JP2017055280A - Oscillator and manufacturing method therefor, electronic apparatus, and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillator performing oscillation operation with desired characteristics, while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the vibrator.SOLUTION: An oscillator has a package having first and second surfaces facing each other, and a third surface projected farther than the second surface by the sidewall, where first and second wiring patterns are placed on the second surface, and an external connection terminal connected electrically with the first wiring pattern is placed on the third surface, a vibrator placed on the first surface of the package, and having an electrode connected electrically with the second wiring pattern, a semiconductor device placed on the second surface of the package, and connected electrically with the first wiring pattern, and a set of extension wiring connected, respectively, with the first and second wiring patterns, while having the portions facing each other on the second surface of the package, and the facing portions can be seen from the outside of the package.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an oscillator configured by mounting a vibrator and a semiconductor device in a package, and a method for manufacturing the same. Furthermore, the present invention relates to an electronic device and a moving body using such an oscillator.

  For example, a crystal oscillator is mounted in a cavity formed on one main surface of a package, and a semiconductor device (IC) is mounted in a cavity formed on the other main surface of the package. Has been made up.

  In such a crystal oscillator, in order to adjust the resonance frequency of the crystal resonator mounted in the package before mounting the IC, it is necessary to connect two electrodes provided on the crystal resonator to an external device. is there. Conventionally, two monitor terminals (pads) that are electrically connected to the two electrodes of the crystal vibrator have been arranged in the cavity in which the IC is mounted.

  As a related technique, FIG. 1 of Patent Document 1 discloses that an increase in the number of outer peripheral pins 3 is suppressed by providing test terminals 4 on an upper surface or a lower surface of an integrated circuit package 2 on a circuit board 1. Has been. In FIG. 1 of Patent Document 2, an increase in the number of bottom surface pins 3 is suppressed by providing test terminals 4 on the top surface of the package 2 in an integrated circuit having a structure connected to the circuit board 1 by the bottom surface pins 3. It is disclosed.

JP-A-6-222109 (abstract, FIG. 1) Japanese Patent Laid-Open No. 6-232295 (abstract, FIG. 1)

  However, in recent years, the size of the oscillator package has been reduced, and it has become difficult to dispose two monitor terminals in the cavity in which the IC is mounted. Further, the IC connection pad disposed in the cavity where the IC is mounted is also downsized, and it is difficult to bring the probe needle into contact with the IC connection pad. Further, when the probe needle is brought into contact with the IC connection pad, a dent is left on the IC connection pad, which causes a deterioration in the connectivity of the IC connection pad during IC mounting.

  Accordingly, in view of the above points, a first object of the present invention is to provide an oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the vibrator. Is to provide. A second object of the present invention is to provide an electronic device, a moving body, and the like using such an oscillator.

  In order to solve at least a part of the above problems, an oscillator according to a first aspect of the present invention is provided in a first surface, a second surface, and a peripheral region of the second surface that face each other. A third surface protruding from the second surface by the side wall, the first wiring pattern and the second wiring pattern being disposed on the second surface, and the first wiring pattern via the interlayer connection portion. The external connection terminal electrically connected to the wiring pattern is disposed on the third surface, and the package is disposed on the first surface of the package and electrically connected to the second wiring pattern via the interlayer connection portion. Connected to the vibrator having the formed electrodes, the semiconductor device disposed on the second surface of the package and electrically connected to the first wiring pattern, and the first wiring pattern and the second wiring pattern, respectively Facing each other on the second side of the package Has a portion that comprises a set of the extension lines of the opposing portions is visible from the outside of the package.

  According to the first aspect of the present invention, after adjusting the characteristics of the vibrating body using the external connection terminal electrically connected to the electrode of the vibrating body by the extension wiring, the extension wiring is cut and one set Separated into extended wiring. Therefore, it is possible to provide an oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the vibrating body.

  Here, a cutout may be provided on the outside of the side wall of the package so that the opposing portion of the set of extension wires can be seen from the outside of the package. In that case, since the side wall of the package exists between the second surface of the package on which the semiconductor device is mounted and the extension wiring cut by a laser or the like, chips generated by laser cutting or the like are generated in the second package. Contamination due to scattering on the surface can be reduced.

  Alternatively, a cutout may be provided inside the side wall of the package so that the opposing portion of the set of extension wires can be seen from the outside of the package. In that case, after the oscillator is mounted on a printed wiring board or the like, it is possible to reduce the possibility of foreign matter coming into contact with the set of extended wirings.

  Alternatively, the side wall of the package may be provided on the second surface of the package so as to avoid the facing portions of the set of extended wirings. In that case, since a wide space spreads around the extension wiring, the extension wiring can be easily cut.

  In the above, it is desirable that the distance between a set of extended wires in the facing portion is 40 μm or more and 200 μm or less. When the extension wiring is cut with a laser, the extension wiring can be cut with a width of about 40 μm by one laser cutting. Therefore, if the distance between the cut extension wires is 40 μm at a minimum, the production efficiency can be improved and the generation of chips due to the cut can be suppressed. On the other hand, in a high-accuracy oscillator, the parasitic capacitance between the cut extension wires affects the characteristics of the oscillator. In such a case, if the distance between the cut extension wires is 200 μm at the maximum, the parasitic capacitance can be reduced to such an extent that the characteristics of the oscillator are not affected.

