JP2010213015A - Piezoelectric device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device in which reliability is improved by preventing or suppressing a package from being deviated from a predetermined position with respect to a mount substrate, and a manufacturing method of the piezoelectric device. <P>SOLUTION: A piezoelectric device 1 includes a package 3 housing a piezoelectric vibrating chip 2 therein, a mount substrate 4, spacers 51-54 forming a gap between the package 3 and the mount substrate 4, and an electronic component 6. Among the spacers 51-54, the spacers 51, 52 are fixed in the package 3 by a brazing metal 7 and the spacers 53, 54 are fixed in the package 3 by a thermosetting adhesive 8. The spacers 53, 54 and the package 3 are fixed by the thermosetting adhesive 8 prior to fixing the spacers 51, 52 and the package 3 using the brazing metal 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric device and a manufacturing method thereof.

As a piezoelectric device, an electronic component constituting a crystal oscillator circuit is provided on a support substrate, and the crystal resonator is fixed to the support substrate via a spacer so that the crystal resonator is positioned above the electronic component. The thing of a structure is known (refer patent document 1).
The piezoelectric device (piezoelectric oscillator) of Patent Document 1 includes a package that houses a piezoelectric vibrating piece therein, a circuit board that fixes the package via a connection member (spacer), a circuit board formed by the connection member, and a package. And an integrated circuit (IC) mounted on a circuit board so as to be located in the space between them.
In such a piezoelectric device, a spherical member having a high melting point is used as a connecting member, and a solder ball coated with a conductive member (solder) having a low melting point is used as a connecting member. The package can be supported by the core while being electrically connected with solder.

However, in such a piezoelectric device, the package is likely to be displaced with respect to the circuit board until the solder of the connection member is melted and solidified and the connection member, the circuit board, and the connection member and the package are joined to each other. In particular, the melting of the four connecting members does not necessarily occur simultaneously, and when the melting start time of the four connecting members shifts, the package is displaced in the surface direction around the connecting member that is melted last.
As described above, the piezoelectric device disclosed in Patent Document 1 has a problem that the arrangement position of the package is deviated from the predetermined position. If the arrangement position of the package is deviated from the predetermined position, for example, the circuit board and the piezoelectric vibrating piece cannot be electrically connected, or the piezoelectric device is enlarged (deformed).

JP 2008-104151 A

  An object of the present invention is to provide a highly reliable piezoelectric device and a method for manufacturing a piezoelectric device that prevent or suppress a shift of a package from a predetermined position.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
A piezoelectric device of the present invention includes a package containing a piezoelectric vibrating piece,
A mounting substrate for mounting the package;
A plurality of spacers provided between the package and the mounting substrate, and forming a gap between the package and the mounting substrate;
An electronic component that is disposed so as to be positioned in the gap and drives the piezoelectric vibrating piece,
Have
At least one of the plurality of spacers is fixed to the package by a first fixing material, and at least one of the other spacers is fixed to the package by a second fixing material;
The first fixing material is a metal braze;
The second fixing material is an adhesive that adheres and fixes the spacer and the package prior to the first fixing material.
Thereby, the shift | offset | difference from the predetermined position of a package can be prevented or suppressed, and a highly reliable piezoelectric device is obtained.

[Application Example 2]
A piezoelectric device of the present invention includes a package containing a piezoelectric vibrating piece,
A mounting substrate for mounting the package;
A plurality of spacers provided between the package and the mounting substrate, and forming a gap between the package and the mounting substrate;
An electronic component that is disposed so as to be positioned in the gap and drives the piezoelectric vibrating piece,
Have
At least one of the plurality of spacers is fixed to the package by a first fixing material, and at least one of the other spacers is fixed to the package by a second fixing material;
The first fixing material is a metal braze;
The second fixing material is an adhesive that bonds and fixes the spacer and the package prior to the first fixing material,
The adhesive is a thermosetting adhesive having a curing temperature lower than the melting point of the metal brazing.
Accordingly, the thermosetting adhesive can be cured without melting the metal brazing by heating to a temperature not lower than the curing temperature of the thermosetting adhesive and not higher than the melting point of the metal brazing. Therefore, it is possible to simply fix the spacer and the package with the thermosetting adhesive prior to fixing the spacer and the package with the metal brazing.

[Application Example 3]
In the piezoelectric device of the present invention, it is preferable that the curing temperature of the adhesive is 10 degrees or more lower than the melting point of the metal brazing.
Thereby, although the metal brazing does not melt, the thermosetting adhesive can ensure a relatively wide temperature range for curing.

[Application Example 4]
In the piezoelectric device of the present invention, the spacer fixed to the package through the second fixing material among the plurality of spacers includes a spherical core and solder formed so as to cover the surface of the core It is preferable to have.
As a result, the package can be fixed to the mounting substrate via solder while exhibiting a function as a spacer (that is, a function of forming a gap for providing an electronic component between the package and the mounting substrate) at the core. it can.

