JP2015201749A - Crystal vibration element and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress creeping-up of a conductive adhesive in a slit of a crystal vibration element including a base, a vibration part and a slit.SOLUTION: A base 11 has an upper surface 111 and a lower surface 112 in the thickness direction, where the lower surface 112 is fixed to an element mounting member 32 by a conductive adhesive 31. Vibration arms 12a, 12b are extending from the base 11. Slits 16a, 16b are formed in the outer periphery of the base 11, so as to be depressed from the upper surface 111 and lower surface 112 in the thickness direction. A virtual surface extending the upper surface 111 is the extension upper surface, and a virtual surface extending the lower surface 112 is the extension lower surface. Thin wall portions 17a, 17b are provided, respectively, in the slits 16a, 16b, and projecting while separated from at least one of the extension upper surface and extension lower surface.

Description

  The present invention relates to a crystal resonator element used for, for example, a reference signal source and a clock signal source, and a manufacturing method thereof. Hereinafter, a tuning fork-type bending quartz crystal vibrating element (hereinafter abbreviated as “vibrating element”) will be described as an example of a quartz crystal vibrating element.

  FIG. 8 is a perspective view showing a vibration element of Related Art 1. FIG. Hereinafter, description will be given based on this drawing.

  The vibration element 210 of the related technology 1 includes a base 211, vibration arm portions 212a and 212b, and cut portions 216a and 216b. The vibration element 210 having such a structure is disclosed in Patent Document 1, for example.

  The base 211 has a rectangular shape when viewed from the upper surface 241 side and the lower surface 242 side, and the lower surface 242 is fixed to an element mounting member (not shown) by the conductive adhesive 231. The vibrating arm portions 212a and 212b are extended from the base portion 211 and formed with groove portions 213a and 213b, respectively. The notches 216a and 216b penetrate from the upper surface 241 to the lower surface 242 of the base 211, and are formed on opposite side surfaces of the base 211, respectively.

  The base portion 211 and the vibrating arm portions 212 a and 212 b are made of a crystal vibrating piece 215. The vibration element 210 includes pad electrodes 221a and 221b, excitation electrodes 222a and 222b, frequency adjustment metal films 223a and 223b, and wiring patterns 224a and 224b in addition to the crystal vibrating piece 215.

  Here, the notches 216 a and 216 b increase the adhesion strength between the conductive adhesive 231 and the vibration element 210 by increasing the adhesion area of the conductive adhesive 231.

WO2006 / 114936

  However, the vibration element 210 of Related Art 1 has the following problems.

  For example, when the supply amount of the conductive adhesive 231 increases, the conductive adhesive 231 may scoop up the notches 216a and 216b due to surface tension and reach the upper surface 241. The conductive adhesive 231 that has reached the upper surface 241 causes the wiring patterns 224a and 224b to be short-circuited or the wiring of other vibration elements to be short-circuited via the suction pins at the time of mounting.

  In recent years, with the progress of miniaturization of the vibration element 10, the notches 216a and 216b are also miniaturized, so that the conductive adhesive 231 is likely to crawl up, and this problem becomes more serious.

  Therefore, an object of the present invention is to provide a vibration element and a method for manufacturing the same that can suppress the creeping of the conductive adhesive in the cut portion.

The vibration element according to the present invention is
A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
A notch formed on the outer periphery of the base so as to be recessed in the thickness direction from the upper surface and the lower surface;
In a vibration element comprising
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface,
A thin portion that is provided in the notch and protrudes away from at least one of the extended upper surface and the extended lower surface;
It is further provided with the feature.

The manufacturing method according to the present invention includes:
A method of manufacturing a vibration element according to the present invention in which a groove is formed along the extending direction in the vibration part,
When forming the groove portion, simultaneously form the cut portion and the thin portion,
It is characterized by that.

  According to the present invention, by providing the thin wall portion that protrudes in the cut portion, the thin wall portion serves as a barrier against the conductive adhesive that attempts to scoop up the cut portion. Crawling can be suppressed.

