JP2013162030A - Electronic device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device that is made compact and increased in manufacturing yield by preventing a package from being broken in a manufacturing process therefor, and an electronic apparatus including the same.SOLUTION: An electronic device (piezoelectric device 10) includes a package 12 having a first recessed part 16 in which an electronic component (piezoelectric vibration chip 72) is housed and a second recessed part 60 sharing a bottom part of the first recessed part 16 and opened to the opposite direction from the first recessed part 16, and a lid 84G sealing the opening part of the first recessed part 16, and is characterized in that an inner wall surface of the second recessed part 60 includes a groove 66 which partially extends along a depth of the second recessed part 60 and is arcuate in plane view, and the groove 66 is filled with metal bodies 68E and 68F.

Description

  The present invention relates to an electronic device and an electronic apparatus, and more particularly to a technique for preventing breakage of a package during a manufacturing process of a miniaturized electronic device.

  Conventionally, for the purpose of reducing the size of an oscillator, a structure in which a piezoelectric vibrating reed that excites vibration and an integrated circuit (IC) that controls oscillation are stacked in the stacking direction is known as one of electronic devices. It has been. As an example of an electronic device having such a structure, a device having a so-called H-shaped package as shown in FIG. 9 can be cited (see Patent Documents 1 and 2).

  FIG. 9 shows a sectional view of a conventional piezoelectric device, and FIG. 10 shows a bottom view of FIG. 9 is a cross-sectional view taken along the line AA in FIG. As shown in FIG. 9, the piezoelectric device 100 according to the related art includes a package 102 having a laminated structure, a piezoelectric vibrating piece 114 disposed in a first recess 108 on the top of the package 102, and an opening of the first recess 108. A lid 116 for sealing the portion. The package 102 includes a center substrate 104 on which the piezoelectric vibrating piece 114 is mounted, a first frame substrate 106 bonded to the periphery of the upper surface of the center substrate 104 to form a first recess 108, and a periphery of the lower surface of the center substrate 104. And a second frame-like substrate 110 which is joined to form a second recess 112. In the second recess 112, an integrated circuit 118 that is electrically connected to the piezoelectric vibrating piece 114 is disposed.

  As shown in FIGS. 9 and 10, a plurality of connection electrodes 122 that are bonded to the bottom surface of the second recess 112 via the pad electrodes 120 of the integrated circuit 118 and the bumps 128 are disposed. A part of the connection electrode 122 is electrically connected to the piezoelectric vibrating piece 114 via a through electrode (not shown) penetrating the center substrate 104 in the thickness direction. Further, the remaining connection electrodes 122 are electrically connected to the mounting electrode 126 disposed at the lower end of the package 102 via a through electrode 124 that penetrates the second frame substrate 110 in the thickness direction.

  As a manufacturing process of the piezoelectric device 100, first, as shown in FIG. 9, a package 102 having an H-shaped cross section is constructed by a center substrate 104, a first frame substrate 106, and a second frame substrate 110. Then, the piezoelectric vibrating piece 114 is accommodated and mounted in the first recess 108, the position around the opening of the first recess 108 of the package 102 and the lid 116 are joined by seam welding, and the second The integrated circuit 118 is accommodated in the recess 112 and mounted.

JP 2000-138553 A JP 2011-228978 A

  However, as the electronic device typified by the piezoelectric device 100 described above is downsized, it is difficult to form the through electrode 124a shown in FIG. 10, that is, the through electrode 124a other than the corners of the second frame substrate 110. Become. That is, even if the through electrode 124a is formed at that position, the second frame substrate 110 (package 102) may be damaged with the through electrode 124a forming portion as a base point due to thermal distortion during seam welding.

  Accordingly, the present invention pays attention to the above-mentioned problems, and in an electronic device that is miniaturized, an electronic device that prevents the package from being damaged during the manufacturing process and increases the manufacturing yield, and an electronic apparatus including the electronic device. The purpose is to provide.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A package having a first recess that accommodates an electronic component, and a second recess that shares the bottom of the first recess and opens in a direction opposite to the first recess, A lid that seals the opening of the first recess, and a part of the inner wall surface of the second recess is in the depth direction of the second recess. An electronic device having an arcuate groove extending in a plan view, the groove being filled with a metal body.

  With the above configuration, the thickness of the member forming the wall surface of the second recess can be ensured to some extent, so that the strength of the entire package can be increased. At this time, the thermal strain accompanying the seam welding of the lid is concentrated on the portion where the metal body is disposed. However, the metal body can absorb the thermal strain. Therefore, the electronic device has an improved manufacturing yield by preventing breakage of the package.

