JP6457199B2 - Quartz vibrating element and method for manufacturing the same - Google Patents

Description

  The present invention relates to a crystal resonator element used for, for example, a reference signal source and a clock signal source, and a manufacturing method thereof. Hereinafter, a tuning fork-type bending quartz crystal vibrating element (hereinafter abbreviated as “vibrating element”) will be described as an example of a quartz crystal vibrating element.

  FIG. 9 is a perspective view showing a vibration element according to Related Technique 1. FIG. Hereinafter, description will be given based on this drawing.

  The vibration element 210 of the related technology 1 includes a base 211, vibration arm portions 212a and 212b, and cutout portions 215a and 215b. The vibration element 210 having such a structure is disclosed in Patent Documents 1 and 2, for example.

  The base 211 has a square shape when viewed from the upper surface 241 side and the lower surface 242 side, and the lower surface 242 is fixed to an element mounting member (not shown) by the conductive adhesive 231. The vibrating arm portions 212a and 212b are extended from the base portion 211 and formed with groove portions 213a and 213b, respectively. The notches 215a and 215b penetrate from the upper surface 241 to the lower surface 242 of the base 211, and are formed on opposite sides of the base 211, respectively.

  The base portion 211 and the vibrating arm portions 212 a and 212 b are made of a crystal vibrating piece 214. The vibration element 210 includes pad electrodes 221a and 221b, excitation electrodes 222a and 222b, frequency adjustment metal films 223a and 223b, wiring patterns 224a and 224b, and the like in addition to the crystal vibrating piece 214.

  The portions of the base 211 close to the vibrating arm portions 212a and 212b vibrate together with the bending vibration of the vibrating arm portions 212a and 212b. If this portion is fixed with the conductive adhesive 231, a problem that vibration energy leaks to the element mounting member side (hereinafter referred to as “vibration leakage”) occurs. This vibration leakage is a loss of vibration energy, and thus causes deterioration or increase in the CI (Crystal Impedance) value of the vibration element 210.

  Here, the cut portions 215 a and 215 b prevent the conductive adhesive 231 from flowing into the vibrating arm portions 212 a and 212 b of the base portion 211.

JP 59-183520 A JP 2002-261575 A

  However, the vibration element 210 of Related Art 1 has the following problems.

  Even when the cut portions 215a and 215b are provided, for example, when the supply amount of the conductive adhesive 231 increases, the conductive adhesive 231 exceeds the cut portions 215a and 215b and the vibrating arm portions 212a and 212b of the base 211. It sometimes flowed to the side. In recent years, with the miniaturization of the vibration element 10, the notches 215a and 215b are also miniaturized, and this problem is becoming more serious.

  Accordingly, an object of the present invention is to provide a vibration element and a method of manufacturing the same that can reliably suppress the flow of the conductive adhesive to the vibrating portion side of the base when the cut portion is formed in the base portion. There is to do.

The vibration element according to the present invention is
A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
An outer notch formed on the outer periphery of the base so as to penetrate the upper surface and the lower surface;
An inner notch formed on an inner periphery of the outer notch so as to be recessed in the thickness direction from the upper surface and the lower surface;
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface, it is formed in the inner notch, and at least one of the extended upper surface and the extended lower surface A thin-walled portion that protrudes away from the
Equipped with a,
The outer notch is rectangular when viewed from the upper surface side and the lower surface side,
On the inner periphery of the outer cut portion, there are a first surface on the vibration portion side, a second surface on the opposite side to the vibration portion side, and a third surface connecting the first surface and the second surface. Included,
Of the intersecting line between the third surface and the first surface and the intersecting line between the third surface and the second surface, the inside includes a portion including only the intersecting line between the third surface and the second surface. A notch was formed,
Is.

The manufacturing method according to the present invention includes:
A method of manufacturing a vibration element according to the present invention in which a groove is formed along the extending direction in the vibration part,
When forming the groove portion, simultaneously form the inner cut portion and the thin portion,
It is characterized by that.

  According to the present invention, by providing the inner cut portion in the outer cut portion and providing the thin wall portion protruding in the inner cut portion, the conductive adhesive can be guided to the inner cut portion and the thin wall portion. The flow of the conductive adhesive to the vibrating part side can be reliably suppressed by the outer cut part.

