JP2013175659A - Multiple patterning wiring board - Google Patents

Multiple patterning wiring board Download PDF

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JP2013175659A
JP2013175659A JP2012040250A JP2012040250A JP2013175659A JP 2013175659 A JP2013175659 A JP 2013175659A JP 2012040250 A JP2012040250 A JP 2012040250A JP 2012040250 A JP2012040250 A JP 2012040250A JP 2013175659 A JP2013175659 A JP 2013175659A
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conductor pattern
wiring
conductor
wiring board
plating
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JP5956185B2 (en
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Yurie Onizuka
友里恵 鬼塚
Yosuke Moriyama
陽介 森山
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Kyocera Corp
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board which can reduce the difference in thickness between plating layers to be deposited on a plurality of conductor patterns having different sizes.SOLUTION: The multiple patterning wiring board has a mother board 1 which has a plurality of wiring board regions 11 arranged in a matrix shape in a planar view, and a plurality of conductor pattern groups 2 provided on the surface of the mother board 1. Each of the plurality of conductor pattern groups 2 has a first conductor pattern 21 and a second conductor pattern 22. The first conductor pattern 21 is provided in each of the plurality of wiring board regions 11. The second conductor pattern 22 is provided in the wiring board region 11 adjacent to the wiring board region 11 in which the first conductor pattern 21 is provided, and has an area larger than that of the first conductor pattern 21.

Description

本発明は、母基板に複数の配線基板領域が設けられた多数個取り配線基板に関するものである。   The present invention relates to a multi-piece wiring board in which a plurality of wiring board regions are provided on a mother board.

近年、電子装置の小型化の要求に伴って配線基板は小型化されており、小型の配線基板を効率よく製作するために、多数個取り配線基板が用いられている。多数個取り配線基板は、例えば複数の配線基板領域を有する母基板と、母基板の表面に設けられた複数の導体パターンと、これらの複数の導体パターン同士を電気的に接続されためっき用配線とを有している（例えば、特許文献１を参照。）。複数の導体パターンは、目的に応じて互いの面積が異なることがあった。   In recent years, with the demand for downsizing of electronic devices, wiring boards have been downsized, and in order to efficiently manufacture a small wiring board, a multi-piece wiring board is used. The multi-cavity wiring board includes, for example, a mother board having a plurality of wiring board regions, a plurality of conductor patterns provided on the surface of the mother board, and a wiring for plating in which the plurality of conductor patterns are electrically connected to each other. (For example, refer to Patent Document 1). The plurality of conductor patterns sometimes have different areas depending on purposes.

特開2005−108895号公報JP 2005-108895 A

しかしながら、めっき用配線を介して電流を流すことによって複数の導体パターンにめっき層を被着する場合に、面積の大きさの異なる導体パターンに被着されためっき層の厚みが異なることがあった。   However, when a plating layer is deposited on a plurality of conductor patterns by passing an electric current through the wiring for plating, the thickness of the plating layers deposited on the conductor patterns having different sizes may be different. .

本発明の一つの態様による多数個取り配線基板は、平面視において縦横に配置された複数の配線基板領域を有する母基板と、母基板の表面に設けられた複数の導体パターン群とを有している。複数の導体パターン群のそれぞれが、第１の導体パターンと第２の導体パターンとを有している。第１の導体パターンは、複数の配線基板領域のそれぞれに設けられている。第２の導体パターンは、第１の導体パターンが設けられた配線基板領域に隣り合う配線基板領域に設けられており第１の導体パターンよりも大きい面積を有する。第１の導体パターンおよび第２の導体パターンが電気的に接続されており、複数の導体パターン群のそれぞれが、母基板に設けられためっき用配線に電気的に接続されている。   A multi-cavity wiring board according to an aspect of the present invention includes a mother board having a plurality of wiring board regions arranged vertically and horizontally in a plan view, and a plurality of conductor pattern groups provided on the surface of the mother board. ing. Each of the plurality of conductor pattern groups has a first conductor pattern and a second conductor pattern. The first conductor pattern is provided in each of the plurality of wiring board regions. The second conductor pattern is provided in a wiring board region adjacent to the wiring board region provided with the first conductor pattern, and has a larger area than the first conductor pattern. The first conductor pattern and the second conductor pattern are electrically connected, and each of the plurality of conductor pattern groups is electrically connected to the plating wiring provided on the mother board.

本発明の他の態様による多数個取り配線基板は、複数の導体パターン群が複数の第１の導体パターン列と、複数の第１の導体パターン列と交互に配置された複数の第２の導体パターン列とからなり、複数の第１の導体パターン列が、めっき用配線のうち第１のめっき用配線に電気的に接続されているとともに、複数の第２の導体パターン列が、めっき用配線のうち第２のめっき用配線に電気的に接続されている。複数の第１の導体パターン列は、互いに電気的に接続された複数の第１の導体パターン群からなる。複数の第２の導体パターン列は、互いに電気的に接続された複数の第２の導体パターン群からなる。   The multi-cavity wiring board according to another aspect of the present invention includes a plurality of second conductors in which a plurality of conductor pattern groups are alternately arranged with a plurality of first conductor pattern rows and a plurality of first conductor pattern rows. The plurality of first conductor pattern rows are electrically connected to the first plating wiring among the plating wirings, and the plurality of second conductor pattern rows are plating wirings. Are electrically connected to the second plating wiring. The plurality of first conductor pattern rows are composed of a plurality of first conductor pattern groups that are electrically connected to each other. The plurality of second conductor pattern rows are composed of a plurality of second conductor pattern groups that are electrically connected to each other.

