CN102244972A

CN102244972A - Circuit board and application thereof

Info

Publication number: CN102244972A
Application number: CN2011100814330A
Authority: CN
Inventors: 王忠诚
Original assignee: Individual
Current assignee: Individual
Priority date: 2010-04-08
Filing date: 2011-04-01
Publication date: 2011-11-16

Abstract

The invention relates to a circuit board and application thereof. The circuit board comprises an insulator and a conductive circuit, wherein the insulator is provided with a side edge, a first surface and a second surface corresponding to the first surface; the conductive circuit consists of an upper part and a lower part; the upper part is provided with a first side edge, a first width, a first length, a first upper surface and a first lower surface corresponding to the first upper surface, and the first upper surface of the upper part can be implemented as the first upper surface of the conductive circuit; the lower part is provided with a second side edge, a second width, a second length, a second upper surface and a second lower surface corresponding to the second upper surface, and the second lower surface of the lower part can be implemented as the second lower surface of the conductive circuit; and the upper part is jointed with at least one part of the second upper surface of the lower part by means of one part of the first lower surface. In the invention, the circuit board can not be thicker because no chip needs to be contained, thereby reducing the thickness of an assembly, so that the circuit board or the assembly can meet the development trend of being lighter, thinner and smaller.

Description

Circuit board and application thereof

Technical field

The present invention is a kind of structure that belongs to circuit board, and this circuit board is in conjunction with having the structure applications of semiconductor chip.

Background technology

As shown in figure 16, be existing semi-conductive packaging housing 1A cutaway view, this packaging housing 1A includes circuit board 5, chip 20, electrical transmission line 60 and packaging body 10, wherein, this circuit board 5 has an insulator 40, two conducting wires 7 and a conductive path 7K, this insulator 40 has side 44, first surface 41 and corresponding second surface 42, and each conducting wire 7 has side 7C respectively, the first upper surface 7A and the corresponding first lower surface 7B, and the first lower surface 7B of each conducting wire 7 combines with the first surface 41 or the second surface 42 of insulator 40 respectively, this conductive path 7K insulated body 40 coats, and the two ends of conductive path 7K will be arranged on respectively with insulator 40 first surfaces 41 and second surface 42 corresponding conducting wires 7 and engage, make two corresponding conducting wires 7 electrical communication each other, and this conductive path 7K is by the manufacturing process of boring and plating or consent and make, and so can increase the manufacturing process and the cost of this circuit board 5; One chip 20, chip 20 has side 24, conducting end 23, first surface 21 and corresponding second surface 22, wherein conducting end 23 is arranged on first surface 21 usefulness and electrically connects usefulness for external, and second surface 22 engages with insulator 40 first surfaces 41 of circuit board 5; One electrical transmission line 60, this electrical transmission line 60 is embodied as conductor wire, and electrically the two ends of transmission line 60 engage with chip 20 conducting end 23 and a conducting wire 7 first upper surface 7A respectively, make chip 20 conducting end 23 and conducting wire 7 electrical communication; One packaging body 10, this packaging body 10 are arranged on insulator 40 first surfaces 41, and coating circuit plate 5, chip 20 and electrical transmission line 60.

Above-mentioned packaging housing 1A shown in Figure 16, be separately positioned on the surface of insulator 40 because of chip 20, conducting wire 7 and packaging body 10, the thickness T a that makes packaging housing 1A is added up by circuit board 5 thickness T 5, chip 20 thickness T 20 and packaging body 10 thickness T 10 to form, wherein, the thickness T 5 of circuit board 5 is to be added up by insulator 40 thickness T 40 and conducting wire 7 thickness T 7 to form; Light for satisfying product, thin, short and little development trend, therefore, reach one of effective ways that reduce packaging housing 1A thickness T a with the thickness T 7 of minimizing circuit board 5 conducting wires 7 or the thickness T 20 of chip 20, but, reduce conducting wire 7 thickness T 7 or chip 20 thickness T 20, need the production equipment of increasing purchase attenuate, simultaneously, the thickness T 20 of these circuit board 5 conducting wires, 7 thickness T 7 and chip 20 can't become " zero ", that is to say, when conducting wire 7 thickness T 7 or chip 20 thickness T 20 are " zero ", the conducting wire 7 and the chip 20 that are positioned at circuit board 5 with regard to expression are non-existent, therefore, make packaging housing (Package) 1A thickness T a can't effectively reduce and be unfavorable for industry utilization.

Summary of the invention

Technical problem underlying to be solved by this invention is, overcome the above-mentioned defective that prior art exists, and provide a kind of circuit board and application thereof, provide a structure that the conducting wire side is coated by the circuit board insulator, make the thickness of circuit board be able to thinner because of the thickness that does not include the conducting wire, and can be again in conjunction with the chip of semiconductor in circuit board of the present invention, make the side of chip be coated by the insulator of circuit board, make the thickness of circuit board thicker, and then make the thickness of packaging housing be able to the thinner use that is beneficial to industry because of the thickness that does not include chip.

The technical solution adopted for the present invention to solve the technical problems is:

A kind of circuit board is characterized in that, comprising: an insulator, this insulator have side, first surface and corresponding second surface; One conducting wire, this conducting wire is made up of a top and a bottom, this top has the first side, first width, first length, first upper surface and corresponding first lower surface, this top first upper surface also can be embodied as first upper surface of this conducting wire, this bottom has the second side, second width, second length, second upper surface and corresponding second lower surface, this bottom second lower surface also can be embodied as second lower surface of this conducting wire, wherein, top is to borrow the part of first lower surface to engage with at least a portion of bottom second upper surface, in view of the above, this bottom is exactly to pile up with top to combine, this insulator coats this conducting wire, make this conducting wire be embedded in this insulator, wherein, make this insulator coat the part of top first lower surface and the part of first side at least, and make first upper surface not insulated body coat and be exposed to insulator first surface outside, simultaneously, first length on top is longer than second length of bottom, a part that makes top first lower surface not with lower bond.

Aforesaid circuit board, wherein second upper surface of bottom, conducting wire and second side insulated body coat, and the not insulated body coating of second lower surface of bottom.

Aforesaid circuit board, wherein second upper surface of bottom, conducting wire, second lower surface and second side insulated body coat.

Aforesaid circuit board, wherein second lower surface of first upper surface on the top of conducting wire or bottom is depressed in insulator surface or does not protrude from insulator surface.

Aforesaid circuit board, wherein the part of the part of second side, conducting wire or first side not insulated body coat and be exposed to insulator exterior.