FIG. 3 is a perspective view illustrating a vibration element according to the first embodiment. 2 [A] is a cross-sectional view taken along the line IIa-IIa in FIG. 1, FIG. 2 [B] is a cross-sectional view taken along the line IIb-IIb in FIG. 1, and FIG. It is a schematic sectional drawing which shows the state mounted in the member. It is a perspective view which shows an outer side cut | notch part, an inner side cut | notch part, and a thin part, FIG. 3 [A] is Embodiment 1, FIG. 3 [B] is the modification 1. FIG. It is a perspective view which shows an outer side cut part, an inner side cut part, and a thin part, FIG. 4 [C] is the modification 2 and FIG. 4 [D] is the modification 3. FIG. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 5 [A], FIG. 5 [B], and FIG. 5 [C]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 6 [D], FIG. 6 [E], and FIG. 6 [F]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 7 [G], FIG. 7 [H], and FIG. 7 [I]. It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 8 [J], FIG. 8 [K], and FIG. 8 [L]. It is a perspective view which shows the vibration element of related technology.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. Moreover, since the shape drawn on drawing is drawn so that those skilled in the art can understand easily, it does not necessarily correspond with an actual dimension and ratio.

  FIG. 1 is a plan view illustrating the vibration element according to the first embodiment. 2A is a cross-sectional view taken along line IIa-IIa in FIG. 2B is a cross-sectional view taken along line IIb-IIb in FIG. FIG. 2C is a schematic cross-sectional view illustrating a state where the vibration element of FIG. 1 is mounted on an element mounting member. FIG. 3A is a perspective view showing the outer cut portion, the inner cut portion, and the thin portion in FIG. Hereinafter, description will be given based on these drawings. Note that the extension upper surface 113, the extension lower surface 114, the thin-walled upper surface 171 and the thin-walled lower surface 172 are denoted by reference numerals only in FIG. About the 1st surface 151, the 2nd surface 152, the 3rd surface 153, and the intersection line 154, a code | symbol is attached | subjected only to FIG. 3 [A].

  As shown in FIG. 1, the vibration element 10 according to the first embodiment includes a base 11, two vibrating arm portions 12a and 12b as vibration portions, outer cut portions 15a and 15b, and inner cut portions 16a and 16b. And thin-walled portions 17a and 17b. The base 11 has an upper surface 111 and a lower surface 112 in the thickness direction, and the lower surface 112 is fixed to the element mounting member 32 (FIG. 2C) by the conductive adhesive 31. The vibrating arm portions 12 a and 12 b are extended from the base portion 11. The outer notches 15a and 15b are formed on the outer periphery of the base 11 so as to penetrate the upper surface 111 and the lower surface 112, respectively. The inner cut portion 16a is formed on the inner periphery of the outer cut portion 15a so as to be recessed from the upper surface 111 and the lower surface 112 in the thickness direction. The inner cut portion 16b is formed on the inner periphery of the outer cut portion 15b so as to be recessed from the upper surface 111 and the lower surface 112 in the thickness direction.

  As shown in FIG. 2B, a virtual surface with the upper surface 111 extended is referred to as an extended upper surface 113, and a virtual surface with the lower surface 112 extended is referred to as an extended lower surface 114. At this time, the thin portions 17a and 17b are provided in the inner cut portions 16a and 16b, respectively, and protrude in a state separated from at least one of the extended upper surface 113 and the extended lower surface 114. More specifically, the thin portions 17a and 17b have a thin portion upper surface 171 and a thin portion lower surface 172. The thin portion upper surface 171 is a surface away from the extended upper surface 113, and the thin wall lower surface 172 is a surface away from the extended lower surface 114. It is.

