JP2008135524A - Multiple patterning wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board wherein a plating layer can be surely and normally deposited on a positioning conductor pattern formed on the outer edge of a dummy region and furthermore the positioning conductor pattern can be easily and surely recognized. <P>SOLUTION: Many wiring board regions 2 are disposed in both a longitudinal and a vertical direction at the center of a mother substrate 1, and the positioning conductor pattern 5 is formed so as to be located on the production 2b of the boundary of the wiring board region 2 on the external edge of the dummy region 3 arranged on a peripheral part. In the multiple patterning board 9A where a plating layer is deposited on a wiring conductor 4 and the positioning conductor pattern 5, the positioning conductor pattern 5 is formed on the bottom of a recessed part 3a formed on the outer edge of the dummy region 3. Pins serving as a plating jig for supporting the substrate 1 are intercepted by the circumference of the recessed part 3a, so that the positioning conductor pattern 5 can be prevented from being covered with the pins, and it can be recognized that the plating layer is surely and normally deposited on the positioning conductor pattern 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a multi-piece wiring board in which wiring board regions are arranged vertically and horizontally at the center of a mother board and dummy areas are arranged at the outer periphery, and in particular, a conductor pattern to which a plating layer is deposited. Relates to a multi-piece wiring board formed at the outer edge of the dummy region.

  Conventionally, for example, a wiring board used for mounting electronic components such as semiconductor elements and piezoelectric elements is made of a ceramic material such as an aluminum oxide sintered body, and has a mounting portion on which the electronic components are mounted on the main surface. And a wiring conductor formed from the mounting portion to the outer peripheral portion of the insulating base. An electronic device is formed by mounting an electronic component on the mounting portion of the insulating base and electrically connecting an electrode of the electronic component to a wiring conductor.

  Such a wiring board is generally a wiring board that becomes a wiring board on a single mother board in order to facilitate the handling of a large number of wiring boards and to efficiently manufacture the wiring board and the electronic device. A wiring line substrate is manufactured in the form of a so-called multi-cavity wiring substrate in which a large number of regions are arranged.

  As shown in FIG. 6, the multi-cavity wiring board generally includes a mother board 11 in which a plurality of wiring board regions 12 are arranged vertically and horizontally in the center portion of the main surface, and dummy regions 13 are formed in the outer peripheral portion. An electronic component mounting portion 12a formed in the wiring board region 12 and a wiring conductor 14 formed from the mounting portion 12a of the wiring board region 12 to the outer peripheral portion and electrically connected to the electronic component. is there. Such a multi-piece wiring board 19 is cut at the boundary of the wiring board region 12 by cutting means such as dicing, whereby individual wiring boards are manufactured.

  A positioning conductor pattern 15 is formed on the outer edge portion of the dummy region 13 so as to be positioned on the extended line 12b at the boundary of the wiring board region 12. The position of the boundary of the wiring board region 12 is recognized by the positioning conductor pattern 15 and, for example, a dicing blade is positioned based on this position to cut the multi-piece wiring board 19 into each wiring board region 12. It is.

  Note that a plating layer of nickel, gold, or the like is deposited on the exposed surfaces of the conductors of the wiring conductor 14 and the positioning conductor pattern 15. These plating layers prevent oxidative corrosion of the wiring conductor 14 and the positioning conductor pattern 15, facilitate the connection of electronic components to the wiring conductor 14, and make the positioning conductor pattern 15 easy and reliable. In order to be deposited.

The plating jig used to hold the multi-layer wiring board 19 in the plating solution when depositing the plating layer is usually made of a material having elasticity such as metal on a frame-shaped main body. It is a structure in which a large number of pins are attached so as to protrude. As shown in FIG. 7, the mother board 11 is vertically held by the pins 20 and the upper and lower or left and right side portions thereof are sandwiched, and the multi-piece wiring board 19 is held by utilizing the elasticity of the pins 20. For example, as shown in FIG. 7, the tip portion of the pin 20 is bent or curved in a “hem” shape or the like in order to easily hold the mother board 11. FIG. 7 is a partial perspective view showing an example in which the mother board 11 of the multi-piece wiring board 19 is held by the pins 20 of the jig, and the same parts as those in FIG. .
JP 2006-310796 A JP 2006-278608 A JP 2005-209761 A

  However, in the conventional multi-cavity wiring board 19, the position of the pin 20 of the jig may be shifted due to an external force mistakenly applied when handling the jig or water pressure in the plating solution. The front end portion of the main substrate 11 is bent or curved so as to be applied to the outer edge portion of the dummy region 13 on the main surface of the mother substrate 11. For this reason, the pin 20 whose position is shifted may contact and cover the positioning conductor pattern 15, and the plating layer may not be normally attached to the positioning conductor pattern 15. In this case, defects such as so-called plating chipping and plating unevenness occur in the positioning conductor pattern 15, and it becomes difficult to recognize the positioning conductor pattern 15 stably and easily.