  An electronic apparatus according to a second aspect of the present invention includes any one of the above oscillators. A mobile object according to a third aspect of the present invention includes any one of the above oscillators. According to the second or third aspect of the present invention, by using an oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the vibrating body. In addition, an electronic device or a moving body in which an oscillator that generates a clock signal is miniaturized can be provided.

  According to a fourth aspect of the present invention, there is provided an oscillator manufacturing method that protrudes from a second surface by first and second surfaces facing each other and side walls provided in a peripheral region of the second surface. The first surface and the second wiring pattern are disposed on the second surface and electrically connected to the first wiring pattern through the interlayer connection portion. Step (a) of preparing a package in which the connection terminals are arranged on the third surface and at least a part of the extended wiring connecting the second wiring pattern to the first wiring pattern is visible from the outside. A step (b) of disposing a vibrating body on the first surface of the package and electrically connecting the electrode of the vibrating body to the second wiring pattern via the interlayer connection portion; and the vibrating body via the extension wiring Using an external connection terminal electrically connected to the electrode of A step (c) of adjusting the resonance frequency, a step (d) of joining the lid portion covering the vibrating body to the package, a step (e) of cutting the extension wiring, and a semiconductor device disposed on the second surface of the package And (f) electrically connecting the semiconductor device to the first wiring pattern.

  According to the fourth aspect of the present invention, after adjusting the characteristics of the vibrating body using the external connection terminal electrically connected to the electrode of the vibrating body by the extension wiring, the extension wiring is cut. Therefore, it is possible to provide an oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the vibrating body.

  Here, in the oscillator manufacturing method, the vibration body is strengthened by using an external connection terminal electrically connected to the electrode of the vibration body through the extension wiring between the step (d) and the step (e). A step of exciting may be further provided. Thereby, the foreign matter adhering to the vibrating body is shaken off, or the characteristics of the vibrating body are improved, and the yield of the vibrating body is improved.

  In addition, the oscillator manufacturing method uses the external connection terminal electrically connected to the electrode of the vibrating body through the extension wiring between the step (d) and the step (e), and the characteristics of the vibrating body are adjusted. You may further provide the process to test | inspect. For example, by measuring the resonance frequency, impedance, etc. while changing the voltage applied to the electrode of the vibrating body from an external measuring device, the vibrating body is determined to be good or not based on the magnitude or amount of change in the measured value. Whether it is a non-defective product can be determined.

Sectional drawing of the crystal oscillator which concerns on each embodiment of this invention. 1 is a bottom view of a crystal oscillator package according to a first embodiment of the present invention. 1 is a perspective view of a crystal oscillator according to a first embodiment of the present invention. FIG. 3 is a bottom view of the package shown in FIG. 2 after the extension wiring is cut. The bottom view of the package of the crystal oscillator concerning the 2nd Embodiment of this invention. The figure which shows the package of the crystal oscillator which concerns on the 3rd Embodiment of this invention. The bottom view of the package of the crystal oscillator concerning the 4th Embodiment of this invention. The flowchart which shows the manufacturing method of the crystal oscillator which concerns on one Embodiment of this invention. FIG. 2 is a circuit diagram showing a circuit configuration example of the crystal oscillator shown in FIG. 1. 1 is a block diagram illustrating a first configuration example of an electronic device according to an embodiment of the present invention. The block diagram which shows the 2nd structural example of the electronic device which concerns on one Embodiment of this invention. The block diagram which shows the structural example of the moving body which concerns on one Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same referential mark is attached | subjected to the same component and the overlapping description is abbreviate | omitted. In the following embodiments, a crystal oscillator using a crystal oscillator will be described as an example.
<Crystal oscillator>
FIG. 1 is a cross-sectional view of a crystal oscillator according to each embodiment of the present invention. As shown in FIG. 1, the crystal oscillator 110 is formed on a package 10, a crystal resonator 20 mounted in a cavity formed on one main surface of the package 10, and the other main surface of the package 10. The semiconductor device (IC) 30 mounted in the cavity and the lid portion 40 that covers the crystal vibrating body 20 are included.

  The package 10 is configured, for example, by laminating a second substrate 12 and a third substrate 13 that form side walls on both surfaces of the first substrate 11 and has an H-shaped cross section. The first surface 10a to the third surface 10c may be substantially parallel to each other. The first substrate 11 to the third substrate 13 are made of an insulator such as ceramic, for example. The package 10 protrudes more than the second surface 10b by the first surface 10a and the second surface 10b facing each other and the side wall (third substrate 13) provided in the peripheral region of the second surface 10b. And a third surface 10c.

  The crystal vibrating body 20 is disposed on the first surface 10 a of the package 10, and includes a crystal piece 21 that is a piezoelectric body, and a first electrode 22 and a second electrode 23 that sandwich the crystal piece 21. The crystal vibrating body 20 is supported by the support member 24. By applying an AC voltage between the electrode 22 and the electrode 23, mechanical vibration of the crystal vibrating body 20 is excited by the piezoelectric effect. A lid 40 that covers the crystal resonator 20 is bonded to a side wall (second substrate 12) provided in the peripheral region of the first surface 10 a of the package 10. The lid 40 is made of, for example, iron (Fe), cobalt (Co), nickel (Ni), or an alloy thereof.

