JP2005210673A - Surface-mounted crystal oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature compensated crystal oscillator which is easily handled and excellent in productivity. <P>SOLUTION: In a temperature compensated crystal oscillator constituted so that a rectangular container body internally housing a crystal vibration element is placed and fixed through a spacer member on a rectangular mounting substrate which has a plurality of external terminals on its lower surface and mounts on its upper surface an IC element for controlling an oscillation output on the basis of the vibration of the crystal vibration element, and the oscillation output is controlled on the basis of temperature compensation data stored in the IC element, a write control terminal which is comprised of a metal post, for writing temperature compensation data to the IC element is interposed between the container body and the mounting substrate, and a portion of the write control terminal is exposed between a side surface of the container body and a side surface of the mounting substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a temperature-compensated crystal oscillator used as a timing device for communication equipment and electronic equipment.

  Conventionally, crystal oscillators have been used as timing devices for portable communication devices and the like.

  As such a conventional crystal oscillator, for example, as shown in FIG. 4, a container body 23 in which a crystal resonator element 24 is accommodated is provided, a concave portion 25 is provided in the central region of the upper surface, and a plurality of external terminals 22 are provided on the lower surface. The IC element 26 that is attached to the mounting base 21 and that controls the oscillation output based on the vibration of the crystal resonator element 24 is disposed in a region surrounded by the lower surface of the container body 21 and the inner surface of the recess 25. The thing of the structure accommodated is known (for example, refer patent document 1).

  The container body 23 and the mounting base 21 are usually made of a ceramic material such as alumina ceramics, wiring conductors are formed on the inside and the surface thereof, and a conventionally known green sheet laminating method or the like is employed. It has been produced. A plurality of bonding electrodes are provided at corresponding positions on the lower surface of the container body 23 and the upper surface of the mounting substrate 21, and these bonding electrodes are bonded to each other via a conductive bonding material. As a result, the container body 23 was fixed to the upper surface of the mounting base 21.

In addition, a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on the temperature compensation data created according to the temperature characteristics of the crystal resonator element 24 is provided inside the IC element 26. In order to store such temperature compensation data in the memory in the IC element 26, a write control terminal 27 is provided on the outer surface of the mounting substrate 21, and after the crystal oscillator is assembled, the temperature is applied to the write control terminal 27. The temperature compensation data is stored in the memory in the IC element 26 by applying the probe needle of the compensation data writing device and inputting the temperature compensation data to the IC element 26.
JP-A-10-98151

  However, in the above-described conventional temperature-compensated crystal oscillator, the write control terminal 27 for writing temperature compensation data is provided on the outer surface of the mounting substrate 21, and the mounting substrate 21 is manufactured. Further, a film-like write control terminal 27 is formed by making a through hole in a ceramic mother substrate from which the mounting substrate 21 is cut, applying a conductive paste to the inner surface thereof, baking it, or applying metal plating. However, since such a complicated processing process becomes indispensable, the productivity of the temperature-compensated crystal oscillator is significantly reduced.

  Therefore, in order to eliminate the above-described drawbacks, it is conceivable to arrange the write control terminal 27 on the lower surface of the mounting substrate 21.

  However, when the write control terminal 27 is arranged on the lower surface of the mounting base 21, the wiring of the mother board (not shown) on which the temperature-compensated crystal oscillator is mounted and the above-described write control terminal 27 face each other. If this occurs, stray capacitance may be generated between the wiring of the motherboard and the write control terminal 27. In this case, the electrical characteristics of the communication device and electronic device in which the temperature compensated crystal oscillator is incorporated are greatly affected. In addition, there is a risk that when the temperature compensated crystal oscillator is mounted on the mother board by soldering or the like, a part of the melted solder may come into contact with the write control terminal 27 to cause a short circuit. There was an inconvenience in handling the crystal oscillator.

  The present invention has been devised in view of the above drawbacks, and an object thereof is to provide a temperature compensated crystal oscillator that is easy to handle and excellent in productivity.