Aforesaid circuit board, wherein top, conducting wire has more one the 3rd lower surface, the 3rd lower surface is between top first lower surface and second side, bottom, and top the 3rd lower surface and second side, bottom are neither to be engaged with insulator, makes between the second side of insulator and bottom having an accommodation space.

Aforesaid circuit board, wherein circuit board also has the conductive layer of one deck at least, and this conductive layer is arranged on the not surface, conducting wire of insulated body coating.

Aforesaid circuit board, wherein second width of the bottom of conducting wire is wideer than first width on top, a part that makes bottom second upper surface not with top first lower surface engages, at least a portion of this bottom can be extended at the insulator second surface.

Aforesaid circuit board, wherein circuit board also includes one the 3rd insulator, and the 3rd insulator has side, first surface and corresponding second surface at least, and the second surface of the 3rd insulator engages with the first surface or the second surface of circuit board insulator.

Aforesaid circuit board, wherein circuit board more includes one second conducting wire, and the 3rd insulator includes a hole especially, and this hole makes the part of conducting wire be exposed to this hole outside; This second conducting wire is arranged on the 3rd insulator first surface and borrows this hole to engage with the conducting wire.

Aforesaid circuit board, wherein circuit board also includes a hole.

Aforesaid circuit board, wherein circuit board also includes a chip, this chip has first surface, second surface, conducting end and side, wherein, conducting end is arranged on this chip first surface, and makes at least a portion insulated body coating of sides of chip and be not exposed to insulator exterior, in view of the above, make chip be embedded in the insulator, and the chip first surface is exposed to insulator exterior.

Aforesaid circuit board, wherein circuit board also includes an electrical transmission line, and this electrical transmission line is embodied as conductor wire or conductive paste, and the two ends of this electrical transmission line combine with chip conducting end and conducting wire respectively.

Aforesaid circuit board, wherein circuit board also includes a hole, chip and viscose, this viscose is arranged in the circuit board hole, and this chip is arranged in the circuit board hole, chip has first surface, second surface, conducting end and side, wherein, conducting end is arranged on first surface, and sides of chip is borrowed viscose and engaged with insulator.

Circuit board of the present invention is:

A kind of circuit board is characterized in that, comprising: an insulator, this insulator have side, first surface and corresponding second surface; One conducting wire, this conducting wire has first side, first upper surface and corresponding first lower surface, wherein, first side, conducting wire insulated body coats and is not exposed to insulator exterior, make this conducting wire be embedded in this insulator, and make conducting wire first upper surface be exposed to insulator first surface outside; At least one conductive layer, this conductive layer are arranged on not conducting wire first upper surface of insulated body coating; One chip, this chip has first surface, second surface, conducting end and side, wherein, conducting end is arranged on first surface, this sides of chip insulated body coats and is not exposed to insulator exterior, make this chip be embedded in this insulator, and make the adjacent setting of chip, and the chip first surface is exposed to insulator first surface outside with the conducting wire.

Aforesaid circuit board, wherein circuit board also includes one the 3rd insulator, and the 3rd insulator has side, first surface and corresponding second surface at least, and the second surface of the 3rd insulator engages with the first surface of circuit board insulator.

Aforesaid circuit board, wherein circuit board more includes one second conducting wire, and the 3rd insulator more includes a hole, the hole of the 3rd insulator makes the part of conducting wire be exposed to the 3rd insulator hole outside, simultaneously, this second conducting wire is arranged on the 3rd insulator first surface and borrows the 3rd insulator hole to engage with the conducting wire.

The invention has the beneficial effects as follows, provide a structure that the conducting wire side is coated by the circuit board insulator, make the thickness of circuit board be able to thinner because of the thickness that does not include the conducting wire, and can be again in conjunction with the chip of semiconductor in circuit board of the present invention, make the side of chip be coated by the insulator of circuit board, make the thickness of circuit board thicker, and then make the thickness of packaging housing be able to the thinner use that is beneficial to industry because of the thickness that does not include chip.

Description of drawings

The present invention is further described below in conjunction with drawings and Examples.

Figure 1A is the vertical view of circuit board of the present invention;

Figure 1B～Fig. 1 D is three kinds of cutaway views that circuit board of the present invention forms along the cutting of Figure 1A circuit board center line;

Fig. 2 A is the vertical view of circuit board of the present invention;

Fig. 2 B is the cutaway view that circuit board of the present invention cuts into along Fig. 2 A circuit board center line;

Fig. 3～Fig. 5 is the cutaway view of circuit board of the present invention;

Fig. 6～Fig. 7 is the cutaway view that circuit board conductive wire of the present invention has conductive layer;

Fig. 8～Figure 10 is the cutaway view that circuit board of the present invention is coated by the 3rd insulator;

Figure 11～Figure 12 is the cutaway view that circuit board of the present invention has a chip;

Figure 13～Figure 14 is the cutaway view that circuit board of the present invention has chip and electrical transmission line;

Figure 15 is the cutaway view of circuit board of the present invention in conjunction with carrier;

Figure 16 is the cutaway view of existing semi-conductive packaging housing and circuit board thereof.

The number in the figure explanation:

10 packaging bodies, 15 protective layers

16 first surfaces, 17 second surfaces

19 holes, 20 chips

21 first surfaces, 22 second surfaces

23 conducting end, 24 sides

30 carriers, 31 first surfaces

32 second surfaces, 39 holes

40 insulators, 41,46 first surfaces

42,47 second surfaces, 44,48 sides

43 holes 45 the 3rd insulator

49 accommodation space 4A, first insulator

4B

second insulator

5,50,55 circuit boards

58 holes, 60 electrical transmission lines

68 electrical transmission line 69 another electrical transmission lines

70,71 tops, 7 conducting wires

711 first upper surfaces, 712 first lower surfaces

72 bottoms, 714 first sides

721 second upper surfaces, 722 second lower surfaces

724 second sides 732 the 3rd lower surface

734 the 3rd sides, 75 second conducting wires

The 7A first upper surface 7B first lower surface

7C side 7K conductive path

81 first surfaces, 82 second surfaces

80 viscoses, 91 first conductive layers

92 second

conductive layers

100,1A packaging housing

The CL center line Hd degree of depth

Hp height L71 first length

The L72 second length W71 first width

The W72 second width Ta, Tp thickness

T5, T7, T10, T20, T40, T50, T70 thickness

Embodiment

Following Figure 1A～circuit board shown in Figure 14 is the position that the conducting wire is set by change, in order to reduce the structure of circuit board thickness, is described as follows:

