JP2006101241A - Piezoelectric oscillator and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature compensation type liquid crystal oscillator which can be easily handled and is excellent in productivity. <P>SOLUTION: The piezoelectric oscillator is formed in such a way that a spatial portion is provided on the main front surface of an insulating base, an integrated circuit element having an incorporated oscillation circuit or a combination of the integrated circuit element and an electronic component is mounted in the spatial portion, and a container body for housing a piezoelectric vibration element is mounted on the top surface of the spatial portion of the insulating base. A step is provided on the rear main surface of the insulating base, and a characteristic control data writing terminal is formed on the step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

          The present invention relates to a piezoelectric oscillator used as a timing device for communication equipment, electronic equipment, and the like, and a method for manufacturing the same.

         Conventionally, crystal oscillators have been used as timing devices for portable communication devices and the like. As such a conventional crystal oscillator, for example, as shown in FIG. 4, a container body 23 in which a crystal resonator element 24 is accommodated is provided, a concave portion 25 is provided in the central area of the upper surface, and a plurality of external terminals 22 are provided on the lower surface. An integrated circuit element 26 that is attached to the mounting base 21 and that controls the oscillation output based on the vibration of the crystal resonator element 24 is provided in a region surrounded by the lower surface of the container body 21 and the inner surface of the recess 25. A housed structure is known.

         The container body 23 and the mounting base 21 are usually made of a ceramic material such as alumina ceramic, and a wiring conductor is formed inside and on the surface, and a conventionally known green sheet laminating method or the like is adopted. It is made by doing. A plurality of bonding electrodes are provided at corresponding positions on the lower surface of the container body 23 and the upper surface of the mounting substrate 21, and these bonding electrodes are bonded to each other via a conductive bonding material. As a result, the container body 23 was fixed to the upper surface of the mounting base 21.

         In addition, a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on the oscillation characteristic control data created according to the temperature characteristic of the crystal resonator element 24 is provided inside the integrated circuit element 26. In order to store such oscillation characteristic control data in the memory in the integrated circuit element 26, a characteristic control data write terminal 27 is provided on the outer surface of the mounting substrate 21, and after the crystal oscillator is assembled, this characteristic is obtained. The oscillation characteristic control data is stored in the memory in the integrated circuit element 26 by applying the probe needle of the oscillation characteristic control data writing device to the control data writing terminal 27 and inputting the oscillation characteristic control data to the integrated circuit element 26. It was.

JP-A-10-98151

         The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

         However, in the above-described conventional piezoelectric oscillator, the characteristic control data writing terminal 27 for writing the oscillation characteristic control data is provided on the outer surface of the mounting substrate 21. In order to manufacture the mounting substrate 21. A film-like characteristic control data writing terminal is formed by opening a through hole in a ceramic mother substrate from which the mounting substrate 21 is cut, applying a conductive paste to the inner surface of the ceramic base substrate, baking it, or applying a metal plating. 27 is required to be attached, and such a complicated machining process becomes indispensable, so that the productivity of the piezoelectric oscillator is remarkably lowered.

         Therefore, in order to solve the above-described problem, it is conceivable to arrange the characteristic control data writing terminal 27 on the lower surface of the mounting substrate 21.

         However, when the characteristic control data writing terminal 27 is arranged on the lower surface of the mounting substrate 21, the wiring of the motherboard on which the temperature-compensated crystal oscillator is mounted and the above-described characteristic control data writing terminal 27 face each other. If this occurs, stray capacitance may be generated between the wiring of the motherboard and the characteristic control data writing terminal 27. In this case, the electrical characteristics of the communication device or electronic device in which the temperature compensated crystal oscillator is incorporated are greatly increased. In addition, there is a risk that when the temperature-compensated crystal oscillator is mounted on the motherboard by soldering or the like, a part of the molten solder contacts the characteristic control data writing terminal 27 to cause a short circuit. There is a problem that the piezoelectric oscillator is not easy to handle.

         The present invention has been devised in view of the above-mentioned drawbacks. Therefore, an object of the present invention is to provide a piezoelectric oscillator that is easy to handle and excellent in productivity, and a method for manufacturing the same.

         In the piezoelectric oscillator of the present invention, a space is provided on the front main surface of the insulating substrate, and the integrated circuit element in which the oscillation circuit is incorporated or the integrated circuit element and the electronic component element are mounted in the space part. A piezoelectric oscillator comprising a container body in which a piezoelectric vibration element is accommodated on the upper surface of a space portion of an insulating substrate, wherein a step portion is provided on the back main surface of the insulating substrate, and the step Characteristic control data write terminals are formed at the locations.