  The temperature-compensated crystal oscillator of the present invention has a rectangular container body in which a crystal resonator element is accommodated, and a plurality of external terminals on the lower surface, and controls oscillation output based on the vibration of the crystal resonator element. A temperature at which an oscillation output is controlled based on temperature compensation data stored in the IC element, mounted and fixed on a rectangular mounting substrate having an IC element mounted on the upper surface via a spacer member. Compensation type crystal oscillator comprising a metal post between the container body and the mounting substrate, and a write control terminal for writing temperature compensation data to the IC element, and the write control A part of the terminal is exposed between the side surface of the container body and the side surface of the mounting substrate.

  In the temperature-compensated crystal oscillator according to the present invention, the spacer member is composed of four metal posts attached to the four corners of the upper surface of the mounting substrate.

  Furthermore, in the temperature compensated crystal oscillator of the present invention, 2N write control terminals (N is a natural number) are provided, and these 2N write control terminals are provided on two parallel sides of the mounting substrate. Each of the N pieces is arranged symmetrically with respect to the center line parallel to the two sides.

  Still further, in the temperature compensated crystal oscillator of the present invention, the IC element is sealed with a resin material, and the outer peripheral portion of the resin material is extended to the outer peripheral portion of the mounting base, and the extended portion is adjacent to the temperature-compensated crystal oscillator. The gap between the spacer members and between the spacer member and the write control terminal is filled.

  Furthermore, the temperature-compensated crystal oscillator of the present invention is constituted by a flip chip type IC in which the IC element has a rectangular shape, and the resin material for sealing the IC element is formed of a transparent material, The two end faces of the IC elements arranged substantially in parallel are exposed from between adjacent spacer members in a state of being covered with the resin material.

  Furthermore, in the temperature compensated crystal oscillator according to the present invention, the write control terminal is mechanically connected to the container body by bonding the upper end portion thereof to a bonding pad provided on the lower surface of the container body via a bonding material. It is characterized by being.

  The temperature compensated crystal oscillator according to the present invention has a write control terminal for writing temperature compensation data in an IC element formed by a metal post, and a part of the write control terminal is formed on a side surface of a container body and a mounting substrate. Thus, when assembling a temperature-compensated crystal oscillator, the write control terminal made of a metal post is simply attached to a predetermined position on the upper surface of the mounting substrate. Temperature-compensated crystal oscillators can be manufactured with no complicated processing processes, such as when film-like write control terminals are formed on the outer surface of the mounting substrate as in conventional temperature-compensated crystal oscillators. Therefore, the productivity of the temperature compensated crystal oscillator can be improved.

  In this case, when a floating capacitance is generated between the wiring of the motherboard on which the temperature-compensated crystal oscillator is mounted and the write control terminal, or when the temperature-compensated crystal oscillator is mounted on the motherboard by soldering or the like, melting occurs. There is also an advantage that the temperature compensated crystal oscillator can be easily handled without causing a part of the solder to contact the write control terminal and causing a short circuit.

  According to the temperature compensated crystal oscillator of the present invention, 2N write control terminals (N is a natural number) are provided, and these 2N write control terminals are provided along two parallel sides of the mounting substrate. By arranging N pieces symmetrically with respect to the center line parallel to the two sides, the probe needle of the temperature compensation data writing device is applied to the 2N write control terminals from the side, and the IC element is applied to the IC element. When writing temperature compensation data, the force from the probe needle is applied in a balanced manner from both sides of the container body, so that the container body can be held well during writing and is biased by contact with the probe needle. Breakage of the write control terminal due to stress can be effectively prevented.

  Furthermore, according to the temperature-compensated crystal oscillator of the present invention, the IC element on the mounting substrate is sealed with the resin material, and the outer peripheral portion of the resin material is extended to the outer peripheral portion of the mounting substrate. By filling the existing portions in the gaps between adjacent spacer members and between the spacer member and the write control terminal, the attachment strength of the IC element, the write control terminal, the spacer member, etc. to the mounting substrate can be increased. The resin material can be reinforced and the circuit forming surface of the IC element can be well protected by the resin material, and the mechanical strength and reliability of the temperature compensated crystal oscillator can be maintained high. .

  Furthermore, according to the temperature compensated crystal oscillator of the present invention, the IC element is covered with a transparent resin material, and the two end surfaces of the IC element are exposed from between adjacent spacer members in a state of being covered with the resin material. By doing so, it becomes possible to directly view the joint portion of the IC element with respect to the mounting substrate, and when inspecting the product, the joining state of the IC element can be easily confirmed by visual inspection, etc. Can be made.

