JP2013239548A - Sheet substrate, electronic component, electronic apparatus, electronic component testing method and electronic component manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet substrate, an electronic component, an electronic apparatus, an electronic component testing method and an electronic component manufacturing method, which avoid interference between electronic elements and facilitate testing in the electronic components which are structured by substrate region by respectively arranging the electronic elements in the substrate regions of the sheet substrate.SOLUTION: A sheet substrate 54 includes a plurality of substrate regions 56 arranged in a matrix, in each of which an integrated circuit 50 is arranged, and a mounting electrode 18A and a mounting electrode 18B are arranged to be electrically connected to each integrated circuit 50. The sheet substrate 54 of the present embodiment includes: first terminals 62A-62C for connecting the mounting electrodes 18A to the substrate regions 56 with respect to each row and in parallel with each other; and second terminals 66A-66C for connecting the mounting electrodes 18B to the substrate regions 56 with respect to each column and in parallel with each other. Any integrated circuit 50 among the integrated circuits 50 which is specified by the selected first terminal 62A-62C and the selected second terminal 66A-66C can be activated.

Description

  The present invention relates to a sheet substrate, an electronic component, an electronic device, an electronic component inspection method, and an electronic component manufacturing method, and in particular, a technique capable of easily performing an inspection after mounting an electronic element mounted on the electronic component. It is about.

  Conventionally, a so-called multi-cavity technique has been used as an efficient method for manufacturing electronic components. Specifically, a sheet substrate having a plurality of substrate regions is prepared, and an electronic element such as a piezoelectric vibrating piece or IC is arranged in each substrate region, and the sheet substrate is divided into individual pieces along the boundary of the substrate region. Thus, individual electronic components are obtained.

  In the above electronic component, there are cases where operations such as operation confirmation are performed on an electronic element mounted on the electronic component. For example, when the electronic element is a piezoelectric vibrating piece and an integrated circuit connected to the piezoelectric vibrating piece, an inspection probe is brought into contact with a connection electrode electrically connected to the integrated circuit, and whether or not the piezoelectric vibrating piece oscillates, Alternatively, it may be inspected whether the resonance frequency, CI value, etc. are within an appropriate range. By this operation, only the electronic components that have passed the inspection can be advanced to the next step.

By the way, in order to reduce the cost of electronic components, it is necessary to increase the number of manufactured electronic components per sheet substrate, but the inspection of individual electronic components becomes more complicated as the number of electronic components is increased.
In Patent Document 1, wirings are drawn from the connection electrodes of each substrate region, the wirings are connected in parallel outside the substrate region, and electric power is supplied from the wirings connected in parallel to the electronic components, so that a plurality of electronic components are simultaneously connected. A configuration for starting and inspecting an electronic component is disclosed.

JP 2004-328505 A

  However, in the case of the configuration of Patent Document 1, since the electronic elements arranged in the respective substrate regions are activated simultaneously, the electronic elements may interfere with each other. For example, when the electronic element is an integrated circuit connected to the piezoelectric vibrating piece, the piezoelectric vibrating pieces interfere with each other, and the resonance frequency of the piezoelectric vibrating piece changes, which may make proper inspection difficult.

  Therefore, the present invention pays attention to the above-mentioned problems, and avoids interference between electronic elements and facilitates inspection of electronic components constructed for each board area by arranging electronic elements in the board area of the sheet substrate. An object of the present invention is to provide a sheet substrate, an electronic component, an electronic device, an electronic component inspection method, and an electronic component manufacturing method.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A plurality of substrate regions arranged in a matrix, electronic elements are arranged in each substrate region, and a first mounting electrode and a second mounting electrode that are electrically connected to the electronic elements are A sheet substrate disposed in a substrate region, wherein the first mounting electrode is connected in parallel for each row of the substrate region, and the second mounting electrode is connected to a column of the substrate region. A second terminal connected in parallel to each other, and among the electronic elements, the electronic terminal specified by the selected first terminal and the second terminal can be activated. A sheet substrate characterized by that.
With the above configuration, an arbitrary electronic element can be selectively activated, so that interference between adjacent electronic elements can be avoided. In addition, since it is not necessary to bring an inspection probe or the like into contact with an electrode arranged in a substrate region to be inspected, a sheet substrate capable of easily inspecting an electronic element is obtained.

Application Example 2 A third mounting electrode and a fourth mounting electrode that are arranged in each substrate region and are electrically connected to the electronic element, and one of the substrate regions as adjacent rows or columns. The substrate regions arranged in the direction, the third mounting electrodes arranged in the substrate region included in one array, and the first region disposed in the substrate region included in the other array 4. The sheet substrate according to application example 1, further comprising a third terminal that connects the four mounting electrodes in parallel.
With the above configuration, the third terminal connected to the third mounting electrode of the activated electronic element is different from the third terminal connected to the fourth mounting electrode of the activated electronic element. Therefore, electrical connection to the third mounting electrode and the fourth mounting electrode connected to the activated electronic element can be performed with only the third terminal.

Application Example 3 In each substrate region, a fifth mounting electrode that is bonded to the electronic element is disposed, and the second terminals are arranged in one direction as adjacent rows in the substrate region. The second mounting electrodes disposed in the substrate region included in one array, and the fifth mounting electrode disposed in the substrate region included in the other array. And the sheet substrate according to Application Example 1 or 2, wherein the two are connected in parallel.
With the above configuration, the second terminal that is the connection destination of the second mounting electrode of the activated electronic element is different from the second terminal that is the connection destination of the fifth mounting electrode of the activated electronic element. become. Therefore, the second mounting electrode and the fifth mounting electrode connected to the activated electronic element can be electrically connected only by the second terminal.