Application Example 2 The package is connected to a center substrate and a peripheral edge of one main surface of the center substrate, and forms the first recess having a bottom surrounded by the periphery of the center substrate. And a first frame-like substrate to be joined to the lid, and the second concave portion connected to the periphery of the other main surface of the center substrate and having a range surrounded by the periphery of the center substrate as a bottom. The electronic device according to Application Example 1, wherein the electronic device includes a second frame-shaped substrate.
With the above structure, the electronic device can be formed with a stacked structure to reduce costs.

[Application Example 3] The electronic device according to Application Example 1 or 2, wherein a material of the package is ceramic.
With the above configuration, even if the package material is ceramic, the thermal strain accompanying seam welding can be concentrated on the metal body, so that the electronic device can be manufactured with increased manufacturing yield while suppressing the cost of the package material.

  [Application Example 4] Any one of Application Examples 1 to 3, wherein the groove is disposed at a position separated from a center position in the width direction of the wall surface toward an end portion side in the width direction of the wall surface. Or an electronic device as described in one example.

  The central position in the width direction of the wall surface of the second recess is a place where thermal strain accompanying seam welding is concentrated. Therefore, by arranging the metal body at a position away from the position as in the above configuration, the location where the thermal strain concentration portion becomes the center in the width direction of the wall surface of the second recess of the package, and the metal body And can be dispersed. Therefore, durability against thermal distortion of the entire package can be enhanced.

Application Example 5 The electronic device according to any one of Application Examples 1 to 4, wherein a plurality of the grooves are arranged on the wall surface.
With the above-described configuration, the location where thermal strain is concentrated can be dispersed in a plurality of metal bodies, so that the durability of the entire package against thermal strain can be further improved.

  Application Example 6 A mounting terminal is provided around the opening of the second recess, and the groove and the metal body extend to an edge of the opening of the second recess so that the metal body The electronic device according to any one of Application Examples 1 to 5, wherein the electronic device is connected to the mounting terminal.

  With the above configuration, the metal body can be used as a part of the electrodes constituting the electronic device, and the stress that the mounting electrode receives from the mounting substrate is concentrated on the metal body, and the stress that the package receives from the mounting substrate. Can be reduced.

Application Example 7 In Application Example 6, in which the second electronic component is disposed in the second recess, and the metal body is electrically connected to the second electronic component. The electronic device described.
With the above configuration, the metal body can be formed on the second electronic component in accordance with the number of connection electrodes, so that the strength of the entire package can be maintained.

[Application Example 8] An electronic apparatus including the electronic device according to any one of Application Examples 1 to 7.
For the same reason as in Application Example 1, the electronic device has an improved manufacturing yield by preventing package damage.

It is a disassembled perspective view (the 1) of the piezoelectric device of this embodiment. It is a disassembled perspective view (the 2) of the piezoelectric device of this embodiment. It is the sectional view on the AA line of FIG. 1, FIG. It is a top view of the piezoelectric device of this embodiment. It is a bottom view of the center board | substrate of this embodiment. It is a bottom view (before integrated circuit mounting) of the piezoelectric device of this embodiment. It is a bottom view (after integrated circuit mounting) of the piezoelectric device of this embodiment. It is a schematic diagram of the electronic device carrying the piezoelectric device of this embodiment. It is sectional drawing of the piezoelectric device of a prior art. FIG. 10 is a bottom view of FIG. 9.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  1 and 2 are exploded perspective views of the piezoelectric device of this embodiment. 3 is a cross-sectional view taken along the line AA of FIGS. 1 and 2, and FIG. 4 is a plan view of the piezoelectric device of the present embodiment (with the lid omitted). In FIG. 5, the bottom view of the center board | substrate of this embodiment is shown. FIG. 6 shows a bottom view (before the integrated circuit is mounted) of the piezoelectric device of the present embodiment, and FIG. 7 shows a bottom view (after the integrated circuit is mounted) of the piezoelectric device of the present embodiment.

  Here, FIG. 1 and FIG. 2 describe a state in which each component is disassembled from an angle at which a downward surface can be seen in FIG. 3 (from the −Z axis direction). Therefore, in FIGS. 1 and 2, the surface that appears as an upward surface by a solid line is the lower surface of each component, and the surface that appears as a downward surface by a broken line is the upper surface of each component. FIG. 3 also corresponds to a cross-sectional view taken along line AA in FIGS. In the figure, the X, Y, and Z axes are orthogonal to each other.

  As shown in FIGS. 1 to 3, the piezoelectric device 10 (electronic device) of the present embodiment is housed in a package 12 whose cross section is H-shaped (see FIG. 3) and a first recess 16 of the package 12. Piezoelectric vibrating piece 72 (electronic component), metal lid 84G that seals the opening of first recess 16, and integrated circuit 54 (second electronic component) housed in second recess 60 of package 12 The whole outline is constructed by the above. Therefore, as shown in FIG. 3, the first recess 16 and the second recess 60 share the bottom, and the opening directions are opposite to each other.

