JP2010226397A - Piezoelectric device, electronic equipment, and method of manufacturing the piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device that can easily and visually recognize a connection section while reducing height when packaging on substrates, or the like, and can be reliably connected; and to provide electronic equipment including the piezoelectric device and a method of manufacturing piezoelectric devices for manufacturing the piezoelectric device. <P>SOLUTION: A piezoelectric oscillator 1 includes: a substrate 4 for packaging; a package 3 that is placed on the substrate 4 for packaging and stores a piezoelectric vibration reed 2; and an electronic component 6 that is provided between the substrate 4 for packaging and the package 3 and drives the piezoelectric vibration reed 2. Also, a portion of the substrate 4 for packaging is bent upward, and a packaging terminal 43 is provided on a lower surface of the bent section 401. When such a piezoelectric oscillator 1 is packaged onto a circuit board 8, the connection between the circuit board 8 and the piezoelectric oscillator 1 is soldered, thus forming a solder reservoir (connection section 91) in a gap 9 formed at a lower portion of the bent section 401, and hence fixing the piezoelectric oscillator 1 onto the circuit board 8. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a piezoelectric device, an electronic apparatus, and a method for manufacturing a piezoelectric device.

A piezoelectric device such as a crystal oscillator generally includes a piezoelectric element such as a crystal resonator and an electronic component such as an IC element that drives the piezoelectric element. As such a piezoelectric device, for the purpose of downsizing and the like, a device having a configuration in which a piezoelectric element and an electronic component are mounted on a substrate so as to overlap is known.
For example, in the piezoelectric oscillator (crystal oscillator) described in Patent Document 1, a package containing a crystal resonator element is mounted on a mounting substrate via a pillar member, and an electronic component is mounted between the package and the mounting substrate. It is mounted on the mounting board so as to fit in

In addition, external electrodes are provided on the bottom surface of the mounting substrate of such a piezoelectric oscillator. The external electrode is electrically connected to a wiring pattern on a circuit board on which the piezoelectric oscillator is mounted via solder, anisotropic conductive paste, or the like. That is, the piezoelectric oscillator is mounted on the circuit board by connecting the external electrode of the piezoelectric oscillator and the wiring pattern of the circuit board.
Here, when the piezoelectric oscillator described in Patent Document 1 is arranged on the circuit board, the external electrode provided on the bottom surface of the piezoelectric oscillator and the wiring pattern provided on the circuit board are soldered. Thus, the piezoelectric oscillator is fixed on the circuit board.

FIG. 13 is a cross-sectional view showing a state in which a conventional piezoelectric oscillator is mounted on a circuit board.
A piezoelectric oscillator 900 shown in FIG. 13 includes a mounting substrate 901 and a package 903 containing an electronic component 902 and a crystal resonator element mounted thereon. In addition, a pillar member 904 is provided between the mounting substrate 901 and the package 903, and a mounting terminal 905 is provided on the lower surface of the mounting substrate 901.

On the other hand, the circuit board 910 shown in FIG. 13 has an insulating substrate 911 and circuit wiring 912 provided on the upper surface thereof.
When such a piezoelectric oscillator 900 is mounted on the circuit board 910 using solder, the piezoelectric oscillator 900 is placed on the circuit board 910 so that the mounting terminal 905 of the piezoelectric oscillator 900 and the circuit wiring 912 of the circuit board 910 face each other. Is mounted and soldered between the mounting terminal 905 and the circuit wiring 912.

  The piezoelectric oscillator 900 mounted in this manner is inspected for a connection state between the circuit board 910 and the piezoelectric oscillator 900 in an inspection process. In the inspection process, it is preferable that the space between the soldered mounting terminal 905 and the circuit wiring 912 can be directly recognized. However, since solder exists as a very thin layer (solder layer 909) between the mounting terminal 905 and the circuit wiring 912, it is not possible to directly see the portion other than the end surface of the solder layer 909. For this reason, it was difficult to perform sufficient visual inspection. In addition, when the mounting terminal 905 enters inside the outer edge of the piezoelectric oscillator 900, the mounting terminal 905 is hidden behind the mounting substrate 901 of the piezoelectric oscillator 900, and the solder layer 909 can be directly visually confirmed. It becomes difficult.

In addition, when the connection is made through the thin layered solder layer 909, a large stress is easily concentrated on the connection interface due to the difference in thermal expansion coefficient between the two connected, and the stress is relieved in the shape of both connected. hard. For this reason, a crack may occur in the solder layer 909 at the bonding interface, which may cause disconnection or the like.
Moreover, in the piezoelectric oscillator described in Patent Document 2, a mounting substrate is fixed to a package containing a piezoelectric vibrating piece via electronic components.

  When the piezoelectric oscillator described in Patent Document 2 is soldered and mounted on a circuit board, a sufficient gap is not formed between the mounting terminal and the circuit wiring of the circuit board. It exists as a very thin solder layer between the circuit wiring of the circuit board. Therefore, as in the case of Patent Document 1, visual inspection of soldering is difficult, and cracks may occur in the solder layer, leading to disconnection and the like.

JP 2002-64333 A JP 2007-281597 A

  An object of the present invention is to provide a piezoelectric device capable of facilitating the visual recognition of a connecting portion while being reduced in height when mounted on a substrate or the like and capable of highly reliable connection, and such a piezoelectric device. An object of the present invention is to provide an electronic apparatus and a method for manufacturing a piezoelectric device for manufacturing the piezoelectric device.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The piezoelectric device of the present invention is provided on the mounting substrate, on one surface side of the mounting substrate, and is provided between the mounting substrate and the package. An electronic component for driving the resonator element,
The mounting substrate has a bent part formed by bending a part of the edge part toward the package, and a part of the bent part is fixed to the package;
A mounting terminal is provided on a surface of the bent portion opposite to the package.
As a result, when mounted on a substrate or the like, a piezoelectric device capable of facilitating the visual recognition of the connecting portion while achieving a low profile and capable of highly reliable connection can be obtained.

[Application Example 2]
In the piezoelectric device according to the aspect of the invention, the bent portion may be inclined with respect to the electronic component mounting portion that is a portion on which the electronic component is mounted on the mounting substrate, and extend from the inclined portion toward the edge side. A tip portion that is a portion that has been
The tip portion is preferably fixed to the package.

