JP2008278227A - Manufacturing method of piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric oscillator capable of easily measuring a piezoelectric vibrating element even when made to be compact. <P>SOLUTION: The manufacturing method of a piezoelectric oscillator for mounting the piezoelectric vibrating element in a first recessed part, hermetically sealing the first recessed part with a lid and mounting an integrated circuit element in a second recessed part comprises: a container body manufacturing step for having a piezoelectric vibrating element mounting pad on one principal plane of a substrate body and two conductor patterns for mounting the integrated circuit element on the other principal plane and provided in parallel to be used to measure the piezoelectric vibrating element; a vibrator part forming step for mounting the piezoelectric vibrating element on the mounting pad provided in the first recessed part and hermetically sealing the first recessed part with the lid; a piezoelectric vibrating element measuring step for using the conductor patterns to measure the piezoelectric vibrating element, wherein the conductor patterns are electrically connected to the mount pad; an integrated circuit element mounting pad forming step for cutting the conductor patterns to form an integrated circuit element mounting pad; and an integrated circuit element mounting step for mounting the integrated circuit element on the integrated circuit element mounting pad. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device or the like.

  2. Description of the Related Art Conventionally, a piezoelectric oscillator that is one of electronic components is mounted on an electronic device such as a portable communication device. This piezoelectric oscillator is used as a reference signal generation source or a clock signal generation source, for example.

For example, as shown in FIG. 3, the conventional piezoelectric oscillator 100 is mainly composed of a container body 101, a lid body 106, a piezoelectric vibration element 105, an integrated circuit element 107, and a resin 108. The container body 101 is configured by integrally forming a frame body 109 on both main surfaces of the substrate body 104. One recess formed by the substrate body 104 and the frame body 109 is used as a first recess 102, and the other This recess is referred to as a second recess 103.
A piezoelectric vibration element 105 is mounted in the first recess 102 of the container body 101, and the first recess 102 is hermetically sealed by the lid body 106.
Further, an integrated circuit element 107 is mounted in the second recess 103 of the container body 101 shown in FIG. 4 and a resin 108 is filled between the integrated circuit element 107 and the substrate body 104 as shown in FIG. ing.
The integrated circuit element 107 includes an oscillation circuit that excites the piezoelectric vibration element 105 to obtain an output signal, a temperature compensation circuit that receives the output signal and performs temperature compensation on the signal, and the like.

  Here, in the conventional piezoelectric oscillator 100, a square monitor electrode pad 151 connected to the piezoelectric vibration element 105 is formed on the surface of the substrate body in the second recess 103. A plurality of circular integrated circuit element mounting pads 122 are formed so as to surround the monitor electrode pad 151.

  With such a structure, the conventional piezoelectric oscillator 100 has a structure in which the piezoelectric vibration element 105 and the integrated circuit element 107 are mounted on the substrate body 104. Therefore, the mounting area on the mother board (not shown) can be reduced. Further, since the piezoelectric vibration element 105 and the integrated circuit element 107 are mounted in completely different regions, the oscillation operation of the piezoelectric vibration element 105 can be stabilized over a long period of time. Further, since the monitor electrode pad 151 for measuring the oscillation characteristics of the piezoelectric vibration element 105 mounted in the first recess 102 is formed on the surface of the substrate body of the second recess 103, the resin is mounted after the integrated circuit element 107 is mounted. When 108 is filled, the outside air is not touched.

  For this reason, since the piezoelectric vibration element 105 is cut off from the outside, it is possible to prevent malfunction due to an external factor. Further, the conventional piezoelectric oscillator 100 uses the monitor electrode pad 151, so that the single oscillation characteristic of the piezoelectric vibration element 105 can be measured independently before the integrated circuit element 107 is mounted. In the conventional piezoelectric oscillator 100, the frequency adjustment of the piezoelectric vibration element 105 and the selection of temperature compensation data become very simple. Further, since the conventional piezoelectric oscillator 100 can easily detect a defect in the oscillation characteristics of the piezoelectric vibration element 105 during the manufacturing process, the integrated circuit element 107 is not wasted and the useless manufacturing process can be eliminated. Therefore, an inexpensive piezoelectric oscillator can be obtained. In addition, since the conventional piezoelectric oscillator 100 has the integrated circuit element 107 mounted after the piezoelectric vibration element 105 is mounted on the surface of the substrate body 104, the heat treatment performed to stabilize the frequency of the piezoelectric vibration element 105 is performed. The operation reliability and connection reliability of the integrated circuit element 107 can be improved without being applied to the integrated circuit element 107 (see, for example, Patent Documents 1 and 2).