FIG. 3 is a perspective view illustrating a vibration element according to the first embodiment. 2 [A] is a cross-sectional view taken along the line IIa-IIa in FIG. 1, FIG. 2 [B] is a cross-sectional view taken along the line IIb-IIb in FIG. 1, and FIG. It is a schematic sectional drawing which shows the state mounted in the member. It is a perspective view which shows the cut | notch part and thin part in the modification of Embodiment 1. FIG. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 4 [A], FIG. 4 [B], and FIG. 4 [C]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 5 [D], FIG. 5 [E], and FIG. 5 [F]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 6 [G], FIG. 6 [H], and FIG. 6 [I]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 7 [J], FIG. 7 [K], and FIG. 7 [L]. It is a perspective view which shows the vibration element of related technology.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. Moreover, since the shape drawn on drawing is drawn so that those skilled in the art can understand easily, it does not necessarily correspond with an actual dimension and ratio.

  FIG. 1 is a plan view illustrating the vibration element according to the first embodiment. 2A is a cross-sectional view taken along line IIa-IIa in FIG. 2B is a cross-sectional view taken along line IIb-IIb in FIG. FIG. 2C is a schematic cross-sectional view illustrating a state where the vibration element of FIG. 1 is mounted on an element mounting member. Hereinafter, description will be given based on these drawings. Note that the extension upper surface 113, the extension lower surface 114, the thin-walled upper surface 171 and the thin-walled lower surface 172 are denoted by reference numerals only in FIG.

  The vibration element 10 according to the first embodiment includes a base 11, two vibration arm portions 12a and 12b as vibration portions, cut portions 16a and 16b, and thin portions 17a and 17b. The base 11 has an upper surface 111 and a lower surface 112 in the thickness direction, and the lower surface 112 is fixed to the element mounting member 32 by the conductive adhesive 31. The vibrating arm portions 12 a and 12 b are extended from the base portion 11. The notches 16a and 16b are formed on the outer periphery of the base 11 so as to be recessed from the upper surface 111 and the lower surface 112 in the thickness direction. A virtual surface with the upper surface 111 extended is referred to as an extended upper surface 113, and a virtual surface with the lower surface 112 extended is referred to as an extended lower surface 114. At this time, the thin portions 17a and 17b are provided in the cut portions 16a and 16b, respectively, and protrude in a state separated from at least one of the extended upper surface 113 and the extended lower surface 114.

  The thin-walled portions 17 a and 17 b have a thin-walled upper surface 171 and a thin-walled lower surface 172. The thin-walled upper surface 171 is a surface away from the extended upper surface 113, and the thin-walled lower surface 172 is a surface away from the extended lower surface 114. The base 11 has a rectangular shape when viewed from the upper surface 111 side and the lower surface 112 side. The notches 16a and 16b are provided in portions including the apexes 11a and 11b on the opposite side of the base 11 on the vibrating arm portions 12a and 12b side, respectively.

  The vibrating arm portions 12a and 12b are extended from the base portion 11 in the same direction, and groove portions 13a and 13b are provided along the extending direction. The base 11 and the vibrating arm portions 12 a and 12 b are made of a crystal vibrating piece 15. In addition to the crystal vibrating piece 15, the vibration element 10 includes pad electrodes 21a and 21b, excitation electrodes 22a and 22b, frequency adjusting metal films 23a and 23b, wiring patterns 24a and 24b, and the like.

  Next, the configuration of the vibration element 10 will be described in more detail.

  The base 11 is a flat plate having a substantially rectangular shape in plan view. The quartz crystal resonator element 15 has a tuning fork shape in which the base 11 and the vibrating arms 12a and 12b are integrated, and is manufactured by a film forming technique, a photolithography technique, and a wet etching technique.

  The groove portions 13a, 13b vibrate from the boundary portion with the base 11 toward the tips of the vibrating arm portions 12a, 12b, two on the front and back surfaces of the vibrating arm portion 12a and two on the front and back surfaces of the vibrating arm portion 12b. The arm portions 12a and 12b are provided with a predetermined length parallel to the length direction of the arms 12a and 12b. In the first embodiment, two grooves 13a and 13b are provided on the front and back surfaces of the vibrating arm 12a and two grooves on the front and back surfaces of the vibrating arm 12b. However, the number of the grooves 13a and 13b is not limited. For example, one may be provided on the front and back surfaces of the vibrating arm portion 12a and one on each of the front and back surfaces of the vibrating arm portion 12b, or may be provided on only one side of the front and back surfaces.