Application Example 4 The electronic element is arranged in each substrate region of the sheet substrate according to any one of Application Examples 1 to 3, and the sheet substrate is divided along the boundary of the substrate region to be separated into pieces. Electronic parts characterized by being made.
For the same reason as in Application Example 1, the electronic component can be easily inspected by avoiding interference between the electronic devices.

Application Example 5 An electronic apparatus comprising the electronic component according to Application Example 4 mounted thereon.
For the same reason as in Application Example 1, the electronic device can avoid the interference between the electronic elements and can easily inspect the electronic elements.

Application Example 6 For a sheet substrate having a plurality of substrate regions arranged in a matrix, an electronic element is arranged in each substrate region, and a first mounting electrode and a second mounting are electrically connected to the electronic device. An electronic component inspection method configured for each substrate region in the sheet substrate by disposing an electrode in each substrate region, wherein the first mounting electrode is connected to a first terminal for each row of the substrate region. The second mounting electrode is connected to a second terminal for each column of the substrate region, and is specified by the selected first terminal and the second terminal among the electronic elements. A method for inspecting an electronic component, comprising: activating any of the electronic elements.
For the same reason as in Application Example 1, an electronic component inspection method is provided in which interference between electronic elements is avoided and the electronic elements can be easily inspected.

Application Example 7 With respect to a sheet substrate having a plurality of substrate regions arranged in a matrix, an electronic element is arranged in each substrate region, and a first mounting electrode and a second mounting are electrically connected to the electronic device. An electronic component manufacturing method configured for each substrate region on the sheet substrate by disposing electrodes in each substrate region, wherein the first mounting electrode is connected in parallel for each row of the substrate region A first step of arranging a first terminal and a second terminal for connecting the second mounting electrode in parallel for each column of the substrate region; and the first selected among the electronic elements. A second step of activating any of the electronic elements specified by one terminal and the second terminal, and a third step of dividing the sheet substrate along a boundary of the substrate region. A method for manufacturing electronic components.
For the same reason as in Application Example 1, an electronic component manufacturing method is provided in which interference between electronic elements is avoided and the electronic elements can be easily inspected.

It is a circuit diagram of the sheet substrate of a 1st embodiment. It is a top view of the sheet substrate of a 1st embodiment. It is the sectional view on the AA line of FIG. It is a back view of the sheet substrate of a 1st embodiment. It is an enlarged view of the part enclosed with the dashed-dotted line of FIG. It is a schematic diagram of the electronic component of this embodiment. It is a circuit diagram of the sheet substrate of a 2nd embodiment. It is a circuit diagram of the sheet substrate of a 3rd embodiment. It is a top view of the sheet substrate of a 3rd embodiment. It is a schematic diagram of the electronic device carrying the electronic component of this embodiment.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 is a circuit diagram of a sheet substrate according to the first embodiment. The sheet substrate 54 of the first embodiment is a collection of a plurality of electronic components 10 (substrate regions 56) in a matrix (3 × 3 = 9 in this embodiment), and wiring is arranged vertically and horizontally, The mounting electrodes 18A to 18E arranged in each electronic component 10 are connected by type. In the figure, the electronic components 10 are numbered (Nos. 1 to 9). In the figure, the vertical direction is the row direction, and the horizontal direction is the column direction.

  As will be described later, an integrated circuit 50 is disposed on the electronic component 10, and mounting electrodes 18 </ b> A to 18 </ b> E that are electrically connected to the integrated circuit 50 are disposed on the mounting surface 16 of the electronic component 10. The mounting electrode 18A (first mounting electrode) is a power supply terminal (Vdd), the mounting electrode 18B (second mounting electrode) is a ground terminal (GND), and the mounting electrode 18C (third mounting electrode) is an output terminal (OUT). The mounting electrode 18D (fourth mounting electrode) is an adjustment terminal (Vc) described later, and the mounting electrode 18E (fifth mounting electrode) is a temperature information output terminal (T) described later.

  The first wirings 60A, 60B, and 60C connect the mounting electrodes 18A of the electronic components 10 in the same row in parallel. The first wiring 60A connects the first, second, and third mounting electrodes 18A in parallel, and the first wiring 60B connects the fourth, fifth, and sixth mounting electrodes 18A in parallel, The first wiring 60C connects the seventh, eighth, and ninth mounting electrodes 18A in parallel. The first wirings 60A, 60B, and 60C are connected to the first terminals 62A, 62B, and 62C, respectively. Any one of the first terminals 62A, 62B, and 62C is turned on to apply the power supply voltage, and the rest is turned off to stop the application of the power supply voltage by an external switching control or the like.

  The second wirings 64A, 64B, 64C connect the mounting electrodes 18B of the electronic components 10 in the same column and the mounting electrodes 18E of the electronic components 10 in the same column in parallel. Here, the second wirings 64 </ b> A and 64 </ b> B are the electronic components 10 arranged in one direction as adjacent columns among the electronic components 10, and are arranged in the electronic components 10 included in one arrangement. The mounted electrodes 18B and the mounted electrodes 18E arranged on the electronic component 10 included in the other array are connected in parallel.

  Therefore, the second wiring 64A is connected in parallel to the mounting electrode 18B of the electronic component 10 of No. 1, 4, and 7 and the mounting electrode 18E of the electronic component 10 of No. 2, 5, and 8. ing. The second wiring 64B is formed by connecting the mounting electrodes 18B of the second, fifth, and eighth electronic components 10 and the mounting electrodes 18E of the third, sixth, and ninth electronic components 10 in parallel. Yes. The second wiring 64C connects the mounting electrodes 18B of the third, sixth, and ninth electronic components 10 in parallel.

