JP5558321B2 - Multiple wiring board - Google Patents

Description

  In the present invention, a plurality of wiring board regions serving as wiring boards for mounting electronic components such as semiconductor elements and surface acoustic wave elements are arranged vertically and horizontally on a mother board, and the wiring conductors of each wiring board area are plated. The present invention relates to a multi-piece wiring board in which plating terminals for supplying a current for forming are formed on an exposed surface of a mother board.

  Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements have a plurality of rectangular plate-like shapes made of ceramic sintered bodies such as glass ceramic sintered bodies and aluminum oxide sintered bodies. It has a mounting portion for mounting electronic components on the upper surface of the insulating base formed by stacking the insulating layers, and is made of a metal material such as tungsten or copper from the mounting portion or its periphery to the side or lower surface of the insulating base. It has a structure in which a plurality of wiring conductors are formed.

  Such a wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board. The multi-cavity wiring board has, for example, a structure in which a plurality of wiring board regions serving as wiring boards are arranged vertically and horizontally on a flat mother board.

  In such a multi-piece wiring board, wiring conductors are formed from the upper surface to the lower surface of the wiring board region, and the wiring conductors of the upper and lower insulating layers are electrically connected to each other via through conductors that penetrate the insulating layer in the thickness direction. It is connected to the.

  Further, the multi-piece wiring board is manufactured by laminating and firing a plurality of ceramic green sheets on which a conductor paste serving as a wiring conductor is printed at a predetermined portion. The through conductor is formed by punching the ceramic green sheet in advance to form a through hole, filling the through hole with a conductive paste, and simultaneously firing at the time of firing.

JP 2001-319991 JP 2003-273272 A JP 2007-158183 A

  However, in the above-described prior art multi-cavity wiring board, there is a possibility that there is a stacking misalignment between the stacked upper and lower ceramic green sheets. When stacking deviation occurs, the electrical characteristics fluctuate due to deviation from a predetermined numerical value of the electromagnetic coupling between the upper and lower wiring conductors, and the upper and lower via via conductors that penetrate the insulating layer (ceramic green sheet) in the thickness direction. There is a possibility of causing problems such as disconnection between the via conductor and the wiring conductor when the wiring conductor is electrically connected. In particular, since the frequency of electrical signals transmitted through wiring conductors has been increasing in recent years, the influence on the electrical characteristics of the wiring conductors due to the positional deviation between the upper and lower wiring conductors has increased. For this reason, it is demanded that a multi-piece wiring board easily and reliably detect that such a stacking deviation has not occurred.

The present invention has been completed in view of such conventional problems, and its purpose is to provide a large number of pieces that can easily and reliably detect that a stacking deviation exceeding an allowable range has not occurred. It is to provide a wiring board.

  In the multi-cavity wiring board of the present invention, a plurality of wiring board regions are arranged vertically and horizontally on a mother board formed by laminating a plurality of insulating layers made of a ceramic sintered body, and on the exposed surface of the mother board, A multi-piece wiring board in which a plating terminal for supplying a plating current to a wiring conductor in the wiring board region is formed, and a through conductor is formed from the surface of the mother board to the interlayer of the insulating layer. And a conductive layer electrically connected to the plating terminal has a distance between the edge and the through conductor, and has an edge facing each other with the through conductor interposed between the insulating layers. In a direction in which the through conductor and the opposing edge of the conductor layer are arranged in a plan view, respectively, from the side surface of the through conductor to the opposing edge of the conductor layer. Sum of shortest distances Saga, and is characterized in that it matches to twice the laminating misalignment amount in the insulating layer to be tolerated in the one direction.

  Further, the multi-cavity wiring board of the present invention is the above configuration, wherein the conductor layer has at least a pair of quadrangular patterns arranged such that the sides of the conductor layer face each other across the through conductor in a plan view. It is characterized by being.

  Further, the multi-piece wiring board of the present invention is characterized in that, in the above configuration, the conductor layer is an annular pattern arranged so that the through conductor is located inside in a plan view. is there.

  In the multi-piece wiring board of the present invention, in the above configuration, a frame-shaped dummy region is provided on the outer peripheral portion of the mother substrate, and the conductor layer and the through conductor are formed in the dummy region. It is characterized by this.