  Particularly, in recent years, the size of the wiring board region 12 in plan view has been reduced in accordance with the miniaturization of the wiring board, and the distance between the boundaries of the wiring board region 12 has been reduced to, for example, about 2.5 mm or less. For this reason, a large number of positioning conductor patterns 15 located on the extended line 12b at the boundary of the wiring board region 12 are also formed at a narrow interval, and the positioning conductor pattern 15 is even with a slight positional deviation of the pins 20. Is starting to hide.

  The present invention has been completed in view of such problems, and even if the positions of the pins of the jig for plating are displaced, the positioning conductor pattern formed on the outer edge portion of the dummy region is surely provided. It is an object of the present invention to provide a multi-piece wiring board that can normally deposit a plating layer and that can easily and reliably recognize a positioning conductor pattern.

  The multi-cavity wiring board of the present invention has a plurality of wiring board regions arranged vertically and horizontally having a mounting part for an electronic component and a wiring conductor connected to the electronic component at the center of the mother board. A positioning conductor pattern is formed on an outer edge portion of the dummy area arranged in the section so as to be located on an extension line of the boundary of the wiring board area, and a plating layer is attached to the wiring conductor and the positioning conductor pattern. In the multi-piece wiring board, the positioning conductor pattern is formed on a bottom surface of a concave portion formed on an outer edge portion of the dummy region.

  Further, the multi-piece wiring board of the present invention is characterized in that, in the above configuration, the concave portion is opened to an outer edge of the dummy region.

  Moreover, the multi-piece wiring board of the present invention is characterized in that, in the above configuration, the concave portion is formed for each of the positioning conductor patterns.

  Moreover, the multi-piece wiring board of the present invention is characterized in that, in the above configuration, the concave portion is formed for each of the plurality of positioning conductor patterns.

  The multi-piece wiring board of the present invention is characterized in that, in the above configuration, the concave portion is continuous at least on each side of the mother board along an outer edge of the dummy region. .

  The multi-cavity wiring board according to the present invention has a plurality of wiring board regions arranged vertically and horizontally, having a mounting part for an electronic component and a wiring conductor connected to the electronic part at the center of the mother board. The positioning conductor pattern is formed on the outer edge of the dummy area arranged on the outer peripheral portion so as to be located on the extended line of the boundary of the wiring board area, and the plating layer is covered on the wiring conductor and the positioning conductor pattern. In the multi-piece wiring substrate to be attached, a convex portion is formed adjacent to the positioning conductor pattern in the dummy region.

  According to the multi-cavity wiring board of the present invention, since the positioning conductor pattern is formed on the bottom surface of the concave portion formed at the outer edge of the dummy region, the mother board is held by the jig for plating. Sometimes, the pins of the jig are in contact with the surface (main surface) of the mother substrate adjacent to the concave portion from the side surface of the mother substrate, and the mother substrate is held without contacting the positioning conductor pattern at this portion. Therefore, it is possible to effectively prevent the plating jig pins from being in contact with and covering the positioning conductor pattern, and the plating layer can be normally deposited on the positioning conductor pattern.

  Therefore, according to the multi-cavity wiring board of the present invention, the positioning conductor pattern formed on the outer edge of the dummy region can be used even when the pins of the plating jig for holding the mother board are displaced. It is possible to deposit a plating layer normally, and it is a multi-piece wiring board in which a normal plating layer is uniformly applied to any positioning conductor pattern, and positioning by the naked eye, an image recognition device, etc. It is possible to provide a multi-piece wiring board that can easily and reliably recognize a conductor pattern for use.

  Further, in the multi-cavity wiring board of the present invention, when the concave portion is open to the outer edge of the dummy region, the plating solution can be easily passed into the concave portion from the side surface side of the mother board through the open portion. You can go in and out. Therefore, the plating solution is circulated and supplied more favorably to the positioning conductor pattern formed on the bottom surface of the concave portion, and the positioning conductor pattern has a defect due to lack of metal (ion) in the plating solution. Is effectively prevented. Therefore, in this case, the plating layer can be normally deposited on the positioning conductor pattern more reliably.

  In addition, in the multi-cavity wiring board of the present invention, when the concave portion is formed for each positioning conductor pattern, for example, a depression is formed in the outer edge portion of the dummy region corresponding to each positioning conductor pattern. In such a case, it is possible to form a concave portion with a shape and size that effectively prevents the contact of the pins of the jig for plating for each positioning conductor pattern. Therefore, in this case, the pins of the jig for plating can be more effectively prevented from covering the positioning conductor pattern, and the plating layer can be normally deposited on the individual positioning conductor patterns more reliably. it can.