  The second wirings 64A, 64B, and 64C are connected to the second terminals 66A, 66B, and 66C, respectively. Any one of the second terminals 66A, 66B, and 66C is turned on and grounded by an external switching control or the like, and the remaining terminals are turned off and the grounding is released. An external terminal (not shown) for acquiring temperature information output from the mounting electrode 18E can be connected to the second terminals 66A and 66B.

  The third wirings 68A and 68B connect the mounting electrode 18C of the electronic component 10 in the same column and the mounting electrode 18D of the electronic component 10 in the same column in parallel. Here, the third wirings 68 </ b> A and 68 </ b> B are the electronic components 10 arranged in one direction as adjacent columns among the electronic components 10, and are arranged on the electronic components 10 included in one arrangement. The mounted electrodes 18C and the mounted electrodes 18D disposed on the electronic component 10 included in the other array are connected in parallel.

  Therefore, the third wiring 68A connects the mounting electrode 18C of the electronic component 10 of No. 1, 4, and 7 and the mounting electrode 18D of the electronic component 10 of No. 2, 5, and 8 in parallel. doing. The third wiring 68B connects the mounting electrode 18C of the second, fifth, and eighth electronic components 10 and the mounting electrode 18D of the third, sixth, and ninth electronic components 10 in parallel. Yes.

  The third wirings 68A and 68B are connected to the third terminals 70A and 70B, respectively. An external terminal (not shown) for taking out an output from the mounting electrode 18C or an external terminal (not shown) for applying an adjustment voltage to the mounting electrode 18D may be connected to the third terminals 70A and 70B. it can.

  The auxiliary wiring 72A connects the mounting electrodes 18E of the first, fourth, and seventh electronic components 10 in parallel, and the auxiliary wiring 72B is the mounting electrode of the first, fourth, and seventh electronic components 10 18D is connected in parallel. The auxiliary wiring 72C connects the mounting electrodes 18B of the third, sixth, and ninth electronic components 10 in parallel.

  The auxiliary wirings 72A, 72B, 72C are connected to auxiliary terminals 74A, 74B, 74C, respectively. The auxiliary terminal 74A has an external terminal (not shown) for acquiring temperature information output from the mounting electrode 18E, and the auxiliary terminal 74B has an external terminal (not shown) for applying an adjustment voltage to the mounting electrode 18D. However, external terminals (not shown) for taking out the output from the mounting electrode 18C are connected to the auxiliary terminals 74C, respectively.

  The electronic component 10 is activated when a power supply voltage is applied to the mounting electrode 18A and the mounting electrode 18B is grounded. For example, as shown in FIG. 1, when starting the electronic component 10 of No. 5, the first terminal 62B (with an arrow in the figure) and the second terminal 66B (with an arrow in the figure) are turned on. . At this time, the power supply voltage is applied to the fourth and sixth electronic components 10 from the first terminal 62B. At this time, these electronic components 10 are not grounded and do not start.

  The fifth electronic component 10 is connected to the second terminal 66A, the third terminal 70A, and the third terminal 70B. Therefore, the temperature information of the fifth electronic component 10 can be taken out from the second terminal 66A (with arrow in the figure), and the fifth electronic component 10 can be taken from the third terminal 70A (with arrow in the figure). On the other hand, an adjustment voltage can be applied, and the output of the fifth electronic component 10 can be taken out from the third terminal 70B (with an arrow in the figure).

  In the above configuration, when the first terminal 62B is turned off and the first terminal 62A (60C) is switched to the on state, the operation of the fifth electronic component 10 is stopped and the second (eighth) electronic device is stopped. The component 10 can be activated. The temperature information can be extracted, the adjustment voltage can be applied, and the output of the electronic component can be detected with the same arrangement described above.

  When the first terminal 62B is turned on, the second terminal 66B is turned off, and the second terminal 66A (C) is switched to the on state, the operation of the fifth electronic component 10 is stopped and the fourth terminal 66B is turned on. The (No. 6) electronic component 10 can be activated. At this time, an external terminal (not shown) for extracting temperature information, an external terminal (not shown) for applying an adjustment voltage, and a connection destination of an external terminal (not shown) for extracting the output of the electronic component 10 are By switching to the terminals on the left (right adjacent), temperature information can be extracted, adjustment voltage can be applied, and the output of the electronic component 10 can be extracted. Therefore, in the sheet substrate 54 of the present embodiment, all the electronic components 10 are individually activated by arbitrarily selecting the first terminals 62A to 62C and the second terminals 66A to 66C to be turned on, Inspection can be performed.

  Thus, in this embodiment, since the arbitrary electronic component 10 (integrated circuit 50) is selectively activated, interference between the electronic components 10 adjacent to each other can be avoided. Further, since it is not necessary to bring the inspection probe or the like into contact with the mounting electrodes 18A to 18E disposed on the electronic component 10 (substrate region 56) to be inspected, the electronic component 10 (integrated circuit 50) can be easily inspected. This is a sheet substrate 54 that can be used.

  The second terminals 66A and 66B are not used simultaneously for grounding and for obtaining temperature information. That is, the second terminal to which the mounting electrode 18B of the activated electronic component 10 (integrated circuit 50) is connected is different from the second terminal to which the mounting electrode 18E of the activated electronic component 10 is connected. It will be. Therefore, it is possible to electrically connect to the mounting electrode 18B and the mounting electrode 18E connected to the activated electronic component 10 with only the second terminal.