  According to the multi-cavity wiring board of the present invention, each of the conductor layers having the above-described configuration, having edges facing each other with the through conductor interposed between the insulating layers and electrically connected to the plating terminal, From the side surface of the through conductor to the edge of the conductor layer in one direction in which the through conductor and the opposing edge of the conductor layer are arranged in a plan view. The total length of the shortest distances is equal to twice the amount of stacking misalignment of the insulating layer allowed in this one direction. Therefore, when the stacking misalignment is within an allowable range, the conductor layer due to stacking misalignment The decrease in the shortest distance between one edge of the conductor and the side of the penetrating conductor matches the increase in the shortest distance between the other edge and the penetrating conductor, and the total length of these shortest distances is The conductor layer is kept constant (twice the allowable stacking deviation) Not in contact with the edge and the through conductor facing each other is (that is, the conductor layer and the through conductor is not electrically connected.).

  Therefore, when a plating current is supplied to the plating terminal, the plating current is not supplied to the through conductor via the conductor layer, and the plating layer is deposited on the exposed end surface of the through conductor. do not do. And by confirming that the plating layer is not deposited on the exposed end face of this through conductor, it is easy to confirm that there is no stacking deviation exceeding the allowable range in the multi-piece wiring board, and It can be detected reliably. Therefore, it is possible to provide a multi-piece wiring board capable of easily and reliably detecting that a stacking deviation exceeding an allowable range has not occurred.

Note that in multi-cavity wiring boards where the stacking deviation has occurred beyond the allowable range, any part of the opposing edges of the conductor layer contacts the through conductor, so that the through conductor is interposed through the conductor layer. Is supplied with power for plating, and a plating layer is deposited on the exposed end face of the through conductor. Therefore, it is possible to easily identify a multi-piece wiring board in which the stacking deviation occurs.

  In the multi-piece wiring board of the present invention, in the above configuration, the conductor layer is at least a pair of quadrangular patterns arranged so that the sides face each other across the through conductor in a plan view. In this case, it is easy to form the conductor layer, and it is also easy to form the conductor layer and the through conductor in the above positional relationship. Therefore, in this case, it is easy and reliable to detect that the stacking deviation exceeding the allowable range has not occurred, and it is possible to provide a multi-piece wiring board effective in ensuring high productivity.

  In addition, if the conductor layer has a plurality of pairs of quadrilateral patterns with different directions facing each other, the presence or absence of stacking deviation is detected in a plurality of directions, for example, two directions (so-called XY directions) orthogonal to each other. You can also.

  In the multi-piece wiring board of the present invention, in the configuration described above, the conductor layer is an annular pattern in which the through conductor is positioned inside in a plan view. When some of the edges on the circumference are opposed to each other with the through conductor interposed between them, the conductor layer and the through conductor are not affected even if a laminating deviation exceeding the allowable range occurs in any radial direction of the annular pattern. Touch. When the conductor layer is in contact with the through conductor, the plating layer is deposited on the exposed end surface of the through conductor. Therefore, if the plating layer is not deposited on this end surface, the stacking misalignment will occur in any radial direction. Can be detected. Therefore, it is possible to provide a multi-piece wiring board that can more effectively detect that a stacking deviation exceeding an allowable range has not occurred.

  Further, in the multi-piece wiring board of the present invention, in any of the above configurations, a frame-like dummy region is provided on the outer peripheral portion of the mother board, and the conductor layer and the through conductor are formed in the dummy region. Since there is no need to dispose unnecessary conductor layers and through conductors in the wiring board area, it is easy to downsize the wiring board area (individual wiring board) and to increase the density of the wiring conductor, and to prevent misalignment. It is possible to provide a multi-piece wiring board that can be easily confirmed that it has not occurred.

(A) is a top view which shows the principal part in an example of embodiment of the multi-cavity wiring board of this invention, (b) is sectional drawing in the AA of (a). It is a top view which shows typically the whole multi-piece wiring board shown in FIG. It is a principal part enlarged plan view which expands and shows the principal part of Fig.1 (a). (A) is a top view which shows the principal part in the other example of embodiment of the multi-cavity wiring board of this invention, (b) is a top view which shows the principal part of the multi-cavity wiring board of a reference example. is there. (A) And (b) is a top view which shows the principal part in the other example of embodiment of the multi-piece wiring board of this invention, respectively. It is a top view which shows the principal part in the other example of embodiment of the multi-cavity wiring board of this invention. It is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention.