  The vibrating arm 12a is provided with excitation electrodes 22a on both side surfaces so that the planes facing each other across the crystal have the same polarity, and an excitation electrode 22b is provided inside the groove 13a on the front and back surfaces. Similarly, the vibrating arm portion 12b is provided with excitation electrodes 22b on both side surfaces so that the planes facing each other across the crystal have the same polarity, and the excitation electrode 22a is provided inside the groove portion 13b on the front and back surfaces. . Accordingly, in the vibrating arm portion 12a, the excitation electrode 22a provided on both side surfaces and the excitation electrode 22b provided in the groove portion 13a have different polarities, and in the vibrating arm portion 12b, the excitation electrode 22b provided on both side surfaces. And the excitation electrode 22a provided in the groove 13b have different polarities.

  The base 11 is provided with pad electrodes 21a and 21b and wiring patterns 24a and 24b. The wiring pattern 24a electrically connects the pad electrode 21a and the excitation electrode 22a, and the wiring pattern 24b electrically connects the pad electrode 21b and the excitation electrode 22b. The pad electrode 21a, the excitation electrode 22a, the frequency adjusting metal film 23a, and the wiring pattern 24a are electrically connected to each other. The pad electrode 21b, the excitation electrode 22b, the frequency adjusting metal film 23b, and the wiring pattern 24b are also electrically connected to each other.

  The vibration element 10 is fixed and electrically connected to the pad electrode 33 on the element mounting member 32 side via the pad electrodes 21 a and 21 b and the conductive adhesive 31.

  Quartz crystals are trigonal. A crystal axis passing through the crystal apex is defined as a Z axis, three crystal axes connecting ridge lines in a plane perpendicular to the Z axis are defined as an X axis, and a coordinate axis orthogonal to the X axis and the Z axis is defined as a Y axis. Here, when the coordinate system consisting of these X, Y, and Z axes is rotated within a range of ± 5 degrees around the X axis, the rotated Y axis and Z axis are respectively represented as Y ′ axis and Z axis. 'As axis. In this case, in the first embodiment, the extending direction of the two vibrating arm portions 12a and 12b is the Y′-axis direction, and the direction in which the two vibrating arm portions 12a and 12b are arranged is the X-axis direction. .

  Next, the operation of the vibration element 10 will be described. When the tuning fork type vibration element 10 is vibrated, an alternating voltage is applied to the pad electrodes 21a and 21b. When an electrical state after application is instantaneously captured, the excitation electrodes 22b provided in the groove portions 13a on the front and back of the vibrating arm portion 12a have a positive potential, and the excitation electrodes 22a provided on both side surfaces of the vibrating arm portion 12a are A negative electric potential is generated, and an electric field is generated from positive to negative. At this time, the excitation electrode 22a provided in the groove 13b on the front and back sides of the vibrating arm portion 12b has a negative potential, and the excitation electrode 22b provided on both side surfaces of the vibrating arm portion 12b has a positive potential, and is generated in the vibrating arm portion 12a. The polarity is opposite to the polarity, and an electric field is generated from plus to minus. The electric field generated by the alternating voltage causes a stretching phenomenon in the vibrating arm portions 12a and 12b, and a flexural vibration mode having a predetermined resonance frequency is obtained.

  Next, the operation and effect of the vibration element 10 will be described.

  (1) According to the first embodiment, by providing the thin-walled portions 17a and 17b protruding in the cut portions 16a and 16b, the conductive adhesive 31 that tries to scoop up the cut portions 16a and 16b. Since the thin portions 17a and 17b serve as a barrier, the creeping of the conductive adhesive 31 at the cut portions 16a and 16b can be suppressed.

  In addition, by providing the thin portions 17a and 17b protruding in the cut portions 16a and 16b, the adhesion area of the conductive adhesive 31 can be further increased compared to the case where only the cut portions 16a and 16b are provided. Therefore, the adhesive strength between the conductive adhesive 31 and the vibration element 10 can be further increased.