JP 2000-77941 A JP 2003-163540 A

  However, in the case of the conventional piezoelectric oscillator 100 in which the monitor electrode pad 151 of the conventional piezoelectric oscillator described above is formed in the second concave portion 103 on the bottom surface side of the substrate body 104, the piezoelectric vibrating element 105 can be easily measured as the miniaturization progresses. Therefore, it is difficult to provide the monitor electrode pad 151 having an area for performing the following. That is, the integrated circuit element mounting pads 122 and the monitor electrode pads 151 are densely packed, and the respective areas are further reduced. Therefore, it becomes difficult to measure the piezoelectric vibration element 105.

  Accordingly, an object of the present invention is to solve the above-described problems and to provide a method for manufacturing a piezoelectric oscillator that can easily measure a piezoelectric vibration element even if it is downsized.

  The method for manufacturing a piezoelectric oscillator according to the present invention is made to solve the above-mentioned problems, and a first recess and a second recess are formed by providing frame portions on both main surfaces of a substrate body. A piezoelectric oscillator manufacturing method in which a piezoelectric vibration element is mounted in the first recess of the container body and hermetically sealed with a lid, and an integrated circuit element is mounted in the second recess, A piezoelectric vibration element mounting pad for mounting the piezoelectric vibration element on one main surface of the substrate body and two integrated parallel lines used for measurement of the piezoelectric vibration element by mounting the integrated circuit element on the other main surface. A container body manufacturing process for manufacturing the container body having a conductor pattern, and a piezoelectric vibration element is mounted on a mounting pad provided in the first recess, and the first recess is hermetically sealed with a lid, and vibration is generated. A vibrator portion forming step for forming a child portion, the conductor pattern and the tower. A piezoelectric vibration element measuring step for measuring the piezoelectric vibration element using the conductor pattern, wherein the pad is electrically connected; and an integrated circuit for mounting the integrated circuit element by cutting the conductor pattern An integrated circuit element mounting pad forming step for forming an element mounting pad and an integrated circuit element mounting step for mounting an integrated circuit element on the integrated circuit element mounting pad are characterized in that it is configured.

  Further, in the manufacturing method, the container body manufacturing process is a process of manufacturing a collective substrate in which a plurality of the container bodies are arranged, and the vibrator unit is formed for each of the container bodies constituting the collective substrate. Characterized in that it comprises a process, a piezoelectric vibration element measuring process, an integrated circuit element mounting pad forming process, and an integrated circuit element mounting process, and an individualization process for individualizing each container body. To do.

  Furthermore, in the manufacturing method, a laser beam is used for cutting the conductor pattern in the integrated circuit element mounting pad forming step.

  According to the method for manufacturing a piezoelectric oscillator according to the present invention, since a conductor pattern provided in parallel with two strips is used as a conventional monitor electrode pad, measurement can be performed in a wide area, and then the conductor pattern is cut. Since it is used as an integrated circuit element mounting pad, the number of pads provided in the second recess can be reduced. Therefore, measurement can be easily performed even if miniaturization progresses.

(First embodiment)
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1A is a cross-sectional view showing an example of a piezoelectric oscillator according to the first embodiment of the present invention, and FIG. 1B is a view showing an example of a container body in which an integrated circuit element is mounted. .
In each drawing, for clarity of explanation, a part of the structure is not shown, and some dimensions are exaggerated. In particular, the thickness dimension in each figure is exaggerated.