  A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

Fig.1 (a) is a top view which shows the principal part in an example of embodiment of the multi-piece wiring board of this invention, FIG.1 (b) is a cross section in the AA line of Fig.1 (a). FIG. 2 is a plan view schematically showing the whole multi-piece wiring board shown in FIG. 1 (a) and 1 (b)
In FIG. 2, 1 is a mother board, 2 is a wiring board region, 3 is a wiring conductor, 4 is a through conductor, and 5 is a conductor layer. A plurality of wiring board regions 9 in which wiring conductors 3 are formed are arranged on the mother board 1 in the vertical and horizontal directions, so that a multi-piece wiring board 9 is basically formed. Further, plating terminals 8 for supplying a plating current to the respective wiring conductors 3 of the plurality of wiring substrate regions 2 formed on the exposed surface such as the outer peripheral side surface of the mother substrate 1 and the outer peripheral portion of the upper surface are formed. Has been. In the example shown in FIG. 2, a dummy region 6 is formed on the outer periphery of the mother substrate 1, and a plating terminal 8 is formed in a notch provided on the outer periphery of the dummy region.

  The mother substrate 1 is a ceramic sintered body such as a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a mullite sintered body. A plurality of insulating layers 1a made of

  The plurality of wiring board regions 2 arranged on the mother board 1 are areas that each become an individual wiring board (not shown). By dividing the mother board 1 along the boundary of the wiring board region 2, a plurality of wiring boards are manufactured simultaneously and collectively.

  When an individual wiring board is used as an electronic component mounting board, an electronic component mounting portion (no reference numeral) is provided on the surface such as the central portion of the upper surface of the wiring board region 2. In the example shown in FIG. 1, the central portion of the wiring board region 2 is an electronic component mounting portion, and the wiring conductor 3 is formed from the mounting portion to the outer peripheral portion. In the example shown in FIGS. 1 and 2, the wiring conductor 3 is electrically connected to an electrode of an electronic component near a mounting portion via a conductive connecting material (not shown) such as a bonding wire or solder. .

  Electronic components (not shown) mounted on the mounting unit include semiconductor integrated circuit elements such as IC and LSI, and optical semiconductor elements such as LED (light emitting diode), PD (photodiode), and CCD (charge coupled device). Various electronic devices such as semiconductor devices including surface acoustic wave devices, piezoelectric devices such as surface acoustic wave devices and crystal resonators, capacitive devices, resistors, and micromachines (so-called MEMS devices) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Parts.

  The electronic component has a resin adhesive such as an epoxy resin, a polyimide resin, an acrylic resin, a silicone resin, a polyether amide resin, Au-Sn, Sn-Ag-Cu, or Sn-Cu on the mounting portion. , Sn-Pb or the like, or a bonding material such as glass.

  The wiring conductor 3 is electrically connected to an electronic component as described above, for example, and serves as a conductive path that electrically connects the electronic component to an external electric circuit. In the example shown in FIG. 1, wiring conductors 3 are arranged above and below with an insulating layer 1a interposed therebetween. The upper and lower wiring conductors 3 have portions that overlap each other, and are set so as to generate a predetermined inductance component and capacitance component by electromagnetic coupling at the overlapping portions. In this case, when a high frequency signal of about several hundred MHz to several tens GHz is transmitted to the wiring conductor 3, the electrical characteristics of the wiring conductor 3 become a predetermined value by electromagnetic coupling between the wiring conductors 3. Adjusted.

  The wiring conductor 3 is made of a metal material such as tungsten, molybdenum, copper-tungsten, manganese, silver, copper, palladium, platinum, or gold. These metal materials are deposited on the surface of the insulating layer 1a as a metallized layer, for example.

  The wiring conductor 3 may include a conductor (so-called via conductor) (not shown) penetrating the insulating layer 1a in the thickness direction. In this case, a via conductor is formed by filling a through-hole (not shown) penetrating the insulating layer 1a in the thickness direction with a metal material such as tungsten similar to the above.