本発明の一つの態様による多数個取り配線基板は、母基板の表面に設けられた複数の導体パターン群のそれぞれが、第１の導体パターンと、第１の導体パターンに電気的に接続されており第１の導体パターンよりも大きい面積を有する第２の導体パターンとを有しており、複数の導体パターン群がめっき用配線に電気的に接続されていることから、複数の導体パターン群における電気抵抗の差を低減できるので、複数の導体パターン群に被着されるめっき厚みの差を低減できる。   In the multi-cavity wiring board according to one aspect of the present invention, each of the plurality of conductor pattern groups provided on the surface of the mother board is electrically connected to the first conductor pattern and the first conductor pattern. And the second conductor pattern having a larger area than the first conductor pattern, and the plurality of conductor pattern groups are electrically connected to the wiring for plating. Since the difference in electrical resistance can be reduced, the difference in plating thickness deposited on the plurality of conductor pattern groups can be reduced.

（ａ）は、本発明の第１の実施形態における多数個取り配線基板を示す上面図であり、（ｂ）は（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows the multi-piece wiring board in the 1st Embodiment of this invention, (b) is sectional drawing in the AA of (a). （ａ）は、本発明の第１の実施形態における多数個取り配線基板の他の例を示す上面図であり、（ｂ）は（ａ）のＡ−Ａ線における断面図である。(A) is a top view which shows the other example of the multi-piece wiring board in the 1st Embodiment of this invention, (b) is sectional drawing in the AA of (a). （ａ）は、本発明の第２の実施形態における多数個取り配線基板を示す上面図であり、（ｂ）は本発明の第２の実施形態における多数個取り配線基板を示す下面図である。(A) is a top view showing the multi-cavity wiring board in the second embodiment of the present invention, and (b) is a bottom view showing the multi-cavity wiring board in the second embodiment of the present invention. . （ａ）は、図３（ａ）のＡ−Ａ線における断面図であり、（ｂ）は図３（ａ）のＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line of Fig.3 (a), (b) is sectional drawing in the BB line of Fig.3 (a). （ａ）は、本発明の第２の実施形態における多数個取り配線基板の他の例を示す上面図であり、（ｂ）は本発明の第２の実施形態における多数個取り配線基板の他の例を示す下面図である。(A) is a top view which shows the other example of the multi-cavity wiring board in the 2nd Embodiment of this invention, (b) is other than the multi-cavity wiring board in the 2nd Embodiment of this invention. It is a bottom view which shows the example of. （ａ）は、図５（ａ）のＡ−Ａ線における断面図であり、（ｂ）は図５（ａ）のＢ−Ｂ線における断面図である。(A) is sectional drawing in the AA line of Fig.5 (a), (b) is sectional drawing in the BB line of Fig.5 (a).

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における多数個取り配線基板は、図１および図２に示された例のように、母基板１と、母基板１の表面に設けられた複数の導体パターン群２と、導体パターン群２に電気的に接続されためっき用配線３と、母基板１の内部に設けられており、複数の導体パターン群２またはめっき用配線３に電気的に接続された配線導体４とを有している。 (First embodiment)
The multi-cavity wiring board according to the first embodiment of the present invention includes a mother board 1 and a plurality of conductor pattern groups 2 provided on the surface of the mother board 1, as in the example shown in FIGS. A plating wiring 3 electrically connected to the conductor pattern group 2 and a wiring conductor provided inside the mother board 1 and electrically connected to the plurality of conductor pattern groups 2 or the plating wiring 3 4.

母基板１は平面視において縦横に配置された複数の配線基板領域11を有する。母基板１には複数の配線基板領域11が設けられており、複数の配線基板領域11の周囲にダミー領域12が設けられている。配線基板領域11は、例えば電子部品が搭載され封止された後、外部回路基板に実装されるパッケージとして利用される領域である。ダミー領域12は、多数個取り配線基板の製造時や搬送時に用いるための領域であり、このダミー領域12を用いて母基板１となる生成形体や多数個取り配線基板の加工時や搬送時の位置決め、固定等を行なうことができる。なお、複数の配線基板領域11は縦および横の少なくとも一方の並びに配置されていればよい。   The mother board 1 has a plurality of wiring board regions 11 arranged vertically and horizontally in plan view. A plurality of wiring board regions 11 are provided on the mother board 1, and dummy areas 12 are provided around the plurality of wiring board areas 11. The wiring board area 11 is an area used as a package mounted on an external circuit board after electronic components are mounted and sealed, for example. The dummy area 12 is an area for use when manufacturing or transporting a multi-piece wiring board. When the dummy area 12 is used to form a generation body to be a mother board 1 or a multi-piece wiring board or when carrying it. Positioning, fixing, etc. can be performed. The plurality of wiring board regions 11 may be arranged in at least one of the vertical and horizontal directions.

母基板１は、セラミックスや樹脂等の絶縁体からなるものである。セラミックスから成る場合は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体およびガラスセラミックス質焼結体等が挙げられる。また、樹脂からなる場合は、例えば、エポキシ樹脂，ポリイミド樹脂，アクリル樹脂，フェノール樹脂，ポリエステル樹脂、および四フッ化エチレン樹脂を始めとするフッ素系樹脂等が挙げられる。また、ガラスエポキシ樹脂のように、ガラス繊維から成る基材に樹脂を含浸させたものが挙げられる。   The mother board 1 is made of an insulator such as ceramics or resin. In the case of ceramics, examples thereof include aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies, mullite sintered bodies, and glass ceramic sintered bodies. Moreover, when it consists of resin, a fluorine resin etc., such as an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a polyester resin, and a tetrafluoroethylene resin, are mentioned, for example. Moreover, what impregnated resin to the base material which consists of glass fibers like glass epoxy resin is mentioned.

