JP2011249526A - Multi-piece wiring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-piece wiring substrate capable of individually confirming conduction state of an electronic component for each wiring substrate region.SOLUTION: The multi-piece wiring substrate includes a mother board 1 in which a plurality of wiring substrate regions 1a are arranged vertically and horizontally at a central portion and a dummy region 1b is arranged on the outer periphery, with a plurality of insulating layers being stacked, a first wiring conductor 2 and a second wiring conductor 3 in which a part of each is exposed on the surface of the wiring substrate region 1a, a plurality of first plating wirings 4 for connecting a plurality of first wiring conductors 2 together in the wiring substrate region 1a arranged vertically, a plurality of second plating wirings 5 for connecting a plurality of second wiring conductors 5 together in the wiring substrate region 1a arranged horizontally, being arranged in an insulating layer different from the first plating wiring 4, and a common conductor which is provided to the dummy region 1b and is electrically connected to the first plating wiring 4 and the second plating wiring 5. The conduction state to an electronic component in each wiring substrate region can be individually confirmed.

Description

  The present invention relates to a multi-cavity wiring board in which a wiring board region for mounting an electronic component is arranged in the center.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of an insulating substrate made of an electrically insulating material such as an aluminum oxide sintered body, and a metal powder metallization such as tungsten or molybdenum. It is formed by arranging a wiring conductor. And while mounting an electronic component on such a wiring board and electrically connecting each electrode of an electronic component to a corresponding wiring conductor via electrical connection means, such as solder and a bonding wire, an electronic device is obtained. Produced.

  Such wiring boards have become smaller in size in response to recent demands for thinner and smaller electronic devices. In order to efficiently produce a plurality of wiring boards, a plurality of wirings are provided at the center. A so-called multi-piece wiring board in which substrate regions are arranged vertically and horizontally is manufactured by dividing the substrate region along the boundary of each wiring substrate region.

  Further, in such a multi-piece wiring board, the wiring conductor is formed in the wiring board area, and a dummy area is provided on the outer peripheral portion so as to surround the plurality of wiring board areas. In this dummy area, a wiring for plating and a frame-like plating conductor are formed, which are electrically connected to the wiring conductors of each wiring board area. By immersing this multi-piece wiring board in a plating bath and supplying current to each wiring conductor via the plating wiring and the plating conductor, a plating layer is formed on the exposed surface of the wiring conductor by electrolytic plating. Adhere.

  And after mounting an electronic component in each wiring board area | region and electrically connecting an electronic component and a wiring conductor, several electronic devices are manufactured simultaneously by dividing | segmenting for every wiring board area | region ( For example, see Patent Document 1.)

  In addition, in the case of a multi-piece wiring board for a light emitting device in which a light emitting element is mounted as an electronic component in each wiring board area, each wiring board area is sealed after being mounted with a light emitting element in each wiring board area and sealed with resin or the like. Before dividing along the boundary, a current may be passed through the wiring conductor to cause the light emitting elements to emit light and check the state of each light emitting device.

JP 2000-165003 A

  However, when a current is passed through the wiring conductor of the multi-piece wiring board, the wiring conductors of all wiring board regions are electrically connected by the plating wiring and the frame-shaped plating conductor. In the case where a light emitting element is mounted as an electronic component in the substrate region, a current flows through the plurality of mounted light emitting elements, and the plurality of light emitting elements emit light simultaneously. For this reason, the light of each light emitting element mounted in each wiring board region becomes weak, and it cannot be confirmed whether the light emitting device emits desired light when divided into individual light emitting devices. It was. Further, when a high voltage is applied to a wiring conductor of a multi-piece wiring board or a high current is applied in order to increase the light of the light emitting element, the light emitting element may be damaged.

  The present invention has been devised in view of the above-described problems of the prior art, and the purpose of the present invention is to make it possible to individually confirm the electrical connection state of electronic components for each wiring board region. The object is to provide a single-piece wiring board.

  The multi-cavity wiring board according to the present invention includes a mother board in which a plurality of wiring board regions are arranged in a central portion in a vertical and horizontal manner, a dummy region is arranged in an outer peripheral portion, and a plurality of insulating layers are stacked. And a plurality of first wiring conductors and second wiring conductors provided in the wiring board region, each part of which is exposed on the surface of the wiring board region, and a plurality of the wiring board regions arranged in the vertical direction. A plurality of first plating wirings connecting the first wiring conductors and a plurality of second wiring conductors in the wiring board region arranged in the lateral direction are connected. The first plating wiring and the first plating wiring disposed in an insulating layer different from the insulating layer in which the first plating wiring is disposed, the plurality of second plating wirings, and the first plating wiring and the first And a common conductor electrically connected to the plating wiring.

