JP2015070253A - Multiple piece forming wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple piece forming wiring board that facilitates detection of short circuit and disconnection.SOLUTION: A multiple piece forming wiring board 1 includes: a mother board 2 for multiple piece forming which is formed of a plurality of laminated insulating layers, has a plurality of square-shaped wiring board regions 1a arrayed in a matrix on a main surface thereof and an outside region 1b of the wiring board regions 1a, and on a surface of which plated electrodes 3 are provided; first penetration conductors 4 that pass through at least one of the insulating layers to be derived to at least one of both main faces of the mother board 2 and provided at the outside region 1b; second penetration conductors 5 that are pass at least one of the insulating layers to be derived to at least one of both main faces of the mother board 2, provided at the outside region 1b next to the first penetration conductors 4 and electrically connected to the plated electrodes 3; and inner layer patterns 6 that are provided inside the mother board 2, electrically connected to the second penetration conductors 5 and have clearances 7 between the first penetration conductors 4 and the patterns.

Description

  The present invention relates to a multi-chip wiring board in which a wiring board region for mounting an electronic component in the center of a mother board is arranged in at least one of vertical and horizontal directions.

  Conventionally, wiring boards for mounting electronic components such as semiconductor elements and crystal resonators are made of metal powder metallization such as tungsten, molybdenum and copper on a mother board made of an electrically insulating material such as an aluminum oxide sintered body or resin. It is formed by arranging wiring conductors made of Electronic components are mounted on such a wiring board, and each electrode of the electronic component is electrically connected to a corresponding wiring conductor through electrical connection means such as solder, bonding wires, and gold bumps. A device is made.

  Such wiring boards have become extremely small in size with the recent demand for miniaturization of electronic devices, and in order to efficiently produce a plurality of wiring boards and electronic devices, a plurality of wiring boards are provided in the central portion. A so-called multi-cavity wiring board in which the wiring board regions are arranged vertically and horizontally is manufactured, and is manufactured by cutting and dividing the wiring board regions along the boundaries of the wiring board regions.

  Further, in such a multi-piece wiring board, a part of the wiring conductor is formed in the wiring board region so as to be exposed on the surface of the wiring board region, and the plurality of wiring boards are electrically connected. An outer region is provided so as to surround the wiring board region. In this outer region, for example, a frame pattern for plating (plating frame) electrically connected to the wiring conductor of each wiring board region is formed. In addition, by dipping this multi-piece wiring board in a plating bath and supplying a current to each wiring conductor through a plating frame pattern, a plating layer is formed on the exposed surface of the wiring conductor by electrolytic plating. Adhere. The plating current is supplied to the plating frame pattern (plating frame) by forming a plating electrode electrically connected to the plating frame pattern on the outer periphery of the mother substrate. A jig is brought into contact with the electrode, and a predetermined current is passed from the power source for plating to the frame pattern for plating through the jig and the plating electrode.

Then, the multi-piece wiring board is cut and divided for each wiring board area, or after mounting an electronic component on the upper surface of each wiring board area, the wiring board area is cut and divided for each wiring board area.
(For example, see Patent Document 1)

JP-A-5-304370

However, recent wiring boards are required to have more pins and higher density of wiring conductors (internal wiring layers and through wiring conductors) in the wiring board due to further miniaturization and higher functionality of electronic components. ing. With the increase in the number of pins and the density of wiring conductors, gaps between internal wiring layers of multiple wiring boards and clearances between multiple through-wiring conductors that penetrate the insulating layer in the thickness direction are progressing. There is a possibility that a short circuit may occur between wiring conductors with different connections inside the wiring board due to, for example, misalignment during manufacturing or bleeding of the wiring conductor that occurs when the wiring conductor is printed. At this time, since the wiring conductors of the respective wiring board regions are electrically connected via the frame pattern for plating, the wiring conductors having different connections in the inspection method such as the electrical check in the state of the multi-cavity wiring board. It was difficult to identify a non-defective product / defective product of the wiring board in the multi-cavity wiring board state.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to provide a multi-piece wiring that can easily detect the possibility of a short circuit between wiring conductors in a wiring board region. It is to provide a substrate.

The first multi-cavity wiring board of the present invention is formed by laminating a plurality of insulating layers, and includes a plurality of rectangular wiring board regions arranged vertically and horizontally at a central portion and an outer region of the wiring substrate region. A plurality of mother substrates each having a plating electrode provided on a surface thereof, and are led to at least one of both main surfaces of the mother substrate through at least one of the insulating layers, The first through conductor provided in the outer region and at least one of the insulating layers are led out to at least one of both main surfaces of the mother board, and the first through conductor is adjacent to the outer region. A second penetrating conductor that is electrically connected to the plating electrode, and is provided inside the mother board and electrically connected to the second penetrating conductor; and Between the inner layer pattern with clearance and ,have.