母基板１が、例えば、酸化アルミニウム質焼結体からなる場合には、アルミナ（Ａｌ２Ｏ３），シリカ（ＳｉＯ２），カルシア（ＣａＯ）およびマグネシア（ＭｇＯ）等の原料粉末に適当な有機溶剤および溶媒を添加混合して泥漿状となすとともに、これを従来周知のドクターブレード法やカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを得て、次に、セラミックグリーンシートに適当な打ち抜き加工を施すとともに必要に応じて複数枚積層し、高温（約1500〜1800℃）で焼成すること
によって製作される。 When the base substrate 1 is made of, for example, an aluminum oxide sintered body, an organic material suitable for raw material powders such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO), and magnesia (MgO) is used. A ceramic green sheet is obtained by adding a solvent and a solvent to form a slurry, and forming this into a sheet using a conventionally known doctor blade method, calendar roll method, etc. The sheet is manufactured by performing an appropriate punching process, stacking a plurality of sheets as necessary, and firing at a high temperature (about 1500 to 1800 ° C.).

母基板１が、例えば、樹脂から成る場合は、所定の配線基板の形状に成形できるような金型を用いて、トランスファーモールド法やインジェクションモールド法等によって成形することができる。また、例えば、ガラスエポキシ樹脂のように、ガラス繊維から成る基材に樹脂を含浸させたものであってもよく、この場合は、ガラス繊維から成る基材にエポキシ樹脂の前駆体を含浸させ、このエポキシ樹脂前駆体を所定の温度で熱硬化させることによって形成することができる。   When the mother board 1 is made of, for example, a resin, it can be molded by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined wiring board shape. Further, for example, a glass fiber base material impregnated with a resin, such as glass epoxy resin, in this case, a glass fiber base material is impregnated with an epoxy resin precursor, The epoxy resin precursor can be formed by thermosetting at a predetermined temperature.

導体パターン群２は、第１の導体パターン21と第２の導体パターン22とを有している。第１の導体パターン21は、母基板１の第１主面１ａにおいて、複数の配線基板領域11のそれぞれに設けられている。第２の導体パターン22は、母基板１の第１主面１ａにおいて、第１の導体パターン21が設けられた配線基板領域11に隣り合う配線基板領域11に設けられており、第１の導体パターン21よりも大きい面積を有する。導体パターン群２は、１つの第１の導体パターン21と１つの第２の導体パターン22とを電気的に接続することによって構成されている。   The conductor pattern group 2 has a first conductor pattern 21 and a second conductor pattern 22. The first conductor pattern 21 is provided in each of the plurality of wiring board regions 11 on the first main surface 1 a of the mother board 1. The second conductor pattern 22 is provided in the wiring substrate region 11 adjacent to the wiring substrate region 11 provided with the first conductor pattern 21 on the first main surface 1a of the mother substrate 1. The area is larger than that of the pattern 21. The conductor pattern group 2 is configured by electrically connecting one first conductor pattern 21 and one second conductor pattern 22.

また、第１の導体パターン21および第２の導体パターン22は、複数の配線基板領域11のそれぞれに設けられており、同じ配線基板領域11内に設けられた第１の導体パターン21と第２の導体パターン22とは電気的に絶縁されるように設けられている。第１の導体パターン21および第２の導体パターン22は、例えばＬＥＤ素子を接合するとともに、ＬＥＤ素子と電気的に接続される電極である。   The first conductor pattern 21 and the second conductor pattern 22 are provided in each of the plurality of wiring board regions 11, and the first conductor pattern 21 and the second conductor pattern 21 provided in the same wiring board region 11 are provided. The conductor pattern 22 is provided so as to be electrically insulated. The first conductor pattern 21 and the second conductor pattern 22 are electrodes that, for example, join LED elements and are electrically connected to the LED elements.

複数の導体パターン群２は、母基板１に設けられためっき用配線３に電気的に接続されている。第１の導体パターン21または第２の導体パターン22のいずれかが、めっき用配線３に電気的に接続されることによって、導体パターン群２とめっき用配線３とが電気的に接続されている。第１の導体パターン21同士または第２の導体パターン22同士が電気的に接続されることによって、複数の導体パターン群２がめっき用配線３に電気的に接続されている。第２の導体パターン22は、第１の導体パターン21に比べて面積が大きく、断面積も大きいので、第２の導体パターン22同士を電気的に接続すると、第１の導体パターン21同士を電気的に接続した場合に比べて、電流経路における抵抗値が小さくなるので、互いの抵抗値の差が大きくなる。   The plurality of conductor pattern groups 2 are electrically connected to the plating wiring 3 provided on the mother board 1. Either the first conductor pattern 21 or the second conductor pattern 22 is electrically connected to the plating wiring 3 so that the conductor pattern group 2 and the plating wiring 3 are electrically connected. . The plurality of conductor pattern groups 2 are electrically connected to the plating wiring 3 by electrically connecting the first conductor patterns 21 or the second conductor patterns 22 to each other. Since the second conductor pattern 22 has a larger area and a larger cross-sectional area than the first conductor pattern 21, when the second conductor patterns 22 are electrically connected to each other, the first conductor patterns 21 are electrically connected to each other. Since the resistance value in the current path is smaller than in the case where the connection is established, the difference between the resistance values is increased.

第１の導体パターン21、第２の導体パターン22、めっき用配線３および配線導体４は、母基板１がセラミックスからなる場合であれば、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ），銅（Ｃｕ）等の金属粉末メタライズから成り、母基板１用のセラミックグリーンシートに第１の導体パターン21および第２の導体パターン22用の導体ペーストをスクリーン印刷法等により所定形状に印刷して、母基板１用のセラミックグリーンシートと同時に焼成することによって、母基板１の所定位置に形成される。   The first conductor pattern 21, the second conductor pattern 22, the plating wiring 3 and the wiring conductor 4 are tungsten (W), molybdenum (Mo), manganese (Mn) if the mother substrate 1 is made of ceramics. , Silver (Ag), copper (Cu), and other metal powder metallization, and the conductive paste for the first conductor pattern 21 and the second conductor pattern 22 is applied to the ceramic green sheet for the mother substrate 1 by a screen printing method or the like. It is formed in a predetermined position on the mother board 1 by printing in a predetermined shape and firing simultaneously with the ceramic green sheet for the mother board 1.

