JP2015041891A - Sheet substrate, method for manufacturing electronic device, and method for inspecting electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet substrate that can be probed without providing terminals dedicated to probing.SOLUTION: A sheet substrate 10 includes: first terminals 12, 13 arranged in a first region 11 of a first surface 5a and connected with a vibration element 20; second terminals 32, 33 arranged in a second region 31; a first annular electrode 17 arranged in a third region 51 surrounding the first terminals 12, 13; a second annular electrode 37 arranged in a fourth region 91 surrounding the second terminals 32, 33; first external terminals 21, 23 arranged in a region of a second surface reverse to the first surface 5a overlapping the first region 11 in a plan view, and electrically connected to the first terminals 12, 13; and a second external terminal 42 arranged in a region of the second surface overlapping the second region 31 in a plan view, and electrically connected to the second annular electrode 37. The first external terminal 23 is electrically connected to the second external terminal 42.

Description

  The present invention relates to a sheet substrate, an electronic device manufacturing method using the sheet substrate, and an electronic device inspection method.

  2. Description of the Related Art There is known a method of manufacturing an electronic device in which a plurality of electronic devices configured by connecting electronic components are arranged on a sheet substrate (mother substrate) and separated into pieces by dividing the sheet substrate. In recent years, with the miniaturization of electronic devices, the electronic devices arranged on the sheet substrate have come close to each other, and it has become difficult to contact the inspection probe due to space limitations, and various devices have been proposed. For example, Patent Document 1 includes a first substrate region on which electronic components are mounted and a second substrate region adjacent to the first substrate region, and is connected to an element connected to the first region via a signal wiring. A method of manufacturing an electronic component having a signal terminal provided on the outer surface of the second substrate region is disclosed. In the electronic component manufacturing method, an electrical signal is applied to an element in the first substrate region and a signal terminal in the second substrate region to perform a characteristic inspection or the like.

JP 2008-35486 A

  However, in the above-described method for manufacturing an electronic component, a signal terminal which is a dedicated terminal for bringing a probe or the like into contact with the outer surface of the second substrate region is provided. Therefore, since the electronic device after dividing the sheet substrate is provided with terminals unnecessary for the operation of the electronic device on the outer surface, it is difficult to further reduce the size of the divided electronic device. It had the problem that.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A sheet substrate according to this application example includes a first terminal having a first region and a second region on a first surface, arranged in the first region, and connected to a first electronic component; A second terminal disposed in the second region; a third region surrounding the first terminal in the first region; the first conductive portion disposed in the third region; A second conductive portion disposed in the fourth region having a fourth region surrounding the second terminal in the two regions, and a second surface in front-back relation with the first surface, the first surface in a plan view. The first external terminal electrically connected to the first terminal and the second surface are disposed in a region overlapping with the second region in plan view. And a second external terminal electrically connected to the second conductive portion, wherein the first external terminal is Characterized in that it is connected to an external terminal electrically.

  According to this application example, the first terminal disposed in the first region is electrically connected to the second conductive portion disposed in the second region via the first external terminal and the second external terminal. Has been. Thereby, the first electronic component connected to the first terminal can be subjected to a characteristic inspection or the like by a signal input via the second conductive portion. Accordingly, since the characteristic inspection of the first electronic component can be performed without providing a dedicated terminal for inspection, the first region and the second region corresponding to the occupied portion of the dedicated terminal for inspection and the wiring portion related thereto can be obtained. The area can be reduced. In other words, the number of first regions and second regions that can be arranged on the sheet substrate can be increased, which can contribute to an improvement in manufacturing efficiency.

  Application Example 2 In the sheet substrate according to the application example described above, the sheet substrate includes a third terminal that is disposed in the first region and to which a second electronic component is connected, and the third terminal is surrounded by the third region. In addition, it is preferable that the first conductive portion is electrically connected and is not electrically connected to the first terminal.

  According to this application example, in addition to the above, the characteristic inspection of the second electronic component is performed via the first conductive portion of the first region electrically connected to the first terminal disposed in the first region. It can be carried out. Therefore, since the characteristic inspection of the second electronic component can be performed without providing a dedicated terminal for inspection, the first region and the second region corresponding to the occupied portion of the dedicated terminal for inspection and the wiring portion related thereto can be obtained. The area can be reduced. In other words, the number of first regions and second regions that can be arranged on the sheet substrate can be increased, which can contribute to an improvement in manufacturing efficiency.

  Application Example 3 In the sheet substrate according to the application example described above, the first external terminal includes a through electrode extending from the first surface to the second surface at a boundary portion between the first region and the second region. It is preferable that the second external terminal and the second external terminal are electrically connected via the through electrode.

  According to this application example, the first external terminal and the second external terminal are electrically connected via the through electrode provided at the boundary between the first region and the second region. Therefore, the first external terminal and the second external terminal can be electrically connected without providing a dedicated connection wiring.

  Application Example 4 In the sheet substrate according to the application example described above, it is preferable that a lid having conductivity is connected to each of the first conductive part and the second conductive part.

  According to this application example, the first electronic component or the second through the conductive lid connected to the first conductive portion and the conductive lid connected to the second conductive portion. It is possible to inspect the characteristics of electronic components. Accordingly, since the characteristic inspection of the first electronic component or the second electronic component can be performed without providing a dedicated terminal for inspection, the first region corresponding to the occupied portion of the dedicated terminal for inspection and the wiring portion related thereto. In addition, the area of the second region can be reduced.

  Application Example 5 An electronic device manufacturing method according to this application example includes a first terminal having a first region and a second region on a first surface, the first terminal disposed in the first region, and the second region. A second terminal disposed in the first region, a third region surrounding the first terminal in the first region, a first conductive portion disposed in the third region, and in the second region A first region having a fourth region surrounding the second terminal, and a second conductive portion disposed in the fourth region; and a second surface in a front-back relationship with the first surface; A first external terminal that is disposed in the overlapping region and is electrically connected to the first terminal, and is electrically connected to the first external terminal on the second surface, and is A second external terminal disposed in a region overlapping with the second region and electrically connected to the second conductive portion. A method of manufacturing an electronic device using a sheet substrate, wherein a step of connecting a first electronic component to the first terminal and a step of connecting a first lid having conductivity to the second conductive portion And.

  According to this application example, the first terminal is electrically connected to the first lid that is connected to the second conductive portion via the first external terminal and the second external terminal. Thereby, the 1st electronic component connected to the 1st terminal can perform a measurement etc. by the signal inputted via the 1st lid. Therefore, since the first electronic component can be measured without providing a dedicated measurement terminal on the second surface of the sheet substrate that overlaps the first and second regions, the dedicated terminal and the wiring associated therewith can be occupied. It is possible to reduce the areas of the first region and the second region corresponding to the portion. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate, that is, to efficiently manufacture a small electronic device.

  Application Example 6 In the method of manufacturing an electronic device according to the application example, the sheet substrate is disposed in the first region and surrounded by the third region, and is electrically connected to the first conductive portion. A third terminal that is connected and not electrically connected to the first terminal; and a step of connecting a second electronic component to the third terminal; And a step of connecting the second lid body.