  Further, in the multi-cavity wiring board of the present invention, when the concave portion is formed for each of the plurality of positioning conductor patterns, the pin contact is effectively prevented for each of the plurality of positioning conductor patterns. A concave portion can be formed by shape and size. Further, the space inside the concave portion can be made larger than the case where the concave portion is formed for each positioning conductor pattern, so that the plating solution can be made in and out well. Moreover, the man-hour for forming a recessed part can be reduced.

  Therefore, in this case, the plating layer can be normally deposited on the positioning conductor pattern more reliably and a multi-product wiring board with high productivity can be provided.

  Further, in the multi-cavity wiring board of the present invention, when the concave portion is continuous at least on each side of the mother board along the outer edge portion of the dummy area, for example, When a step which is a concave portion is formed over the entire length, the pin of the jig for plating is in contact with the surface (main surface) of the dummy region adjacent to the step on the center side of the mother substrate. This effectively prevents the pin from contacting and covering the positioning conductor pattern. Further, since the concave portion is continuous over the length direction of each side of the mother board, the inner space can be further secured.

  Further, in this case, for example, the concave portions can be formed collectively on each side of the square-plate-shaped mother substrate, so that the number of steps for forming the concave portions can be further reduced. Therefore, better productivity of the multi-piece wiring board can be ensured.

  Therefore, in this case, the plating layer can be normally deposited on the positioning conductor pattern more reliably and a multi-product wiring board with high productivity can be provided.

  Further, since the multi-cavity wiring board of the present invention has a convex portion formed adjacent to the positioning conductor pattern in the dummy area, the plating is performed when the mother board is held by a plating jig. The pins of the jig for contact are in contact with the end surface of the convex portion adjacent to the positioning conductor pattern from the side surface of the mother substrate, and the mother substrate is held without contacting the positioning conductor pattern at this portion. Therefore, it is possible to effectively prevent the plating jig pins from being in contact with and covering the positioning conductor pattern, and the plating layer can be normally deposited on the positioning conductor pattern.

  Therefore, according to the multi-cavity wiring board of the present invention, the positioning conductor pattern formed on the outer edge of the dummy region can be used even when the pins of the plating jig for holding the mother board are displaced. A plating layer can be normally deposited, and a multi-piece wiring board can be provided in which the positioning conductor pattern is easily and reliably recognized by the naked eye or an image recognition device.

  The multi-cavity wiring board according to the present invention will be described with reference to the accompanying drawings, in which a concave portion is formed (Configuration A) and a convex portion is formed (Configuration B).

(Configuration A)
FIG. 1A is a plan view showing an example of an embodiment of a multi-piece wiring board (configuration A) of the present invention, FIG. 1B is a side view of FIG. 1A, and FIG. It is a principal part enlarged plan view which shows the modification of (a). In FIG. 1, 1 is a mother board, 2 is a wiring board area, 3 is a dummy area, 4 is a conductor pattern for positioning, and 5 is a wiring conductor. A large number of wiring board regions 2 are arranged vertically and horizontally in the central portion of the mother substrate 1, a dummy region 3 is formed in the outer peripheral portion, and a positioning conductor pattern 4 is formed in the outer edge portion of the dummy region. A wiring board 9A is basically configured.

  The mother substrate 1 is made of ceramic materials such as aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies, mullite sintered bodies, glass ceramic sintered bodies, resin materials, resins and glass or ceramic powders. It is made of an insulating material such as a composite material.

  If the mother substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide or silicon oxide is formed into a sheet shape together with a resin binder and a solvent to produce a plurality of ceramic green sheets. These ceramic green sheets are produced by subjecting them to predetermined processing such as punching, lamination, and pressurization, and firing at a temperature of about 1300 to 1600 ° C.

  The mother board 1 has, for example, a quadrangular shape in plan view, and a large number of wiring board regions 2 are arranged vertically and horizontally at the center. Each of the wiring board regions 2 is a region serving as a wiring board for mounting electronic components, and has a mounting portion 2a having a rectangular shape or the like in plan view at the center of the upper surface.

  Electronic components (not shown) mounted on the mounting portion 2a are semiconductor integrated circuit elements such as IC and LSI, optical semiconductor elements such as LD (semiconductor laser), LED (light emitting diode), PD (photodiode), and crystal. These are various electronic components such as vibrators, piezoelectric elements such as surface acoustic wave elements, sensor elements such as pressure sensor elements and acceleration sensor elements, capacitive elements, inductors, resistors, and the like. This electronic component is joined to the mounting portion 2a via a brazing material such as a gold-tin brazing material or a joining material (not shown) made of glass, resin, or the like.