  The semiconductor device 30 is disposed on the second surface 10b of the package 10 and incorporates a plurality of circuit elements that constitute an oscillation circuit. The semiconductor device 30 includes a plurality of terminals (shown as terminals 31 in FIG. 1) electrically connected to the electrodes 22 and 23 of the crystal vibrating body 20 and a plurality of terminals disposed on the third surface 10 c of the package 10. And a plurality of terminals (terminals 32 and 33 are shown in FIG. 1) electrically connected to the external connection terminals (not shown). The semiconductor device 30 may be, for example, a semiconductor chip (bare chip) that is not enclosed in a package. The bare chip is mounted on the second surface 10b of the package 10 by flip chip bonding or the like.

<First Embodiment>
FIG. 2 is a bottom view of the crystal oscillator package according to the first embodiment of the present invention. As shown in FIG. 2, wiring patterns 51 to 56 are arranged on the second surface 10 b of the package 10. A part of each of the wiring patterns 51 to 56 constitutes an IC connection pad that is electrically connected to each terminal of the semiconductor device 30. Further, the wiring patterns 55 and 56 are formed on the first surface 10a of the package 10 via the interlayer connection portions 55a and 56a made of a conductor filled in the through holes formed in the first substrate 11. They are electrically connected to two wiring patterns (not shown) to which the electrodes 22 and 23 of the crystal vibrating body 20 are connected.

  In addition, external connection terminals 61 to 64 are disposed on the third surface 10 c of the package 10. The external connection terminals 61 to 64 are connected to the wiring pattern 51 via interlayer connection portions 51 a to 54 a made of a conductor filled between the second surface 10 b and the third surface 10 c at the four corners of the package 10. To 54, respectively. For example, the wiring patterns 51 to 56 and the external connection terminals 61 to 64 are made of a conductor such as aluminum (Al) or copper (Cu), and the interlayer connection portions 51a to 56a are made of aluminum (Al) or copper (Cu). Or a conductor such as tungsten (W).

  The electrodes 22 and 23 of the crystal resonator 20 shown in FIG. 1 are electrically connected to the wiring patterns 55 and 56 via the interlayer connection portions 55a and 56a, respectively. The semiconductor device 30 is electrically connected to the wiring patterns 51 to 56. Accordingly, the semiconductor device 30 is electrically connected to the external connection terminals 61 to 64 via the wiring patterns 51 to 54 and is electrically connected to the electrodes 22 and 23 of the crystal resonator 20 via the wiring patterns 55 and 56. Connected to.

  For example, the semiconductor device 30 is supplied with the power supply potential VCC and the reference potential VEE from the external connection terminals 61 and 64, performs an oscillation operation using the crystal resonator 20, and externally connects an output signal generated by the oscillation operation. Output to terminal 62. The external connection terminal 63 is used for inputting a clock signal for setting data for controlling the oscillation frequency in the memory in the semiconductor device 30 in the manufacturing process of the crystal oscillator. You may be in a no-contact state.

  Thus, when the crystal oscillator package 10 is miniaturized, when the external connection terminals 61 to 64 are provided, two external connection terminals (monitors) electrically connected to the electrodes 22 and 23 of the crystal vibrating body 20 are provided. It is difficult to provide a terminal. Further, the IC connection pad provided in the cavity is also miniaturized, and it is difficult to bring the probe needle into contact with the IC connection pad.

  Therefore, two extended wirings are provided to connect the wiring patterns 55 and 56 to two of the wiring patterns 51 to 54, respectively. For example, as shown in FIG. 2, the first extension wiring 71 that connects the wiring pattern 55 to the wiring pattern 52 and the second extension wiring 72 that connects the wiring pattern 56 to the wiring pattern 54 are the first extension of the package 10. 2 surface 10b. Thereby, the electrodes 22 and 23 of the crystal vibrating body 20 are electrically connected to the external connection terminals 62 and 64, respectively.

  Accordingly, it is possible to connect the crystal vibrating body 20 to an external device by bringing the probe needle into contact with the external connection terminals 62 and 64 electrically connected to the electrodes 22 and 23 of the crystal vibrating body 20, respectively. In the manufacturing process of the crystal oscillator, for example, the resonance frequency of the crystal resonator 20 is adjusted by trimming the electrode 23 with a laser while measuring the resonance characteristics of the crystal resonator 20 using an external device.

  FIG. 3 is a perspective view of the crystal oscillator according to the first embodiment of the present invention. However, in FIG. 3, the bottom surface of the package 10 is located on the upper side in the drawing. In the first embodiment, the first cut is made so that at least a part of the first extension wiring 71 (FIG. 2) can be seen from the outside in a plan view of the side wall (third substrate 13) of the package 10. A notch 81 is provided, and a second notch 82 is provided so that at least a part of the second extension wiring 72 can be seen from the outside.

  Accordingly, the extension wirings 71 and 72 visible from the outside of the package 10 can be cut with a laser or the like. FIG. 3 shows a state where the extension wiring 72 is cut and separated into a set of extension wirings 72a and 72b. In the present application, the “plan view” means that each part is seen through from a direction perpendicular to the second surface 10 b (FIG. 1) of the package 10.