また、母基板１の第２主面１ｂの配線基板領域11には第３の導体パターン５が設けられている。第３の導体パターン５は配線導体４に接合されて電気的に接続されている。第３の導体パターン５は配線導体４を介して第１の導体パターン21または第２の導体パターン22のいずれかに電気的に接続されている。第３の導体パターン５は、例えば配線基板領域11に搭載される電子部品と、外部回路基板とを電気的に接続するためのものである。   A third conductor pattern 5 is provided in the wiring board region 11 of the second main surface 1b of the mother board 1. The third conductor pattern 5 is joined and electrically connected to the wiring conductor 4. The third conductor pattern 5 is electrically connected to either the first conductor pattern 21 or the second conductor pattern 22 via the wiring conductor 4. The third conductor pattern 5 is for electrically connecting, for example, an electronic component mounted on the wiring board region 11 and an external circuit board.

めっき用配線３は、図１に示された例のように、母基板１の内部に設けられており、共通導体31と接続配線32とを有している。このようなめっき用配線３は母基板１の表面に設けられていてもよいが、めっき用配線３が母基板１の内部に設けられていると、めっき用配線３はめっき層を被着する必要がないので、めっき層を設ける部分を低減できる。めっ
き用配線３は、めっき用の電源と複数の導体パターン群２とを電気的に接続するためのものである。 As shown in the example shown in FIG. 1, the plating wiring 3 is provided inside the mother board 1 and has a common conductor 31 and a connection wiring 32. Such a plating wiring 3 may be provided on the surface of the mother board 1, but when the plating wiring 3 is provided inside the mother board 1, the plating wiring 3 deposits a plating layer. Since there is no need, the part which provides a plating layer can be reduced. The plating wiring 3 is for electrically connecting a plating power source and the plurality of conductor pattern groups 2.

共通導体31は、平面視において母基板１の上端部および下端部に、複数の導体パターン群２と接続されて設けられている。また、共通導体31は、母基板１の端部に設けられた切欠きまたは孔の内面に露出されている。   The common conductor 31 is connected to the plurality of conductor pattern groups 2 at the upper end portion and the lower end portion of the mother board 1 in plan view. Further, the common conductor 31 is exposed at the inner surface of a notch or a hole provided at the end of the mother board 1.

接続配線32は、共通導体31と第１の導体パターン21または第２の導体パターン22との間、縦方向に隣接する配線基板領域11の第１の導体パターン21同士の間または第２の導体パターン22同士の間、横方向に隣接する配線基板領域11の第１の導体パターン21と第２の導体パターン22との間をそれぞれ電気的に接続する。   The connection wiring 32 is between the common conductor 31 and the first conductor pattern 21 or the second conductor pattern 22, between the first conductor patterns 21 of the wiring board region 11 adjacent in the vertical direction, or the second conductor. Between the patterns 22, the first conductor pattern 21 and the second conductor pattern 22 in the wiring board region 11 adjacent in the horizontal direction are electrically connected.

配線導体４は母基板１の内部に設けられている。配線導体４には、母基板１の絶縁層間に配置される導体層と、絶縁層を貫通しており、絶縁層の上下に位置する導体同士を電気的に接続する貫通導体とがある。貫通導体によって電気的に接続される導体とは、導体層、第１の導体パターン21、第２の導体パターン22または第３の導体パターン５である。母基板１がセラミックスからなる場合は、絶縁層間に配置される導体層は、母基板１用のセラミックグリーンシートにスクリーン印刷法等の印刷手段によって導体層用のメタライズペーストを印刷塗布し、母基板１用の生成形体とともに焼成することによって形成される。また、貫通導体は、導体層を形成するためのメタライズペーストの印刷塗布に先立って母基板１用のセラミックグリーンシートに金型やパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストをスクリーン印刷法等の印刷手段によって充填しておき、母基板１となる生成形体とともに焼成することによって形成する。メタライズペーストは、主成分の金属粉末に有機バインダーおよび有機溶剤、また必要に応じて分散剤等を加えてボールミル，三本ロールミルまたはプラネタリーミキサー等の混練手段によって混合および混練することで作製する。また、セラミックグリーンシートの焼結挙動に合わせたり、焼成後の母基板１との接合強度を高めたりするために、ガラスまたはセラミックスの粉末を添加してもよい。貫通導体用のメタライズペーストは、有機バインダーや有機溶剤の種類や添加量によって充填に適した、一般的に導体層用のメタライズペーストよりも高い粘度に調整される。   The wiring conductor 4 is provided inside the mother board 1. The wiring conductor 4 includes a conductor layer disposed between the insulating layers of the mother board 1 and a through conductor that penetrates the insulating layer and electrically connects conductors positioned above and below the insulating layer. The conductor electrically connected by the through conductor is the conductor layer, the first conductor pattern 21, the second conductor pattern 22, or the third conductor pattern 5. When the mother board 1 is made of ceramic, the conductor layer disposed between the insulating layers is obtained by printing and applying a metallized paste for the conductor layer to the ceramic green sheet for the mother board 1 by printing means such as a screen printing method. It is formed by firing together with a generated shape for 1. Further, the through conductor is penetrated for the through conductor by a processing method such as punching by die or punching or laser processing on the ceramic green sheet for the mother substrate 1 prior to the printing application of the metallized paste for forming the conductor layer. A hole is formed, and a metallized paste for a through conductor is filled in the through hole by a printing means such as a screen printing method, and is fired together with a generated shape to be the mother substrate 1. The metallized paste is prepared by adding an organic binder and an organic solvent to the main component metal powder and, if necessary, a dispersing agent and the like, and mixing and kneading by a kneading means such as a ball mill, a three-roll mill or a planetary mixer. Further, glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate 1 after firing. The metallized paste for through conductors is generally adjusted to have a higher viscosity than the metallized paste for conductor layers, which is suitable for filling depending on the type and addition amount of the organic binder and organic solvent.