  It should be noted that the mounting portion 2a is provided in a shape such as a square shape or an oval shape according to the number, shape, size, function, etc. of the electronic components to be mounted, or a plurality of mounting portions 2a are provided on the upper surface and the lower surface of the wiring board region 2. Alternatively, a plurality of different shapes may be provided. Further, a recess (not shown) may be formed in the wiring board region 2, and the mounting portion 2a may be provided on the bottom surface of the recess.

  In the wiring board region 2, wiring conductors 4 connected to electronic components mounted on the mounting portion are formed. For example, one end of the wiring conductor 4 is exposed to the mounting portion 2a and the other end is exposed to the lower surface side of the wiring board region 2. The wiring conductor 4 functions as a conductive path for connecting the electronic component to an external electric circuit. For example, one end of the wiring conductor 4 and an electrode (not shown) of an electronic component are connected via a connecting material (not shown) such as a bonding wire, solder, or conductive adhesive, By electrically connecting the end side to an external electric circuit, the electrode of the electronic component and the external electric circuit are electrically connected via the wiring conductor 4.

  The wiring conductor 4 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, or palladium. If such a wiring conductor 4 is made of tungsten, for example, a metal paste prepared by adding an organic solvent, a binder, or the like to tungsten powder is applied to a ceramic green sheet serving as the base substrate 1 by a screen printing method or the like. It can be formed by printing in a predetermined pattern by the means.

  A dummy region 3 is arranged on the outer periphery of the mother substrate 1 so as to surround the wiring substrate regions 2 arranged in the vertical and horizontal directions. The dummy area 3 is formed to facilitate handling of the multi-piece wiring board 9A. By arranging the dummy area 3 on the outer peripheral portion of the mother board 1, the wiring board area 2 located at the outermost periphery of the array is protected, for example, and a machine such as a crack is formed in the wiring board area 2 during handling such as transportation. Occurrence of mechanical destruction is suppressed.

  In addition, a positioning conductor pattern 5 is formed on the outer edge of the dummy region 3 so as to be positioned on the extension line 2 b at the boundary of the wiring board region 2. The positioning conductor pattern 5 is for detecting the position of the boundary of the wiring board area 2 at the outer edge of the dummy area 3 (that is, the outer edge of the mother board 1). The positioning conductor pattern 5 is recognized by an image recognition device, and the dicing blade is moved in accordance with the position, whereby positioning during dicing is performed.

  For example, as shown in FIG. 1A, the positioning conductor pattern 5 has a shape that can clearly detect the position of the boundary of the wiring board region 2, such as a linear shape (elongated rectangular shape) extending in the direction of the extension line 2b. Form. The positioning conductor pattern 5 is not limited to a linear pattern, and may be a triangular shape, a rhombus, a trapezoidal shape, an elliptical shape, or the like, and any other shape as long as the position of the extension line 2b can be detected. It may be formed. Further, a pair of quadrangular conductor patterns (not shown) may be formed with the extension line 2b interposed therebetween, and the extension line 2b may be located between the pair of conductor patterns.

  The positioning conductor pattern 5 can be formed by the same method using the same material as the wiring conductor 4. For example, in the case of forming the positioning conductor pattern 5 with a tungsten metallized layer, the same metal paste as that for forming the wiring conductor 4 is applied to a predetermined position (specific position of the ceramic green sheet to be the mother substrate 1). Can be formed by printing by means such as a screen printing method.

  Note that the position of the boundary between the wiring board region 2 and the wiring board region 2 in the mother board 1 (ceramic green sheet) can be specified with reference to the outer edge of the mother board 1, for example. By setting the printing plate surface on which the pattern to be the wiring conductor 4 and the positioning conductor pattern 5 is formed on the basis of the outer edge of the ceramic green sheet, and printing the metal paste so as to become those patterns, The wiring conductor 4 and the positioning conductor pattern 5 can be formed at predetermined positions on the mother board 1.

  For such a multi-piece wiring board 9A, a pair of positioning conductor patterns 5 on the opposite sides of the mother board 1 and making a pair are recognized by, for example, an image recognition device, and the positions of the pair of positioning conductor patterns 5 are also recognized. The mother board 1 is cut along the boundary of the wiring board region 2 by moving the rotary blade (dicing blade) of the dicing machine and cutting the mother board 1 starting and ending points respectively. A wiring board (not shown) is produced.

  The electronic components are mounted on the mounting portions 2a of the individual wiring boards, the electrodes of the electronic components are connected to the wiring conductors 4 via bonding wires, and the mounting portions 2a are connected to the lid or resin material as necessary. By sealing with a sealing material (not shown) such as a semiconductor device, various electronic devices such as a semiconductor device, an oscillator, a sensor device, an imaging device, and a light emitting device are manufactured. The manufactured electronic device is used as a component in electronic devices such as computers, mobile phones, digital cameras, scanners, and pressure sensors.