  FIG. 4 is a bottom view of the package shown in FIG. 2 after the extension wiring is cut. By cutting the extension wires 71 and 72, as shown in FIG. 4, the first extension wire 71 is separated into the first set of extension wires 71a and 71b, and the second extension wire 72 is changed to the second set. The extension wires 72a and 72b are separated. Thereby, the wiring patterns 55 and 56 are electrically separated from the wiring patterns 52 and 54, and the electrodes 22 and 23 of the crystal vibrating body 20 are electrically separated from the external connection terminals 62 and 64.

  After cutting the extension wirings 71 and 72, the first set of extension wirings 71a and 71b are connected to the wiring pattern 55 and the wiring pattern 52, respectively, and portions facing each other on the second surface 10b of the package 10 are connected. Have. The first notch 81 is provided on the outside in a plan view of the side wall of the package 10 so that the facing portion can be seen from the outside of the package 10.

  The second set of extended wirings 72 a and 72 b are connected to the wiring pattern 56 and the wiring pattern 54, respectively, and have portions facing each other on the second surface 10 b of the package 10. The second notch 82 is provided on the outside in a plan view of the side wall of the package 10 so that the facing portion can be seen from the outside of the package 10.

  Here, it is desirable that the distance between the first set of extension wires 71a and 71b in the facing portion and the distance between the second set of extension wires 72a and 72b in the facing portion are 40 μm or more and 200 μm or less. .

  When the extension wirings 71 and 72 are cut with a laser, the extension wiring can be cut with a width of about 40 μm by one laser cutting. Therefore, if the distance between the cut extension wires is 40 μm at a minimum, the production efficiency can be improved and the generation of chips due to the cut can be suppressed. On the other hand, in a high-precision crystal oscillator, the parasitic capacitance between the cut extension wires affects the characteristics of the crystal oscillator. In such a case, if the distance between the cut extension wires is 200 μm at the maximum, the parasitic capacitance can be reduced to such an extent that the characteristics of the crystal oscillator are not affected.

  According to the present embodiment, after adjusting the characteristics of the crystal resonator 20 using the two external connection terminals electrically connected to the electrodes 22 and 23 of the crystal resonator 20 by the extension wires 71 and 72, the extension is performed. The wiring 71 is cut and separated into extension wirings 71a and 71b, and the extension wiring 72 is cut and separated into extension wirings 72a and 72b. Therefore, it is possible to provide a crystal oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal resonator 20.

  As described above, even if the crystal oscillator package 10 is downsized, the characteristics of the crystal oscillator 20 can be adjusted using the two external connection terminals, so that the yield of the crystal oscillator can be improved. . Further, since it is no longer necessary to bring the probe needle into contact with the IC connection pad, no dent is left on the IC connection pad, and the connectivity of the IC connection pad during IC mounting is not deteriorated.

  Further, since the notches 81 and 82 are provided outside the side wall of the package 10, the second surface 10b of the package 10 on which the semiconductor device 30 is mounted and the extension wirings 71 and 72 cut by a laser or the like. Since the side wall of the package 10 exists, contamination caused by chips generated by laser cutting or the like scattering on the second surface of the package can be reduced.

<Second Embodiment>
FIG. 5 is a bottom view of the crystal oscillator package according to the second embodiment of the present invention. In the second embodiment, a first notch 83 is provided on the inner side in a plan view of the side wall (third substrate 13) of the package 10 so that at least a part of the first extension wiring 71 can be seen from the outside. In addition, a second notch 84 is provided so that at least a part of the second extension wiring 72 can be seen from the outside. Regarding other points, the second embodiment may be the same as the first embodiment.

  Also in the second embodiment, the extended wirings 71 and 72 visible from the outside of the package 10 can be cut with a laser or the like. After the extension wires 71 and 72 are cut, the first set of extension wires 71a and 71b are connected to the wiring pattern 55 and the wiring pattern 52, respectively, as shown in FIG. 10b have portions facing each other. The first notch 83 is provided on the inner side in a plan view of the side wall of the package 10 so that the facing portion can be seen from the outside of the package 10.

  The second set of extended wirings 72 a and 72 b are connected to the wiring pattern 56 and the wiring pattern 54, respectively, and have portions facing each other on the second surface 10 b of the package 10. The second notch 84 is provided on the inner side in a plan view of the side wall of the package 10 so that the facing portion can be seen from the outside of the package 10.

  According to the present embodiment, as in the first embodiment, a crystal that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal resonator 20 or the like. An oscillator can be provided. Further, since the notches 83 and 84 are provided inside the side wall of the package 10, there is a possibility that foreign matter may come into contact with the extension wires 71a and 71b and the extension wires 72a and 72b after the crystal oscillator is mounted on a printed wiring board or the like. Can be reduced.

<Third Embodiment>
FIG. 6 is a view showing a crystal oscillator package according to the third embodiment of the present invention. FIG. 6A is a bottom view of the package, and FIG. 6B is a side view of the package. In the third embodiment, the side wall (third substrate 13) of the package 10 is formed on the second surface 10b of the package 10 so as to face the first set of extension wires 71a and 71b and the second set of extension wires. 72a and 72b are provided so as to avoid the opposing portions. In other respects, the third embodiment may be the same as the first embodiment.

  Also in the third embodiment, the extension wirings 71 and 72 visible from the outside of the package 10 can be cut by a laser or the like. After the extension wires 71 and 72 are cut, the first set of extension wires 71a and 71b are connected to the wiring pattern 55 and the wiring pattern 52, respectively, as shown in FIG. 10b have portions facing each other. The side wall (third substrate 13) of the package 10 is provided so that the facing portion can be seen from the outside of the package 10.