Further, in the piezoelectric oscillator manufacturing method of the present invention, a space is provided on the front main surface of the rectangular oscillator substrate region, and a step portion is provided on the back main surface of the previous oscillator substrate region. In the stepped portion, a characteristic control data write terminal electrically connected to the integrated circuit element mounted in the space portion is provided, and a throw-away area provided with the characteristic control data write terminal is formed. Forming a mother substrate in which a plurality of the oscillator substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;


An integrated circuit element that controls oscillation output based on a container body in which the piezoelectric vibration element is accommodated in the oscillator substrate region, and oscillation characteristic control data that compensates for temperature characteristics of the piezoelectric vibration element, or an integrated circuit element and an electronic device Step B for attaching the component elements;

A step C of inputting oscillation characteristic control data to the integrated circuit element from the characteristic control data writing terminal provided at the step portion, and storing the oscillation characteristic control data in a memory in the previous integrated circuit element;

The mother board is cut along an outer periphery of each of the oscillator substrate regions, and each oscillator substrate region is electrically connected to the integrated circuit element mounted in the oscillator substrate region and the electronic component element. And a step D of obtaining a plurality of piezoelectric oscillators at the same time by separating from each of the discarded areas where the characteristic control data writing terminals are provided.

         Furthermore, the piezoelectric oscillator manufacturing method of the present invention is formed in the stepped portion and the disposal region by mounting an integrated circuit element in each oscillator substrate region that forms the mother substrate in the step B. The characteristic control data writing terminal and the oscillator substrate region are electrically connected to each other through a wiring conductor formed on the surface or / and inside of the previous mother substrate.

         Furthermore, in the method for manufacturing a piezoelectric oscillator according to the present invention, in the step A, a characteristic control data write terminal is provided in an inner layer of the discard area of the mother substrate, and the surface of the discard area has a tip on the surface. A through-hole reaching the surface of the characteristic control data writing terminal is formed.

         According to the piezoelectric oscillator of the present invention, the stepped portion is provided on the back main surface of the insulating base, and the characteristic control data writing terminal is formed at the previous stepped portion. When mounting on a circuit, there is no inconvenience that a part of the conductive bonding material used to bond the two adheres to the characteristic control data writing terminal and causes a short circuit. It can be remarkably simplified.

         According to the method for manufacturing a piezoelectric oscillator of the present invention, the characteristic control data write terminal used for writing the oscillation characteristic control data to the integrated circuit element is also provided in the area where the mother board is discarded. Since the control data has been written and then separated, the oscillator substrate area requires a minimum space for placing the characteristic control data write terminals, and the overall structure of the piezoelectric oscillator is significantly reduced in size. I can do it.

         In addition, in this case, the manufacturing process of the piezoelectric oscillator can be further simplified, and no equipment such as a socket for writing the oscillation characteristic control data to each piezoelectric oscillator is required, thereby improving the productivity of the piezoelectric oscillator. Can be kept extremely high.

Furthermore, according to the method for manufacturing a piezoelectric oscillator of the present invention, the previous mother board is divided after the integrated circuit element is mounted. When the integrated circuit element is mounted, the mother board itself is the integrated circuit element. Since it functions as a carrier for mounting, it is possible to eliminate the need for a carrier for mounting integrated circuit elements, and to eliminate the need for complicated operations such as mounting individual substrates obtained by dividing the mother substrate on the carrier. . Also by this, the productivity of the piezoelectric oscillator can be remarkably improved.

         Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the oscillation characteristic control data is input again to the integrated circuit element through the first characteristic control data write terminal formed in the previous substrate region, By including the step of storing the oscillation characteristic control data in the memory in the integrated circuit element, it is possible to readjust the oscillation characteristic control data that has been input incorrectly on the mother board even if it becomes a divided individual state. Therefore, the production yield of piezoelectric oscillators can be remarkably improved.

         Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the characteristic control data write terminal is provided in the inner layer of the discard area of the mother substrate, and the surface of the discard area has the above-mentioned Through the formation of through-holes that reach the surface of the characteristic control data writing terminal, these through-holes serve as guidelines when applying the probe, thus eliminating poor probe contact and significantly improving productivity. Has the effect of enabling

         Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.