[Application Example 5]
In the piezoelectric device according to the aspect of the invention, it is preferable that the spacer and the adhesive fixed to the package via the second fixing material among the plurality of spacers have conductivity.
Accordingly, the electronic component and the piezoelectric vibrating piece can be electrically connected through the posture stabilizing spacer.

[Application Example 6]
A method for manufacturing a piezoelectric device of the present invention is a method for manufacturing a piezoelectric device in which a package containing a piezoelectric vibrating piece is mounted on a mounting substrate via a plurality of spacers,
A first step of fixing at least one of the plurality of spacers to the package via an adhesive;
After the first step, among the plurality of spacers, at least one of the spacers other than the spacer fixed to the package via the adhesive is fixed to the package via a metal braze. And a second step.
Thereby, the shift | offset | difference from the predetermined position of a package can be prevented or suppressed, and a highly reliable piezoelectric device can be manufactured.

[Application Example 7]
In the piezoelectric device manufacturing method of the present invention, the adhesive is a thermosetting adhesive having a curing temperature lower than the melting point of the metal brazing,
The first step is preferably performed by heating to a temperature higher than the curing temperature of the thermosetting adhesive and lower than the melting point of the metal brazing.
Accordingly, the thermosetting adhesive can be cured without melting the metal brazing by heating to a temperature not lower than the curing temperature of the thermosetting adhesive and not higher than the melting point of the metal brazing. Therefore, it is possible to simply fix the spacer and the package with the thermosetting adhesive prior to fixing the spacer and the package with the metal brazing.

[Application Example 8]
In the method for manufacturing a piezoelectric device of the present invention, it is preferable that the curing temperature of the adhesive is 10 degrees or more lower than the melting point of the metal brazing.
Thereby, although the metal brazing does not melt, the thermosetting adhesive can ensure a relatively wide temperature range for curing.

It is sectional drawing which shows 1st Embodiment of the piezoelectric device of this invention. FIG. 2 is a top view and a bottom view of a package included in the piezoelectric device shown in FIG. 1. It is a top view of the mounting substrate with which the piezoelectric device shown in FIG. 1 is provided. It is sectional drawing of the spacer with which the piezoelectric device shown in FIG. 1 is provided. It is sectional drawing which shows the state which molded the piezoelectric device shown in FIG. It is sectional drawing explaining the manufacturing method of the piezoelectric device shown in FIG. It is sectional drawing explaining the manufacturing method of the piezoelectric device shown in FIG. It is sectional drawing explaining the manufacturing method of the piezoelectric device shown in FIG. It is a bottom view of the package with which the piezoelectric device which concerns on 2nd Embodiment of this invention is provided. FIG. 10 is a top view of a mounting substrate included in the piezoelectric device shown in FIG. 9. It is a bottom view of the package with which the piezoelectric device which concerns on 3rd Embodiment of this invention is provided. It is a top view of the mounting substrate with which the piezoelectric device shown in FIG. 11 is provided.

Hereinafter, a piezoelectric device of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
<First Embodiment>
First, a first embodiment of the piezoelectric device of the present invention will be described.
1 is a cross-sectional view showing a first embodiment of the piezoelectric device of the present invention, FIG. 2 is a top view and a bottom view of a package included in the piezoelectric device shown in FIG. 1, and FIG. 3 is a diagram of the piezoelectric device shown in FIG. FIG. 4 is a cross-sectional view of a spacer provided in the piezoelectric device shown in FIG. 1, FIG. 5 is a cross-sectional view showing a state in which the piezoelectric device shown in FIG. 1 is molded, and FIGS. FIG. 6 is a cross-sectional view illustrating a method for manufacturing the piezoelectric device shown in FIG. 5. In FIG. 3, illustration of a wiring pattern 42 described later is omitted. In the following description, the upper side in FIGS. 1 to 8 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.
A piezoelectric device 1 shown in FIG. 1 includes a package 3 that accommodates a piezoelectric vibrating piece 2, a mounting substrate 4 that mounts (fixes and supports) the package 3 via spacers 51 to 54, and between the package 3 and the mounting substrate 4. And the electronic component 6 provided on the mounting substrate 4 so as to be positioned at the position. Hereinafter, these will be described in detail in order.

First, the piezoelectric vibrating piece 2 will be described.
In the present embodiment, the piezoelectric vibrating piece 2 is a surface acoustic wave element. As shown in FIG. 2, the surface acoustic wave element 2 includes a piezoelectric substrate 21 having a longitudinal shape, an IDT (comb electrode) 22 provided on the piezoelectric substrate 21, and a pair disposed on both sides of the IDT 22. Reflectors 23a and 23b.

