JP2006101241A - Piezoelectric oscillator and manufacturing method thereof - Google Patents

Piezoelectric oscillator and manufacturing method thereof Download PDF

Info

Publication number
JP2006101241A
JP2006101241A JP2004285517A JP2004285517A JP2006101241A JP 2006101241 A JP2006101241 A JP 2006101241A JP 2004285517 A JP2004285517 A JP 2004285517A JP 2004285517 A JP2004285517 A JP 2004285517A JP 2006101241 A JP2006101241 A JP 2006101241A
Authority
JP
Japan
Prior art keywords
control data
oscillator
substrate
characteristic control
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004285517A
Other languages
Japanese (ja)
Inventor
Toshio Nakazawa
利夫 中澤
Original Assignee
Kyocera Kinseki Corp
京セラキンセキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Kinseki Corp, 京セラキンセキ株式会社 filed Critical Kyocera Kinseki Corp
Priority to JP2004285517A priority Critical patent/JP2006101241A/en
Publication of JP2006101241A publication Critical patent/JP2006101241A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature compensation type liquid crystal oscillator which can be easily handled and is excellent in productivity. <P>SOLUTION: The piezoelectric oscillator is formed in such a way that a spatial portion is provided on the main front surface of an insulating base, an integrated circuit element having an incorporated oscillation circuit or a combination of the integrated circuit element and an electronic component is mounted in the spatial portion, and a container body for housing a piezoelectric vibration element is mounted on the top surface of the spatial portion of the insulating base. A step is provided on the rear main surface of the insulating base, and a characteristic control data writing terminal is formed on the step. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、通信機器や電子機器等のタイミングデバイスとして用いられる圧電発振器とその製造方法に関するものである。           The present invention relates to a piezoelectric oscillator used as a timing device for communication equipment, electronic equipment, and the like, and a method for manufacturing the same.

従来より、携帯用通信機器等のタイミングデバイスとして水晶発振器が用いられている。かかる従来の水晶発振器としては、例えば図4に示す如く、内部に水晶振動素子24が収容されている容器体23を、上面の中央域に凹部25を下面に複数個の外部端子22を有した実装用基体21上に取着させるとともに、前記容器体21の下面と前記凹部25の内面とで囲まれる領域内に、水晶振動素子24の振動に基づいて発振出力を制御する集積回路素子26を収容させた構造のものが知られている。          Conventionally, crystal oscillators have been used as timing devices for portable communication devices and the like. As such a conventional crystal oscillator, for example, as shown in FIG. 4, a container body 23 in which a crystal resonator element 24 is accommodated is provided, a concave portion 25 is provided in the central area of the upper surface, and a plurality of external terminals 22 are provided on the lower surface. An integrated circuit element 26 that is attached to the mounting base 21 and that controls the oscillation output based on the vibration of the crystal resonator element 24 is provided in a region surrounded by the lower surface of the container body 21 and the inner surface of the recess 25. A housed structure is known.

なお、前記容器体23、及び前記実装用基体21は、通常、アルミナセラミックス等のセラミック材料から成り、その内部、及び表面には配線導体が形成され、従来から周知のグリーンシート積層法等を採用することによって製作されている。そして、このような容器体23の下面や実装用基体21の上面には、それぞれ対応する箇所に接合電極が複数個ずつ設けられており、これらの接合電極同士を導電性接合材を介して接合することにより容器体23が実装用基体21の上面に固定されていた。          The container body 23 and the mounting base 21 are usually made of a ceramic material such as alumina ceramic, and a wiring conductor is formed inside and on the surface, and a conventionally known green sheet laminating method or the like is adopted. It is made by doing. A plurality of bonding electrodes are provided at corresponding positions on the lower surface of the container body 23 and the upper surface of the mounting substrate 21, and these bonding electrodes are bonded to each other via a conductive bonding material. As a result, the container body 23 was fixed to the upper surface of the mounting base 21.

また、前記集積回路素子26の内部には、水晶振動素子24の温度特性に応じて作成された発振特性制御データに基づいて水晶発振器の発振出力を補正するための温度補償回路が設けられており、このような発振特性制御データを集積回路素子26内のメモリに格納するために実装用基体21の外側面には特性制御データ書込端子27が設けられ、水晶発振器を組み立てた後、この特性制御データ書込端子27に発振特性制御データ書込装置のプローブ針を当てて発振特性制御データを集積回路素子26へ入力することによって発振特性制御データを集積回路素子26内のメモリに格納していた。          In addition, a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on the oscillation characteristic control data created according to the temperature characteristic of the crystal resonator element 24 is provided inside the integrated circuit element 26. In order to store such oscillation characteristic control data in the memory in the integrated circuit element 26, a characteristic control data write terminal 27 is provided on the outer surface of the mounting substrate 21, and after the crystal oscillator is assembled, this characteristic is obtained. The oscillation characteristic control data is stored in the memory in the integrated circuit element 26 by applying the probe needle of the oscillation characteristic control data writing device to the control data writing terminal 27 and inputting the oscillation characteristic control data to the integrated circuit element 26. It was.

特開平10―98151号公報JP-A-10-98151

なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。          The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

しかしながら、上述した従来の圧電発振器においては、実装用基体21の外側面に発振特性制御データを書き込むための特性制御データ書込端子27が設けられており、かかる実装用基体21を製作するために、実装用基体21が切り出されるセラミック製の母基板に貫通穴を開けて、その内面に導体ペーストを塗布して焼き付けたり、更には金属メッキを施す等して膜状の特性制御データ書込端子27を被着させておく必要があり、このような複雑な加工プロセスが不可欠と成ることによって圧電発振器の生産性を著しく低下させるといった問題があった。          However, in the above-described conventional piezoelectric oscillator, the characteristic control data writing terminal 27 for writing the oscillation characteristic control data is provided on the outer surface of the mounting substrate 21. In order to manufacture the mounting substrate 21. A film-like characteristic control data writing terminal is formed by opening a through hole in a ceramic mother substrate from which the mounting substrate 21 is cut, applying a conductive paste to the inner surface of the ceramic base substrate, baking it, or applying a metal plating. 27 is required to be attached, and such a complicated machining process becomes indispensable, so that the productivity of the piezoelectric oscillator is remarkably lowered.

そこで上述の問題を解消するために、特性制御データ書込端子27を実装用基体21の下面に配置させることが考えられる。          Therefore, in order to solve the above-described problem, it is conceivable to arrange the characteristic control data writing terminal 27 on the lower surface of the mounting substrate 21.