  The plating terminal 8 is formed on an exposed surface such as the outer peripheral side of the square flat plate-shaped mother substrate 1 or the outer peripheral portion of the upper and lower surfaces, for example, and is a connection conductor (not shown) formed on the inside or the surface of the mother substrate 1. And the wiring conductor 3 of the wiring board region 2 is electrically connected. In the example shown in FIG. 2, the plating terminal 8 is provided with a notch in the shape of an arc or the like in plan view on the outer peripheral portion of the mother board 1, and the same metal material as that of the wiring conductor 3 on the inner surface of the notch Is formed.

  In such a mother substrate 1 having plating terminals 8 in which a plurality of wiring substrate regions 2 each having a wiring conductor 3 are arranged vertically and horizontally, for example, each insulating layer 1a is made of an aluminum oxide sintered body. If so, it can be manufactured as follows.

  First, a raw material powder composed mainly of borosilicate glass containing aluminum oxide and silicon dioxide, mixed with magnesium oxide, calcium oxide, etc. is kneaded with an organic solvent and a binder, and a doctor blade method, a lip coater method, etc. A ceramic green sheet is produced by forming into a sheet by a forming method. Next, a metal paste such as tungsten or molybdenum is kneaded with an organic solvent and a binder to produce a metal paste. Next, a metal paste is printed on a pattern of a predetermined wiring conductor 3 by a printing method such as a screen printing method in each region to be the wiring board region 2. Further, as necessary, a through hole is formed in the ceramic green sheet, and a metal paste serving as a via conductor is filled in the through hole. Then, a plurality of ceramic green sheets are printed with a metal paste serving as the plating terminals 8 in a predetermined pattern, and these are laminated. After the ceramic green sheet laminate is cut into the outer dimensions of the mother board 1, about By firing at a firing temperature of about 1500 to 1600 ° C., the mother board 1 having the plating terminals 8 in which the plurality of wiring board regions 2 each having the wiring conductor 3 are arranged vertically and horizontally can be manufactured. .

  The printing of the metal paste to be the plating terminal 8 may be performed either before or after the ceramic green sheets are stacked. In this case, an arc-like cut or the like may be provided on the outer peripheral portion of the ceramic green sheet or its laminate, and a metal paste that will serve as the plating terminal 8 may be printed on the inner surface of the cutout.

  In the multi-chip wiring board 9 of the present invention, through conductors 4 are formed from the surface of the mother board 1 to the interlayer of the insulating layer 1a, and the edges facing each other with the through conductor 4 interposed between the insulating layers 1a. And a conductor layer 5 electrically connected to the plating terminal 8 is disposed so as to be spaced from the edge and the through conductor 4, for example, as shown in FIG. Then, the total length of the shortest distances S from the side surface of the through conductor 4 to the opposing edges of the conductor layer 5 in one direction L in which the through conductor 4 and the opposing edge of the conductor layer 5 are arranged is: This corresponds to twice the amount of misalignment of the insulating layer 1a allowed in the one direction L. FIG. 3 is an enlarged plan view of the main part showing the main part of FIG. In FIG. 3, the same parts as those in FIG.

  According to such a multi-cavity wiring board 9, since the above configuration is provided, when the stacking deviation between the upper and lower insulating layers 1a is within an allowable range (that is, within the scope of the present invention). The decrease in the shortest distance S between one edge of the conductor layer 5 and the side surface of the through conductor 4 due to the misalignment coincides with the increase in the shortest distance S between the other edge and the through conductor 4. The total length of these shortest distances S is maintained constant (twice the allowable stacking deviation), and the opposing edges of the conductor layer 5 and the through conductor 4 are not in contact (that is, the conductor layer). 5 and the through conductor 4 are not electrically connected.)

Therefore, when a plating current is supplied to the plating terminal 8, no plating current is supplied to the through conductor 4 via the conductor layer 5, and the exposed end surface of the through conductor 4 is plated. The layer does not adhere. Then, by confirming that the plated layer is not deposited on the exposed end face of the through conductor 4, it is easy to confirm that the stacking deviation exceeding the allowable range does not occur in the multi-piece wiring board 9. And can be detected reliably. Therefore, it is possible to provide the multi-piece wiring board 9 that can easily and surely detect that the stacking deviation exceeding the allowable range has not occurred.