  The second multi-cavity wiring board of the present invention comprises a plurality of insulating layers stacked, and a plurality of rectangular wiring board regions arranged vertically and horizontally at the center and an outer region of the wiring substrate region. A plurality of mother substrates each having a plating electrode provided on a surface thereof, and are led to at least one of both main surfaces of the mother substrate through at least one of the insulating layers, The first through conductor provided in the outer region and at least one of the insulating layers are led out to at least one of both main surfaces of the mother board, and the first through conductor is adjacent to the outer region. A second through conductor that is electrically connected to the plating electrode, and is electrically connected to the first through conductor, provided in the mother board, and the second through conductor; Inner layer pattern with clearance between , The has.

  According to the first configuration described above, for example, an internal wiring layer and a through wiring conductor having different connections in the wiring board region or a through wiring conductor having a different connection are in contact with each other due to a manufacturing deviation when stacking a plurality of insulating layers. When a short circuit occurs, the first through conductor and the inner layer pattern electrically connected to the plating electrode are short-circuited. Therefore, when the plating layer is deposited, the first through conductor is exposed to the exposed surface. By confirming the presence or absence of deposition of the plating layer, it is possible to easily detect the possibility that a short circuit has occurred between the internal wiring layer and the through wiring conductor having different connections in the wiring board region.

  According to the second configuration, for example, an internal wiring layer and a through wiring conductor having different connections within the wiring board region or a through wiring conductor having a different connection are in contact with each other due to a manufacturing deviation when stacking a plurality of insulating layers. When the short circuit occurs, the inner layer pattern connected to the first through conductor is short-circuited to the second through conductor electrically connected to the plating electrode. By confirming whether or not the plating layer is deposited on the exposed surface of one through conductor, it is easy to detect the possibility of a short circuit between the internal wiring layer and the through wiring conductor having different connections in the wiring board region. It becomes possible to detect.

It is a top view which shows the external appearance of the multi-cavity wiring board which concerns on the 1st Embodiment of this invention. (A) is the principal part enlarged top view of the A section of FIG. 1, (b) is a plan perspective view between the uppermost insulating layer of (a) and the second insulating layer from the top, (C) is an example of the longitudinal cross-sectional view corresponding to the XX line of (a). (A), (b), (c) is the principal part expanded sectional view which shows the state which the lamination | stacking shift | offset | difference produced in the multi-piece wiring board of this invention. (A) is a principal part enlarged top view of the multi-piece wiring board based on the 2nd Embodiment of this invention, (b) is the uppermost insulating layer of (a), and the 2nd insulation from the top It is a plane perspective view between layers, (c) is an example of the longitudinal cross-sectional view corresponding to the XX line of (a). It is a top view which shows the external appearance of the multi-cavity wiring board which concerns on the 3rd Embodiment of this invention. (A) is a principal part expanded top view of the B section of FIG. 5, (b) is a principal part expanded longitudinal sectional view corresponding to the XX line of (a). FIG. 7A is a top perspective view of the insulating layer α in FIG. 6, and FIG. 7B is a top perspective view of the insulating layer β in FIG. 6. FIG. 7A is a top perspective view of the insulating layer γ of FIG. 6, and FIG. 7B is a top perspective view of the insulating layer δ layer of FIG. 6.

  Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
With reference to FIGS. 1 to 4, the multi-cavity wiring board 1 according to the first embodiment of the present invention will be described. The multi-piece wiring board 1 in the present embodiment includes a mother board 2 having a plurality of wiring board areas 1a arranged in the vertical and horizontal directions and an outer area 1b arranged so as to surround the wiring board area 1a. A plating electrode 3, a first through conductor 4, and a second through conductor 5 are provided in the outer region 1b. The first through conductor 4 and the second through conductor 5 are led out to at least one of the main surfaces of the mother board 2. The multi-cavity wiring board 1 has wiring conductors formed on the surface and thickness direction of each insulating layer of the mother board 2. The multi-sided wiring board 1 may be either upward or downward, but for convenience, in the longitudinal sectional view, the orthogonal coordinate system xyz is defined and the positive side in the z direction is As used above, the word “upper surface” or “lower surface” is used.

  In the multi-cavity wiring board 1, a plurality of wiring board regions 1a are arranged in the vertical and horizontal directions at the center of the mother board 2, and an outer region 1b is provided around the wiring board regions 1a. ing. In such a multi-piece wiring board 1 in which a plurality of wiring board regions 1a are arranged in the central portion, a plurality of small rectangular wiring boards can be satisfactorily manufactured by cutting and dividing the wiring board regions 1a individually. be able to. In the example shown in FIG. 1, a total of 32 wiring board regions 1 a are arranged in the central portion of the mother board 2 in 8 rows in the vertical direction and 4 rows in the horizontal direction. The wiring board region 1a only needs to be arranged in a total of two rows in either the vertical or horizontal direction, and may be an arrangement of only the vertical columns or only the horizontal columns. The multi-piece wiring board 1 is a multilayer board having a plurality of insulating layers. In the example shown in FIG. 2C and FIG. 4C, the multi-piece wiring board 1 shows an example in which three insulating layers are provided. There may be.