  The second set of extended wirings 72 a and 72 b are connected to the wiring pattern 56 and the wiring pattern 54, respectively, and have portions facing each other on the second surface 10 b of the package 10. The side wall (third substrate 13) of the package 10 is provided so that the facing portion can be seen from the outside of the package 10.

  According to the present embodiment, as in the first embodiment, a crystal that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal resonator 20 or the like. An oscillator can be provided. Further, since a part of the side wall of the package 10 is deleted, a wide space is extended around the extension wires 71 and 72, so that the extension wires 71 and 72 can be easily cut.

<Fourth Embodiment>
FIG. 7 is a bottom view of the crystal oscillator package according to the fourth embodiment of the present invention. In the fourth embodiment, the first extension wiring 71 and the second extension wiring 72 are formed on the second surface 10 b surrounded by the side wall of the package 10 without providing a notch or the like on the side wall of the package 10. Has been placed. Regarding other points, the fourth embodiment may be the same as the first embodiment.

  Also in the fourth embodiment, the extension wirings 71 and 72 visible from the outside of the package 10 can be cut by a laser or the like. After the extension wires 71 and 72 are cut, the first set of extension wires 71a and 71b are connected to the wiring pattern 55 and the wiring pattern 52, respectively, as shown in FIG. 10b have portions facing each other. The second set of extended wirings 72 a and 72 b are connected to the wiring pattern 56 and the wiring pattern 54, respectively, and have portions facing each other on the second surface 10 b of the package 10.

  According to the fourth embodiment of the present invention, as in the first embodiment, while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal resonator 20, the desired characteristics can be achieved. A crystal oscillator that performs an oscillation operation can be provided. In addition, since a package having a general shape can be used, the cost for producing a special mold is reduced. However, when the extension wirings 71 and 72 are cut with a laser, laser marks remain on the second surface 10b of the package 10 and chips are scattered, so that the mountability of the semiconductor device 30 may be reduced. .

<Manufacturing method of crystal oscillator>
Next, a method for manufacturing a crystal oscillator according to an embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a flowchart showing a method for manufacturing a crystal oscillator according to an embodiment of the present invention.

  In step S1 of FIG. 8, for example, a package 10 as shown in FIGS. 1 and 2 is prepared. That is, as shown in FIG. 1, the package 10 has a first surface 10a and a second surface 10b facing each other, and a side wall provided in a peripheral region of the second surface 10b. Also has a protruding third surface 10c.

  Further, as shown in FIG. 2, the wiring patterns 51 to 56 are arranged on the second surface 10b of the package 10, and are electrically connected to the wiring patterns 51 to 54 via the interlayer connection portions 51a to 54a, respectively. The external connection terminals 61 to 64 thus arranged are arranged on the third surface 10 c of the package 10. The package 10 includes a first extension wiring 71 and a second extension wiring 72 that connect the wiring patterns 55 and 56 to two of the wiring patterns 51 to 54 (the wiring patterns 52 and 54 in FIG. 2), respectively. At least a part is configured to be visible from the outside.

  For example, a first substrate 11 to a third substrate 13 having a large area are prepared in order to simultaneously manufacture a plurality of packages 10. A plurality of through holes are formed in the first substrate 11 and the third substrate 13. In addition, two wiring patterns (not shown) and wiring patterns 51 to 56 electrically connected to the electrodes 22 and 23 of the crystal vibrating body 20 and the wiring patterns 51 to 56 are formed on the first substrate 11, and in the through holes. Interlayer connection portions 55a and 56a are formed by filling the conductor.

  The second substrate 12 and the third substrate 13 are bonded to both surfaces of the first substrate 11. Further, external connection terminals 61 to 64 are formed on the third substrate 13, and conductors are filled in the through holes to form interlayer connection portions 51 a to 54 a. Then, the individual substrates 10 are separated by cutting the first substrate 11 to the third substrate 13 with a dicing blade or the like.

  In step S <b> 2, the crystal vibrating body 20 is manufactured by forming the first electrode 22 and the second electrode 23 on both surfaces of the crystal piece 21. In step S3, the crystal vibrating body 20 is disposed on the first surface 10a of the package 10 using the support member 24, and the electrodes 22 and 23 of the crystal vibrating body 20 are connected to the wiring pattern 55 via the interlayer connection portions 55a and 56a. And 56 are electrically connected to each other. Accordingly, the electrodes 22 and 23 of the crystal vibrating body 20 are electrically connected to the external connection terminals 62 and 64 via the extension wires 71 and 72, respectively.

  In step S4, the resonance frequency of the crystal resonator 20 is adjusted using the two external connection terminals 62 and 64 that are electrically connected to the electrodes 22 and 23 of the crystal resonator 20 via the extension wires 71 and 72, respectively. Is done. For example, a network analyzer is connected to the electrodes 22 and 23 of the crystal vibrator 20 to measure the resonance characteristics of the crystal vibrator 20, or an external oscillation circuit is connected to the electrodes 22 and 23 of the crystal vibrator 20 to set the oscillation frequency. While measuring, the resonance frequency of the crystal resonator 20 is adjusted by trimming the electrode 23 with a laser.