  According to this application example, the first terminal is electrically connected to the first lid that is connected to the second conductive portion. The third terminal is electrically connected to the second lid connected to the first conductive part. As a result, the first electronic component connected to the first terminal and the second electronic component connected to the third terminal are measured by signals input through the first lid and the second lid. It can be carried out. Accordingly, the first electronic component and the second electronic component can be measured without providing a dedicated terminal for inspection on the second surface of the sheet substrate overlapping the first region and the second region. It is possible to reduce the areas of the first region and the second region corresponding to the occupied portion of the associated wiring. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate. That is, a small electronic device having a plurality of electronic components can be efficiently manufactured.

  Application Example 7 An electronic device inspection method according to this application example includes a first terminal having a first area and a second area on a first surface, the first terminal disposed in the first area, and the second area. A second terminal disposed in the first region, a third region surrounding the first terminal in the first region, a first conductive portion disposed in the third region, and in the second region A first region having a fourth region surrounding the second terminal, and a second conductive portion disposed in the fourth region; and a second surface in a front-back relationship with the first surface; A first external terminal that is disposed in the overlapping region and is electrically connected to the first terminal, and is electrically connected to the first external terminal on the second surface, and is A second external terminal disposed in a region overlapping with the second region and electrically connected to the second conductive portion. A method for inspecting an electronic device using a sheet substrate comprising: a step of connecting a first electronic component to the first terminal; and a step of inspecting a characteristic of the first electronic component. In the step of inspecting, the characteristic of the first electronic component is inspected by inputting a signal to the second conductive portion.

  According to this application example, the first terminal is electrically connected to the second conductive portion via the first external terminal and the second external terminal. As a result, the first electronic component connected to the first terminal can be subjected to characteristic inspection by a signal input via the second conductive portion. Accordingly, the characteristic inspection of the first electronic component can be performed without providing a dedicated terminal for inspection on the second surface of the sheet substrate that overlaps the first region and the second region, so that the dedicated terminal and the wiring portion related thereto are occupied. It is possible to reduce the areas of the first region and the second region corresponding to the portion. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate. That is, it is possible to provide an inspection method applicable to downsizing of an electronic device.

  Application Example 8 In the electronic device inspection method according to the application example described above, the electronic device inspection method includes a step of connecting a first lid having conductivity to the second conductive portion, and in the step of inspecting the characteristics, It is preferable to inspect the first electronic component by inputting a signal to one lid.

  According to this application example, the first terminal is electrically connected to the first lid that is connected to the second conductive portion. As a result, the first electronic component connected to the first terminal can be subjected to a characteristic inspection by a signal input through the first lid. Accordingly, the characteristic inspection of the first electronic component can be performed without providing a dedicated terminal for inspection on the second surface of the sheet substrate that overlaps the first region and the second region, so that the dedicated terminal and the wiring portion related thereto are occupied. It is possible to reduce the areas of the first region and the second region corresponding to the portion. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate. That is, it is possible to provide an inspection method applicable to miniaturization of an electronic device including a plurality of electronic components.

  Application Example 9 In the electronic device inspection method according to the application example, the sheet substrate is disposed in the first region and surrounded by the third region, and is electrically connected to the first conductive unit. And a third terminal that is not electrically connected to the first terminal, the step of connecting the second electronic component to the third terminal, and the characteristics of the second electronic component are inspected In the step of inspecting the characteristics, it is preferable to inspect the second electronic component by inputting a signal to the first conductive portion.

  According to this application example, the first terminal is electrically connected to the second conductive portion. The third terminal is electrically connected to the first conductive part. Accordingly, the first electronic component connected to the first terminal and the second electronic component connected to the third terminal are subjected to a characteristic inspection by a signal input via the first conductive portion or the second conductive portion. It can be carried out. Therefore, the characteristic inspection of the first electronic component and the second electronic component can be performed without providing a dedicated terminal for inspection on the second surface of the sheet substrate overlapping the first region and the second region. It is possible to reduce the areas of the first region and the second region corresponding to the occupied portion of the associated wiring. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate. That is, it is possible to provide an inspection method applicable to miniaturization of an electronic device including a plurality of electronic components.

  Application Example 10 In the inspection method for an electronic device according to the application example described above, a step of connecting a first lid having conductivity to the first conductive portion, and a second property having conductivity to the second conductive portion. Connecting the lid, and inspecting the characteristic, a signal is input to at least one of the first lid and the second lid, and the first electronic component and the second It is preferable to inspect at least one characteristic of the electronic component.

  According to this application example, the first terminal is electrically connected to the first lid that is connected to the second conductive portion. The third terminal is electrically connected to the second lid connected to the first conductive part. As a result, the first electronic component connected to the first terminal and the second electronic component connected to the third terminal are caused by a signal input via at least one of the first lid and the second lid. Characteristic inspection can be performed. Therefore, the characteristic inspection of the first electronic component and the second electronic component can be performed without providing a dedicated terminal for inspection on the second surface of the sheet substrate overlapping the first region and the second region. It is possible to reduce the area of the first region and the second region corresponding to the occupied portion of the wiring portion concerned. In other words, it is possible to increase the number of first regions and second regions that can be disposed on the sheet substrate. That is, it is possible to provide an inspection method applicable to miniaturization of an electronic device including a plurality of electronic components.

The top view which shows schematic structure of the sheet | seat board | substrate which concerns on 1st Embodiment. The schematic structure of the sheet | seat board | substrate which concerns on 1st Embodiment is shown, (a) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. The schematic structure of the sheet | seat board | substrate which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is CC sectional drawing. Sectional drawing which shows an example of schematic structure of the sheet | seat board | substrate (electronic device) using a cover body, and is equivalent to the BB cross section of FIG. The modification of a sheet | seat board | substrate is shown, (a) is a fragmentary top view, (b) is DD sectional drawing. The process flowchart which shows the manufacturing process of the electronic device using a sheet | seat board | substrate. The perspective view which shows the structure of the mobile type personal computer as an example of an electronic device. The perspective view which shows the structure of the mobile telephone as an example of an electronic device. The perspective view which shows the structure of the digital still camera as an example of an electronic device. The perspective view which shows the structure of the motor vehicle as an example of a mobile body.

  Hereinafter, a sheet substrate, an electronic device manufacturing method using the sheet substrate, and an electronic device inspection method using the sheet substrate according to the present invention will be described in detail with reference to the drawings based on the embodiments shown in the accompanying drawings. To do.

<Sheet substrate>
(First embodiment)
A sheet substrate according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing a schematic configuration of a sheet substrate according to the first embodiment of the present invention. 2 is a cross-sectional view showing a schematic configuration of the sheet substrate according to the first embodiment of the present invention, FIG. 2A is a cross-sectional view taken along line AA of FIG. 1, and FIG. 2B is a cross-sectional view of FIG. It is -B sectional drawing. In FIG. 1, for the sake of easy viewing, the vibration element as the first electronic component is indicated by an imaginary line (two-dot chain line).

  As shown in FIGS. 1 and 2, the sheet substrate (mother substrate) 10 according to the first embodiment includes a base substrate 5, a first region 11 disposed on the first surface 5 a of the base substrate 5, and a first substrate 11. 2 regions 31. The constituent material of the base substrate 5 is preferably an insulating (non-conductive) material, such as various glass materials, various ceramic materials such as oxide ceramics, nitride ceramics, carbide ceramics, polyimide, etc. Various resin materials can be used. A set of the first region 11 and the second region 31 is arranged in a matrix on the sheet substrate 10. Between the adjacent areas, there are provided divided areas 7 and 8 for dividing each area into one electronic device. The divided regions 7 and 8 are provided so that the separated electronic device has a substantially rectangular outer shape.