  Furthermore, according to the temperature compensated crystal oscillator of the present invention, the upper end portion of the write control terminal is bonded to the bonding pad on the lower surface of the container body via the bonding material, so that the mounting substrate and the container body are bonded. The strength is improved, and the reliability of the temperature compensated crystal oscillator can be maintained high.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  1 is an exploded perspective view of a temperature compensated crystal oscillator according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the temperature compensated crystal oscillator of FIG. 1, and the temperature compensated crystal oscillator shown in these figures is A rectangular container body 1 in which a crystal resonator element 5 is housed, a plurality of external terminals 10 on a lower surface, and a spacer member 12 on a rectangular mounting substrate 6 on which an IC element 7 is provided on an upper surface. It has a structure that is placed and fixed via.

  The container body 1 is made of, for example, a substrate 2 made of a ceramic material such as glass-ceramic or alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, or phosphor bronze, and a metal similar to the seal ring 3. The container body 1 is formed by attaching the seal ring 3 to the upper surface of the substrate 2 and placing and fixing the lid body 4 on the upper surface of the substrate 2, and is positioned inside the seal ring 3. A crystal resonator element 5 is mounted on the upper surface of the substrate 2 to be operated.

  The container body 1 is for hermetically sealing the quartz resonator element 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the crystal resonator element 5 are provided on the upper surface of the substrate 2, and a plurality of bonding electrodes connected to a spacer member 12 described later are provided on the lower surface of the substrate 2. Each of these pads and the like are electrically connected to each other through wiring conductors on the surface of the substrate or via-hole conductors embedded in the substrate.

  When the substrate 2 of the container body 1 is made of a ceramic material such as glass-ceramic, for example, a wiring conductor is formed on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to the ceramic material powder. The conductor paste to be manufactured is applied by conventionally known screen printing or the like, and a plurality of the pastes are laminated and press-molded, followed by firing at a high temperature.

  The seal ring 3 and the lid body 4 of the container body 1 are manufactured by forming a metal such as 42 alloy into a predetermined shape by using a conventionally known metal processing method, and the obtained seal ring 3 is attached to the substrate 2. After brazing the conductor layer previously deposited on the upper surface, and subsequently mounting and fixing the crystal resonator element 5 on the upper surface of the substrate 2 using a conductive adhesive, the above-described lid body 4 is conventionally known. The container body 1 is assembled by joining to the upper surface of the seal ring 3 by resistance welding or the like. In this way, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

  On the other hand, the quartz crystal vibrating element 5 accommodated in the container body 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a variable voltage from the outside. Is applied to the quartz piece via a pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

  The crystal resonator element 5 is mounted on the upper surface of the substrate 2 by electrically connecting a pair of vibration electrodes to a corresponding mounting pad on the upper surface of the substrate via a conductive adhesive, whereby the crystal resonator element 5 and the container are mounted. Electrical and mechanical connections with the body 1 are made simultaneously.

  Here, when the lid 4 of the container body 1 is connected to the external terminal 10 for the ground terminal disposed on the lower surface of the mounting substrate via the wiring conductor of the container body 1 and the mounting substrate 6, Since the lid 4 is grounded to provide a shielding function, the crystal resonator element 5 and the IC element 7 to be described later can be protected better than unnecessary electrical action from the outside. Therefore, the lid body 4 of the container body 1 is preferably connected to the external terminal 10 for the ground terminal via the wiring body of the container body 1 and the mounting base 6.

  The mounting base 6 on which the container body 1 is placed and fixed has a substantially rectangular shape, and spacer members 12 are individually attached and erected at the four corners of the upper surface of the mounting base. The IC element 7 is mounted in the central area of the upper surface of the mounting substrate surrounded by the spacer members 12.

  The mounting base 6 is for supporting the container body 1 with an IC element 7 and a spacer member 12 on the upper surface thereof, and a resin material such as glass cloth base epoxy resin, polycarbonate, epoxy resin, polyimide resin or the like. Or a ceramic material such as glass-ceramic or alumina ceramic.

  Further, the spacer member 12 mounted and erected on the upper surface of the mounting base 6 is formed by a metal post formed of a metal material such as copper into a square column shape, and the lower end of the mounting base 6 It is electrically and mechanically connected to the wiring conductor, and is electrically and mechanically connected to the connection electrode on the lower surface of the container body via a conductive bonding material such as solder at the upper end.