         FIG. 1 is a schematic exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention, and FIG. 2 is a schematic external perspective view showing a manufacturing method of the piezoelectric oscillator of FIG. 1, which is shown in these drawings. The piezoelectric oscillator has a structure having a container body in which a quartz crystal vibration element 5 as a piezoelectric vibration element is accommodated, and a concave space in which an integrated circuit element 7 is accommodated on the front main surface of an insulating substrate. .

         The container 1 includes a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze, and a lid made of the same metal as the seal ring 3. 4, the seal ring 3 is attached to the upper surface of the substrate 2, and the lid body 4 is placed and fixed on the upper surface of the substrate 2. Thus, the container body 1 is configured and located inside the seal ring 3. A crystal resonator element 5 is mounted on the upper surface of the substrate 2.

         The container body 1 accommodates a quartz crystal resonator element 5 in an inner space, specifically, a space surrounded by the front main surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. The upper surface of the substrate 2 is provided with a pair of mounting pads connected to the vibration electrode of the crystal resonator element 5, and these pads are embedded in the wiring conductor on the substrate surface or in the substrate. Corresponding parts are electrically connected to each other through via hole conductors and the like.

         When the substrate 2 of the container 1 is made of a ceramic material such as glass-ceramic, for example, wiring is made on the surface of a ceramic green sheet obtained by adding an appropriate organic solvent to the ceramic material powder and mixing it. A conductor paste to be a conductor is applied by well-known screen printing or the like, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

         Further, the seal ring 3 and the lid 4 of the container body 1 employ a conventionally well-known metal processing method, and are produced by molding a metal such as 42 alloy into a predetermined shape, and the seal ring 3 obtained. Is brazed to a conductor layer previously deposited on the upper surface of the substrate 2, and then the quartz resonator element 5 is mounted and fixed on the upper surface of the substrate 2 using a conductive adhesive, and then the lid described above is mounted. The container body 1 is assembled by joining the body 4 to the upper surface of the seal ring 3 by a conventionally known resistance welding or the like. In this way, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

         On the other hand, the crystal resonator element 5 accommodated in the container body 1 is formed by attaching a pair of vibration electrodes to both main surfaces of a crystal piece cut along a predetermined crystal axis. When the fluctuating voltage is applied to the crystal piece via the pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

         The crystal resonator element 5 is mounted on the upper surface of the substrate 2 by electrically connecting a pair of vibration electrodes to a corresponding mounting pad on the upper surface of the substrate via a conductive adhesive. The electrical connection with the container body 1 and the mechanical connection are made simultaneously.

         Here, if the lid 4 of the container body 1 is connected to the container body 1 or the external terminal 9 for the ground terminal arranged on the lower surface of the insulating base body via the wiring conductor of the insulating base body 1, Since the shielding function is imparted by grounding the lid body 4, the crystal vibrating element 5 and the integrated circuit element 7 to be described later can be better protected from unnecessary external electrical action. It also plays. Therefore, the lid 4 is preferably connected to the external terminal 9 for the ground terminal via the wiring conductor of the insulating base 1.

         The insulative base 6 is formed to have a concave cross section by a resin material such as glass cloth base epoxy resin, polycarbonate, epoxy resin or polyimide resin, or ceramic material such as glass-ceramic or alumina ceramic. Includes a plurality of bonding electrodes electrically connected to corresponding first bonding electrodes on the lower surface of the container body, and four external terminals 9 (power supply voltage terminals, ground terminals) on the back main surface of the insulating base. , Oscillation output terminal and oscillation control terminal), and these external terminals 9 are connected to circuit wiring of the external electric circuit by soldering or the like when the piezoelectric oscillator is mounted on an external electric circuit such as a mother board. It will be electrically connected.

         Further, a step portion 8 is formed on the back main surface of the insulating substrate, and a characteristic control data writing terminal 10 is provided at the step portion 8.

          Here, of the four external terminals 9, if the ground terminal and the oscillation output terminal are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. I can do it. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

          Further, the insulating base described above is formed by depositing a plurality of electrode pads in the central region in the space portion surrounded by the front main surface of the substrate 2 and the inner surface of the wall portion. The integrated circuit element 7 described above is mounted.