  As shown in FIG. 3A, on the inner periphery of the outer cut portion 15a, there are a first surface 151 on the vibrating arm portion 12a side and a second surface 152 on the opposite (base end surface 110) side on the vibrating arm portion 12a side. And are included. An inner cut portion 16 a is formed on at least the second surface 152. The outer cut 15a has a rectangular shape when viewed from the upper surface 111 side and the lower surface 112 side. Therefore, a third surface 153 that connects the first surface 151 and the second surface 152 is further included in the inner periphery of the outer cut portion 15a. An inner cut portion 16 a is formed at a portion including the intersection line 154 between the third surface 153 and the second surface 152. The inner cut portion 16a and the thin portion 17a are also substantially rectangular in plan view.

  The outer cut portion 15b, the inner cut portion 16b, and the thin portion 17b shown in FIG. 1 sandwich the center line (the extending direction of the vibrating arm portions 12a and 12b) with the outer cut portion 15a, the inner cut portion 16a, and the thin portion 17a. This is a line-symmetric structure.

  The vibrating arm portions 12a and 12b are extended from the base portion 11 in the same direction, and groove portions 13a and 13b are provided along the extending direction. The base portion 11 and the vibrating arm portions 12 a and 12 b are made of a crystal vibrating piece 14. In addition to the crystal vibrating piece 14, the vibration element 10 includes pad electrodes 21a and 21b, excitation electrodes 22a and 22b, frequency adjusting metal films 23a and 23b, wiring patterns 24a and 24b, and the like.

  Next, the configuration of the vibration element 10 will be described in more detail.

  The base 11 is a flat plate having a substantially rectangular shape in plan view. The quartz crystal resonator element 14 has a tuning fork shape in which the base 11 and the vibrating arms 12a and 12b are integrated, and is manufactured by a film forming technique, a photolithography technique, and a wet etching technique.

  The groove portions 13a, 13b vibrate from the boundary portion with the base 11 toward the tips of the vibrating arm portions 12a, 12b, two on the front and back surfaces of the vibrating arm portion 12a and two on the front and back surfaces of the vibrating arm portion 12b. The arm portions 12a and 12b are provided with a predetermined length parallel to the length direction of the arms 12a and 12b. In the first embodiment, two grooves 13a and 13b are provided on the front and back surfaces of the vibrating arm 12a and two grooves on the front and back surfaces of the vibrating arm 12b. However, the number of the grooves 13a and 13b is not limited. For example, one may be provided on the front and back surfaces of the vibrating arm portion 12a and one on each of the front and back surfaces of the vibrating arm portion 12b, or may be provided on only one side of the front and back surfaces.

  The vibrating arm 12a is provided with excitation electrodes 22a on both side surfaces so that the planes facing each other across the crystal have the same polarity, and an excitation electrode 22b is provided inside the groove 13a on the front and back surfaces. Similarly, the vibrating arm portion 12b is provided with excitation electrodes 22b on both side surfaces so that the planes facing each other across the crystal have the same polarity, and the excitation electrode 22a is provided inside the groove portion 13b on the front and back surfaces. . Accordingly, in the vibrating arm portion 12a, the excitation electrode 22a provided on both side surfaces and the excitation electrode 22b provided in the groove portion 13a have different polarities, and in the vibrating arm portion 12b, the excitation electrode 22b provided on both side surfaces. And the excitation electrode 22a provided in the groove 13b have different polarities.

  The base 11 is provided with pad electrodes 21a and 21b and wiring patterns 24a and 24b. The wiring pattern 24a electrically connects the pad electrode 21a and the excitation electrode 22a, and the wiring pattern 24b electrically connects the pad electrode 21b and the excitation electrode 22b. The pad electrode 21a, the excitation electrode 22a, the frequency adjusting metal film 23a, and the wiring pattern 24a are electrically connected to each other. The pad electrode 21b, the excitation electrode 22b, the frequency adjusting metal film 23b, and the wiring pattern 24b are also electrically connected to each other.

  The vibration element 10 is fixed and electrically connected to the pad electrode 33 on the element mounting member 32 side via the pad electrodes 21 a and 21 b and the conductive adhesive 31.