  As shown in FIG. 1, the piezoelectric oscillator 10 according to the first embodiment of the present invention includes a container body 11 including a substrate body 12, a first frame portion 13, and a second frame portion 15, and a piezoelectric vibration element 14. The integrated circuit element 16 and the lid 20 are mainly configured. In the piezoelectric oscillator 10 shown in FIG. 1, the piezoelectric vibration element 14 is disposed in a first recess 18 formed by providing a first frame portion 13 on one main surface (hereinafter referred to as “upper surface”) of a substrate body 12. The second recess formed by mounting, hermetically sealing the first recess 18 with the lid 20, and providing the second frame portion 15 on the other main surface (hereinafter referred to as “lower surface”) of the substrate body 12. The integrated circuit element 16 is mounted in 28. In addition, external connection electrode terminals 19 for electrical connection to an external substrate body such as a mother board of an electronic device are provided at the four corners of the second frame portion 15 provided on the lower surface of the substrate body 12. .

The container body 11 includes, for example, a substrate body 12 made of a ceramic material such as glass-ceramic and alumina ceramic, and a first frame portion 13 and a second frame portion 15 made of a ceramic material similar to the substrate body 12. The substrate body 12, the first frame portion 13, and the second frame portion 15 are integrally formed. By providing the first frame portion 13 on the upper surface of the substrate body 12, the first recess 18 is formed on the upper surface side of the substrate body 12. Similarly, a second recess 28 is formed on the lower surface side of the substrate body 12. A piezoelectric vibration element mounting pad 24 is provided on the bottom surface of the first recess 18 in the first recess 18, that is, on the upper surface of the substrate body 12. The piezoelectric vibration element 14 is mounted on the piezoelectric vibration element mounting pad 24 via the conductive bonding material 21.
The first recess 18 in which the piezoelectric vibration element 14 is mounted is placed and fixed on the annular exposed side surface of the first frame 13 so as to cover the opening of the first recess 18. It is hermetically sealed by a rectangular flat lid 20 made of 42 alloy, Kovar, phosphor bronze or the like. Here, a portion constituted by the container body 11, the piezoelectric vibration element 14, and the lid body 20 is referred to as a vibrator portion.
In addition, the container body 11 is good also as a structure which provided the 1st frame part which consists of a seal ring, and the 2nd frame part in the board | substrate body 12, for example.

  In addition, the piezoelectric vibration element 14 mounted in the first recess 18 is formed of a rectangular flat plate piece, and for example, quartz is used as the piezoelectric material. The piezoelectric vibrating element 14 is subjected to outer shape processing on a crystal base plate cut out from an artificial crystalline lens at a predetermined cut angle to form a desired flat rectangular crystal piece, and a pair of opposite faces on both front and back main surfaces of the crystal piece. The excitation electrode is formed by deposition. When a fluctuation voltage from the outside is applied to the piezoelectric vibrating element 14 via a pair of excitation electrodes, a vibration in a predetermined vibration mode is generated at a predetermined frequency.

Further, as shown in FIG. 1, a plurality of integrated circuit element mounting pads 22 are formed at predetermined positions in the second recess 28 on the lower surface of the substrate body 12. On the integrated circuit element mounting pad 22, the integrated circuit element 16 is disposed via a conductive bonding material 23 such as a conductive adhesive, bumps such as solder or gold. The integrated circuit element 16 is mechanically and electrically connected and fixed to the integrated circuit element mounting pad 22 by, for example, a conductive bonding material 23.
The integrated circuit element mounting pad 22 is formed by cutting two strip-shaped conductor patterns in parallel, that is, two parallel pairs.

Further, the integrated circuit element 16 has a memory that stores temperature compensation data for compensating the temperature characteristics of the piezoelectric vibration element 14 on the circuit forming surface, and a temperature sensing element that detects the ambient temperature state, based on the temperature compensation data. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibration element 14 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit Is output to the outside of the piezoelectric oscillator and then used as a reference signal such as a clock signal.
Note that after the integrated circuit element 16 is mounted on the integrated circuit element mounting pad 22, the resin J may be filled in the second recess 28 so as to cover the circuit formation surface.

  Next, a method for manufacturing a piezoelectric oscillator according to the present invention will be described. 2A is a view showing an example of a conductor pattern, FIG. 2B is a view showing a state in which the conductor pattern is cut, and FIG. 2C is a view showing the integrated circuit element mounting pad by cutting the conductor pattern. It is a figure which shows the state which provided the electrically conductive paste in the state which carried out, (d) is a figure which shows the state which mounted the integrated circuit element in the integrated circuit element mounting pad.