  Here, when the area indicated by reference numeral 11 in FIG. 1 is the first area, the area indicated by reference numeral 31 arranged side by side in the figure is the second area, and the area indicated by reference numeral 11b arranged vertically in the figure. Is another area. In addition, this arrangement | positioning can also be set as the same structure even if either of the area | regions located in a matrix form is made into the 1st area | region. For example, when the area indicated by the reference numeral 31 is the first area, the area on the left side of the reference numeral 31 arranged side by side in the figure (in this example, the area indicated by the reference numeral 31 is the left end portion of the sheet substrate 10. Therefore, this area does not exist.) Is the second area. In addition, the area indicated by reference numeral 31b on the lower side of the area indicated by reference numeral 31 arranged vertically in the figure is another area.

  The first region 11 is arranged in the third region 51 surrounding the first terminal 12 and the fifth terminal 13, and the first terminal 12 and the fifth terminal 13 to which the vibration element 20 as the first electronic component is connected. And a first annular electrode 17 as a first conductive portion. Similarly, in the second region 31, second terminals 32 and 33 to which the vibration element 20 as the first electronic component is connected, and a second region 91 disposed in the fourth region 91 surrounding the second terminals 32 and 33. A second annular electrode 37 is provided as a conductive portion. For example, the first terminal 12 and the fifth terminal 13 in the first region 11 and the second terminals 32 and 33 in the second region 31 are made of a conductive paste such as silver or palladium or tungsten metallized, and have a required shape. It is formed by baking after forming and then plating nickel and gold or silver. The connection wiring 14 extending from the first terminal 12 and the connection wiring 34 extending from the second terminal 32 are also formed in the same configuration as described above.

  Similarly to the above, the first annular electrode 17 and the second annular electrode 37 are baked after forming a required shape using a conductive paste such as silver or palladium or tungsten metallized, and then nickel and gold or It can be formed by plating silver or the like. The first annular electrode 17 and the second annular electrode 37 may be configured such that a seam ring (not shown) formed of an alloy such as Kovar is provided on the electrode having the above-described configuration. Good. The seam ring has a function as a bonding material with a lid 72 (see FIG. 4) as a lid, which will be described later, and has a frame shape (substantially rectangular ring shape) along the first surface 5a of the base substrate 5. Is provided.

  Furthermore, the second surface 5b of the base substrate 5 that is in front-to-back relation with the first surface 5a is disposed in a region that overlaps the first region 11 in plan view when the first surface 5a is viewed from the front direction. First external terminals 21, 22, 23, and 24 are provided. The second surface 5 b of the base substrate 5 is provided with second external terminals 41, 42, 43, 44 arranged in a region overlapping the second region 31 in the same plan view. The first external terminals 21, 22, 23, 24 and the second external terminals 41, 42, 43, 44 are made of, for example, tungsten metallized and fired after forming a required shape, and then nickel and gold or It is formed by plating silver or the like.

  The first external terminals 21 and the external terminals 22b arranged in the adjacent regions are electrically connected by connection terminals 26 provided on the second surface 5b of the base substrate 5. Similarly, the first external terminal 23 and the second external terminal 42 arranged in the adjacent region are electrically connected by the connection terminal 25 provided on the second surface 5 b of the base substrate 5. .

  The base substrate 5 in the first region 11 is provided with through wirings 15, 16, 18 penetrating from the first surface 5 a to the second surface 5 b. The through wiring 15 is connected to the connection wiring 14 extending from the first terminal 12 and to the first external terminal 21. The through wiring 16 is connected to the first annular electrode 17 and to the first external terminal 22. The through wiring 18 is connected to the fifth terminal 13 and to the first external terminal 23. Similarly, the base substrate 5 in the second region 31 is provided with through-wirings 35, 36, and 38 penetrating from the first surface 5a to the second surface 5b. The through wiring 35 is connected to the connection wiring 34 extending from the second terminal 32 and to the second external terminal 41. The through wiring 36 is connected to the second annular electrode 37 and to the second external terminal 42. The through wiring 38 is connected to the second terminal 33 and to the second external terminal 43.

  With the configuration as described above, the first external terminal 21 is electrically connected to the first terminal 12 via the connection wiring 14 and the through wiring 15 provided on the first surface 5 a of the first region 11. . Further, the first external terminal 21 is connected to the external terminal 22b provided in the other adjacent region 11b and arranged in a matrix through the connection terminals 26 arranged on the second surface 5b, and the through wiring It is electrically connected to the annular electrode 17b through 16b. That is, the first terminal 12 is electrically connected to the annular electrode 17b in the other region 11b through the connection wiring 14, the through wiring 15, the first external terminal 21, the connection terminal 26, the external terminal 22b, and the through wiring 16b. Has been.

  The second external terminal 42 is electrically connected to the second annular electrode 37 serving as the second conductive portion via the through wiring 36 provided in the second region 31. Further, the second external terminal 42 is connected to the first external terminal 23 by the connection terminal 25 disposed on the second surface 5 b, and is connected to the fifth terminal 13 through the through wiring 18. That is, the fifth terminal 13 is electrically connected to the second annular electrode 37 via the through wiring 18, the first external terminal 23, the connection terminal 25, the second external terminal 42, and the through wiring 36.

  The vibration element 20 as the first electronic component is connected to the first terminal 12 and the fifth terminal 13 by a bonding material such as a conductive adhesive 19 in the first region 11, and in the second region 31, the second terminal 32. , 33 are connected to each other by a bonding material such as a conductive adhesive 39. The vibration element 20 of the present embodiment uses an AT-cut quartz substrate (piezoelectric substrate) formed of quartz as an example of a piezoelectric material. A piezoelectric material such as quartz has crystal axes X, Y, and Z orthogonal to each other, and the quartz substrate of this embodiment is along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ. Thus, a flat plate cut out from the crystal is used as the vibration element 20. For example, in the case of an AT cut quartz substrate, θ is approximately 35 ° 15 ′. The quartz substrate is not limited to the AT cut with the angle θ of about 35 ° 15 ′ as described above, but is an SC cut for exciting thickness shear vibration, BT cut, X cut for exciting tuning fork vibration, etc. Other piezoelectric substrates may be used. The vibration element 20 may have a configuration in which a driving unit including a piezoelectric layer using, for example, PZT is provided on an element substrate made of, for example, a silicon substrate.

  In the vibration element 20, electrodes such as an excitation electrode, an extraction electrode, and a connection electrode are formed on a rectangular element piece formed by dividing the AT-cut quartz crystal substrate, but this is not shown. The vibration element 20 is connected to the first terminal 12 and the fifth terminal 13 with a conductive adhesive applied to the portion of the connection electrode connected to each excitation electrode provided on the front and back surfaces (main surface) of the element piece. Is arranged to be located. Note that the shape of the element piece is not limited to a rectangular shape, and may be an elliptical shape, a trapezoidal shape, a triangular shape, a rectangular shape, or the like.

