CN105682384A - Flexible multilayer circuit board and manufacturing method thereof - Google Patents
Flexible multilayer circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105682384A CN105682384A CN201610206004.4A CN201610206004A CN105682384A CN 105682384 A CN105682384 A CN 105682384A CN 201610206004 A CN201610206004 A CN 201610206004A CN 105682384 A CN105682384 A CN 105682384A
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- Prior art keywords
- layer
- intermediate layer
- circuit board
- flexible multi
- predeterminable area
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The invention discloses a flexible multilayer circuit board and a manufacturing method thereof. The manufacturing method of the flexible multilayer circuit is characterized by, to begin with, preparing a middle layer and cutting the middle layer to enable a first preset region of the middle layer to be separated from a function region; then, bonding a top-layer circuit and a bottom-layer circuit on the surface of the middle layer, and etching wiring layers of the top-layer circuit and the bottom-layer circuit; and finally, carrying out cutting on the bottom-layer circuit to enable a second preset region of the bottom-layer circuit to be separated from a function region thereof, and at this moment, the second preset region of the bottom-layer circuit and the first preset region of the middle layer fall off due to gravity, and thus preparation of the flexible multilayer circuit board having a partial single-layer structure is finished. According to the manufacturing method of the flexible multilayer circuit, difficulty in preparing the flexible multilayer circuit board having the partial single-layer structure is smaller, and production qualified rate of the flexible multilayer circuit board having the partial single-layer structure is improved.
Description
Technical field
The present invention relates to circuit board making technical field, more particularly, it relates to a kind of flexible multi-layered wiring board and preparation method thereof.
Background technology
Flexible circuit board is low with its cost, motility advantages of higher becomes the first-selection of each electronic equipment production firm. at some electronic product, if mobile phone etc. is due to the needs of self structure, it is necessary to take the flexible multi-layered wiring board with partial mono-layer structure to realize the setting of its internal electronic element. there is the structure of flexible multi-layered wiring board of partial mono-layer structure as shown in Figure 1, prior art carries out circuit from intermediate layer to outer layer when having the flexible multi-layered wiring board of partial mono-layer structure described in making prepare, pure glue 13 is passed through bonding between adjacent lines, owing to the thickness of the position, monolayer region 11 of the described flexible multi-layered wiring board with partial mono-layer structure is less, and there is bigger difference in height with multi-layer area 12 junction in described monolayer region 11, therefore prior art carries out in described monolayer region 11 being easy to this region is caused damage when circuit makes, the production yield of the flexible multi-layered wiring board described in making with partial mono-layer structure is very low.
Therefore, a kind of manufacture method producing the higher flexible multi-layered wiring board with partial mono-layer structure of yield is needed badly.
Summary of the invention
For solving above-mentioned technical problem, the invention provides a kind of flexible multi-layered wiring board and preparation method thereof, produce the relatively low problem of yield with what solve the flexible multi-layered wiring board of partial mono-layer structure.
For solving above-mentioned technical problem, embodiments provide following technical scheme:
A kind of flexible multi-layered method for manufacturing circuit board, described flexible multi-layered method for manufacturing circuit board includes:
Preparation intermediate layer, described intermediate layer includes at least one of which circuit, and every sandwich circuit includes substrate and is positioned at the routing layer through over etching of described substrate surface;
Described intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from;
Functional areas surface-coated bonding agent in described intermediate layer both side surface, and cover a sandwich circuit on the routing layer surface of described interlayer surfaces, top line as described multilayer circuit board, substrate surface in described interlayer surfaces covers a sandwich circuit, as the wiring underlayer of described multilayer circuit board, and the routing layer of described top line and wiring underlayer is performed etching;
Described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, the area of described second predeterminable area is more than described first predeterminable area.
Preferably, preparation intermediate layer includes:
Double-faced flexible base material is utilized to prepare intermediate layer.
Preferably, preparation intermediate layer includes:
Single-sided flexible base material is utilized to prepare intermediate layer.