なお、第１の導体パターン21，第２の導体パターン22および第３の導体パターン５の表面には、必要に応じて、ニッケル，金等の耐蝕性に優れる金属が被着され、接続電極または外部端子電極となる。これにより、第１の導体パターン21，第２の導体パターン22および第３の導体パターン５が腐食することを効果的に抑制できる。また、接続電極と電子部品との接合、接続電極とボンディングワイヤとの接合、および外部端子電極と外部電気回路基板の配線との接合を強固にできる。例えば、第１の導体パターン21，第２の導体パターン22および第３の導体パターン５の露出する表面には、厚さ１〜10μｍ程度のニッケルめっき層と厚さ0.1〜３μｍ程度の金めっき層とが、電解めっき法により順次被着される
。 In addition, the surface of the first conductor pattern 21, the second conductor pattern 22, and the third conductor pattern 5 is coated with a metal having excellent corrosion resistance, such as nickel or gold, as necessary. It becomes an external terminal electrode. Thereby, it can suppress effectively that the 1st conductor pattern 21, the 2nd conductor pattern 22, and the 3rd conductor pattern 5 corrode. Further, the connection between the connection electrode and the electronic component, the connection between the connection electrode and the bonding wire, and the connection between the external terminal electrode and the wiring of the external electric circuit board can be strengthened. For example, on the exposed surfaces of the first conductor pattern 21, the second conductor pattern 22, and the third conductor pattern 5, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are provided. Are sequentially deposited by electrolytic plating.

また、母基板１が樹脂からなる場合には、第１の導体パターン21，第２の導体パターン22，めっき用配線３、配線導体４および第３の導体パターン５は、銅，金，アルミニウム，ニッケル，クロム，モリブデン，チタンおよびそれらの合金等の金属材料から成る。このような第１の導体パターン21，第２の導体パターン22，めっき用配線３、配線導体４および第３の導体パターン５は、例えば、ガラスエポキシ樹脂から成る樹脂シート上に、所定の形状に加工した銅箔を転写し、銅箔が転写された樹脂シートを積層して接着剤で接着することによって形成する。また、配線導体４のうち、樹脂シートを厚み方向に貫通する貫通導体は、導体ペーストの印刷やめっき法によって樹脂シートに形成した貫通孔の内面
に被着形成するか、貫通孔を充填して形成すればよい。また、金属箔や金属柱を樹脂成形によって一体化させたり、母基板１にスパッタリング法，蒸着法等を用いて被着させて形成される。 When the mother board 1 is made of resin, the first conductor pattern 21, the second conductor pattern 22, the plating wiring 3, the wiring conductor 4 and the third conductor pattern 5 are made of copper, gold, aluminum, It consists of metallic materials such as nickel, chromium, molybdenum, titanium and their alloys. The first conductor pattern 21, the second conductor pattern 22, the plating wiring 3, the wiring conductor 4, and the third conductor pattern 5 are formed in a predetermined shape on a resin sheet made of glass epoxy resin, for example. The processed copper foil is transferred, and a resin sheet to which the copper foil is transferred is laminated and bonded with an adhesive. Further, among the wiring conductors 4, the through conductors that penetrate the resin sheet in the thickness direction are deposited on the inner surface of the through holes formed in the resin sheet by conductor paste printing or plating, or filled with the through holes. What is necessary is just to form. Further, it is formed by integrating a metal foil or a metal column by resin molding, or by depositing it on the mother substrate 1 using a sputtering method, a vapor deposition method or the like.

また、図２に示された例のように、ダミー導体パターン６が母基板１のダミー領域12に設けられていてもよい。ダミー導体パターン６は、複数の配線基板領域11の最外周に配置された第１の導体パターン21または第２の導体パターン22のそれぞれに電気的に接続されている。   Further, as in the example shown in FIG. 2, the dummy conductor pattern 6 may be provided in the dummy region 12 of the mother board 1. The dummy conductor pattern 6 is electrically connected to each of the first conductor pattern 21 or the second conductor pattern 22 disposed on the outermost periphery of the plurality of wiring board regions 11.

ダミー導体パターン６は、第２の導体パターン22に接続された第１のダミー導体パターン61と第１の導体パターン21に接続された第２のダミー導体パターン62とを有している。第１のダミー導体パターン61は第１の導体パターン22と同じ面積であり、第２のダミー導体パターン62は第２の導体パターン22と同じ面積を有している。また、母基板１の下面には、図２に示す例においては、第３の導体パターン５と同じ形状のダミー導体パターン６を有している。   The dummy conductor pattern 6 has a first dummy conductor pattern 61 connected to the second conductor pattern 22 and a second dummy conductor pattern 62 connected to the first conductor pattern 21. The first dummy conductor pattern 61 has the same area as the first conductor pattern 22, and the second dummy conductor pattern 62 has the same area as the second conductor pattern 22. Further, in the example shown in FIG. 2, a dummy conductor pattern 6 having the same shape as the third conductor pattern 5 is provided on the lower surface of the mother board 1.

このようなダミー導体パターン６が設けられていることによって、最外周に配置された第１の導体パターン21または第２の導体パターン22に被着されるめっき層の厚みと、他の第１の導体パターン21または第２の導体パターン22に被着されるめっき層の厚みとの差が低減できる。   By providing the dummy conductor pattern 6 as described above, the thickness of the plating layer deposited on the first conductor pattern 21 or the second conductor pattern 22 arranged on the outermost periphery, and the other first The difference with the thickness of the plating layer deposited on the conductor pattern 21 or the second conductor pattern 22 can be reduced.

なお、母基板１の上面のダミー導体パターン６および下面のダミー導体パターン６は配線導体４によって接続されている。また、ダミー導体パターン６と第１の導体パターン21または第２の導体パターン22とは接続配線32によって電気的に接続されている。   The dummy conductor pattern 6 on the upper surface of the mother board 1 and the dummy conductor pattern 6 on the lower surface are connected by the wiring conductor 4. The dummy conductor pattern 6 and the first conductor pattern 21 or the second conductor pattern 22 are electrically connected by a connection wiring 32.