  According to the sheet substrate 10 of the first embodiment described above, the first terminal 12 connected to the vibration element 20 disposed in the first region 11 includes the connection wiring 14, the through wiring 15, the first external terminal 21, The connection terminal 26 is electrically connected to the annular electrode 17b disposed in the other region 11b through the external terminal 22b disposed in the other region 11b and the through wiring 16b. Further, the fifth terminal 13 connected to the vibration element 20 arranged in the first region 11 has the through wiring 18, the first external terminal 23, the connection terminal 25 and the second region 31 arranged in the second region 31. The second annular electrode 37 disposed in the second region is electrically connected via the external terminal 42 and the through wiring 36. Accordingly, the vibration element 20 as the first electronic component connected to the first terminal 12 and the fifth terminal 13 in the first region 11 is provided with the annular electrode 17b disposed in the other region 11b, Further, a characteristic inspection or the like can be performed by a signal input to the second annular electrode 37 disposed in the second region 31. Therefore, since the characteristic inspection of the vibration element 20 can be performed without providing a dedicated terminal for inspection, the first region 11 and the second region 31 corresponding to the occupied portion of the dedicated terminal for inspection and the wiring portion related thereto. In addition, the area of the other region 11b can be reduced. In other words, it is possible to increase the number of first regions 11, the second regions 31, and the other regions 11b that can be disposed on the sheet substrate 10 and contribute to an improvement in manufacturing efficiency. In this embodiment, the vibration element 20 as the first electronic component is input to the annular electrode 17b disposed in the other region 11b and the second annular electrode 37 disposed in the second region 31. However, the present invention is not limited to this, and a signal obtained by reflecting the signal input to the second annular electrode 37 by the vibration element 20 can be obtained using the second annular electrode 37. Even if a method such as detection is used, the characteristics of the vibration element 20 can be inspected.

(Second Embodiment)
Next, the sheet | seat board | substrate which concerns on 2nd Embodiment of this invention is demonstrated using FIG. FIG. 3 is a diagram showing a schematic configuration of a sheet substrate according to the second embodiment of the present invention, FIG. 3 (a) is a plan view, and FIG. 3 (b) is a CC view of FIG. 3 (a). It is sectional drawing. In the figure, for the sake of easy viewing, the vibration element as the first electronic component is indicated by an imaginary line (two-dot chain line). In addition, detailed description of the same configuration as in the first embodiment may be omitted.

  As shown in FIGS. 3A and 3B, the sheet substrate 100 according to the second embodiment includes a base substrate 105, a first region 111 disposed on the first surface 105 a of the base substrate 105, and a first substrate 111. 2 regions 131. Further, the first surface 105 a of the base substrate 105 has a region 201 and a region 211 as other regions. The constituent material of the base substrate 105 is preferably an insulating (non-conductive) material, such as various glass materials, various ceramic materials such as oxide ceramics, nitride ceramics, carbide ceramics, polyimide, etc. Various resin materials can be used. In the sheet substrate 100, a set of the first region 111 and the second region 131 is arranged in a matrix. Between the adjacent regions, the divided regions 7 and 8 when the respective regions are separated into one electronic device are provided in a direction in which they intersect.

  Here, when the area denoted by reference numeral 111 in FIG. 3 is the first area, the area denoted by reference numeral 131 arranged side by side in the figure is the second area. In addition, the region arranged in the vertical direction in the drawing with the first region 111 becomes a region 211 as another region, and the region arranged in the vertical direction in the drawing in the second region 131 becomes a region 201 as another region. . In addition, this arrangement | positioning can also be set as the same structure even if either of the area | regions located in a matrix form is made into the 1st area | region. For example, when the area indicated by reference numeral 131 is the first area, the area arranged on the left side of the first area 131 in the figure (in this example, the area indicated by reference numeral 131 is the left end portion of the sheet substrate 100). Therefore, this area does not exist.) Is the second area.

  In the first region 111, the first terminal 112 to which the vibration element 120 as the first electronic component is connected, the fifth terminal 113, and the third terminal 181 to which the thermistor 180 as the second electronic component is connected, The first terminal 1122, the first terminal 112, the fifth terminal 113, the third terminal 181, and the first annular electrode 117 as the first conductive portion disposed in the third region 171 surrounding the fourth terminal 182; , Is provided. Similarly, in the second region 131, second terminals 112b and 113b to which the vibration element 120 as the first electronic component is connected, a third terminal 181b to which the thermistor 180b as the second electronic component is connected, and The fourth terminal 182b, the second terminals 112b and 113b, the third terminal 181b, and the second annular electrode 117b as the second conductive portion disposed in the fourth region 171b surrounding the fourth terminal 182b are provided. ing. The first terminal 112 and the fifth terminal 113 in the first region 111, and the second terminals 112b and 113b in the second region 131, for example, use a conductive paste such as silver or palladium or tungsten metallization, and the required shape. It is formed by baking after forming and then plating nickel and gold or silver. Further, the connection wiring 114 extending from the first terminal 112 and the connection wiring 114b extending from the second terminal 112b are also formed in the same configuration as described above.

  The first annular electrode 117 and the second annular electrode 117b are formed by using a conductive paste such as silver / palladium or tungsten metallization, and firing after forming the required shape, and then nickel and gold or It can be formed by plating silver or the like. The first annular electrode 117 and the second annular electrode 117b may have a configuration in which a seam ring (not shown) formed of an alloy such as Kovar is provided on the electrode having the above-described configuration. Good. The seam ring has a function as a bonding material with a lid 72 (see FIG. 4) as a lid, which will be described later, and has a frame shape (substantially rectangular ring shape) along the first surface 105a of the base substrate 105. Is provided.

  Furthermore, the second surface 105b of the base substrate 105 that is in front-to-back relation with the first surface 105a is disposed in a region that overlaps the first region 111 in plan view when the first surface 105a is viewed from the front direction. First external terminals 121, 122, 123, 124 are provided. Further, the second surface 105b of the base substrate 105 is provided with second external terminals 121b, 122b, 123b, and 124b that are arranged in a region overlapping the second region 131 in the same plan view. The first external terminals 121, 122, 123, 124 and the second external terminals 121b, 122b, 123b, 124b are baked after forming a required shape using, for example, tungsten metallization, and then nickel and gold or It is formed by plating silver or the like.

  The first external terminal 121 of the first region 111 and the external terminal 122d of the other region 211 arranged in the adjacent region are electrically connected by the connection terminal 126 provided on the second surface 105b of the base substrate 105. It is connected. Similarly, the first external terminal 123 of the first region 111 and the second external terminal 122b of the second region 131 that are disposed in adjacent regions are connected to the second surface 105b of the base substrate 105. The terminals 125 are electrically connected. Similarly, the first external terminal 124 of the first region 111 and the second external terminal 121b of the second region 131 arranged in adjacent regions are connected to the second surface 105b of the base substrate 105. The terminals 125b are electrically connected. Similarly, the second external terminal 121b of the second region 131 and the external terminal 122c of the other region 201 arranged in the adjacent region are the connection terminals 126b provided on the second surface 105b of the base substrate 105. Are electrically connected.