しかしながら、特性制御データ書込端子27を実装用基体21の下面に配置させた場合には温度補償型水晶発振器が実装されるマザーボードの配線と、上述の特性制御データ書込端子27とが対向していると、マザーボードの配線と特性制御データ書込端子27との間で浮遊容量を発生することがあり、その場合、温度補償型水晶発振器が組み込まれる通信機器や電子機器の電気的特性に多大な影響を与える恐れがある上に、温度補償型水晶発振器を半田付け等によってマザーボード上に搭載した際、溶融した半田の一部が特性制御データ書込端子27に接触して短絡を起こすといった危険性があり、圧電発振器の取り扱いの簡便性を欠くといった問題があった。          However, when the characteristic control data writing terminal 27 is arranged on the lower surface of the mounting substrate 21, the wiring of the motherboard on which the temperature-compensated crystal oscillator is mounted and the above-described characteristic control data writing terminal 27 face each other. If this occurs, stray capacitance may be generated between the wiring of the motherboard and the characteristic control data writing terminal 27. In this case, the electrical characteristics of the communication device or electronic device in which the temperature compensated crystal oscillator is incorporated are greatly increased. In addition, there is a risk that when the temperature-compensated crystal oscillator is mounted on the motherboard by soldering or the like, a part of the molten solder contacts the characteristic control data writing terminal 27 to cause a short circuit. There is a problem that the piezoelectric oscillator is not easy to handle.

本発明は上記欠点に鑑み案出されたもので、従ってその目的は、取り扱いが簡便で生産性に優れた圧電発振器、及びその製造方法を提供することにある。          The present invention has been devised in view of the above-mentioned drawbacks. Therefore, an object of the present invention is to provide a piezoelectric oscillator that is easy to handle and excellent in productivity, and a method for manufacturing the same.

本発明の圧電発振器は絶縁性基体の表主面に空間部が設けられており、先の空間部には発振回路を組み込んだ集積回路素子、或いは該集積回路素子、及び電子部品素子を搭載させ、絶縁性基体の空間部上面に圧電振動素子が収容されている容器体を載置させて成る圧電発振器であって、前記の絶縁性基体の裏主面には段差箇所が設けられ、前記段差箇所には特性制御データ書込端子が形成されていることを特徴とするものである。          In the piezoelectric oscillator of the present invention, a space is provided on the front main surface of the insulating substrate, and the integrated circuit element in which the oscillation circuit is incorporated or the integrated circuit element and the electronic component element are mounted in the space part. A piezoelectric oscillator comprising a container body in which a piezoelectric vibration element is accommodated on the upper surface of a space portion of an insulating substrate, wherein a step portion is provided on the back main surface of the insulating substrate, and the step Characteristic control data write terminals are formed at the locations.

また、本発明の圧電発振器の製造方法は、矩形状の発振器基板領域の表主面に、空間部が設けられており、先の発振器基板領域の裏主面には段差箇所が設けられ、この段差箇所には、前記の空間部に搭載する集積回路素子に電気的接続した特性制御データ書込端子を設け、前記の特性制御データ書込端子を設けた捨てしろ領域を形成し、捨てしろ領域を外周に形成した該発振器基板領域が複数個マトリックスに配列されて一体に構成されている母基板を形成する工程Aと、


前記の発振器基板領域に圧電振動素子が収容されている容器体と前記圧電振動素子の温度特性を補償する発振特性制御データ基づいて発振出力を制御する集積回路素子或いは先の集積回路素子、及び電子部品素子とを取着させる工程Bと、

前記の段差箇所に設けられている特性制御データ書込端子より集積回路素子に発振特性制御データを入力し、先の集積回路素子内のメモリに発振特性制御データを格納する工程Cと、

前記の母基板を各々の前記発振器基板領域の外周に沿って切断し、各発振器基板領域をその発振器基板領域内に搭載した前記集積回路素子、及び前記の電子部品素子と電気的に接続した前記特性制御データ書込端子が設けられている各捨てしろ領域から切り離し、複数個の圧電発振器を同時に得る工程Dとを含むことを特徴とするものである。
Further, in the piezoelectric oscillator manufacturing method of the present invention, a space is provided on the front main surface of the rectangular oscillator substrate region, and a step portion is provided on the back main surface of the previous oscillator substrate region. In the stepped portion, a characteristic control data write terminal electrically connected to the integrated circuit element mounted in the space portion is provided, and a throw-away area provided with the characteristic control data write terminal is formed. Forming a mother substrate in which a plurality of the oscillator substrate regions formed on the outer periphery are arranged in a matrix and configured integrally;


An integrated circuit element that controls oscillation output based on a container body in which the piezoelectric vibration element is accommodated in the oscillator substrate region, and oscillation characteristic control data that compensates for temperature characteristics of the piezoelectric vibration element, or an integrated circuit element and an electronic device Step B for attaching the component elements;

A step C of inputting oscillation characteristic control data to the integrated circuit element from the characteristic control data writing terminal provided at the step portion, and storing the oscillation characteristic control data in a memory in the previous integrated circuit element;

The mother board is cut along an outer periphery of each of the oscillator substrate regions, and each oscillator substrate region is electrically connected to the integrated circuit element mounted in the oscillator substrate region and the electronic component element. And a step D of obtaining a plurality of piezoelectric oscillators at the same time by separating from each of the discarded areas where the characteristic control data writing terminals are provided.

更に、本発明の圧電発振器の製造方法は、前記の工程Bにおいて、母基板を形成する各発振器基板領域に集積回路素子を搭載することによって、先の段差箇所並びに捨てしろ領域に形成されている特性制御データ書込端子と発振器基板領域、及び先の母基板の表面または/及び内部に形成した配線導体を介して、電気的に接続されることを特徴とするものである。          Furthermore, the piezoelectric oscillator manufacturing method of the present invention is formed in the stepped portion and the disposal region by mounting an integrated circuit element in each oscillator substrate region that forms the mother substrate in the step B. The characteristic control data writing terminal and the oscillator substrate region are electrically connected to each other through a wiring conductor formed on the surface or / and inside of the previous mother substrate.

また、更に本発明の圧電発振器の製造方法は、前記工程Aにおいて、前記の母基板の捨てしろ領域の内層に特性制御データ書込端子が設けられており、捨てしろ領域の表面には、先の特性制御データ書込端子表面に達する貫通孔が形成されていることを特徴とするものである。          Furthermore, in the method for manufacturing a piezoelectric oscillator according to the present invention, in the step A, a characteristic control data write terminal is provided in an inner layer of the discard area of the mother substrate, and the surface of the discard area has a tip on the surface. A through-hole reaching the surface of the characteristic control data writing terminal is formed.

本発明の圧電発振器によれば、絶縁基体の裏主面に段差箇所が設けられ、先の段差箇所には特性制御データ書込端子が形成されていることにより、圧電発振器をマザーボード等の外部電気回路に搭載する際、両者の接合に用いられている導電性接合材の一部が前記の特性制御データ書込端子に付着してショートを起こすといった不都合を発生することが無く、製品の取り扱いを著しく簡便とすることが出来る。          According to the piezoelectric oscillator of the present invention, the stepped portion is provided on the back main surface of the insulating base, and the characteristic control data writing terminal is formed at the previous stepped portion. When mounting on a circuit, there is no inconvenience that a part of the conductive bonding material used to bond the two adheres to the characteristic control data writing terminal and causes a short circuit. It can be remarkably simplified.