上述したような多数個取り配線基板は、配線基板領域11毎に分割されることによって、複数の配線基板となる。このような多数個取り配線基板の分割によって第１の導体パターン21と第２の導体パターン22との間の接続配線32が切断される。   The multi-piece wiring board as described above is divided into the wiring board regions 11 to form a plurality of wiring boards. The connection wiring 32 between the first conductor pattern 21 and the second conductor pattern 22 is cut by dividing the multi-piece wiring board.

多数個取り配線基板は、スライシング法等によって配線基板領域11同士の境界または配線基板領域11とダミー領域12との境界に沿って切断して分割できる。また、多数個取り配線基板は、母基板1の配線基板領域11同士の境界または配線基板領域11とダミー領域12と
の境界に分割溝が設けられていてもよい。多数個取り配線基板が分割溝を有する場合は、分割溝に沿って撓折して分割できる。分割溝は、母基板1用の生成形体にカッター刃を押
し当てたり、スライシング装置によって生成形体の厚みより小さく切り込むか、焼成後にスライシング装置により母基板1の厚みより小さく切り込んで形成できる。 The multi-piece wiring substrate can be divided by cutting along the boundary between the wiring substrate regions 11 or the boundary between the wiring substrate region 11 and the dummy region 12 by a slicing method or the like. The multi-cavity wiring board may be provided with a dividing groove at the boundary between the wiring board regions 11 of the mother board 1 or at the boundary between the wiring board region 11 and the dummy region 12. When the multi-cavity wiring board has a dividing groove, it can be divided by bending along the dividing groove. The dividing groove can be formed by pressing the cutter blade against the generated shape for the mother substrate 1, cutting it with a slicing device smaller than the thickness of the generated shape, or cutting it after the baking with a slicing device smaller than the thickness of the mother substrate 1.

多数個取り配線基板が分割された配線基板には、必要に応じて電子部品が搭載される。搭載される電子部品は、例えばＩＣチップやＬＳＩチップ等の半導体素子，水晶振動子や圧電振動子等の圧電素子および各種センサ等である。   Electronic components are mounted on the wiring board obtained by dividing the multi-cavity wiring board as necessary. Electronic components to be mounted are, for example, semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal vibrators and piezoelectric vibrators, and various sensors.

第１の実施形態における多数個取り配線基板は、平面視において縦横に配置された複数の配線基板領域11を有する母基板１と、母基板１の表面に設けられた複数の導体パターン群２とを有している。複数の導体パターン群２のそれぞれが、第１の導体パターン21と第２の導体パターン22とを有している。第１の導体パターン21は、複数の配線基板領域11のそれぞれに設けられている。第２の導体パターン22は、第１の導体パターン21が設けられた配線基板領域11に隣り合う配線基板領域11に設けられており第１の導体パターン21よりも大きい面積を有する。第１の導体パターン21および第２の導体パターン22が電気的に接続されており、複数の導体パターン群２のそれぞれが、母基板１に設けられためっき用配線３に電気的に接続されていることから、例えば第１の導体パターン21および第２の導体
パターン22のそれぞれを電気的に接続して導体パターン群を構成した場合に比べて、複数の導体パターン群２における電気抵抗の差を低減できるので、複数の導体パターン群２に被着されるめっき厚みの差を低減できる。 The multi-cavity wiring board in the first embodiment includes a mother board 1 having a plurality of wiring board regions 11 arranged vertically and horizontally in a plan view, and a plurality of conductor pattern groups 2 provided on the surface of the mother board 1. have. Each of the plurality of conductor pattern groups 2 has a first conductor pattern 21 and a second conductor pattern 22. The first conductor pattern 21 is provided in each of the plurality of wiring board regions 11. The second conductor pattern 22 is provided in the wiring board region 11 adjacent to the wiring board region 11 in which the first conductor pattern 21 is provided, and has a larger area than the first conductor pattern 21. The first conductor pattern 21 and the second conductor pattern 22 are electrically connected, and each of the plurality of conductor pattern groups 2 is electrically connected to the plating wiring 3 provided on the mother board 1. Therefore, for example, compared with the case where the conductor pattern group is configured by electrically connecting each of the first conductor pattern 21 and the second conductor pattern 22, the difference in electrical resistance between the plurality of conductor pattern groups 2 is reduced. Since it can reduce, the difference of the plating thickness deposited on the some conductor pattern group 2 can be reduced.

（第２の実施形態）
次に、本発明の第２の実施形態による多数個取り配線基板について、図３および図４を参照しつつ説明する。 (Second Embodiment)
Next, a multi-piece wiring board according to a second embodiment of the present invention will be described with reference to FIGS.

本発明の第２の実施形態における多数個取り配線基板において、上記した第１の実施形態の多数個取り配線基板と異なる点は、図３に示された例のように複数の導体パターン群２が、複数の第１の導体パターン列24と複数の第２の導体パターン列26とからなり、複数の第１の導体パターン列24と複数の第２の導体パターン列26とが交互に配置されている点である。複数の第１の導体パターン列24は、互いに電気的に接続された複数の第１の導体パターン群23を有する。また、複数の第１の導体パターン列24は、めっき用配線３のうち第１のめっき用配線33に電気的に接続されている。複数の第２の導体パターン列26は、互いに電気的に接続された複数の第２の導体パターン群25を有する。また、複数の第２の導体パターン列26は、めっき用配線３のうち第２のめっき用配線34に電気的に接続されている。   The multi-cavity wiring board according to the second embodiment of the present invention differs from the multi-cavity wiring board of the first embodiment described above in that a plurality of conductor pattern groups 2 are provided as in the example shown in FIG. Is composed of a plurality of first conductor pattern rows 24 and a plurality of second conductor pattern rows 26, and the plurality of first conductor pattern rows 24 and the plurality of second conductor pattern rows 26 are alternately arranged. It is a point. The plurality of first conductor pattern rows 24 have a plurality of first conductor pattern groups 23 that are electrically connected to each other. Further, the plurality of first conductor pattern rows 24 are electrically connected to the first plating wiring 33 in the plating wiring 3. The plurality of second conductor pattern rows 26 include a plurality of second conductor pattern groups 25 that are electrically connected to each other. The plurality of second conductor pattern rows 26 are electrically connected to the second plating wiring 34 in the plating wiring 3.