  The base substrate 105 in the first region 111 is provided with through-wirings 115, 116, 118, and 127 that penetrate from the first surface 105a to the second surface 105b. The through wiring 115 is connected to the connection wiring 114 extending from the first terminal 112 and is connected to the first external terminal 121. The through wiring 116 is connected to the first annular electrode 117 and the third terminal 181 and to the first external terminal 122. The through wiring 118 is connected to the fifth terminal 113 and to the first external terminal 123. The through wiring 127 is connected to the connection wiring 183 extending from the fourth terminal 182 and is connected to the first external terminal 124. Similarly, the base substrate 105 in the second region 131 is provided with through wirings 115b, 116b, 118b, and 127b penetrating from the first surface 105a to the second surface 105b. The through wiring 115b is connected to the connection wiring 114b extending from the second terminal 112b and to the second external terminal 121b. The through wiring 116b is connected to the second annular electrode 117b and the third terminal 181b and to the second external terminal 122b. The through wiring 118b is connected to the second terminal 113b and to the second external terminal 123b. The through wiring 127b is connected to the connection wiring 183b extending from the fourth terminal 182b and to the second external terminal 124b.

  With the configuration as described above, the first external terminal 121 is electrically connected to the first terminal 112 via the connection wiring 114 and the through wiring 115 provided on the first surface 105 a of the first region 111. . Further, the first external terminals 121 are connected in a matrix form via the connection terminals 126 arranged on the second surface 105b and connected to the external terminals 122d provided in the other adjacent areas 211, and the through wiring It is electrically connected to an annular electrode 117d provided in another region 211 through 116d. That is, the first terminal 112 provided in the first region 111 is connected to another region 211 via the connection wiring 114, the through wiring 115, the first external terminal 121, the connection terminal 126, the external terminal 122d, and the through wiring 116d. It is electrically connected to the annular electrode 117d provided in the.

  The second external terminal 122b provided in the second region 131 is electrically connected to the second annular electrode 117b as the second conductive portion through the through wiring 116b. Further, the second external terminal 122 b is connected to the first external terminal 123 provided in the first region 111 by the connection terminal 125 disposed on the second surface 105 b, and is connected to the fifth terminal 113 via the through wiring 118. Connected with. That is, the fifth terminal 113 is electrically connected to the second annular electrode 117b via the through wiring 118, the first external terminal 123, the connection terminal 125, the second external terminal 122b, and the through wiring 116b.

  The third terminal 181 provided in the first region 111 is electrically connected to the first annular electrode 117. The fourth terminal 182 provided in the first region 111 is connected to the first external terminal 124 through the connection wiring 183 and the through wiring 127. Further, the first external terminals 124 are connected to the second external terminals 121b provided in the adjacent second regions 131 arranged in a matrix through the connection terminals 125b arranged on the second surface 105b. ing. Further, the second external terminal 121b is connected to the external terminal 122c arranged in a matrix and provided in another adjacent region 201 through the connection terminal 126b arranged on the second surface 105b, and passes through. It is electrically connected to the annular electrode 117c provided in the other region 201 through the wiring 116c. That is, the fourth terminal 182 in the first region 111 includes the connection wiring 183, the through wiring 127, the first external terminal 124, the connection terminal 125b, the second external terminal 121b, the connection terminal 126b, the external terminal 122c, and the through wiring 116c. And is electrically connected to the annular electrode 117c in the other region 201.

  The vibration element 120 as the first electronic component is connected to the first terminal 112 and the fifth terminal 113 in the first region 111 by a bonding material such as a conductive adhesive 119, and in the second region 131, the second terminal 112b. , 113b are connected by a bonding material such as a conductive adhesive 119b. Since the vibration element 120 of the present embodiment has the same configuration as that of the first embodiment described above, the following detailed description is omitted.

  The thermistors 180 and 180b as second electronic components connected to the third terminals 181 and 181b and the fourth terminals 182 and 182b by a bonding material such as a conductive adhesive 184 have a function of detecting temperature. doing. The vibration element 120 has a so-called frequency-temperature characteristic in which the resonance frequency changes with temperature. In order to suppress the frequency change due to the frequency temperature characteristic, thermistors 180 and 180b capable of detecting the environmental temperature as a data signal are provided. By correcting the resonance frequency based on the detected temperature signal data, it is possible to improve the resonance frequency accuracy.

  According to the sheet substrate 100 of the second embodiment described above, the first terminal 112 connected to the vibration element 120 arranged in the first region 111 includes the connection wiring 114, the through wiring 115, the first external terminal 121, The connection terminal 126 is electrically connected to the annular electrode 117d disposed in the other region 211 via the external terminal 122d disposed in the other region 211 and the through wiring 116d. In addition, the fifth terminal 113 connected to the vibration element 120 arranged in the first region 111 has a through wiring 118, a first external terminal 123, a connection terminal 125, and a second external arranged in the second region 131. It is electrically connected to the second annular electrode 117b disposed in the second region via the terminal 122b and the through wiring 116b. As a result, the vibration element 120 as the first electronic component connected to the first terminal 112 and the fifth terminal 113 in the first region 111 includes the annular electrode 117d disposed in the other region 211, In addition, characteristics such as a resonance frequency of the vibration element 120 can be inspected by a signal input to the second annular electrode 117b disposed in the second region 131. In this embodiment, the vibration element 120 as the first electronic component is input to the annular electrode 117d arranged in the other region 211b and the second annular electrode 117b arranged in the second region 131. However, the present invention is not limited to this, and the signal input to the second annular electrode 117b is reflected by the vibration element 120 and is detected using the second annular electrode 117b. Even if this method is used, the characteristics of the vibration element 120 can be inspected.

  In addition, the third terminal 181 disposed in the first region 111 of the sheet substrate 100 of the second embodiment is electrically connected to the first annular electrode 117 in the first region 111. Further, the fourth terminal 182 arranged in the first region 111 includes a connection wiring 183, a through wiring 127, a first external terminal 124, a connection terminal 125b, a second external terminal 121b, a connection terminal 126b, an external terminal 122c, and It is electrically connected to the annular electrode 117c in the other region 201 through the through wiring 116c. Since the thermistor 180 as the second electronic component is connected to the third terminal 181 and the fourth terminal 182, the first annular electrode 117 disposed in the first region and the other region 201 are disposed. A characteristic inspection or the like can be performed by a signal input to the annular electrode 117c. In this embodiment, the thermistor 180 as the second electronic component is input to the first annular electrode 117 disposed in the first region 111 and the annular electrode 117c disposed in the other region 201. However, the present invention is not limited to this, and the signal input to the first annular electrode 117 is reflected by the thermistor 180 using the second annular electrode 37. Even if a method such as detection is used, the characteristic inspection of the thermistor 180 can be performed.

  As described above, the sheet substrate 100 according to the second embodiment includes annular electrodes (first annular electrodes 117) arranged in four different regions (first region 111, second region 131, and other regions 201, 211). , The measurement terminal or the like is brought into contact with at least two of the second annular electrode 117b and the annular electrodes 117c, 117d), and the characteristics of the vibration element 120 as the first electronic component and the thermistor 180 as the second electronic component Inspection can be performed. Therefore, since the characteristic inspection of the vibration element 120 and the thermistor 180 can be performed without providing a dedicated inspection terminal, the first region 111 corresponding to the dedicated terminal for inspection and the occupied portion of the wiring portion related thereto, and The area of the second region 131 can be reduced. In other words, the number of the first regions 111 and the second regions 131 that can be disposed on the sheet substrate 100 can be increased, which can contribute to an improvement in manufacturing efficiency.