  The base substrate 2 is made of, for example, an electrical insulating material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic sintered body. A plurality of substantially rectangular insulating layers made of ceramics or plastics such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin or tetrafluoroethylene resin (plastics) are stacked up and down. Is formed.

In each wiring board region 1a, wiring conductors formed on the surface and thickness direction of each insulating layer of the mother board 2 are formed. The wiring conductor is used as a conduction path for electrically connecting an electronic component mounted when divided into a plurality of wiring boards and an external circuit board. The wiring conductor has an internal wiring layer formed between the insulating layers of the mother board 2 and a through wiring conductor formed in the thickness direction of the insulating layer.

  The outer region 1b includes at least a first through conductor 4 and a second through conductor 5 having end portions exposed on one main surface of the mother board 2, and an inner layer pattern 6 electrically connected to the second through conductor 5. The plating electrode 3 electrically connected to the second through conductor 5 is provided. Further, a concave portion or a wiring conductor may be provided on one main surface of each wiring board region 1a, and the wiring conductor is a region that becomes a side surface of the wiring board when divided into the other main surface or individual wiring boards. May be provided.

  The plating electrode 3 is for electrically connecting a wiring conductor provided in the wiring board region 1a and a jig connected to a power source for plating. In the example shown in FIGS. 1 to 4, the plating electrode 3 is formed on the inner surface of a notch provided on the outer side of the multi-piece wiring board 1. In the case where the mother substrate 2 is made of ceramic, these plating electrodes 3 are formed by punching a ceramic green sheet with a mold or the like to form a through hole that becomes a notch, and then, on the inner surface of the through hole, the same as the wiring conductor described later The plating electrode 3 is formed by the same material and the same method, and the through hole is divided. Further, when the multi-piece wiring board 1 is made of resin, the plating electrodes 3 are formed in advance as a mother board 2 having through holes, or a large number of the mother boards 2 are taken so that the wiring board 1 is substantially flat. After forming the through hole using laser processing or the like, the plating electrode 3 is formed on the inner surface of the through hole by the same material and the same method as the wiring conductor used when the mother board 2 is resin. And it can form by dividing this through-hole.

  Moreover, in the example shown in FIGS. 1-4, although the plating electrode 3 is provided in the inner surface of a notch part, a through-hole is formed in the outer side area | region 1b, and it may form in the inner surface of this through-hole. I do not care. When the plating electrode 3 is formed on the inner surface of the notch or the through hole in this way, the contact with the jig connected to the power source for plating can be easily performed, and the plating layer is applied with high accuracy. can do.

2C, the second through conductor 5 is electrically connected to each inner layer pattern 6 between each insulating layer, and each inner layer pattern 6 is connected to the first through conductor. A clearance 7 having a width G is provided. Further, the second through conductor 5 is electrically connected to the plating electrode 3, and the first
The through conductor 4 and the inner layer pattern 6 are not electrically connected. This state indicates the normal state of the multi-piece wiring board 1. That is, when the multi-piece wiring board 1 in a normal state is immersed in a plating bath and a plating layer is deposited by an electrolytic plating method, the plating layer is not covered on the exposed surface of the first through conductor 4. A plating layer is applied to the exposed surface of the second through conductor 5 without being attached.

  In the example shown in FIG. 2C, the state in which the plating layer is applied to the exposed surfaces of the first through conductor 4 and the second through conductor 5 is indicated by horizontal hatching, and the plating layer is applied. No state is shown in white. By confirming the presence or absence of the plating layer on the exposed surface of the first through conductor 4 and the second through conductor 5 by visual inspection or image inspection, it is possible to obtain the multi-piece wiring board 1 in the state. There is a possibility that a gap has occurred between the uppermost insulating layer and the second insulating layer from the top or other layers, and a short circuit has occurred between wiring conductors with different connections between these insulating layers. Can be confirmed.

The normal state described above means a state in which the first through conductor 4 and the inner layer pattern are not short-circuited and the second through conductor 5 is not disconnected as shown in FIG. To do. In this state, as shown in FIG. 2C, the plating layer is not deposited on the exposed end portion of the first through conductor 4, and the plating layer is formed on the exposed end portion of the second through conductor 5. Is attached.

  Conversely, as will be described later, in the case of an abnormal state, as in the example shown in FIGS. 3A to 3C, is the plating layer deposited on the exposed end of the first through conductor 4, Alternatively, the plating layer is not deposited on the exposed end portion of the second through conductor 5.