  Quartz crystals are trigonal. A crystal axis passing through the crystal apex is defined as a Z axis, three crystal axes connecting ridge lines in a plane perpendicular to the Z axis are defined as an X axis, and a coordinate axis orthogonal to the X axis and the Z axis is defined as a Y axis. Here, when the coordinate system consisting of these X, Y, and Z axes is rotated within a range of ± 5 degrees around the X axis, the rotated Y axis and Z axis are respectively represented as Y ′ axis and Z axis. 'As axis. In this case, in the first embodiment, the extending direction of the two vibrating arm portions 12a and 12b is the Y′-axis direction, and the direction in which the two vibrating arm portions 12a and 12b are arranged is the X-axis direction. .

  Next, the operation of the vibration element 10 will be described. When the tuning fork type vibration element 10 is vibrated, an alternating voltage is applied to the pad electrodes 21a and 21b. When an electrical state after application is instantaneously captured, the excitation electrodes 22b provided in the groove portions 13a on the front and back of the vibrating arm portion 12a have a positive potential, and the excitation electrodes 22a provided on both side surfaces of the vibrating arm portion 12a are A negative electric potential is generated, and an electric field is generated from positive to negative. At this time, the excitation electrode 22a provided in the groove 13b on the front and back sides of the vibrating arm portion 12b has a negative potential, and the excitation electrode 22b provided on both side surfaces of the vibrating arm portion 12b has a positive potential, and is generated in the vibrating arm portion 12a. The polarity is opposite to the polarity, and an electric field is generated from plus to minus. The electric field generated by the alternating voltage causes a stretching phenomenon in the vibrating arm portions 12a and 12b, and a flexural vibration mode having a predetermined resonance frequency is obtained.

  Next, the operation and effect of the vibration element 10 will be described.

  (1) According to the first embodiment, the inner notches 16a and 16b are provided in the outer notches 15a and 15b, and the thin portions 17a and 17b projecting in the inner notches 16a and 16b are provided. Since the conductive adhesive 31 can be guided to the cut portions 16a and 16b and the thin portions 17a and 17b, the flow of the conductive adhesive 31 to the vibrating arm portions 12a and 12b of the base portion 11 is prevented from flowing into the outer cut portions 15a and 15a. It is reliably suppressed by 15b. That is, the conductive adhesive 31 that is about to flow into the vibrating arm portions 12a and 12b beyond the outer notches 15a and 15b scoops up the inner notches 16a and 16b due to surface tension, and is further thinned portions 17a and 17b. If you crawl up and stay there, you can't go further.

  Since the creeping distance from the lower surface 112 to the upper surface 111 can be sufficiently obtained by providing the thin portions 17a and 17b that protrude in the inner cut portions 16a and 16b, the conductive adhesive 31 that reaches the upper surface 111 is excessively excessive. Can suppress the crawl up. Therefore, a short circuit of the wiring patterns 24a, 24b, etc. on the upper surface 111 can be prevented.

  Moreover, since the inner cut portions 16a and 16b and the thin portions 17a and 17b are provided, the adhesion area of the conductive adhesive 31 can be further increased as compared with the case where only the outer cut portions 15a and 15b are provided. Further, the adhesive strength between the conductive adhesive 31 and the vibration element 10 can be further increased.

  (2) The inner peripheries of the outer notches 15a and 15b include a first surface 151 on the vibrating arm portions 12a and 12b side and a second surface 152 on the opposite side to the vibrating arm portions 12a and 12b, and at least second In the case where the inner cut portions 16a and 16b are formed on the surface 152, the conductive adhesive 31 which is about to flow into the first surface 151 can be suppressed in front of the surface 152, so that vibration leakage can be further reduced. This is because vibration leakage increases as the conductive adhesive 31 approaches the vibrating arm portions 12a and 12b. Therefore, in the first embodiment, it is desirable that the inner cut portions 16a and 16b are formed in a portion including the intersection line 154 between the third surface 153 and the second surface 152.

  (3) When the thin wall upper surface 171 is a surface away from the extended upper surface 113 and the thin wall lower surface 172 is a surface separated from the extended lower surface 114, the base 11 can be formed vertically symmetrically. The same vibration characteristic can be obtained regardless of which of the lower surface 112 and the lower surface 112 is bonded to the element mounting member 32. Therefore, the trouble of checking the upper surface 111 and the lower surface 112 can be saved, so that the mounting process can be simplified.