  In the first and second embodiments described above, the vibration element 120 is exemplified as the first electronic component and the thermistor 180 is exemplified as the second electronic component. However, the electronic component is a vibration element. It is not limited to 120 and thermistor 180, and may be a passive component such as a resistor, a capacitor, an inductor, or a diode, an active component such as a transistor or an integrated circuit, or another electronic component.

(Embodiment using a lid)
In addition to the above-described configuration, the sheet substrates 10 and 100 of the first embodiment and the second embodiment described above include electronic components such as the vibration element 120 and the thermistor 180, and a lid (including a wiring body). A cover) can also be arranged. The configuration will be described with reference to FIG. FIG. 4 shows an example of a schematic configuration of a sheet substrate (electronic device) using a lid, and is a cross-sectional view corresponding to a BB cross section of FIG. In addition, about the structure similar to 1st Embodiment, the same code | symbol may be attached | subjected and the description may be abbreviate | omitted.

  As shown in FIG. 4, the vibration element 20 as the first electronic component is connected to the first surface 5 a of the base substrate 5. Further, the first surface 5 a is provided with a first annular electrode 17 and a second annular electrode 37 provided in a frame shape surrounding the vibration element 20. A seam ring 71 as a bonding material is connected on the first annular electrode 17 and the second annular electrode 37. The first annular electrode 17, the second annular electrode 37, and the seam ring 71 form a recess whose upper surface is open, and an electronic component is accommodated in the recess. The seam ring 71 is made of an alloy such as Kovar, for example, and has conductivity. The seam ring 71 is provided in a frame shape (substantially rectangular shape) along the upper surfaces of the first annular electrode 17 and the second annular electrode 37.

The opening of the recess is closed by a lid 72 as a lid body joined to the first annular electrode 17 and the second annular electrode 37 via a seam ring (not shown) as a joining material. The sealed internal space can be set to a desired atmospheric pressure. For example, the internal space is filled with nitrogen gas at about atmospheric pressure, or vacuum (pressure lower than normal atmospheric pressure (lower than 1 × 10 ⁵ Pa, higher than 1 × 10 ⁻¹⁰ Pa (JIS Z 8126− 1: 1999)), the vibration of the vibration element 20 can be continued more stably.

  The lid 72 is a plate-like member that closes the opening of the recessed portion to be opened and is joined around the opening of the recessed portion by using, for example, a seam welding method. Since the lid 72 of this example is plate-shaped, it is easy to form and further excellent in shape stability. In addition, a Kovar plate material is used for the lid 72 of this example. By using a Kovar plate for the lid 72, when sealing, the seam ring 71 and the lid 72 formed of Kovar are melted in the same molten state, and further easily alloyed so that sealing is easy. And reliably. The lid 72 may be made of a plate material of another material instead of Kovar, for example, a metal material such as 42 alloy or stainless steel, or the same material as the first annular electrode 17 and the second annular electrode 37. Can be used. Further, in order to further improve the bonding of the lid 72 and the seam ring 71 to the surface to be bonded to the seam ring 71 of the lid 72, an alloy mainly composed of a metal such as gold, silver, copper, or the left metal, or A brazing material such as solder may be formed.

  By dividing the sheet substrate (base substrate 5) having the above-described configuration while leaving the respective regions (divided regions 7 and 8 shown in FIG. 1), an individualized electronic device can be obtained. Moreover, since it divides | segments by the division | segmentation area | regions 7 and 8 shown in FIG. 1, the connection terminal including the connection terminal 25 (The other connection terminal is not shown in FIG. 4) is cut | disconnected, and each area | region is connected. It does not affect the characteristics of the electronic device after the connection terminals are separated.

  According to the configuration using such a conductive lid (lid 72), the annular electrodes (first annular electrode 117, second annular electrode 117b, annular electrode as described in the first and second embodiments). 117c and 117d), instead of a method in which a measurement terminal is brought into contact with at least two of 117c and 117d) to perform a characteristic inspection, etc. It can be carried out. Accordingly, probing (contact of the measurement terminal) within a wider range is possible, the contactability of the measurement terminal can be improved, and the dedicated terminal for inspection and the occupied portion of the wiring portion related thereto are included. It is possible to reduce the areas of the first region and the second region.

  The lid is not limited to the plate-shaped lid 72, but is a cap formed of a metal material such as a Kovar plate, 42 alloy plate, stainless steel plate, etc., into a concave can shape having a flange on the outer periphery by drawing or the like. A configuration using (can) may be used. When this cap is used, a cap (can) can be joined to the first annular electrode 17 and the second annular electrode 37 by, for example, resistance welding.

(Modification)
Next, a modification of the sheet substrate will be described with reference to FIG. FIG. 5 shows a modification of the sheet substrate, where (a) is a partial plan view and (b) is a DD cross-sectional view. Although the drawing is drawn based on the example of the second embodiment, the present invention is not limited to this, and other forms are also applicable.

  The sheet substrate of the modification shown in FIG. 5 differs from the configuration of the second embodiment in the configuration of connection terminals that connect external terminals in each region. In the sheet substrate of this modification, the external terminals of each region are connected by through electrodes 152 provided at four corners that are the boundary between the first region and the second region (see FIG. 3). . The through electrode 152 includes a through hole 150 extending from the first surface 105 a to the second surface 105 b of the base substrate 105 and an electrode layer 151 provided on the inner peripheral surface of the through hole 150. The through electrode 152 can play a role of castellation when divided in the divided regions 7 and 8 (see FIG. 3). The through hole 150 is provided so as to hang within the planar shape of the external terminal including the first external terminals 122 and 123 and the second external terminal 122b. The electrode layer 151 is provided in contact with external terminals including the first external terminals 122 and 123 and the second external terminal 122b.

  With such a configuration, the external terminals including the first external terminals 122 and 123 and the second external terminal 122b can be electrically connected by the electrode layer 151 of the through electrode 152. Therefore, the external terminals including the first external terminals 122 and 123 and the second external terminal 122b can be electrically connected without providing a dedicated connection wiring.

<Method for manufacturing electronic device>
Next, a method for manufacturing an electronic device using the above-described sheet substrate will be described with reference to FIG. FIG. 6 is a process flow diagram showing a manufacturing process of an electronic device using a sheet substrate. In this description, an example in which a lid is connected to the configuration related to the first region 111 of the sheet substrate 100 of the second embodiment will be described with reference to FIG. 3, but similar steps are used in other regions. be able to.

  First, in the sheet substrate 100 described in the second embodiment, the vibration element 120 as the first electronic component is used as the first terminal 112 and the fifth terminal 113, and the thermistor 180 as the second electronic component is used as the first electronic component. The sheet substrate 100 in a state before being connected to the three terminals 181 and the fourth terminals 182 is prepared (sheet substrate preparation step S101). Note that the sheet substrate 100 of this example uses a configuration in which a seam ring (not shown) formed in a frame shape is joined to the first annular electrode 117.

  Next, the vibration element 120 is electrically connected to the first terminal 112 and the fifth terminal 113 through a bonding material such as a conductive adhesive 119. The conductive adhesive 119 has a paste shape in which a conductive filler is mixed in a resin base material. The vibration element 120 is placed on a paste-like conductive adhesive 119 applied on the first terminal 112 and the fifth terminal 113 together with a connection electrode (not shown). Thereafter, the conductive adhesive is dried and cured at a predetermined temperature and time, and the vibration element 120 is connected to the first terminal 112 and the fifth terminal 113 (first electronic component connecting step S103).