  (2) When the thin-walled upper surface 171 is a surface away from the extended upper surface 113 and the thin-walled lower surface 172 is a surface away from the extended lower surface 114, the base 11 can be formed vertically symmetrical, so the upper surface 111 of the base 11 The same vibration characteristic can be obtained regardless of which of the lower surface 112 and the lower surface 112 is bonded to the element mounting member 32. Therefore, the trouble of checking the upper surface 111 and the lower surface 112 can be saved, so that the mounting process can be simplified.

  (3) In the related art 1, as shown in FIG. 8, the notch portion 216a is provided on the opposite side surface of the base portion 211, so that the work for confirming the scooping up of the conductive adhesive 231 is performed from the −X axis direction. Limited. On the other hand, in the first embodiment, as shown in FIG. 1, the notch portion 16a is provided in the portion including the apex 11a, so that the confirmation work of scooping up the conductive adhesive 231 is performed in the −X axis direction. To Y ′ axis direction is possible from anywhere. Therefore, according to the first embodiment, it is easy to confirm the scooping of the conductive adhesive 31 in the cut portions 16a and 16b.

  Next, the notch part and thin part in the modification of Embodiment 1 are demonstrated based on FIG.

  FIG. 3A shows the cut portion 66a and the thin portion 67a in the modified example A. The thin-walled portion 67a has a portion corresponding to the vertex (vertex 11a in FIG. 1) removed, and is a flat plate having a substantially triangular shape in plan view. As shown in FIG. 1, in the thin part 17a in Embodiment 1, since the vertex 11a is sharp, there exists a possibility that a front-end | tip may be missing. On the other hand, in the thin-walled portion 67a in the modified example A, since the portion corresponding to the apex is removed, there is no possibility that the tip is lost, so that the yield can be improved.

  FIG. 3B shows the cut portion 66b and the thin portion 67b in the modified example B. The thin-walled portion 67b has a portion corresponding to the apex (vertex 11a in FIG. 1) removed, and is a flat plate having a substantially triangular shape (one side of which is an arc) in plan view. As shown in FIG. 1, in the thin part 17a in Embodiment 1, since the vertex 11a is sharp, there exists a possibility that a front-end | tip may be missing. On the other hand, in the thin-walled portion 67b in the modified example B, since the portion corresponding to the apex is removed, there is no possibility that the tip is lost, so that the yield can be improved.

  FIG. 3C shows a cut portion 66c and a thin portion 67c in Modification C. In FIG. 2B, the thin portion 67c has a structure in which the extended lower surface 114 and the thin portion lower surface 172 coincide.

  FIG. 3D shows a cut portion 66d and a thin portion 67d in Modification D. The thin-walled portion 67d has a structure in which the extended upper surface 113 and the thin-walled upper surface 171 coincide with each other in FIG. 2B.

  FIG. 3E shows a cut portion 66e and a thin-walled portion 67e in Modification E. The notch 66e is formed on the opposite side surface of the base 11 in FIG.

  FIG. 3F shows notches 66f and 66g and thin portions 67f and 66g in Modification F. The cut portion 66f and the thin portion 67f, and the cut portion 66g and the thin portion 66g are formed one by one with the apex 11a interposed therebetween.

  As shown in the modified examples A to F, the shape, number, and position of the cut portion and the thin portion are arbitrary.

  Next, a method for manufacturing the resonator element according to the first embodiment will be described as a manufacturing method according to the second embodiment. 4 to 7 are cross-sectional views showing each step in the manufacturing method of the second embodiment. Hereinafter, the manufacturing method of the second embodiment will be described with reference to FIG. 1 and FIG.

  As shown in FIG. 1, the vibrating arm portion 12a and the vibrating arm portion 12b have the same structure symmetrically, and the vibrating arm portion 12a side and the vibrating arm portion 12b side of the base 11 have the same symmetrical structure. 4 to 7 show manufacturing steps only on the vibrating arm portion 12a side and only on the vibrating arm portion 12a side of the base 11 in the IIa-IIa line cross section and the IIb-IIb line cross section in FIG.