The piezoelectric substrate 21 is made of quartz. By configuring the piezoelectric substrate 21 with quartz, excellent temperature characteristics can be exhibited. The piezoelectric substrate 21 may be made of a piezoelectric material other than quartz, such as lithium tantalate, lithium niobate, lithium tetraborate, and the like.
The IDT 22 is provided at the center of the piezoelectric substrate 21. The IDT 22 includes a pair of electrodes 22a and 22b. The pair of electrodes 22a and 22b are arranged so that the electrode finger 221a of the electrode 22a and the electrode finger 221b of the electrode 22b are engaged with each other. When a voltage is applied between the pair of electrodes 22a and 22b, periodic distortion occurs between the electrode fingers 221a and 221b due to the piezoelectric effect of the piezoelectric substrate 21, and the surface acoustic wave is excited. The excited surface acoustic wave propagates along the continuous direction of the electrode fingers 221a and 221b (that is, the longitudinal direction of the piezoelectric substrate 21).
The pair of reflectors 23a and 23b are arranged on both sides of the IDT 22 in the above-described propagation direction of the surface acoustic wave. Such reflectors 23a and 23b have a function of reflecting the surface acoustic wave propagating to the piezoelectric substrate 21 and confining it between the reflectors 23a and 23b.

  The IDT 22 and the reflectors 23a and 23b are formed so as to be shifted to one end side in the longitudinal direction of the piezoelectric substrate 21 (right end side in FIG. 2). A pair of extraction electrodes 24 a and 24 b are formed on the other end side (left end side in FIG. 2) of the piezoelectric substrate 21. The extraction electrodes 24a and 24b are each formed so as to go from the upper surface (the surface on which the IDT 22 is formed) of the piezoelectric substrate 21 to the lower surface via the side surface. The extraction electrode 24a is electrically connected to the electrode 22a, and the extraction electrode 24b is electrically connected to the electrode 22b.

The IDT 22, the reflectors 23a and 23b, and the extraction electrodes 24a and 24b can be formed of a metal material having excellent conductivity such as aluminum and aluminum alloy, respectively.
By providing such a surface acoustic wave element 2, the piezoelectric device 1 can constitute a SAW device such as a SAW oscillator.

Next, the package 3 that houses and fixes the surface acoustic wave element 2 will be described.
The package 3 has a substantially rectangular shape in plan view. Such a package 3 has a plate-like base substrate 31, a frame-like frame member 32, and a plate-like lid member 33, and the base substrate 31, the frame member 32, the lid member 33, and However, they are stacked in this order from the mounting substrate 4 side. The base substrate 31 and the frame member 32, and the frame member 32 and the lid member 33 are bonded to each other through, for example, an adhesive or a brazing material. The package 3 accommodates the surface acoustic wave element 2 in the internal space S defined by the base substrate 31, the frame member 32 and the lid member 33.

As a constituent material of such a base substrate 31, those having insulating properties (non-conductive) are preferable. For example, various ceramics such as various glasses, oxide ceramics, nitride ceramics, carbide ceramics, polyimide Various resin materials such as can be used.
Moreover, as a constituent material of the frame member 32 and the lid member 33, the same constituent material as the base substrate 31, various metal materials such as Al and Cu, various glass materials, and the like can be used, for example.

  As shown in FIGS. 1 and 2, a pair of internal terminals 34 a and 34 b are formed on the upper surface of the base substrate 31 so as to be exposed to the internal space S. On the internal terminals 34a and 34b, epoxy-type and polyimide-type conductive adhesives 39a and 39b are respectively applied (stacked), and further, on the conductive adhesives 39a and 39b. The surface acoustic wave element 2 described above is placed with the surface on which the IDT 22 and the like are formed facing upward (the lid member 33 side). Then, the surface acoustic wave element 2 is fixed to the internal terminals 34a and 34b (base substrate 31) by curing the conductive adhesives 39a and 39b.

  This fixing is performed such that the conductive adhesive 39a contacts the extraction electrode 24a and the conductive adhesive 39b contacts the extraction electrode 24b. As a result, the surface acoustic wave element 2 is fixed to the base substrate 31 via the conductive adhesives 39a and 39b, and the extraction electrode 24a and the internal terminal 34a are electrically connected via the conductive adhesive 39a. The lead electrode 24b and the internal terminal 34b are electrically connected through the conductive adhesive 39b.

As shown in FIG. 2, four external terminals 35a, 35b, 35c, and 35d are provided on the lower surface of the base substrate 31 so as to be positioned in the vicinity of the four corners. These external terminals 35a to 35d are positioned so as to face four connection terminals 41a to 41d, which will be described later, provided on the mounting substrate 4, respectively.
Out of the four external terminals 35a to 35d, the external terminals 35a and 35b are hot terminals that are electrically connected to the internal terminals 34a and 34b through via holes formed in the base substrate 31, respectively. The other two external terminals 35c and 35d are dummy terminals for increasing the bonding strength (the bonding strength between the spacers 51 to 54 and the package 3) when the package 3 is mounted on the mounting substrate 4, respectively.
Such internal terminals 34a and 34b and external terminals 35a to 35d can be formed, for example, by applying gold plating to an underlying layer of tungsten and nickel plating.