  Similarly, the third terminals 70A and 70B are not used simultaneously for output extraction and adjustment voltage application. That is, the third terminal connected to the mounting electrode 18C of the activated electronic component 10 (integrated circuit 50) and the third terminal connected to the mounting electrode 18D of the activated electronic component 10 are different from each other. Therefore, electrical connection to the mounting electrode 18C and the mounting electrode 18D connected to the activated electronic component 10 (integrated circuit 50) can be performed with only the third terminal.

  Next, the structure of the sheet substrate 54 constructed based on the wiring diagram shown in FIG. 1 and a plurality of electronic components 10 constructed by the sheet substrate 54 will be described. 2 is a plan view of the sheet substrate of the first embodiment, FIG. 3 is a sectional view taken along line AA of FIG. 2, and FIG. 4 is a back view of the sheet substrate of the first embodiment. FIG. 5 shows an enlarged view of a portion surrounded by a one-dot chain line in FIG. 1, and FIG. 6 shows a schematic diagram of the electronic component of this embodiment. In FIG. 2, the cap 32 is omitted, and the piezoelectric vibrating piece 38 and the integrated circuit 50 are omitted in a part of the substrate region 56.

  As shown in FIG. 2, the sheet substrate 54 of the present embodiment is formed of an insulator such as ceramic, and a plurality (3 × 3 = 9) of substrate regions 56 arranged in a matrix and its surroundings The terminal region 58 is arranged. The substrate regions 56 are not in contact with each other and are separated from each other with a predetermined interval, and the first wirings 60A to 60C, the second wirings 64A to 64C, and the third wirings 68A to 68C are interposed therebetween. Is arranged.

  The piezoelectric vibrating piece 38 and the integrated circuit 50 are disposed in each substrate region 56 on the upper surface (mounting surface 14) of the sheet substrate 54, and the mounting electrodes 18A to 18E are disposed in each substrate region 56 on the back surface (mounting surface 16). Has been. As described above, in the sheet substrate 54 of the present embodiment, the electronic component 10 of the present embodiment is constructed for each substrate region 56, and the base substrate is obtained by dividing the sheet substrate 54 along the boundary of the substrate region 56. The electronic component 10 based on 12 is singulated.

  As shown in FIG. 6 and the like, in the electronic component 10, the piezoelectric vibrating piece 38 and the integrated circuit 50 are arranged side by side on the base substrate 12, and the cap 32 (FIG. 3) accommodates the piezoelectric vibrating piece 38 and the integrated circuit 50. It has a form joined to the base substrate 12 in the form. The electronic component 10 is a piezoelectric device that oscillates itself by receiving power from outside.

  The piezoelectric vibrating piece 38 is made of a piezoelectric material such as quartz. In the present embodiment, for example, a thickness-shear vibrating piece using a quartz AT-cut substrate is used. The piezoelectric vibrating piece 38 includes a vibrating portion 40 (see an enlarged view in FIG. 3) that vibrates in thickness and a mount portion 42 that is bonded to the base substrate 12. An excitation electrode 44A (X1) is disposed on the upper surface of the vibration unit 40, and an excitation electrode 44B (X2) is disposed on the lower surface. An extraction electrode 46A is extracted from the excitation electrode 44A, and an extraction electrode 46B is extracted from the excitation electrode 44B. The extraction electrode 46 </ b> B is extracted to the lower surface of the mount portion 42. The extraction electrode 46 </ b> A is extracted to the lower surface of the mount portion 42 via the upper surface and side surfaces of the mount portion 42. As the piezoelectric vibrating piece 38, a tuning fork type vibrating piece, a double tuning fork type vibrating piece, a SAW resonance piece, a gyro vibrating piece, or the like can be applied.

  The integrated circuit 50 is an electronic element in which an oscillation circuit that drives the piezoelectric vibrating piece 38 as an oscillation source, a temperature compensation circuit that performs temperature compensation of an oscillation signal of the oscillation circuit, and the like are integrally formed. A pad electrode 52 is disposed on the active surface (lower surface) of the integrated circuit 50. The pad electrode 52 includes connection terminals (X1, X2) electrically connected to the piezoelectric vibrating piece 38, a power supply terminal (Vdd) that receives power from the outside, a ground terminal (GND), and an output signal output terminal (OUT). Is placed. Further, as the pad electrode 52, an adjustment voltage input terminal (Vc) for inputting an adjustment voltage for adjusting the oscillation frequency of the output signal of the oscillation circuit built in the integrated circuit 50 is disposed. The integrated circuit 50 includes a thermistor, and temperature information is generated based on the thermistor. In order to output this, the integrated circuit 50 is provided with a temperature information output terminal (T) as one of the pad electrodes 52.

The base substrate 12 has a mounting surface 14 on which the piezoelectric vibrating piece 38 and the integrated circuit 50 are mounted, and a mounting surface 16 as the back surface thereof.
As shown in FIG. 5, mount electrodes 24 </ b> A and 24 </ b> B are arranged at positions facing the extraction electrodes 46 </ b> A and 46 </ b> B on the mounting surface 14 of the base substrate 12. Further, connection electrodes 20 (X1, X2, Vdd, GND, OUT, Vc, T) are arranged at positions facing the pad electrodes 52 on the mounting surface. On the other hand, as shown in FIGS. 4 and 5, mounting electrodes 18A (Vdd), 18B (GND), 18C (OUT), 18D (Vc), 18E (T) are provided on the periphery of the lower surface of the mounting surface 16 of the base substrate 12. ) Is arranged.

  As shown in FIG. 5, the mount electrode 24A (X1) and the connection electrode 20 (X1) are electrically connected to each other by the routing electrode 22A, and the mount electrode 24B (X2) and the connection electrode 20 (X2) are also The lead electrodes 22B are electrically connected to each other.