  The package 12 is constructed by a laminated structure of insulating materials such as ceramics, and has four layers in which a second frame substrate 58, a second center substrate 38, a first center substrate 24, and a first frame substrate 14 are laminated in this order from the bottom. It has a structure.

  The first center substrate 24 is a rectangular substrate on which the piezoelectric vibrating piece 72 is mounted, and is bonded to the first frame substrate 14 and the second center substrate 38. The second center substrate 38 is mounted with the integrated circuit 54 and joined to the second frame substrate 58 and the first center substrate 24.

  The first frame-shaped substrate 14 is a rectangular ring-shaped substrate bonded to the periphery of the upper surface of the first center substrate 24. And the 1st frame-shaped board | substrate 14 is joined to the periphery of the 1st center board | substrate 24, The area | region enclosed by the part (periphery) joined to the 1st frame-shaped board | substrate 14 of the upper surface of the 1st center board | substrate 24 Is used as a bottom surface, and the first recess 16 for accommodating the piezoelectric vibrating piece 72 is formed.

  The second frame-shaped substrate 58 is a rectangular ring-shaped substrate bonded to the periphery of the lower surface of the second center substrate 38. Then, the second frame substrate 58 is bonded to the periphery of the second center substrate 38, so that a region surrounded by a portion (periphery) bonded to the second frame substrate on the lower surface of the second center substrate 38 is formed. A second recess 60 for accommodating the integrated circuit 54 is formed on the bottom surface.

  In the piezoelectric device 10, as shown in FIG. 1, the inner wall surface of the second recess 60 has a longitudinal direction in the depth direction of the second recess 60, and is a plan view (cross section viewed from the Z-axis direction). An arc-shaped (may be semi-circular) groove 66 is arranged, and the groove 66 is filled with metal bodies 68E and 68F.

  In the above configuration, the lid 84G and the package 12 are joined to each other by seam welding, and the seam welding is performed in a state where the joining portion is heated. On the other hand, since the thermal expansion coefficient of the lid 84G (metal) is larger than the thermal expansion coefficient of the package 12, the shrinkage amount of the lid 84G becomes larger than the shrinkage amount of the package 12 when cooled after seam welding. Therefore, the package 12 receives thermal distortion from the lid 84 </ b> G in the direction of narrowing the opening of the first recess 16. As a result, the first center substrate 24, the second center substrate 38, and the second frame substrate 58 are curved by receiving thermal strain in the direction in which the peripheral edge is pulled toward the lid 84G.

  Therefore, the second frame substrate 58 is subjected to thermal strain in the direction in which the opening of the second recess 60 expands. At this time, the portion between the corner portions of the second frame-shaped substrate 58 (portion through which the center line in FIGS. 3, 6, and 7 passes) is a portion where the thermal strain is most concentrated. If the through electrode 124a is formed in this portion as in the prior art (FIG. 10), the strength of that portion is remarkably weakened, and the second frame substrate 58 is cracked and broken.

  On the other hand, in the present embodiment, as shown in FIG. 1, the arc-shaped groove 66 is formed on the inner wall surface of the second frame-shaped substrate 58 in a plan view (cross section viewed from the Z-axis direction). . Thereby, the thickness of the second frame substrate 58 can be secured to some extent, so that the strength of the second frame substrate 58 can be maintained.

  In addition, metal bodies 68E and 68F are embedded in the groove 66. The metal (for example, copper) which is the material of the metal bodies 68E and 68F has lower strength (Young's modulus) than ceramic. Therefore, in this embodiment, thermal strain concentrates on the metal bodies 68E and 68F after seam welding, and stress concentration on the second frame substrate 58 can be avoided. And since the metal which is the material of the metal bodies 68E and 68F has malleability (flexibility), it can deform | transform itself and can absorb stress. Therefore, the piezoelectric device 10 is obtained in which the package 12 is prevented from being damaged and the manufacturing yield is increased.

  In the present embodiment, the cross section of the groove 66 viewed from the Z-axis direction has an arc shape. Thereby, since a corner | angular part is not formed in the groove | channel 66, the stress concentration with respect to a corner | angular part can be avoided and the durability of the package 12 can be maintained.

  In the present embodiment, the metal bodies 68E and 68F are moved from the position in the center in the width direction of the inner wall surface of the second frame-shaped substrate 58 (the position overlapping the center line O in FIGS. 3, 6, and 7) It arrange | positions in the position spaced apart in the width direction. Thereby, the thermal strain by seam welding can be distributed to the position in the center in the width direction of the inner wall surface of the second frame-shaped substrate 58 and the metal bodies 68E and 68F. Therefore, durability against thermal distortion of the entire package 12 can be enhanced. Of course, even if the metal body is arranged at a position overlapping the above-described center line O, the durability against thermal distortion of the second frame-shaped substrate 58 is greater than when the metal body is not disposed on the inner wall surface of the second frame-shaped substrate 58. Will improve.