  Next, the outer cut portion, the inner cut portion, and the thin portion in the modified example of the first embodiment will be described with reference to FIGS. 3 and 4.

  FIG. 3B shows an outer cut portion 65a, an inner cut portion 66a, and a thin portion 67a in Modification 1. The outer notch 65a has a substantially ¼ circular shape in plan view, and the inner notch 66a has a substantially ¾ circular shape in plan view. The inner periphery of the outer notch 65a includes a first surface 651 on the vibrating arm 12a side and a second surface 652 on the opposite (base end surface 110) side on the vibrating arm 12a side. The first surface 651 is an arc-shaped concave curved surface, and the second surface 652 is a flat surface. The inner notch 66a is formed in at least the second surface 652, and specifically, is formed in a portion including the intersection line 654 between the first surface 651 and the second surface 152.

  FIG. 4C shows an outer cut portion 75a, an inner cut portion 76a, and a thin portion 77a in Modification 2. In FIG. 2B, the thin-walled portion 77a has a structure in which the extended lower surface 114 and the thin-walled lower surface 172 coincide. The inner periphery of the outer notch 75a includes a first surface 751 on the vibrating arm 12a side and a second surface 752 on the opposite (base end surface 110) side on the vibrating arm 12a side. The outer notch 75a has a substantially rectangular shape in plan view. Therefore, a third surface 753 that connects the first surface 751 and the second surface 752 is further included in the inner periphery of the outer notch 75a. The inner notch 76a is formed in at least the second surface 752, and specifically, is formed in a portion including the intersection line 754 between the third surface 753 and the second surface 752.

  FIG. 4D shows an outer cut portion 85a, an inner cut portion 86a, and a thin portion 87a in Modification 3. In FIG. 2B, the thin-walled portion 87a has a structure in which the extended upper surface 113 and the thin-walled portion upper surface 171 coincide. The inner periphery of the outer notch 85a includes a first surface 851 on the vibrating arm 12a side and a second surface 852 on the opposite (base end surface 110) side on the vibrating arm 12a side. The outer notch 85a has a substantially rectangular shape in plan view. Therefore, a third surface 853 connecting the first surface 851 and the second surface 852 is further included in the inner periphery of the outer cutout portion 85a. The inner notch 86a is formed in at least the second surface 852, and specifically, is formed in a portion including the intersection line 854 between the third surface 853 and the second surface 852.

  As shown in the first to third modifications, the shapes of the outer cut portion, the inner cut portion, and the thin portion are arbitrary. Also, the number and position of these are arbitrary. Other configurations, operations, and effects of the first to third modifications are the same as those of the first embodiment.

  Next, a method for manufacturing the resonator element according to the first embodiment will be described as a manufacturing method according to the second embodiment. 5 to 8 are cross-sectional views showing each step in the manufacturing method of the second embodiment. Hereinafter, the manufacturing method of the second embodiment will be described with reference to FIGS.

  As shown in FIG. 1, the vibrating arm portion 12a and the vibrating arm portion 12b have the same structure symmetrically, and the vibrating arm portion 12a side and the vibrating arm portion 12b side of the base 11 have the same symmetrical structure. Accordingly, FIGS. 5 to 8 show a manufacturing process only on the vibrating arm portion 12a side and only on the vibrating arm portion 12a side of the base 11 in the IIa-IIa line cross section and the IIb-IIb line cross section in FIG.

  The manufacturing method according to the second embodiment is a method for manufacturing the resonator element 10 according to the first embodiment, and is characterized in that the inner cut portion 16a and the thin portion 17a are simultaneously formed when the groove portion 13a is formed. . This will be described in detail below.

  First, as shown in FIG. 5A, for example, a corrosion-resistant film 42 is formed on the front and back surfaces of a substrate 41 made of a quartz Z plate, a photoresist film 43 is formed on the corrosion-resistant film 42, and a vibrating arm portion and The external patterning is performed by removing a part of the photoresist film 43 so that the photoresist film 43 remains only in the region 52 and the base region 51. At this time, the photoresist film 43 in the region 55 that becomes the outer cut portion is also removed. The corrosion-resistant film 42 is made of a metal having corrosion resistance against the crystal etching solution, and may be a single layer made of chromium or a plurality of layers made of chromium and gold, for example. The photoresist film 43 is applied by, for example, a spin coat method.