Preferably, the technique that described intermediate layer carries out cutting employing is clicking technique or lancinate technique or laser cutting parameter.
Preferably, the technique that the second predeterminable area of described wiring underlayer carries out cutting employing is laser cutting parameter or technique of lancinating.
Preferably, described bonding agent is pure glue.
Preferably, described first predeterminable area includes multiple the first subregion being separated from each other;
Described second predeterminable area includes second subregion identical with described first subregion quantity;
The position one_to_one corresponding of described second subregion and described first subregion, and the area of described second subregion is more than the area of the first corresponding subregion.
Preferably, after the routing layer of described top line is performed etching, also included before the substrate surface of described interlayer surfaces covers a sandwich circuit:
Described top line deviate from side, described intermediate layer laminating one layer of insulating protective film.
Preferably, after the routing layer of described wiring underlayer is performed etching, also include before described wiring underlayer is cut:
Described intermediate layer one side surface one layer of insulating protective film of laminating is deviated from described wiring underlayer.
A kind of flexible multi-layered wiring board, described flexible multi-layered wiring board utilizes the flexible multi-layered method for manufacturing circuit board described in above-described embodiment to make.
Can be seen that from technique scheme, embodiments provide a kind of flexible multi-layered wiring board and preparation method thereof, wherein, first described flexible multi-layered method for manufacturing circuit board by preparing intermediate layer, and intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from; Then at the bonding top line of described interlayer surfaces and wiring underlayer, and the routing layer of described top line and wiring underlayer is performed etching; Finally described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, now the second predeterminable area of described wiring underlayer plate and first predeterminable area in described intermediate layer are due to gravity Automatic-falling, complete the making with the flexible multi-layered wiring board of partial mono-layer structure. By above-mentioned Making programme it appeared that, when etching the routing layer of described top line, local single-layer area is supported by first predeterminable area in described intermediate layer, thus having the monolayer region of the flexible multi-layered wiring board of single layer structure and the difference in height of multi-layer area described in reducing, and then reduce the difficulty that local single-layer area circuit makes and the probability that in circuit manufacturing process, monolayer region is caused damage or breakage, there is described in improving the production yield of the flexible multi-layered wiring board of partial mono-layer structure.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to the accompanying drawing provided.
Fig. 1 is the structural representation of the flexible multi-layered wiring board with partial mono-layer structure;
The schematic flow sheet of a kind of flexible multi-layered method for manufacturing circuit board that Fig. 2 provides for the embodiment of the present application;
Structural representation in the flexible multi-layered wiring board manufacturing process that Fig. 3-7 provides for the embodiment of the present application.
Detailed description of the invention
As described in background, prior art carries out in the monolayer region of the described flexible multi-layered wiring board with partial mono-layer structure be easy to this region is caused damage when circuit makes so that described in there is partial mono-layer structure the production yield of flexible multi-layered wiring board very low.
In view of this, the embodiment of the present application provides a kind of flexible multi-layered method for manufacturing circuit board, and described flexible multi-layered method for manufacturing circuit board includes:
Preparation intermediate layer, described intermediate layer includes at least one of which circuit, and every sandwich circuit includes substrate and is positioned at the routing layer of described substrate surface;
Described intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from;
Functional areas surface-coated bonding agent in described intermediate layer both side surface, and cover a sandwich circuit on the routing layer surface of described interlayer surfaces, top line as described multilayer circuit board, substrate surface in described interlayer surfaces covers a sandwich circuit, as the wiring underlayer of described multilayer circuit board, and the routing layer of described top line and wiring underlayer is performed etching;
Described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, the area of described second predeterminable area is more than described first predeterminable area.
Accordingly, the embodiment of the present application additionally provides a kind of flexible multi-layered wiring board, and described flexible multi-layered wiring board utilizes the flexible multi-layered method for manufacturing circuit board described in above-described embodiment to make.