  Furthermore, the metal bodies 68E and 68F extend to the edge of the opening of the second recess 60, that is, to the lower end of the second frame substrate 58, and are connected to the mounting electrodes 62E and 62F. Accordingly, the metal bodies 68E and 68F can be used as a part of the electrodes constituting the piezoelectric device 10, and the stress that the mounting electrodes 62E and 62F (second frame-shaped substrate 58) receive from the mounting destination substrate is metal. By concentrating on the bodies 68E and 68F, the stress that the package 12 receives from the mounting substrate can be reduced.

  1, 6, and 7, the metal bodies 68 </ b> E and 68 </ b> F are embedded in the wall surface forming the long side inside the second frame substrate 58, but the metal body may be embedded in the short side. Furthermore, it is also possible to embed a plurality of metal bodies on one wall surface inside the second frame-shaped substrate 58. With such a configuration, the thermal strain received by the second frame-shaped substrate 58 is a plurality of metals. It can be dispersed in the body, and the durability against thermal strain can be further enhanced.

  The number of metal bodies can be increased or decreased according to the number of pad electrodes 56 mounted on the integrated circuit 54. Then, a metal body is electrically connected to the pad electrode 56 of the integrated circuit 54 to achieve both the purpose of improving the durability of the package 12 and the purpose of performing the electrical connection of the integrated circuit 54.

In the present embodiment, the material of the package 12 is ceramic. However, even if the material is ceramic, the thermal strain associated with seam welding can be concentrated on the metal body, so that the piezoelectric device 10 with an improved manufacturing yield can be obtained while suppressing the cost of the material of the package 12.
In the present embodiment, the electronic component housed in the first recess 16 is the piezoelectric vibrating piece 72, but other electronic elements other than the piezoelectric vibrating piece 72 may be used.

  The configuration of the piezoelectric device 10 of the present embodiment will be described in detail. In the following description, capital letters are attached to the reference numerals attached to the electrodes and the like, but those having common alphabets are electrically connected to each other.

  As shown in FIGS. 1 and 3, mounting electrodes 62 (62 </ b> A, 62 </ b> B, 62 </ b> E, 62 </ b> F, 62 </ b> G, 62 </ b> H) are disposed on the lower surface of the second frame-shaped substrate 58. Among these, the mounting electrodes 62 </ b> A, 62 </ b> B, 62 </ b> G, and 62 </ b> H are arranged at corners of the second frame-shaped substrate 58. The mounting electrode 62E is disposed between the mounting electrode 62A and the mounting electrode 62G, and the mounting electrode 62F is disposed between the mounting electrode 62B and the mounting electrode 62H.

  A through electrode 64 (64A, 64B, 64G, 64H) penetrating through the second frame substrate 58 in the thickness direction is disposed at a position where the mounting electrodes 62A, 62B, 62G, 62H of the second frame substrate 58 are disposed. Has been. As shown in FIG. 1, upper surface electrodes 70 </ b> A, 70 </ b> B, 70 </ b> G, and 70 </ b> H are arranged at positions where the through electrodes 64 on the upper surface of the second frame substrate 58 are exposed so as to be connected to the through electrodes 64.

  As shown in FIG. 1, FIG. 3, etc., the inner wall surface of the second frame-shaped substrate 58 has a longitudinal direction in the thickness direction of the second frame-shaped substrate 58, and the cross section may be arc-shaped (semi-circular may be used). ), And metal bodies 68E and 68F are embedded in the groove 66. Therefore, the metal bodies 68E and 68F also have a circular arc shape in cross section following the shape of the groove 66. As shown in FIG. 3, the groove 66 and the metal bodies 68 </ b> E and 68 </ b> F are formed from the center line O (FIGS. 3, 6, and 7) that is the center of the width in the X-axis direction of the inner wall surface of the second recess 60. It is arranged at a separated position.

  As shown in FIG. 1, the groove 66 is formed to reach the upper surface and the lower surface of the second frame substrate 58 on the inner wall surface of the second frame substrate 58. Thereby, the lower end of the metal body 68E is connected to the mounting electrode 62E, and the lower end of the metal body 68F is connected to the mounting electrode 62F. Further, upper surface electrodes 70E and 70F are arranged at positions exposed on the upper surface of the second frame-shaped substrate 58 of the metal bodies 68E and 68F so as to be connected to the metal bodies 68E and 68F.

  As a manufacturing process of the second frame-shaped substrate 58 of the present embodiment, first, a ceramic material before sintering, which is a material of the second frame-shaped substrate 58, is molded into the outer shape of the second frame-shaped substrate 58 using a mold. To do. At this time, a through hole and a groove 66 for the through electrode 64 are formed. Next, after the metal paste used as the material of the through electrode 64 and the metal bodies 68E and 68F is embedded in the through hole and the groove 66 for the through electrode 64, the ceramic material is sintered together with the metal paste. Then, various electrodes may be formed on the surface of the second frame substrate 58 using sputtering or plating.