  According to the multi-cavity wiring board of the present invention, the plurality of first plating wirings connecting the plurality of first wiring conductors in the wiring board region arranged in the vertical direction and the wiring arranged in the horizontal direction. A plurality of second wiring conductors in the substrate region are connected to each other, and provided in a dummy region and a plurality of second plating wirings disposed in an insulating layer different from the insulating layer in which the first plating wiring is disposed. The first plating wiring and the second plating wiring that are electrically connected to the first plating wiring and the first plating wiring arranged in the vertical direction and the horizontal arrangement. The first plating wiring and the second plating wiring can be made electrically independent by separating the second plating wiring and the common conductor formed in the dummy region. In this manner, with the first plating wiring and the second plating wiring being electrically independent, the electronic component is mounted on each wiring board region, and the electrode of the electronic component, the first wiring conductor, and the first wiring conductor After electrically connecting the two wiring conductors, if a current is passed between the first plating wiring and the second plating wiring, the first wiring conductor and the second wiring in each wiring board region Since a current can flow between the conductors, the state of the electronic components in each wiring board region can be individually confirmed.

(A) is a top view which shows an example of embodiment of the multi-cavity board | substrate of this invention, (b) is sectional drawing in the AA of (a). (A) is a bottom view of the multi-cavity wiring board in FIG. 1, and (b) is a sectional view taken along line AA in (a). (A) is a top view which shows an example of the form which separated the multi-piece wiring board in FIG. 1 along the planned separation line, (b) is a bottom view of (a). (A) is a top view which shows the other example of embodiment of the multiple substrate of this invention, (b) is sectional drawing in the AA of (a). (A) is a bottom view of the multi-cavity wiring board in FIG. 4, and (b) is a cross-sectional view taken along the line AA in (a). (A) is a top view which shows the other example of embodiment of the multi-cavity board | substrate of this invention, (b) is a bottom view of (a). (A) is a top view which shows the other example of embodiment of the multi-cavity board | substrate of this invention, (b) is a bottom view of (a).

A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings. 1 to 7, 1 is a mother board, 1 a is a wiring board area, 1 b is a dummy area, 2 is a first wiring conductor, 3 is a second wiring conductor, 4 is a first plating wiring, The second plating wiring, 6 is a plating frame, 7 is a plating terminal, 8 is a separation line, 9 is a division line, 10 is an electronic component, 11 is a recess, and 12 is a contact pad.

  In the multi-piece wiring board of the example shown in FIGS. 1, 2, and 4 to 7, a plurality of wiring board regions 1 a are arranged vertically and horizontally in the center of the mother board 1, and dummy is placed on the outer periphery of the mother board 1. Region 1b is provided. A large number of wiring mother boards in which a plurality of wiring board regions 1a are arranged in the central portion can be successfully produced with a plurality of small wiring boards (not shown) by dividing the wiring board regions 1a individually. It becomes a wiring board. In the example shown in FIGS. 1, 2 and 4 to 7, a total of 20 wiring board regions 1 a of 5 rows in the vertical direction and 4 rows in the horizontal direction are arranged at the center of the mother board 1. ing. A first wiring conductor 2 and a second wiring conductor 3 are arranged in each wiring board region 1a. The first wiring conductor 2 is electrically connected to the first plating wiring 4 disposed so as to extend in the vertical direction, and the second wiring conductor 3 is disposed in the second direction so as to extend in the lateral direction. The plating wiring 5 is electrically connected. The first plating wiring 4 and the second plating wiring 5 are electrically connected to a plating frame 6 provided as a common conductor in the dummy region 1b.