  FIG. 3A and FIG. 3B show an example in the case where a deviation occurs between the insulating layers constituting the multi-piece wiring board 1 of the present invention. The example shown in FIG. 3A shows a state in which the uppermost insulating layer is shifted to the left side with respect to the second insulating layer when a plurality of insulating layers are stacked and pressed. In this state, the inner layer pattern 6 is in contact with the uppermost first through conductor 4 between the uppermost insulating layer and the second insulating layer. When a plating layer is deposited on the multi-piece wiring board 1 in such a state by using an electrolytic plating method, the first through conductor is passed through the second through conductor 5 and the inner layer pattern 6 of the second insulating layer. A plating layer is also deposited on the exposed surface of 4a. Further, since the other first through conductors 4b are not in contact with the inner layer pattern 6, the plating layer is not deposited.

In the example shown in FIG. 3A, the second through conductor 5a has not yet been disconnected. However, even if the wire has not been disconnected, if a certain amount of deviation occurs, for example, the through wiring conductor in the wiring board region 1a may not be able to maintain characteristics such as electrical resistance. Accordingly, it is necessary to detect a predetermined deviation amount even when the wire has not been disconnected. In such a case, the width G of the clearance 7 may be made the same as the width required for the reliability of joining of the through wiring conductors. With such a configuration, for example, in the example shown in FIG. 3A, although the second through conductor 5a is not disconnected, the plating is applied to the surface of the first through conductor 4a exposed on the mother board 2. Therefore, although there is no disconnection, it is possible to confirm that the through-wiring conductor cannot maintain the characteristics such as electric resistance and is a defective product.

  In the example shown in FIG. 3B, the uppermost insulating layer is shifted to the left more than the second insulating layer as compared with the example shown in FIG. In this state, the inner layer pattern 6 is in contact with the uppermost first through conductor 4 between the uppermost insulating layer and the second insulating layer, and the inner layer pattern 6 is the uppermost second through conductor 5. Not touching. When a plating layer is deposited on the multi-piece wiring board 1 in such a state using an electrolytic plating method, the second through conductor 5a of the second insulating layer electrically connected to the plating electrode 3 is used. The plating layer is also applied to the exposed surface of the first through conductor 4a, which is the uppermost layer, through the inner layer pattern 6. Further, since the other first through conductors 4b are not in contact with the inner layer pattern 6, the plating layer is not deposited. Further, since the uppermost second through conductor 5a is not electrically connected to the second through conductor 5a of the second insulating layer by displacement, a plating layer is not formed on the exposed surface of the second through conductor 5a. Not attached. In other words, by confirming the presence or absence of deposition of the plating layer on the exposed surface of the second through conductor 5a by visual inspection or image inspection, a deviation that causes the disconnection between the second through conductors 5a having the same connection is generated. It is possible to confirm that the occurrence of the occurrence of the ink is not generated due to bleeding at the time of printing the wiring conductor only on the first through conductor 4a, and it is possible to confirm that the displacement is generated as a whole.

In the example shown in FIG. 3C, the inner layer pattern 6 connected to the second through conductor 5a electrically connected to the plating electrode 3 and the first through conductor 4a are not electrically connected. Indicates the state. When a plating layer is applied to the multi-piece wiring board 1 in such a state using an electrolytic plating method, the exposed surface of the first through conductor 4a and the exposed surface of the second through conductor 5a The plating layer is not deposited. From this, when only the first through conductor 4a is confirmed, there is a possibility that the multi-piece wiring board 1 is erroneously detected as being in a normal state, but the second through conductor 5a is also confirmed. Thus, the possibility that the multi-piece wiring board 1 is not in a normal state can be confirmed.

  In the above example, an example is shown in which a deviation occurs between the uppermost insulating layer and the second insulating layer. However, when a deviation occurs between the second insulating layer and the third insulating layer, etc. Even in a state where a deviation occurs between other insulating layers, it can be considered in the same manner as described above.

  For example, when the mother board 2 is made of ceramic, the width G of the clearance 7 is approximately equal to the amount of deviation that can be allowed in the entire process including the step of laminating and pressing a plurality of ceramic green sheets to be the mother board 2. Even when a deviation larger than the allowable amount occurs during manufacturing, it is possible to detect the deviation, and to provide a highly reliable multi-piece wiring board 1. Visual confirmation of a short circuit between the internal wiring layer and the through wiring conductor is possible. Alternatively, it can be detected by an image inspection machine or the like. The allowable deviation amount is, for example, about half of the diameter of the through wiring conductor.

  As described above, the mother board 2 is provided with a plurality of wiring conductors, and the clearance G is preferably about the same as the minimum interval between the wiring conductors. Between each insulating layer, the width G of the clearance 7 is set to the same distance as the smallest distance between adjacent internal wiring layers and through wiring conductors in the wiring board region 1a, or between through wiring conductors having different connections. In this regard, when a short circuit occurs between the internal wiring layer and the through wiring conductor having different connections within the wiring board region 1a, or between the through wiring conductors having different connections, it becomes possible to detect with higher accuracy.