また、本発明の圧電発振器の製造方法によれば、発振特性制御データを集積回路素子に書き込むのに使用される特性制御データ書込端子を母基板の捨てしろ領域にも設けておき、発振特性制御データの書き込みを完了した後、切り離すようにしたことから、発振器基板領域には特性制御データ書込端子を配置させるための最小限のスペースを必要として圧電発振器の全体構造を著しく小型化することが出来る。          According to the method for manufacturing a piezoelectric oscillator of the present invention, the characteristic control data write terminal used for writing the oscillation characteristic control data to the integrated circuit element is also provided in the area where the mother board is discarded. Since the control data has been written and then separated, the oscillator substrate area requires a minimum space for placing the characteristic control data write terminals, and the overall structure of the piezoelectric oscillator is significantly reduced in size. I can do it.

しかもこの場合、圧電発振器の製造プロセスをより簡素とすることが出来る上に、個々の圧電発振器に発振特性制御データを書き込むためのソケット等の設備は一切不要であり、これによって圧電発振器の生産性を著しく高く維持することが出来る。          In addition, in this case, the manufacturing process of the piezoelectric oscillator can be further simplified, and no equipment such as a socket for writing the oscillation characteristic control data to each piezoelectric oscillator is required, thereby improving the productivity of the piezoelectric oscillator. Can be kept extremely high.

更に、本発明の圧電発振器の製造方法によれば、先の母基板は集積回路素子を搭載した後で分割されるように成っており、集積回路素子の搭載時、母基板自体が集積回路素子搭載用のキャリアとして機能することから、集積回路素子搭載用のキャリアを不要
とすることが出来、母基板の分割によって得られた個々の基板をキャリアに搭載するといった煩雑な作業も一切不要と成る。これによっても、圧電発振器の生産性を著しく向上させることが出来る。
Furthermore, according to the method for manufacturing a piezoelectric oscillator of the present invention, the previous mother board is divided after the integrated circuit element is mounted. When the integrated circuit element is mounted, the mother board itself is the integrated circuit element. Since it functions as a carrier for mounting, it is possible to eliminate the need for a carrier for mounting integrated circuit elements, and to eliminate the need for complicated operations such as mounting individual substrates obtained by dividing the mother substrate on the carrier. . Also by this, the productivity of the piezoelectric oscillator can be remarkably improved.

また、更に本発明の圧電発振器の製造方法によれば、先の基板領域に形成されている第1の特性制御データ書込端子を介して、再度集積回路素子に発振特性制御データを入力し、集積回路素子内のメモリに発振特性制御データを格納する工程を含むことにより、母基板上で発振特性制御データを入力ミスなったものについて、分割後の個片状態と成っても再調整することが出来る為、圧電発振器の生産歩留まりを著しく改善させることが可能と成る。          Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the oscillation characteristic control data is input again to the integrated circuit element through the first characteristic control data write terminal formed in the previous substrate region, By including the step of storing the oscillation characteristic control data in the memory in the integrated circuit element, it is possible to readjust the oscillation characteristic control data that has been input incorrectly on the mother board even if it becomes a divided individual state. Therefore, the production yield of piezoelectric oscillators can be remarkably improved.

また、更に本発明の圧電発振器の製造方法によれば、先の母基板の捨てしろ領域の内層に前記の特性制御データ書込端子が設けられており、また、捨てしろ領域の表面には前記の特性制御データ書込端子表面に達する貫通孔が形成されていることにより、プローブをあてる際に、これらの貫通孔がガイドラインとなる為、プローブの接触不良等を無くし著しく生産性を向上させることを可能とする効果を有する。          Further, according to the method for manufacturing a piezoelectric oscillator of the present invention, the characteristic control data write terminal is provided in the inner layer of the discard area of the mother substrate, and the surface of the discard area has the above-mentioned Through the formation of through-holes that reach the surface of the characteristic control data writing terminal, these through-holes serve as guidelines when applying the probe, thus eliminating poor probe contact and significantly improving productivity. Has the effect of enabling

以下、本発明を添付図面に基づいて詳細に説明する。なお、各図においての同一の符号は同じ対象を示すものとする。          Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.

図1は本発明の一実施形態に係る圧電発振器の概略の分解斜視図であり、図2は図1の圧電発振器の製造方法を示した概略の外観斜視図であり、これらの図に示される圧電発振器は、圧電振動素子としての水晶振動素子5が収容される容器体と、絶縁性基体の表主面に集積回路素子7が収容される凹部状の空間部とを有する構造と成っている。          FIG. 1 is a schematic exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention, and FIG. 2 is a schematic external perspective view showing a manufacturing method of the piezoelectric oscillator of FIG. 1, which is shown in these drawings. The piezoelectric oscillator has a structure having a container body in which a quartz crystal vibration element 5 as a piezoelectric vibration element is accommodated, and a concave space in which an integrated circuit element 7 is accommodated on the front main surface of an insulating substrate. .

容器体1は、例えばガラス−セラミック、アルミナセラミックス等のセラミック材料から成る基板2と、42アロイやコバール,リン青銅等の金属から成るシールリング3と、シールリング3と同様の金属から成る蓋体4とから成り、前記の基板2の上面にシールリング3を取着させ、その上面に蓋体4を載置して固定させることによって容器体1が構成され、シールリング3の内側に位置する基板2の上面に水晶振動素子5が実装される。          The container 1 includes a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze, and a lid made of the same metal as the seal ring 3. 4, the seal ring 3 is attached to the upper surface of the substrate 2, and the lid body 4 is placed and fixed on the upper surface of the substrate 2. Thus, the container body 1 is configured and located inside the seal ring 3. A crystal resonator element 5 is mounted on the upper surface of the substrate 2.

前記の容器体1はその内部に、具体的には、基板2の表主面とシールリング3の内面と蓋体4の下面とで囲まれる空間部内に水晶振動素子5を収容して気密封止する構造と成っており、基板2の上面には水晶振動素子5の振動電極に接続される一対の搭載パッド等がそれぞれ設けられ、これらのパッド等は基板表面の配線導体や基板内部に埋設されているビアホール導体等を介して、対応するもの同士が相互に電気的に接続されている。          The container body 1 accommodates a quartz crystal resonator element 5 in an inner space, specifically, a space surrounded by the front main surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. The upper surface of the substrate 2 is provided with a pair of mounting pads connected to the vibration electrode of the crystal resonator element 5, and these pads are embedded in the wiring conductor on the substrate surface or in the substrate. Corresponding parts are electrically connected to each other through via hole conductors and the like.