  The multi-cavity wiring board of the present invention has a mother board in which a plurality of wiring board regions 1a are arranged vertically and horizontally in the central portion, and a dummy region 1b is arranged in the outer peripheral portion, and a plurality of insulating layers are laminated. 1st wiring conductor 2 and 2nd wiring conductor 3 which were provided in the board | substrate 1, the wiring board area | region 1a, and each one part was exposed to the surface of the wiring board area | region 1a, and the wiring board area | region arrange | positioned vertically A plurality of first plating wires 4 for connecting a plurality of first wiring conductors 1a of 1a and a plurality of second wiring conductors 3 of a wiring board region 1a arranged in the lateral direction are connected, A plurality of second plating wirings 5 disposed in an insulating layer different from the insulating layer in which one plating wiring 4 is disposed, and the first plating wiring 4 and the second plating wiring provided in the dummy region 1b. As a common conductor electrically connected to the plating wiring 5 And a use frame 6 Ki Tsu.

  According to such a multi-piece wiring board of the present invention, with the above-described configuration, the first plating wiring 4 arranged in the vertical direction and the second plating wiring 5 arranged in the horizontal direction, By separating the plating frame 6 at the dummy region 1b, the first plating wiring 4 and the second plating wiring 5 can be electrically independent. In this way, in a state where the first plating wiring 4 and the second plating wiring 5 are electrically independent, the electronic component 10 is mounted on each wiring board region 1a, and the electrodes of the electronic component 10 and the first wiring After electrically connecting the wiring conductor 2 and the second wiring conductor 3, if a current is passed between the first plating wiring 4 and the second plating wiring 5, each wiring board region 1 a Since a current can be passed between the first wiring conductor 2 and the second wiring conductor 3, the state of the electronic component 10 in each wiring board region 1a can be individually confirmed. For example, as in the example shown in FIG. 3, a light emitting element is mounted as an electronic component 10 on each wiring board region 1a, and the electrode of the light emitting element and the first wiring conductor 2 and the second wiring conductor 3 are electrically connected. After the connection to, if a current is passed between the first plating wiring 4 and the second plating wiring 5, the light emitting state of the light emitting element in each wiring board region 1 a can be individually confirmed.

The mother board 1 is formed by laminating a plurality of insulating layers made of an insulating material such as ceramics or resin. When the mother substrate 1 is made of ceramics, for example, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, a glass ceramic, etc. Materials can be used. When the mother board 1 is made of a resin, for example, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a polyester resin, a fluorocarbon resin such as a tetrafluoroethylene resin, or a glass epoxy resin, A material made of glass fiber impregnated with a resin can be used as the material. A wiring board region 1a shown in FIGS. 1 to 7 (surrounded by a broken dividing line 9) in which the first wiring conductor 2 and the second wiring conductor 3 are formed in the center of the mother board 1 is formed. Are arranged vertically and horizontally. A dummy region 1 b is provided on the outer peripheral portion of the mother board 1. In the dummy region 1b, a first plating wiring 4, a second plating wiring 5, a plating frame 6, and a plating terminal 7 are formed. The dummy region 1b can also be used as a region for positioning, fixing, and the like during processing or transport of a later-described generated shape to be the mother substrate 1 and a multi-piece wiring substrate.

  If the mother substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and solvent, plasticizer, dispersion for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by adding and mixing the agent is formed into a sheet shape by using a conventionally known sheet forming method such as a doctor blade method to obtain a ceramic green sheet, and then punching suitable for the ceramic green sheet In addition, a plurality of layers are laminated as necessary to produce a shaped body to be the mother substrate 1 and fired at a temperature of about 1500 to 1800 ° C.

  Further, when the mother substrate 1 is made of resin, it can be manufactured by using a mold that can be molded into a predetermined shape of the mother substrate 1 by a transfer molding method, an injection molding method, or the like. Further, for example, a glass fiber base material impregnated with a resin, such as glass epoxy resin, in this case, a glass fiber base material is impregnated with an epoxy resin precursor, This epoxy resin precursor can be produced by thermosetting at a predetermined temperature.

  Further, in the wiring board region 1a of the mother board 1, as in the example shown in FIGS. 4 and 5, a recess 11 in which the electronic component 10 is mounted may be formed as necessary. If the mother substrate 1 is made of ceramics, the recesses 11 are formed by punching through holes for the recesses 11 in some of the plurality of ceramic green sheets for the mother substrate 1 by die or punching, laser processing methods, etc. It can be formed by forming.

  The shape of the concave portion 11 may be a polygonal shape such as a quadrangle in a plan view, a circular shape such as a circular shape or an elliptical shape, or the like. Further, as shown in FIGS. 4 and 5, when the circular shape is seen in a plan view and the inner peripheral surface of the recess 11 is inclined so that the opening side becomes larger, for example, a light emitting element is mounted as the electronic component 10. In this case, the light emitted from the light emitting element can be favorably reflected by the inner peripheral surface of the recess 11 and emitted to the outside.