  For example, nickel plating or gold plating is applied to the upper end surface of the spacer member 12 to a predetermined thickness in order to improve the bonding state of the conductive bonding material used for bonding to the container body 1. The

  Further, four external terminals 10 (a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal) are provided on the lower surface of the mounting substrate 6, and these external terminals 10 are temperature compensated crystal oscillators. Is mounted on an external electric circuit such as a mother board (not shown), it is electrically connected to the circuit wiring of the external electric circuit by soldering or the like.

  Here, if the ground terminal and the oscillation output terminal of the four external terminals 10 are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. Can do. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

  Furthermore, a plurality of electrode pads are deposited and formed on the upper surface of the mounting substrate 6 described above, and the above-described IC element 7 is mounted in the formation region of these electrode pads.

  As the IC element 7, for example, a rectangular flip chip IC having a plurality of connection pads corresponding to the electrode pads of the mounting base 6 on the lower surface is used, and the circuit formation surface ( The lower surface) has a temperature sensing element (thermistor) for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the crystal vibration element 5, and the crystal vibration element 5 based on the temperature compensation data. A temperature compensation circuit that corrects vibration characteristics according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is output to the outside. Then, for example, it is used as a reference signal such as a clock signal.

  Further, the IC element 7 is exposed from adjacent spacer members in a state where two end surfaces arranged substantially in parallel are covered with a resin material 13 described later, and the exposed side surface of the IC element 7 is a container. It is arranged along the outer peripheral portion of the mounting substrate 6 slightly inside the outer peripheral portion of the body 1 and the mounting substrate 6, for example, 1 μm to 500 μm inward from the outer periphery of the mounting substrate 6. In this case, since the width dimension of the mounting substrate 6 in the direction orthogonal to the exposed side surface of the IC element 7 is designed to be substantially equal to the length of one side of the IC element 7, the overall structure of the temperature compensated crystal oscillator is There is an advantage that it can be made compact.

  The IC element 7 is mounted by individually bonding the connection pads provided on the lower surface thereof to the corresponding electrode pads on the upper surface of the mounting substrate through a conductive bonding material such as solder or gold bump. The electronic circuit in the IC element 7 is electrically connected to the crystal resonator element 5 and the external terminal 10 through the wiring conductor of the container body 1 and the wiring conductor of the mounting base 6. Is done.

  When the mounting substrate 6 is made of a glass cloth base epoxy resin, the glass cloth base formed by weaving glass yarn is impregnated with a liquid precursor of the epoxy resin, and the precursor is polymerized at a high temperature. The spacer is formed by forming a base, and a metal foil such as a copper foil adhered to the surface of the base is applied to a predetermined pattern by using a conventionally known photo-etching or the like. It is formed. When the container body 1 is attached / fixed to the mounting substrate 6 via the spacer member 12, the upper surface of the spacer member 12 is bonded to the lower surface of the container body via a conductive bonding material such as solder. The container body 1 is mounted on the mounting substrate 6 by bringing the conductive bonding material into contact with the electrodes, and then electrically and mechanically connecting the conductive bonding material by applying heat.

  A plurality of write control terminals 11 for writing temperature compensation data to the IC element 7 are interposed between the container body 1 and the mounting substrate 6 described above.

  Similarly to the spacer member 12 described above, the write control terminal 11 is formed by a metal post formed of a metal material such as copper in a columnar shape, and a part of the side surface is formed between the container side surface and the mounting substrate side surface. It is attached to the upper surface of the mounting substrate 6 so as to be exposed from between.

  These write control terminals 11 are juxtaposed along the edge of the mounting base 6 and are electrically connected to the IC element 7 via the wiring conductors of the mounting base 6. In this embodiment, the number of write control terminals 11 is set to 2N (N is a natural number), for example, four, and these four write control terminals 11 are along two parallel sides of the mounting substrate 6. Two of them are arranged symmetrically with respect to a center line parallel to the two sides.

  Therefore, after assembling the temperature-compensated crystal oscillator, the probe needle 16 of the temperature-compensation data writing device is applied to these write control terminals 11 from the side, and temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 5 is obtained. The temperature compensation data is stored in the memory of the IC element 7 by writing.