Shown in Figure 1A～Fig. 1 D, be the vertical view and the cutaway view of circuit board 50 basic structures of the present invention, wherein, Figure 1A is a vertical view, and Figure 1B～Fig. 1 D is the structure cutaway view of three kinds of shapes forming along the cutting of the centre line C L of Figure 1A circuit board 50, wherein, conducting wire 70 features shown in Figure 1A～Fig. 1 D are: this conducting wire 70 is made up of a top 71 and a bottom 72, and make this top 71 and bottom 72 for piling up setting, and top 71 and bottom 72 are electrical communication each other, so, make the part of 70 tops 71, conducting wire and bottom 72 lay respectively at insulator 40 first surfaces 41 and second surface 42, in order to external electric connection, in view of the above, circuit board 50 does not need as shown in figure 16 conductive path 7K just can make to lay respectively at insulator 40 first, second surface 41,42 conducting wire 70 electrical communication, and the equipment and the cost of manufacture of producing conductive path 7K need not arranged, the cost of circuit board 50 is minimized, simultaneously, because of conducting wire 70 is to be made by a metal material, making this top 71 is integrally formed (Unitary) with bottom 72, so 72 zones that are engaged with each other in 70 tops 71, conducting wire and bottom can not produce an interface (Interface), in view of the above, conducting wire 70 just can be not to have the reliability that the interface reduces product because of top 71 and 72 of bottoms, because, in the process of making the conducting wire, if will be when being bonded together with two metal materials (also being exactly top 71 and bottom 72) in the mode of piling up (Build up), have the risk that is subjected to chemical contamination or burning at the interface of two metal bond, and then cause the be full of cracks (Crack) at interface or impedance (Impedance) to increase, therefore, cause the damage or the reliability (Reliability) of circuit board to reduce easily, simultaneously, insulator 40 also is integrally formed (Unitary), so the inside of insulator 40 just can not produce an interface, in view of the above, insulator 40 just can not produce the phenomenon of peeling off (Peel off) because of this interface, and cause the damage of circuit board 50, be described in detail as follows:

At first, shown in Figure 1A and Figure 1B, include: an insulator 40, insulator 40 is a kind of megohmite insulants, be to be embodied as epoxy resin (Epoxy) or pottery or resin (Resin) or anti-welding lacquer (Solder mask) or poly-argon acid amides (Polyimide) or other megohmite insulant that is suitable for, this insulator 40 has side 44, first surface 41 and corresponding second surface 42; One conducting wire 70, conducting wire 70 is to be made by conductor, it is to be the metal that main material or other are suitable for copper or aluminium that this conductor can be embodied as, this conducting wire 70 is made up of a top 71 and a bottom 72, this top 71 has first side 714, first width W 71, first length L 71, first upper surface 711 and corresponding first lower surface 712, these top 71 first upper surfaces 711 also can be embodied as first upper surface of this conducting wire 70, this bottom 72 has second side 724, second width W 72, second length L 72, second upper surface 721 and corresponding second lower surface 722, these bottom 72 second lower surfaces 722 also can be embodied as second lower surface of this conducting wire 70, wherein, top 71 is to borrow the part of first lower surface 712 to engage with at least a portion of bottom 72 second upper surfaces 721, in view of the above, this bottom 72 is exactly to pile up with top 71 to combine, and make this conducting wire 70 become integrally formed (Unitary) conductor, this insulator 40 coats this conducting wire 70 (top 71 and bottom 72), make this conducting wire 70 be embedded in this insulator 70, wherein, make this insulator 40 coat the part of top 71 first lower surfaces 712 and the part of first side 714 at least, and make first upper surface 711 not insulated body coat and be exposed to insulator 40 first surfaces 41 outsides, simultaneously, first length L 71 on top 71 is longer than second length L 72 of bottom 72, make the part of top 71 first lower surfaces 712 not engage with bottom 72, the at least a portion on this top 71 can be extended at insulator 40 first surfaces 41,71 can extend at insulator 40 first surfaces 41 by top, make circuit board 50 have more practicality, and the part of this first side 714 also can be on demand, and insulated body 40 does not coat and is exposed to side 44 outsides of insulator 40; Except above-mentioned feature, and make this insulator 40 coat second upper surface 721 and the second side 724 of bottom 72 at least, and make second lower surface 722 not insulated body 40 coat and be exposed to insulator 40 second surfaces 42 outsides, wherein, because this insulator 40 more coats second upper surface 721 and the second side 724 of bottom 72, and make second lower surface 722 not insulated body 40 coat and be exposed to insulator 40 second surfaces 42 outsides, wherein, because second upper surface 721 of 70 bottoms 72, conducting wire also insulated body 40 coats, the area that makes conducting wire 70 insulated bodys 40 coat is increased, make conducting wire 70 insulated bodys 40 coat more firmly, therefore, the problem that can avoid conducting wire 70 to peel off more from insulator 40, and can improve the quality reliability of circuit board 50, simultaneously, conducting wire 70 first upper surfaces 711 and second lower surface 722 do not protrude respectively and flush first surface 41 or second surface 42 in insulator 40, and bottom 72 second width W 72 of conducting wire 70 are wideer than top 71 first width W 71, make the part of bottom 72 second upper surfaces 721 not engage with top 71, make at least a portion of this bottom 72 extend at insulator 40 second surfaces 42,72 can extend at insulator 40 second surfaces 42 by the bottom, make circuit board 50 have more practicality; With regard to circuit board 50 thickness T 50, because of conducting wire 70 insulated bodys 40 coat, make circuit board 50 identical with insulator 40 thickness T 40 because of not containing conducting wire 70 thickness T 70, in view of the above, conducting wire 70 thickness T 70 just treat as into " zero " thickness, make circuit board 50 thickness T 50 be reduced to the thinnest, to be satisfied with light, thin, short, the little development trend of product.

Shown in Figure 1A and Fig. 1 C, the feature of Figure 1A and Fig. 1 C and explanation all to Figure 1A similar to shown in Figure 1B, its difference is as follows: 70 bottoms, conducting wire, 72 second lower surfaces 722 shown in Fig. 1 C are to protrude from insulator 40 second surfaces 42 1 height H p on demand, a part that makes conducting wire 70 second lower surfaces 722 and second side 724 not insulated body 40 coats and is exposed to insulator 40 second surfaces 42, make circuit board 50 can borrow the part lifting of this protrusion and the bonding area of tin cream (Solder paste) or tin ball (Solder hall) or other conductive materials, in order to promote the bond quality of circuit board 50 and tin cream etc.; In like manner, 70 tops, conducting wire, 71 first upper surfaces 711 also can protrude from insulator 40 first surfaces 41 1 height (not illustrating) on demand, a part that makes conducting wire 70 first upper surfaces 711 and first side 714 not insulated body 40 coats and is exposed to insulator 40 first surfaces 41 outsides, in order to promote the bond quality of circuit board 50 and tin cream etc.