  The first wiring conductor 2 and the second wiring conductor 3 are formed on one main surface of the mother board 1 and serve as connection electrodes connected to the electrodes of the electronic component 10, and are formed on the other main surface of the mother board 1. An external terminal electrode for connecting to the wiring conductor of the external circuit board, and an internal wiring conductor such as a through conductor that is formed inside the mother board 1 and connects the connection electrode and the external terminal electrode to each other. is there.

When the mother substrate 1 is made of ceramics, the first wiring conductor 2 and the second wiring conductor 3 are screened on the surface of the ceramic green sheet for the mother substrate 1 when arranged on the surface of the insulating substrate or the recess 11. It is formed by printing and applying a metallized paste by printing means such as a printing method and baking it together with the generated shape for the mother substrate 1. Further, the first wiring conductor 2 and the second wiring conductor 3 penetrate through the mother board 1 and electrically connect the first wiring conductors 2 and the second wiring conductors 3 positioned vertically. In the case of including a conductor, the through-hole is formed by a punching method using a die or punching or a processing method such as laser processing on a ceramic green sheet for the mother substrate 1 prior to printing and application of a metallized paste for forming a portion to be a through conductor. The metallized paste is filled in the through-holes by a printing means such as a screen printing method, and is fired together with the generated shape to be the mother substrate 1. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as required to the main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. Further, glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate 1 after firing. What is necessary is just to adjust the metallized paste with which it fills a through-hole to a viscosity higher than the metallized paste printed on the surface of a ceramic green sheet suitable for filling with the kind and addition amount of an organic binder or an organic solvent.

  The first wiring conductor 2 and the second wiring conductor 3 are made of copper (Cu), gold (Au), aluminum (Al), nickel (Ni), chromium (when the mother board 1 is made of resin). It is made of a metal material such as Cr), molybdenum (Mo), titanium (Ti), and alloys thereof. For example, the copper foil processed into the shape of the 1st wiring conductor 2 and the 2nd wiring conductor 3 is transcribe | transferred on the resin sheet which consists of glass epoxy resins, and the resin sheet in which the copper foil was transcribe | stacked is laminated | stacked with an adhesive agent. It is formed by bonding. Of the internal conductors, the through conductors that penetrate the resin sheet in the thickness direction can be deposited on the inner surface of the through holes formed in the resin sheet by conductor paste printing or plating, or by filling the through holes. Good. Alternatively, the metal foil or metal pillar may be integrated by resin molding, or may be deposited on the insulating substrate by sputtering, vapor deposition, plating, or the like.

  The first plating wiring 4 electrically connects the plurality of first wiring conductors 2 in the wiring board region 1a arranged in the vertical direction, and the first wiring wiring 4 in the wiring board region 1a located at the outermost part in the vertical direction. 1 wiring conductor 2 and the plating frame 6 are electrically connected. The second plating wiring 5 electrically connects the plurality of second wiring conductors 3 in the wiring substrate region 1a arranged in the horizontal direction, and the wiring substrate region 1a located at the outermost side in the horizontal direction. The second wiring conductor 3 and the plating frame 6 are electrically connected.

  Further, the first plating wiring 4 and the second plating wiring 5 are arranged on both main surfaces of the mother board 1 in the example shown in FIGS. 1 and 2, but are shown in FIGS. As in the example, it may be arranged inside the mother board 1. In such a case, the first plating wiring 4 and the second plating wiring 5 may be arranged between different insulating layers of the mother substrate 1. When the first plating wiring 4 and the second plating wiring 5 are arranged on the surface of the mother substrate 1, the exposed surfaces of the first plating wiring 4 and the second plating wiring 5 are also exposed. Since the plating layer is deposited, when the multi-piece wiring board is divided along the planned dividing line 9, the plating layer may be elongated or plating dust may be scattered. In addition, it is preferable to dispose the first plating wiring 4 and the second plating wiring 5 in advance, because the expansion of the plating layer and the scattering of the plating scraps can be suppressed. In addition, when the first plating wiring 4 and the second plating wiring 5 are arranged inside the mother board 1, the plating wiring is formed by dividing grooves formed before the plating is applied. By arranging them between the layers that are not formed, the dividing grooves can be formed along the planned separating lines 8 and the planned dividing lines 9. One of the first plating wiring 4 and the second plating wiring 5 may be arranged on the surface of the mother board 1 and the other may be arranged inside the mother board 1 as necessary. A division groove can be formed along the planned separation line 8 and the planned division line 9 on the main surface where the wiring is not disposed before the plating layer is deposited.