  A lead electrode 22C extends from the connection electrode 20 (Vdd). The routing electrode 22 </ b> C extends to a position directly above the mounting electrode 18 </ b> A, and is electrically connected to the mounting electrode 18 </ b> A via a through electrode 26 that penetrates the base substrate 12. Thereby, the connection electrode 20 (Vdd) is electrically connected to the mounting electrode 18A.

The connection electrode 20 (GND) is disposed at a position directly above the mounting electrode 18B, and is electrically connected to the mounting electrode 18B through the through electrode 26.
The connection electrode 20 (OUT) is disposed at a position directly above the mounting electrode 18C, and is electrically connected to the mounting electrode 18C through the through electrode 26.

  A lead electrode 22D extends from the connection electrode 20 (Vc). The routing electrode 22D extends to a position directly above the mounting electrode 18D, and is electrically connected to the mounting electrode 18D through the through electrode 26. Thereby, the connection electrode 20 (Vc) is electrically connected to the mounting electrode 18D.

The connection electrode 20 (T) is disposed at a position directly above the mounting electrode 18E, and is electrically connected to the mounting electrode 18E through the through electrode 26.
A frame-shaped metallization 28 is disposed at a position surrounding the piezoelectric vibrating piece 38 and the integrated circuit 50 on the mounting surface 14 of the base substrate 12. The metallized 28 is connected to the connection electrode 20 (GND). Therefore, the metallized 28 is electrically connected to the mounting electrode 18B. A metal cap 32 (FIG. 3) is bonded to the base substrate 12 with the metallized 28 as a bonding surface. Therefore, the cap 32 hermetically seals the piezoelectric vibrating piece 38 and the integrated circuit 50, and electrostatically shields the accommodation space in the cap 32 from the outside, thereby reducing electrical disturbance to the piezoelectric vibrating piece 38 and the integrated circuit 50. can do.

  As shown in FIGS. 3 and 5, piezoelectric vibration is performed in such a manner that the lead electrode 46A and the mount electrode 24A are joined by the conductive adhesive 48A, and the lead electrode 46B and the mount electrode 24B are joined by the conductive adhesive 48B. The piece 38 is bonded onto the base substrate 12. Accordingly, the piezoelectric vibrating piece 38 is supported by the base substrate 12 in a cantilevered state with the mount portion 42 (FIG. 6) as a fixed end and is electrically connected to the mount electrodes 24A and 24B.

  Further, the pad electrode 52 (X1, X2, Vdd, GND, OUT, Vc, T) of the integrated circuit 50 is joined to the connection electrode 20 (X1, X2, Vdd, GND, OUT, Vc, T) to integrate the integrated circuit 50. The circuit 50 is electrically connected to the connection electrode 20, the mount electrodes 24A and 24B, and the mounting electrodes 18A to 18E. Accordingly, the integrated circuit 50 is driven by receiving power from the mounting electrode 18A (Vdd) with the mounting electrode 18B (GND) grounded. The integrated circuit 50 applies an AC voltage to the piezoelectric vibrating piece 38 via the pad electrodes 52 (X1, X2), so that the piezoelectric vibrating piece 38 vibrates at a predetermined resonance frequency, and the oscillation signal is transmitted to the mounting electrode. It can be output from 18C (OUT). The adjustment voltage is applied to the integrated circuit 50 through the mounting electrode 18C (Vc), and temperature information based on the thermistor can be output from the mounting electrode 18E.

  As shown in FIGS. 2 and 4, the first wirings 60A, 60B, 60C are arranged to extend in the column direction of the arrangement of the substrate regions 56 on the mounting surface 16 of the sheet substrate 54, and the mounting electrodes 18A in the same row are connected. They are connected in parallel.

  The first wiring 60 </ b> A is arranged along the arrangement of the first, second, and third substrate regions 56, and the mounting electrode 18 </ b> A of the first, second, and third substrate regions 56 through the routing electrode 76. It is connected to the.

  The first wiring 60B is disposed between the array of the first, second, and third substrate regions 56 and the array of the fourth, fifth, and sixth substrate regions 56, and is arranged via the routing electrode 76. The fourth, fifth, and sixth substrate regions 56 are connected to the mounting electrodes 18A.

  The first wiring 60 </ b> C is disposed between the array of the fourth, fifth, and sixth substrate regions 56 and the array of the seventh, eighth, and ninth substrate regions 56, and is arranged via the routing electrode 76. And connected to the mounting electrodes 18A of the substrate regions 56 of No. 7, No. 8, and No. 9.

  The first terminals 62A, 62B, and 62C are disposed in the terminal region 58 on the upper surface of the sheet substrate 54, and are electrically connected to the first wirings 60A, 60B, and 60C through the through electrode 26.

  As shown in FIGS. 2 and 4, the second wirings 64A, 64B and 64C are arranged on the mounting surface 14 of the sheet substrate 54 so as to connect the metallizations 28 in the same row in series (FIG. 5). reference). Accordingly, the second wiring 64A connects the mounting electrodes 18B of the first, fourth, and seventh substrate regions 56 in parallel, and the second wiring 64B is connected to the second, fifth, and eighth substrate regions. The 56 mounting electrodes 18B are connected in parallel, and the second wiring 64C connects the mounting electrodes 18B in the third, sixth, and ninth substrate regions 56 in parallel.

