JP2002009576A - Piezoelectric device and its package structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface mount type piezoelectric device in which a piezoelectric vibration chip supported in a package in a way of cantilever is stably fixed and supported by using a small consumed amount of a conductive adhesive to realize an excellent resistance to shock. SOLUTION: In the package having an insulation case 20 and a cover 21 joined to its upper part, an electrode pad 29 to mount a lead electrode 26 of a crystal vibration chip 22 in a way of cantilever is placed on a connection electrode 27 formed on the mount face of the insulation case close to a side wall 24a of the insulation case, and a slit 32 one end of which is open and the other end of which is closed is formed on a side of wall. When placing the crystal vibration chip on the electrode pad to which a conductive adhesive 33 is adhered and curing the adhesive the crystal vibration chip is fixed and supported between both sides of the base end provide with the lead electrode and the sidewalls of the insulation case as well as between the rear side of the base end and the electrode pad.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type piezoelectric device such as a crystal unit, a crystal oscillator and a SAW device used in electronic equipment, and more particularly, to a cantilever type piezoelectric vibrating piece in a package. Related to supporting structure.

[0002]

2. Description of the Related Art Conventionally, as various electronic devices such as information communication devices, OA devices, and consumer devices have become smaller and thinner, piezoelectric devices used in these devices have been made smaller and thinner. Is being planned. In general, surface mount type piezoelectric devices widely adopt a structure in which a piezoelectric vibrating piece such as quartz is supported at one end in a cantilever manner, fixed in a package made of an insulating material such as ceramic, and hermetically sealed. ing.

A conventional surface mount type crystal resonator illustrated in FIG. 11 is a package in which an AT-cut crystal resonator element 2 is accommodated in a thin rectangular box-shaped insulating container 1 and hermetically sealed with a thin plate-like lid 3. Having a structure. The insulating container 1 is composed of a base 4 on a rectangular flat plate and a rectangular frame 5 joined to the upper surface thereof, and a pair of left and right connection electrodes 6, 6 is provided at one end on the surface of the base 4. Have been. Each connection electrode 6, 6
The electrode pads 7, 7 are formed at predetermined heights thereon, and are electrically connected to external electrodes (not shown) on the back surface of the base 4 via the conductive leads 8, 8. Quartz vibrating reed 2 having excitation electrodes 9 formed on both sides of a thin rectangular quartz plate
Are provided with extraction electrodes 10 and 10 from the excitation electrode at the base end thereof.

In the step shown in FIG. 12 for mounting the quartz-crystal vibrating piece 2 on the insulating container 1, first, conductive adhesives 11, 11 are respectively attached to the electrode pads 7, 7 (FIG. 12).
B). Next, the quartz-crystal vibrating reed 2 is placed with the respective extraction electrodes aligned with the corresponding electrode pads and the free ends thereof are lifted from the upper surface of the base 4 (FIG. 12C). In this state, the conductive adhesive 11 is cured, and the lid 3 is joined to the upper end of the insulating container 1 and hermetically sealed, whereby the crystal resonator element 2 is cantilevered in the package.

For example, Japanese Patent Application Laid-Open No. 11-274890 discloses, as a prior art, an E-shape having a thickness of 0.1 mm for connection to a pattern electrode serving as a connection terminal of a quartz plate.
A surface-mounted crystal resonator in which a degree of pattern electrode is formed by performing metallization such as gold plating on a ceramic base is described. In Japanese Patent Application Laid-Open No. 10-22776, a supporting portion is provided on a connection electrode of an insulating substrate, and the piezoelectric vibrating reed is supported by the supporting portion at a position closer to the excitation electrode than the edge and higher than the edge. By supporting the piezoelectric vibrating piece at a position, the piezoelectric vibrating piece is always lifted above the insulating substrate at a substantially constant angle from the insulating substrate surface, and can be mounted with a substantially constant gap secured between them. Is disclosed.

[0006]

However, in order to reduce the size and thickness of the conventional piezoelectric device in accordance with the recent trend, the amount of the conductive adhesive for fixing the piezoelectric vibrating piece is reduced. For this reason, the adhesive strength is reduced, and there is a problem that the connection is likely to be disconnected or unstable due to an impact such as a drop. Conversely, if the amount of the adhesive used is increased, the space between the two connection electrodes is reduced due to miniaturization.
As shown in C ', there is a possibility that excess adhesive 11a flows out from the joint between the vibrating reed 2 and the electrode pad 7 to the other connection electrode side, and short-circuits both electrodes. So conventionally,
By making a groove between both electrodes on the mounting surface of the insulating container,
It is necessary to take measures to prevent the conductive adhesive from flowing, but the number of steps is increased and the processing is troublesome.