The plating terminal 7 is for electrically connecting the first plating wiring 4 and the second plating wiring 5 to a plating power source or a jig connected to the plating power source. . In the example shown in FIGS. 1, 2, and 4 to 7, the plating terminal 7 is formed on the inner surface of a notch provided on the outer side of the mother board 1, and is a frame-shaped common conductor surrounding the wiring board region 1a. Are electrically connected to the first plating wiring 4 and the second plating wiring 5 through the plating frame 6. These plating terminals 7 are formed by punching out a ceramic green sheet with a mold or the like to form a through hole to be cut out, and then, on the inner surface of the through hole, the first wiring conductor 2 and the second wiring conductor 3 are formed. It can be formed by printing and applying a metallized paste similar to the metallized paste used for printing.

  Further, in the example shown in FIGS. 1, 2, and 4 to 7, the plating terminal 7 is formed on the inner surface of the notch formed on the side surface of the mother substrate 1, but the mother substrate 1 is formed in the dummy region 1b. May be formed on the inner surface of the through hole.

  The plating frame 6 is disposed in the dummy region 1 b and is electrically connected to the first plating wiring 4 and the second plating wiring 5. In the example shown in FIGS. 1, 2, and 4 to 7, the plating frame 6 is formed on both main surfaces of the mother substrate 1, but only on one of the main surfaces of the mother substrate 1. It may be formed or arranged inside the mother board 1. When a plurality of plating frames 6 are formed as in the examples shown in FIGS. 1, 2, and 4 to 7, the first wiring conductor 2 and the second wiring conductor 3 from the plating terminal 7. Thus, the variation in the thickness of the plating layer deposited on the exposed surfaces of the first wiring conductor 2 and the second wiring conductor 3 can be reduced. When a plurality of plating frames 6 are formed, the plating frames 6 are electrically connected to each other by through conductors or the like to reduce the resistance value of the plating frame 6 and the first wiring. Variations in the thickness of the plating layer deposited on the exposed surfaces of the conductor 2 and the second wiring conductor 3 can be reduced.

  When the plating frames 6 are formed on both main surfaces of the mother board 1, the resistance values of the first wiring conductor 2 and the first plating wiring 4 in the respective wiring board regions 1a and the second wiring conductor 3 are used. When the resistance value of the second plating wiring 5 is greatly different, the width, thickness, arrangement, material, etc. are different between the plating frame 6 on the one main surface and the plating frame 6 on the other main surface. Thus, the resistance value from the plating frame 6 to the first wiring conductor 2 and the resistance value from the plating frame 6 to the second wiring conductor 3 may be approximately the same. Thereby, the variation in the thickness of the plating layer deposited on the exposed surface of the first wiring conductor 2 and the exposed surface of the second wiring conductor 3 can be reduced.

  The first plating wiring 4, the second plating wiring 5, and the plating frame 6 are formed by the same material and method as the first wiring conductor 2 and the second wiring conductor 3 described above. Can do.

  The common conductor for electrically connecting the plating terminal 7 to the first plating wiring 4 and the second plating wiring 5 is not limited to the frame shape, for example, the first plating wiring in a plan view. 4 is arranged to be connected to the first plating wiring 4 in at least one of the upper and lower dummy areas, and the second plating wiring 4 is arranged in at least one of the left and right dummy areas of the second plating wiring 5. It may be connected and arranged. In such a case, the common conductor connected to the first plating wiring 4 and the common conductor connected to the second plating wiring 5 may be electrically connected to the plating terminal 7. Further, the common conductor connected to the first plating wiring 4 and the common conductor connected to the second plating wiring 5 may be electrically connected by wiring formed inside the mother board 1. .

  When the plating layer is deposited on the exposed surfaces of the first wiring conductor 2 and the second wiring conductor 3, the mother substrate 1 is immersed in a plating bath for electrolytic plating, and the plating terminal 7 is A current is supplied to the first plating wiring 4 and the second plating wiring 5 by connecting to a power supply for plating.