  As shown in FIGS. 4 and 5, the mounting electrode 18 </ b> E is electrically connected to the mounting electrode 18 </ b> B in the substrate region 56 on the left side via the routing electrode 78. Therefore, the second wiring 64A electrically connects the mounting electrodes 18E of the second, fifth, and eighth substrate regions 56 in parallel, and the second wiring 64B includes the third, sixth, and ninth wirings. The mounting electrodes 18E in the substrate region 56 are electrically connected in parallel. The second wirings 64A, 64B, 64C extend to the terminal region 58 and are connected to the second terminals 66A, 66B, 66C, respectively.

  As shown in FIG. 2, the third wiring 68 </ b> A has an array of the first, fourth, and seventh substrate regions 56 and the second, fifth, and eighth substrate regions 56 on the mounting surface 14 of the sheet substrate 54. Are arranged so as to extend in the row direction between the arrays.

  As shown in FIG. 4, the third wiring 68 </ b> A includes the mounting electrode 18 </ b> C in the first, fourth, and seventh substrate regions 56 and the mounting electrode 18 </ b> D in the second, fifth, and eighth substrate regions 56. Are electrically connected in parallel via the electrode 80 and the through electrode 26.

  As shown in FIG. 2, the third wiring 68 </ b> B is arranged on the mounting surface 14 of the sheet substrate 54 with an array of the second, fifth, and eighth substrate regions 56 and the third, sixth, and ninth substrate regions 56. Are arranged so as to extend in the row direction between the arrays.

As shown in FIG. 4, the third wiring 68B includes a mounting electrode 18C in the second, fifth, and eighth substrate regions 56, and a mounting electrode 18D in the third, sixth, and ninth substrate regions 56; Are electrically connected in parallel via the wiring 80 and the through electrode 26.
The third wirings 68A and 68B extend to the terminal region 58 and are connected to the third terminals 70A and 70B, respectively.

As shown in FIG. 2, the auxiliary wiring 72 </ b> A is arranged on the mounting surface 14 of the sheet substrate 54 so as to extend in the row direction along the array of the first, fourth, and seventh substrate regions 56.
As shown in FIG. 4, the auxiliary wiring 72 </ b> A electrically connects the mounting electrodes 18 </ b> E of the first, fourth, and seventh substrate regions 56 in parallel via the routing electrode 82 and the through electrode 26.

As shown in FIG. 2, the auxiliary wiring 72 </ b> B is arranged to extend in the row direction between the auxiliary wiring 72 </ b> A and the array of the first, fourth, and seventh substrate regions 56.
As shown in FIG. 4, the auxiliary wiring 72 </ b> B electrically connects the mounting electrodes 18 </ b> D of the first, fourth, and seventh substrate regions 56 in parallel via the routing electrode 82 and the through electrode 26.

As shown in FIG. 2, the auxiliary wiring 72 </ b> C is arranged on the mounting surface 14 of the sheet substrate 54 so as to extend in the row direction along the arrangement of the third, sixth, and ninth substrate regions 56.
As shown in FIG. 4, the auxiliary wiring 72 </ b> C electrically connects the mounting electrodes 18 </ b> C of the third, sixth, and ninth substrate regions 56 in parallel via the routing electrode 82 and the through electrode 26. The auxiliary wirings 72A, 72B, 72C extend to the terminal region 58 and are connected to the auxiliary terminals 74A, 74B, 74C, respectively.

  In FIG. 3, the left side (4th) substrate region 56 (electronic component 10) includes a pad electrode 52 (Vc) of the integrated circuit 50, a connection electrode 20 (Vc), a lead-out electrode 22D, a through electrode 26, and a mounting electrode 18D. The state is shown in which it is electrically connected to the auxiliary wiring 72B (auxiliary terminal 74B) via the lead-out electrode 82 and the through electrode 26. In the left (No. 4) substrate region 56, the pad electrode 52 (T) of the integrated circuit 50 is connected via the connection electrode 20 (T), the through electrode 26, the mounting electrode 18E, the routing electrode 82, and the through electrode 26. The state where it is electrically connected to the auxiliary wiring 72A (auxiliary terminal 74A) is shown.

  In the center (number 5) substrate region 56 (electronic component 10) of FIG. 3, the pad electrode 52 (T) of the integrated circuit 50 is connected to the connection electrode 20 (T), the through electrode 26, the mounting electrode 18E, the lead electrode 78, The state where it electrically connected to metallization 28 (2nd wiring 64A, 2nd terminal 66A) via mounting electrode 18B of 4th substrate field 56, penetration electrode 26, and connection electrode 20 (GND) is expressed. Yes. Further, in the central (No. 5) substrate region 56, the pad electrode 52 (OUT) of the integrated circuit 50 is formed through the connection electrode 20 (OUT), the through electrode 26, the mounting electrode 18C, the routing electrode 80, and the through electrode 26. 3 shows a state of being electrically connected to the third wiring 68B (third terminal 70B).

  The right side of FIG. 3 is a view of a cut surface between the third and sixth substrate regions 56 and cutting the second wiring 64C, but the first terminal 62B is connected to the through electrode 26 and the second electrode 64C. 1 shows a state in which it is electrically connected to the mounting electrode 18A (not shown in FIG. 3) via one wiring 60B and the routing electrode 76.

  The sheet substrate 54 of the present embodiment is fired after forming a through hole for forming the through electrode 26 in the ceramic substrate before sintering having a plurality of substrate regions 56 and terminal regions 58, and the through electrode is formed in the through hole. 26 and various wirings and electrodes may be formed using sputtering or the like.