(Container manufacturing process)
In the container body manufacturing process, the piezoelectric vibration element mounting pad 24 for mounting the piezoelectric vibration element 14 on one main surface of the substrate body 12 and the integrated circuit element 16 on the other main surface are mounted to measure the piezoelectric vibration element 14. This is a process of manufacturing the container body 11 having the conductor pattern 25 provided in parallel with the two strips used.
In this container body manufacturing process,
The container body 11 is manufactured so as to electrically connect the conductor pattern 25 and the piezoelectric vibration element mounting pad 24.

(Transducer part forming process)
In the vibrator part forming step, the piezoelectric vibration element 14 is mounted on the piezoelectric vibration element mounting pad 24 provided in the first concave part 18, and the first concave part 18 is hermetically sealed with the lid body 20. It is a process of forming.
In this vibrator portion forming step, the integrated circuit element 16 is not mounted and the second recess 28 is vacant.

(Piezoelectric vibration element measurement process)
The piezoelectric vibration element measurement step is a step of measuring the piezoelectric vibration element 14 using the conductor pattern 25 in a state where the conductor pattern 25 and the piezoelectric vibration element mounting pad 24 are electrically connected. In this measurement, a measurement pin (not shown) such as a probe pin is brought into contact with the conductor pattern 25 to measure the electrical characteristics of the piezoelectric vibration element 14 (see FIG. 2A).

(Integrated circuit element mounting pad formation process)
The integrated circuit element mounting pad forming step is a step of cutting the conductor pattern 25 to form the integrated circuit element mounting pad 22 for mounting the integrated circuit element 16. The conductor pattern 25 is cut by irradiating the cut portion with a laser beam. The width for cutting the conductor pattern 25 is, for example, about 50 μm, and the laser beam is continuously irradiated along the set cutting line until the desired cutting width is reached (see FIG. 2B). A pad 22 is formed.
In addition, after the conductor pattern 25 is cut, a laser mark (not shown) may remain on the surface of the substrate body 12 inside the second recess 28.
The integrated circuit element mounting pad 22 shown in FIG. 2 includes, for example, two pads that are connected to the piezoelectric vibration element 14 at the upper and lower stages on the right side in plan view, the upper left stage is output, the lower left stage is GND, the upper center stage is Vcc, and the lower center stage. May be used as Vcon. In this case, considering that the container body 11 becomes the integrated circuit element mounting pad 22 after the conductor pattern 25 is cut, various internal wirings (illustrated) may be provided in the container body 11.

(Integrated circuit element mounting process)
The integrated circuit element mounting step is a step of mounting the integrated circuit element 16 by applying a conductive paste 26 such as a solder paste on the integrated circuit element mounting pad 22. The conductive paste 26 is applied using a printing machine, a dispenser, or the like. Further, the mechanical and electrical connection between the integrated circuit element 16 and the integrated circuit element mounting pad 22 is performed by passing through a heating furnace such as a reflow furnace, heating and melting and then solidifying by cooling (FIGS. 2C and 2D). reference). Further, the mechanical and electrical connection between the integrated circuit element 16 and the integrated circuit element mounting pad 22 includes a bonding method such as an ultrasonic pressure welding method in which the conductive bonding material 23 and the integrated circuit element mounting pad 22 are pressed by ultrasonic waves. It is also possible to use it.

(Second embodiment)
The method for manufacturing a piezoelectric oscillator according to the second embodiment of the present invention differs from the first embodiment in that a collective substrate in which a plurality of container bodies 11 are arranged is used. At this time, the container body manufacturing process, the container body manufacturing process, the vibrator part forming process, the piezoelectric vibration element measuring process, and the integrated circuit element mounting pad forming process are performed in a state where the container body 11 is a collective substrate (FIG. 2 ( a) to FIG. 2 (d)).

(Individualization process)
In the individualizing process, the vibrator part forming process and the individualizing process are performed for each container body 11 after performing the piezoelectric vibration element measuring process, the integrated circuit element mounting pad forming process, and the integrated circuit element mounting process. It is a process of separating. Thereby, many piezoelectric oscillators 10 can be manufactured.