Can be seen that from technique scheme, embodiments provide a kind of flexible multi-layered wiring board and preparation method thereof, wherein, first described flexible multi-layered method for manufacturing circuit board by preparing intermediate layer, and intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from; Then at the bonding top line of described interlayer surfaces and wiring underlayer, and the routing layer of described top line and wiring underlayer is performed etching; Finally described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, now the second predeterminable area of described wiring underlayer plate and first predeterminable area in described intermediate layer are due to gravity Automatic-falling, complete the making with the flexible multi-layered wiring board of partial mono-layer structure. By above-mentioned Making programme it appeared that, when etching the routing layer of described top line, local single-layer area is supported by first predeterminable area in described intermediate layer, thus having the monolayer region of the flexible multi-layered wiring board of single layer structure and the difference in height of multi-layer area described in reducing, carry out reducing the difficulty that local single-layer area circuit makes and the probability that monolayer region is caused damage or breakage in circuit manufacturing process, there is described in improving the production yield of the flexible multi-layered wiring board of partial mono-layer structure.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments. Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
The embodiment of the present application provides a kind of flexible multi-layered method for manufacturing circuit board, as in figure 2 it is shown, described flexible multi-layered method for manufacturing circuit board includes:
S101: preparation intermediate layer, described intermediate layer includes at least one of which circuit, and every sandwich circuit includes substrate and is positioned at the routing layer through over etching of described substrate surface. This step complete after described flexible multi-layered wiring board structure as shown in Figure 3.
On the basis of above-described embodiment, a specific embodiment of the application provides the preparation flow in a kind of intermediate layer with three layers routing layer, including:
A: single-sided flexible base material is provided, described single-sided flexible base material includes substrate, and is positioned at the routing layer of described substrate one side surface, and described routing layer is not etched metal level or conductive membrane layer;
B: described routing layer is performed etching, it is thus achieved that the routing layer pattern of needs, as the second layer in described intermediate layer;
C: be coated with bonding agent in described second layer routing layer upper and lower surface, lid layer single-sided flexible base material is respectively covered in its both side surface, and the routing layer of other except the second layer layer is performed etching, obtain described intermediate layer ground floor and the routing layer pattern of third layer needs.
In the present embodiment, described bonding agent is insulating adhesive, insulated from each other to ensure between each layer routing layer. In one embodiment of the invention, described routing layer is Copper Foil. The concrete material of described routing layer is not limited by the application, specifically depending on practical situation. Owing to described routing layer being performed etching thus obtaining the method for routing layer pattern that needs and flow process is well known to those skilled in the art, the application does not repeat at this.
It should be noted that, in the present embodiment, described intermediate layer utilizes single-sided flexible base material to be prepared, but this is not limited by the present invention, may be used without the intermediate layer described in a double-faced flexible base material and a single-sided flexible base material preparation with three layers routing layer, specifically depending on practical situation.
On the basis of above-described embodiment, another specific embodiment of the application intermediate layer to have two-layer routing layer, it is provided that the preparation flow in a kind of intermediate layer, including:
A1: double-faced flexible base material is provided, described double-faced flexible base material includes substrate, and is positioned at the routing layer of described substrate both side surface, and described routing layer is not etched metal level or conduction coating layer;
B1: the routing layer of described double-faced flexible base material is performed etching, it is thus achieved that the routing layer pattern of needs, completes the preparation in described intermediate layer.
It should be noted that, in the present embodiment, described intermediate layer utilizes double-faced flexible base material to be prepared, but this is not limited by the present invention, in other embodiments of the application, may be used without the intermediate layer described in two single-sided flexible base material preparations with two-layer routing layer, specifically depending on practical situation.
On the basis of above-described embodiment; in a preferred embodiment of the application; after the routing layer etching operation completing intermediate layer, deviate from described base material side at described routing layer and cover insulating protective film, to strengthen the insulating properties between each layer routing layer of described flexible multi-layered wiring board.