  Such a multi-cavity wiring board 9A prevents oxidative corrosion of the wiring conductor 4 on the surface of the wiring conductor 4 before being divided into individual pieces, as well as solder wettability to the wiring conductor 4 and bonding wire. In order to improve the bonding property, a plating layer (not shown) such as nickel, gold, palladium, copper, silver or platinum is applied.

  The positioning conductor pattern 5 is also coated on its surface with a plating layer (not shown) similar to that deposited on the wiring conductor 4. The plating layer deposited on the positioning conductor pattern 5 prevents oxidative corrosion of the positioning conductor pattern 5 and makes it easy and reliable to recognize the positioning conductor pattern 5 by the naked eye, an image recognition device, or the like. belongs to.

  The positioning conductor pattern 5 formed of a tungsten metallized layer or the like tends to be difficult to recognize by the naked eye or an image recognition device because it tends to have a dull color tone and a weak metallic luster. On the other hand, if the plating layer is deposited on the surface of the positioning conductor pattern 5, the positioning conductor pattern 5 can be easily recognized by the metallic luster of the plating layer.

  The plating layer deposited on the wiring conductor 4 and the positioning conductor pattern 5 has at least a plating layer exposed on the outermost surface in order to obtain effects such as prevention of oxidative corrosion, improvement of bonding property, and improvement of recognition. A gold plating layer is preferred. For example, if the wiring conductor 4 and the positioning conductor pattern 5 are made of a metallized layer such as tungsten or molybdenum, the plated layer can be constituted by a nickel plated layer and a gold plated layer sequentially deposited on the metallized layer. preferable. The gold plating layer is firmly attached to the surface of the wiring conductor 4 and the positioning conductor pattern 5 by the nickel plating layer having good adhesion to both the metallized layer and the gold plating layer, and the above-mentioned oxidation corrosion is prevented by the gold plating layer. Effects such as prevention can be sufficiently obtained.

  For example, the plating layer does not need to supply a current for plating to the wiring conductor 4 or the positioning conductor pattern 5 and does not require such a current supplying conductor, so that the wiring conductor in the wiring board region 2 is not necessary. 4 is easily deposited by an electroless plating method. The plating layer is deposited by the electroless plating method by holding the mother substrate 1 from the side with pins (not shown) of a plating jig as described above, and holding the mother substrate 1 together with this jig with nickel or It is performed by dipping in an electroless plating solution such as gold.

  In the multi-cavity wiring board 9 </ b> A, the positioning conductor pattern 5 is formed on the bottom surface of the concave portion 3 a formed on the outer edge portion of the dummy region 3. Therefore, when holding the mother board 1 with the pins of the jig for plating, the pins of the jig come into contact with the surface (main surface) of the mother board 1 adjacent to the concave portion 3a from the side surface of the mother board 1, and this portion Thus, the mother board 1 is held without contacting the positioning conductor pattern 5. Therefore, it is possible to effectively prevent the pins of the jig from being in contact with and covering the positioning conductor pattern 5, and the plating layer can be normally deposited on the positioning conductor pattern 5.

  Therefore, according to the multi-cavity wiring substrate 9A, the positioning conductor pattern 5 formed on the outer edge portion of the dummy region 3 even when the pins of the plating jig for holding the mother substrate 1 are displaced. In addition, it is possible to provide a multi-layer wiring board 9A that can normally deposit a plating layer and can easily and surely recognize the positioning conductor pattern 5 by the naked eye, an image recognition device, or the like.

  Further, in such a multi-piece wiring board 9A, when the concave portion 3a is opened to the outer edge of the dummy region 3 as shown in FIGS. The plating solution can easily enter and exit from the side surface side of the mother substrate 1 into the concave portion 3a. Therefore, the plating solution is circulated and supplied more favorably to the positioning conductor pattern 5 formed on the bottom surface of the concave portion 3a. The positioning conductor pattern 5 is made of a metal (ion or ion) such as nickel or gold in the plating solution. ) Can be effectively prevented from occurring due to defects (so-called burns, burns, etc.). Therefore, in this case, the plating layer can be normally deposited on the positioning conductor pattern 5 more reliably. Therefore, it is preferable that the concave portion 3 a is open to the outer edge of the dummy region 3.

  Such a concave portion 3a is formed by punching the outer edge portion of a plurality of ceramic green sheets to be the mother substrate 1 according to the shape of the concave portion 3a using a mold or the like. It can be formed by applying. The inner surface of the concave portion 3a is formed by the punched portion of the uppermost ceramic green sheet, and the bottom surface of the concave portion 3a is formed by the upper surface of the ceramic green sheet laminated below the upper portion. In addition, the punching process for forming the concave portion 3a is not limited to the uppermost layer of the ceramic green sheets to be stacked, but also to the ceramic green sheets in the lower layers so as to be continuous vertically when stacked. It may be formed. The depth of the concave portion 3a can be adjusted by the number of punched layers, and the contact between the pins of the plating jig and the positioning conductor pattern 5 can be more effectively prevented.