According to Japanese Patent Application Laid-Open No. H11-274890, a conventional quartz resonator having a pattern electrode plated with gold has a weak adhesive force against shock and vibration. By providing a cavity, filling it with a conductive adhesive and building it up and electrically connecting it to the connection terminals of the quartz plate, the quartz plate is hardly peeled off and the connection is stabilized. However, forming the cavity in a ceramic base requires
In addition to the increase in man-hours and the cumbersome processing, it becomes technically difficult as miniaturization progresses. In addition, the quartz resonator described in the publication has a metallized portion for supporting one end of the quartz plate on the side opposite to the conductive portion of the ceramic base.

In view of the above, an object of the present invention is to meet the demand for miniaturization and thinning of a surface-mount type piezoelectric device by reducing the piezoelectric vibrating reed held in a package in a cantilever manner by using a small amount of conductive adhesive. An object of the present invention is to provide a piezoelectric device and a package structure thereof that can be stably fixed and held in a used amount and can realize excellent impact resistance against dropping, vibration, and the like.

[0009]

In order to achieve the above object, a package structure of a piezoelectric device according to the present invention has a piezoelectric element piece in a package and a cantilevered structure at one end provided with an extraction electrode. In a surface-mount type piezoelectric device to be mounted and hermetically sealed, the package has an insulating container and a lid joined to an upper portion thereof, and the insulating container has a connection electrode on the mounting surface and a connection electrode on the connection electrode. Having an electrode pad for connecting the extraction electrode of the piezoelectric element piece with a conductive adhesive, the electrode pad having a slit whose end is opened only on the side of the side wall of the adjacent insulating container, The slit is formed such that the side of the slit whose end is opened is close to the side wall.

With this configuration, when the piezoelectric element piece is mounted and mounted on the electrode pad to which the conductive adhesive is attached, the conductive adhesive is placed on the electrode pad due to the presence of the slit. Not only is it easier, but also the end of the slit is more likely to flow to the side of the open side wall, so that the risk of short-circuiting between both connection electrodes is reduced. In addition, the conductive adhesive flows from the side where the end of the slit of the electrode pad is opened to the adjacent side wall of the insulating container and hardens. Therefore, even when the amount of the conductive adhesive used is relatively small, the piezoelectric element piece is not only between the back surface of the end provided with the extraction electrode and the electrode pad, but also on both sides thereof with the side wall of the insulating container. Since it is fixed and held in between, its mounting strength is improved.

In one embodiment, the electrode pads are formed by screen printing a conductive material. As a result, the thickness of the electrode pad is smaller in the area on the side where the slit is provided than in the area on the opposite side, so that the conductive adhesive is directed along the slope toward the side wall of the adjacent insulating container. This is preferable because it can flow more easily.

In another embodiment, the electrode pad has a laminated structure of a lower layer portion having no slit and an upper layer portion having the slit. Thereby, the height at which the piezoelectric element pieces are mounted can be adjusted, and a sufficient mounting height that does not contact the mounting surface of the insulating container against vibration due to vibration or impact can be secured.

In another embodiment, the side wall of the insulating container is disposed so as to approach along one end of the piezoelectric element piece provided with the extraction electrode. Thus, regardless of the shape, structure, and dimensions of the entire package, the piezoelectric element piece can always be fixedly held in the package in a stable state as described above.

According to another aspect of the present invention, there is provided a piezoelectric device in which a piezoelectric element piece is stably mounted in a cantilever manner on a mounting surface of an insulating container having the above-mentioned electrode pad with a small amount of a conductive adhesive. Provided and exhibit excellent shock resistance against dropping and vibration.

According to still another aspect of the present invention, a surface mount type piezoelectric element is mounted in a package in a cantilever manner at one end where the lead electrode is provided and hermetically sealed. A piezoelectric device, wherein the package has an insulating container in which a connection electrode for connecting a lead electrode of a piezoelectric element piece to the mounting surface with a conductive adhesive is provided, and a lid joined to an upper portion thereof. , The extraction electrode of the piezoelectric element piece is
A piezoelectric device is provided having a slit that is open only on the side of the side wall of the insulating container adjacent thereto.

