CN201541392U

CN201541392U - Circuit board

Info

Publication number: CN201541392U
Application number: CN200920269229XU
Authority: CN
Inventors: 曹庆娟; 范文纲
Original assignee: Inventec Corp
Current assignee: Inventec Corp
Priority date: 2009-11-13
Filing date: 2009-11-13
Publication date: 2010-08-04
Anticipated expiration: 2019-11-13

Abstract

A circuit board comprises: a substrate body; a first weld pad and a second weld pad electrically connected with each other and installed on the surface of the substrate body, wherein the second weld pad is provided with a conductive through hole; and an insulated protective layer installed on the surface of the substrate body and installed between the first weld pad and the second weld pad so as to form a plurality of openings respectively exposed outside the first weld pad and the second weld pad. In the circuit board, the weld pad with the conductive through hole is isolated from other weld pad through the insulated protective layer so as to prevent the problem of solder flow due to different radiating efficiencies between the weld pads when reflowing, thereby preventing to drive electronic components connected on the weld pads to offset due to solder flow; thus, the circuit board is capable of efficiently reducing manufacturing cost and providing better reliability.

Description

Circuit board

Technical field

The utility model relates to a kind of circuit board, particularly relates to the circuit board that a kind of cost of manufacture is lower and reliability is higher.

Background technology

Flourish along with electronic industry, electronic product is also gradually to multi-functional, high performance direction research and development.For satisfying semiconductor package part high integration and microminiaturized package requirements, provide a plurality of masters, passive device and circuit to carry the circuit board that connects, also develop into multi-layer sheet by lamina gradually, thereby under limited space, enlarge available circuit area on the circuit board with user demand in response to the integrated circuit of high electron density by the interlayer interconnection technique.

The manufacturing of available circuit plate, be earlier to increase layer at two circuits that all form multilayer relatively on the surface of a loading plate, and outermost line layer has a plurality of weld pads, and increase at this circuit respectively on the outermost surface of layer and form welding resisting layer, and this welding resisting layer is formed with a plurality of welding resisting layer openings, order respectively this weld pad correspondence exposes to respectively this welding resisting layer opening, at last, engage (wire bond) so that electronic component is electrically connected to weld pad by surface adhering technology (SMT, Surface Mount Technology) or line.

Yet, existing circuit board electrically connects for two lip-deep relatively circuits with this loading plate increase layer, must form run through this loading plate two relatively the surface through hole, then, form conductive layer in this through-hole surfaces, then, on this conductive layer, form metal level, and in this through hole, form conductive through hole, owing to also need on this conductive through hole, to form the circuit layer reinforced structure afterwards, so the quality requirements for this conductive through hole is higher,, and then influence the cost of manufacture of final products so the method for making of the conductive through hole of planting will make that the making step of integrated circuit plate is too numerous and diverse.

Therefore, in view of the above-mentioned problems, how to avoid the method for making of conductive through hole of the prior art too numerous and diverse, and then cause the problems such as cost rising of product, the real problem that has become present anxious desire solution.

Summary of the invention

For solving the problem in the above-mentioned background technology, a purpose of the present utility model provides the lower circuit board of a kind of conductive through hole cost of manufacture.

For reaching above-mentioned and other purpose, the utility model provides a kind of circuit board, comprises substrate body, is located at first weld pad and second weld pad and the insulating protective layer on the surface of this substrate body, this first weld pad and second weld pad are electrically connected to each other, and have conductive through hole on this second weld pad; This insulating protective layer is located at the surface of this substrate body, and is located between this first weld pad and this second weld pad, to form a plurality of openings that expose this first weld pad and second weld pad respectively.

In an embodiment, the width of being located at the insulating protective layer of this first weld pad and second weld pad is 0.3 millimeter at circuit board of the present utility model, and this first weld pad can be for being connected to electronic component, and this first weld pad can connect for surface adhering technology (SMT).

In addition, circuit board of the present utility model also can comprise scolder, coats respectively on this first weld pad and second weld pad, and this scolder can be tin cream, and this insulating protective layer can be welding resisting layer or green lacquer.

Than prior art; circuit board of the present utility model is that conductive through hole is formed on the weld pad; and can lower cost of manufacture; and weld pad and other weld pads that will be formed with conductive through hole by insulating protective layer are isolated; cause the electronic component skew that is connected on the weld pad to prevent flow of solder material, so circuit board of the present utility model has lower production cost and the follow-up electronic component that is connected on the weld pad is had more accurate position and higher reliability is arranged.