         As the integrated circuit element 7, for example, a rectangular flip-chip IC having a plurality of connection pads corresponding to the electrode pads of the insulating base 1 on the lower surface is used, and the circuit on the lower surface is used. On the forming surface, a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing oscillation characteristic control data for compensating temperature characteristics of the crystal vibration element 5, and the crystal vibration element 5 based on the oscillation characteristic control data. Is provided with a temperature compensation circuit that corrects the vibration characteristics according to a temperature change, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the oscillation output generated by this oscillation circuit is After being output to the outside, it can be used as a reference signal such as a clock signal.

         In the integrated circuit element 7 described above, the connection pads provided on the lower surface thereof are individually bonded to the corresponding electrode pads on the upper surface of the insulating substrate through conductive bonding materials such as solder and gold bumps. The element 7 is attached to the mounting base 6, whereby the electronic circuit in the integrated circuit element 7 is electrically connected to the crystal vibrating element 5, the external terminal 9, etc. via the wiring conductor of the insulating base.

         A plurality of characteristic control data write terminals 10 for writing oscillation characteristic control data to the integrated circuit element 7 are interposed at the step portions formed on the back main surface of the substrate 2 of the insulating base 1 described above. Has been.

         These characteristic control data write terminals 10 are juxtaposed at the stepped portions formed on the back main surface of the insulating substrate, and are electrically connected to the integrated circuit element 7 via the wiring conductors of the insulating substrate 1 and the like. It is connected. Therefore, after assembling the piezoelectric oscillator, the oscillation characteristic control data corresponding to the temperature characteristic of the crystal resonator element 5 is written by applying the probe needle of the oscillation characteristic control data writing device to the characteristic control data writing terminal 10 from below. As a result, the oscillation characteristic control data is stored in the memory of the integrated circuit element 7.

         Thus, the piezoelectric oscillator described above is mounted on an external wiring board such as a mother board by soldering or the like, and a predetermined frequency corresponding to the resonance frequency of the crystal resonator element 5 is corrected while correcting the oscillation output by the temperature compensation circuit of the integrated circuit element 7. It functions as a temperature compensated crystal oscillator by outputting an oscillation signal.

         In this case, when the piezoelectric oscillator is mounted on the mother board by soldering or the like, the characteristic control data writing terminal 10 is formed at the stepped portion 8, so that a part of the melted solder is recorded in the characteristic control data writing. There is no short circuit due to contact with the lead-in terminal 10, and as a result, there is an effect that the handling of the piezoelectric oscillator is remarkably simplified.

         Next, a method for manufacturing the above-described piezoelectric oscillator will be described with reference to FIGS.

         (Step A) First, as shown in FIG. 2 (a), a characteristic is that a concave space is formed on the front main surface of the insulating base and a step portion 8 on the back main surface of the previous insulating base. Prepared is a mother board 13 in which an oscillator substrate area having a control data write terminal 10 and a discard area having a plurality of second characteristic control data write terminals are adjacent to each other and arranged in a matrix. To do.

         Such a base substrate 13 is formed of a glass cloth base material epoxy resin, polycarbonate, epoxy resin, polyimide resin or other resin material, glass-ceramic, alumina ceramics or other ceramic material, for example, a glass cloth base material. In the case of forming with epoxy resin, a glass cloth substrate formed by weaving glass yarn is impregnated with a liquid precursor of epoxy resin, and this precursor is polymerized at a high temperature to form a base, and copper foil is formed on the surface thereof. A predetermined wiring pattern including the characteristic control data writing terminal 10, the bonding electrode, the external terminal, and the like is obtained by pasting a metal foil such as the above and processing it into a predetermined pattern using a conventionally known photo-etching or the like. It is formed.

         (Step B) Next, as shown in FIG. 2 (b), the container body 1 in which the crystal resonator element 5 is accommodated in the oscillator substrate region of the mother substrate, and the oscillation for compensating the temperature characteristics of the crystal resonator element 5. The integrated circuit element 7 for controlling the oscillation output based on the characteristic control data or the integrated circuit element 7 and the electronic component element are attached.

As described above, the container body 1 includes the substrate 2, the seal ring 3, and the lid body 4, and the crystal resonator element 5 is accommodated therein.
For example, the crystal resonator element 5 is mounted on the upper surface of the obtained substrate 2. At this time, the vibration electrode of the crystal resonator element 5 and the mounting pad on the upper surface of the substrate are electrically and mechanically connected via the conductive bonding material. Then, the seal ring 3 is placed and fixed on the upper surface of the substrate 2 so as to surround the crystal resonator element 5, and the lid body 4 is joined to the upper surface of the seal ring 3 by conventionally known resistance welding or the like. Thus, the container body 1 is assembled.