  Further, if the diameter of the second through conductor 5 is set to be equal to or smaller than the minimum diameter of the through wiring conductor in each insulating layer of the wiring board region 1a, the upper and lower electrical connections of the second through conductor 5 are shifted from the wiring board region 1a. Is affected by the same degree of influence as the state of the wiring board region 1a, and thus the disconnection between the internal wiring layer and the through wiring conductor, which should be the same connection in the wiring board region 1a, more accurately. Or it becomes possible to confirm the disconnection between the penetration conductors which should be the same connection.

Further, the first through conductor 4 and the second through conductor 5 are preferably provided around all four corners of the mother board 2. By providing a large number of pairs P of the first through conductors 4 and the second through conductors 5 at the corners of the wiring board 1, for example, when the mother board 2 is made of ceramics, it is provided at the center of the mother board 2. Even in the vicinity of the boundary value of the values at which the wiring conductors are short-circuited in the wiring board region 1a, it is possible to detect a multi-piece wiring board 1 in which the wiring conductors are short-circuited or possibly short-circuited. it can. This is because, when the mother board 2 is made of ceramics, the wiring board in which the periphery of the corner is most susceptible to displacement and deformation in the process of laminating and pressing, and the variation of the first through conductor 4 is arranged in the center. This is because it appears larger than the area 1a. As a result, the detection accuracy can be further improved.

  Further, by providing a plurality of pairs P of the first through conductors 4 and the second through conductors 5 around the four corners of the wiring board 1, for example, the multi-wiring board 1 is made of ceramics. When there is a pair P only at the corners, when metallized paste such as a wiring conductor is printed on a ceramic green sheet by screen printing or the like, or when the metallized paste is distorted or smeared, it is stacked and pressed When a local deformation occurs in the ceramic green sheet at this time, no defect is observed in the wiring board region 1a, but a plating layer is deposited on the first through conductor 4 or the second through conductor 5 There may be cases where the plating layer is not deposited. At this time, the pair P for detecting the deviation between the same insulating layers is provided between the same insulating layers around the four corners, so that a large number of defects detected in the pair P can be obtained in the entire wiring board 1. It is possible to confirm whether this is a phenomenon that has occurred or only a part of the pair P in which a defect has been detected, or a part of the wiring board 1 that is not in a normal state. As a result, it is possible to reduce the possibility of erroneous detection.

  In the pair P, it is preferable that the first through conductor 4 and the second through conductor 5 that confirm the same insulating layer to be detected are adjacent to each other and exposed on the same surface. This can easily compare whether or not the plating layer is applied in visual inspection or visual inspection in image inspection. In addition, when using image inspection, a short circuit occurs between the wiring conductors in the wiring board region 1a. This is because the possibility of occurrence of disconnection can be confirmed once.

  The first through conductor 4, the second through conductor 5, the inner layer pattern 6, and the wiring conductor are tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) when the mother board 2 is made of ceramics. Or it consists of metallization, such as copper (Cu). Further, the first through conductor 4, the second through conductor 5, the inner layer pattern 6, and the wiring conductor are copper (Cu), gold (Au), aluminum (Al), nickel (when the mother board 2 is made of resin). It is made of a metal material such as Ni), chromium (Cr), molybdenum (Mo) or titanium (Ti) and alloys thereof.

In order to protect the wiring conductor exposed on the main surface of the mother board 2 and prevent oxidation, and to improve electrical connection with electronic components and external circuit boards, it is exposed on the main surface of the mother board 2. The Ni plating layer having a thickness of 0.5 to 10 μm is deposited on the surface of the wiring conductor, or the Ni plating layer and the gold (Au) plating layer having a thickness of 0.5 to 3 μm are sequentially deposited.

  The wiring conductor is connected to the same plating electrode 3 in the same manner as the second through conductor 5, so that an electrolytic plating layer is deposited on the wiring conductor exposed on the surface of the mother board 2 by electrolytic plating. At the same time, the state of short circuit and disconnection in the multi-piece wiring board 1 can be confirmed by the state of the first through conductor 4 or the second through conductor 5 attached to the electrolytic plating layer.

  Next, a method for manufacturing the multi-cavity wiring board 1 of this embodiment will be described.

(1) First, a ceramic green sheet constituting the mother board 2 is formed. For example, when obtaining the mother substrate 2 which is an aluminum oxide (Al ₂ O ₃ ) sintered material, silica (SiO ₂ ), magnesia (MgO) or calcia (as a sintering aid) is added to the Al ₂ O ₃ powder. A powder such as CaO) is added, an appropriate binder, a solvent and a plasticizer are added, and then the mixture is kneaded to form a slurry. Thereafter, a ceramic green sheet for multi-piece production is obtained by a conventionally known forming method such as a doctor blade method or a calender roll method.

  When the mother board 2 is made of, for example, a resin, the mother board 2 can be formed by molding by a transfer molding method or an injection molding method using a mold that can be molded into a predetermined shape. . Further, the mother board 2 may be obtained by impregnating a base material made of glass fiber with a resin, such as glass epoxy resin. In this case, the mother substrate 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermally curing the epoxy resin precursor at a predetermined temperature.