Description of drawings

Fig. 1 is the schematic top plan view of an embodiment of circuit board of the present utility model;

Fig. 2 is the schematic top plan view of another embodiment of circuit board of the present utility model.

The component symbol simple declaration:

10 surfaces

11 weld pads

111 first weld pads

112 second weld pads

12 insulating protective layers

120 openings

13 conductive through holes

Embodiment

Below by particular specific embodiment execution mode of the present utility model is described, those skilled in the art can understand other advantages of the present utility model and effect easily by the content that this specification disclosed.

See also Fig. 1, it is the schematic top plan view of an embodiment of circuit board of the present utility model.

Have a plurality of weld pads 11 that are electrically connected to electronic component (not expression in graphic) in order to correspondence on one surface 10 of the circuit board of present embodiment; has insulating protective layer 12 in addition on this surface 10; this insulating protective layer 12 has a plurality of openings 120; order respectively these weld pad 11 correspondences exposes to respectively this opening 120; in addition; this weld pad 11 is provided with conductive through hole 13, and this conductive through hole 13 runs through circuit board and electrically connects the circuit layer reinforced structure of circuit board both sides (not expression in the drawings).

Above-mentioned circuit board is directly to form conductive through hole 13 on the weld pad 11 on the surface 10, owing to do not need on this conductive through hole 13, to form other structures, so the manufacture process requirement of this conductive through hole 13 is lower, so can reduce the integral manufacturing cost of circuit board.

Yet, need to form earlier scolder (not expression in the drawings) on this weld pad 11 to electrically connect and fixed electronic element, and because the radiating efficiency at these conductive through hole 13 places is higher, so scolder is mobile toward this conductive through hole 13 easily, and then the drive electronic component departs from original correct position.

See also Fig. 2, it is the schematic top plan view of another embodiment of circuit board of the present utility model.

The circuit board of present embodiment is roughly identical with a last embodiment; and main difference is that present embodiment is that original weld pad 11 is divided into first weld pad 111 and second weld pad 112 that is electrically connected to each other; order is this first weld pad 111 and second weld pad, 112 corresponding respectively these openings 120 that expose to respectively; this first weld pad 111 is for being connected to electronic component; this second weld pad 112 is for forming conductive through hole 13; therefore and separation is done with insulating protective layer 12 in the surface of this first weld pad 111 and second weld pad 112, can avoid the follow-up scolder (for example tin cream) that forms on this first weld pad 111 to be subjected to the influence of conductive through hole 13 and causes the offset of electronic component.

According to above-mentioned circuit board; the width of separating the insulating protective layer 12 of this first weld pad 111 and second weld pad 112 can be 0.3 millimeter (mm), and this first weld pad 111 can be for surface adhering technology (SMT) connection, and this insulating protective layer 12 can be welding resisting layer again; preferable, welding resisting layer can be green lacquer.

In sum; circuit board of the present utility model is that conductive through hole is formed on the weld pad; and can lower cost of manufacture; and weld pad and other weld pads that will be formed with conductive through hole by insulating protective layer are isolated; cause the electronic component skew that is connected on the weld pad to prevent flow of solder material, so circuit board of the present utility model has lower production cost and the follow-up electronic component that is connected on the weld pad is had more accurate position and higher reliability is arranged.

The foregoing description is in order to illustrative principle of the present utility model and effect thereof, but not is used to limit the utility model.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present utility model and category.Therefore rights protection scope of the present utility model should be foundation with the scope of claims of the present utility model.

Claims

1. a circuit board is characterized in that, this circuit board comprises:

Substrate body;

First weld pad and second weld pad are located at the surface of this substrate body, and are electrically connected to each other, and have conductive through hole on this second weld pad; And

Insulating protective layer is located at the surface of this substrate body, and is located between this first weld pad and this second weld pad, to form a plurality of openings that expose this first weld pad and second weld pad respectively.

2. circuit board according to claim 1 is characterized in that, the width of being located at the insulating protective layer of this first weld pad and second weld pad is 0.3 millimeter.

3. circuit board according to claim 1 is characterized in that, this first weld pad is for being connected to electronic component.

4. circuit board according to claim 1 is characterized in that, this first weld pad connects for the surface adhering technology.

5. circuit board according to claim 1 is characterized in that, also comprises scolder, coats respectively on this first weld pad and second weld pad.

6. circuit board according to claim 5 is characterized in that, this scolder is a tin cream.

7. circuit board according to claim 1 is characterized in that, this insulating protective layer is a welding resisting layer.

8. circuit board according to claim 7 is characterized in that, this welding resisting layer is green lacquer.