なお、前記容器体1の基板2は、ガラス−セラミック等のセラミック材料から成る場合、例えば、セラミック材料粉末に適当な有機溶剤等を添加して混合して得たセラミックグリーンシートの表面等に配線導体となる導体ペーストを従来から周知のスクリーン印刷等によって塗布するとともに、これを複数枚積層してプレス成形した後に高温で焼成することによって製作される。          When the substrate 2 of the container 1 is made of a ceramic material such as glass-ceramic, for example, wiring is made on the surface of a ceramic green sheet obtained by adding an appropriate organic solvent to the ceramic material powder and mixing it. A conductor paste to be a conductor is applied by well-known screen printing or the like, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

また、前記の容器体1のシールリング3、及び蓋体4は従来から周知の金属加工法を採用し、42アロイ等の金属を所定形状に成形することによって製作され、得られたシールリング3を基板2の上面に予め被着させておいた導体層にロウ付けし、続いて水晶振動素子5を、導電性接着剤を用いて基板2の上面に実装して固定した後、上述の蓋体4をこれも従来から周知の抵抗溶接等によってシールリング3の上面に接合することによって容器体1が組み立てられる。このようにシールリング3と蓋体4とを抵抗溶接によって接合する場合、シールリング3や蓋体4の表面には予めNiメッキ層やAuメッキ層等が被着される。          Further, the seal ring 3 and the lid 4 of the container body 1 employ a conventionally well-known metal processing method, and are produced by molding a metal such as 42 alloy into a predetermined shape, and the seal ring 3 obtained. Is brazed to a conductor layer previously deposited on the upper surface of the substrate 2, and then the quartz resonator element 5 is mounted and fixed on the upper surface of the substrate 2 using a conductive adhesive, and then the lid described above is mounted. The container body 1 is assembled by joining the body 4 to the upper surface of the seal ring 3 by a conventionally known resistance welding or the like. In this way, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

一方、前記の容器体1の内部に収容される水晶振動素子5は、所定の結晶軸でカットした水晶片の両主面に一対の振動電極を被着して形成されており、外部からの変動電圧が一対の振動電極を介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こす。          On the other hand, the crystal resonator element 5 accommodated in the container body 1 is formed by attaching a pair of vibration electrodes to both main surfaces of a crystal piece cut along a predetermined crystal axis. When the fluctuating voltage is applied to the crystal piece via the pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

前記の水晶振動素子5は、一対の振動電極を導電性接着剤を介して基板上面の対応する搭載パッドに電気的に接続させることによって基板2の上面に搭載され、これによって水晶振動素子5と容器体1との電気的接続、及び機械的接続が同時に成される。          The crystal resonator element 5 is mounted on the upper surface of the substrate 2 by electrically connecting a pair of vibration electrodes to a corresponding mounting pad on the upper surface of the substrate via a conductive adhesive. The electrical connection with the container body 1 and the mechanical connection are made simultaneously.

ここで容器体1の蓋体4を容器体1や、絶縁性基体1の配線導体を介して絶縁性基体下面に配されるグランド端子用の外部端子9に接続させておけば、その使用時に蓋体4がアースされることによりシールド機能が付与されることと成るため、水晶振動素子5や後述する集積回路素子7を外部からの不要な電気的作用より良好に保護することが出来るといった効果も奏するものである。従って、蓋体4は絶縁性基体1の配線導体を介してグランド端子用の外部端子9に接続させておくことが好ましい。          Here, if the lid 4 of the container body 1 is connected to the container body 1 or the external terminal 9 for the ground terminal arranged on the lower surface of the insulating base body via the wiring conductor of the insulating base body 1, Since the shielding function is imparted by grounding the lid body 4, the crystal vibrating element 5 and the integrated circuit element 7 to be described later can be better protected from unnecessary external electrical action. It also plays. Therefore, the lid 4 is preferably connected to the external terminal 9 for the ground terminal via the wiring conductor of the insulating base 1.

前記の絶縁性基体6は、ガラス布基材エポキシ樹脂やポリカーボネイト,エポキシ樹脂,ポリイミド樹脂等の樹脂材料やガラス−セラミック,アルミナセラミックス等のセラミック材料等によって断面凹状を成すように形成され、その上面には容器体下面の対応する第1接合電極に電気的に接続される複数個の接合電極が、また前記の絶縁性基体の裏主面には4つの外部端子9(電源電圧端子、グランド端子、発振出力端子、発振制御端子の4つ)が設けられており、これらの外部端子9は、圧電発振器をマザーボード等の外部電気回路に搭載する際、半田付け等によって外部電気回路の回路配線と電気的に接続されることと成る。          The insulative base 6 is formed to have a concave cross section by a resin material such as glass cloth base epoxy resin, polycarbonate, epoxy resin or polyimide resin, or ceramic material such as glass-ceramic or alumina ceramic. Includes a plurality of bonding electrodes electrically connected to corresponding first bonding electrodes on the lower surface of the container body, and four external terminals 9 (power supply voltage terminals, ground terminals) on the back main surface of the insulating base. , Oscillation output terminal and oscillation control terminal), and these external terminals 9 are connected to circuit wiring of the external electric circuit by soldering or the like when the piezoelectric oscillator is mounted on an external electric circuit such as a mother board. It will be electrically connected.

また、前記の絶縁性基体の裏主面には、段差箇所8が形成されており、前記の段差箇所8には、特性制御データ書込端子10が設けられている。          Further, a step portion 8 is formed on the back main surface of the insulating substrate, and a characteristic control data writing terminal 10 is provided at the step portion 8.

ここで、4個の外部端子9のうち、グランド端子と発振出力端子を近接させて配置するようにすれば、発振出力端子より出力される発振信号にノイズが干渉することを有効に防止することが出来る。従って、グランド端子と発振出力端子は近接させて配置することが好ましい。           Here, of the four external terminals 9, if the ground terminal and the oscillation output terminal are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. I can do it. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

更に、上述した絶縁性基体は基板2の表主面と壁部の内面とで囲まれる空間部内の中央域に複数個の電極パッドを被着して形成されており、これら電極パッドの形成領域に上述した集積回路素子7が搭載される。           Further, the insulating base described above is formed by depositing a plurality of electrode pads in the central region in the space portion surrounded by the front main surface of the substrate 2 and the inner surface of the wall portion. The integrated circuit element 7 described above is mounted.

前記の集積回路素子7としては、例えば下面に絶縁性基体1の電極パッドと1対1に対応する複数個の接続パッドを有した矩形状のフリップチップ型IC等が用いられ、その下面の回路形成面には、周囲の温度状態を検知するサーミスタといった感温素子、水晶振動素子5の温度特性を補償する発振特性制御データを格納するためのメモリ、発振特性制御データに基づいて水晶振動素子5の振動特性を温度変化に応じて補正する温度補償回路、また先の温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられ、この発振回路で生成された発振出力は、外部に出力された後に例えばクロック信号等の基準信号として利用することが出来る。          As the integrated circuit element 7, for example, a rectangular flip-chip IC having a plurality of connection pads corresponding to the electrode pads of the insulating base 1 on the lower surface is used, and the circuit on the lower surface is used. On the forming surface, a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing oscillation characteristic control data for compensating temperature characteristics of the crystal vibration element 5, and the crystal vibration element 5 based on the oscillation characteristic control data. Is provided with a temperature compensation circuit that corrects the vibration characteristics according to a temperature change, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the oscillation output generated by this oscillation circuit is After being output to the outside, it can be used as a reference signal such as a clock signal.