Shown in Figure 1A and Fig. 1 D, the feature of Figure 1A and Fig. 1 D and explanation all to Figure 1A similar to shown in Figure 1B, its difference is as follows: conducting wire 70 second lower surfaces 722 shown in Fig. 1 D are not protrude on demand and be depressed in insulator 40 second surfaces 42 1 depth H d, circuit board 50 can borrow the depth H d of depression be provided with again the conductive layer of one deck (Conductive layer) at least in the conducting wire 70 surface (consulting the explanation of Fig. 7), in order to promote the quality that engages of circuit board 50 and electrical transmission line (consulting the label " 60 " of Figure 13) or tin cream etc.

Shown in Fig. 2 A～Fig. 2 B, be the vertical view and the cutaway view of circuit board 50, wherein Fig. 2 A is a vertical view, and Fig. 2 B is a kind of cutaway view that forms along the cutting of Fig. 2 A centre line C L, include: an insulator 40, this insulator 40 has side 44, first surface 41 and corresponding second surface 42; One conducting wire 70, this conducting wire 70 is made up of a top 71 and a bottom 72, this top 71 has first side 714, first width W 71, first length L 71, first upper surface 711 and corresponding first lower surface 712, these top 71 first upper surfaces 711 also can be embodied as first upper surface of this conducting wire 70, this bottom 72 has second side 724, second width W 72, second length L 72, second upper surface 721 and second lower surface 722, these bottom 72 second lower surfaces 722 also can be embodied as second lower surface of this conducting wire 70, wherein, top 71 is to borrow the part of first lower surface 712 to engage with at least a portion of bottom 72 second upper surfaces 721, in view of the above, this bottom 72 is exactly to pile up with top 71 to combine, and make this conducting wire 70 become integrally formed (Unitary) conductor, this insulator 40 coats this conducting wire 70, make this conducting wire 70 be embedded in this insulator 70, wherein, this insulator 40 coats the part of top 71 first lower surfaces 712 and the part of first side 714 at least, and make first upper surface 711 not insulated body coat and be exposed to insulator 40 first surfaces 41 outsides, simultaneously, first length L 71 on top 71 is longer than second length L 72 of bottom 72, make the part of top 71 first lower surfaces 712 not engage with bottom 72, the at least a portion on this top 71 can be extended at insulator 40 first surfaces 41,71 can extend at insulator 40 first surfaces 41 by top, make circuit board 50 have more practicality; Except above-mentioned feature, this insulator 40 coats second side 724 especially, and make second lower surface 722 not insulated body 40 coat and be exposed to insulator 40 second surfaces 42 outsides, wherein, first upper surface 711, second lower surface 722 do not protrude and are depressed in first surface 41, the second surface 42 1 depth H d of insulator 40 respectively, make circuit board 50 can borrow conductive layer that the depth H d of depression be provided with one deck at least again in the conducting wire 70 surface (consulting the explanation of Fig. 7), in order to promote the bond quality of circuit board 50.

As shown in Figure 3, it is the circuit board 50 that develops based on Figure 1B, the feature of this circuit board 50 and explanation are all similar to the circuit board 50 shown in Figure 1B, its difference is as follows: the bottom 72 of conducting wire 70 shown in Figure 3 is to have the 3rd lower surface 732 and the 3rd side 734 on demand, and the 3rd lower surface 732 and the 3rd side 734 are between the second side 724 and second lower surface 722, wherein, the 3rd lower surface 732, the 3rd side 734 is neither to be engaged with insulator 40 and exposes in insulator 40 outsides, in view of the above, make and have an accommodation space 49 usefulness between insulator 40 and bottom 72 the 3rd side 734 for tin cream or conductive layer or other material that is suitable for are set, make conducting wire 70 borrow the bonding area of the 3rd side 734 liftings, in order to promote the quality reliability of circuit board 50 with other material.

As shown in Figure 4, it is the circuit board 50 that develops based on Figure 1B, the feature of this circuit board 50 and explanation are all similar to the circuit board 50 shown in Figure 1B, its difference is as follows: 70 tops 71, conducting wire shown in Figure 4 have one the 3rd lower surface 732, the 3rd lower surface 732 is between top 71 first

lower surfaces

712 and 72 second sides 724, bottom, and top 71 the 3rd

lower surface

732,72 second sides 724, bottom are neither to be engaged with insulator 40 and exposes in insulator 40 outsides, in view of the above, make and have an accommodation space 49 usefulness between

insulator

40 and 72 second sides 724, bottom for tin cream or conductive layer or other material usefulness is set, circuit board 50 can be borrowed the bonding area of second side 724 liftings with other material, in order to promote the bond quality of circuit board 50.

As shown in Figure 5, it is the circuit board 50 that develops based on Fig. 1 D, the feature of this circuit board 50 and explanation are all similar to the circuit board 50 shown in Fig. 1 D, first difference shown in Figure 5 is: conducting wire 70 second lower surfaces, 722 insulated bodys 40 of circuit board 50 coat, and are not exposed to insulator 40 outsides; And second difference is: the insulator 40 of circuit board 50 is made up of the first insulator 4A and the second insulator 4B, this insulator 40 also is to have first surface 41, second surface 42 and side 44, wherein, the first insulator 4A and the second insulator 4B pile up and are bonded together, 71 first sides 714, this first insulator 4A coated with conductive circuit 70 tops, and first lower surface 712 on the second insulator 4B coated with conductive circuit, 70 tops 71,72 second sides 724, bottom and bottom 72 second lower surfaces 722, and can make first on demand, the second insulator 4A, 4B is made up of the insulating material of identical or different thermal coefficient of expansion (Coefficient of thermal expansion), sticks up (Warpage) problem and promotes the quality reliability in order to the song that improves circuit board 50; And also insulated body 40 coatings on demand of these conducting wire 70 first upper surfaces 711, and be not exposed to insulator 40 first surfaces, 41 outsides (not illustrating).