  Thereby, the stress of a surface direction is easy to be relieved because the inclination-angle of an inclination part changes freely. For this reason, when the piezoelectric device is mounted on the base material, it is possible to more reliably suppress the occurrence of problems associated with stress concentration. Further, since the tip portion is substantially parallel to the electronic component mounting portion, the tip portion is also substantially parallel to the package, so that it is reliably bonded to the package with a sufficient area. In addition, since the tip portion is fixed to the package, the electronic component is surrounded by a part of the periphery by the mounting substrate and the package. As a result, the mounting substrate and the package can protect the electronic components from impacts and intrusion of foreign matter, and can improve the durability and reliability of the piezoelectric device.

[Application Example 3]
In the piezoelectric device according to the aspect of the invention, it is preferable that the mounting terminal is provided on the inclined portion.
Thereby, when a piezoelectric device is mounted on a base material, an area required for the mounting can be further reduced. For this reason, the area | region on a base material can be used effectively, for example, when a base material is a circuit board, the wiring density of circuit wiring can be raised more. As a result, the circuit board can be reduced in size.

[Application Example 4]
In the piezoelectric device of the present invention, the mounting substrate has a rectangular shape in plan view,
The bent portions are preferably provided at the edges of a pair of opposing sides of the mounting substrate or at the four corners of the mounting substrate.
Thereby, the mounting board can reliably protect the electronic component. As a result, the reliability of the piezoelectric device can be further increased.

[Application Example 5]
In the piezoelectric device according to the aspect of the invention, it is preferable that the mounting substrate is made of a flexible material.
Thereby, since flexibility is given to the mounting substrate, the mounting substrate itself can alleviate stress concentration.

[Application Example 6]
An electronic apparatus of the present invention is an electronic apparatus including the piezoelectric device of the present invention,
The piezoelectric device is placed on a substrate,
Having a gap between the bent portion of the piezoelectric device and the base material,
A connecting portion for connecting the mounting terminal and the wiring pattern on the substrate is formed in the gap.
Accordingly, when the piezoelectric device is mounted on the base material, the connection portion formed between the mounting terminal and the base material is formed in the gap, and thus the thickness of the connection portion tends to be thick. For this reason, this connection part can be visually recognized more easily.

[Application Example 7]
In the electronic device according to the aspect of the invention, it is preferable that the connection portion is a conductive member filled in at least a part of the gap.
Thereby, since the connection part which bears the said connection becomes a certain amount of thickness, it is easy to relieve stress concentration. For this reason, generation | occurrence | production of the malfunction accompanying stress concentration can be suppressed reliably.

[Application Example 8]
A method for manufacturing a piezoelectric device according to the present invention includes a mounting substrate having mounting terminals, a package provided on one surface side of the mounting substrate, containing a piezoelectric vibrating piece, and the mounting substrate and the package. A method of manufacturing a piezoelectric device having an electronic component for driving the piezoelectric vibrating piece,
A plurality of regions to be the mounting substrate are connected, a mounting substrate film having the mounting terminals is prepared in each region, and the electrons are respectively provided on the surface opposite to the surface having the mounting terminals in each region. An electronic component placement process for placing the component;
A package placement process for placing the packages so as to sandwich the electronic components with respect to the mounting substrate film; and
Of the region of the mounting substrate film, a portion including the mounting terminal is bent to the package side to form a bent portion, and a bending step of bonding the bent portion and the package;
A cutting step of cutting a boundary between the regions of the mounting substrate film to manufacture a plurality of the piezoelectric devices.
As a result, when mounted on a substrate or the like, the connection portion can be easily seen while reducing the height, and a plurality of piezoelectric devices that can be connected with high reliability can be efficiently and simultaneously. Can be manufactured.

[Application Example 9]
In the piezoelectric device manufacturing method of the present invention, the mounting substrate film is connected to the region to be the mounting substrate and the region, and is electrically connected to the electronic component in the electronic component mounting step. And an extension portion having a power adjustment terminal,
Before or after the bending step, it is preferable to have an adjustment step of rewriting information on the electronic component via the adjustment terminal and then separating the region and the extended portion.
As a result, even if the usage environment of the piezoelectric device changes significantly after the manufacture of the piezoelectric device, a piezoelectric device capable of stable oscillation can be manufactured by rewriting various information in the electronic component according to the usage environment. Can do.

It is a disassembled perspective view which shows the piezoelectric oscillator to which 1st Embodiment of the piezoelectric device of this invention is applied. It is the (a) top view and (b) bottom view which show typically the piezoelectric oscillator shown in FIG. It is the sectional view on the AA line of FIG. It is a top view which shows typically the mounting board | substrate with which a piezoelectric oscillator is provided. It is sectional drawing for demonstrating the method to mount the piezoelectric oscillator shown in FIG. 1 on a circuit board. It is the elements on larger scale which show the other structural example of the connection part formed in the clearance gap between a mounting terminal and circuit wiring. It is a conceptual diagram which shows the board | substrate film for mounting for manufacturing the board | substrate for mounting with which the piezoelectric oscillator shown in FIG. 1 is provided. It is a figure for demonstrating the manufacturing method of the piezoelectric oscillator shown in FIG. It is a figure for demonstrating the manufacturing method of the piezoelectric oscillator shown in FIG. It is a perspective view which shows the other structural example of the mounting board | substrate with which a piezoelectric oscillator is provided. It is a perspective view which shows the mounting board | substrate of the piezoelectric oscillator to which 2nd Embodiment of the piezoelectric device of this invention is applied. It is the (a) top view and (b) bottom view which show the board | substrate film for mounting for manufacturing the board | substrate for mounting shown in FIG. It is sectional drawing which shows the state which mounted the conventional piezoelectric oscillator on the circuit board.

Hereinafter, a piezoelectric device, an electronic apparatus, and a method for manufacturing a piezoelectric device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
<First Embodiment>
First, a first embodiment of the piezoelectric device of the present invention will be described.
FIG. 1 is an exploded perspective view showing a piezoelectric oscillator to which a first embodiment of a piezoelectric device of the present invention is applied, and FIG. 2 schematically shows the piezoelectric oscillator shown in FIG. 1 (a) a top view and (b) a bottom surface. 3 is a cross-sectional view taken along line AA of FIG. 2, and FIG. 4 is a plan view schematically showing a mounting substrate provided in the piezoelectric oscillator. In the following description, the front side of the paper surface in FIG. 2A is referred to as “upper”, and the back side of the paper surface is referred to as “lower”. In FIG. 1, the mold resin that covers the piezoelectric oscillator is omitted.

(Piezoelectric oscillator)
First, a piezoelectric oscillator will be described as an example of the first embodiment of the piezoelectric device of the present invention.
A piezoelectric oscillator 1 shown in FIG. 1 is mounted so as to be housed between a package 3 for housing a piezoelectric vibrating piece 2, a mounting substrate 4 for mounting (fixing) the package 3, and the package 3 and the mounting substrate 4. And an electronic component 6 provided on the circuit board 4.