Next, the mounting substrate 4 on which the above package 3 is mounted (fixed) will be described. As shown in FIG. 3, the mounting substrate 4 has a substantially rectangular shape in plan view. Further, the mounting substrate 4 is formed slightly larger than the base substrate 31 of the package 3 described above.
The mounting substrate 4 may be a rigid substrate, a flexible substrate, or a rigid flexible substrate. In addition, the constituent material of the mounting substrate 4 is preferably an insulating (non-conductive) material, for example, various ceramics such as various glasses, oxide ceramics, nitride ceramics, carbide ceramics, polyimide, etc. Various resin materials can be used.

As shown in FIGS. 1 to 3, four connection terminals 41 a, 41 b, 41 c, 41 d and a wiring pattern 42 are formed on the upper surface (the surface on the package 3 side) of the mounting substrate 4. In FIG. 3, the wiring pattern 42 is not shown.
The four connection terminals 41a to 41d are formed near the corners of the mounting substrate 4 so as to face the external terminals 35a to 35d of the package 3, respectively. Of these connection terminals 41a to 41d, connection terminals 41a and 41b corresponding to external terminals (hot terminals) 35a and 35b are electrically connected to the wiring pattern 42, respectively.

On the other hand, as shown in FIG. 1, on the lower surface of the mounting substrate 4, for example, a plurality of mounting terminals 43 that are electrically and mechanically connected to a circuit board (not shown) on which the piezoelectric device 1 is mounted are formed. . Each mounting terminal 43 is electrically connected to the wiring pattern 42 through a via hole formed in the mounting substrate 4.
In addition, on the lower surface of the mounting substrate 4, it is possible to perform characteristic inspection of the electronic component 6 and rewrite (adjustment) of various information inside the electronic component 6 (for example, temperature compensation information of the piezoelectric device 1) as necessary. A write terminal may be formed.

  An electronic component 6 is mounted (placed) on the center of the upper surface of the mounting substrate 4. The electronic component 6 is, for example, an integrated circuit element (hereinafter also simply referred to as “IC”) as a circuit element for driving the surface acoustic wave element 2. As shown in FIG. 1, the IC 6 is fixed to the mounting substrate 4 with an insulating (non-conductive) adhesive or an adhesive member 44 such as an adhesive sheet, and further, with a metal wire (bonding wire) 45, The wiring pattern 42 is electrically connected. Thereby, each terminal (connection terminal 41a, 41b and mounting terminal 43) and IC6 are electrically connected via the wiring pattern 42. FIG.

  The mounting substrate 4 fixes the package 3 on the upper surface side via spacers 51 to 54. The spacers 51 to 54 are arranged around the IC 6 and form a gap for mounting the IC 6 and the like between the mounting substrate 4 and the package 3. Thereby, since the package 3 and the IC 6 can be stacked (stacked) in the height direction of the piezoelectric device 1, the size of the piezoelectric device 1 can be reduced.

As shown in FIG. 3, among the four spacers 51 to 54, the spacer 51 is provided on the connection terminal 41a of the mounting substrate 4, the spacer 52 is provided on the connection terminal 41b, and the spacer 53 is provided. Is provided on the connection terminal 41c, and the spacer 54 is provided on the connection terminal 41d.
These four spacers are for forming a gap for mounting the IC 6 between the mounting substrate 4 and the package 3 as described above. Further, the spacers 51 and 52 are the IC 6 and the piezoelectric vibrating piece. The spacers 53 and 54 also have a function as a posture stabilization spacer that stabilizes the posture of the package 3.

Hereinafter, although the structure of these spacers 51-54 is demonstrated concretely, since these spacers 51-54 are respectively the same structures, it demonstrates on behalf of the spacer 51, and about the spacers 52-54, Description is omitted.
As shown in FIG. 4, the spacer 51 is substantially spherical. Such a spacer 51 includes a spherical nucleus 511 and solder (conductive material layer) 512 coated on the surface of the nucleus 511. The core 511 has a melting point higher than that of the solder 512. The constituent material of the core 511 is not particularly limited as long as the material is higher than the melting point of the solder 512. For example, various metal materials such as gold, silver, and copper can be used.

  As will be described later, the spacer 51 is heated to a melting point of the solder 512 or higher and lower than the melting point of the core 511, and the solder 512 is melted and solidified, whereby the core 511 functions as a spacer (that is, package 3 and mounting). The package 3 can be fixed (fixed) to the mounting substrate 4 via the solder 512 while exhibiting the function of forming a gap for providing the IC 6 between the substrate 4 and the substrate 4.