なお、前の記集積回路素子7は、その下面に設けた接続パッドを絶縁性基体上面の対応する電極パッドに半田や金バンプ等の導電性接合材を介して個々に接合させることによって集積回路素子7が実装用基体6に取着され、これによって集積回路素子7内の電子回路が絶縁性基体の配線導体等を介して水晶振動素子5や外部端子9等に電気的に接続される。          In the integrated circuit element 7 described above, the connection pads provided on the lower surface thereof are individually bonded to the corresponding electrode pads on the upper surface of the insulating substrate through conductive bonding materials such as solder and gold bumps. The element 7 is attached to the mounting base 6, whereby the electronic circuit in the integrated circuit element 7 is electrically connected to the crystal vibrating element 5, the external terminal 9, etc. via the wiring conductor of the insulating base.

そして、先に述べた絶縁性基体1の基板2の裏主面に形成された段差箇所には、集積回路素子7に発振特性制御データを書き込むための特性制御データ書込端子10が複数個介在されている。          A plurality of characteristic control data write terminals 10 for writing oscillation characteristic control data to the integrated circuit element 7 are interposed at the step portions formed on the back main surface of the substrate 2 of the insulating base 1 described above. Has been.

これらの特性制御データ書込端子10は、絶縁性基体の裏主面に形成された段差箇所に並設されており、絶縁性基体1の配線導体等を介して集積回路素子7に電気的に接続されている。従って、圧電発振器を組み立てた後に、これらの特性制御データ書込端子10に下方より発振特性制御データ書込装置のプローブ針を当てて水晶振動素子5の温度特性に応じた発振特性制御データを書き込むことによって集積回路素子7のメモリ内に発振特性制御データが格納されることに成る。          These characteristic control data write terminals 10 are juxtaposed at the stepped portions formed on the back main surface of the insulating substrate, and are electrically connected to the integrated circuit element 7 via the wiring conductors of the insulating substrate 1 and the like. It is connected. Therefore, after assembling the piezoelectric oscillator, the oscillation characteristic control data corresponding to the temperature characteristic of the crystal resonator element 5 is written by applying the probe needle of the oscillation characteristic control data writing device to the characteristic control data writing terminal 10 from below. As a result, the oscillation characteristic control data is stored in the memory of the integrated circuit element 7.

かくして上述した圧電発振器は、マザーボード等の外部配線基板上に半田付け等によって搭載され、集積回路素子7の温度補償回路によって発振出力を補正しながら、水晶振動素子5の共振周波数に応じた所定の発振信号を出力することにより温度補償型水晶発振器として機能する。          Thus, the piezoelectric oscillator described above is mounted on an external wiring board such as a mother board by soldering or the like, and a predetermined frequency corresponding to the resonance frequency of the crystal resonator element 5 is corrected while correcting the oscillation output by the temperature compensation circuit of the integrated circuit element 7. It functions as a temperature compensated crystal oscillator by outputting an oscillation signal.

また、この場合、圧電発振器を半田付け等によってマザーボード上に搭載する際に、特性制御データ書込端子10が段差箇所8に形成されていることから、溶融した半田の一部が特性制御データ書込端子10に接触して短絡を起こすことも無く、その結果、圧電発振器の取り扱いを著しく簡便とする効果を奏するものである。          In this case, when the piezoelectric oscillator is mounted on the mother board by soldering or the like, the characteristic control data writing terminal 10 is formed at the stepped portion 8, so that a part of the melted solder is recorded in the characteristic control data writing. There is no short circuit due to contact with the lead-in terminal 10, and as a result, there is an effect that the handling of the piezoelectric oscillator is remarkably simplified.

次に図2の(a)乃至(d)を用いて上述した圧電発振器の製造方法について説明する。          Next, a method for manufacturing the above-described piezoelectric oscillator will be described with reference to FIGS.

(工程A)まず、図2の(a)に示すように絶縁性基体の表主面に凹形状の空間部と、先の絶縁性基体の裏主面の段差箇所8に設けられている特性制御データ書込端子10を有する発振器基板領域と、複数個の第2の特性制御データ書込端子を有する捨てしろ領域とを相互に隣接させて、これらをマトリックス状に配置した母基板13を準備する。          (Step A) First, as shown in FIG. 2 (a), a characteristic is that a concave space is formed on the front main surface of the insulating base and a step portion 8 on the back main surface of the previous insulating base. Prepared is a mother board 13 in which an oscillator substrate area having a control data write terminal 10 and a discard area having a plurality of second characteristic control data write terminals are adjacent to each other and arranged in a matrix. To do.

このような母基板13は、ガラス布基材エポキシ樹脂やポリカーボネイト,エポキシ樹脂,ポリイミド樹脂等の樹脂材料やガラス−セラミック,アルミナセラミックス等のセラミック材料等によって形成されており、例えば、ガラス布基材エポキシ樹脂で形成する場合、ガラス糸を編み込んで形成したガラス布基材にエポキシ樹脂の液状前駆体を含浸させるとともに、この前駆体を高温で重合させることによってベースが形成され、その表面に銅箔等の金属箔を貼着し、これを従来から周知のフォトエッチング等を採用して所定パターンに加工することによって特性制御データ書込端子10や接合電極や外部端子等を含む所定の配線パターンが形成される。          Such a base substrate 13 is formed of a glass cloth base material epoxy resin, polycarbonate, epoxy resin, polyimide resin or other resin material, glass-ceramic, alumina ceramics or other ceramic material, for example, a glass cloth base material. In the case of forming with epoxy resin, a glass cloth substrate formed by weaving glass yarn is impregnated with a liquid precursor of epoxy resin, and this precursor is polymerized at a high temperature to form a base, and copper foil is formed on the surface thereof. A predetermined wiring pattern including the characteristic control data writing terminal 10, the bonding electrode, the external terminal, and the like is obtained by pasting a metal foil such as the above and processing it into a predetermined pattern using a conventionally known photo-etching or the like. It is formed.

(工程B)次に図2の(b)に示すように母基板の発振器基板領域に、水晶振動素子5が収容されている容器体1と、前記水晶振動素子5の温度特性を補償する発振特性制御データに基づいて発振出力を制御する集積回路素子7或いは該集積回路素子7、及び電子部品素子とを取着させる。          (Step B) Next, as shown in FIG. 2 (b), the container body 1 in which the crystal resonator element 5 is accommodated in the oscillator substrate region of the mother substrate, and the oscillation for compensating the temperature characteristics of the crystal resonator element 5. The integrated circuit element 7 for controlling the oscillation output based on the characteristic control data or the integrated circuit element 7 and the electronic component element are attached.

前記の容器体1には、先に述べたように基板2とシールリング3と蓋体4とで構成されており、その内部に水晶振動素子5を収容させている。
例えば、得られた基板2の上面に水晶振動素子5を搭載する。このとき、水晶振動素子5の振動電極と基板上面の搭載パッドとは導電性接合材を介して電気的に、かつ機械的に接続される。そして、基板2の上面に、水晶振動素子5を囲繞するようにしてシールリング3を載置して固定し、シールリング3の上面に蓋体4を従来から周知の抵抗溶接等によって接合することにより容器体1が組み立てられる。
As described above, the container body 1 includes the substrate 2, the seal ring 3, and the lid body 4, and the crystal resonator element 5 is accommodated therein.
For example, the crystal resonator element 5 is mounted on the upper surface of the obtained substrate 2. At this time, the vibration electrode of the crystal resonator element 5 and the mounting pad on the upper surface of the substrate are electrically and mechanically connected via the conductive bonding material. Then, the seal ring 3 is placed and fixed on the upper surface of the substrate 2 so as to surround the crystal resonator element 5, and the lid body 4 is joined to the upper surface of the seal ring 3 by conventionally known resistance welding or the like. Thus, the container body 1 is assembled.