  (2) A metal paste is applied to a portion that becomes a wiring conductor including the first through conductor 4, the second through conductor 5, the inner layer pattern 6, and the inner wiring layer and the through wiring conductor on the obtained ceramic green sheet by a screen printing method or the like. Apply and fill. This metallized paste is fired at the same time as the ceramic green sheet to be the mother substrate 2, so that the first through conductor 4, the second through conductor 5, the inner layer pattern 6, the inner layer pattern 6, and the like A wiring conductor including a wiring layer and a wiring conductor including a through wiring conductor is formed. This metal paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and a binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading. The metallized paste may contain glass or ceramics in order to increase the bonding strength with the mother board 2.

  (3) A ceramic green sheet laminate is produced by laminating and pressing the ceramic green sheets to be the respective insulating layers.

  (4) The ceramic green sheet laminate is fired at a temperature of about 1500 to 1800 ° C. to obtain a multi-piece substrate in which a plurality of mother substrates 2 are arranged. By this step, the metallized paste described above becomes a wiring conductor including the first through conductor 4, the second through conductor 5, the inner layer pattern 6, the internal wiring layer and the through wiring conductor.

  (5) Ni plating or Au plating is applied to the second through conductor 5 and the wiring conductor using the electrolytic plating method on the multi-piece wiring board 1 obtained by firing.

  The multi-piece wiring board 1 is obtained by the steps (1) to (5).

  In this way, the appearance of the multi-piece wiring board 1 having the plating layer deposited on the surface is visually inspected by image or visual observation, and the first through conductor 4 and the second through conductor 5 provided in the outer region 1b are plated. By confirming the presence or absence of layer deposition, it is possible to confirm the possibility of a disconnection or short circuit between the wiring conductors in the wiring board region 1a.

  (6) A plurality of wiring boards can be obtained by dividing the multi-cavity wiring board 1 into a plurality of mother boards 2. In this division, a dividing groove is formed in the multi-piece wiring board 1 along a portion that becomes the outer edge of the mother board 2, and the mother board is divided by breaking along the dividing groove or by a slicing method or the like. The method etc. which cut | disconnect along the location used as the outer edge of the board | substrate 2 can be used. The dividing grooves can be formed by cutting the multi-cavity substrate smaller than the thickness of the multi-cavity substrate after firing, but by pressing a cutter blade against the ceramic green sheet laminate for the multi-cavity wiring substrate 1, You may form by cutting smaller than the thickness of a ceramic green sheet laminated body with a slicing apparatus.

(Second Embodiment)
Next, a multi-piece wiring board 1 according to a second embodiment of the present invention will be described with reference to FIG. The second embodiment differs from the first embodiment in the through conductor to which the inner layer pattern 6 is connected. Other parts are the same as those in the first embodiment.

  As in the example shown in FIG. 4, the multi-piece wiring board 1 includes a plurality of insulating layers laminated, and a plurality of rectangular wiring board regions 1a and wiring board regions 1a arranged vertically and horizontally at the center. A plurality of mother substrates 2 having plating electrodes 3 provided on the surface thereof, and at least one of both main surfaces of the mother substrate 2 penetrating through at least one of the insulating layers. And is led to at least one of the two main surfaces of the mother board 2 through at least one of the first through conductor 4 and the insulating layer provided in the outer region, and the outer region 1b A second through conductor 5 provided adjacent to the first through conductor 4 and electrically connected to the plating electrode 3, provided inside the mother board 2, and electrically connected to the first through conductor 4. And an inner layer having a clearance 7 between the second through conductor 5 Turn 6 and may have a. In the example shown in FIGS. 4B and 4C, the multi-cavity wiring board 1 is in a normal state, and the first through conductor 4 and the inner layer pattern 6 are electrically connected. The inner layer pattern 6 is not electrically connected to the plating electrode 3. That is, when the multi-piece wiring board 1 is immersed in the plating layer and the plating layer is deposited by the electrolytic plating method, the plating layer is not deposited on the exposed surface of the first through conductor 4, and the second A plating layer is deposited on the exposed surface of the through conductor 5.

In the example shown in FIG. 4C, as in the example shown in FIG. 3, when the plurality of insulating layers are pressed and stacked, the uppermost insulating layer is displaced from the predetermined position of the second insulating layer. When the inner layer pattern 6 electrically connected to the first through conductor 5 and the second through conductor 5 are electrically connected, the multi-piece wiring board 1 in such a state is When the plating layer is deposited using the electrolytic plating method, the plating layer is deposited on the exposed surface of the first through conductor 4. Then, by confirming whether or not the plating layer is deposited on the exposed surface of the second through conductor 5 by visual inspection or image inspection, the wiring in the wiring board region 1a is connected in the state of the multi-piece wiring board 1 The possibility that a short circuit between different wiring conductors has occurred can be confirmed.

