of the middle layer
Predeterminable area and function distinguishing from；Then it is bonded top line and wiring underlayer in the interlayer surfaces, and to the top layer
The routing layer of route and wiring underlayer performs etching；Finally the wiring underlayer is cut, makes the of the wiring underlayer
Two predeterminable areas and its function distinguishing are from the first of the second predeterminable area of the wiring underlayer plate and the middle layer is pre- at this time
If the production with the flexible multi-layered wiring board of partial mono-layer structure is completed due to gravity Automatic-falling in region.Pass through above-mentioned system
Make process it can be found that the first predeterminable area of the middle layer is to local list when etching the routing layer of the top line
Layer region is supported, to reduce single layer region and the multi-layer area of the flexible multi-layered wiring board with single layer structure
Difference in height, thereby reduce local single-layer area route production difficulty and single layer region is made in route manufacturing process
At the probability of damage or breakage, the production yield of the flexible multi-layered wiring board with partial mono-layer structure is improved.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (9)
1. a kind of flexible multi-layered method for manufacturing circuit board, which is characterized in that the flexible multi-layered method for manufacturing circuit board includes:
Prepare middle layer, the middle layer includes at least one layer of route, and every sandwich circuit includes substrate and is located at the substrate table
The routing layer through over etching in face；
The middle layer is cut, make the middle layer the first predeterminable area and function distinguishing from；
Bonding agent is coated on the functional areas surface of the middle layer both side surface, and in the cabling layer surface of the interlayer surfaces
A sandwich circuit is covered, as the top line of the multilayer circuit board, covers one layer in the substrate surface of the interlayer surfaces
Route is performed etching as the wiring underlayer of the multilayer circuit board, and to the routing layer of the top line and wiring underlayer；
The wiring underlayer is cut, the second predeterminable area and its function distinguishing for making the wiring underlayer are from described the
The area of two predeterminable areas is greater than first predeterminable area；
First predeterminable area includes multiple the first subregions being separated from each other；
Second predeterminable area includes the second subregion identical with the first subregion quantity；
The position of second subregion and first subregion corresponds, and the area of second subregion be greater than with
The area of its corresponding first subregion.
2. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that preparing middle layer includes:
Middle layer is prepared using double-faced flexible substrate.
3. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that preparing middle layer includes:
Middle layer is prepared using single-sided flexible substrate.
4. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that cut to the middle layer
The technique of tapping is clicking technique or knife cuts technique or laser cutting parameter.
5. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that the of the wiring underlayer
Two predeterminable areas carry out the technique that cutting uses and cut technique for laser cutting parameter or knife.
6. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that the bonding agent is pure glue.
7. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that walked to the top line
After line layer performs etching, before the substrate surface of the interlayer surfaces covers a sandwich circuit further include:
One layer of insulating protective film is bonded away from the middle layer side in the top line.
8. flexible multi-layered method for manufacturing circuit board according to claim 1, which is characterized in that walked to the wiring underlayer
After line layer performs etching, before being cut to the wiring underlayer further include:
One layer of insulating protective film is bonded away from one side surface of middle layer in the wiring underlayer.
9. a kind of flexible multi-layered wiring board, which is characterized in that the flexible multi-layered wiring board utilizes any one of claim 1-8 institute
The flexible multi-layered method for manufacturing circuit board stated is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610206004.4A CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610206004.4A CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682384A CN105682384A (en) | 2016-06-15 |
| CN105682384B true CN105682384B (en) | 2019-04-26 |
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| CN201610206004.4A Expired - Fee Related CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108901147B (en) * | 2018-06-12 | 2020-01-31 | 深圳市景旺电子股份有限公司 | multilayer flexible circuit board manufacturing method and multilayer flexible circuit board |
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| EP0195935A2 (en) * | 1985-03-27 | 1986-10-01 | PPC Electronic AG | Process for manufacturing a circuit board comprising rigid and flexible parts for printed circuits |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0364994A (en) * | 1989-08-03 | 1991-03-20 | Aica Kogyo Co Ltd | Printed wiring board |
| JPH03141694A (en) * | 1989-10-26 | 1991-06-17 | Aica Kogyo Co Ltd | Manufacture of rigid flexible composite multilayer printed circuit board |
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2016
- 2016-04-01 CN CN201610206004.4A patent/CN105682384B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0195935A2 (en) * | 1985-03-27 | 1986-10-01 | PPC Electronic AG | Process for manufacturing a circuit board comprising rigid and flexible parts for printed circuits |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
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| Publication number | Publication date |
|---|---|
| CN105682384A (en) | 2016-06-15 |
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