Hereinafter, each part which comprises the piezoelectric oscillator 1 is demonstrated in detail sequentially.
First, the piezoelectric vibrating piece 2 will be described.
In the present embodiment, the piezoelectric vibrating piece 2 is a tuning-fork type quartz vibrating piece as shown in FIG. As shown in FIG. 2, the piezoelectric vibrating piece 2 includes a piezoelectric substrate 21 having a longitudinal shape and a tuning fork shape, and two excitation electrodes (not shown) formed on the surface of the piezoelectric substrate 21. ing.

The piezoelectric substrate 21 is made of a piezoelectric material. Examples of the piezoelectric material include crystal, lithium tantalate, lithium niobate, lithium borate, and barium titanate.
The excitation electrode applies an electric field to the piezoelectric substrate 21. When an electric field is applied to the excitation electrode, the piezoelectric substrate 21 can be vibrated at a certain frequency (resonance frequency) due to the inverse piezoelectric effect of the piezoelectric material. When the piezoelectric substrate 21 vibrates, a voltage having a certain frequency is generated between the two excitation electrodes due to the piezoelectric effect of the piezoelectric material. Utilizing these properties, the piezoelectric vibrating reed 2 can generate an electrical signal that vibrates at a resonance frequency.

Next, the package 3 for housing and fixing the piezoelectric vibrating piece 2 will be described.
The package 3 has a substantially square shape or a substantially rectangular shape in plan view. As shown in FIG. 3, such a package 3 includes a plate-like base substrate 31 having a concave portion corresponding to the internal space S <b> 1 in the central portion, and a lid member that is stacked on the base substrate 31 so as to cover the concave portion. 32. The base substrate 31 and the lid member 32 are joined by an adhesive or a brazing material. The package 3 accommodates the piezoelectric vibrating reed 2 in an internal space S1 defined by the base substrate 31 and the lid member 32. In FIG. 2A, the lid member 32 is shown in a transparent manner.

As the constituent material of the base substrate 31, those having insulating properties (non-conductive) are preferable. For example, various glass materials, various ceramic materials such as oxide ceramics, nitride ceramics, carbide ceramics, polyimide, etc. Various resin materials can be used.
Further, as the constituent material of the lid member 32, for example, the same constituent material as that of the base substrate 31, various metal materials such as Al and Cu, various glass materials, and the like can be used. In particular, when a light-transmitting material such as a glass material is used as the constituent material of the lid member 32, the piezoelectric vibrating piece 2 can be obtained by previously forming a metal cover (not shown) on the piezoelectric substrate 21. Even after the substrate 3 is accommodated in the package 3, the metal cover is irradiated with a laser through the lid member 32, and the metal cover is removed to reduce the mass of the piezoelectric substrate 21 (mass). The frequency of the piezoelectric vibrating piece 2 can be adjusted by the reduction method.

  As shown in FIG. 3, a pair of mount electrodes 34 is formed on the bottom surface of the recess (internal space S <b> 1) of the base substrate 31. On the mount electrode 34, an epoxy-based or polyimide-based conductive adhesive 39 containing conductive particles is applied (stacked), and further on the conductive adhesive 39. The piezoelectric vibrating reed 2 described above is placed. Then, by curing the conductive adhesive 39, the piezoelectric vibrating reed 2 is cantilevered by the mount electrode 34 (base substrate 31).

By this fixing, one of the pair of mount electrodes 34 is electrically connected to one of the two excitation electrodes provided on the piezoelectric vibrating piece 2 via the conductive adhesive 39. The other mount electrode 34 is also electrically connected to the other excitation electrode through the conductive adhesive 39.
Further, since the piezoelectric vibrating piece 2 is fixed by adhering the left end of the piezoelectric vibrating piece 2 to the base substrate 31, when the piezoelectric vibrating piece 2 vibrates, the left side of the piezoelectric vibrating piece 2 is fixed. The end is the “fixed end”, while the right end is the “free end”.

Further, as shown in FIG. 2A, external terminals 35 are provided on the lower surface of the base substrate 31 in the vicinity of both ends in the longitudinal direction.
These two external terminals 35 are electrically connected to two mount electrodes 34, respectively.
Each of the mount electrodes 34 and the external terminals 35 can be formed by applying gold plating to an underlying layer of tungsten and nickel plating, for example.

Next, the mounting substrate 4 on which such a package 3 is placed will be described.
As shown in FIG. 1, the mounting substrate 4 is a substrate on which the package 3 and an electronic component 6 to be described later are mounted. The mounting substrate 4 has a substantially square shape or a substantially rectangular shape in plan view. The substrate is approximately the same size as 31.
Such a mounting substrate 4 has an insulating substrate 40, a plurality of electrode terminal portions 41 provided on the upper surface (surface on the package 3 side), and two wiring patterns 42.

  Among these, the insulating substrate 40 may be a rigid substrate, a flexible substrate, or a rigid flexible substrate, but is preferably a flexible substrate from the viewpoint of ease of processing. In addition, the constituent material of the insulating substrate 40 is preferably an insulating (non-conductive) material. Examples of the constituent material of the rigid substrate include various glasses, oxide ceramics, and nitride ceramics. And ceramics such as carbide-based ceramics. As the constituent material of the flexible substrate, various resin materials such as polyimide, polyethylene, polypropylene, and polyethylene terephthalate can be used.

Further, as shown in FIG. 3, the plurality of electrode terminal portions 41 are spaced apart from each other in correspondence with the pad portions 61 of the electronic component 6.
These electrode terminal portions 41 are terminals for driving the piezoelectric vibrating reed 2, as well as characteristic inspection of the electronic component 6 and rewriting of various information in the electronic component 6 (for example, temperature compensation information of the piezoelectric oscillator 1). A write terminal, an input / output terminal, a ground terminal, and the like.

  In addition, as shown in FIG. 1, as shown in FIG. 1, a part of the center in the short direction of the insulating substrate 40 protrudes upward at both ends in the longitudinal direction of the mounting substrate 4. Two bent portions 401 and 401 are formed by being bent. In each bent portion 401, bent lines 402a and 402b are formed at the root portion and the tip portion, respectively. As a result, each of the bent portions 401 is bent upward along the fold line 402a, and the region on the distal end side of the fold line 402a and the proximal end side of the fold line 402b is located on a portion other than the bent portion 401 of the insulating substrate 40. It becomes the inclined part 401a inclined with respect to it. On the other hand, the bending line 402b is bent downward, so that the region on the tip side of the bending line 402b becomes a tip portion 401b substantially parallel to the portion other than the folding portion 401 of the insulating substrate 40.