(Third embodiment)
Next, a multi-piece wiring board 1 according to a third embodiment of the present invention will be described with reference to FIGS.

  The multi-cavity wiring board 1 of the present embodiment is different from the multi-cavity wiring board 1 of the first embodiment in that the respective through conductors are formed on the surfaces of the first through conductors 4 and the second through conductors 5 derived. The first electrode pattern 10 and the second electrode pattern 11 having a wider width, the first through conductor 4 and the second through conductor 5 penetrate the mother substrate 2 in the thickness direction (z-axis direction), A point leading out to both the upper surface and the lower surface of the mother board 2 and a land 9 for assisting electrical connection between the first through conductors 4 and the second through conductors 5 between the insulating layers. It is.

  In the example shown in FIGS. 5 and 6, the first through conductor 4 and the second through conductor 5 are formed on the surface of the multi-piece wiring substrate 1, respectively, with the first electrode pattern 10 and the second electrode pattern 11. Each of the first through conductor 4 and the second through conductor 5 is wider than the first through conductor 4 and has a different shape in plan perspective.

  Whether or not the plating layer is deposited by increasing the area visible on the surface of the multi-layer wiring board 1 by providing electrode patterns on the surfaces of the first through conductor 4 and the second through conductor 5. Can be easily determined, and the possibility of false detection or no detection can be reduced.

  In addition, if the first electrode pattern 10 and the second electrode pattern 11 have different shapes, the plating layer is deposited on either the first electrode pattern 10 or the second electrode pattern 11, particularly in image inspection. Since it is recognized as a different shape when detecting whether or not, it is possible to reduce the possibility of erroneous detection. In addition, when visual inspection is performed, it is easier to confirm that the electrode pattern has a different shape. Preferably, when one of the electrode patterns has a nearly circular shape, the other electrode pattern should have a greatly different shape from each other, such as a triangle or a trapezoid having a large inclination.

  In the example shown in FIG. 6A, the first electrode pattern 10 and the second electrode pattern 11 are substantially equal in size, but it is preferable that the surface area is greatly different. For example, as a modification of the example shown in FIG. 6A, it is preferable that the surface area of the first electrode pattern 10 is 1.5 times or more that of the second electrode pattern 11. This can further reduce false detection in image inspection. In particular, if the first electrode pattern 10 is made larger than the second electrode pattern 11, it is easy to recognize because the Au plating layer is deposited on the second electrode pattern 11 in a normal state.

  Further, as in the example shown in FIG. 5, the first electrode pattern 10 and the second electrode pattern 11 are provided adjacent to each other, and the distance between the first electrode pattern 10 and the second electrode pattern 11 is 0.3 mm to 1.0 mm. If it is set to mm, erroneous detection in the image inspection can be prevented.

  In this embodiment, as shown in FIG. 6B, the first through conductor 4 and the second through conductor 5 penetrate the mother board 2 in the thickness direction (Z-axis direction). As a result, the inspection can be performed regardless of the front and back directions of the multi-piece wiring board 1.

  In the present embodiment, as shown in FIG. 6B, the inner layer pattern 6 is provided in all the layers of the plurality of insulating layers, and has a clearance G between each of the inner layer patterns 6. The first through conductors 4 are preferably provided respectively. In FIG. 6 (b), the mother board 2 is composed of six insulating layers, and each insulating layer has five insulating layers α to ε. The total number of pairs with the through conductors 5 is P1 to P5. Thus, by providing the pair P of the first through conductor 4 and the second through conductor 5 so as to be detected for each insulating layer between the α to ε layers, an abnormality occurs in the pair P between the insulating layers. Can be confirmed as one of the means of product analysis. When the number of insulating layers is n, n-1 pairs P are provided when checking the state between all insulating layers.

  7 to 8 are enlarged top perspective views of main parts in the insulating layers α to δ of the present embodiment.

  7 to 8, each land wiring conductor of the first through conductor 4, the second through conductor 5 and the wiring area substrate 1a is provided with a land 9 having a diameter equal to or larger than the diameter of the through wiring conductor. By forming between the insulating layers, it is possible to prevent an abnormality caused by a manufacturing shift that does not affect the disconnection or short circuit of the product, and to further increase electrical conduction between the upper and lower insulating layers. Further, as in the example shown in FIGS. 7 to 8, the clearance 7 is provided in a circular shape around the first through conductor 4, and the inner layer pattern 6 is provided in a similar circular shape around the clearance 7. Even if a deviation occurs in the direction, it is possible to reliably detect a short circuit between the internal wiring layer of the wiring board region 1a and the through wiring conductor. At this time, the width G of the clearance 7 is similar to that in the first embodiment in the internal wiring layers, the through wiring conductors, and the internal wiring layers and the through wiring conductors in the wiring substrate region 1a between the respective insulating layers. The shortest distance may be used, and the distance may be different for each pair P that confirms each insulating layer.