  Among the spacers 51 to 54 having such a configuration, the spacers (electrical connection spacers) 51 and 52 corresponding to the hot terminals 35a and 35b of the package 3 are metal brazing (first fixing member) having conductivity such as solder. ) 7 are fixed (fixed) to the hot terminals 35a and 35b by spacers 7, and the spacers (posture stabilizing spacers) 53 and 54 corresponding to the dummy terminals 35c and 35d are respectively thermosetting adhesives (second fixing members). 8 is fixed (fixed) to the dummy terminals 35c and 35d.

  Here, the fixing of the spacers 53 and 54 and the dummy terminals 35c and 35d by the thermosetting adhesive 8 is performed prior to the fixing of the spacers 51 and 52 and the hot terminals 35a and 35b by the metal brazing 7. Thereby, at the time of manufacturing the piezoelectric device 1, unintentional displacement (displacement from a predetermined position) of the package 3 can be prevented or suppressed, and the reliability of the piezoelectric device 1 is improved. This will be described in detail together with the description of the piezoelectric device manufacturing method described later.

  In particular, in the present embodiment, the spacers 51 and 52 and the hot terminals 35a and 35b are fixed by the metal brazing 7 having conductivity. Therefore, the unintentional displacement of the package 3 described above can be prevented when the piezoelectric device 1 is manufactured, and the IC 6 and the piezoelectric vibrating piece 2 can be electrically connected easily. As a result, the manufacturing process of the piezoelectric device 1 can be simplified.

  The curing temperature of the thermosetting adhesive 8 is lower than the melting point of the metal brazing 7 and is, for example, about 150 degrees. Accordingly, the thermosetting adhesive 8 is cured without melting the metal brazing 7 by heating to a temperature not lower than the curing temperature of the thermosetting adhesive 8 and not higher than the melting point of the metal brazing 7, and the spacer 53, Only 54 can be fixed to the package 3. That is, simply by adjusting the heating temperature, the spacers 53 and 54 and the package 3 are fixed by the thermosetting adhesive 8 prior to the fixing of the spacers 51 and 52 and the package 3 by the metal brazing 7. be able to.

The curing temperature of the thermosetting adhesive 8 is not particularly limited as long as it is lower than the melting point of the metal braze 7, but is preferably 10 degrees or more lower than the melting point of the metal braze 7, and more preferably 20 degrees or more. . As a result, the metal braze 7 does not melt, but the thermosetting adhesive 8 can ensure a relatively wide temperature range for curing, and the metal braze 7 can be used to more easily fix the spacers 51 and 52 to the package 3. Prior to this, the spacers 53 and 54 and the package 3 can be fixed by the thermosetting adhesive 8.
Such a thermosetting adhesive 8 is not particularly limited, and for example, an epoxy-based adhesive or the like can be used.
The piezoelectric device 1 according to the present embodiment has been described above. As shown in FIG. 5, the molding material 9 made of a fluid resin is poured into the piezoelectric device 1, and the lid member 33 of the package 3 is poured. The entire piezoelectric device 1 may be covered with the molding material 9 so that the upper surface and the lower surface of the mounting substrate 4 are exposed to the outside.

Next, a manufacturing method of the piezoelectric device 1 (a manufacturing method of the piezoelectric device of the present invention) will be described.
The manufacturing method of the piezoelectric device 1 includes: [1] A process of mounting the IC 6 on the mounting substrate 4 and electrically connecting the IC 6 and the wiring pattern 42; [2] spacers to the connection terminals 41a to 41d, respectively. 51-54 is mounted, and the metal brazing 7 is applied to the tops of the spacers 51, 52 and the thermosetting adhesive 8 is applied to the tops of the spacers 53, 54, and [3] spacers 51-54. C process (first process) in which the spacers 53 and 54 and the package 3 are fixed (fixed) in a state where the package is placed thereon, and [4] the spacers 51 and 52 and the package 3 are fixed (fixed). ) D process (second process) and [5] E process for filling the gap between the package 3 and the mounting substrate 4 with the molding material 9. Hereinafter, these steps will be described in detail.

[1] Step A First, as shown in FIG. 6A, the connection terminals 41a to 41d and the wiring pattern 42 are formed on the upper surface, and the mounting terminal 43 that is electrically connected to the wiring pattern 42 through the via hole is formed on the lower surface. A mounting substrate 4 is prepared. The connection terminals 41a to 41d and the wiring pattern 42 are formed, for example, by forming a conductive film (metal film) on the upper surface of the mounting substrate 4 by sputtering or the like, and etching to remove unnecessary portions of the conductive film (connection terminals 41a to 41d and It can be formed by removing a portion that does not correspond to the wiring pattern 42. The mounting terminal 43 can be formed in the same manner.