  In this case, the four write control terminals 11 are arranged symmetrically with respect to the center line parallel to the two sides, two each along the two parallel sides of the mounting substrate 6. When the temperature compensation data is written to the IC element 7 by applying the probe needle 16 of the temperature compensation data writing device to the four write control terminals 11 from the side, the force from the probe needle 16 is applied to the mounting substrate 6 or the container. It will be applied with good balance from both sides of the body 1. For this reason, it is possible to satisfactorily hold the mounting substrate 6 and the container body 1 at the time of writing, and to effectively prevent breakage of the writing control terminal 11 due to the biased stress due to contact with the probe needle 16. it can.

  Here, if the upper end portion of the write control terminal 11 is bonded to a dummy bonding pad provided on the lower surface of the container body 1 via a bonding material, the bonding strength between the mounting base 6 and the container body 1 can be increased. As a result, the reliability of the temperature compensated crystal oscillator can be maintained high. Therefore, the write control terminal 11 can be mechanically connected to the container body 1 by bonding the upper end portion of the write control terminal 11 to a bonding pad provided on the lower surface of the container body 1 via a bonding material. preferable.

  Furthermore, the above-described IC element 7 is sealed with a resin material 13 made of, for example, an epoxy resin, and the outer peripheral portion of the resin material 13 extends to the outer peripheral portion of the mounting base 6 and is adjacent thereto. The gaps between the spacer members and between the spacer member 12 and the write control terminal 11 are filled, and a part of the gap is also attached to the exposed surface of the IC element 7 described above.

  Thus, by filling the resin material 13 into the gaps between the adjacent spacer members 12-12 and between the spacer member 12 and the write control terminal 11, the IC element 7, the write control terminal 11, and the spacer The attachment strength of the member 12 and the like to the mounting base 6 can be reinforced, and the circuit forming surface of the IC element 7 can be well protected by the resin material 13, and the mechanical strength of the temperature compensated crystal oscillator In addition, it is possible to maintain high reliability.

  In this case, if the resin material 13 is formed of a transparent material, even if the side surface of the IC element 7 exposed from the adjacent spacer members 12-12 is covered with the resin material 13, the mounting base 6 Therefore, it is possible to easily confirm the joining state of the IC element by visual inspection or the like when inspecting the product, and to improve the workability of the inspection.

  Thus, the above-described temperature compensated crystal oscillator is mounted on an external wiring board such as a mother board by soldering or the like, and the oscillation output is corrected by the temperature compensation circuit of the IC element 7, and according to the resonance frequency of the crystal resonator element 5. By outputting a predetermined oscillation signal, it functions as a temperature compensated crystal oscillator.

  According to the temperature compensated crystal oscillator of the present embodiment as described above, the write control terminal 11 for writing the temperature compensation data to the IC element 7 is formed by the metal post, and one of the write control terminals 11 is formed. Since the portion is exposed between the side surface of the container body and the side surface of the mounting substrate, when the temperature compensated crystal oscillator is assembled, the write control terminal 11 made of a metal post is placed at a predetermined position on the upper surface of the mounting substrate. A temperature-compensated crystal oscillator can be manufactured simply by wearing it, and complicated processing like when forming a film-like write control terminal on the outer surface of a mounting substrate in a conventional temperature-compensated crystal oscillator Since no process is required, the productivity of the temperature compensated crystal oscillator can be improved.

  In this case, when a floating capacitance is generated between the wiring of the motherboard on which the temperature compensated crystal oscillator is mounted and the write control terminal 11, or when the temperature compensated crystal oscillator is mounted on the motherboard by soldering or the like. Since a part of the melted solder does not come into contact with the write control terminal 11 to cause a short circuit, there is an advantage that the temperature compensated crystal oscillator can be handled easily.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, the spacer member 12 is formed of a metal post. Instead, the spacer member 12 is formed of the same material as that of the mounting base 6 and the mounting base 6 using the same insulating material. You may make it form integrally. In this case, a bonding pad for electrically and mechanically connecting the spacer member 12 via the bonding electrode on the lower surface of the container body and the conductive bonding material is provided on the upper end surface of the spacer member 12.