  Copper (Cu) is preferable as the material for the various electrodes and the metal bodies 68E and 68F. The first center substrate 24, the second center substrate 38, and the first frame substrate 14 can also be formed through the same manufacturing process.

  Instead of forming the through electrode 64, as shown in FIG. 1 and the like, at the corner of the second frame substrate 58 (the same applies to the first center substrate 24, the second center substrate 38, and the first frame substrate 14). A notch 12a (castellation) is formed, and the upper surface electrodes 70A, 70B, 70G, and 70H are respectively extended to the lower surface via the wall surface of the notch 12a and connected to the mounting electrodes 62A, 62B, 62G, and 62H, respectively. You may make it do.

  The integrated circuit 54 is integrally formed with an oscillation circuit that drives the piezoelectric vibrating piece 72 as an oscillation source, a temperature compensation circuit that compensates the temperature of the oscillation signal of the oscillation circuit, and the like. As shown in FIG. 1, pad electrodes 56 (56 </ b> A to 56 </ b> H) are arranged on the active surface (+ Z-axis side surface) of the integrated circuit 54. Here, the pad electrode 56 is set as follows, for example.

  The pad electrode 56A is a control voltage application terminal (Vc) for adjusting the oscillation frequency and the like, and the pad electrode 56B is a power input terminal (Vcc). The pad electrode 56C is a connection terminal (X1) that is connected to the piezoelectric vibrating piece 72, and the pad electrode 56D is also a connection terminal (X2) that is connected to the piezoelectric vibrating piece 72. The pad electrode 56E and the pad electrode 56F serve as adjustment terminals for writing programs and the like. The pad electrode 56G is a ground terminal (GND), and the pad electrode 56H is an output terminal (O / P) for an oscillation signal.

  As shown in FIGS. 1 and 5, the first connection electrode 40 (40 </ b> A to 40 </ b> H), the second connection electrodes 42 </ b> A, 42 </ b> B, 42 </ b> E, 42 </ b> F, 42 </ b> G, 42 </ b> H are provided on the lower surface of the second center substrate 38. Electrodes 46C, 46D and the like are arranged. The first connection electrode 40 is disposed following the position of the pad electrode 56 disposed on the active surface of the integrated circuit 54.

  As shown in FIGS. 1 and 6, the second connection electrodes 42A, 42B, 42E, 42F, 42G, and 42H are formed on the upper surface electrodes 70A and 70A, respectively, when the second center substrate 38 and the second frame substrate 58 are joined. It arrange | positions so that it can connect with 70B, 70E, 70F, 70G, and 70H. The inspection electrodes 46C and 46D are electrodes for confirming the operation of the piezoelectric vibrating piece 72 after mounting the piezoelectric vibrating piece 72 as will be described later.

  The first connection electrode 40A is electrically connected to the second connection electrode 42A through the wiring electrode 44A, and the first connection electrode 40B is electrically connected to the second connection electrode 42B through the wiring electrode 44B. The first connection electrode 40C is electrically connected to the inspection electrode 46C via the wiring electrode 48C, and the first connection electrode 40D is electrically connected to the inspection electrode 46D via the wiring electrode 48D.

  The first connection electrode 40E is electrically connected to the second connection electrode 42E via the wiring electrode 44E, and the first connection electrode 40F is electrically connected to the second connection electrode 42F via the wiring electrode 44F. Yes. The first connection electrode 40G is electrically connected to the second connection electrode 42G via the wiring electrode 44G, and the first connection electrode 40H is electrically connected to the second connection electrode 42H via the wiring electrode 44H. Yes.

  As shown in FIGS. 3 and 7, the pad electrode 56 of the integrated circuit 54 and the first connection electrode 40 are joined by bumps 86 formed of Au or the like, and the integrated circuit 54 is formed by so-called face-down bonding. 2 Mounted on the lower surface of the center substrate 38.

  Therefore, by bonding the second frame-shaped substrate 58 to the second center substrate 38, the pad electrode 56A (Vc) becomes the first connection electrode 40A, the wiring electrode 44A, the second connection electrode 42A, the upper surface electrode 70A, the through electrode. It is electrically connected to the mounting electrode 62A via 64A. The pad electrode 56B (Vcc) is electrically connected to the mounting electrode 62B via the first connection electrode 40B, the wiring electrode 44B, the second connection electrode 42B, the upper surface electrode 70B, and the through electrode 64B. The pad electrode 56G (GND) is electrically connected to the mounting electrode 62G via the first connection electrode 40G, the wiring electrode 44G, the second connection electrode 42G, the upper surface electrode 70G, and the through electrode 64G. The pad electrode 56H (O / P) is electrically connected to the mounting electrode 62H via the first connection electrode 40H, the wiring electrode 44H, the second connection electrode 42H, the upper surface electrode 70H, and the through electrode 64H.