  Next, as shown in FIG. 6B, the IC 6 is placed on the upper surface of the mounting substrate 4 via an adhesive member 44 that is an adhesive, and the adhesive member 44 is solidified, whereby the IC 6 is mounted on the mounting substrate 4. Secure (fix). Thereafter, the IC 6 and the wiring pattern 42 are electrically connected by wire bonding (bonding wire 45). The wire bonding is not particularly limited, and various types of bonding such as ball bonding and wedge bonding can be used. Note that the electrical connection between the IC 6 and the wiring pattern 42 may be performed, for example, via a solder ball (that is, by BGA).

[2] Step B As shown in FIG. 6C, the spacers 51 to 54 are placed on the connection terminals 41 a to 41 d of the mounting substrate 4, respectively. Next, as shown in FIG. 6 (d), the paste-like metal braze 7 is applied to the tops of the spacers 51 and 52, and the thermosetting adhesive 8 is applied to the tops of the spacers 53 and 54. Next, as shown in FIG. 7A, the package 3 containing the piezoelectric vibrating reed 2 is placed on the spacers 51 to 54 from above the mounting substrate 4. At this time, the package 3 is mounted so that the hot terminals 35a and 35b of the package 3 are aligned with the spacers 51 and 52 and the dummy terminals 35c and 35d are aligned with the spacers 53 and 54.

[3] Step C By heating to a temperature not lower than the curing temperature of the thermosetting adhesive 8 and not higher than the melting point of the metal brazing 7 to cure the thermosetting adhesive 8, as shown in FIG. The spacers 53 and 54 and the package 3 are fixed by the thermosetting adhesive 8. Thereby, the unintentional displacement to the surface direction of the package 3 is prevented (suppressed).

[4] Step D By heating to a temperature equal to or higher than the melting point of the metal brazing 7 and melting and solidifying the metal brazing 7, the spacers 51, 52 and the package 3 are joined to the metal brazing 7 as shown in FIG. It sticks through. Further, in the step D, the metal brazing 7 is melted and the solders of the spacers 51 to 54 (for example, the solder 512 of the spacer 51) are also melted, whereby the spacers 51 to 54 and the connection terminals 41a to 41c are connected. Stick. In particular, in the spacer 51, the metal braze 7 and the solder 512 are compatible, and the spacer 51 and the package 3 are firmly fixed via the metal braze 7 (the same applies to the spacer 52).

From this point of view, it is preferable that the metal braze 7 and the solder (for example, solder 512) of each of the spacers 51 to 54 are mainly composed of the same material (for example, a metal material such as silver). . As a result, the melting points of the solder of the metal braze 7 and each of the spacers 51 to 54 can be made almost equal, and the metal braze 7 and the solder 512 can be melted almost simultaneously, so that the fixing can be performed more easily. it can. Further, the compatibility between the metal braze 7 and the solder is improved, and the bonding strength of these is also improved.
In this way, the package 3 is fixed to the mounting substrate 4 via the spacers 51 to 54, and the mounting of the package 3 on the mounting substrate 4 is completed, whereby the piezoelectric device shown in FIG. 1 is obtained.

[5] Step E Finally, as shown in FIG. 8A, the gap (space) between the package 3 and the mounting substrate 4 is filled with a molding material 9 and solidified. Thereby, the piezoelectric device 1 shown in FIG. 5 is obtained.
The piezoelectric device 1 can be manufactured as described above. This step D may be omitted.
The method for manufacturing the piezoelectric device 1 has been described above.

  Here, as in the conventional case, when all the spacers and the package are joined via the metal brazing (that is, when the joining of the spacer and the package is performed in one stage), the viscosity of the metal braze is melted to melt the viscosity. The package is easily displaced with respect to the spacer due to the decrease in the viscosity. In particular, when the melting start time differs between the metal brazing provided in each spacer, the package displacement (positional deviation) becomes significant. Therefore, in the conventional method, it is difficult to arrange the package at a desired position, and it is difficult to obtain a highly reliable piezoelectric device.

On the other hand, in the present invention, as described above, the thermosetting adhesive is first cured in a state where the metal brazing is not melted, and the fixing between the spacer (posture stabilizing spacer) and the package is completed. Thereafter, the metal brazing is melted and solidified to complete the fixing between the spacer (electrical connection spacer) and the package. Thus, before melting the metal brazing, the spacer (posture stabilizing spacer) and the package are fixed, and the package is not displaced (is difficult to occur), so that the package when the metal brazing 7 is melted is obtained. Is effectively prevented. Therefore, according to the method for manufacturing a piezoelectric device of the present invention, the package can be arranged at a predetermined position, and a highly reliable piezoelectric device can be manufactured.
In particular, in the present embodiment, since the curing temperature of the thermosetting adhesive 8 is lower than the melting point of the metal braze 7, as described in the step C, simply by adjusting the heating temperature, the metal braze 7 can be easily obtained. The spacers 53 and 54 and the package 3 can be fixed by the thermosetting adhesive 8 before the spacers 51 and 52 and the package 3 are fixed.