なお、シールリング3、及び蓋体4は従来から周知の金属加工法を採用し、42アロイ等の金属を所定形状に成形することによって製作され、前記シールリング3は、基板2の上面に予め被着させておいた導体層にロウ付けすることによって基板2に固定される。また上述のように、シールリング3と蓋体4とを抵抗溶接によって接合する場合、シールリング3や蓋体4の表面には予めNiメッキ層やAuメッキ層等が被着される。          The seal ring 3 and the lid 4 are manufactured by adopting a conventionally known metal processing method and molding a metal such as 42 alloy into a predetermined shape, and the seal ring 3 is formed on the upper surface of the substrate 2 in advance. It is fixed to the substrate 2 by brazing to the conductor layer that has been deposited. Further, as described above, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

前記の集積回路素子7としては、例えば、下面に絶縁性基体の第2の空間に形成されている電極パッドと1対1に対応する複数個の接続パッドを有した矩形状のフリップチップ型IC等が用いられ、その下面の回路形成面には、周囲の温度状態を検知するサーミスタといった感温素子、水晶振動素子5の温度特性を補償する発振特性制御データを格納するためのメモリ、発振特性制御データに基づいて水晶振動素子5の振動特性を温度変化に応じて補正する温度補償回路や、先の温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられ、この発振回路で生成された発振出力は、外部に出力された後に、例えばクロック信号等の基準信号として利用される。          As the integrated circuit element 7, for example, a rectangular flip-chip IC having a plurality of connection pads corresponding to electrode pads formed on the lower surface in the second space of the insulating base and one-to-one. The circuit forming surface on the lower surface thereof is a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing oscillation characteristic control data for compensating the temperature characteristic of the crystal vibration element 5, and an oscillation characteristic A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to temperature changes based on the control data, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the circuit is used as a reference signal such as a clock signal after being output to the outside.

なお、前記集積回路素子7は、その下面に設けた接続パッドを絶縁性基体上面の対応する電極パッドに半田や金バンプ等の導電性接合材を介して個々に接合させることによって集積回路素子7が絶縁性基体6に取着され、これによって集積回路素子7内の電子回路が容絶縁性基体1の配線導体等を介して水晶振動素子5や外部端子9等に電気的に接続される。          The integrated circuit element 7 is formed by individually bonding the connection pads provided on the lower surface thereof to the corresponding electrode pads on the upper surface of the insulating substrate through a conductive bonding material such as solder or gold bump. Is attached to the insulating base 6, whereby the electronic circuit in the integrated circuit element 7 is electrically connected to the crystal vibrating element 5, the external terminal 9, etc. via the wiring conductor of the insulating base 1.

また、かかる工程Bにおいては、前記の母基板を形成する各発振器基板領域Aに集積回路素子を搭載することによって、先の段差箇所8、並びに前記捨てしろ領域に形成されている特性制御データ書込端子10と発振器基板領域、及び先の母基板13の表面または/及び内部に形成した配線導体を介して、電気的に接続されることと成る。          In the step B, the integrated circuit element is mounted on each oscillator substrate region A forming the mother substrate, so that the characteristic control data document formed in the stepped portion 8 and the discarding region is formed. The lead-in terminal 10 is electrically connected to the oscillator substrate region and a wiring conductor formed on the surface or / and inside of the mother substrate 13.

(工程C)次に、図2の(c)に示すように母基板13の捨てしろ領域Bに設けた複数個の特性制御データ書込端子10を介して各発振器基板領域A内の集積回路素子7に発振特性制御データを入力し、集積回路素子7内のメモリに発振特性制御データを格納する。          (Step C) Next, as shown in FIG. 2 (c), integrated circuits in each oscillator substrate region A via a plurality of characteristic control data write terminals 10 provided in the area B to be discarded of the mother substrate 13. Oscillation characteristic control data is input to the element 7, and the oscillation characteristic control data is stored in a memory in the integrated circuit element 7.

このような発振特性制御データの書込作業は、発振特性制御データ書込装置のプローブ針を特性制御データ書込端子10に当てて、水晶振動素子5の温度特性に応じて作成された発振特性制御データを集積回路素子7の温度補償回路内に設けられているメモリに入力し、これを記憶させることによって行なわれる。なお、ここで集積回路素子7に書き込まれる発振特性制御データは、水晶振動素子毎の温度特性バラツキを補正するためのものであり、その圧電発振器に使用される水晶振動素子5の温度特性を事前に測定しておくことにより得られるものである。          The writing operation of the oscillation characteristic control data is performed by applying the probe needle of the oscillation characteristic control data writing device to the characteristic control data writing terminal 10 and generating the oscillation characteristic according to the temperature characteristic of the crystal resonator element 5. This is done by inputting the control data to a memory provided in the temperature compensation circuit of the integrated circuit element 7 and storing it. Here, the oscillation characteristic control data written in the integrated circuit element 7 is for correcting the temperature characteristic variation for each crystal vibration element, and the temperature characteristic of the crystal vibration element 5 used in the piezoelectric oscillator is previously determined. It is obtained by measuring in advance.

(工程D)次に、図2の(d)に示すように母基板13を各発振器基板領域の外周に沿って切断することにより、各発振器基板領域Aを捨てしろ領域より切り離す。先の母基板13の切断は従来から周知のダイシング等によって行なわれ、かかる切断工程を経て母基板13が個々の発振器基板領域毎に分割される。これにより、容器体1の下面に、発振器基板領域Aに対応した絶縁性基体と集積回路素子7とを取着させてなる複数個の圧電発振器が同時に得られる。          (Step D) Next, as shown in FIG. 2 (d), the mother substrate 13 is cut along the outer periphery of each oscillator substrate region, so that each oscillator substrate region A is discarded and separated from the region. The previous mother substrate 13 is cut by conventionally known dicing or the like, and the mother substrate 13 is divided into individual oscillator substrate regions through such a cutting process. As a result, a plurality of piezoelectric oscillators obtained by attaching the insulating base corresponding to the oscillator substrate region A and the integrated circuit element 7 to the lower surface of the container body 1 can be obtained simultaneously.

最後に前記の絶縁性基体6に形成されている特性制御データ書込端子10を介して、再度集積回路素子に発振特性制御データを入力し、集積回路素子内のメモリに発振特性制御データを格納することにより、母基板13上で発振特性制御データのうち入力ミスなったものについて、分割後の個片状態になっても再調整することが出来る為、歩留まりを著しく改善させることが可能とする効果を奏するものである。          Finally, the oscillation characteristic control data is input again to the integrated circuit element via the characteristic control data writing terminal 10 formed on the insulating substrate 6, and the oscillation characteristic control data is stored in the memory in the integrated circuit element. This makes it possible to readjust the oscillation characteristic control data on the mother board 13 that has been input incorrectly, even if it becomes an individual state after division, so that the yield can be remarkably improved. There is an effect.