  The pad electrode 56E is electrically connected to the mounting electrode 62E via the first connection electrode 40E, the wiring electrode 44E, the second connection electrode 42E, the upper surface electrode 70E, and the metal body 68E. The pad electrode 56F is electrically connected to the mounting electrode 62F via the first connection electrode 40F, the wiring electrode 44F, the second connection electrode 42F, the upper surface electrode 70F, and the metal body 68F.

  On the other hand, the upper surface electrode 50C is disposed at a position facing the first connection electrode 40C on the upper surface of the second center substrate 38, and the upper surface electrode 50D is disposed at a position facing the first connection electrode 40D on the upper surface of the second center substrate 38. Is arranged. The upper surface electrode 50C is electrically connected to the first connection electrode 40C through the through electrode 52C, and the upper surface electrode 50D is electrically connected to the first connection electrode 40D through the through electrode 52D. Further, an upper surface electrode 50G is disposed on the upper surface of the second center substrate 38 at a position facing the second connection electrode 42G, and the upper surface electrode 50G is electrically connected to the second connection electrode 42G through the through electrode 52G. .

  A rearrangement electrode 26C is disposed at a position facing the upper surface electrode 50C on the lower surface of the first center substrate 24, and a rearrangement electrode 26D is disposed at a position facing the upper surface electrode 50D on the lower surface of the first center substrate 24. Yes. Therefore, by joining the first center substrate 24 and the second center substrate 38, the rearrangement electrode 26C is electrically connected to the upper surface electrode 50C, and the rearrangement electrode 26D is electrically connected to the upper surface electrode 50D. The

  On the other hand, on the upper surface of the first center substrate 24, mount electrodes 28C and 28D (see FIG. 4) are arranged. Conductive adhesives 82C and 82D (see FIG. 4) are applied to the mount electrodes 28C and 28D, respectively, and the mount electrodes 28C and 28D are electrically connected to the later-described extraction electrodes 80C and 80D. The vibrating piece 72 is supported on the first center substrate 24 in a cantilevered state.

Lower surface electrodes 30C and 30D are disposed at positions facing the mount electrodes 28C and 28D on the lower surface of the first center substrate 24.
The lower electrode 30C is electrically connected to the mount electrode 28C through the through electrode 32C, and the lower electrode 30D is electrically connected to the mount electrode 28D through the through electrode 32D.

  The lower surface electrode 30C is electrically connected to the rearrangement electrode 26C via the wiring electrode 34C, and the lower surface electrode 30D is electrically connected to the rearrangement electrode 26D via the wiring electrode 34D.

  On the lower surface of the first center substrate 24, the lower surface electrode 30 </ b> G is disposed at a position facing the upper surface electrode 50 </ b> G of the second center substrate 38. An upper surface electrode 36G is disposed at a position facing the lower surface electrode 30G of the first center substrate 24. The upper surface electrode 36G is electrically connected to the lower surface electrode 30G through the through electrode 32G.

  As shown in FIGS. 2 to 4, the piezoelectric vibrating piece 72 is formed of a piezoelectric material such as quartz. In the present embodiment, for example, a thickness-shear vibrating piece using a quartz AT-cut substrate is used. The piezoelectric vibrating piece 72 includes a vibrating portion 74 that vibrates in thickness and a mount portion 76 that is bonded to the first center substrate 24. An excitation electrode 78C (FIGS. 2 and 3) is disposed on the lower surface of the vibration portion 74, and an excitation electrode 78D (FIGS. 3 and 4) is disposed on the upper surface. The piezoelectric vibrating piece 72 has a so-called mesa structure, and the vibrating portion 74 is thicker than other portions of the piezoelectric vibrating piece 72. Thereby, thickness shear vibration can be confined in the vibration part 74, and excitation efficiency can be improved.

  An extraction electrode 80C is extracted from the excitation electrode 78C, and an extraction electrode 80D is extracted from the excitation electrode 78D. The extraction electrode 80 </ b> C is extracted to the lower surface of the mount portion 76, that is, the surface on the first center substrate 24 side (surface on the −Z axis side). The extraction electrode 80 </ b> D is drawn to the lower surface of the mount portion 76 via the upper surface (+ Z-axis side surface) and side surface (−X-axis side surface) of the mount portion 76.

  The mount 76 and the first center substrate 24 are joined by conductive adhesives 82C and 82D (see FIG. 4). At this time, the lead electrode 80C and the mount electrode 28C are electrically connected by the conductive adhesive 82C (see FIG. 3), and the lead electrode 80D and the mount electrode 28D are electrically connected by the conductive adhesive 82D. Yes.