  In this embodiment, since the spacers (electrical connection spacers) 51 and 52 and the package 3 are fixed by the metal brazing 7, the IC 6 and the piezoelectric vibrating piece 2 are electrically connected via the spacers 51 and 52. Can be connected to. As described above, the metal brazing 7 is used for the spacers 51 and 52 used for the electrical connection between the IC 6 and the piezoelectric vibrating piece 2, and the thermosetting adhesive 8 is used for the other spacers 53 and 54. When the device 1 is manufactured, the above-described unintentional displacement of the package 3 can be prevented or suppressed, and the IC 6 and the piezoelectric vibrating piece 2 can be easily electrically connected.

<Second Embodiment>
Next, a second embodiment of the piezoelectric device of the present invention will be described.
9 is a bottom view of a package included in the piezoelectric device according to the second embodiment of the present invention, and FIG. 10 is a top view of a mounting substrate included in the piezoelectric device shown in FIG. In FIG. 10, the wiring pattern 42 is not shown. In the following description, the upper side in FIGS. 9 and 10 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.

Hereinafter, the piezoelectric device according to the second embodiment will be described focusing on the differences from the above-described embodiment, and description of similar matters will be omitted.
The piezoelectric device according to the second embodiment of the present invention is the same as that described above except that the arrangement of the external terminals 35a to 35d formed on the package 3 and the arrangement of the connection terminals 41a to 41d formed on the mounting substrate 4 are different. This is the same as the embodiment. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 9, four external terminals 35a to 35d are formed on the lower surface of the package 3 (the lower surface of the base substrate 31). Among these, the external terminals (hot terminals) 35a and 35b are formed so as to correspond to the diagonals of the package 3 (lower left corner and upper right corner in FIG. 9), and external terminals (dummy terminals) 35c and 35d. Is provided so as to correspond to a diagonal (an upper left corner and a lower right corner in FIG. 9) different from the diagonal on which the external terminals 35a and 35b are formed.

As shown in FIG. 10, the connection terminals 41 a to 41 d are formed on the mounting board 4 so as to face the external terminals 35 a to 35 d when the package 3 faces the mounting board, respectively. Furthermore, spacers 51 to 54 are provided on the connection terminals 41a to 41d, respectively.
Also according to the second embodiment, the same effects as those of the first embodiment can be obtained.

<Third Embodiment>
Next, a third embodiment of the piezoelectric device of the present invention will be described.
FIG. 11 is a bottom view of a package included in the piezoelectric device according to the third embodiment of the present invention, and FIG. 12 is a top view of a mounting substrate included in the piezoelectric device shown in FIG. In FIG. 12, the wiring pattern 42 is not shown. In FIG. 12, the wiring pattern 42 is not shown. In the following description, the upper side in FIGS. 11 and 12 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.

Hereinafter, the piezoelectric device according to the third embodiment will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.
The piezoelectric device according to the third embodiment of the present invention is the first embodiment described above except that the number and arrangement of external terminals formed on the package 3 are different from the number and arrangement of connection terminals formed on the mounting substrate 4. It is the same as the form. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 11, two external terminals 35a and 35b are formed on the lower surface of the package 3 (the lower surface of the base substrate 31). These external terminals 35 a and 35 b are hot terminals that are electrically connected to the piezoelectric vibrating piece 2. That is, in this embodiment, the dummy terminals 35c and 35d formed in the above-described embodiment are omitted. The external terminal 35a is formed on the left side in FIG. 11 of the lower surface of the package 3, and the external terminal 35b is formed on the right side in FIG.

  Also, as shown in FIG. 12, two connection terminals 41a and 41b are formed on the mounting board 4 so as to face the external terminals 35a and 35b when the package 3 faces the mounting board, respectively. Yes. Furthermore, spacers 51 and 53 are provided on the connection terminal 41a, and spacers 52 and 54 are provided on the connection terminal 41b. Here, the spacers 51 and 52 fixed to the package 3 by the metal braze 7 are provided so as to correspond to the diagonal of the mounting substrate 4, and the spacer 53 fixed to the package 3 by the thermosetting adhesive 8. , 54 are provided so as to correspond to a diagonal different from the diagonal provided with the spacers 51, 52.