また、第２の実施形態では、めっき用配線３が母基板１の表面に設けられている。めっき用配線３は母基板１の内部に設けられていてもよいが、母基板１の表面に設けられていると、配線導体４の内部の配線導体４の配置の自由度を高めることができる。   Further, in the second embodiment, the plating wiring 3 is provided on the surface of the mother board 1. The plating wiring 3 may be provided inside the mother board 1, but if it is provided on the surface of the mother board 1, the degree of freedom of arrangement of the wiring conductor 4 inside the wiring conductor 4 can be increased. .

母基板１の表面に設けられた第１のめっき用配線33の共通導体31同士および第２のめっき用配線34の共通導体31同士は、母基板１を貫通する接続配線32によって、それぞれ電気的に接続されている。   The common conductors 31 of the first plating wiring 33 and the common conductors 31 of the second plating wiring 34 provided on the surface of the mother board 1 are electrically connected to each other by the connection wiring 32 penetrating the mother board 1. It is connected to the.

第１のめっき用配線33と第２のめっき用配線34とは、それぞれ同様の配置および同様の形状としておくと、第１のめっき用配線33と第２のめっき用配線34とで抵抗値の差が小さくなって、複数の導体パターン群２に被着されるめっき厚みの差を低減できるので好ましい。   If the first plating wiring 33 and the second plating wiring 34 have the same arrangement and the same shape, the first plating wiring 33 and the second plating wiring 34 have resistance values. This is preferable because the difference is reduced and the difference in plating thickness applied to the plurality of conductor pattern groups 2 can be reduced.

このような多数個取り配線基板は、第１の導体パターン列24と、第２の導体パターン列26とが電気的に独立しているので、多数個取り配線基板を分割せずに電気検査を行うことができる。電気検査とは、同じ配線基板領域11における第１の導体パターン２ａと第２の導体パターン２ｂとの電気的な短絡の有無等を確認することである。   In such a multi-cavity wiring board, the first conductor pattern row 24 and the second conductor pattern row 26 are electrically independent, so that the electrical inspection can be performed without dividing the multi-cavity wiring board. It can be carried out. The electrical inspection is to confirm the presence or absence of an electrical short circuit between the first conductor pattern 2a and the second conductor pattern 2b in the same wiring board region 11.

例えば、各配線基板領域11に電子部品を搭載する前の電気検査では、電気的に独立した第１のめっき用配線33と第２のめっき用配線34との間の電気的な導通状態を確認すればよい。また、配線基板領域11に電子部品を搭載した後の電気検査では、複数の電子部品の作動状態を確認することができる。電子部品として発光素子を搭載した場合であれば、複数の発光素子の発光状態を確認できる。   For example, in the electrical inspection before electronic components are mounted on each wiring board region 11, the electrical continuity between the first and second plating wirings 33 and 34 is confirmed. do it. Further, in the electrical inspection after the electronic components are mounted on the wiring board region 11, the operating states of the plurality of electronic components can be confirmed. In the case where a light emitting element is mounted as an electronic component, the light emission state of the plurality of light emitting elements can be confirmed.

なお、図３に示す例のように、第１のめっき用配線33の共通導体31および第２のめっき用配線34の共通導体31は、めっき用電源に２箇所で接続される場合には、母基板１の中心を対称点として点対称に設けられているとめっき層の厚みのばらつきを低減するのに有効である。   As shown in FIG. 3, when the common conductor 31 of the first plating wiring 33 and the common conductor 31 of the second plating wiring 34 are connected to the power supply for plating at two locations, Providing point symmetry with the center of the mother substrate 1 as the symmetry point is effective in reducing variations in the thickness of the plating layer.

また、図３に示す例のように、第１のめっき用配線33が母基板１の表面に設けられている場合には、第２のめっき用配線34が母基板１の表面に設けられていればよいが、第１の
めっき用配線33が母基板１の内部に設けられている場合には、第２のめっき用配線34が母基板１の内部に設けられていればよい。 Further, as in the example shown in FIG. 3, when the first plating wiring 33 is provided on the surface of the mother substrate 1, the second plating wiring 34 is provided on the surface of the mother substrate 1. However, when the first plating wiring 33 is provided in the mother substrate 1, the second plating wiring 34 may be provided in the mother substrate 1.

なお、本発明は上述の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更は可能である。例えば、第１の導体パターン21および第２の導体パターン22は、焼成後の母基板１の表面に、導体ペーストをスクリーン印刷法等によって所定形状に印刷した後、焼付けることによって、母基板１の所定位置に形成させても良い。   Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the first conductor pattern 21 and the second conductor pattern 22 are printed on the surface of the fired mother board 1 by printing a conductor paste in a predetermined shape by a screen printing method or the like and then baking it. It may be formed at a predetermined position.

また、第１の導体パターン21および第２の導体パターン22は、母基板１の表面に、スパッタリング法，蒸着法等によって被着させてもよい。   The first conductor pattern 21 and the second conductor pattern 22 may be deposited on the surface of the mother substrate 1 by a sputtering method, a vapor deposition method, or the like.