Learn by Figure 1A～Fig. 5 is described: circuit board 50 of the present invention can be on demand, make conducting wire 70 first upper surfaces 711 or second lower surface 722 exposed or be not exposed to insulator 40 first surfaces 41 or second surface 42, also can make conducting wire 70 first upper surfaces 711 or second lower surface 722 protrude on demand or do not protrude from insulator 40 first surfaces 41 or second surface 42; In addition, also can make each circuit board 50 combine, make circuit board 50 be applied even more extensively in electronic industry, enumerate the sectional views of Fig. 6～Figure 15 embodiment now to reach practical effect with anti-welding lacquer or other object such as conductive layer or chip:

As shown in Figure 6, it is the circuit board 50 that develops based on Fig. 1 C, the feature of this circuit board 50 and explanation are all similar to the circuit board 50 shown in Fig. 1 C, its difference is as follows: circuit board 50 shown in Figure 6 also includes a conductive layer, this conductive layer is embodied as first conductive layer 91, this first conductive layer 91 is embodied as nickel or copper or palladium or silver or other suitable conductive materials, in order to the bond strength of lifting with other conductive materials (as: nickel or gold or silver or copper or palladium or tin etc.), this first conductive layer 91 is separately positioned on the not surface of the conducting wire 70 of insulated body 40 coatings, just conducting wire 70 first upper surfaces 711, the part of second lower surface 722 and second side 724; Learn by above-mentioned explanation: expose part so long as conducting wire 70 is not subjected to insulator 40 coatings in insulator 40 outsides, at least the conductive layer of one deck all can be set, simultaneously, this conductive layer is with after conducting wire 70 combines, make conductive layer also can be considered as the part of conducting wire 70 on demand, make conducting wire 70 not form by conductive layer respectively on 70 surfaces, conducting wire of insulated body 40 coatings.

As shown in Figure 7, it is the circuit board 50 that develops based on Fig. 2 B, the feature of this circuit board 50 and explanation are all as follows to circuit board 50 similar its differences shown in Fig. 2 B: circuit board 50 shown in Figure 7 has more comprised 2 first conductive layers 91 and 2 second conductive layers 92, each first conductive layer 91 and each second conductive layer 92 pile up first upper surface 711 and bottom 72 second lower surfaces 722 on 70 tops 71, conducting wire that are arranged on not insulated body 40 coatings respectively, wherein, each first conductive layer 91 engages with first upper surface 711 on 70 tops 71, conducting wire and second lower surface 722 of bottom 72 respectively, each second conductive layer 92 engages and is exposed to insulator 40 outsides with first conductive layer 91 respectively simultaneously, use in order to the connection of power supply property, wherein, because of first, second conductive layer 91,92 are arranged on 70 surfaces, conducting wire that are depressed in insulator 40, make the side (not indicating) of each conductive layer engage with insulator 40, and then increase the bonding area and the bond strength of each conductive layer and insulator 40, to avoid first, second conductive layer 91,92 peel off from insulator 40, in view of the above, not only need not to increase the thickness of circuit board 50, and can also promote the quality of circuit board 50.

As shown in Figure 8, it is the circuit board 50 that develops based on Fig. 1 D, the feature of this circuit board 50 and explanation are all similar to the circuit board 50 shown in Fig. 1 D, its first difference is as follows: circuit board 50 shown in Figure 8 more includes one the 3rd insulator 45, the 3rd insulator 45 has side 48, first surface 46 and corresponding second surface 47, the second surface 47 of the 3rd insulator 45 engages with insulator 40 first surfaces 41, wherein, conducting wire 70 first surfaces 711 have at least a part not coated by the 3rd insulator 45, be arranged on insulator 40 first surfaces 41 by the 3rd insulator 45, can prevent circuit board 50 to be subjected to external force collision and cause damage, simultaneously, can also prevent that external conductive materials from causing 70 the electrical short circuits in conducting wire (Short); Second difference is as follows: this circuit board 50 shown in Figure 8 more includes a hole 58, and this hole 58 can be for chip or other object that is fit to usefulness are set.

As shown in Figure 9, it is the circuit board 50 that develops based on Fig. 1 D, the feature of this circuit board 50 and explanation all 50 similar (consulting Fig. 1 D illustrates) to the circuit board shown in Fig. 1 D, this circuit board shown in Figure 9 50 more includes: one the 3rd insulator 45, the 3rd insulator 45 has side 48, hole 43, first surface 46 and corresponding second surface 47, the second surface 47 of the 3rd insulator 45 is to engage with insulator 40 first surfaces 41, wherein, 70 tops, conducting wire, 71 first surfaces 711 have at least a part not coated by the 3rd insulator 45 and are exposed to hole 43 outsides, and the connection of power supply property is used; One second conducting wire 75, second conducting wire 75 is to be provided as rewiring (Re-layout) on demand to use, this second conducting wire 75 is arranged on the 3rd insulator 45 first surfaces 46, and engage with these 70 tops, conducting wire, 71 first surfaces 711 by the 3rd insulator 45 holes 43, make this second conducting wire 75 and this conducting wire 70 can electrical communication; One protective layer 15, this protective layer 15 is a kind of megohmite insulants, it is to be embodied as epoxy resin or resin or anti-welding lacquer or other megohmite insulant that is suitable for, and have first surface 16, corresponding second surface 17 and a hole 19, these protective layer 15 second surfaces 17 are to engage with the 3rd insulator 45 first surfaces 46, and coat the part of second conducting wire 75, wherein second conducting wire 75 not the part that coats of protected seam 15 be exposed to protective layer 15 holes 19 outsides, use for externally electrically connecting; Learn by above-mentioned explanation, also be provided with second conducting wire 75, must make circuit board 50 be used by industry widely, to reach handy, practical effect by circuit board 50.

As shown in figure 10, it is the circuit board 50 that develops based on Fig. 1 D, the feature of this circuit board 50 and explanation all 50 similar (consulting Fig. 1 D illustrates) to the circuit board shown in Fig. 1 D, this circuit board shown in Figure 10 50 more includes: 2 the 3rd insulators 45, each the 3rd insulator 45 is separately positioned on the first surface 41 and the second surface 42 of insulator 40, wherein, the 3rd insulator 45 that is arranged on insulator 40 second surfaces 42 includes a hole 43, this hole 43 makes at least a portion of 70 bottoms, conducting wire, 72 second lower surfaces 722 do not coated by the 3rd insulator 45 and is exposed to the 3rd insulator 45 outsides, and the connection of power supply property is used; Learn by above-mentioned explanation, borrow the 3rd insulator 45 to be arranged on first,

second surface

41,42 of insulator 40, circuit board 50 can more flexiblely be used.