  In the manufacturing process of the electronic component 10 of the present embodiment, the piezoelectric vibrating piece 38, the integrated circuit 50, and the cap 32 are mounted on each substrate region 56 of the sheet substrate 54. Next, the first terminals 62A, 62B, and 62C and the second terminals 66A, 66B, and 66C arranged in the terminal area 58 are arbitrarily selected, and the integrated circuit arranged in each board area 56 (electronic component 10). Activate 50 one by one. The oscillation signal and temperature information output from the activated integrated circuit 50 are inspected, and various adjustments are made by applying an adjustment voltage to the integrated circuit 50. Of course, when there is a defect in the integrated circuit 50 or the piezoelectric vibrating piece 38 connected thereto, the electronic component 10 over the substrate region 56 is removed. The electronic component 10 can be separated into pieces by dividing the sheet substrate 54 along the boundary of the substrate region 56.

  FIG. 7 shows a circuit diagram of the sheet substrate according to the second embodiment. In the following description, the same reference numerals are given to the same components as those in the above-described embodiment, and the description thereof is omitted unless necessary.

  Unlike the first embodiment, the sheet substrate 54A of the second embodiment differs in the direction of the third wiring. That is, the third wirings 68A and 68B are electronic components 10 arranged in one direction as rows adjacent to each other among the electronic components 10 (substrate region 56), and are included in one arrangement. A mounting electrode 18C disposed on the component 10 and a mounting electrode 18D disposed on the electronic component 10 included in the other array are connected in parallel. Therefore, the third wiring 68A connects the mounting electrodes 18D of the first, second, and third electronic components 10 and the mounting electrodes 18C of the fourth, fifth, and sixth electronic components 10 in parallel. doing. The third wiring 68B connects the mounting electrodes 18D of the electronic components 10 of Nos. 4, 5, and 6 and the mounting electrodes 18C of the electronic components 10 of Nos. 7, 8, and 9 in parallel. Yes.

  The auxiliary wiring 72B connects the mounting electrodes 18D of the electronic components 10 of No. 7, 8, and 9 in parallel, and the auxiliary wiring 72C connects the mounting electrodes 18C of the electronic components 10 of No. 1, No. 2, No. 3, and No. 3. Connected in parallel.

  In correspondence with FIG. 2, the third wirings 68A and 68B and the auxiliary wirings 72B and 72C may be arranged on the mounting surface 14 of the sheet substrate 54A (sheet substrate 54), respectively. The third wiring 68A is arranged between the array of the first, second, and third substrate regions 56 and the array of the fourth, fifth, and sixth substrate regions 56, and the third wiring 68B is What is necessary is just to arrange | position between the arrangement | sequence of the 4th, 5th, 6th board | substrate area | region 56, and the arrangement | sequence of the 7th, 8th, 9th board | substrate area | region 56. The auxiliary wiring 72B is arranged along the arrangement of the seventh, eighth, and ninth substrate regions 56, and the auxiliary wiring 72C is arranged along the arrangement of the first, second, and third substrate regions 56. That's fine. The method for inspecting the electronic component 10 arranged on the sheet substrate 54A of the second embodiment is the same as that of the first embodiment, and the description thereof is omitted.

  FIG. 8 shows a circuit diagram of the sheet substrate of the third embodiment, and FIG. 9 shows a plan view of the sheet substrate of the third embodiment. In the sheet substrate 54B of the third embodiment, the third wirings 68A and 68B are divided into a third wiring 68Aa, a third wiring 68Ab, a third wiring 68Ba, and a third wiring 68Bb, respectively.

The third wiring 68Aa connects the mounting electrodes 18C of the first, fourth, and seventh electronic components 10 (substrate region 56) in parallel, and the end thereof is connected to the third terminal 70Aa.
The third wiring 68Ab connects the mounting electrodes 18D of the second, fifth, and eighth electronic components 10 in parallel, and the end thereof is connected to the third terminal 70Ab.

The third wiring 68Ba connects the mounting electrodes 18C of the second, fifth, and eighth electronic components 10 in parallel, and the end thereof is connected to the third terminal 70Ba.
The third wiring 68Bb connects the mounting electrodes 18D of the third, sixth, and ninth electronic components 10 in parallel, and the end thereof is connected to the third terminal 70Bb.

  In the above configuration, in order to activate the fifth electronic component 10, the first terminal 62B and the second terminal 66B are turned on. The temperature information of the fifth electronic component 10 is taken in from the second terminal 66A, and the adjustment voltage is applied to the fifth electronic component 10 from the third terminal 70Ab, and the output of the fifth electronic component 10 is output from the second terminal 66A. 3 terminal 70Ba.

  As shown in FIG. 9, the third wirings 68Aa, 68Ab, 68Ba, and 68Bb may be arranged on the mounting surface 14 of the sheet substrate 54B. The third wires 68Aa and 68Ab are arranged so as to be parallel to each other between the arrangement of the first, fourth, and seventh substrate regions 56 and the arrangement of the second, fifth, and eighth substrate regions 56. That's fine. The third wires 68Ba and 68Bb are arranged so as to be parallel to each other between the arrangement of the second, fifth, and eighth substrate regions 56 and the arrangement of the third, sixth, and ninth substrate regions 56. That's fine.

  In the first embodiment and the second embodiment, the third terminals 70 </ b> A and 70 </ b> B are used for the purpose of taking out the output of the electronic component 10 and for applying an adjustment voltage to the electronic component 10. Therefore, when the adjustment voltage is applied to the activated electronic component 10, the adjustment voltage is also applied to the mounting electrode 18 </ b> C of the electronic component 10 connected to the same third terminal as the electronic component 10, and this adjustment voltage is applied to the integrated circuit 50. May be adversely affected. Therefore, in the present embodiment, wiring for extracting the output of the electronic component 10 and wiring for applying an adjustment voltage to the electronic component 10 are separated.