In the case where the plating frame 6 is formed as a common conductor as in the examples shown in FIGS. 1, 2, and 4 to 7, the plating terminals 7 are respectively set near the four corners. If provided one by one, variation in the current supplied to each of the plurality of wiring board regions 1a is reduced, and the first wiring conductor 2 and the second wiring conductor 3 for each wiring board region 1a are exposed. Variation in the thickness of the plating layer deposited on the surface can be reduced.

  The plating layer deposited on the exposed surfaces of the first wiring conductor 2 and the second wiring conductor 3 is a metal having excellent corrosion resistance, such as nickel, gold, or silver, a metal having excellent connectivity of the connection member, or light. For example, a nickel plating layer (not shown) with a thickness of about 1 to 10 μm directly applied to each of the first wiring conductor 2 and the second wiring conductor 3. And a gold plating layer having a thickness of about 0.1 to 3 μm or a silver plating layer (not shown) having a thickness of about 0.1 to 5 μm deposited on the nickel plating layer. By forming such a plating layer, corrosion of the first wiring conductor 2 and the second wiring conductor 3 can be effectively suppressed. Further, when the gold plating layer is applied as the outermost layer, the electronic component 10 is fixed to the first wiring conductor 2 or the second wiring conductor 3, or the first wiring conductor 2 or the second wiring conductor. 3 and a connection member (not shown) such as a bonding wire, and the connection between the first wiring conductor 2 or the second wiring conductor 3 and the wiring conductor of the external electric circuit board can be strengthened. In addition, when the silver plating layer is applied as the outermost layer, the reflectance of light is high, and when the light emitting element is mounted as the electronic component 10, the light emitted from the light emitting element can be favorably reflected.

  Then, the electronic component 10 is mounted for each wiring board region 1a, and the electronic component 10 is electrically connected to the first wiring conductor 2 and the second wiring conductor 3. The electronic component 10 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element such as a light emitting diode, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, or various sensors.

  For example, when the electronic component 10 is a flip-chip type light emitting element, the electronic component 10 emits light through a bonding material such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin). The device electrode is mounted by electrically and mechanically connecting the first wiring conductor 2 and the second wiring conductor 3. Also, underfill may be injected between the light emitting element and the wiring board after bonding by bumps.

  Further, for example, when the electronic component 10 is a wire bonding type light emitting element, the light emitting element is fixed with a bonding agent such as glass, resin or brazing material, and then the light emitting element is connected via a connecting agent such as a bonding wire. Are mounted by electrically connecting the first wiring conductor 2 and the second wiring conductor 3 to each other.

  Further, for example, when the electronic component 10 is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor are electrically connected by a bonding material such as a conductive resin. .

  The electronic component 10 is sealed with a cap-like or plate-like lid made of metal, ceramics, glass, resin, or the like. As the lid, one having a thermal expansion coefficient close to that of the mother substrate 1 is preferable. For example, if the mother substrate 1 is made of an aluminum oxide sintered body and a lid made of metal is used, Fe What consists of -Ni (iron-nickel) alloy, Fe-Ni-Co (iron-nickel-cobalt) alloy, etc. may be used. When the electronic component 10 is a light-emitting element, not only a translucent cap or plate-shaped lid made of glass or resin, but also a translucent lens or lens made of glass or resin is attached. A cap-shaped or plate-shaped lid body may be used.

  Further, if necessary, the electronic component 10 may be covered with a resin such as an epoxy resin or a silicone resin. For example, when the electronic component 10 is formed of a light emitting element, the wavelength of light emitted from the light emitting element may be converted by the phosphor using a resin containing the phosphor.

  After mounting the electronic component 10 for each wiring board region 1a, as shown in the example shown in FIG. 3, the multi-piece wiring board is separated by the planned separation line 8 between the wiring board region 1a and the plating frame 6. Thus, the first plating wiring 4 and the second plating wiring 5 and the plating frame 6 are separated, and the first plating wiring 4 arranged in the vertical direction and the first plating wiring 4 are arranged in the horizontal direction. The second plating wiring 5 is electrically independent. By selecting one of the first plating wirings 4 arranged in the vertical direction and one of the second plating wirings 5 arranged in the horizontal direction and passing a current, the first plating wiring 4 An electric current is passed through the electronic component 10 electrically connected to the first wiring conductor 2 and the second wiring conductor 3 in the wiring board region 1a where one and the second plating wiring 5 intersect. Can do. For example, in the case of using a light emitting element as the electronic component 10, the light emitting state can be confirmed by causing the light emitting element to emit light for each wiring board region 1a.