  In step S5, the lid 40 that covers the crystal vibrating body 20 is joined to the package 10 by welding, for example. Thereafter, step S6 or step S7 may be performed. In step S <b> 6, a large AC voltage is applied to the crystal resonator 20 using the two external connection terminals 62 and 64 that are electrically connected to the electrodes 22 and 23 of the crystal resonator 20 via the extension wires 71 and 72, respectively. By applying to the electrodes 22 and 23, the quartz crystal vibrating body 20 is strongly excited. Thereby, the foreign matter adhering to the crystal resonator 20 is shaken off, or the characteristics of the crystal resonator 20 are improved, and the yield of the crystal resonator 20 is improved.

  In step S7, the characteristics of the crystal resonator 20 are inspected using the two external connection terminals 62 and 64 that are electrically connected to the electrodes 22 and 23 of the crystal resonator 20 via the extension wires 71 and 72, respectively. The For example, by measuring the resonance frequency, impedance, etc. while changing the voltage applied to the electrodes 22 and 23 of the crystal vibrating body 20 from an external measuring device, the crystal vibrating body is measured based on the magnitude or amount of change of the measured value. Whether 20 is a good product or a defective product can be determined.

  In step S8, as shown in FIGS. 3 and 4, the extension wirings 71 and 72 are cut with a laser or the like. Thereby, the wiring patterns 55 and 56 are electrically separated from the wiring patterns 52 and 54, and the electrodes 22 and 23 of the crystal vibrating body 20 are electrically separated from the external connection terminals 62 and 64. Thereafter, in step S9, the crystal oscillator is cleaned.

  In step S10, the semiconductor device 30 is disposed on the second surface 10b of the package 10, and the semiconductor device 30 is electrically connected to the wiring patterns 51 to 56. Thereby, the semiconductor device 30 is electrically connected to the external connection terminals 61 to 64 and the electrodes 22 and 23 of the crystal vibrating body 20, and the crystal oscillator is completed.

  According to the present embodiment, after adjusting the characteristics of the crystal resonator 20 using the two external connection terminals electrically connected to the electrodes 22 and 23 of the crystal resonator 20 by the extension wires 71 and 72, the extension is performed. The wirings 71 and 72 are cut off. Therefore, it is possible to provide a crystal oscillator that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal resonator 20.

<Circuit configuration of crystal oscillator>
FIG. 9 is a circuit diagram showing a circuit configuration example of the crystal oscillator shown in FIG. As shown in FIG. 9, the crystal oscillator 110 includes a crystal resonator 20 and an oscillation circuit built in the semiconductor device 30 (FIG. 1). The oscillation circuit includes an NPN bipolar transistor Q1, resistors R0 to R4, capacitors C1 to C4, external connection terminals 61 to 64, a buffer amplifier 101, and a control circuit 102.

  The external connection terminal 61 is supplied with the power supply potential VCC, and the external connection terminal 64 is supplied with the reference potential VEE. The resistors R1 and R2 are connected in series between the two electrodes of the quartz crystal vibrating body 20. The resistor R0 is connected between the connection point of the resistors R1 and R2 and the control circuit 102.

  Capacitors C1 and C2 are connected between the two electrodes of the crystal resonator 20 and the wiring of the reference potential VEE, respectively. The capacitor C3 is connected in series between one electrode of the crystal vibrating body 20 and the collector of the transistor Q1. The capacitor C4 is connected between the other electrode of the crystal vibrating body 20 and the base of the transistor Q1.

  The collector of the transistor Q1 is connected to the wiring of the power supply potential VCC via the resistor R3, and the emitter is connected to the wiring of the reference potential VEE. The resistor R4 is connected between the collector and base of the transistor Q1. The buffer amplifier 101 buffers the oscillation signal generated at the collector of the transistor Q1 and outputs it to the external connection terminal 62.

  The transistor Q1 performs an inverting amplification operation, and an oscillation signal generated at the collector is fed back to the base via the crystal oscillator 20 or the like. At that time, the crystal vibrating body 20 vibrates due to the AC voltage applied by the transistor Q1. The vibration is greatly excited at a specific resonance frequency, and the crystal resonator 20 operates as a negative resistance. As a result, the crystal oscillator 110 oscillates at an oscillation frequency determined mainly by the resonance frequency of the crystal resonator 20.

  However, the oscillation frequency of the crystal oscillator 110 can be finely adjusted by changing the capacitance value of the capacitor C1 or C2. Therefore, in the example shown in FIG. 9, the capacitors C1 and C2 are configured by variable capacitance diodes (varactor diodes) whose capacitance values change according to the control voltage, for example. The variable capacitance diode changes its capacitance value according to a reverse bias voltage applied between the cathode and the anode.

  A clock signal for setting data for controlling the oscillation frequency of the crystal oscillator 110 is input to the external connection terminal 63. The control circuit 102 includes a memory such as a nonvolatile memory. For example, data for controlling the oscillation frequency of the crystal oscillator 110 is set in the memory in accordance with the number of pulses included in the input clock signal. Further, the control circuit 102 generates a control voltage for controlling the capacitance values of the capacitors C1 and C2 based on the data stored in the memory, and supplies the control voltage to the capacitors C1 and C2 via the resistors R0 to R2. Thereby, the oscillation frequency of the crystal oscillator 110 can be controlled from the outside.