In such a configuration, the external terminal 35 a and the connection terminal 41 a are electrically connected via the spacer 51 and the metal brazing 7, and the external terminal 35 b and the connection terminal 41 b are connected via the spacer 52 and the metal brazing 7. Electrically connected. Here, in order to further improve the electrical connection between the external terminal 35a and the connection terminal 41a, the thermosetting adhesive 8 preferably has conductivity. Thereby, the external terminal 35a and the connection terminal 41a can be electrically connected by the spacer 51 and the metal braze 7, and can also be electrically connected by the spacer 53 and the thermosetting adhesive 8. The same applies to the electrical connection between the external terminal 35b and the connection terminal 41b.
As the thermosetting adhesive 8 having conductivity, for example, a thermosetting adhesive containing conductive particles such as a silver filler can be used.
Also according to the third embodiment, the same effects as those of the first embodiment can be obtained.

As described above, the piezoelectric device and the manufacturing method of the piezoelectric device according to the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to these embodiments, and the configuration of each part may be any arbitrary function having the same function. It can be replaced with that of the configuration. Moreover, other arbitrary structures and processes may be added. Moreover, the piezoelectric device of the present invention may be a combination of any two or more configurations (features) of the above-described embodiments.
In the above-described embodiment, the configuration using the surface acoustic wave element as the piezoelectric vibrating piece has been described. However, the piezoelectric vibrating piece is not limited to this, for example, a gyro sensor using a piezoelectric body such as quartz, A tuning fork-type piezoelectric vibrating piece or a rectangular thickness-shear vibrating piece may be used.

  DESCRIPTION OF SYMBOLS 1 ... Piezoelectric device 2 ... Piezoelectric vibrating piece (surface acoustic wave element) 21 ... Piezoelectric substrate 22 ... IDT 22a, 22b ... Electrode 221a, 221b ... Electrode finger 23a, 23b ... Reflector 24a, 24b …… Extraction electrode 3 …… Package 31 …… Base substrate 32 …… Frame member 33 …… Cover member 34a, 34b …… Internal terminal 35a-35d …… External terminal 39a, 39b …… Conductive adhesive 4 …… Mounting Substrate 41a to 41d ... Connection terminal 42 ... Wiring pattern 43 ... Mounting terminal 44 ... Adhesive member 45 ... Bonding wire 51-54 ... Spacer 511 ... Core 512 ... Solder 6 ... Electronic component (IC) 7 ... Metal brazing 8 ... Thermosetting adhesive 9 ... Mold material

Claims (8)

A package containing a piezoelectric vibrating piece;
A mounting substrate for mounting the package;
A plurality of spacers provided between the package and the mounting substrate, and forming a gap between the package and the mounting substrate;
An electronic component that is disposed so as to be positioned in the gap and drives the piezoelectric vibrating piece,
Have
At least one of the plurality of spacers is fixed to the package by a first fixing material, and at least one of the other spacers is fixed to the package by a second fixing material;
The first fixing material is a metal braze;
2. The piezoelectric device according to claim 1, wherein the second fixing material is an adhesive that adheres and fixes the spacer and the package prior to the first fixing material. A package containing a piezoelectric vibrating piece;
A mounting substrate for mounting the package;
A plurality of spacers provided between the package and the mounting substrate, and forming a gap between the package and the mounting substrate;
An electronic component that is disposed so as to be positioned in the gap and drives the piezoelectric vibrating piece,
Have
At least one of the plurality of spacers is fixed to the package by a first fixing material, and at least one of the other spacers is fixed to the package by a second fixing material;
The first fixing material is a metal braze;
The second fixing material is an adhesive that bonds and fixes the spacer and the package prior to the first fixing material,
The piezoelectric device, wherein the adhesive is a thermosetting adhesive having a curing temperature lower than a melting point of the metal brazing.   The piezoelectric device according to claim 2, wherein the curing temperature of the adhesive is 10 degrees or more lower than the melting point of the metal brazing.   The spacer that is fixed to the package through the second fixing material among the plurality of spacers includes a spherical nucleus and solder formed so as to cover a surface of the nucleus. Item 4. The piezoelectric device according to any one of Items 1 to 3.   5. The spacer according to claim 1, wherein the spacer and the adhesive fixed to the package via the second fixing material among the plurality of spacers have conductivity. Piezoelectric device. A method of manufacturing a piezoelectric device in which a package containing a piezoelectric vibrating piece is mounted on a mounting substrate via a plurality of spacers,
A first step of fixing at least one of the plurality of spacers to the package via an adhesive;
After the first step, among the plurality of spacers, at least one of the spacers other than the spacer fixed to the package via the adhesive is fixed to the package via a metal braze. A method for manufacturing a piezoelectric device, comprising: a second step. The adhesive is a thermosetting adhesive having a curing temperature lower than the melting point of the metal brazing,
The method for manufacturing a piezoelectric device according to claim 6, wherein the first step is performed by heating to a temperature higher than the curing temperature of the thermosetting adhesive and lower than the melting point of the metal brazing. .   The method for manufacturing a piezoelectric device according to claim 7, wherein a curing temperature of the adhesive is 10 degrees or more lower than a melting point of the metal brazing.

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