By configuring the lead-out electrodes of the piezoelectric element pieces in this manner, even if the insulating container of the package has the conventional structure or the above-described structure of the present invention, when mounting the piezoelectric element pieces, Since the conductive adhesive easily flows to the side of the side wall where the end of the slit is opened, the possibility of short-circuiting between both connection electrodes is reduced. At this time, if the insulating container of the package has the structure of the present invention described above,
This is advantageous because the flow of the conductive adhesive becomes easier to control when the piezoelectric element piece is mounted.

Further, in one embodiment, the side wall of the insulating container is similarly arranged close to the extraction electrode of the piezoelectric element piece, so that the side wall is always irrespective of the shape, structure and dimensions of the entire package. The piezoelectric element piece can be stably fixed and held in the package.

[0018]

FIG. 1 schematically shows a structure of a first embodiment of a piezoelectric vibrator to which the present invention is applied. In this piezoelectric vibrator, an AT-cut quartz vibrating piece 22 is mounted in a cantilevered manner in a package including an insulating container 20 and a lid 21 as shown in FIG. The insulating container 20 has a generally rectangular base 2 made of an insulating material such as ceramics.
3 is formed in a thin box shape in which the same rectangular frame 24 is integrally joined to the upper surface. The lid 21 is formed of a thin plate of glass, ceramic, or metal, and is joined to the upper end of the frame 24 with a metal brazing material such as sealing glass or solder.
The crystal resonator element 22 is hermetically sealed inside the package. The quartz vibrating reed 22 is formed of a rectangular quartz thin plate, on both sides of which excitation electrodes 25 are formed, and at one end, that is, at the base end, the extraction electrodes 2 from the respective excitation electrodes at the left and right ends.
6, 26 are formed.

On the upper surface of the base 23 constituting the mounting surface of the crystal vibrating piece 22, a pair of left and right connection electrodes 27, 27 is provided near one end thereof by metalizing, for example, tungsten whose surface is gold-plated. Each is formed to connect each extraction electrode of the crystal resonator element. Each connection electrode is electrically connected to an external electrode (not shown) formed on the back surface of the base via leads 28, 28 made of a conductor wired on the surface of the base 23.
On each connection electrode, a substantially rectangular electrode pad 29, 2 made of a suitable conductive material and having its surface plated with gold or the like.
9 are formed.

In this embodiment, each of the electrode pads 29, 2
Numerals 9 are arranged so as to be close to the longitudinal side walls 24a of the adjacent frames 24 with a slight gap. As shown in FIG.
0 and an upper layer portion 31. Lower part 30
Is formed to a substantially constant thickness by plating or vapor deposition. In the upper layer portion 31, the approximate center is extended in the width direction,
One slit 32 is formed with one end open toward the adjacent longitudinal side wall 24a and the other end closed. The upper layer portion 31 is formed, for example, by screen-printing a conductive material on the lower layer portion 30, so that the thickness of the region on the side wall 24 a side provided with the slit 32 has no slit, ie, the other connection electrode side. Region becomes thinner. Therefore, the upper surface of the electrode pad
Generally, it is inclined downward from the inside toward the side wall 24a.

The quartz vibrating reed 22 is mounted on the insulating container 20 according to the same process as in the prior art shown in FIGS. On the upper surface of the electrode pad 29, for example, as shown in FIG.
A known conductive adhesive 33 such as a polyimide-based, silicone-based, or urethane-based adhesive is applied in a predetermined amount. The conductive adhesive 33 to be used usually has a viscosity of about 200 dPa · s, but the provision of the slit 32 makes it easy to place on the electrode pad. Further, due to the inclination of the upper surface of the electrode pad, a small amount of the conductive adhesive 33 is applied to the side wall 2 as shown in FIG. 5A.
It flows out to 4a side. Next, as shown in FIG. 4C, the quartz-crystal vibrating piece 22 is placed with its extraction electrode aligned with the corresponding electrode pad. The conductive adhesive 33 flows to the side wall 24a so as to fill the space between the side wall 24a and the side of the quartz-crystal vibrating reed 22 as well shown in FIG. 5B. As described above, according to the present embodiment, the conductive adhesive adhered to each electrode pad does not easily flow to the connection electrode on the opposite side due to the presence of the slit 32.
There is no risk of short-circuiting between both electrodes.

When the conductive adhesive 33 is heated and hardened in this state, the quartz-crystal vibrating piece 22 is cantilevered to the electrode pad 29 at the base end thereof, and maintains a slight distance from the surface of the base 23. And are mounted so as to extend substantially in parallel. Since the quartz vibrating reed 22 is fixedly held not only between the back surface of the base end portion and the electrode pad but also on both sides thereof with the side wall 24a of the insulating container, the amount of the conductive adhesive used is relatively small. At least, sufficient mount strength can be obtained. Moreover, since the quartz-crystal vibrating piece 22 is fixed only at the base end thereof, there is no possibility that the operation and performance as the vibrator will be affected at all.