<Electronic equipment>
Next, an electronic apparatus using the crystal oscillator according to any embodiment of the present invention will be described.
FIG. 10 is a block diagram illustrating a first configuration example of an electronic apparatus according to an embodiment of the invention. The electronic apparatus includes a crystal oscillator 110, a CPU 120, an operation unit 130, a ROM (read only memory) 140, a RAM (random access memory) 150, and a communication unit according to any one embodiment of the present invention. 160, the display part 170, and the audio | voice output part 180 are included. Note that some of the components shown in FIG. 10 may be omitted or changed, or other components may be added to the components shown in FIG.

  The crystal oscillator 110 generates a clock signal by performing an oscillation operation at a set oscillation frequency. The clock signal generated by the crystal oscillator 110 is supplied to each part of the electronic device via the CPU 120 and the like.

  The CPU 120 operates in synchronization with the clock signal supplied from the crystal oscillator 110 and performs various signal processing and control processing according to a program stored in the ROM 140 or the like. For example, the CPU 120 controls the communication unit 160 in order to perform various signal processing according to an operation signal supplied from the operation unit 130 and to perform data communication with the outside. Alternatively, the CPU 120 generates an image signal for causing the display unit 170 to display various images, or generates an audio signal for causing the audio output unit 180 to output various sounds.

  The operation unit 130 is an input device including, for example, operation keys and button switches, and outputs an operation signal corresponding to an operation by the user to the CPU 120. The ROM 140 stores programs, data, and the like for the CPU 120 to perform various signal processing and control processing. The RAM 150 is used as a work area of the CPU 120, and temporarily stores programs and data read from the ROM 140, data input using the operation unit 130, calculation results executed by the CPU 120 according to the programs, and the like. To do.

  The communication unit 160 includes, for example, an analog circuit and a digital circuit, and performs data communication between the CPU 120 and an external device. The display unit 170 includes, for example, an LCD (liquid crystal display device) or the like, and displays various types of information based on a display signal supplied from the CPU 120. The audio output unit 180 includes, for example, a speaker and outputs audio based on an audio signal supplied from the CPU 120.

  Examples of the electronic device include a mobile terminal such as a mobile phone, a smart card, a calculator, an electronic dictionary, an electronic game device, a digital still camera, a digital movie, a TV, a video phone, a crime prevention TV monitor, a head mounted display, Applicable to personal computers, printers, network devices, car navigation devices, measuring devices, and medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, and electronic endoscopes) To do.

  FIG. 11 is a block diagram showing a second configuration example of the electronic apparatus according to the embodiment of the invention. In this example, a clock and a timer will be described. A timepiece according to an embodiment of the present invention includes a crystal oscillator 110, a frequency divider 111, an operation unit 130, a display unit 170, an audio output unit 180, and a time measuring unit according to any embodiment of the present invention. 190. In addition, the timer according to the embodiment of the present invention includes a control unit 200 instead of the audio output unit 180. Note that some of the components shown in FIG. 11 may be omitted or changed, or other components may be added to the components shown in FIG.

  The frequency divider 111 is composed of, for example, a plurality of flip-flops, and divides the clock signal supplied from the crystal oscillator 110 to generate a time-divided clock signal. The timer unit 190 is composed of, for example, a counter, and performs a time measuring operation based on the divided clock signal supplied from the frequency divider 111 to generate a display signal indicating the current time or the alarm time, or an alarm sound. For generating an alarm signal.

  The operation unit 130 is used to set the current time and the alarm time in the time measuring unit 190. The display unit 170 displays the current time and the alarm time according to the display signal supplied from the time measuring unit 190. The sound output unit 180 generates an alarm sound according to the alarm signal supplied from the time measuring unit 190.

  In the case of a timer, a timer function is provided instead of the alarm function. That is, the timer unit 190 generates a timer signal indicating that the current time matches the set time. The control unit 200 turns on or off the device connected to the timer in accordance with the timer signal supplied from the timer unit 190.

  According to the present embodiment, the clock signal is generated by using the crystal oscillator 110 that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal oscillator. An electronic device in which the generated crystal oscillator 110 is miniaturized can be provided.

<Moving object>
Next, a moving body using a crystal oscillator according to any embodiment of the present invention will be described. Examples of the moving object include an automobile, a self-propelled robot, a self-propelled transport device, a train, a ship, an airplane, and an artificial satellite.

  FIG. 12 is a block diagram illustrating a configuration example of a moving object according to an embodiment of the present invention. As shown in FIG. 12, this moving body includes a crystal oscillator 110 according to any embodiment of the present invention, and further includes an electronically controlled fuel injection device 210, an electronically controlled ABS device 220, or an electronically controlled type. Various electronically controlled devices such as a constant speed traveling device 230 are mounted. Note that some of the components shown in FIG. 12 may be omitted or changed, or other components may be added to the components shown in FIG.

  The crystal oscillator 110 generates a clock signal by performing an oscillation operation at a set oscillation frequency. The clock signal generated by the crystal oscillator 110 is supplied to the electronically controlled fuel injection device 210, the electronically controlled ABS device 220, the electronically controlled constant speed traveling device 230, or the like.