  The manufacturing method according to the second embodiment is a method for manufacturing the vibration element 10 according to the first embodiment, and is characterized in that, when the groove portion 13a is formed, the cut portion 16a and the thin portion 17a are formed at the same time. This will be described in detail below.

  First, as shown in FIG. 4A, for example, a corrosion-resistant film 42 is formed on the front and back surfaces of a substrate 41 made of a quartz Z plate, a photoresist film 43 is formed on the corrosion-resistant film 42, and a vibrating arm portion and The external patterning is performed by removing a part of the photoresist film 43 so that the photoresist film 43 remains only in the region 52 and the base region 51. The corrosion-resistant film 42 is made of a metal having corrosion resistance against the crystal etching solution, and may be a single layer made of chromium or a plurality of layers made of chromium and gold, for example. The photoresist film 43 is applied by, for example, a spin coat method.

  Subsequently, as shown in FIG. 4B, the portion of the corrosion resistant film 42 where the photoresist film 43 is not formed in FIG. 4A is removed by etching. For example, the corrosion-resistant film 42 not covered with the photoresist film 43 is removed by wet etching using a dedicated etching solution. Thereby, the substrate 41 appears in the portion where the corrosion-resistant film 42 is removed.

  Subsequently, as shown in FIG. 4C, all of the photoresist film 43 remaining in FIG. 4B is removed.

  Subsequently, as shown in FIG. 5D, a photoresist film 44 is formed on the entire surface of the substrate 41 including the corrosion resistant film 42.

  Subsequently, as shown in FIG. 5E, a part of the photoresist film 44 is removed. At this time, not only the portions 52 other than the region 52 serving as the vibrating arm portion and the region 51 serving as the base portion are removed, but also the photoresist film 44 in the region 53 serving as the groove portion and the region 56 serving as the cut portion is removed. By doing so, patterning of a groove part and a notch part is performed.

  Subsequently, as shown in FIG. 5 [F], outer shape etching is performed. That is, in the substrate 41 made of a quartz Z plate, the etching is performed leaving only the region 52 serving as the vibrating arm portion and the region 51 serving as the base portion. As a result, the substrate 41 that is not covered by the corrosion-resistant film 42, that is, the exposed surface of the crystal, is completely removed using buffered hydrofluoric acid (HF + NH4F), thereby forming the outer shape of the vibrating arm portion 12a and the base portion 11.

  Subsequently, as shown in FIG. 6G, the corrosion-resistant film 42 in the region 53 to be a groove and the region 56 to be a notch is removed.

  Subsequently, as shown in FIG. 6H, etching of the groove and the cut portion is performed. That is, in the substrate 41 made of a quartz Z plate, the region 53 to be a groove and the region 56 to be a notch are etched to a certain depth. As a result, the substrate 41 that is not covered with the corrosion-resistant film 42, that is, the exposed surface of the crystal is half-etched using buffered hydrofluoric acid (HF + NH4F), thereby forming the cut portion 16a and the thin portion 17a simultaneously with the groove portion 13a. .

  Subsequently, as shown in FIG. 6I, all of the corrosion-resistant film 42 and the photoresist film 44 are removed.

  Subsequently, as shown in FIG. 7J, an electrode film 46 is formed on the entire front and back surfaces of the substrate 41. The electrode film 46 is, for example, a single layer film of chromium or titanium, or a laminated film in which palladium or gold is formed thereon, and is formed by sputtering or vapor deposition, for example.

  Subsequently, as shown in FIG. 7K, a photoresist film 45 is formed on the entire surface of the electrode film 46 by electrodeposition, and the electrode pattern is exposed and developed. At this time, in the region 51 serving as the base, the region 58 serving as the electrode is covered with the photoresist film 45. In addition, the electrodeposition method is suitable for forming the photoresist film 45 to the minute unevenness like the region 53 to be the groove. The region 58 serving as an electrode includes the region serving as the pad electrode 21a and the wiring patterns 24a and 24b illustrated in FIG. 1 in addition to the region serving as the pad electrode 21b illustrated in FIG.