  Although the inclination angle of the inclined portion 401a, that is, the angle formed between the portion other than the bent portion 401 of the insulating substrate 40 and the inclined portion 401a is not particularly limited, it is preferably about 5 to 80 °, preferably about 10 to 70 °. It is more preferable that it is about 20 to 60 °. When two inclination angles are considered, the smaller angle is referred to as the “inclination angle”.

Moreover, although the height of the front-end | tip part 401b changes according to the size of the piezoelectric oscillator 1, the thickness of the electronic component 6, etc., as an example, Preferably it is about 0.2-3 mm, More preferably, it is about 0.3-2 mm. It is said.
In addition, two notches 403 and 403 are formed along the longitudinal direction at both ends in the longitudinal direction of the mounting substrate 4 as shown in FIG. That is, a total of four notches 403 are formed in the mounting substrate 4. A region between the two notches 403 and 403 is a bent portion 401. By providing the notch 403 in this manner, even if the mounting substrate 4 is bent, the influence does not reach other regions in the short side direction of the mounting substrate 4.

Each notch 403 preferably has a V-shaped plan view at the tip as shown in FIG. Thereby, each bending part 401 becomes easier to bend.
Further, in the longitudinal direction of the mounting substrate 4, as shown in FIG. 2B, a notch 404 for separating each bent portion 401 from other regions (electronic component mounting portion on which the electronic component 6 is mounted). Is formed. That is, a plurality of the notches 404 are formed at the base portion of each bent portion 401 along the bend line 402a. By providing the cuts 404 in this way, the mounting substrate 4 can be easily folded along the folding line 402a, and the influence of the bending is applied to other regions in the longitudinal direction of the mounting substrate 4. It has become impossible to reach.

Each notch 404 is constituted by a groove, a recess, a through hole, or the like formed in the mounting substrate 4.
In addition, as shown in FIGS. 3 and 4, the two wiring patterns 42 have one end connected to one of the plurality of electrode terminal portions 41, and the other end is mounted. The substrate 4 is formed so as to extend toward both ends in the longitudinal direction.
The other end portion of each wiring pattern 42 extends to the tip end portion 401b through the inclined portion 401a of each bent portion 401. Further, the other end of each wiring pattern 42 has a wide line width. Thereby, each wiring pattern 42 has improved connectivity with the external terminal 35 of the package 3 described above.

  On the other hand, mounting terminals 43 are formed on the lower surface of each bent portion 401 of the mounting substrate 4. Each mounting terminal 43 is a terminal for electrical and mechanical connection with a circuit board on which the piezoelectric oscillator 1 is mounted. Each mounting terminal 43 is electrically connected to each electrode terminal portion 41 via a conductor post provided in a via hole formed in the mounting substrate 4.

An electronic component 6 is placed on the center of the upper surface of the mounting substrate 4. The electronic component 6 is, for example, an integrated circuit element (IC) and has a function of driving the piezoelectric vibrating piece 2.
As shown in FIG. 3, the electronic component 6 is mounted by so-called face-down bonding via bumps (projection electrodes) 44 formed on the electrode terminal portions 41. Thereby, each pad part 61 and each electrode terminal part 41 of the electronic component 6 are electrically connected, and the electronic component 6 is fixed to the mounting substrate 4.

The electronic component 6 may be electrically connected by so-called wire bonding using a metal wire instead of fail-down bonding.
In addition, the package 3 is placed on the front end portion 401 b of each bent portion 401 of the mounting substrate 4. As a result of the package 3 being placed on the tip 401b, the package 3 was lifted from the center of the mounting substrate 4 by the protruding height of each bent portion 401, as shown in FIGS. It is in a state. This eliminates the need for a spacer, a pillar member, and the like for lifting the package 3 as in the prior art, and a reduction in height due to simplification of the structure of the piezoelectric oscillator 1 can be achieved.

Further, as described above, the tip 401b of each bent portion 401 of the mounting substrate 4 and the external terminal 35 of the package 3 are joined or connected by a conductive member such as solder (brazing material) or a conductive adhesive. It is glued. Since the front end portion 401b is a region substantially parallel to the lower surface of the package 3, it can be reliably bonded to the package 3 with a sufficient area.
In addition, as a result of joining each bending part 401 and the package 3, the electronic component 6 will be in the state by which the lower surface and side surface were covered with the board | substrate 4 for mounting. As a result, the mounting substrate 4 can protect the electronic component 6 from impacts, intrusion of foreign matter, and the like, and can improve the durability and reliability of the piezoelectric oscillator 1.

The piezoelectric oscillator 1 is partially molded with a mold resin 7. This reinforces the bonding between the package 3 and the mounting substrate 4 and protects each. For the mold resin 7, for example, various thermosetting resin materials are suitable.
In FIG. 3, the mold resin 7 is filled in the outer peripheral portion of the lid member 32 and the gap between the package 3 and the mounting substrate 4, but also covers the side surfaces of the package 3 and the mounting substrate 4. May be provided.

(Piezoelectric oscillator mounting method)
Next, a method for mounting the piezoelectric oscillator 1 on a circuit board will be described.
FIG. 5 is a cross-sectional view for explaining a method of mounting the piezoelectric oscillator shown in FIG. 1 on a circuit board. In the following description, the upper side in FIG. 5 is referred to as “upper” and the lower side is referred to as “lower”. In FIG. 5, the mold resin that covers the piezoelectric oscillator is omitted.

The piezoelectric oscillator 1 is mounted on a circuit board via, for example, solder, anisotropic conductive paste or the like.
The mounting method is not particularly limited, such as a reflow method or a flow method, but the reflow method will be described here.
Specifically, the reflow mounting method includes a step of supplying a solder paste to a location where the piezoelectric oscillator 1 is mounted on the circuit board, a step of mounting the piezoelectric oscillator 1 on the circuit board, and the piezoelectric oscillator 1 A step of heating (reflowing) the mounted circuit board by heating, melting and solidifying the solder.

Hereinafter, each step will be described.
First, a solder paste is supplied onto the circuit wiring 81 of the circuit board 8.
The solder paste is a paste obtained by mixing solder powder or flux with a binder.
The supply of the solder paste can be performed using, for example, a dispenser in addition to various printing methods such as screen printing.