  Subsequently, as shown in FIG. 5B, the portion of the corrosion-resistant film 42 where the photoresist film 43 is not formed in FIG. 5A is removed by etching. For example, the corrosion-resistant film 42 not covered with the photoresist film 43 is removed by wet etching using a dedicated etching solution. Thereby, the substrate 41 appears in the portion where the corrosion-resistant film 42 is removed.

  Subsequently, as shown in FIG. 5 [C], the photoresist film 43 remaining in FIG. 5 [B] is all removed.

  Subsequently, as shown in FIG. 6D, a photoresist film 44 is formed on the entire surface of the substrate 41 including the corrosion resistant film 42.

  Subsequently, as shown in FIG. 6E, a part of the photoresist film 44 is removed. At this time, not only the portion of the photoresist film 44 other than the region 52 to be the vibrating arm portion and the region 51 to be the base portion is removed, but also the region 53 to be the groove portion and the photoresist film 44 in the region 56 to be the inner cut portion. By removing, the groove portion and the inner cut portion patterning is performed.

  Subsequently, as shown in FIG. 6 [F], outer shape etching is performed. That is, in the substrate 41 made of a quartz Z plate, the etching is performed leaving only the region 52 serving as the vibrating arm portion and the region 51 serving as the base portion. As a result, the substrate 41 that is not covered with the corrosion-resistant film 42, that is, the exposed surface of the crystal, is completely removed using buffered hydrofluoric acid (HF + NH4F), whereby the outer shape of the vibrating arm portion 12a and the base portion 11 and the outer cut portion 15a. Form.

  Subsequently, as shown in FIG. 7G, the corrosion-resistant film 42 in the region 53 that becomes the groove and the region 56 that becomes the inner cut portion is removed.

  Subsequently, as shown in FIG. 7 [H], the groove portion and the inner cut portion are etched. That is, in the substrate 41 made of a quartz Z plate, the region 53 to be a groove and the region 56 to be an inner cut are etched to a certain depth. As a result, the substrate 41 that is not covered with the corrosion-resistant film 42, that is, the exposed surface of the crystal is half-etched using buffered hydrofluoric acid (HF + NH4F), thereby forming the inner cut portion 16a and the thin portion 17a simultaneously with the groove portion 13a. To do.

  Subsequently, as shown in FIG. 7I, all of the corrosion-resistant film 42 and the photoresist film 44 are removed.

  Subsequently, an electrode film 46 is formed on the entire front and back surfaces of the substrate 41 as shown in FIG. The electrode film 46 is, for example, a single layer film of chromium or titanium, or a laminated film in which palladium or gold is formed thereon, and is formed by sputtering or vapor deposition, for example.

  Subsequently, as shown in FIG. 8K, a photoresist film 45 is formed on the entire surface of the electrode film 46 by electrodeposition, and the electrode pattern is exposed and developed. At this time, in the region 51 serving as the base, the region 58 serving as the electrode is covered with the photoresist film 45. In addition, the electrodeposition method is suitable for forming the photoresist film 45 to the minute unevenness like the region 53 to be the groove. The region 58 serving as an electrode includes the region serving as the pad electrode 21a and the wiring patterns 24a and 24b illustrated in FIG. 1 in addition to the region serving as the pad electrode 21b illustrated in FIG.

  Finally, as shown in FIG. 8L, the electrode film 46 not covered with the photoresist film 45 is removed by etching, and then the photoresist film 45 is also removed. As a result, the excitation electrodes 22a and 22b are formed in the vibrating arm portion 12a and the groove portion 13a, and the pad electrode 21b is formed in the base portion 11, the outer cut portion 15a, the inner cut portion 16a, and the thin portion 17a. At this time, as shown in FIG. 1, the pad electrode 21a and the wiring patterns 24a and 24b are also formed, and the vibration element 10 is completed. The frequency adjusting metal films 23a and 23b may be formed by, for example, a separate metal mask and vapor deposition.