As shown in figure 11, be to serve as object relatively with existing circuit board 5 shown in Figure 16, progressive effect so as to explanation circuit board 50 of the present invention, wherein, Figure 11 all is embodied as identical with the thickness of insulator, chip and conducting wire shown in Figure 16, the circuit board 50 of this Figure 11 includes: an insulator 40, insulator 40 have side 44, first surface 41 and corresponding second surface 42; One conducting wire 70, this conducting wire 70 has first side 714, first upper surface 711 and corresponding first lower surface 712, wherein, 70 first sides, conducting wire, 714 insulated bodys 40 coat and are not exposed to insulator 40 outsides, make this conducting wire 70 be embedded in this insulator 40, and make conducting wire 70 first upper surfaces 711 exposed and do not protrude from insulator 40 first surfaces 41 outsides; One conductive layer, this conductive layer is embodied as first conductive layer 91, this first conductive layer 91 is arranged on not 70 surfaces, conducting wire (conducting wire 70 first upper surfaces 711 just) of insulated body 40 coatings, these first conductive layer, 91 sides (not label) are that insulated body 40 coats and is not exposed to this insulator 40 outsides, in view of the above, make this circuit board 50 can not increase the thickness of this circuit board 50 because being provided with this first conductive layer 91, use in order to industry, wherein, this first conductive layer 91 makes this conducting wire 70 be easy to be electrically connected with electrical transmission line conductive materials such as (consulting the label " 68 " of Figure 12), and can promote itself and extraneous bond quality; And this first conductive layer 91 also can be on demand not insulated body 40 coat and (consult shown in Figure 6 this and be positioned at first conductive layer 91 of conducting wire 70 first upper surfaces 711, wherein, this first conductive layer 91 not insulated body 40 coats, and conducting wire 70 first upper surfaces 711 flush in insulator 40 first surfaces 41); One chip 20, chip 20 has first surface 21, second surface 22, conducting end 23 and side 24, wherein, conducting end 23 is arranged on first surface 21, this chip 20 sides 24 insulated bodys 40 coat and are not exposed to insulator 40 outsides, make chip 20 be embedded in the insulator 40, and chip 20 first surfaces 21 are exposed and do not protrude from insulator 40 first surfaces 41 outsides, and make chip 20 and conducting wire 70 adjacent settings; Circuit board 50 shown in Figure 11, because of conducting wire 70 and chip 20 all are embedded in the insulator 40, make chip 20 thickness T 20 and conducting wire 70 thickness T 70 can be regarded as " zero " thickness 50 li of circuit boards, make the thickness T 50 of circuit board 50 equal the thickness T 40 of insulator 40, in view of the above, the thickness T 50 that makes circuit board 50 can be because of the thickness T 20 that includes chip 20 and conducting wire 70 thickness T 70 and is thicker, and make circuit board 50 thickness T 50 of Figure 11 thinner than circuit board 5 thickness T 5 of Figure 16, make this circuit board 50 be used by industry more easily; Except above-mentioned feature, these chip shown in Figure 11 20 second surfaces 22 insulated body 40 on demand coat and are not exposed to insulator 40 second surfaces 42 outsides, and these chip 20 second surfaces 22 also can be on demand not insulated body 40 coat and be exposed to insulator 40 second surfaces 42 outsides.

As shown in figure 12, it is the circuit board 55 that develops based on the circuit board 50 of Figure 11, the feature of this circuit board 55 and explanation all to circuit board shown in Figure 11 50 similar (consulting Figure 11 illustrates), wherein, circuit board 55 more includes: an electrical transmission line 68, electrically transmission line 68 is that a kind of conductive paste (Paste) can be embodied as the pasty masses with copper or aluminium or other suitable metal, and conductive paste through after being heating and curing can with insulator 40, conducting wire 70, first conductive layer 91, chip 20 waits other material to be bonded together, the two ends of this electrical transmission line 68 engage with first conductive layer 91 on chip 20 conducting end 23 and the conducting wire 70 respectively, make chip 20 conducting end 23 and conducting wire 70 electrical communication, wherein, electrically transmission line 68 is: bind from itself and chip 20 first surfaces 21 conducting end 23, then, after being bonding on insulator 40 first surfaces 41 again, last first conductive layer 91 that is bonding on again on 70 first upper surfaces 711 of conducting wire, simultaneously, electrically transmission line 68 can be replaced (label " 60 " of consulting Figure 13 illustrates) with a kind of conductor wire (Wire) on demand; One the 3rd insulator 45, the 3rd insulator 45 is arranged on circuit board 50 insulators 40 first surfaces 41, and first conductive layer, 91, the three insulators 45 on coating chip 20 first surfaces 21, electrical transmission line 68 and conducting wire 70 first upper surfaces 711 have side 48, first surface 46 and corresponding second surface 47; As shown in the above description, in conjunction with other object (this example is: electrical transmission line 68, the 3rd insulator 45) circuit board 55 can be used widely, and can be on demand at the 3rd insulator 45 first surfaces 46 or insulator 40 second surfaces 42 of circuit board 55, in conjunction with other insulator or conducting wire, make the circuit board (consult Figure 13 explanation) of circuit board 55 again for having the multilayer conductive circuit.

As shown in figure 13, it is the circuit board 55 that develops based on the circuit board 50 of Fig. 9, the feature of this circuit board 55 and explanation all to circuit board shown in Figure 9 50 similar (consulting Fig. 9 illustrates), wherein, circuit board 55 includes especially: a chip 20, chip 20 has side 24, first surface 21 and corresponding second surface 22, wherein, first surface 21 has conducting end 23 and uses in order to the connection of power supply property, these chip 20 sides 24 insulated bodys 40 coat and are embedded in the insulator 40, and make chip 20 and conducting wire 70 be adjacent setting, and make chip 20 first surfaces 21 be exposed to insulator 40 first surfaces 41; 2 first conductive layers 91, each first conductive layer was arranged on not 70 surfaces, conducting wire (just conducting wire 70 first upper surfaces 711 and second lower surface 722) of insulated body 40 coatings in 91 minutes, the thickness of common first conductive layer 91 is not more than 10 microns, so, first conductive layer 91 can be considered as the part of conducting wire 70, make first upper surface 711 or second lower surface 722 of conducting wire 70 just can form by first conductive layer 91 on demand, use in order to the connection of power supply property; One electrical transmission line 60, this electrical transmission line 60 is to be embodied as the metal conductive wire that gold or silver or copper or aluminium etc. are suitable for, electrically the two ends of transmission line 60 engage with chip 20 conducting end 23 and first conductive layer 91 that is positioned at conducting wire 70 first upper surfaces 711 respectively, make chip 20 conducting end 23 and conducting wire 70 electrical communication; Learn by above-mentioned explanation: in circuit board 55, make circuit board 55 be more conducive to use because of having chip 20 in conjunction with chip 20 and electrical transmission line 60; Simultaneously, be to be exposed to insulator 40 outsides because of circuit board 55 conducting wires 70 have a part (conducting wire 70 second lower surfaces 722) at least, for externally being electrically connected, in view of the above, circuit board 55 can also be regarded as a packaging housing (Package).