  In FIG. 10, the schematic diagram of the electronic device (mobile terminal) which mounts the electronic component of this embodiment is shown. In FIG. 10, the portable terminal 88 (including PHS) includes a plurality of operation buttons 90, an earpiece 92 and a mouthpiece 94, and a display unit 96 is disposed between the operation buttons 90 and the earpiece 92. Yes. Recently, the portable terminal 88 has a GPS function. Therefore, the portable terminal 88 incorporates the electronic component 10 (piezoelectric device) of the present embodiment as a clock source for the GPS circuit.

  In addition, the electronic device including the electronic component 10 according to the present embodiment includes, in addition to the portable terminal 88 described above, a high-functionality portable, a digital still camera, a personal computer, a laptop personal computer, a television, a video camera, a video tape recorder, Car navigation device, pager, inkjet discharge device, electronic notebook, calculator, electronic game device, word processor, workstation, video phone, TV monitor for crime prevention, electronic binoculars, POS terminal, medical device (for example, electronic thermometer, blood pressure monitor, It can be applied to blood glucose meters, electrocardiogram measuring devices, ultrasound diagnostic devices, electronic endoscopes), fish detectors, various measuring instruments, instruments (eg, vehicles, aircraft, ship instruments), flight simulators, etc. .

DESCRIPTION OF SYMBOLS 10 ......... Electronic component, 12 ......... Base substrate, 14 ......... Mounting surface, 16 ......... Mounting surface, 18A-18E ......... Mounting electrode, 20 ...... Connection electrode, 22A-22D ......... Lead electrode, 24A, 24B ......... Mount electrode, 26 ......... Penetration electrode, 28 ......... Metalized, 32 ......... Cap, 38 ......... Piezoelectric vibrating piece, 40 ...... Vibrating part, 42 ......... Mount part, 44A, 44B ... Excitation electrode, 46A, 46B ... Extraction electrode, 48A, 48B ... Conductive adhesive, 50 ... Integrated circuit, 52 ... Pad electrode, 54, 54A, 54B ......... Sheet substrate, 56 ......... Board area, 58 ......... Terminal area, 60A-60C ......... First wiring, 62A-62C ......... First terminal, 64A-64C ......... No. 2 wirings, 66A to 66C..., Second terminal, 68 , 68Aa, 68Aa, 68B, 68ba, 68Bb ......... Third wiring, 70A, 70Aa, 70Ab, 70B, 70Ba, 70Bb ......... Third terminal, 72A-72C ......... Auxiliary wiring, 74A-74C ... ...... Auxiliary terminal, 76 ..... Leading electrode, 78 ..... Leading electrode, 80 ..... Leading electrode, 82 ....... Leading electrode, 88 ..... Portable terminal, 90 ..... Operation buttons, 92 .... ... earpiece, 94 ..... mouthpiece, 96 ..... display part.

Claims (7)

A plurality of substrate regions are arranged in a matrix, electronic elements are disposed in each substrate region, and first and second mounting electrodes that are electrically connected to the electronic elements are disposed in each substrate region. A sheet substrate,
A first terminal for connecting the first mounting electrode in parallel for each row of the substrate region;
A second terminal for connecting the second mounting electrode in parallel for each column of the substrate region;
A sheet substrate characterized in that, among the electronic elements, any of the electronic elements specified by the selected first terminal and second terminal can be activated. A third mounting electrode and a fourth mounting electrode disposed in each substrate region and electrically connected to the electronic element;
Among the substrate regions, the substrate regions arranged in one direction as rows or columns adjacent to each other, and the third mounting electrodes arranged in the substrate region included in one of the arrays The sheet substrate according to claim 1, further comprising a third terminal that connects the fourth mounting electrodes disposed in the substrate region included in the other array in parallel. A fifth mounting electrode that is bonded to the electronic element is disposed in each substrate region,
The second terminal is
Among the substrate regions, the substrate regions arranged in one direction as rows adjacent to each other, the second mounting electrodes arranged in the substrate region included in one array, and the other The sheet substrate according to claim 1, wherein the fifth mounting electrodes arranged in the substrate region included in the array are connected in parallel.   The electronic device is arranged in each substrate region of the sheet substrate according to claim 1, and the sheet substrate is divided into individual pieces along a boundary of the substrate region. And electronic parts.   An electronic device comprising the electronic component according to claim 4. With respect to a sheet substrate having a plurality of substrate regions arranged in a matrix, an electronic element is disposed in each substrate region, and a first mounting electrode and a second mounting electrode that are electrically connected to the electronic element are connected to each substrate region. An electronic component inspection method configured for each substrate region in the sheet substrate,
Connecting the first mounting electrode to a first terminal for each row of the substrate region;
Connecting the second mounting electrode to a second terminal for each column of the substrate region;
A method of inspecting an electronic component, comprising: activating any of the electronic elements specified by the selected first terminal and the second terminal. With respect to a sheet substrate having a plurality of substrate regions arranged in a matrix, an electronic element is disposed in each substrate region, and a first mounting electrode and a second mounting electrode that are electrically connected to the electronic element are connected to each substrate region. A method of manufacturing an electronic component configured for each substrate region in the sheet substrate,
A first terminal for connecting the first mounting electrode in parallel for each row of the substrate region; a second terminal for connecting the second mounting electrode in parallel for each column of the substrate region; A first step of arranging
A second step of activating any of the electronic elements identified by the selected first terminal and the second terminal;
A third step of dividing the sheet substrate along a boundary of the substrate region;
A method for manufacturing an electronic component, comprising:

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