  In addition, in a multi-piece wiring board (not shown) in which the stacking deviation has occurred beyond the allowable range, one of the edges of the conductor layer (not shown) and the through conductor (not shown) are in contact with each other. Therefore, the power for plating is supplied to the through conductor via the conductor layer, and the plating layer is deposited on the exposed end surface of the through conductor. Therefore, it is possible to easily identify a multi-piece wiring board in which the stacking deviation occurs.

  FIG. 4A is a plan view showing a main part in another example of the embodiment of the multi-cavity wiring board 9 of the present invention, and FIG. 4B is a multi-cavity wiring board 19 of the reference example. It is a top view which shows the principal part. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. In FIG. 4B, 11 is a mother board of the multi-piece wiring board 19 of the reference example, 12 is a wiring board region, 13 is a wiring conductor, 14 is a through conductor, and 15 is a conductor layer.

  FIG. 4A shows an example in which the insulating layer 1a on which the conductor layer 5 is formed is misaligned to the right within an allowable range with respect to the upper insulating layer 1a. In this case, an increase in the shortest distance between the edge of the right conductor layer 5 and the side surface of the through conductor 4 and a decrease in the shortest distance between the edge of the left conductor layer 5 and the side surface of the through conductor 4 The total length of these shortest distances is kept constant, and the edge of the left conductor layer 5 and the through conductor 4 are not in contact with each other. In this case, since the plating conductor is not supplied with a plating current from the conductor layer 5, the plating layer is not deposited on the exposed end face. Therefore, it can be detected that the stacking deviation is within an allowable range.

  In other words, if the sum of the shortest distances between the penetrating conductors 4 and the edges of the conductor layer 5 facing each other is equal to twice the allowable deviation amount, each of the edges of the conductor layers 5 and the penetrating holes are penetrated. The shortest distance from the conductor 4 does not have to be the same shortest distance S. Also in the example shown in FIG. 4A, the sum of the shortest distances between the edges of the opposing conductor layers 5 and the through conductors 4 is twice the allowable deviation amount.

  On the other hand, in the multi-piece wiring board 19 of the reference example shown in FIG. 4 (b), the insulating layer (no symbol) on which the conductor layer 15 is formed has an allowable range with respect to the upper insulating layer. The stacking is shifted to the right. In the multi-cavity wiring board 19, the edge of the left conductor layer 15 is positioned so as to overlap the through conductor 14 in plan view, and the conductor layer 15 and the through conductor 14 are electrically connected. In this case, since the plating current is supplied to the through conductor 14 via the conductor layer 15, the plating layer is deposited on the exposed end surface of the through conductor 14 in the plating solution. Therefore, it is easily detected that the multi-layer wiring board 19 has a stacking deviation exceeding the allowable range.

  The electrical connection between the conductor layer 5 and the plating terminal 8 is, for example, an internal wiring (not shown) arranged between the insulating layers 1a, a via conductor (not shown) penetrating the insulating layer 1a in the thickness direction, or the like. It can be done through.

  Note that the allowable stacking shift amount is, for example, a shift amount allowed when the electromagnetic coupling between the upper and lower wiring conductors 3 described above is set to a predetermined value. When a laminating deviation occurs between the upper and lower insulating layers 1a exceeding the allowable deviation amount, the electromagnetic coupling amount between the upper and lower wiring conductors 3 deviates from a predetermined value, and the electrical characteristics of the wiring conductor 3 are reduced. It deviates from the predetermined value.

The allowable stacking deviation amount is, for example, in consideration of electromagnetic coupling between the upper and lower wiring conductors 3 as described above, and the insulating layer 1a is made of an aluminum oxide sintered body, and the wiring conductor 3 is made of tungsten. Or when the line width made of molybdenum is about 100 μm,
If the electrical signal transmitted through the wiring conductor 3 is a high-frequency signal of about several hundred MHz, the maximum is about 25 μm.