Next, the piezoelectric oscillator 1 is placed on the supplied solder paste. The position of the mounted piezoelectric oscillator 1 is held by the viscosity of the solder paste.
Next, the circuit board 8 on which the piezoelectric oscillator 1 is mounted is heated by a reflow furnace. Although heating temperature is suitably set according to the kind of solder, it is set as about 220-260 degreeC as an example.
By such heating, the binder component in the solder paste is first decomposed and removed. Thereafter, when the heating temperature exceeds the melting point of the solder, the solder is melted and spreads between the circuit wiring 81 of the circuit board 8 and each mounting terminal 43 of the piezoelectric oscillator 1.

Thereafter, the circuit board 8 is radiated to solidify the solder, and the piezoelectric oscillator 1 is mounted on the circuit board 8.
Here, the molten solder between the mounting terminal 43 and the circuit wiring 81 wets and spreads so as to fill a gap between the mounting terminal 43 and the circuit wiring 81 as shown in FIG. Further, since the mounting terminal 43 is formed on the lower surface of the bent portion 401 of the mounting substrate 4 of the piezoelectric oscillator 1, a gap 9 is generated between the mounting terminal 43 and the circuit wiring 81. . As shown in FIG. 5, the melted solder is formed so as to fill the gap 9 with a gently curved shape called a “fillet” (fillet 92 shown in FIG. 5) on the opening side of the gap 9. It becomes a solder pool. Such a solder pool is solidified, and the connection part 91 shown in FIG. 5 is formed.

In the conventional piezoelectric oscillator, since there was almost no gap with the circuit board, even if it tried to visually recognize a connection part, the visible area was very small. For this reason, in the inspection process, it was extremely difficult to directly look at the fillet and find defects such as cracks occurring in the connection portion.
Further, a difference in thermal expansion coefficient generally exists between the piezoelectric oscillator and the circuit board, but this thermal expansion coefficient difference may cause stress concentration on the connection portion after mounting. In the conventional solder accumulated in a layer shape, such stress concentration cannot be alleviated, and a crack or the like may occur in the connection portion.

On the other hand, in the mounting of the piezoelectric oscillator 1, as shown in FIG. 5, a relatively wide gap 9 is generated between the mounting terminal 43 and the circuit wiring 81 due to the bending of the bent portion 401. Therefore, in the inspection process, the thicker connecting portion 91 formed in the wide gap 9 can be easily visually recognized, and the defect can be easily found.
Further, since the connection portion 91 is a material in which solder is accumulated to a certain thickness, and the solder is a material having a relatively high flexibility, it contributes to relaxation of stress concentration in the connection portion 91. For this reason, even if the stress due to the difference in the thermal expansion coefficient between the piezoelectric oscillator 1 and the circuit board 8 occurs, the connecting portion 91 surely suppresses the occurrence of defects, thereby improving product reliability and manufacturing yield. Can be achieved.

  Furthermore, since the connecting portion 91 fixes the bent portion 401 to the circuit board 8, it contributes to stress relaxation particularly in the lateral direction (direction parallel to the circuit board 8). This is because the bent portion 401 is formed by bending an insulating substrate, and therefore the bending angle (inclination angle of the inclined portion 401a) can be freely changed, so that stress in the lateral direction (surface direction) is particularly changed. It is because it is easy to relax. This tendency is particularly remarkable when the insulating substrate 40 is a flexible substrate (flexible substrate). For this reason, the connecting portion 91 can more reliably suppress the occurrence of problems associated with stress concentration.

  In addition, since the electronic component 6 is mounted between the bent portions 401 formed at both ends of the mounting substrate 4, the mounting position (mounting) of the electronic component 6 is mounted even when the thickness of the connection portion 91 is increased. Almost no effect on (height). For this reason, even if the thickness of the connecting portion 91 is increased, it is difficult to affect the height of the piezoelectric oscillator 1 mounted on the circuit board 8. The entire circuit board 8 on which the oscillator 1 is mounted can be reliably reduced in thickness.

Note that the shape of the connecting portion 91 can take various shapes depending on the formation region of the mounting terminal 43.
FIG. 6 is a partially enlarged view showing another configuration example of the connection portion formed in the gap between the mounting terminal and the circuit wiring.
In the piezoelectric oscillator 1 shown in FIG. 5 described above, the mounting terminal 43 is provided on both the lower surface of the inclined portion 401a and the lower surface of the tip portion 401b in the bent portion 401. On the other hand, the piezoelectric oscillator shown in FIG. 6 is the same as the piezoelectric oscillator 1 shown in FIG. 5 except that the shape of the mounting terminal 43 is different.

That is, the mounting terminal 43 a shown in FIG. 6A is provided only on the lower surface of the tip end portion 401 b in the bent portion 401. When the piezoelectric oscillator 1 having such a mounting terminal 43a is placed on the circuit board 8, a solder pool as shown in FIG. 6A is formed between the mounting terminal 43a and the circuit wiring 81. The connection part 91a is formed when this solidifies.
On the other hand, the mounting terminal 43b shown in FIG. 6B is provided only on the lower surface of the distal end portion 401b in the bent portion 401, like the mounting terminal 43a described above. The piezoelectric oscillator 1 having such mounting terminals 43b is placed on the circuit board 8, and a conductive spherical shape as shown in FIG. 6B is provided between the mounting terminals 43b and the circuit wiring 81. The spacers 93 are connected. Then, a solder pool as shown in FIG. 6B is formed between the mounting terminal 43b and the spacer 93 and between the circuit wiring 81 and the spacer 93, and this solidifies to form the connection portion 91b. Has been.

According to such a connecting portion 91b, the piezoelectric oscillator 1 can be mounted in a state where it is lifted from the circuit board 8 by the diameter of the spacer 93. As a result, a wider gap 9 is formed between the mounting terminal 43 and the circuit wiring 81. As a result, the connecting portion 91b and the fillet 92 can be visually confirmed more reliably.
The spacer 93 includes, for example, a solder layer formed on the surface of particles made of copper.