  The electronically controlled fuel injection device 210 operates in synchronization with the clock signal supplied from the crystal oscillator 110, and in a premixed combustion engine such as a gasoline engine, liquid fuel is injected into the intake air in a mist form at a predetermined timing. To do. The electronically controlled ABS (anti-lock brake system) device 220 operates in synchronization with the clock signal supplied from the crystal oscillator 110, and when the operation is performed to apply the brake, the brake is gradually strengthened. When the moving body starts to slide, the brake is once released and then driven again. The electronically controlled constant speed traveling device 230 operates in synchronization with the clock signal supplied from the crystal oscillator 110, and monitors the speed of the moving body, and applies an accelerator or a brake so that the speed of the moving body becomes constant. Control.

  According to the present embodiment, the clock signal is generated by using the crystal oscillator 110 that performs an oscillation operation with desired characteristics while reducing the number of dedicated monitor terminals used for adjusting the characteristics of the crystal oscillator. A moving body in which the crystal oscillator 110 to be generated is miniaturized can be provided.

  In the above embodiment, the crystal oscillator using the crystal oscillator has been described. However, the present invention is not limited to the embodiment described above, and is also applicable to an oscillator using a piezoelectric body other than the crystal. can do. Further, the oscillator may be provided with one extension wiring electrically connected to one electrode of the vibrating body, or the extension wiring may be cut to form one set of extension wiring. In that case, one monitor terminal electrically connected to the other electrode of the vibrator may be provided. Thus, many modifications are possible within the technical idea of the present invention by those who have ordinary knowledge in the technical field.

  DESCRIPTION OF SYMBOLS 10 ... Package, 11-13 ... Board | substrate, 20 ... Crystal oscillator, 21 ... Crystal piece, 22, 23 ... Electrode, 24 ... Support member, 30 ... Semiconductor device, 31-33 ... Terminal of semiconductor device, 40 ... Cover part 51-56 ... wiring pattern, 51a-56a ... interlayer connection part, 61-64 ... external connection terminal, 71, 71a, 71b, 72, 72a, 72b ... extended wiring, 81-84 ... notch, 101 ... buffer amplifier , 102 ... Control circuit, 110 ... Crystal oscillator, 111 ... Frequency divider, 120 ... CPU, 130 ... Operation unit, 140 ... ROM, 150 ... RAM, 160 ... Communication unit, 170 ... Display unit, 180 ... Audio output unit, DESCRIPTION OF SYMBOLS 190 ... Time measuring part, 200 ... Control part, 210 ... Electronically controlled fuel injection apparatus, 220 ... Electronically controlled ABS apparatus, 230 ... Electronically controlled constant speed traveling apparatus, Q1 ... Transistor, 0~R4 ... resistance, C1~C4 ... capacitor

Claims (10)

A first wiring having a first surface and a second surface facing each other, and a third surface protruding from the second surface by a side wall provided in a peripheral region of the second surface; A pattern and a second wiring pattern are arranged on the second surface, and an external connection terminal electrically connected to the first wiring pattern via an interlayer connection portion is arranged on the third surface. Package
A vibrator having an electrode disposed on the first surface of the package and electrically connected to the second wiring pattern via an interlayer connection;
A semiconductor device disposed on the second surface of the package and electrically connected to the first wiring pattern;
A set of extensions connected to the first wiring pattern and the second wiring pattern, respectively, having portions facing each other on the second surface of the package, the facing portions being visible from the outside of the package Wiring and
An oscillator comprising:   2. The oscillator according to claim 1, wherein a cutout is provided on the outside of the side wall of the package so that a facing portion of the one set of extension wires can be seen from the outside of the package.   2. The oscillator according to claim 1, wherein a cutout is provided inside the side wall of the package so that a facing portion of the one set of extension wires can be seen from the outside of the package.   2. The oscillator according to claim 1, wherein the side wall of the package is provided on the second surface of the package so as to avoid an opposing portion of the set of extended wirings.   The oscillator according to any one of claims 1 to 4, wherein a distance between the set of extended wires in the facing portion is 40 µm or more and 200 µm or less.   An electronic device comprising the oscillator according to claim 1.   A moving body comprising the oscillator according to claim 1. A first wiring having a first surface and a second surface facing each other, and a third surface protruding from the second surface by a side wall provided in a peripheral region of the second surface; A pattern and a second wiring pattern are arranged on the second surface, and an external connection terminal electrically connected to the first wiring pattern via an interlayer connection portion is arranged on the third surface. And (a) preparing a package configured such that at least a part of an extended wiring connecting the second wiring pattern to the first wiring pattern is visible from the outside;
(B) disposing a vibrating body on the first surface of the package and electrically connecting an electrode of the vibrating body to the second wiring pattern via an interlayer connection;
(C) adjusting the resonance frequency of the vibrating body using an external connection terminal electrically connected to the electrode of the vibrating body via the extension wiring;
A step (d) of bonding a lid covering the vibrating body to the package;
Cutting the extension wiring (e);
(F) disposing a semiconductor device on the second surface of the package and electrically connecting the semiconductor device to the first wiring pattern;
An oscillator manufacturing method comprising:   Between the step (d) and the step (e), using the external connection terminal electrically connected to the electrode of the vibrating body via the extension wiring, the step of strongly exciting the vibrating body The method for manufacturing an oscillator according to claim 8, further comprising:   A step of inspecting characteristics of the vibrating body using the external connection terminal electrically connected to the electrode of the vibrating body via the extension wiring between the step (d) and the step (e). The method of manufacturing an oscillator according to claim 8 or 9, further comprising:

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