Thus, the piezoelectric vibrating piece 72 is supported in a cantilevered state on the package 12 (first center substrate 24) and is electrically connected to the package 12 side.
Further, due to the above connection, the pad electrode 56C (X1) has the first connection electrode 40C, the through electrode 52C, the upper surface electrode 50C, the rearrangement electrode 26C, the wiring electrode 34C, the lower surface electrode 30C, the through electrode 32C, the mount electrode 28C, the lead It is electrically connected to the excitation electrode 78C via the electrode 80C. The pad electrode 56D (X2) is connected to the first connection electrode 40D, the through electrode 52D, the upper surface electrode 50D, the rearrangement electrode 26D, the wiring electrode 34D, the lower surface electrode 30D, the through electrode 32D, the mount electrode 28D, and the extraction electrode 80D. And electrically connected to the excitation electrode 78D.

  Therefore, in the integrated circuit 54, by outputting an AC voltage from the pad electrode 56C (X1) and the pad electrode 56D (X2), the vibrating portion 74 of the piezoelectric vibrating piece 72 vibrates at a predetermined resonance frequency. As the piezoelectric vibrating piece 72, a tuning fork type vibrating piece, a double tuning fork type vibrating piece, a SAW resonance piece, and a gyro vibrating piece can be applied.

A lower surface electrode 18G is arranged at a position facing the upper surface electrode 36G on the lower surface of the first frame-shaped substrate 14. Therefore, the lower surface electrode 18G is electrically connected to the upper surface electrode 36G by bonding the first center substrate 24 and the first frame substrate 14 together.
On the other hand, the upper surface electrode 20G is disposed on the entire upper surface of the first frame-shaped substrate 14, and the upper surface electrode 20G is electrically connected to the lower surface electrode 18G through the through electrode 22G.

  The lid 84G is formed of a metal plate, and seals the opening of the first concave portion 16 of the first frame substrate 14 to hermetically seal the piezoelectric vibrating piece 72. Further, the piezoelectric vibrating piece 72 can be vacuum-sealed by sealing with the lid 84G in a vacuum environment.

  The lid 84G is electrically connected to the upper surface electrode 20G. Therefore, the lid 84G includes the upper electrode 20G, the through electrode 22G, the lower electrode 18G, the upper electrode 36G, the through electrode 32G, the lower electrode 30G, the upper electrode 50G, the through electrode 52G, the second connection electrode 42G, the upper electrode 70G, and the through electrode. It is electrically connected to the mounting electrode 62G via 64G. Therefore, the lid 84G can be grounded by grounding the mounting electrode 62G. Therefore, the lid 84G can perform electrostatic shielding on the piezoelectric vibrating piece 72. Further, by grounding the mounting electrode 62G, the pad electrode 56G electrically connected to the mounting electrode 62G is also grounded.

An assembly process of the piezoelectric device 10 of the present embodiment will be described.
First, the package 12 is formed by laminating the second frame substrate 58, the second center substrate 38, the first center substrate 24, and the first frame substrate 14 in this order using an adhesive or the like. The piezoelectric vibrating piece 72 is accommodated in the first recess 60, and the piezoelectric vibrating piece 72 is mounted on the first center substrate 24 by the conductive adhesives 82C and 82D. Then, the lid 84G and the first frame substrate 14 (upper surface electrode 20G) are joined by seam welding in a vacuum environment. Thereby, the piezoelectric vibrating piece 72 is vacuum-sealed.

  When the second frame substrate 58 is joined to the second center substrate 38, the test electrodes 46C and 46D together with the first connection electrode 40 are exposed at the bottom of the second recess 60 as shown in FIG. . Therefore, a probe is applied to the inspection electrodes 46C and 46D to confirm the operation of the piezoelectric vibrating piece 72.

  The inspection electrodes 46C and 46D are formed to have a larger area than the first connection electrode 40 and the like. Thereby, the contact operation of the probe to the inspection electrodes 46C and 46D can be easily performed. If the piezoelectric vibrating piece 72 cannot be operated (oscillated), or if the resonance frequency, CI value, etc. are remarkably different from the design value even if it oscillates, the piezoelectric vibrating piece 72 (package 12) is excluded, and an appropriate Only the piezoelectric vibrating piece 72 (package 12) that performs the operation is selected. At this time, the wiring electrode 48C that connects the inspection electrode 46C and the first connection electrode 40C and the wiring electrode 48D that connects the inspection electrode 46D and the first connection electrode 40D are excised with a laser or the like, and the inspection electrode 46C and 46D may be insulated from the first connection electrodes 40C and 40D, respectively.

  As shown in FIG. 7, the integrated circuit 54 is accommodated in the second recess 60, and the pad electrode 56 and the first connection electrode 40 of the integrated circuit 54 are face-down bonded using bumps 86, whereby the piezoelectric device 10 is formed. Built.