FIGS. 6A to 6E show various modifications of the slit formed in the electrode pad 29. FIG. In FIG. 6A, one slit 32 is formed in which the substantially center of the electrode pad 29 is extended in the longitudinal direction, one end is opened toward the adjacent width side wall 24b, and the other end is closed. ing. In this embodiment, the base end portion of the quartz-crystal vibrating piece 22 is fixed to the side wall 24b at the end side thereof by a conductive adhesive within a range generally indicated by oblique lines in FIG. 6A.

In the embodiment of FIG. 6B, each electrode pad 29 is formed with two slits, that is, the slit 32a of the first embodiment extending in the width direction and the slit 32b of FIG. 6A extending in the longitudinal direction. I have. Thereby, the crystal vibrating piece 2
Since the base end portion 2 is fixed to the side walls 24a and 24b along the both side edges and the end side thereof with the conductive adhesive in a range generally indicated by oblique lines in FIG. 6B, the base end portion is fixed in two orthogonal directions.
It is fixed and held more stably. 6C, unlike FIG. 6B, two slits 32a and 32 in the longitudinal direction and the width direction.
b is formed in a cross shape that is orthogonal at substantially the center of the electrode pad 29. 6B, the length of each slit is longer than that of FIG. 6B, and the side wall side of the electrode pad is thinner and its inclination becomes larger.
4a and 24b facilitate the flow.

In the embodiment shown in FIG. 6D, one slit 32
Open one end in the diagonal direction of the electrode pad 29 toward the corner between the longitudinal side wall 24a and the width side wall 24b and close the other end to extend. This allows
The conductive adhesive easily flows toward the corner of the side wall, and fixes each corner of the base end portion of the crystal vibrating piece 22 to the side wall of the insulating container within a range generally shown in FIG. 6D.

In the embodiment shown in FIG. 6E, two parallel slits 32a and 32b extending in the width direction and having one end open toward the longitudinal side wall 24a are formed in the same manner as the first embodiment. Is formed. Thereby, the electrode pad becomes thinner on the side wall side in the longitudinal direction and its inclination becomes larger, so that the conductive adhesive easily flows through the side wall 24a.

The embodiment shown in FIG. 6F shows a case where the size of the insulating container is larger than the size of the quartz-crystal vibrating piece, especially when the side wall 3 is formed.
4 shows a package structure suitable for the case where the reference numeral 4 is away from the mounting position of the electrode pad 29 and the crystal vibrating piece 22. In the insulating container of the present embodiment, the side wall portions 34 a corresponding to both sides of the base end portion of the crystal vibrating piece 22 are disposed so as to protrude from other portions and approach the electrode pads 29. Therefore, by providing the slits 32 in the electrode pads as in the above-described embodiments, the conductive adhesive easily flows to the adjacent side wall portion 34a, and the base end of the crystal resonator element 22 can be fixed and held.

Naturally, the slits in FIGS. 6A to 6E are merely examples, and the shape, number, and arrangement of the slits can be variously changed to control the flow of the conductive adhesive. For example, the slits of the above embodiments have a substantially constant width, but are formed wider from the closed end to the open end, and the thickness of the electrode pad is thinner toward the side wall, Therefore, the adhesive can be made to flow more easily. In FIG. 6F, the side wall portion 34a adjacent to the electrode pad is continuous from the side wall 34. However, a crystal oscillator in which a semiconductor element or the like is mounted in the same package,
In the case of another piezoelectric device, a side wall that is not continuous with the side wall of the mounting surface of the insulating container may be similarly formed close to the electrode pad.

FIGS. 7A and 7B show an AT-cut quartz-crystal vibrating piece used in a second embodiment of the quartz-crystal vibrator according to the present invention. The quartz-crystal vibrating piece 35 of the present embodiment differs from the quartz-crystal vibrating piece of the first embodiment in that one slit 38 is formed in an extraction electrode 37 from an excitation electrode 36. Slit 38
As in the case of the slit 32 of the first embodiment, one end is opened to the adjacent side in the longitudinal direction and the other end is closed to extend substantially the center of the extraction electrode 37 in the width direction. . Such a slit can be easily formed by partially etching a portion of the quartz plate on which an extraction electrode is to be formed by using a photolithography technique. Thereafter, since the electrodes are formed on the quartz plate, as shown in FIG. 7B, an electrode film is also formed in the slit 32, and there is no place to lower the conductivity of the extraction electrode 37. Further, as a matter of course, a slit can be formed in the extraction electrode 37 by etching similarly after forming each electrode on the quartz plate.