It should be noted that in another embodiment of the application, the routing layer in described intermediate layer deviates from described base material side and needs to cover described insulating protective film, and this is not limited by the application, specifically depending on the concrete structure of described flexible multi-layered wiring board.
Also, it should be noted in an embodiment of the application, the span of the cabling number of plies that described intermediate layer has is 1-10, including endpoint value, the cabling number of plies that described intermediate layer is had by the application does not limit, specifically depending on practical situation.
On the basis of above-described embodiment, in an embodiment of the application, described substrate is polyimides (Polyimide) or polyethylene terephthalate (PET).
S102: described intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from. This step after completing the structure of described flexible multi-layered wiring board as shown in Figure 4, number in the figure 100 represents described first predeterminable area, and label 200 represents described functional areas.
It should be noted that first predeterminable area in described intermediate layer is corresponding with the monolayer region of the described flexible multi-layered wiring board with partial mono-layer structure.
On the basis of above-described embodiment, in another embodiment of the application, the technique that described intermediate layer carries out cutting employing is clicking technique or lancinate technique or laser cutting parameter. Concrete grammar and technique that the described intermediate layer of described cutting is adopted by the application do not limit, specifically depending on practical situation.
S103: at the functional areas surface-coated bonding agent of described intermediate layer both side surface, and cover a sandwich circuit on the routing layer surface of described interlayer surfaces, top line as described multilayer circuit board, substrate surface in described interlayer surfaces covers a sandwich circuit, as the wiring underlayer of described multilayer circuit board, and the routing layer of described top line and wiring underlayer is performed etching. This step complete after described flexible multi-layered wiring board structure as shown in Figure 5.
It should be noted that the purpose at the first predeterminable area surface-coated bonding agent in described intermediate layer is not to avoid described first predeterminable area and described top line to bond together.
On the basis of above-described embodiment, in another embodiment of the application, described bonding agent is pure glue. The concrete kind of described bonding agent is not limited by the application, specifically depending on practical situation.
Same, the purpose at the first predeterminable area surface-coated bonding agent in described intermediate layer is not to avoid described first predeterminable area and described wiring underlayer to bond together.
S104: described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, the area of described second predeterminable area is more than described first predeterminable area.
It should be noted that, in a preferred embodiment of the application, before described wiring underlayer is cut, described flexible multi-layered wiring board upper and lower surface is carried out the operations such as insulation processing, the surface treatment of surface pads, electric performance test, it is to avoid the monolayer region of top line suffers damage in above-mentioned manufacturing procedure. But the concrete processing sequence of above-mentioned operation is not limited by the application, specifically depending on practical situation. Due to described flexible multi-layered wiring board upper and lower surface is carried out insulation processing, the surface treatment of surface pads, electric performance test flow process concrete operations flow process be well known to those skilled in the art, the application does not repeat at this.
It can further be stated that, when the area of described second predeterminable area is in that to avoid wiring underlayer is cut more than the purpose of described first predeterminable area, described top line is caused the situation of damage to occur by gap by cutting tool, and after described wiring underlayer cuts, described second predeterminable area and the first predeterminable area can realize Automatic-falling due to action of gravity. As shown in Figure 6, the label 300 in figure represents described second predeterminable area to the structure of the flexible multi-layered wiring board after described wiring underlayer is cut. Step S104 complete after flexible multi-layered wiring board structure as shown in Figure 7.
In a preferred embodiment of the application, described second predeterminable area and described first predeterminable area are symmetrical about the straight line crossing described second predeterminable area and the first predeterminable area center simultaneously, and the second predeterminable area that so can pass through less area takes out first predeterminable area in described intermediate layer.
On the basis of above-described embodiment, in another embodiment of the application, described first predeterminable area includes multiple the first subregion being separated from each other;
Described second predeterminable area includes second subregion identical with described first subregion quantity;
The position one_to_one corresponding of described second subregion and described first subregion, and the area of described second subregion is more than the area of the first corresponding subregion, in order to take out described first subregion by described second subregion.