As shown in figure 14, it is the circuit board 55 that develops based on the circuit board 50 of Fig. 8, the feature of this circuit board 55 and explanation all to circuit board shown in Figure 8 50 similar (consulting Fig. 8 illustrates), wherein, circuit board 55 includes especially: a viscose 80, viscose 80 has first surface 81 and second surface 82, and this viscose 80 is arranged in circuit board 55 holes 58; One chip 20, the structure of chip 20 and feature and chip 20 identical (consulting Figure 11 explanation) shown in Figure 11, this chip 20 is arranged in circuit board 58 holes 58, and chip 20 sides 24 are to engage with insulator 40 by means of viscose 80, chip 20 sides 24 are coated by viscose 80 and be not exposed to insulator 40 outsides, in view of the above, make the thickness of circuit board 55 not comprise the thickness of chip 20 sides 24 and be minimized, simultaneously, make chip 20 first surfaces 21 be exposed to insulator 40 first surfaces 41 outsides, use in order to the connection of power supply property; 2 first conductive layers 91, each first conductive layer was arranged on not 70 surfaces, conducting wire (just conducting wire 70 first upper surfaces 711 and second lower surface 722) of insulated body 40 coatings in 91 minutes, the thickness of common first conductive layer 91 is not more than 10 microns, so, first conductive layer 91 can be considered as the part of conducting wire 70, making first upper surface 711 of conducting wire 70 or second lower surface 722 is exactly that first conductive layer 91 is used in order to the connection of power supply property; One electrical transmission line 60, the two ends of this electrical transmission line 60 engage with chip 20 conducting end 23 and conducting wire 70 first upper surfaces 711 respectively, make chip 20 conducting end 23 and conducting wire 70 electrical communication; One the 3rd insulator 45, it has first surface 46, second surface 47, perforate 43 and side 48, the 3rd insulator 45 second surfaces 47 engage with insulator 40 first surfaces 41, and coat the part of electrical transmission line 60, chip 20, viscose 80 and 70 tops, conducting wire, 71 first upper surfaces 711, and make conducting wire 70 first upper surfaces 711 be not exposed to the 3rd insulator 45 perforates 43 outsides, use for externally electrically connecting by the part that the 3rd insulator 45 coats; Learn by above-mentioned explanation: in conjunction with chip 20 and electrical transmission line 60 in circuit board 55, circuit board 55 is used because of having chip 20 industry that is more conducive to, simultaneously, because of having a part at least, circuit board 55 conducting wires 70 are exposed to insulator 40 outsides, what make chip electrically is transferred to circuit board 55 outsides, in view of the above, circuit board 55 can also be regarded as a packaging housing; Except above-mentioned feature, these chip shown in Figure 14 20 second surfaces 22 are to be coated by viscose 80 on demand and be not exposed to viscose 80 second surfaces 82 outsides, and these chip 20 second surfaces 22 also can not coated by viscose 80 on demand and be exposed to viscose 80 second surfaces 82 outsides.

As shown in figure 15, it is circuit board 50 based on Figure 11, a packaging housing 100 that combines the back again with a carrier and form, this carrier may be embodied as following object: support (Lead frame), chip or various circuit board or other carriers that is suitable for, this packaging housing 100 includes: a carrier 30, this carrier is embodied as support, and this carrier 30 has hole 39, first surface 31 and corresponding second surface 32; One circuit board 50, the structure of this circuit board 50 and feature are and the structure identical (consulting Figure 11 explanation) of circuit board shown in Figure 11 50 that this circuit board 50 borrows the part of insulator 40 second surfaces 42 to be engaged in carrier 30 first surfaces 31; One electrical transmission line 60, the two ends of this electrical transmission line 60 are electrically connected with chip 20 and conducting wire 70 respectively; Another electrical transmission line 69, the two ends of this electrical transmission line 69 engage with first conductive layer 91 on support 30 first surfaces 31 and conducting wire 70 first upper surfaces 711 respectively, in view of the above, make the chip 20 must be by this electrical transmission line 60 and this another electrical transmission line 69 and support 30 electrical communication, wherein this electrical transmission line 60 and this another electrical transmission line 69 can be embodied as the suitable conductor wire of gold or copper or other on demand, to meet the demand of industry; One packaging body 10, the part of these packaging body 10 coating circuit plates 50, electrical transmission line 60, another electrical transmission line 69 and carrier 30, and make carrier 30 second surfaces 32 be exposed to packaging body 10 outsides; As shown in the above description: circuit board 50 can be a packaging housing 100 with other carrier be combined into, wherein, this circuit board 50 shown in Figure 15 also can replace on demand as Figure 13～circuit board 55 shown in Figure 14, and make conducting wire 70 second lower surfaces 722 of Figure 13～circuit board 55 shown in Figure 14 engage and electrical communication with carrier 30 by tin ball or conductive paste, make the use of circuit board 50,55 more extensive.

Above-mentioned each figure only is preferred embodiment of the present invention, when not limiting the scope of the present invention with this, example: each 70 bottoms, conducting wire, 72 second lower surface 722 shown in Figure 1A～Fig. 2 B, also insulated body 40 coats and is not exposed to insulator 40 surfaces on demand; As Figure 1A～shown in Figure 7, each circuit board 50 can be provided with the 3rd insulator 45 (consulting Fig. 8～Figure 10 explanation) or second conducting wire 75 and protective layer 15 (consulting Fig. 9 explanation) on demand again; As Figure 1A～each circuit board 50,55 shown in Figure 14, can be embodied as motherboard (Mother board) or be the circuit board of deflection (flexible), in order to being set, other object uses; As Figure 1A～shown in Figure 4, this insulator 40 also can be identical with insulator shown in Figure 5 40, is made up of one first insulator 4A and one second insulator 4B; As Figure 1A～Fig. 7 and Fig. 9～each circuit board 50 shown in Figure 10, can have as shown in Figure 8 a hole 58 on demand more respectively; As Figure 11～shown in Figure 15, chip 20 lower surfaces 22 are the surfaces that can be exposed to insulator 40 on demand; As Figure 12 and circuit board 55 shown in Figure 14, as shown in figure 13 second conducting wire 75 or protective layer 15 can be set on demand; As Fig. 6～shown in Figure 7, can set up at least one conductive layer again, make the conducting wire 70 of Fig. 6 have second conductive layer, the conducting wire 70 of Fig. 7 then has the 3rd conductive layer, and this first, second and third conductive layer can exchange on demand each other.