最後に、工程Aの際に前記の母基板の捨てしろ領域の内層に特性制御データ書込端子10が設けられており、先の捨てしろ領域の表面には特性制御データ書込端子表面に達する貫通孔11が形成されていることにより、プローブをあてる際に、貫通孔11がガイドラインとなる為にプローブの接触不良等を改善できるので、その生産性を著しく向上させることを可能とする。          Finally, in the process A, the characteristic control data write terminal 10 is provided in the inner layer of the discard area of the mother substrate, and reaches the surface of the characteristic control data write terminal on the surface of the previous discard area. Since the through-hole 11 is formed, the contact failure of the probe can be improved because the through-hole 11 serves as a guideline when the probe is applied, so that the productivity can be remarkably improved.

なお、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更や改良等が可能であることは言うまでも無い。また、上述した実施形態においては、容器体1と絶縁性基体6とを接合するのに導電性接合材を用いるようにしたが、この導電性接合材は半田等の一般的な導電材料に限られるものではなく、例えば、導電性接合材として異方性導電接着材等を用いるようにしても良く、その場合、絶縁性基体6に対する容器体1の取着作業が極めて簡単になり、圧電発振器の組立工程が更に簡略化されるといった利点もある。          Note that the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications and improvements can be made without departing from the scope of the present invention. In the above-described embodiment, a conductive bonding material is used to bond the container body 1 and the insulating base 6, but this conductive bonding material is limited to general conductive materials such as solder. For example, an anisotropic conductive adhesive or the like may be used as the conductive bonding material. In this case, the operation of attaching the container body 1 to the insulating substrate 6 becomes extremely simple, and the piezoelectric oscillator There is also an advantage that the assembly process is further simplified.

また、更に上述した実施形態においては、容器体1の蓋体4をシールリング3を介して基板2に接合させるようにしたが、これに代えて、基板2の上面に接合用のメタライズパターンを形成しておき、このメタライズパターンに対して蓋体4をダイレクトに溶接するようにしても構わず、この場合においても本発明の技術的範囲に含まれることは言うまでも無い。          Further, in the embodiment described above, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a metallized pattern for bonding is formed on the upper surface of the substrate 2. It may be formed and the lid 4 may be directly welded to the metallized pattern, and it goes without saying that this case is also included in the technical scope of the present invention.

また、更に上述した実施形態においては、例えば、シールリング3を用いて蓋体4を容器体1上に取り付けるようにしているが、これに代えて容器体上面のAu−Sn等の接合用導体に対して蓋体4を直接、接合することにより蓋体4を容器体1上に取り付けるようにしても構わず、この場合も本発明の技術的範囲に含まれることは言うまでも無い。          Further, in the embodiment described above, for example, the lid 4 is mounted on the container body 1 using the seal ring 3, but instead of this, a bonding conductor such as Au—Sn on the upper surface of the container body. On the other hand, the lid body 4 may be directly attached to the container body 1 by joining, and it goes without saying that this case is also included in the technical scope of the present invention.

更に、上述した実施形態においては、容器体1の基板上面に直接シールリング3を取着させるようにしたが、これに代えて、基板2の上面に基板2と同材質のセラミック材料等から成る枠体を一体的に取着させた上、先の枠体の上面にシールリング3を取着させるようにしても構わない。          Further, in the above-described embodiment, the seal ring 3 is directly attached to the upper surface of the substrate of the container body 1. Instead, the upper surface of the substrate 2 is made of the same ceramic material as the substrate 2. You may make it attach the seal ring 3 to the upper surface of a previous frame body, after attaching a frame body integrally.

また、更に上述した実施形態において、壁部間に位置する前記絶縁性基体1の上面にノイズ除去用のチップ状コンデンサ等を配置させても構わず、この場合も本発明の技術的範囲に含まれることは言うまでも無い。          Further, in the above-described embodiment, a noise-removing chip capacitor or the like may be disposed on the upper surface of the insulating substrate 1 located between the walls, and this case is also included in the technical scope of the present invention. Needless to say.

本発明の一実施形態に係る圧電発振器の概略の分解斜視図である。1 is a schematic exploded perspective view of a piezoelectric oscillator according to an embodiment of the present invention. (a)乃至(d)は本発明の圧電発振器の製造方法を説明するための概略の圧電発振器の外観斜視図である。図(a)は本発明の製造方法に用いられる母基板を圧電振動子の搭載される一主面側より見た概略の斜視図であり、また(b)は(a)の母基板の内層面の部分だけを見た概略の斜視図である。(A) thru | or (d) are the external appearance perspective views of the outline piezoelectric oscillator for demonstrating the manufacturing method of the piezoelectric oscillator of this invention. FIG. (A) is a schematic perspective view of a mother board used in the manufacturing method of the present invention as viewed from one main surface side on which a piezoelectric vibrator is mounted, and (b) is a diagram of the mother board of (a). It is the schematic perspective view which looked only at the part of the layer surface. 図(a)は本発明の圧電発振器の製造方法に用いられる母基板を圧電振動子の搭載される一主面側より見た概略の斜視図であり、また(b)は(a)の母基板の内層面の部分だけを見た概略の斜視図である。FIG. 1A is a schematic perspective view of a mother substrate used in the method for manufacturing a piezoelectric oscillator according to the present invention as viewed from one main surface side on which a piezoelectric vibrator is mounted, and FIG. It is the schematic perspective view which looked only at the part of the inner layer surface of the board | substrate. 従来の圧電発振器の概略の分解斜視図である。It is a schematic exploded perspective view of a conventional piezoelectric oscillator.

符号の説明Explanation of symbols

1・・・容器体
2・・・基板
3・・・シールリング
4・・・蓋体
5・・・水晶振動素子
6・・・絶縁性基体
7・・・集積回路素子
8・・・段差箇所
9・・・外部端子
10・・特性制御データ書込端子
11・・貫通孔
12・・樹脂材
13・・母基板
DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz vibration element 6 ... Insulating base | substrate 7 ... Integrated circuit element 8 ... Step location 9 ... External terminal 10 .... Characteristic control data writing terminal 11 .... Through hole 12 .... Resin material 13 .... Base board

Claims (4)

絶縁性基体の表主面には空間部が設けられており、該空間部には発振回路を組み込んだ集積回路素子、或いは該集積回路素子、及び電子部品素子を搭載させ、該絶縁性基体の空間部上面に圧電振動素子が収容されている容器体を載置させて成る圧電発振器であって、
前記絶縁性基体の裏主面には段差箇所が設けられ、該段差箇所には特性制御データ書込端子が形成されていることを特徴とする圧電発振器。
A space portion is provided on the front main surface of the insulating substrate, and an integrated circuit element in which an oscillation circuit is incorporated, or the integrated circuit element and an electronic component element are mounted in the space portion. A piezoelectric oscillator comprising a container body in which a piezoelectric vibration element is accommodated on the upper surface of a space,
A piezoelectric oscillator characterized in that a step portion is provided on the back main surface of the insulating substrate, and a characteristic control data writing terminal is formed at the step portion.
矩形状の発振器基板領域の表主面には、空間部が設けられており、該発振器基板領域の裏主面には段差箇所が設けられ、該段差箇所には該空間部に搭載する集積回路素子に電気的に接続した特性制御データ書込端子を設け、前記特性制御データ書込端子を設けた捨てしろ領域を形成し、該捨てしろ領域を外周に形成した該発振器基板領域が複数個マトリックス状に配列されて一体に構成されている母基板を形成する工程Aと、