  The concave portion 3a does not necessarily have to be open to the outer edge of the dummy area 3, and may be closed at the outer edge of the dummy area 3, for example, as shown in FIG. In this case, in order to promote the entry / exit of the plating solution into the concave portion 3a, for example, in a shape that is partially wide like a triangular shape in plan view shown in FIG. Preferably there is. 1C is an example of a modification of the multi-cavity wiring board 9A shown in FIGS. 1A and 1B, and the same parts as those in FIGS. 1A and 1B are the same. The code | symbol is attached | subjected.

  Further, in the multi-cavity wiring board 9A having the configuration A of the present invention, when the concave portion 3a is formed for each positioning conductor pattern 5, for example, as shown in FIG. Correspondingly, when a recess as the concave portion 3a is formed in the outer edge portion of the dummy region 3, the following effects are obtained.

  That is, in this case, each positioning conductor pattern 5 has a shape and a dimension that effectively prevent the contact of the pins of the plating jig, such as the depression shown as the concave portion 3a in FIG. Thus, the concave portion 3a can be formed. Therefore, in this case, it is more effectively prevented that the pins cover the positioning conductor pattern 5, and the plating layer can be normally deposited on the positioning conductor pattern 5 more reliably.

  The positioning conductor pattern 5 is formed by printing a metal paste at a predetermined position of the ceramic green sheet to be the mother substrate 1 as described above. When the concave portion 3a is formed, the metal paste is It prints on the surface (upper surface) of the ceramic green sheet which forms the bottom face of the concave part 3a mentioned above. In this case, the printing position of the metal paste to be the positioning conductor pattern 5 can also be specified with reference to the outer edge of the ceramic green sheet, for example, as described above.

  Further, in the multi-cavity wiring board 9A having the configuration A of the present invention, as shown in FIG. 2, for example, a concave portion 3a such as a rectangular cutout in which a plurality of positioning conductor patterns 5 are formed on the bottom surface. Is formed for each of the plurality of positioning conductor patterns 5, the following effects are obtained. 2A is a plan view showing another example of the embodiment of the multi-piece wiring board (configuration A) of the present invention, and FIG. 2B is a side view of FIG. .

  That is, the concave portion 3a can be formed in a shape and size that effectively prevents the contact of the pins of the jig for plating for each of the plurality of positioning conductor patterns 5. Further, the space inside the concave portion 3a can be made larger than the case where the concave portion 3a is formed for each positioning conductor pattern 5, so that the plating solution can enter and exit satisfactorily. Moreover, the man-hour for forming the recessed part 3a can be reduced.

  Therefore, in this case, the plating layer can be properly deposited on the positioning conductor pattern 5 more reliably, and a multi-product wiring board 9A with high productivity can be provided.

  Such a concave portion 3a formed for each of the plurality of positioning conductor patterns 5 is, for example, the uppermost layer (or a plurality of layers from the uppermost layer to the lower side) of the ceramic green sheet to be the mother substrate 1. It can be formed by punching the outer edge of the object over a plurality of extension lines 2b.

  The concave portions 3a in which a plurality of positioning conductor patterns 5 are formed on the bottom surface have different widths in the outer side direction of the mother substrate 1 for each concave portion 3a, or the number of positioning conductor patterns 5 formed on the bottom surface. May be different. For example, the sides of the mother substrate 1 of the concave portion 3a at positions where the pins of the jig for plating are likely to be pinned (for example, positions where the length of the side is divided into three or four equal parts) in the rectangular mother board 1 The pin is blocked by the main surface of the mother substrate 1 (dummy region 3) located between the adjacent concave portions 3a, and the pin contacts the positioning conductor pattern 5. You may make it prevent more effectively.

  In addition, the concave portions 3a formed for each of the plurality of positioning conductor patterns 5 also have the concave shapes formed for each of the positioning conductor patterns 5 described above when they are open to the outer edge of the dummy region 3. The same effect as when the portion 3a (such as a depression) is opened to the outer edge can be obtained.

  Further, in the multi-cavity wiring board 9A having the configuration A of the present invention, when the concave portion 3a is continuous along at least each side of the mother board 1 along the outer edge of the dummy region 3, for example, as shown in FIG. As described above, when the step which is the concave portion 3a is formed on the outer edge of the square frame-shaped dummy region 3 over the entire length of the side, the following effects can be obtained. 3A is a plan view showing another example of the embodiment of the multi-piece wiring board (configuration A) of the present invention, and FIG. 3B is a side view of FIG. .