Also, the mounting terminal 43c shown in FIG. 6C is provided only on the lower surface of the inclined portion 401a in the bent portion 401. When the piezoelectric oscillator 1 having such mounting terminals 43c is placed on the circuit board 8, a solder pool as shown in FIG. 6C is formed between the mounting terminals 43c and the circuit wiring 81. The connection part 91c is formed when this solidifies.
According to such a connection part 91c, the area required for mounting the piezoelectric oscillator 1 can be further reduced. That is, in the case of FIG. 6C, the length L2 necessary for mounting the piezoelectric oscillator 1 on the circuit board 8 is shorter than the length L1 of the piezoelectric oscillator 1. For this reason, the area on the circuit board 8 can be used effectively. For example, the circuit board 8 may have circuit wiring 82 provided so as to enter the gap 9 as shown in FIG. it can. Since this circuit wiring 82 is another wiring different from the circuit wiring 81, according to the mounting form shown in FIG. 6C, the wiring density in the circuit board 8 is reduced without reducing the size of the piezoelectric oscillator 1. Can be increased. As a result, the circuit board 8 can be reduced in size.
Also by the connection portions 91a, 91b, 91c shown in FIG. 6 as described above, the same operations and effects as those of the connection portion 91 shown in FIG. 5 described above can be obtained.

(Piezoelectric oscillator manufacturing method)
Next, a method for manufacturing the piezoelectric oscillator 1 (a method for manufacturing a piezoelectric device of the present invention) will be described.
FIG. 7 is a conceptual diagram showing a mounting substrate film for manufacturing a mounting substrate provided in the piezoelectric oscillator shown in FIG. 1, and FIGS. 8 and 9 are diagrams for explaining a method of manufacturing the piezoelectric oscillator shown in FIG. FIG. 8 and 9 are cross-sectional views taken along line BB in FIG.

A mounting substrate film 100 shown in FIG. 7 is a belt-like film in which regions corresponding to the mounting substrate 4 are connected in a row so that a plurality of piezoelectric oscillators 1 can be formed simultaneously.
The mounting substrate film 100 is formed by connecting a plurality of insulating substrates 40 made of the above-described resin material such as polyimide, and is cut along a cutting line CL shown in FIG. 4 can be manufactured.

In the mounting substrate film 100, the electrode terminal portions 41, the wiring patterns 42, the mounting terminals 43, the notches 403, and the notches 404 described above are formed in portions corresponding to the individual mounting substrates 4. ing.
A plurality of through holes 101 arranged along the width direction are formed between adjacent bent portions 401. This through-hole 101 is connected to the adjacent cutout 403, whereby each bent portion 401 can be bent, and each bent portion 401 can be bent even in the state of the mounting substrate film 100 before cutting each portion. The part 401 can be formed.

In addition, each electrode terminal part 41, each wiring pattern 42, and each mounting terminal 43 can be formed by using a conductive material such as copper and combining techniques such as etching, printing, vapor deposition, and plating.
Further, the insulating film 102 is formed on the entire upper surface of the mounting substrate film 100 in a region excluding each electrode terminal portion 41, each wiring pattern 42, each notch 403, and each notch 404.

Hereinafter, a method for manufacturing the piezoelectric oscillator 1 will be sequentially described.
First, the electronic component 6 is mounted face-down on the upper surface of the mounting substrate film 100 (electronic component placing step).
Specifically, first, the bump 44 is formed on each pad portion 61 with the surface of the electronic component 6 having the pad portion 61 facing upward. Various bumps, such as plating bumps and metal bumps, can be used as the bumps 44. As an example, the tip of a metal wire used for wire bonding is made into a ball shape by discharge, and then the tip is attached to a pad portion. A so-called stud bump formed by pressing and joining to 61 and then cutting the wire and leaving the tip portion on the pad portion 61 is exemplified. After the formation of the bumps 44, as shown in FIG. 8A, the electronic component 6 is supported from above by the bonding head BH, and the electronic components 6 are mounted so that the bumps 44 and the electrode terminal portions 41 are in contact with each other. It is placed on the substrate film 100 for use. And the electronic component 6 is crimped | bonded to the board | substrate film 100 for mounting, applying an ultrasonic wave with the bonding head BH.

Next, as shown in FIG. 8B, the lower surface of the package 3 and the upper surface of the electronic component 6 are bonded with an adhesive (not shown). Thereby, the package 3 is fixed to the upper surface of the electronic component 6.
Next, the mounting substrate film 100 to which the electronic component 6 and the package 3 are fixed is turned upside down. And each bending part 401 of the board | substrate film 100 for mounting is pushed down as shown in FIG.8 (c) (bending process). And the wiring pattern 42 provided in each bending part 401 and the external terminal 35 provided in the package 3 are connected. As a result, the wiring pattern 42, the external terminal 35, and the piezoelectric vibrating reed 2 housed in the package 3 are electrically connected. The wiring pattern 42 and the external terminal 35 are connected by thermocompression bonding or bump bonding.

Further, the mounting substrate film 100 can be bent by, for example, pressing a jig or the like against the mounting substrate film 100.
Next, as shown in FIG. 9 (d), the molding resin 7 molds the space between the package 3 and the mounting substrate film 100 and the outside of the lid member 32 of the package 3. The mold resin 7 is, for example, a method in which a member to be molded is placed in a mold and the mold resin is supplied into the mold (injection mold), a method of supplying by a screen printing method, or a method of filling the gap with the mold resin ( Potting mold) or the like. In the potting mold, these may be blocked with a member (not shown) so that the mold resin does not leak out from each notch 403 or each through hole 101.

Next, the mounting substrate film 100 is cut along a cutting line CL shown in FIG. 9D (cutting process). Thereby, the mounting substrate film 100 is separated into a plurality of mounting substrates 4, and as a result, a plurality of piezoelectric oscillators 1 are manufactured simultaneously.
Next, various characteristics of each piezoelectric oscillator 1 are inspected, and various information in the electronic component 6 is rewritten as necessary. Further, if necessary, the piezoelectric vibrating piece 2 in the package 3 is irradiated with laser light so as to pass through the lid member 32, and the frequency of the piezoelectric vibrating piece 2 is adjusted by the mass reduction method described above.

Note that the mounting substrate 4 may be expanded in the width direction, and an adjustment terminal for rewriting various information in the electronic component 6 may be provided in the expanded portion. Such a mounting substrate will be described below.
FIG. 10 is a perspective view showing another configuration example of the mounting substrate provided in the piezoelectric oscillator.
A temporary substrate 400 shown in FIG. 10A is obtained by extending the mounting substrate 4 shown in FIG. 1 in the width direction, and a portion of the insulating substrate 40 corresponding to the mounting substrate 4 shown in FIG. And an expanded portion 4a which is an expanded portion. Two adjustment terminals 47 are provided on the upper surface of the extended portion 4a. Therefore, the configuration of the temporary substrate 400 is the same as that of the mounting substrate 4 shown in FIG. 1 except for the extended portion 4a and the two adjustment terminals 47 and 47.