In addition, since the piezoelectric oscillator manufacturing method according to the present invention uses the conductor pattern 25 provided in parallel as two strips as a conventional monitor electrode pad, the piezoelectric vibrating element 14 can be measured in a wide area, and thereafter Since the conductor pattern 25 is cut and used as the integrated circuit element mounting pad 22, the number of pads provided in the second recess 28 can be reduced. Therefore, measurement can be facilitated even if miniaturization progresses.
As described above, the piezoelectric oscillator can be reduced in size as compared with the conventional structure, and as a result, the mounting area on an external substrate body such as a mother board can be reduced.

  In addition to the above, various changes and improvements can be made without departing from the scope of the present invention. For example, in the method for manufacturing a piezoelectric oscillator shown in the present embodiment, a laser beam is used for cutting the conductor pattern 25, but a cutting device such as a router may be used.

(A) is sectional drawing which showed an example of the piezoelectric oscillator which concerns on 1st embodiment of this invention, (b) is a figure which shows an example of the container body in the state which mounted the integrated circuit element. (A) is a figure which shows an example of a conductor pattern, (b) is a figure which shows the state which has cut | disconnected the conductor pattern, (c) is the state which cut | disconnected the conductor pattern and was used as the integrated circuit element mounting pad FIG. 6D is a diagram showing a state where a conductive paste is provided, and FIG. 8D is a diagram showing a state where an integrated circuit element is mounted on an integrated circuit element mounting pad. It is sectional drawing which showed the form of the conventional piezoelectric oscillator. It is a figure which shows the state of the container body before mounting an integrated circuit element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Piezoelectric oscillator 11 ... Container body 12 ... Substrate body 13 ... 1st frame part 14 ... Piezoelectric vibration element 15 ... 2nd frame part 16 ... Integrated circuit element DESCRIPTION OF SYMBOLS 18 ... 1st recessed part 19 ... Electrode terminal for external connection 20 ... Lid body 21 ... Conductive joining material 22 ... Integrated circuit element mounting pad 23 ... Conductive joining material 24. ..Piezoelectric vibration element mounting pad 25 ... Conductor pattern 26 ... Conductive paste 28 ... Second recess

Claims (3)

Frame portions are provided on both main surfaces of the substrate body, and a piezoelectric vibration element is mounted in the first recess of the container body in which the first recess and the second recess are formed, and hermetically sealed with a lid. A method of manufacturing a piezoelectric oscillator comprising an integrated circuit element mounted on the second recess,
A piezoelectric vibration element mounting pad for mounting the piezoelectric vibration element on one main surface of the substrate body and two integrated parallel lines used for measurement of the piezoelectric vibration element by mounting the integrated circuit element on the other main surface. A container body manufacturing process for manufacturing the container body having a conductor pattern;
A vibrator part forming step of mounting a piezoelectric vibration element on a mounting pad provided in the first concave part and hermetically sealing the first concave part with a lid to form a vibrator part;
A piezoelectric vibration element measuring step in which the conductor pattern and the mounting pad are electrically connected, and the piezoelectric vibration element is measured using the conductor pattern;
An integrated circuit element mounting pad forming step of forming an integrated circuit element mounting pad for cutting the conductor pattern and mounting the integrated circuit element;
An integrated circuit element mounting step of mounting an integrated circuit element on the integrated circuit element mounting pad;
A method for manufacturing a piezoelectric oscillator, comprising:   The container body manufacturing step is a step of manufacturing a collective substrate in which a plurality of the container bodies are arranged, and the vibrator portion forming step and the piezoelectric vibration element measurement are performed for each of the container bodies constituting the collective substrate. 2. The method according to claim 1, further comprising: an individualizing step of performing a process, the integrated circuit element mounting pad forming process, and the integrated circuit element mounting process to separate each container body. A method for manufacturing a piezoelectric oscillator.   3. The method of manufacturing a piezoelectric oscillator according to claim 1, wherein a laser beam is used for cutting the conductor pattern in the integrated circuit element mounting pad forming step.

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