On the other hand, as shown in FIGS. 8A and 8B, the insulating container on which the crystal vibrating piece 35 is mounted has longitudinal side walls 24a corresponding to both sides of the base end of the crystal vibrating piece.
Are provided in close proximity to each other. The electrode pad 29 may not be formed with a slit as in the present embodiment, or may be formed as in the first embodiment. In any case, as in the case of the first embodiment described above with reference to FIGS. 4 and 5, a predetermined amount of the conductive adhesive 39 is applied to the upper surface of the electrode pad 29 (FIG. 8A). The crystal vibrating piece 35 is placed with its extraction electrode aligned with the corresponding electrode pad (FIG. 8).
B). The conductive adhesive 39 flows to the adjacent side wall 24a along the slit 38 and fills a space between the side wall 24a and the quartz-crystal vibrating piece.

As described above, also in this embodiment, since the conductive adhesive adhered to each electrode pad hardly flows to the connection electrode on the opposite side, there is no danger of short-circuiting between both connection electrodes. Not only between the back surface of the base end of the quartz vibrating piece and the electrode pad, but also on both sides of the quartz container, it is fixedly held on the side wall of the insulating container, thereby relatively little affecting the operation and performance as a vibrator. An effect similar to that of the first embodiment is obtained in that a sufficient mount strength can be obtained by using the conductive adhesive. When slits are formed in the electrode pads as in the first embodiment, it goes without saying that those effects are further improved.

FIGS. 9A and 9B show a modification of the AT-cut quartz-crystal vibrating piece of the second embodiment. In this embodiment, the quartz vibrating reed 35 has a recess 40 having a constant depth around the excitation electrode 36.
7 in that it is a so-called inverted mesa type in which
Is different from the embodiment. In order to form the slit 38, such a dent is used to partially etch the portion of the quartz plate where the extraction electrode is to be formed using photolithography technology, and at the same time, partially etch the quartz plate surface. Thereby, it can be formed without increasing the number of steps. The electrode films of the excitation electrode 36 and the extraction electrode 37 are formed on the surface of the quartz plate etched as described above.

FIGS. 10A and 10B show a tuning-fork type quartz vibrating piece 41 to which the second embodiment is applied. Quartz vibrating reed 4
1, a flat electrode 42 and a side electrode 43 are formed on the surface of a tuning fork-shaped quartz plate as in the prior art, and an extraction electrode 44 from these electrodes is opposite to the left and right arm portions provided with weight portions 45 at the tips. At the base end. At the base end of the quartz vibrating reed 41, as in the embodiment of FIGS. 7 and 9, the approximate center is extended in the width direction, and one end is opened to the longitudinal side of the quartz vibrating reed 41. And a slit 4 with the other end closed
6 are formed. Thereby, similarly, the quartz vibrating piece 4
(1) The tuning fork type crystal resonator which can be downsized by improving the mounting strength and reducing the risk of short-circuiting between the connection electrodes can be obtained.

The present invention is not limited to the above embodiment,
As long as the resonator element is a surface mount type that cantileverly mounts the resonator element, various piezoelectric materials other than quartz, such as lithium tantalate and lithium niobate, and SAW devices can be similarly applied.

[0035]

As is clear from the above description, according to the package structure of the piezoelectric device of the present invention, the conductive adhesive is applied to the side of the side wall where the end of the slit of the electrode pad is open when the piezoelectric element piece is mounted. Because the amount of conductive adhesive used is smaller than before, the piezoelectric element piece is added to the back surface of the end where the extraction electrode is provided without short-circuiting between the connection electrodes, and both sides are Can be fixed and held between the insulating container and the side wall, so that the mounting strength is improved,
It is possible to realize a piezoelectric device that can exhibit excellent impact resistance while being reduced in size and thickness.

Further, according to the piezoelectric device of the present invention, by providing a slit in the extraction electrode of the piezoelectric element piece, the conductive adhesive is applied to the side of the side wall where the end of the slit is opened when the piezoelectric element piece is mounted. Since the flow becomes easier, the risk of short-circuiting between the two connection electrodes is reduced, and the side walls of the insulating container are brought closer to each other, and the end of the piezoelectric element piece is fixed and held also on its side, thereby improving the mounting strength. Miniaturization·
The thickness can be reduced and excellent impact resistance can be achieved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view, partly in section, showing a quartz oscillator according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional perspective view showing the insulating container of the first embodiment on which a quartz vibrating piece is mounted.