The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, every foundation technical spirit of the present invention all still belongs in the scope of technical solution of the present invention any simple modification, equivalent variations and modification that above embodiment did.

Claims

1. a circuit board is characterized in that, comprising:

One insulator, this insulator have side, first surface and corresponding second surface;

One conducting wire, this conducting wire is made up of a top and a bottom, this top has the first side, first width, first length, first upper surface and corresponding first lower surface, this top first upper surface also can be embodied as first upper surface of this conducting wire, this bottom has the second side, second width, second length, second upper surface and corresponding second lower surface, this bottom second lower surface also can be embodied as second lower surface of this conducting wire, wherein, top is to borrow the part of first lower surface to engage with at least a portion of bottom second upper surface, in view of the above, this bottom is exactly to pile up with top to combine, this insulator coats this conducting wire, make this conducting wire be embedded in this insulator, wherein, make this insulator coat the part of top first lower surface and the part of first side at least, and make first upper surface not insulated body coat and be exposed to insulator first surface outside, simultaneously, first length on top is longer than second length of bottom, a part that makes top first lower surface not with lower bond.

2. circuit board according to claim 1 is characterized in that, second upper surface of bottom, described conducting wire and second side insulated body coat, and the not insulated body coating of second lower surface of bottom.

3. circuit board according to claim 1 is characterized in that, second upper surface of bottom, described conducting wire, second lower surface and second side insulated body coat.

4. circuit board according to claim 2 is characterized in that, first upper surface on the top of described conducting wire or second lower surface of bottom are depressed in insulator surface or do not protrude from insulator surface.

5. circuit board according to claim 2 is characterized in that, the part of second side, described conducting wire or the part of first side not insulated body coat and be exposed to insulator exterior.

6. circuit board according to claim 1, it is characterized in that, top, described conducting wire has more one the 3rd lower surface, the 3rd lower surface is between top first lower surface and second side, bottom, and top the 3rd lower surface and second side, bottom are neither to be engaged with insulator, makes between the second side of insulator and bottom having an accommodation space.

7. circuit board according to claim 1 is characterized in that, described circuit board also has the conductive layer of one deck at least, and this conductive layer is arranged on the not surface, conducting wire of insulated body coating.

8. circuit board according to claim 2, it is characterized in that, second width of the bottom of described conducting wire is wideer than first width on top, a part that makes bottom second upper surface not with top first lower surface engages, at least a portion of this bottom can be extended at the insulator second surface.

9. circuit board according to claim 1, it is characterized in that, described circuit board also includes one the 3rd insulator, the 3rd insulator has side, first surface and corresponding second surface at least, and the second surface of the 3rd insulator engages with the first surface or the second surface of circuit board insulator.

10. circuit board according to claim 9 is characterized in that, described circuit board more includes one second conducting wire, and the 3rd insulator includes a hole especially, and this hole makes the part of conducting wire be exposed to this hole outside; This second conducting wire is arranged on the 3rd insulator first surface and borrows this hole to engage with the conducting wire.

11. circuit board according to claim 1 is characterized in that, described circuit board also includes a hole.

12. circuit board according to claim 7, it is characterized in that, described circuit board also includes a chip, this chip has first surface, second surface, conducting end and side, and wherein, conducting end is arranged on this chip first surface, and at least a portion insulated body that makes sides of chip coats and is not exposed to insulator exterior, in view of the above, make chip be embedded in the insulator, and the chip first surface is exposed to insulator exterior.

13. circuit board according to claim 12 is characterized in that, described circuit board also includes an electrical transmission line, and this electrical transmission line is embodied as conductor wire or conductive paste, and the two ends of this electrical transmission line combine with chip conducting end and conducting wire respectively.

14. circuit board according to claim 7, it is characterized in that, described circuit board also includes a hole, chip and viscose, this viscose is arranged in the circuit board hole, and this chip is arranged in the circuit board hole, and chip has first surface, second surface, conducting end and side, wherein, conducting end is arranged on first surface, and sides of chip is borrowed viscose and engaged with insulator.

15. circuit board according to claim 14 is characterized in that, described circuit board also includes an electrical transmission line, and this electrical transmission line is embodied as conductor wire or conductive paste, and the two ends of this electrical transmission line combine with chip conducting end and conducting wire respectively.

16. a circuit board is characterized in that, comprising:

One conducting wire, this conducting wire has first side, first upper surface and corresponding first lower surface, wherein, first side, conducting wire insulated body coats and is not exposed to insulator exterior, make this conducting wire be embedded in this insulator, and make conducting wire first upper surface be exposed to insulator first surface outside;

At least one conductive layer, this conductive layer are arranged on not conducting wire first upper surface of insulated body coating;

One chip, this chip has first surface, second surface, conducting end and side, wherein, conducting end is arranged on first surface, this sides of chip insulated body coats and is not exposed to insulator exterior, make this chip be embedded in this insulator, and make the adjacent setting of chip, and the chip first surface is exposed to insulator first surface outside with the conducting wire.

17. circuit board according to claim 16 is characterized in that, described circuit board also includes an electrical transmission line, and this electrical transmission line is embodied as conductor wire or conductive paste, and the two ends of this electrical transmission line combine with chip conducting end and conducting wire respectively.

18. circuit board according to claim 17, it is characterized in that, described circuit board also includes one the 3rd insulator, and the 3rd insulator has side, first surface and corresponding second surface at least, and the second surface of the 3rd insulator engages with the first surface of circuit board insulator.

19. circuit board according to claim 18, it is characterized in that, described circuit board more includes one second conducting wire, and the 3rd insulator more includes a hole, the hole of the 3rd insulator makes the part of conducting wire be exposed to the 3rd insulator hole outside, simultaneously, this second conducting wire is arranged on the 3rd insulator first surface and borrows the 3rd insulator hole to engage with the conducting wire.