It should be noted that in the present embodiment, described multi-layer flexible circuit board has multiple local single-layer area, these local single-layer area and described first subregion one_to_one corresponding.
On the basis of above-described embodiment, in an embodiment of the application, it is laser cutting parameter or technique of lancinating that the second predeterminable area of described wiring underlayer carries out the technique that cutting adopts. This is not limited by the application, specifically depending on practical situation.
On the basis of above-described embodiment, in a particular preferred embodiment of the application, after the routing layer of described top line is performed etching, also included before the substrate surface of described interlayer surfaces covers a sandwich circuit:
Described intermediate layer one side surface one layer of insulating protective film of laminating is deviated from described top line.
It should be noted that; deviate from described intermediate layer one side surface one layer of insulating protective film of fitting in described top line and both enhanced the insulating properties of described flexible multi-layered wiring board, turn avoid dust, impurity etc. to the pollution of the routing layer of described top line and corrosion.
On the basis of above-described embodiment, in an embodiment of the application, after the routing layer of described top line is performed etching, also included before the substrate surface of described interlayer surfaces covers a sandwich circuit:
Side, described intermediate layer surface printing solder mask is deviated from described top line.
It should be noted that described solder mask and described insulating protective film all serve the insulation protection effect to described top line. The insulation processing mode of described top line is not limited by the application, specifically depending on practical situation.
On the basis of above-described embodiment, in another particular preferred embodiment of the application, after the routing layer of described wiring underlayer is performed etching, also include before described wiring underlayer is cut:
Described intermediate layer one side surface one layer of insulating protective film of laminating is deviated from described wiring underlayer.
Same, one layer of insulating protective film of fitting on the routing layer surface of described wiring underlayer had both enhanced the insulating properties of described flexible multi-layered wiring board, turn avoid the pollution to the routing layer of described wiring underlayer such as dust, impurity. In an embodiment of the application, deviate from side, described intermediate layer printing solder mask at described wiring underlayer and can also play the insulation protection effect to described wiring underlayer. The insulation processing mode of described wiring underlayer is not limited by the application, specifically depending on practical situation.
Accordingly, the embodiment of the present application additionally provides a kind of flexible multi-layered wiring board, and described flexible multi-layered wiring board utilizes the flexible multi-layered method for manufacturing circuit board described in any of the above-described embodiment to make.
In sum, the embodiment of the present application provides a kind of flexible multi-layered wiring board and preparation method thereof, and wherein, first described flexible multi-layered method for manufacturing circuit board by preparing intermediate layer, and intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from; Then at the bonding top line of described interlayer surfaces and wiring underlayer, and the routing layer of described top line and wiring underlayer is performed etching; Finally described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, now the second predeterminable area of described wiring underlayer plate and first predeterminable area in described intermediate layer are due to gravity Automatic-falling, complete the making with the flexible multi-layered wiring board of partial mono-layer structure. By above-mentioned Making programme it appeared that, when etching the routing layer of described top line, local single-layer area is supported by first predeterminable area in described intermediate layer, thus having the monolayer region of the flexible multi-layered wiring board of single layer structure and the difference in height of multi-layer area described in reducing, and then reduce the difficulty that local single-layer area circuit makes and the probability that in circuit manufacturing process, monolayer region is caused damage or breakage, there is described in improving the production yield of the flexible multi-layered wiring board of partial mono-layer structure.
In this specification, each embodiment adopts the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually referring to.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention. The multiple amendment of these embodiments be will be apparent from for those skilled in the art, and generic principles defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments. Therefore, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. a flexible multi-layered method for manufacturing circuit board, it is characterised in that described flexible multi-layered method for manufacturing circuit board includes:
Preparation intermediate layer, described intermediate layer includes at least one of which circuit, and every sandwich circuit includes substrate and is positioned at the routing layer through over etching of described substrate surface;
Described intermediate layer is cut, make first predeterminable area in described intermediate layer and function distinguishing from;
Functional areas surface-coated bonding agent in described intermediate layer both side surface, and cover a sandwich circuit on the routing layer surface of described interlayer surfaces, top line as described multilayer circuit board, substrate surface in described interlayer surfaces covers a sandwich circuit, as the wiring underlayer of described multilayer circuit board, and the routing layer of described top line and wiring underlayer is performed etching;
Described wiring underlayer is cut, make the second predeterminable area of described wiring underlayer and its function distinguishing from, the area of described second predeterminable area is more than described first predeterminable area.
2. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that preparation intermediate layer includes:
Double-faced flexible base material is utilized to prepare intermediate layer.
3. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that preparation intermediate layer includes:
Single-sided flexible base material is utilized to prepare intermediate layer.
4. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that the technique that described intermediate layer carries out cutting employing is clicking technique or lancinate technique or laser cutting parameter.
5. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that it is laser cutting parameter or technique of lancinating that the second predeterminable area of described wiring underlayer carries out the technique that cutting adopts.
6. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that described bonding agent is pure glue.
7. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that described first predeterminable area includes multiple the first subregion being separated from each other;
Described second predeterminable area includes second subregion identical with described first subregion quantity;
The position one_to_one corresponding of described second subregion and described first subregion, and the area of described second subregion is more than the area of the first corresponding subregion.
8. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that after the routing layer of described top line is performed etching, also included before the substrate surface of described interlayer surfaces covers a sandwich circuit:
Described top line deviate from side, described intermediate layer laminating one layer of insulating protective film.
9. flexible multi-layered method for manufacturing circuit board according to claim 1, it is characterised in that after the routing layer of described wiring underlayer is performed etching, also include before described wiring underlayer is cut:
Described intermediate layer one side surface one layer of insulating protective film of laminating is deviated from described wiring underlayer.
10. a flexible multi-layered wiring board, it is characterised in that described flexible multi-layered wiring board utilizes the flexible multi-layered method for manufacturing circuit board described in any one of claim 1-9 to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610206004.4A CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610206004.4A CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682384A true CN105682384A (en) | 2016-06-15 |
| CN105682384B CN105682384B (en) | 2019-04-26 |
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| CN201610206004.4A Expired - Fee Related CN105682384B (en) | 2016-04-01 | 2016-04-01 | A kind of flexible multi-layered wiring board and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901147A (en) * | 2018-06-12 | 2018-11-27 | 深圳市景旺电子股份有限公司 | A kind of making method for multi-layer flexible circuit board and multi-layer flexible circuit board |
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|---|---|---|---|---|
| EP0195935A2 (en) * | 1985-03-27 | 1986-10-01 | PPC Electronic AG | Process for manufacturing a circuit board comprising rigid and flexible parts for printed circuits |
| JPH0364994A (en) * | 1989-08-03 | 1991-03-20 | Aica Kogyo Co Ltd | Printed wiring board |
| JPH03141694A (en) * | 1989-10-26 | 1991-06-17 | Aica Kogyo Co Ltd | Manufacture of rigid flexible composite multilayer printed circuit board |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
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2016
- 2016-04-01 CN CN201610206004.4A patent/CN105682384B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0195935A2 (en) * | 1985-03-27 | 1986-10-01 | PPC Electronic AG | Process for manufacturing a circuit board comprising rigid and flexible parts for printed circuits |
| JPH0364994A (en) * | 1989-08-03 | 1991-03-20 | Aica Kogyo Co Ltd | Printed wiring board |
| JPH03141694A (en) * | 1989-10-26 | 1991-06-17 | Aica Kogyo Co Ltd | Manufacture of rigid flexible composite multilayer printed circuit board |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108901147A (en) * | 2018-06-12 | 2018-11-27 | 深圳市景旺电子股份有限公司 | A kind of making method for multi-layer flexible circuit board and multi-layer flexible circuit board |
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|---|---|
| CN105682384B (en) | 2019-04-26 |
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