FIG. 3 is an enlarged perspective view showing an electrode pad of the first embodiment.

FIGS. 4A to 4C are plan views showing steps of mounting the crystal resonator element on the insulating container of the first embodiment, and FIGS.
It is sectional drawing corresponding to them.

FIGS. 5A and B are enlarged views of FIGS. 4A and 4B, respectively.

6A to 6E are plan views each showing a modification of the electrode pad, and FIG. 6F is a plan view showing a modification of the insulating container of the present invention.

FIG. 7A is a plan view showing a quartz-crystal vibrating piece according to a second embodiment of the present invention, and FIG.

FIGS. 8A and 8B are enlarged cross-sectional views similar to FIGS. 5A and 5B showing a step of mounting the quartz-crystal vibrating piece of the second embodiment.

FIG. 9A is a plan view showing a modification of the quartz-crystal vibrating piece, and FIG.
The figure is a partially enlarged sectional view thereof.

10A is a plan view showing another modified example of the quartz-crystal vibrating piece, and FIG. 10B is a partially enlarged sectional view thereof.

FIG. 11 is a partial cross-sectional exploded perspective view showing a conventional crystal unit.

12A to 12C are plan views showing steps of mounting a crystal resonator element on a conventional insulating container, and FIGS. A ′ to C ′ are cross-sectional views corresponding thereto.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating container 2 Crystal vibrating piece 3 Lid 4 Base 5 Frame 6 Connection electrode 7 Electrode pad 8 Conductive lead 9 Excitation electrode 10 Leader electrode 11 Conductive adhesive 20 Insulating container 21 Cover 22 Quartz vibrating piece 23 Base 24 Frame 24a, 24b Side wall Reference Signs List 25 excitation electrode 26 extraction electrode 27 connection electrode 28 lead 29 electrode pad 30 lower layer part 31 upper layer part 32, 32a, 32b slit 33 conductive adhesive 34 side wall 34a side wall part 35 crystal vibrating piece 36 excitation electrode 37 extraction electrode 38 slit 39 conductive Adhesive 40 dent 41 quartz vibrating piece 42 plane electrode 43 side electrode 44 lead-out electrode 45 weight part 46 slit

Claims (8)

[Claims] 1. A surface mount type piezoelectric device in which a piezoelectric element piece is cantileverly mounted and hermetically sealed at one end where a lead electrode is provided inside a package. A container and a lid joined to an upper part thereof, wherein the insulating container is for connecting a connection electrode on a mounting surface thereof and an extraction electrode of the piezoelectric element piece on the connection electrode by a conductive adhesive. An electrode pad, wherein the electrode pad has a slit that is opened only on the side of the side wall of the insulating container adjacent to the end, and the side that opens the end of the slit is close to the side wall. A package structure for a piezoelectric device, characterized by being formed by: 2. The package structure for a piezoelectric device according to claim 1, wherein said electrode pad is formed by screen-printing a conductive material. 3. The package structure of a piezoelectric device according to claim 1, wherein the electrode pad has a laminated structure of a lower layer portion having no slit and an upper layer portion having the slit. 4. The piezoelectric element according to claim 1, wherein a side wall of the insulating container is arranged so as to be close to one end of the piezoelectric element piece provided with the extraction electrode. A package structure of the piezoelectric device according to any one of the above. 5. A piezoelectric device, wherein a piezoelectric element piece is mounted on a mounting surface of the insulating container according to claim 1 in a cantilever manner. 6. A surface mount type piezoelectric device in which a piezoelectric element piece is cantileverly mounted and hermetically sealed at one end where a lead electrode is provided inside a package, wherein the package comprises An insulating container having a connection electrode for connecting the extraction electrode of the piezoelectric element piece to the mounting surface with a conductive adhesive, and a lid joined to an upper portion thereof, wherein the piezoelectric element piece includes the extraction electrode. A piezoelectric device, characterized in that the formed portion has a slit opened only on the side of the side wall of the insulating container adjacent thereto. 7. The insulating container according to claim 1, wherein the insulating container is the insulating container according to claim 1. Description:
6. The piezoelectric device according to claim 1. 8. The piezoelectric device according to claim 6, wherein a side wall of the insulating container is disposed close to an extraction electrode of the piezoelectric element piece.