  FIG. 8 shows a schematic diagram of an electronic apparatus (mobile terminal) equipped with the piezoelectric device of the present embodiment. In FIG. 8, the portable terminal 88 (including PHS) includes a plurality of operation buttons 90, an earpiece 92, and a mouthpiece 94, and a display unit 96 is disposed between the operation buttons 90 and the earpiece 92. Yes. Recently, the portable terminal 88 has a GPS function. Therefore, the portable terminal 88 incorporates the piezoelectric device 10 (electronic device) of this embodiment as a clock source of the GPS circuit.

  The electronic apparatus including the piezoelectric device 10 according to the present embodiment includes a smartphone, a digital still camera, a personal computer, a laptop personal computer, a television, a video camera, a video tape recorder, and a car navigation system in addition to the above-described portable terminal 88. Devices, pagers, ink jet dispensing devices, electronic notebooks, calculators, electronic game devices, word processors, workstations, video phones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (eg, electronic thermometers, blood pressure monitors, blood glucose meters) It can be applied to electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various measuring instruments, instruments (for example, vehicles, aircraft, ship instruments), flight simulators, and the like.

10 ......... piezoelectric device, 12 ......... package, 12a ......... notch, 14 ......... first frame substrate, 16 ......... first recess, 18G ......... bottom electrode, 20G ......... Upper surface electrode, 22G ......... through electrode, 24 ......... first center substrate, 26C, 26D ......... relocation electrode, 28C, 28D ......... mount electrode, 30C, 30D, 30G ......... lower electrode, 32C , 32D, 32G ......... through electrode, 34C, 34D ......... wiring electrode, 36G ......... top electrode, 38 ......... second center substrate, 40, 40A, 40B, 40C, 40D, 40E, 40F, 40G , 40H ......... first connection electrode, 42A, 42B, 42E, 42F, 42G, 42H ......... second connection electrode, 44A, 44B, 44E, 44F, 44G, 44H ......... wiring electrode, 46C, 46D ... ...... Check Electrode, 48C, 48D ......... wiring electrode, 50C, 50D, 50G ......... top electrode, 52C, 52D, 52G ......... through electrode, 54 ......... integrated circuit, 56, 56A, 56B, 56C, 56D , 56E, 56F, 56G, 56H ......... Pad electrode, 58 ......... Second frame substrate, 60 ... Second recess, 62, 62A, 62B, 62E, 62F, 62G, 62H ......... Mounting Electrode, 64, 64A, 64B, 64G, 64H ......... Penetration electrode, 66 ......... Groove, 68E, 68F ......... Metal body, 70A, 70B, 70E, 70F, 70G, 70H ......... Top electrode, 72 ……… Piezoelectric vibrating piece, 74 ……… Vibrating portion, 76 ……… Mounting portion, 78C, 78D ……… Excitation electrode, 80C, 80D ……… Extraction electrode, 82C, 82D ……… Conductive adhesive, 84G ......... Lid 86... Bump, 88... Mobile terminal, 90... Operation button, 92... Earpiece, 94... Mouthpiece, 96. ......... Package, 104 ...... Center substrate, 106 ......... First frame substrate, 108 ......... First recess, 110 ......... Second frame substrate, 112 ......... Second recess, 114... Piezoelectric vibrating piece 116... Lid 118 118 Integrated circuit 120 Pad electrode 122 Connection electrode 124 Through electrode 126 Mounting electrode 128 ………bump.

Claims (8)

A package having a first recess that accommodates an electronic component, and a second recess that shares a bottom of the first recess and opens in a direction opposite to the first recess;
A lid that seals the opening of the first recess, and an electronic device comprising:
The inner wall surface of the second recess has an arc-shaped groove in plan view, part of which extends in the depth direction of the second recess,
The groove is
An electronic device filled with a metal body. The package is
A center board,
A first frame-like substrate that is connected to a peripheral edge of one main surface of the center substrate and forms the first recess having a bottom portion in a range surrounded by the peripheral edge of the center substrate and is bonded to the lid; ,
And a second frame-like substrate that is connected to the periphery of the other main surface of the center substrate and forms the second recess with a range surrounded by the periphery of the center substrate as a bottom. The electronic device according to claim 1.   The electronic device according to claim 1, wherein a material of the package is ceramic. The groove is
The electronic device according to any one of claims 1 to 3, wherein the electronic device is disposed at a position spaced from a center position in the width direction of the wall surface toward an end portion side in the width direction of the wall surface. The groove is
The electronic device according to claim 1, wherein a plurality of the electronic devices are arranged on the wall surface. A mounting terminal is provided around the opening of the second recess,
The said groove | channel and the said metal body are extended to the edge of the opening part of the said 2nd recessed part, and the said metal body is connected to the said mounting terminal, The Claim 1 characterized by the above-mentioned. The electronic device described. A second electronic component is disposed in the second recess,
The electronic device according to claim 6, wherein the metal body is electrically connected to the second electronic component.   An electronic apparatus comprising the electronic device according to any one of claims 1 to 7.