In this case, for example, the through conductor 4 has a circular shape (cylindrical shape) having a diameter of about 100 μm, and the conductor layers 5 having edges facing each other across the through conductor 4 are parallel to each other. What is necessary is just to set so that the penetration conductor 4 may be located in the exact center of these mutually parallel outer sides as square shape (rectangular shape etc.) whose length of one side is about 100 micrometers-500 micrometers. Since the allowable stacking deviation amount is 25 μm, the shortest distances from the sides facing each other across the through conductor 4 of the rectangular conductor layer 5 in plan view to the side surface of the through conductor 4 are both about 25 μm. (Set to about 50 μm in total).

  According to such a multi-piece wiring board 9, if the amount of misalignment between the upper and lower insulating layers 1a is 25 μm or less, which is an allowable deviation, the conductor layer 5 and the through conductor 4 are electrically connected. Never happen. That is, when there is no stacking deviation (the stacking shift amount is 0 μm), the shortest distance in plan view between the edge of each of the left and right conductor layers 5 and the side surface of the through conductor 4 is the same as the set value. It becomes about 25μm. Further, when the stacking deviation is the same as the allowable stacking shift amount, the shortest distance between the through conductor 4 and the edge of the conductor layer 5 is about 50 μm at either one of the opposing edges of the conductor layer 5. On the other hand, close to 0 μm.

  The allowable stacking deviation amount may be determined by factors other than the electromagnetic coupling between the wiring conductors 3 described above. For example, when a through hole (so-called castellation) (not shown) is provided along the boundary of each wiring board region 2, the end portion of the insulating layer 1a from the inner side surface of this castellation (the inner side surface of the through hole is defined). The allowable protrusion amount of the component) may be used as a reference. When the upper and lower wiring conductors 3 are directly electrically connected via a conductor (via conductor) (not shown) penetrating the insulating layer 1a in the thickness direction, the connection between the via conductor and the wiring conductor 3 is established. The range may be used as a reference.

  The plating current is supplied to the plating terminal 8 by, for example, pressing a conduction pin of a plating jig (so-called rack or the like) (not shown) against the plating terminal 8 and supplying power from a rectifier or the like through the plating jig. The plating terminal 8 is energized with a predetermined current. In this case, the plating current is supplied from the plating terminal 8 to the conductor layer 5 and also to the wiring conductor 3 in each wiring board region 2 in the plating solution, and nickel, cobalt, copper, gold or A plating layer such as an alloy containing these as main components is applied to the exposed surfaces of the wiring conductor 3 and the through conductor 4. In this case, if the wiring conductor 3 and the conductor layer 5 are electrically connected to each other via the connecting conductor (not shown) disposed between the insulating layers 1a between the wiring board regions 2, Sequentially from the outer peripheral wiring board region 2, a plating current is also supplied to the inner wiring board region 2.

  In the multi-piece wiring board 9 according to the present invention, the stacking deviation is not generated by confirming that the plating layer is not deposited on the exposed end face of the through conductor 4 as described above. This can be easily detected, and the time required for this detection is, for example, within about 10 seconds if about 100 to 400 wiring board regions 2 are arranged. On the other hand, in the conventional multi-cavity wiring board (not shown), when an electrical inspection is performed for each wiring board region (not shown) to inspect the presence or absence of misalignment, It takes about 10 minutes using an automatic inspection device.

As described above, the conductor layer 5 changes in accordance with the stacking deviation so that the shortest distance between the edge and the through conductor 4 is the same as the decrease in the other as described above. It needs to be. Therefore, it is desirable that the edges of the conductor layer 5 that face each other across the through conductor 4 have a line-symmetric relationship with respect to a straight line that passes through the through conductor 4 and passes through an intermediate point between these edges.

  As such a conductor layer 5, for example, as shown in FIG. 1, a pair of square patterns whose edges facing each other across the through conductor 4 are parallel to each other, or such a square pattern Are connected via connecting conductors (not shown) that connect the short sides of each other, a square frame pattern (not shown), an annular pattern, and the like. Note that a rectangular pattern such as a rectangular shape is suitable for the conductor layer 5 in consideration of the space to be arranged on the mother board 1 and productivity.

  That is, in the multi-cavity wiring board 9 of the present invention, the conductor layer 5 is at least a pair of quadrangular patterns arranged so that the sides of the conductor layer 5 face each other with the through conductor 4 in plan view. The conductor layer 5 can be easily formed, and the conductor layer 5 and the through conductor 4 can be easily formed in the above positional relationship. Therefore, in this case, it is easy and reliable to detect that the stacking deviation exceeding the allowable range has not occurred, and it is possible to provide the multi-piece wiring board 9 that is effective in ensuring high productivity. .