  As a method of separating the multi-piece wiring board by the planned separation line 8, a dividing groove is formed on the planned separation line 8, and the dividing groove is bent along the dividing groove, or by a slicing method or the like. A method of cutting along the outer edge of the wiring board region 1a can be used. The dividing groove is formed by pressing the cutter blade against the generated shape for the mother substrate 1 or by cutting it with a slicing device to be smaller than the thickness of the generated shape, or after firing, smaller than the thickness of the mother substrate 1 by the slicing device. It can be formed by cutting.

  Moreover, a plurality of light emitting devices are manufactured by dividing the multi-piece wiring board separated by the planned separation line 8 as described above along the planned division line 9 on the outer edge of the wiring board region 1a. As a method of dividing the multi-piece wiring board on which the light emitting elements are mounted into a plurality of light emitting devices, the same method as that used when separating by the planned separation line 8 can be used.

  When dividing grooves are formed on both the planned separation line 8 and the planned dividing line 9, the depth of the dividing grooves formed on the planned separation line 8 is greater than the depth of the dividing grooves formed on the planned dividing line 9. It is effective to make the depth deeper because it is possible to reduce the division by the planned dividing line 9 when separating by the planned separating line 8.

  Further, as in the example shown in FIGS. 6 and 7, contact pads 12 wider than the widths of the first plating wiring 4 and the second plating wiring 5 are formed on the surface of the mother substrate 1. It doesn't matter. By forming the contact pad 12, a better connection to the power source can be achieved. Further, if the contact pads 12 are led out to the same main surface of the mother board 1, it is effective to confirm that each connection pad 12 and the power source are connected. The contact pad 12 can be formed on the main surface of the mother board 1 by using the same material and method as those of the first wiring conductor 2 and the second wiring conductor 3 described above.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, the first wiring conductor 2 or the second wiring conductor 3 is a so-called caster formed by applying a conductor to the inner surface of a notch formed at the boundary of the wiring board region 1a or filling the notch with a conductor. It is also possible to use a connection conductor.

  Further, a plurality of first wiring conductors 2 or second wiring conductors 3 may be formed in each wiring board region 1a. For example, in the example shown in FIG. 7, one first wiring conductor 2 is formed as a common electrode, and three second wiring conductors 3 are formed as individual electrodes. A plurality of electronic components 10 may be mounted on the wiring board region 1a, and the first wiring conductor 2 and the second wiring conductor 3 corresponding to each of the plurality of electronic components 10 may be formed.

Further, when a plurality of first wiring conductors 2 or second wiring conductors 3 are formed in each wiring board region 1a, a plurality of plating wirings connected to these wiring conductors are arranged on the dummy region 1b. It does not matter if it is connected to one contact pad 12. As a result, 1
By bringing a power source into contact with the two contact pads 12, a current can flow simultaneously through the plurality of first wiring conductors 2 or the second wiring conductors 3, and when the light emitting element is mounted as the electronic component 10, one It is possible to confirm the state as a light emitting device that simultaneously emits light from a plurality of light emitting elements mounted on the wiring board region 1a.

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a ... Wiring board area | region 1b ... Dummy area 2 ... 1st wiring conductor 3 ... 2nd wiring conductor 4 ...... For 1st plating Wiring 5... Second plating wiring 6... Plating frame 7... Plating terminal 8.
10 ... Electronic components
11 ... Recess
12 ... Contact pads

Claims (1)

  A plurality of wiring board regions are arranged in the center portion in the vertical and horizontal directions, a dummy region is provided in the outer peripheral portion, and a mother board in which a plurality of insulating layers are stacked, and the wiring board region is provided. The first wiring conductor and the second wiring conductor, each part of which is exposed on the surface of the wiring board region, and the plurality of first wiring conductors in the wiring board region arranged in the vertical direction are connected to each other. A plurality of the second plating wirings arranged in the lateral direction and arranged in an insulating layer different from the insulating layer on which the first plating wirings are arranged. A plurality of second plating wirings connecting the wiring conductors, and a common conductor provided in the dummy region and electrically connected to the first plating wiring and the second plating wiring; Multi-pieces characterized by having Wiring board.

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