  According to the manufacturing method of the second embodiment, as shown in FIG. 7 [H], the inner notches 16a and 16b and the thin portions 17a and 17b are formed simultaneously with the grooves 13a and 13b. The existing process can be used as it is simply by changing the mask (FIG. 6E).

  In addition, the manufacturing method of this Embodiment 2 will be what other processes will be, if the process of forming the inner notches 16a and 16b and the thin parts 17a and 17b simultaneously with the groove parts 13a and 13b is included. May be. For example, the groove portion, the inner cut portion and the thin portion may be formed simultaneously with the outer shape and the outer cut portion using an etching suppression pattern, the electrode may be formed by a lift-off method, and the photoresist film is a positive type. You may reduce the frequency | count of application | coating and peeling by utilizing a latent image. Other configurations, operations, and effects of the second embodiment are the same as those of the first embodiment.

  Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention. Further, the present invention includes a combination of some or all of the configurations of the above-described embodiments as appropriate.

  The present invention can be used for any vibration element provided with a base, a vibration part, and a notch. For example, in addition to a tuning fork type bending vibration element and a thickness shear vibration element, a sensor element such as a gyro sensor Also available.

<Embodiment 1>
DESCRIPTION OF SYMBOLS 10 Vibration element 11 Base part 110 Base end surface 111 Upper surface 112 Lower surface 113 Extension upper surface 114 Extension lower surface 12a, 12b Vibration arm part 13a, 13b Groove part 14 Crystal vibration piece 15a, 15b Outer notch part 151 First surface 152 Second surface 153 Third surface 154 Intersection 16a, 16b Inner cut portion 17a, 17b Thin portion 171 Thin portion upper surface 172 Thin portion lower surface 21a, 21b Pad electrode 22a, 22b Excitation electrode 23a, 23b Frequency adjusting metal film 24a, 24b Wiring pattern 31 Conductive adhesive 32 Element mounting member 33 Pad electrode <Modification>
65a, 75a, 85a, outer notch 651, 751, 851 first surface 652, 752, 852 second surface 753, 853 third surface 654, 754, 854 intersection line 66a, 76a, 86a inner notch 67a, 77a, 87a Thin-walled portion <Embodiment 2>
41 Substrate 42 Corrosion resistant film 43, 44, 45 Photoresist film 46 Electrode film 51 Area to be the base 52 Area to be the vibrating arm part 53 Area to be the groove part 55 Area to be the outer cut part 56 Area to be the inner cut part 58 Electrode Area <Related Technology 1>
210 vibrating element 211 base 241 upper surface 242 lower surface 212a, 212b vibrating arm 213a, 213b groove 214 crystal vibrating piece 215a, 215b notch 221a, 221b pad electrode 222a, 222b excitation electrode 223a, 223b frequency adjusting metal film 224a, 224b Pattern 231 conductive adhesive

Claims (3)

A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
An outer notch formed on the outer periphery of the base so as to penetrate the upper surface and the lower surface;
An inner notch formed on an inner periphery of the outer notch so as to be recessed in the thickness direction from the upper surface and the lower surface;
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface, it is formed in the inner notch, and at least one of the extended upper surface and the extended lower surface A thin-walled portion that protrudes away from the
Equipped with a,
The outer notch is rectangular when viewed from the upper surface side and the lower surface side,
On the inner periphery of the outer cut portion, there are a first surface on the vibration portion side, a second surface on the opposite side to the vibration portion side, and a third surface connecting the first surface and the second surface. Included,
Of the intersecting line between the third surface and the first surface and the intersecting line between the third surface and the second surface, the inside includes a portion including only the intersecting line between the third surface and the second surface. A notch was formed,
Crystal vibrating element. The thin portion has a thin portion upper surface and a thin portion lower surface,
The thin-walled upper surface is a surface away from the extended upper surface,
The thin wall lower surface is a surface away from the extended lower surface,
The crystal resonator element according to claim 1 . The method for manufacturing a crystal resonator element according to claim 1 or 2 , wherein a groove portion is formed along the extending direction in the vibration portion.
When forming the groove portion, simultaneously form the inner cut portion and the thin portion,
A method for manufacturing a quartz crystal resonator element.

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