  In the above-described embodiment, a conductive bonding material is used to bond the container body 1 and the spacer member 12 on the mounting base 6. However, this conductive bonding material is a common material such as solder. For example, an anisotropic conductive adhesive or the like may be used as the conductive bonding material, and in this case, it is very easy to attach the container body 1 to the mounting substrate 6. Thus, there is also an advantage that the assembly process of the temperature compensated crystal oscillator is further simplified.

  Further, in the above-described embodiment, the example in which the four spacer members 12 are attached to the four corners of the upper surface of the mounting substrate has been described. However, the number of the spacer members 12 is not limited to four. When the spacer member 12 is formed of the same insulating material as the mounting base 6, the container body 1 is supported by one spacer member 12 formed in a U shape along the outer periphery of the mounting base 6. Alternatively, the container body 1 may be supported by two, three, or five or more spacer members 12.

  Furthermore, in the above-described embodiment, the plurality of write control terminals 11 are divided into two groups and arranged along two parallel sides of the mounting substrate 6. For example, the write control terminals 11 may be arranged in a line along one side of the mounting substrate 6 as shown in FIG.

  Furthermore, in the above-described embodiment, the number of write control terminals is 2N, specifically four. Instead, the number of write control terminals is two, six, or three. It may be an odd number such as 5 or 5.

  Furthermore, in the embodiment described above, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a metallized pattern for bonding is formed on the upper surface of the substrate 2. In addition, the lid 4 may be directly welded to the metallized pattern.

  Furthermore, in the above-described embodiment, the seal ring 3 is directly attached to the upper surface of the substrate of the container body 1, but instead of this, the upper surface of the substrate 2 is made of the same ceramic material as the substrate 2. The frame body may be attached integrally, and the seal ring 3 may be attached to the upper surface of the frame body.

  Furthermore, in the embodiment described above, it goes without saying that a chip-like capacitor for noise removal may be disposed on the upper surface of the mounting substrate 6 located between the adjacent spacer members 12-12.

1 is an exploded perspective view of a temperature compensated crystal oscillator according to an embodiment of the present invention. It is sectional drawing of the temperature compensation type | mold crystal oscillator of FIG. It is a disassembled perspective view of the temperature compensation type | mold crystal oscillator which concerns on other embodiment of this invention. It is a disassembled perspective view of the conventional temperature compensation type | mold crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Crystal oscillation element 6 ... Base | substrate for mounting 7 ... IC element 7a ... Connection pad 10 ... External terminal 11 ... Write control terminal 12 ... Spacer member 13 ... Resin material 16 ... Probe needle

Claims (6)

A rectangular container body in which a crystal resonator element is accommodated, a rectangular shape having a plurality of external terminals on the lower surface and an IC element on the upper surface for controlling the oscillation output based on the vibration of the crystal resonator element A temperature-compensated crystal oscillator that is mounted and fixed on a mounting substrate via a spacer member and controls oscillation output based on temperature compensation data stored in the IC element,
Between the container body and the mounting substrate, a write control terminal for writing temperature compensation data to the IC element is interposed, and a part of the write control terminal is disposed on the side surface of the container body. A temperature-compensated crystal oscillator characterized in that it is exposed between the side surface of the mounting substrate and the side surface of the mounting substrate. 2. The temperature compensated crystal oscillator according to claim 1, wherein the spacer member is composed of four metal posts attached to four corners of the upper surface of the mounting substrate. There are 2N write control terminals (N is a natural number), and N of these 2N write control terminals are parallel to the two sides along two parallel sides of the mounting substrate. 2. The temperature compensated crystal oscillator according to claim 1, wherein the temperature compensated crystal oscillator is arranged symmetrically with respect to a center line. The IC element is sealed with a resin material, and the outer peripheral portion of the resin material is extended to the outer peripheral portion of the mounting base. The extended portion is between adjacent spacer members and spacer member-writing control. 3. The temperature compensated crystal oscillator according to claim 2, wherein a gap between the terminals is filled. The IC element is formed of a flip-chip type IC having a rectangular shape, and the resin material for sealing the IC element is formed of a transparent material, and 2 of the IC elements arranged substantially in parallel. 5. The temperature-compensated crystal oscillator according to claim 4, wherein one end face is exposed from between adjacent spacer members while being covered with the resin material. The write control terminal is mechanically connected to the container body by bonding an upper end portion thereof to a bonding pad provided on a lower surface of the container body via a bonding material. The temperature compensated crystal oscillator according to claim 5.

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