         The seal ring 3 and the lid 4 are manufactured by adopting a conventionally known metal processing method and molding a metal such as 42 alloy into a predetermined shape, and the seal ring 3 is formed on the upper surface of the substrate 2 in advance. It is fixed to the substrate 2 by brazing to the conductor layer that has been deposited. Further, as described above, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

         As the integrated circuit element 7, for example, a rectangular flip-chip IC having a plurality of connection pads corresponding to electrode pads formed on the lower surface in the second space of the insulating base and one-to-one. The circuit forming surface on the lower surface thereof is a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing oscillation characteristic control data for compensating the temperature characteristic of the crystal vibration element 5, and an oscillation characteristic A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to temperature changes based on the control data, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the circuit is used as a reference signal such as a clock signal after being output to the outside.

         The integrated circuit element 7 is formed by individually bonding the connection pads provided on the lower surface thereof to the corresponding electrode pads on the upper surface of the insulating substrate through a conductive bonding material such as solder or gold bump. Is attached to the insulating base 6, whereby the electronic circuit in the integrated circuit element 7 is electrically connected to the crystal vibrating element 5, the external terminal 9, etc. via the wiring conductor of the insulating base 1.

         In the step B, the integrated circuit element is mounted on each oscillator substrate region A forming the mother substrate, so that the characteristic control data document formed in the stepped portion 8 and the discarding region is formed. The lead-in terminal 10 is electrically connected to the oscillator substrate region and a wiring conductor formed on the surface or / and inside of the mother substrate 13.

         (Step C) Next, as shown in FIG. 2 (c), integrated circuits in each oscillator substrate region A via a plurality of characteristic control data write terminals 10 provided in the area B to be discarded of the mother substrate 13. Oscillation characteristic control data is input to the element 7, and the oscillation characteristic control data is stored in a memory in the integrated circuit element 7.

         The writing operation of the oscillation characteristic control data is performed by applying the probe needle of the oscillation characteristic control data writing device to the characteristic control data writing terminal 10 and generating the oscillation characteristic according to the temperature characteristic of the crystal resonator element 5. This is done by inputting the control data to a memory provided in the temperature compensation circuit of the integrated circuit element 7 and storing it. Here, the oscillation characteristic control data written in the integrated circuit element 7 is for correcting the temperature characteristic variation for each crystal vibration element, and the temperature characteristic of the crystal vibration element 5 used in the piezoelectric oscillator is previously determined. It is obtained by measuring in advance.

         (Step D) Next, as shown in FIG. 2 (d), the mother substrate 13 is cut along the outer periphery of each oscillator substrate region, so that each oscillator substrate region A is discarded and separated from the region. The previous mother substrate 13 is cut by conventionally known dicing or the like, and the mother substrate 13 is divided into individual oscillator substrate regions through such a cutting process. As a result, a plurality of piezoelectric oscillators obtained by attaching the insulating base corresponding to the oscillator substrate region A and the integrated circuit element 7 to the lower surface of the container body 1 can be obtained simultaneously.

         Finally, the oscillation characteristic control data is input again to the integrated circuit element via the characteristic control data writing terminal 10 formed on the insulating substrate 6, and the oscillation characteristic control data is stored in the memory in the integrated circuit element. This makes it possible to readjust the oscillation characteristic control data on the mother board 13 that has been input incorrectly, even if it becomes an individual state after division, so that the yield can be remarkably improved. There is an effect.

         Finally, in the process A, the characteristic control data write terminal 10 is provided in the inner layer of the discard area of the mother substrate, and reaches the surface of the characteristic control data write terminal on the surface of the previous discard area. Since the through-hole 11 is formed, the contact failure of the probe can be improved because the through-hole 11 serves as a guideline when the probe is applied, so that the productivity can be remarkably improved.

         Note that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications and improvements can be made without departing from the scope of the present invention. In the above-described embodiment, a conductive bonding material is used to bond the container body 1 and the insulating base 6, but this conductive bonding material is limited to general conductive materials such as solder. For example, an anisotropic conductive adhesive or the like may be used as the conductive bonding material. In this case, the operation of attaching the container body 1 to the insulating substrate 6 becomes extremely simple, and the piezoelectric oscillator There is also an advantage that the assembly process is further simplified.

         Further, in the embodiment described above, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a metallized pattern for bonding is formed on the upper surface of the substrate 2. It may be formed and the lid 4 may be directly welded to the metallized pattern, and it goes without saying that this case is also included in the technical scope of the present invention.