  Further, for example, as shown in FIGS. 5A and 5B, if the conductor layer 5 has a plurality of pairs of quadrilateral patterns with different directions facing each other, the presence or absence of misalignment in a plurality of directions is detected. You can also 5 (a) and 5 (b) are plan views showing the main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention. 5, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  In the example shown in FIG. 5 (a), two combinations of the conductor layer 5 and the through conductor 4 as shown in FIG. 1 are arranged in one direction L in which the edge of each conductor layer 5 and the through conductor 4 are arranged. Can be regarded as an example of a configuration in which they are arranged so as to be orthogonal to each other and so as to share the through conductor 4.

  In the case of such an example, it can also be detected that a stacking deviation is allowed between the upper and lower insulating layers 1a in two directions orthogonal to each other (so-called XY direction).

  As shown in FIG. 5B, the two sets of conductor layers 5 may be formed with different through conductors 4 interposed therebetween. In this case, it is possible to detect in which direction of the XY directions the stacking deviation has occurred. It is advantageous in taking measures to suppress the stacking deviation of the multi-chip wiring board to be manufactured subsequently by feeding back the result according to the detected direction of the stacking deviation (X and / or Y).

  Note that the four conductor layers 5 in the example shown in FIG. 5 are not all patterns separated from each other, and some of them may be connected to each other. Further, adjacent objects may be sequentially connected to each other to form a frame-like pattern.

  Further, in the multi-piece wiring board 9 of the present invention, for example, as shown in FIG. 6, when the conductor layer 5 is an annular pattern in which the through conductor 4 is positioned on the inner side in a plan view. The conductor layer 5 and the penetrating conductor 4 are in contact with each other in any radial direction of the annular pattern even if a stacking deviation exceeding an allowable range occurs. Therefore, it is possible to provide the multi-piece wiring board 9 that can more effectively detect that the stacking deviation exceeding the allowable range has not occurred. FIG. 6 is a plan view showing a main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 6, the same parts as those in FIG.

  In the example shown in FIG. 6, there are many combinations of the conductor layer 5 and the through conductor 4 as shown in FIG. 1, and one direction L in which the edge of each conductor layer 5 and the through conductor 4 are arranged is annular. It can also be considered as an example of a configuration in which the through conductors 4 are shared along the radial direction of the conductor layer 5.

  In this case, in plan view, for example, the center of the circular through conductor 4 is located at or near the center of the annular conductor layer 5, that is, the side surface of the through conductor 4 and the inner periphery of the conductor layer 5 are concentric. If it is set to be in the shape, it can be effectively detected that the stacking deviation exceeding the allowable range has not occurred.

  Further, as shown in FIG. 7, the multi-piece wiring board 9 of the present invention has a frame-like dummy region 6 provided on the outer peripheral portion of the mother board 1 in any of the above-described configurations. When the conductor layer 5 is formed in the dummy region 6, it is not necessary to dispose unnecessary through conductors 4 and the conductor layer 5 in the wiring substrate region 2, so that the wiring substrate region 2 (individual wiring substrate) It is possible to provide a multi-piece wiring board 9 that can easily confirm that there is no stacking deviation while facilitating downsizing and increasing the density of the wiring conductor 3. FIG. 7 is a plan view showing a main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 7, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the example shown in FIG. 7, the dummy region 6 has a rectangular frame shape, and the rectangular conductor layers 5 are arranged along the length direction of the dummy region 6 so that the long sides thereof are adjacent to each other. . Further, a through conductor 4 is disposed between the conductor layers 5. Also in this example, the shortest distances between the penetrating conductors 4 and the respective edges of the conductor layer 5 are both equal to the allowable deviation amount, and if these shortest distances are summed, they are equal to twice the allowable deviation amount. To do.

  In the example shown in FIG. 7, two notches are provided in each of the two outer peripheral portions of the mother substrate 1 facing each other, and the inner surface of the notches extends from the outer surface of the upper surface of the mother substrate 1. A metal layer is applied as the plating terminal 8. If the base plate 1 is sandwiched from above and below by holding the plating jig pins in the notches, the holding of the base substrate 1 in the plating solution and the supply of the plating current to the plating terminals 8 are performed together. be able to.