前記発振器基板領域に圧電振動素子が収容されている容器体と前記圧電振動素子の温度特性を補償する発振特性制御データに基づいて発振出力を制御する集積回路素子或いは該集積回路素子、及び電子部品素子とを取着させる工程Bと、

前記段差箇所に設けられている特性制御データ書込端子より集積回路素子に発振特性制御データを入力し、該集積回路素子内のメモリに発振特性制御データを格納する工程Cと、
前記母基板を各々の前記発振器基板領域の外周に沿って切断して、各発振器基板領域をその発振器基板領域内に搭載した前記集積回路素子、及び前記電子部品素子と電気的に接続した前記特性制御データ書込端子が設けられている各捨てしろ領域から切り離し、複数個の圧電発振器を同時に得る工程Dとを含む圧電発振器の製造方法。
A space portion is provided on the front main surface of the rectangular oscillator substrate region, a step portion is provided on the back main surface of the oscillator substrate region, and an integrated circuit mounted in the space portion is provided on the step portion. A characteristic control data write terminal electrically connected to the element is provided, a throw-away area provided with the characteristic control data write terminal is formed, and a plurality of oscillator substrate areas in which the discard area is formed on the outer periphery are matrixed Forming a mother substrate that is arranged in a single piece and configured integrally;

An integrated circuit element that controls oscillation output based on a container body in which the piezoelectric vibration element is housed in the oscillator substrate region and oscillation characteristic control data that compensates for temperature characteristics of the piezoelectric vibration element, or the integrated circuit element, and an electronic component Step B for attaching the element;

A step C of inputting oscillation characteristic control data to the integrated circuit element from a characteristic control data writing terminal provided at the step portion, and storing the oscillation characteristic control data in a memory in the integrated circuit element;
The mother board is cut along the outer periphery of each oscillator substrate region, and each oscillator substrate region is mounted in the oscillator substrate region. The integrated circuit element is electrically connected to the electronic component element. A method of manufacturing a piezoelectric oscillator comprising: a step D of separating a plurality of piezoelectric oscillators simultaneously by separating from each forsake area provided with a control data writing terminal.
前記工程Bにおいて、前記母基板を形成する各発振器基板領域に前記集積回路素子を搭載することによって、前記段差箇所並びに前記捨てしろ領域に形成されている前記特性制御データ書込端子と該発振器基板領域、及び該母基板の表面または/及び内部に形成した配線導体を介して、電気的に接続されることを特徴とする請求項2に記載の圧電発振器の製造方法。           In the step B, by mounting the integrated circuit element in each oscillator substrate region forming the mother substrate, the characteristic control data writing terminal and the oscillator substrate formed in the stepped portion and the abandoned region 3. The method for manufacturing a piezoelectric oscillator according to claim 2, wherein the piezoelectric oscillator is electrically connected to each other through a region and a wiring conductor formed on a surface and / or inside the mother substrate. 前記工程Aにおいて、前記母基板の捨てしろ領域の内層に前記特性制御データ書込端子が設けられており、前記捨てしろ領域の表面には前記前記特性制御データ書込端子表面に達する貫通孔が形成されていることを特徴とする請求項2に記載の圧電発振器の製造方法。           In the step A, the characteristic control data write terminal is provided in an inner layer of the discard area of the mother substrate, and a through-hole reaching the surface of the characteristic control data write terminal is formed on the surface of the discard area. 3. The method for manufacturing a piezoelectric oscillator according to claim 2, wherein the piezoelectric oscillator is formed.
JP2004285517A 2004-09-29 2004-09-29 Piezoelectric oscillator and manufacturing method thereof Pending JP2006101241A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004285517A JP2006101241A (en) 2004-09-29 2004-09-29 Piezoelectric oscillator and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004285517A JP2006101241A (en) 2004-09-29 2004-09-29 Piezoelectric oscillator and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JP2006101241A true JP2006101241A (en) 2006-04-13

Family

ID=36240630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004285517A Pending JP2006101241A (en) 2004-09-29 2004-09-29 Piezoelectric oscillator and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2006101241A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184890A (en) * 2005-12-06 2007-07-19 Nippon Dempa Kogyo Co Ltd Surface mount type crystal oscillator
JP2008078791A (en) * 2006-09-19 2008-04-03 Nippon Dempa Kogyo Co Ltd Surface mounting crystal oscillator
JP2008252781A (en) * 2007-03-30 2008-10-16 Kyocera Kinseki Corp Piezoelectric oscillator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184890A (en) * 2005-12-06 2007-07-19 Nippon Dempa Kogyo Co Ltd Surface mount type crystal oscillator
JP2008078791A (en) * 2006-09-19 2008-04-03 Nippon Dempa Kogyo Co Ltd Surface mounting crystal oscillator
JP2008252781A (en) * 2007-03-30 2008-10-16 Kyocera Kinseki Corp Piezoelectric oscillator

Similar Documents

Publication Publication Date Title
JP4545004B2 (en) Piezoelectric oscillator
JP2005244639A (en) Temperature compensated crystal oscillator
JP4167557B2 (en) Method for manufacturing piezoelectric oscillator
JP2007060593A (en) Piezoelectric device and manufacturing method thereof
JP4724518B2 (en) Piezoelectric oscillator
JP2006101241A (en) Piezoelectric oscillator and manufacturing method thereof
JP4585908B2 (en) Method for manufacturing piezoelectric device
JP2005253007A (en) Temperature compensated crystal oscillator
JP4578231B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP4472445B2 (en) Method for manufacturing piezoelectric oscillator
JP4113459B2 (en) Manufacturing method of temperature compensated crystal oscillator
JP2005020633A (en) Manufacturing method of temperature compensated crystal oscillator
JP4472479B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP4376148B2 (en) Piezoelectric oscillator
JP4384567B2 (en) Manufacturing method of temperature compensated crystal oscillator
JP4960080B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP2005244641A (en) Temperature compensated crystal oscillator
JP5005336B2 (en) Method for manufacturing piezoelectric oscillator
JP4328225B2 (en) Temperature compensated crystal oscillator
JP2005244644A (en) Piezoelectric oscillator
JP2004343681A (en) Manufacturing method for temperature compensated crystal oscillator
JP2005210673A (en) Surface-mounted crystal oscillator
JP2006129186A (en) Manufacturing method of piezoelectric oscillator
JP4113460B2 (en) Manufacturing method of temperature compensated crystal oscillator
JP4336213B2 (en) Piezoelectric oscillator