         Further, in the embodiment described above, for example, the lid 4 is mounted on the container body 1 using the seal ring 3, but instead of this, a bonding conductor such as Au—Sn on the upper surface of the container body. On the other hand, the lid body 4 may be directly attached to the container body 1 by joining, and it goes without saying that this case is also included in the technical scope of the present invention.

         Further, in the above-described embodiment, the seal ring 3 is directly attached to the upper surface of the substrate of the container body 1. Instead, the upper surface of the substrate 2 is made of the same ceramic material as the substrate 2. You may make it attach the seal ring 3 to the upper surface of a previous frame body, after attaching a frame body integrally.

         Further, in the above-described embodiment, a noise-removing chip capacitor or the like may be disposed on the upper surface of the insulating substrate 1 located between the walls, and this case is also included in the technical scope of the present invention. Needless to say.

1 is a schematic exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention. (A) thru | or (d) are the external appearance perspective views of the outline piezoelectric oscillator for demonstrating the manufacturing method of the piezoelectric oscillator of this invention. FIG. (A) is a schematic perspective view of a mother board used in the manufacturing method of the present invention as viewed from one main surface side on which a piezoelectric vibrator is mounted, and (b) is a diagram of the mother board of (a). It is the schematic perspective view which looked only at the part of the layer surface. FIG. 1A is a schematic perspective view of a mother substrate used in the method for manufacturing a piezoelectric oscillator according to the present invention as viewed from one main surface side on which a piezoelectric vibrator is mounted, and FIG. It is the schematic perspective view which looked only at the part of the inner layer surface of the board | substrate. It is a schematic exploded perspective view of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz vibration element 6 ... Insulating base | substrate 7 ... Integrated circuit element 8 ... Step location 9 ... External terminal 10 .... Characteristic control data writing terminal 11 .... Through hole 12 .... Resin material 13 .... Base board

Claims (4)

A space portion is provided on the front main surface of the insulating substrate, and an integrated circuit element in which an oscillation circuit is incorporated, or the integrated circuit element and an electronic component element are mounted in the space portion. A piezoelectric oscillator comprising a container body in which a piezoelectric vibration element is accommodated on the upper surface of a space,
A piezoelectric oscillator characterized in that a step portion is provided on the back main surface of the insulating substrate, and a characteristic control data writing terminal is formed at the step portion. A space portion is provided on the front main surface of the rectangular oscillator substrate region, a step portion is provided on the back main surface of the oscillator substrate region, and an integrated circuit mounted in the space portion is provided on the step portion. A characteristic control data write terminal electrically connected to the element is provided, a throw-away area provided with the characteristic control data write terminal is formed, and a plurality of oscillator substrate areas in which the discard area is formed on the outer periphery are matrixed Forming a mother substrate that is arranged in a single piece and configured integrally;

An integrated circuit element that controls oscillation output based on a container body in which the piezoelectric vibration element is housed in the oscillator substrate region and oscillation characteristic control data that compensates for temperature characteristics of the piezoelectric vibration element, or the integrated circuit element, and an electronic component Step B for attaching the element;

A step C of inputting oscillation characteristic control data to the integrated circuit element from a characteristic control data writing terminal provided at the step portion, and storing the oscillation characteristic control data in a memory in the integrated circuit element;
The mother board is cut along the outer periphery of each oscillator substrate region, and each oscillator substrate region is mounted in the oscillator substrate region. The integrated circuit element is electrically connected to the electronic component element. A method of manufacturing a piezoelectric oscillator comprising: a step D of separating a plurality of piezoelectric oscillators simultaneously by separating from each forsake area provided with a control data writing terminal.           In the step B, by mounting the integrated circuit element in each oscillator substrate region forming the mother substrate, the characteristic control data writing terminal and the oscillator substrate formed in the stepped portion and the abandoned region 3. The method for manufacturing a piezoelectric oscillator according to claim 2, wherein the piezoelectric oscillator is electrically connected to each other through a region and a wiring conductor formed on a surface and / or inside the mother substrate.           In the step A, the characteristic control data write terminal is provided in an inner layer of the discard area of the mother substrate, and a through-hole reaching the surface of the characteristic control data write terminal is formed on the surface of the discard area. 3. The method for manufacturing a piezoelectric oscillator according to claim 2, wherein the piezoelectric oscillator is formed.

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