  Even in the configuration in which the dummy region 6 is provided on the outer peripheral portion of the mother board 1, the conductor layer 5 formed in the dummy region 6 is arranged so that the sides face each other with the through conductor 4 interposed therebetween in plan view. In addition, if at least a pair of square patterns are used, as described above, it is easy and reliable to detect that there is no stacking deviation exceeding an allowable range, and it is effective in ensuring high productivity. A multi-piece wiring board 9 can be provided.

  In the example shown in FIG. 7, two sets of quadrangular conductor layers 5 are arranged in the dummy region 6, each of which is perpendicular to one direction L in which the through conductors 4 and the edges facing each other across the through conductors 4 are arranged. Has been. In this example, the presence or absence of misalignment exceeding the allowable range in the multi-cavity wiring board 9 in the XY direction can be detected more effectively. It is also effective for increasing the density of wiring conductors on a single wiring board.

Even in the configuration in which the dummy region 6 is provided on the outer peripheral portion of the mother board 1, the conductor layer 5 is formed in an annular pattern in which the through conductors 4 are located on the inner side in a plan view, and the annular conductor layer is formed. If some of the edges on the inner circumference of 5 are opposed to each other with the through conductor 4 interposed therebetween, it is more effectively detected that the stacking deviation exceeding the allowable range has not occurred as described above. It is possible to provide a multi-piece wiring board that can be used. That is, also in this case, the conductor layer 5 and the through conductor 4 are in contact with each other through the conductor layer 5 even if a laminating deviation exceeding an allowable range occurs in any radial direction of the annular pattern of the conductor layer 5. 4 is supplied with a plating current, and a plating layer is deposited on the exposed end face of the through conductor 4. By detecting that the plating layer is deposited, it is possible to easily detect that a stacking deviation exceeding an allowable range has occurred.

  It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, a metal material similar to that of the wiring conductor 3 is used for the exposed end surface (upper end surface) of the through conductor 4 and a recognition conductor pattern (not shown) having a larger area than the end surface is formed into a circular shape or an elliptical shape. , It may be deposited in a pattern such as a quadrilateral shape so that the stacking deviation can be recognized more easily. In this case, the recognition pad having a larger area than the end face of the through conductor 4 can more easily and reliably recognize that the plating layer is deposited, that is, no stacking deviation has occurred. can do.

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a .... Insulating layer 2 ... Wiring board area | region 3 ... Wiring conductor 4 ... Through-conductor 5 ... Conductor layer 6 ... Dummy area 8 ... Terminal 9 for plating ... Multi-cavity wiring boards

Claims (4)

A plurality of wiring board regions are arranged vertically and horizontally on a mother board formed by laminating a plurality of insulating layers made of a ceramic sintered body, and the wiring conductor of the wiring board area is plated on the exposed surface of the mother board. A multi-piece wiring board in which terminals for plating for supplying current are formed, and through conductors are formed from the surface of the mother board to the interlayer of the insulating layer, and between the layers of the insulating layer, A conductor layer having edges facing each other with the through conductor interposed therebetween and electrically connected to the plating terminal is disposed at a distance between the edge and the through conductor, and is seen in a plan view. Then, the total length of the shortest distances from the side surface of the through conductor to the opposing edges of the conductor layer in one direction in which the through conductors and the opposing edges of the conductor layer are arranged is, In the one direction Multi-piece wiring substrate, wherein the match twice the laminating misalignment amount in the insulating layer acceptable. 2. The multi-piece wiring according to claim 1, wherein the conductor layer is at least a pair of quadrangular patterns arranged so that the sides thereof face each other across the through conductor in a plan view. substrate. The multi-piece wiring board according to claim 1, wherein the conductor layer is an annular pattern arranged so that the through conductor is located inside in a plan view. The frame-shaped dummy area | region is provided in the outer peripheral part of the said mother board | substrate, The said conductor layer and the said penetration conductor are formed in the said dummy area | region, The Claim 1 characterized by the above-mentioned. Multiple printed wiring board as described.

Images