  Next, the thermistor 180 is electrically connected to the third terminal 181 and the fourth terminal 182 through a bonding material such as a conductive adhesive 184. The conductive adhesive 184 has a configuration similar to that of the conductive adhesive 119 described above. The thermistor 180 is placed on the paste-like conductive adhesive 184 applied to the third terminal 181 and the fourth terminal 182 together with each connection electrode (not shown). Thereafter, the conductive adhesive is dried and cured at a predetermined temperature and time, and the thermistor 180 is connected to the third terminal 181 and the fourth terminal 182 (second electronic component connecting step S105).

Next, a lid (not shown) as a lid is placed on the seam ring joined to the first annular electrode 117. Then, the seam ring is melted using a seam welding method or the like, and the lid is connected to the seam ring (lid connecting step S107). By connecting the lid in this way, the opening of the internal space to which the vibration element 120, the thermistor 180, and the like are connected is closed. The sealed internal space is, for example, a gas in a vacuum (pressure lower than normal atmospheric pressure (lower than 1 × 10 ⁵ Pa, higher than 1 × 10 ⁻¹⁰ Pa (JIS Z 8126-1: 1999)). In this case, the vibration of the vibration element 120 can be continued more stably. The seam ring and the lid used here have conductivity because a metal such as kovar is used as described above. Therefore, the first annular electrode 117 and the lid as the lid are electrically connected.

  Next, the characteristics of electronic components such as the vibration element 120 and the thermistor 180 connected and housed in the internal space are inspected (characteristic inspection step S109). As described in the second embodiment, since the annular electrode (lid as a lid through the annular electrode), the vibration element 120, and the thermistor 180 are electrically connected, in this characteristic inspection step S109, It is possible to perform a characteristic inspection by performing contact (probing) of the measurement terminal on the annular electrode (lid).

  Specifically, the first terminal 112 connected to the vibration element 120 disposed in the first region 111 is connected to the annular electrode 117d (lid) disposed in the other region 211 via various terminals. Electrically connected. Furthermore, the fifth terminal 113 connected to the vibration element 120 disposed in the first region 111 is electrically connected to the second annular electrode 117b (lid) disposed in the second region 131 via various terminals. Connected. Thereby, the characteristic inspection of the vibration element 120 located in the first region 111 is performed by measuring a resonance frequency by a signal inputted to at least the second annular electrode 117b (lid) arranged in the second region 131. Can do. The third terminal 181 disposed in the first region 111 of the sheet substrate 100 is electrically connected to the first annular electrode 117 (lid) in the first region. Furthermore, the 4th terminal 182 arrange | positioned at the 1st area | region 111 is electrically connected with the cyclic | annular electrode 117c (lid) of the other area | region 201 via various terminals. Since the thermistor 180 is connected to the third terminal 181 and the fourth terminal 182, characteristic inspection is performed by a signal input to at least the first annular electrode 117 (lid) disposed in the first region 111. It can be performed.

  According to the characteristic inspection method of this example, on the annular electrodes (first annular electrode 117 and second annular electrode 117b) disposed in each of at least two regions (first region 111 and second region 131). A characteristic terminal of the vibrating element 120 and the thermistor 180 can be inspected by bringing a measurement terminal or the like into contact with the lid connected to the lid. Therefore, since the characteristic inspection of the vibration element 120 and the thermistor 180 can be performed without providing a dedicated inspection terminal, the first region 111 corresponding to the dedicated terminal for inspection and the occupied portion of the wiring portion related thereto, and The area of the second region 131 can be reduced. In other words, the number of the first regions 111 and the second regions 131 that can be disposed on the sheet substrate 100 can be increased, which can contribute to an improvement in manufacturing efficiency.

  Next, on the sheet substrate 100, the electronic devices in the respective regions (the first region 111 and the second region 131, etc.) arranged in a matrix are divided by the divided regions 7 and 8, and are separated into individual pieces. The device is completed (individualization step S111). For the division, a dicing saw using a grindstone plate or the like can be used.

  According to the electronic device manufacturing method described above, on the annular electrodes (the first annular electrode 117 and the second annular electrode 117b) disposed in each of at least two regions (the first region 111 and the second region 131). A characteristic inspection of the vibration element 120 and the thermistor 180 can be performed by bringing a measurement terminal or the like into contact with the connected lid. Therefore, since the characteristic inspection of the vibration element 120 and the thermistor 180 can be performed without providing a dedicated inspection terminal, the first region 111 corresponding to the dedicated terminal for inspection and the occupied portion of the wiring portion related thereto, and The area of the second region 131 can be reduced. In other words, it is possible to increase the number of first regions 111 and second regions 131 that can be disposed on the sheet substrate 100, and it is possible to improve the manufacturing efficiency of the electronic device.

  In the above-described manufacturing method, an example using two electronic components (the vibration element 120 and the thermistor 180) has been described. However, a configuration including one electronic component (for example, the vibration element as in the first embodiment). In the configuration provided with 20, the same method can be used. In this case, the process flow is obtained by removing the second electronic component connection process S105 from the process flow shown in FIG.

  In the above-described manufacturing method, the lid connected to the annular electrodes (the first annular electrode 117 and the second annular electrode 117b) disposed in each of at least two regions (the first region 111 and the second region 131). Although it demonstrated by the method of making a measurement terminal etc. contact | abut to the lid as a body, it is not restricted to this. Instead of using this method, measurement is directly performed on the annular electrodes (first annular electrode 117 and second annular electrode 117b) disposed in at least two regions (first region 111 and second region 131) without using a lid. A method of bringing a terminal or the like into contact may be used, and the same effect can be obtained.

  Further, external terminals (first external terminals 121, 122, 123, 124) provided on the second surface 105b of the sheet substrate 100 are connected to connection terminals of electronic components. That is, the first terminal 112 is connected to the first external terminal 121, the fifth terminal 113 is connected to the first external terminal 123, the third terminal 181 is connected to the first external terminal 122, and the fourth terminal. 182 is connected to the first external terminal 124. Accordingly, if a sufficient area of the external terminals (first external terminals 121, 122, 123, 124) can be secured, the characteristic inspection is performed by bringing the measurement terminals into contact with the external terminals (first external terminals 121, 122, 123, 124). It is also possible to perform.

  In the first and second embodiments described above, as the electronic device, a vibrator using one electronic component (vibration element 20) and temperature compensation using two electronic components (vibration element 120 and thermistor 180) are used. The type vibrator has been described as an example, but the present invention is not limited to this. For example, an oscillator on which an oscillation circuit element that is another electronic component is mounted may be used.

  Moreover, when the edge of the sheet | seat board | substrates 10 and 100 is made into the 1st area | regions 11 and 111, an adjacent area | region may not exist. In this case, it is also possible to provide dummy terminals for measurement connected to the respective connection terminals at the end portions of the sheet substrates 10 and 100, and bring the measurement terminals (probes) into contact with the dummy terminals.

[Electronics]
Next, an electronic apparatus to which the electronic device according to an embodiment of the present invention is applied will be described in detail with reference to FIGS. In the description, an example in which the electronic device (vibrator) 1 is applied is shown.