また、図５および図６に示された例のように、第１のめっき用配線33の共通導体31が第１主面１ａに設けられており、第２のめっき用配線34の共通導体31が第２主面１ｂに設けられていてもよい。第１主面１ａおよび第２主面１ｂにそれぞれ設けられた共通導体31を枠形状とできるので、複数の第１の導体パターン群23と共通導体31との間および複数の第２の導体パターン群25と共通導体31との間の電流経路の長さのばらつきを低減できる。   5 and 6, the common conductor 31 of the first plating wiring 33 is provided on the first main surface 1a, and the common conductor 31 of the second plating wiring 34 is provided. May be provided on the second main surface 1b. Since the common conductor 31 provided on each of the first main surface 1a and the second main surface 1b can have a frame shape, a plurality of second conductor patterns are provided between the plurality of first conductor pattern groups 23 and the common conductor 31 and between the plurality of second conductor patterns 31. Variation in the length of the current path between the group 25 and the common conductor 31 can be reduced.

また、第１のめっき用配線33の共通導体31と第２のめっき用配線34の共通導体31が、母基板１の内部の厚み方向における異なる位置に設けられていてもよい。   Further, the common conductor 31 of the first plating wiring 33 and the common conductor 31 of the second plating wiring 34 may be provided at different positions in the thickness direction inside the mother board 1.

また、図５および図６に示す例のような場合、第１のめっき用配線33と第２のめっき用配線34とが母基板１の上面側と下面とにそれぞれ独立して異なる面に形成され、かつ接続配線32が母基板１の表面に形成されている場合には、図５に示す例のように、母基板１の表面に、接続配線32と同様の形状のダミー部を備える形状として導体パターン群２を形成しておくと、個々の配線基板とした際に、配線基板の表面のパターン形状が異なることを抑制することができる。   In the case of the example shown in FIGS. 5 and 6, the first plating wiring 33 and the second plating wiring 34 are independently formed on different surfaces on the upper surface side and the lower surface of the mother board 1, respectively. In the case where the connection wiring 32 is formed on the surface of the mother board 1, a shape having a dummy portion having the same shape as the connection wiring 32 on the surface of the mother board 1, as in the example shown in FIG. 5. If the conductor pattern group 2 is formed as described above, it is possible to prevent the pattern shape on the surface of the wiring board from being different when each wiring board is formed.

１・・・・母基板
１ａ・・・第１主面
１ｂ・・・第２主面
11・・・配線基板領域
12・・・ダミー領域
２・・・・導体パターン群
21・・・・第１の導体パターン
22・・・・第２の導体パターン
23・・・・第１の導体パターン群
24・・・・第１の導体パターン列
25・・・・第２の導体パターン群
26・・・・第２の導体パターン列
３・・・・めっき用配線
31・・・・共通導体
32・・・・接続配線
33・・・・第１のめっき用配線
34・・・・第２のめっき用配線
４・・・・配線導体
５・・・・第３の導体パターン
６・・・・ダミー導体パターン
61・・・・第１のダミー導体パターン群
62・・・・第２のダミー導体パターン群 DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... 1st main surface 1b ... 2nd main surface
11 ... Wiring board area
12 ... dummy area 2 ... conductor pattern group
21... First conductor pattern
22... Second conductor pattern
23... First conductor pattern group
24... First conductor pattern row
25... Second conductor pattern group
26 ··· Second conductor pattern row 3 ··· Plating wiring
31 ... Common conductor
32 ... Connection wiring
33 ··· First plating wiring
34 ··· Second plating wiring 4 ··· Wiring conductor 5 ··· Third conductor pattern 6 ··· Dummy conductor pattern
61... First dummy conductor pattern group
62... Second dummy conductor pattern group

Claims (2)

平面視において縦横に配置された複数の配線基板領域を有する母基板と、
該母基板の表面に設けられた複数の導体パターン群とを備えており、
該複数の導体パターン群のそれぞれが、前記複数の配線基板領域のそれぞれに設けられた第１の導体パターンと、該第１の導体パターンが設けられた配線基板領域に隣り合う配線基板領域に設けられており前記第１の導体パターンよりも大きい面積を有する第２の導体パターンとからなり、前記第１の導体パターンおよび前記第２の導体パターンが電気的に接続されており、前記複数の導体パターン群のそれぞれが、前記母基板に設けられためっき用配線に電気的に接続されていることを特徴とする多数個取り配線基板。 A mother board having a plurality of wiring board regions arranged vertically and horizontally in a plan view;
A plurality of conductor pattern groups provided on the surface of the mother board,
Each of the plurality of conductor pattern groups is provided in a wiring substrate region adjacent to the first conductor pattern provided in each of the plurality of wiring substrate regions and the wiring substrate region in which the first conductor pattern is provided. And a second conductor pattern having a larger area than the first conductor pattern, wherein the first conductor pattern and the second conductor pattern are electrically connected, and the plurality of conductors Each of the pattern groups is electrically connected to a wiring for plating provided on the mother board. 前記複数の導体パターン群が、互いに電気的に接続された複数の第１の導体パターン群からなる複数の第１の導体パターン列と、互いに電気的に接続された複数の第２の導体パターン群からなるとともに前記複数の第１の導体パターン列と交互に配置された複数の第２の導体パターン列とからなり、
前記複数の第１の導体パターン列が、前記めっき用配線のうち第１のめっき用配線に電気的に接続されているとともに、前記複数の第２の導体パターン列が、前記めっき用配線のうち第２のめっき用配線に電気的に接続されていることを特徴とする請求項１に記載の多数個取り配線基板。 The plurality of first conductor pattern groups, each of which includes a plurality of first conductor pattern groups electrically connected to each other, and a plurality of second conductor pattern groups electrically connected to each other. And a plurality of second conductor pattern rows arranged alternately with the plurality of first conductor pattern rows,
The plurality of first conductor pattern rows are electrically connected to the first plating wiring in the plating wiring, and the plurality of second conductor pattern rows are in the plating wiring. The multi-cavity wiring board according to claim 1, wherein the multi-cavity wiring board is electrically connected to the second plating wiring.
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WO2022131586A1 (en) * 2020-12-17 2022-06-23 엘지이노텍 주식회사 Coil member and camera module comprising same

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