The two adjustment terminals 47 and 47 are independently electrically connected to the electrode terminal portion 41 of the temporary substrate 400 via wiring. Thereby, various information in the electronic component 6 can be rewritten via each adjustment terminal 47 (adjustment process).
In addition, since the extended portion 4 a provided with each adjustment terminal 47 is not hidden behind the electronic component 6 or the package 3, each adjustment terminal 4 a is mounted after the electronic component 6 or the package 3 is mounted on the temporary substrate 400. A voltage can be applied to 47. In addition, you may be made to perform this adjustment process before the said bending process.

  Furthermore, since each adjustment terminal 47 has been conventionally formed on the lower surface of the mounting substrate 4, the size of the adjustment terminal 47 cannot be increased in view of ensuring insulation with the adjacent mounting terminals 43. For this reason, when various types of information on the electronic component 6 are rewritten, it is difficult to control the position of the probe that is brought into contact with each adjustment terminal 47 and applies a voltage to the adjustment terminal 47, and connection failure is likely to occur. On the other hand, in the temporary substrate 400 shown in FIG. 10, since each adjustment terminal 47 is provided in the extended portion 4a, the size of each adjustment terminal 47 can be made sufficiently large, and the mounting terminal 43 and the adjustment terminal The separation distance from 47 can be made sufficiently large. As a result, the position control of the probe as described above becomes easy, and the occurrence of connection failure can be reliably prevented.

Note that after the information is rewritten, the temporary substrate 400 is cut along the cutting line CL2 shown in FIG. Thereby, the temporary board | substrate 400 is isolate | separated into the insulating board | substrate 40 and the expansion part 4a, as shown in FIG.10 (b). As a result, the mounting substrate 4 shown in FIG. 1 can be obtained.
Further, the extended portion 4a may be folded back along the cutting line CL2 without being separated and inserted into the gap between the electronic component 6 and the package 3 or other gaps. As a result, the extended portion 4 a can be stored between the electronic component 6 and the package 3. As a result, the piezoelectric oscillator 1 incorporating the adjustment terminal 47 is obtained.

  In such a piezoelectric oscillator 1, various information in the electronic component 6 can be rewritten as needed by pulling the extended portion 4 a out of the gap as necessary. Thereby, even if the usage environment of the piezoelectric oscillator 1 changes significantly after the manufacture of the piezoelectric oscillator 1, the piezoelectric oscillator 1 capable of stable oscillation by rewriting various information corresponding to the usage environment in the electronic component 6. Is obtained.

<Second Embodiment>
Next, a second embodiment of the piezoelectric device of the present invention will be described.
FIG. 11 is a perspective view showing a mounting board of a piezoelectric oscillator to which the second embodiment of the piezoelectric device of the present invention is applied, and FIG. 12 shows a mounting board film for manufacturing the mounting board shown in FIG. (A) Top view and (b) Bottom view. In the following description, the upper side in FIG. 11 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.

Hereinafter, the piezoelectric device according to the second embodiment will be described. The description will focus on differences from the first embodiment, and description of similar matters will be omitted.
The present embodiment is the same as the first embodiment except that the formation portion of the bent portion 401 on the mounting substrate 4 ′ is different.
As shown in FIG. 11, four bent portions 401, 401, which are bent at both ends in the longitudinal direction of the mounting substrate 4 ′ shown in FIG. 401, 401 are formed. As a result, the mounting substrate 4 ′ can be reliably bonded to the package 3, and the four corners of the electronic component 6 can be reliably protected. As a result, the reliability of the piezoelectric oscillator 1 can be further improved.

In addition, one end of the wiring pattern 42 is connected to each of the two electrode terminal portions 41 among the plurality of electrode terminal portions 41 included in the mounting substrate 4 ′. The other end portions of these wiring patterns 42 are formed so as to extend toward the left end portion in the longitudinal direction of the mounting substrate 4 ′.
And the other edge part of each wiring pattern 42 is extended | stretched to the front-end | tip part 401b through the inclination part 401a of the two bending parts 401 and 401 provided in the left side edge part among each bending part 401. FIG. . In addition, the line width is wide at the other end of each wiring pattern 42. Thereby, each wiring pattern 42 has improved connectivity with the external terminal 35 of the package 3 described above.

  On the other hand, in each of the bent portions 401, the two bent portions 401 and 401 provided at the right end portion are provided with connection patterns 48 provided for connection to the external terminals 35 of the package 3, respectively. That is, on the mounting substrate 4 ′, the package 3 is mounted by bonding the two wiring patterns 42, 42 and the two connection patterns 48, 48 to the external terminals 35 of the package 3.

In addition, mounting terminals 43 are formed on the lower surface of each bent portion 401 of the mounting substrate 4 ′. Each mounting terminal 43 is electrically connected to each electrode terminal portion 41 via a conductor post 45 and a wiring pattern 46 provided in a via hole formed in the mounting substrate 4 ′.
The second embodiment as described above also has the same operations and effects as the first embodiment.

Further, although the first embodiment has two mounting terminals 43, the second embodiment has four mounting terminals 43, so that the piezoelectric oscillator 1 is more reliably attached to the circuit board. Can be implemented.
Further, in the first embodiment, the mounting substrate 4 is expanded in the width direction, and an adjustment terminal 47 for rewriting various information in the electronic component 6 is provided in the expanded portion (expanded portion 4a). As described above, in the present embodiment, the mounting substrate 4 ′ is extended in the longitudinal direction, and the adjustment terminal 47 is provided in the extended portion 4a. Note that FIG. 11 shows a state where the mounting substrate 4 ′ (insulating substrate 40) and the extended portion 4a are separated by the cutting line CL2.

Next, a mounting substrate film 100 ′ for manufacturing the mounting substrate 4 ′ will be described.
In the mounting substrate film 100 ′, regions corresponding to the mounting substrate 4 ′ (hereinafter referred to as “mounting substrate regions”) are connected in a row so that a plurality of piezoelectric oscillators 1 can be formed simultaneously. Although it is a belt-like film, it is substantially the same as the mounting substrate film 100 except that the connecting direction is different from the point where the extended portion 4a and the blank portion 4b are provided.

  That is, as shown in FIG. 12, the mounting substrate film 100 'is obtained by connecting end portions in the width direction of regions corresponding to the mounting substrate 4', the extended portion 4a, and the blank portion 4b. Then, by cutting the mounting substrate film 100 ′ along the cutting line CL shown in FIG. 12, a plurality of temporary substrates 400 ′ each including the mounting substrate 4 ′ and the extended portion 4a and blank portion 4b attached thereto are simultaneously provided. Can be formed. Further, by cutting the temporary substrate 400 ′ thus obtained along the cutting line CL <b> 2 shown in FIG. 12, a plurality of mounting substrates 4 ′ can be formed simultaneously.