  FIG. 7 is a perspective view schematically illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the electronic device (vibrator) 1 according to an embodiment of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates an electronic device (vibrator) 1 having a function as a signal processing timing source.

  FIG. 8 is a perspective view schematically illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic device (vibrator) 1 according to an embodiment of the present invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates an electronic device (vibrator) 1 having a function as a signal processing timing source.

  FIG. 9 is a perspective view schematically illustrating a configuration of a digital still camera as an electronic apparatus including the electronic device (vibrator) 1 according to an embodiment of the present invention. In this figure, connection with an external device is also simply shown. Here, the conventional film camera sensitizes the silver halide photographic film with the light image of the subject, whereas the digital still camera 1300 photoelectrically converts the light image of the subject with an imaging device such as a CCD (Charge Coupled Device). To generate an imaging signal (image signal).

  A display unit 100 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 100 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred to and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates an electronic device (vibrator) 1 having a function as a signal processing timing source.

  In addition to the personal computer (mobile personal computer) in FIG. 7, the mobile phone in FIG. 8, and the digital still camera in FIG. 9, the electronic device (vibrator) 1 according to an embodiment of the present invention includes, for example: Inkjet ejection device (for example, inkjet printer), laptop personal computer, TV, video camera, video recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor , Workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (eg, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, Various measuring instruments and instruments (for example, vehicles, Check machine, instruments and ships), a flight simulator, can be applied to electronic devices of a device such as a mobile terminal the base station.

[Moving object]
FIG. 10 is a perspective view schematically showing an automobile as an example of a moving body. An automobile 506 is equipped with an electronic device (vibrator) 1 according to the present invention. For example, as shown in the figure, an automobile 506 as a moving body has an electronic control unit 508 that incorporates an electronic device (vibrator) 1 and controls a tire 509 and the like mounted on a vehicle body 507. In addition, the electronic device (vibrator) 1 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring). System), engine control, battery monitors of hybrid vehicles and electric vehicles, vehicle body attitude control systems, and other electronic control units (ECUs) can be widely applied.

  5 ... base substrate, 5a ... first surface of base substrate, 5b ... second surface of base substrate, 7, 8 ... divided region, 10 ... sheet substrate, 11 ... first region, 11b ... other region, 12 ... first 1 terminal, 13 ... fifth terminal, 14 ... connection wiring, 15, 16 ... through wiring, 16b ... through wiring in other region, 17 ... first annular electrode as first conductive portion, 17b ... annular in other region Electrode, 18 ... penetrating wiring, 19 ... conductive adhesive, 20 ... vibrating element as electronic component, 21, 22, 23, 24 ... first external terminal, 22b ... external terminal in other region, 25, 26 ... connection Terminal, 31 ... 2nd area | region, 31b ... Other area | region, 32, 33 ... 2nd terminal, 34 ... Connection wiring, 35, 36 ... Through wiring, 37 ... 2nd annular electrode as 2nd electroconductive part, 38 ... Through Wiring, 39 ... conductive adhesive, 41, 42, 43, 44 ... first external terminals, 5 ... third region, 72 ... lid as lid, 91 ... fourth region, 180 ... thermistor as an electronic component.

Claims (10)

Having a first region and a second region on the first surface;
A first terminal disposed in the first region and connected to a first electronic component;
A second terminal disposed in the second region;
A first conductive portion having a third region surrounding the first terminal in the first region, the first conductive portion being disposed in the third region;
A second conductive part having a fourth region surrounding the second terminal in the second region, and being disposed in the fourth region;
A first external terminal disposed on a region overlapping the first region in plan view on the second surface in front-back relation with the first surface, and electrically connected to the first terminal;
A second external terminal disposed on the second surface in a region overlapping the second region in plan view and electrically connected to the second conductive portion;
The sheet substrate, wherein the first external terminal is electrically connected to the second external terminal. A third terminal disposed in the first region and connected to a second electronic component;
2. The third terminal is surrounded by the third region, is electrically connected to the first conductive portion, and is not electrically connected to the first terminal. A sheet substrate according to 1. A boundary electrode between the first region and the second region includes a through electrode extending from the first surface to the second surface,
The sheet substrate according to claim 1, wherein the first external terminal and the second external terminal are electrically connected via the through electrode.   The sheet substrate according to any one of claims 1 to 3, wherein a lid having conductivity is connected to each of the first conductive portion and the second conductive portion. The first surface has a first region and a second region, a first terminal disposed in the first region, a second terminal disposed in the second region, and the first terminal in the first region A fourth region having a third region surrounding the first terminal and having a first conductive portion disposed in the third region; and a fourth region surrounding the second terminal in the second region; And the second conductive portion arranged on the second surface and the second surface in front-back relation with the first surface are arranged in a region overlapping the first region in plan view, and electrically with the first terminal A first external terminal connected to the second surface, the second external portion being electrically connected to the first external terminal and disposed in a region overlapping the second region in plan view. And a second external terminal electrically connected to the electronic device using the sheet substrate Te,
Connecting a first electronic component to the first terminal;
And a step of connecting a conductive first lid to the second conductive portion. A method of manufacturing an electronic device, comprising: The sheet substrate is disposed in the first region, is surrounded by the third region, is electrically connected to the first conductive portion, and is not electrically connected to the first terminal. Has a terminal,
Connecting a second electronic component to the third terminal;
The method for manufacturing an electronic device according to claim 5, further comprising: connecting a second lid having conductivity to the first conductive portion. The first surface has a first region and a second region, a first terminal disposed in the first region, a second terminal disposed in the second region, and the first terminal in the first region A fourth region having a third region surrounding the first terminal and having a first conductive portion disposed in the third region; and a fourth region surrounding the second terminal in the second region; And the second conductive portion arranged on the second surface and the second surface in front-back relation with the first surface are arranged in a region overlapping the first region in plan view, and electrically with the first terminal A first external terminal connected to the second surface, the second external portion being electrically connected to the first external terminal and disposed in a region overlapping the second region in plan view. And a second external terminal electrically connected to the electronic device using the sheet substrate Te,
Connecting a first electronic component to the first terminal;
And inspecting the characteristics of the first electronic component,
In the step of inspecting the characteristics, a signal is input to the second conductive portion to inspect the characteristics of the first electronic component, and the method for inspecting an electronic device is characterized. Connecting a first lid having conductivity to the second conductive portion;
In the step of inspecting the characteristics,
The electronic device inspection method according to claim 7, wherein the first electronic component is inspected by inputting a signal to the first lid. The sheet substrate is disposed in the first region, is surrounded by the third region, is electrically connected to the first conductive portion, and is not electrically connected to the first terminal. It has 3 terminals,
Connecting a second electronic component to the third terminal;
Inspecting characteristics of the second electronic component,
The method for inspecting an electronic device according to claim 7, wherein in the step of inspecting the characteristic, a signal is input to the first conductive portion to inspect the second electronic component. Connecting a first lid having conductivity to the first conductive portion;
Connecting a second lid having conductivity to the second conductive part,
In the step of inspecting the characteristics,
The electronic device according to claim 9, wherein a signal is input to at least one of the first lid and the second lid to inspect at least one of the first electronic component and the second electronic component. Device inspection method.

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