  Finally, as shown in FIG. 7L, the electrode film 46 not covered with the photoresist film 45 is removed by etching, and then the photoresist film 45 is also removed. Thereby, excitation electrodes 22a and 22b are formed in the vibrating arm portion 12a and the groove portion 13a, and a pad electrode 21b is formed in the base portion 11, the cut portion 16a, and the thin portion 17a. At this time, as shown in FIG. 1, the pad electrode 21a and the wiring patterns 24a and 24b are also formed, and the vibration element 10 is completed. The frequency adjusting metal films 23a and 23b may be formed by, for example, a separate metal mask and vapor deposition.

  According to the manufacturing method of the second embodiment, as shown in FIG. 6H, the cut portions 16a and 16b and the thin portions 17a and 17b are formed at the same time as the groove portions 13a and 13b. An existing process can be used as it is only by changing (FIG. 5E).

  In addition, the manufacturing method of this Embodiment 2 will be what is the other process if the process of forming the notches 16a and 16b and the thin parts 17a and 17b is included simultaneously with the groove parts 13a and 13b. Also good. For example, the groove portion, the cut portion, and the thin portion may be formed simultaneously with the outer shape using an etching suppression pattern, the electrode may be formed by a lift-off method, and the photoresist film uses a positive latent image. Depending on the situation, the number of coating and peeling may be reduced. Other configurations, operations, and effects of the second embodiment are the same as those of the first embodiment.

  Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention. Further, the present invention includes a combination of some or all of the configurations of the above-described embodiments as appropriate.

  The present invention can be used for any vibration element provided with a base, a vibration part, and a notch. For example, in addition to a tuning fork type bending vibration element and a thickness shear vibration element, a sensor element such as a gyro sensor Also available.

<Embodiment 1>
DESCRIPTION OF SYMBOLS 10 Vibration element 11 Base part 11a, 11b Vertex 111 Upper surface 112 Lower surface 113 Extension upper surface 114 Extension lower surface 12a, 12b Vibration arm part 13a, 13b Groove part 15 Crystal vibrating piece 16a, 16b Cut part 17a, 17b Thin part 171 Thin part upper part 172 Thin part Lower surface 21a, 21b Pad electrode 22a, 22b Excitation electrode 23a, 23b Frequency adjustment metal film 24a, 24b Wiring pattern 31 Conductive adhesive 32 Element mounting member 33 Pad electrode 66a, 66b, 66c, 66d, 66e, 66f Notch 67a , 67b, 67c, 67d, 67e, 67f Thin portion <Embodiment 2>
41 Substrate 42 Corrosion Resistant Film 43, 44, 45 Photoresist Film 46 Electrode Film 51 Base Area 52 Vibrating Arm Area 53 Groove Area 56 Cut Area 58 Electrode Area <Related Technology 1>
210 Vibration element 211 Base 241 Upper surface 242 Lower surface 212a, 212b Vibration arm portion 213a, 213b Groove portion 215 Quartz vibration piece 216a, 216b Notch portion 221a, 221b Pad electrode 222a, 222b Excitation electrode 223a, 223b Frequency adjustment metal film 224a, 224b Pattern 231 conductive adhesive

Claims (5)

A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
A notch formed on the outer periphery of the base so as to be recessed in the thickness direction from the upper surface and the lower surface;
In the crystal resonator element with
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface,
A thin portion that is provided in the notch and protrudes away from at least one of the extended upper surface and the extended lower surface;
A crystal resonator element, further comprising: The thin portion has a thin portion upper surface and a thin portion lower surface,
The thin-walled upper surface is a surface away from the extended upper surface,
The thin wall lower surface is a surface away from the extended lower surface,
The crystal resonator element according to claim 1. The base is rectangular when viewed from the upper surface side and the lower surface side,
The cut portion is provided in a portion including a vertex on the opposite side of the vibration portion side of the base portion,
The crystal resonator element according to claim 2. The thin portion has a portion corresponding to the apex removed,
The crystal resonator element according to claim 3. The method for manufacturing a crystal resonator element according to any one of claims 1 to 4, wherein a groove portion is formed along the extending direction in the vibrating portion.
When forming the groove portion, simultaneously form the cut portion and the thin portion,
A method for manufacturing a quartz crystal resonator element.

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