  Further, as described above, in the mounting substrate film 100 ′, the arrangement direction of the region corresponding to the mounting substrate is different from that of the mounting substrate film 100. They are arranged on both sides in the width direction across the mounting area. For this reason, in the mounting substrate film 100 described above, the film is pulled in the longitudinal direction when the bent portion 401 is bent in one mounting substrate region, and a tensile force is transmitted to the adjacent mounting substrate region, Although there is a possibility that the position of the mounting substrate area with respect to the mounting apparatus is shifted, such a problem is solved in the mounting substrate film 100 ′. That is, in the mounting substrate film 100 ′, even if the bent portion 401 is bent in one mounting substrate region, the tensile force generated at that time is transmitted in the width direction of the mounting substrate film 100 ′, and the mounting substrate film 100 ′ It is not transmitted to the mounting substrate area adjacent to the longitudinal direction of the substrate film 100 ′. For this reason, according to the mounting substrate film 100 ′, it is possible to reliably prevent the above-described positional shift.

The mounting substrate film 100 ′ includes a blank portion 4b. However, the blank portion 4b may be omitted if necessary, and may be omitted.
The piezoelectric oscillator 1 as described above can be applied to various electronic devices, and the obtained electronic device has high reliability.
The electronic apparatus provided with the piezoelectric device of the present invention is not particularly limited. For example, a personal computer (mobile personal computer), a mobile phone, a digital still camera, an ink jet type ejection device (for example, an ink jet printer), and a laptop personal computer. , TV, video camera, video tape recorder, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, security TV monitor, electronic binoculars POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring equipment, instruments (eg, vehicle, aircraft, ship) Instrumentation), hula Simulator, and the like.

The piezoelectric device, the electronic apparatus, and the method for manufacturing the piezoelectric device of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to these.
For example, the number of the bent portions 401 is not limited to two or four, and may be three or more.
In addition, each folding portion 401 may be a “bending” that is not accompanied by a clear folding line, rather than a “folding” that involves folding lines 402a and 402b.
In addition, the piezoelectric device of the present invention includes a crystal oscillator (SPXO), a voltage controlled crystal oscillator (VCXO), a temperature compensated crystal oscillator (TCXO), a crystal oscillator with a thermostatic chamber (OCXO), a gyro sensor, an elasticity A surface wave (SAW) filter or the like may be used.

  DESCRIPTION OF SYMBOLS 1 ... Piezoelectric oscillator 2 ... Piezoelectric vibration piece 21 ... Piezoelectric substrate 3 ... Package 31 ... Base substrate 32 ... Lid member 34 ... Mount electrode 35 ... External terminal 39 ... Conductive adhesive 4, 4 '... Mounting board 4a ... Expansion part 4b ... Blank part 40 ... Insulating board 401 ... Bending part 401a ... Inclined part 401b ... Tip part 402a, 402b ... Bending line 403 ... Notch 404 ······················································· Electrode terminal section 42.... 6 ... Electronic parts 61 ... Pad part 7 ... Mold resin 8 ... Circuit board 81, 82 ... Circuit wiring 9 ... Clearance 91, 91a 91b, 91c ... Connection part 92 ... Fillet 93 ... Spacer 100, 100 '... Mounting substrate film 101 ... Through hole 102 ... Insulating film 400, 400' ... Temporary board 900 ... Piezoelectric oscillator 901 ... ... Mounting board 902 ... Electronic components 903 ... Package 904 ... Column member 905 ... Mounting terminal 909 ... Solder layer 910 ... Circuit board 911 ... Insulating board 912 ... Circuit wiring S1 ... Internal space BH ... Bonding head CL, CL2 ... Cutting line L1, L2 ... Length

Claims (9)

A mounting substrate, a package provided on one surface side of the mounting substrate and containing the piezoelectric vibrating piece, and provided between the mounting substrate and the package, for driving the piezoelectric vibrating piece Electronic components,
The mounting substrate has a bent part formed by bending a part of the edge part toward the package, and a part of the bent part is fixed to the package;
A piezoelectric device, wherein a mounting terminal is provided on a surface of the bent portion opposite to the package. The bent portion is an inclined portion that is inclined with respect to an electronic component mounting portion that is a portion on which the electronic component is mounted on the mounting substrate, and a distal end portion that is a portion extended from the inclined portion toward the edge side. And
The piezoelectric device according to claim 1, wherein the tip portion is fixed to the package.   The piezoelectric device according to claim 2, wherein the mounting terminal is provided on the inclined portion. The mounting substrate has a rectangular shape in plan view,
4. The piezoelectric device according to claim 1, wherein the bent portion is provided at an edge of a pair of sides facing the mounting substrate or at four corners of the mounting substrate. 5.   The piezoelectric device according to claim 1, wherein the mounting substrate is made of a flexible material. An electronic apparatus comprising the piezoelectric device according to any one of claims 1 to 5,
The piezoelectric device is placed on a substrate,
Having a gap between the bent portion of the piezoelectric device and the base material,
In the gap, an electronic device is characterized in that a connecting portion for connecting the mounting terminal and the wiring pattern on the substrate is formed.   The electronic device according to claim 6, wherein the connection portion is a conductive member filled in at least a part of the gap. A mounting substrate having mounting terminals; a package provided on one surface side of the mounting substrate and containing the piezoelectric vibrating piece; provided between the mounting substrate and the package; A method of manufacturing a piezoelectric device having an electronic component for driving,
A plurality of regions to be the mounting substrate are connected, a mounting substrate film having the mounting terminals is prepared in each region, and the electrons are respectively provided on the surface opposite to the surface having the mounting terminals in each region. An electronic component placement process for placing the component;
A package placement process for placing the packages so as to sandwich the electronic components with respect to the mounting substrate film; and
Of the region of the mounting substrate film, a portion including the mounting terminal is bent to the package side to form a bent portion, and a bending step of bonding the bent portion and the package;
A method for manufacturing a piezoelectric device, comprising: cutting a boundary between the regions of the mounting substrate film to manufacture a plurality of the piezoelectric devices. The mounting substrate film has a region to be the mounting substrate, and an extended portion that is connected to the region and includes an adjustment terminal to be electrically connected to the electronic component in the electronic component mounting step. Is,
The method for manufacturing a piezoelectric device according to claim 8, further comprising an adjusting step of rewriting information on the electronic component via the adjustment terminal before or after the bending step and then separating the region and the extended portion.

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