  That is, in the multi-cavity wiring board 9A in which the concave portions 3a are continuous along at least each side of the mother board 1 along the outer edge of the dummy area 3, the dummy adjacent to the concave parts 3a on the center side of the mother board 1 is used. When the pins of the plating jig are in contact with the surface of the region 3 (the main surface on the inner end side of the step), it is effectively prevented that the pins are in contact with and cover the positioning conductor pattern 5. Moreover, since the recessed part 3a is continuing over each edge | side of the motherboard 1, the space inside it can be ensured still more widely.

  Further, in this case, for example, the concave portions 3a can be collectively formed on each side of the square plate-shaped mother substrate 1, so that the number of steps for forming the concave portions 3a can be further reduced. Therefore, the productivity of the multi-piece wiring board 1 can be ensured better.

  Therefore, in this case, the plating layer can be properly deposited on the positioning conductor pattern 5 more reliably, and a multi-product wiring board 9A with high productivity can be provided.

  The concave portion 3a that is continuous on the side of the mother board 1 has, for example, the outer dimensions of the ceramic green sheet that becomes the mother board 1 that is the uppermost layer (or a plurality of layers below the uppermost layer), A step is formed on the outer periphery of the upper surface of the ceramic green sheet to be the mother substrate 1 by making it smaller than the outer dimensions of other layers (similar shape etc.) by a processing means such as mechanical cutting. It can be formed by stacking.

  In addition, the recessed part 3a which continues on the side of the mother board 1 may not be formed over the entire circumference of the mother board 1. For example, such a concave portion 3a is formed only on the side where the positioning conductor pattern 5 is formed, and is not formed on the side or corner where the positioning conductor 5 is not formed. May be reduced.

(Configuration B)
FIG. 4A is a plan view showing an example of an embodiment of the multi-piece wiring board (configuration B) of the present invention, and FIG. 4B is a side view of FIG. In the configuration B, the multi-cavity wiring board 9B has the same basic structure as the multi-cavity wiring board 9A of the configuration A. In FIG. 4, the same reference numerals are given to the same parts as in FIG. Yes. That is, a large number of wiring board regions 2 are arranged vertically and horizontally in the central portion of the mother substrate 1, the dummy region 3 is formed in the outer peripheral portion, and the positioning conductor pattern 5 is formed in the outer edge portion of the dummy region 3. The multi-piece wiring board 9B is basically configured.

  The multi-cavity wiring board 9B is located deeper than the main surface of the mother board 1 in the multi-cavity wiring board 9A as a means for preventing the pins of the plating jig from coming into contact with the positioning conductor pattern 5. The positioning conductor pattern 5 is formed on the bottom surface of the concave portion 3a in FIG. 5, whereas only the convex portion 3b protruding from the main surface of the mother board 1 is formed adjacent to the positioning conductor pattern 5. Is different.

  Hereinafter, the convex part 3b which is this different point will be described, and description of other parts similar to the multi-cavity wiring board 9A will be omitted.

  The multi-cavity wiring board 9 </ b> B has a convex portion 3 b formed adjacent to the positioning conductor pattern 5 in the dummy region 3. Since such convex portions 3b are formed, the jig pins are adjacent to the positioning conductor pattern 5 from the side surface of the mother board 1 when the mother board 1 is held by the pins of the jig for plating. The base substrate 1 is held by this portion in contact with the end surface of the convex portion 3b. Therefore, it is possible to effectively prevent the pins of the jig from being in contact with and covering the positioning conductor pattern 5, and the plating layer can be normally deposited on the positioning conductor pattern 5.

  Therefore, according to the multi-cavity wiring board 9B of the present invention, even if the position of the pin of the plating jig for holding the mother board 1 is displaced, the positioning board formed on the outer edge of the dummy region 3 is used. A plating layer can be normally deposited on the conductor pattern 5, and a multi-piece wiring board 9 </ b> B can be provided that is easy and reliable for the positioning conductor pattern 5 to be easily recognized by the naked eye, an image recognition device, or the like.

  In the case of the multi-piece wiring board 9B having the convex portions 3b, the positioning conductor pattern 5 is formed on the main surface of the mother board 1 (dummy area 3). That is, unlike the positioning conductor pattern 5 of the multi-cavity wiring board 9A, the metal paste that becomes the positioning conductor pattern 5 is applied to the outer edge portion of the surface of the ceramic green sheet that becomes the mother board 1 that is laminated on the uppermost layer. Print it out.

  The convex portion 3b is made of, for example, a ceramic material such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, a resin material, a resin and glass, or a ceramic. It can be formed of an insulating material similar to that of the mother substrate 1, such as a composite material with powder.