  As in the example shown in FIG. 7B, in the multi-cavity wiring board 1 of the present embodiment, a frame-like pattern 8 for plating electrically connected to the plating electrode 3 is formed in the β layer in the outer region 1b. Have. The second through conductors 5 of the pairs P1 to P5 and the internal wiring conductors of the wiring board region 1a are electrically connected to the plating electrode 3 via the frame pattern 8 for plating. The second through conductors 5 of the pairs P1 to P5 do not necessarily have to be connected to the frame pattern 8 for plating, but the internal wiring conductor in the wiring board region 1a is the frame pattern 8 for plating (plating electrode 3). Therefore, it may be electrically connected to the plating electrode 3 by conducting with the internal wiring conductor of the wiring board region 1a as in the example shown in FIG.

  Further, when the plurality of pairs P of the first through conductors 4 and the second through conductors 5 are provided along the frame-shaped pattern 8, the distance between the frame-shaped pattern 8 and the plurality of second through-conductors 5 is increased. It is easy to make them equal, the voltage applied when depositing the plating layer can be made the same, and the thickness of the plating layer is almost the same, so the false detection in the image inspection by the dark blue of the deposited plating layer Thus, it is possible to inspect the short circuit and the disconnection between the internal wiring layer of the wiring board region 1a and the through wiring conductor more favorably.

  Note that the third embodiment may be combined with the second embodiment in addition to the first embodiment.

  In addition, this invention is not limited to the example of the above-mentioned embodiment, A various deformation | transformation is possible.

  Further, the shape of the wiring board region 1a of the multi-piece wiring board 1 in the present embodiment is not specified.

DESCRIPTION OF SYMBOLS 1 ... Multi-wiring board 1a ... Wiring board area | region 1b ... Outer area | region 2 ... Mother board 3 ... Plating electrode 4 ... 1st penetration conductor 5 ... Second through conductor 6 ... inner layer pattern 7 ... clearance 8 ... frame pattern 9 ... land 10 ... first electrode pattern 11 ... second electrode pattern

Claims (8)

A plurality of insulating layers are laminated, and each has a plurality of rectangular wiring board regions arranged in the center in the vertical and horizontal directions and an outer region of the wiring board region, and a plating electrode is provided on the surface. A large number of mother boards,
Passing through at least one of the insulating layers and being led out to at least one of the two main surfaces of the mother substrate, a first through conductor provided in the outer region;
It penetrates at least one of the insulating layers and is led out to at least one of the two main surfaces of the mother substrate, and is provided adjacent to the first through conductor in the outer region, and is electrically connected to the plating electrode. A connected second through conductor;
A multi-piece wiring board, comprising: an inner layer pattern provided inside the mother board, electrically connected to the second through conductor, and having a clearance between the first through conductor. The multi-piece wiring board according to claim 1, wherein the first through conductor and the second through conductor are provided at corners of the mother board. At least one of both main surfaces of the mother board is electrically connected to the first through conductor, and a first electrode pattern having a surface area larger than a cross-sectional area of the first through conductor is provided,
The second electrode pattern that is electrically connected to the second through conductor and has a larger surface area than a cross-sectional area of the second through conductor is provided on at least one of both main surfaces of the mother board. The multi-piece wiring board according to claim 1 or 2. The outer region has a frame pattern for plating provided on the surface of the plurality of insulating layers or the mother substrate so as to surround the wiring substrate region,
The multi-piece wiring board according to any one of claims 1 to 3, wherein the second through conductor is electrically connected to the plating electrode through the frame pattern. The inner layer pattern is provided in all layers between the plurality of insulating layers,
The multi-piece wiring board according to any one of claims 1 to 4, wherein the first through conductors are provided so as to have a clearance between the inner layer patterns. The multi-piece wiring board according to any one of claims 1 to 5, wherein the first through conductor and the second through conductor are provided around all four corners of the mother board. The mother board is provided with a plurality of wiring conductors,
The multi-cavity wiring board according to any one of claims 1 to 6, wherein the clearance is substantially equal to a minimum interval between the wiring conductors. A plurality of insulating layers are laminated, and each has a plurality of rectangular wiring board regions arranged in the center in the vertical and horizontal directions and an outer region of the wiring board region, and a plating electrode is provided on the surface. A large number of mother boards,
Passing through at least one of the insulating layers and being led out to at least one of the two main surfaces of the mother substrate, a first through conductor provided in the outer region;
It penetrates at least one of the insulating layers and is led out to at least one of the two main surfaces of the mother substrate, and is provided adjacent to the first through conductor in the outer region, and is electrically connected to the plating electrode. A connected second through conductor;
A multi-layer wiring board, comprising: an inner layer pattern provided inside the mother board, electrically connected to the first through conductor, and having a clearance between the second through conductor.

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