  If the convex portion 3b is made of, for example, an aluminum oxide sintered body, a raw material powder similar to that for producing a ceramic green sheet is kneaded with a resin binder and a solvent to produce a ceramic paste. The paste can be formed by printing and applying it adjacent to a metal paste (which will be the positioning conductor pattern 5) printed on the ceramic green sheet which will be the mother substrate 1.

  The convex portion 3 b is formed by forming a ceramic green sheet similar to that for forming the mother substrate 1 into the shape of the predetermined convex portion 3 b, and forming the formed sheet on the uppermost surface of the ceramic green sheet serving as the mother substrate 1. It can also be formed by laminating and pressurizing and laminating. Moreover, you may form the convex-shaped part 3b by joining insulating materials, such as a ceramic material, a resin material, and a composite material, via glass, resin, etc. to the main surface of the motherboard 1.

  The convex portion 3b is not limited to a pair of rectangular shapes sandwiching the positioning conductor pattern 5 as shown in FIG. 4, and prevents the pins of the plating jig from contacting the positioning conductor pattern 5 Anything that can block the pin as much as possible can be used.

  An example of such a convex portion 3b is shown in FIG. FIGS. 5A to 5C are main part enlarged plan views showing other examples of the embodiment of the multi-cavity wiring board 9B. In FIG. 5, the same parts as those in FIGS. 1 and 4 are the same. The code | symbol is attached | subjected.

  5A and 5B show an example in which the convex portion 3b is formed in a columnar shape, here a columnar shape. When the convex part 3b is columnar, it can be easily formed by applying the ceramic paste to the surface of the ceramic green sheet to be the mother substrate 1 using a jig or the like. Moreover, the shape (conical truncated cone shape, quadrangular truncated pyramid shape, etc.) which becomes large when it planarly views on the mother board | substrate 1 side without forming in perfect column shape may be sufficient. In addition, when the convex portion 3b has a columnar shape or the like, the amount of ceramic paste can be reduced, so that the stress accompanying shrinkage during firing is small, and this stress causes the mother substrate 1 to be deformed. There is no.

  FIG. 5C shows an example in which the convex portion 3 b is formed with a large area on the surface of the dummy region excluding the positioning conductor pattern 5. In this case, for example, the convex portion 3b is formed by laminating a ceramic green sheet for a convex portion having a large area punched into a predetermined shape on a ceramic green sheet to be the mother substrate 1, and the convex portion 3b is formed. Good productivity can be secured.

  When the convex portion 3b is formed in a large area on the surface of the dummy region 3 excluding the positioning conductor pattern 5 as described above, the warpage of the mother substrate 1 is caused by contraction during firing of the convex portion ceramic green sheet. Such deformation may occur. Therefore, in this case, a dummy green sheet (not shown) similar to the ceramic green sheet for the convex portion is also laminated on the lower surface side of the mother board 1 (laminated body of ceramic green sheets) to obtain the mother board. It is preferable to cancel the stress during firing between the upper and lower surfaces of 1.

  The convex portions 3b are preferably located at least on both sides of the positioning conductor pattern 5 so as to reliably block the pins of the plating jig, and are located close to the outer edge of the dummy region 3. It is so preferable that it is formed.

  Further, the height of the convex portion 3b is preferably as high as possible to prevent the plating jig pins from coming into contact with the positioning conductor pattern 5. However, if the convex portion 3b becomes too high, there is a possibility that it becomes an obstacle when the mother substrate 1 is cut by dicing or the like. Therefore, if the convex portion 3b is made of, for example, an aluminum oxide sintered body or a glass ceramic sintered body formed by simultaneous firing with the mother substrate 1, it is preferable to suppress the height to 1 mm or less.

(A) is a top view which shows an example of embodiment of the multi-piece wiring board of this invention, (b) is the side view, (c) is a principal part expansion which shows the modification of (a) It is a top view. (A) is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention, (b) is the side view. (A) is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention, (b) is the side view. (A) is a top view which shows an example of embodiment of the multi-piece wiring board of this invention, (b) is the side view. (A)-(c) is a principal part enlarged plan view which shows the other example of embodiment of the multi-piece wiring board of this invention, respectively. It is a top view which shows an example of the conventional multi-piece wiring board. It is a fragmentary perspective view which shows an example when the multi-piece wiring board shown in FIG. 6 is hold | maintained with the jig | tool for plating.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area | region 2a ... Mounting part 2b ... Extension line 3 ... Dummy area 3a ... Recessed part 3b ... · Convex 4 ··· Wiring conductor 5 ··· Positioning conductor pattern 9A ··· Multiple-wiring board 9B ··· Multiple-wiring substrate

Claims (6)

A large number of wiring board regions having a wiring conductor connected to the electronic component and having a mounting part for the electronic component in the central part of the mother board are arranged vertically and horizontally, and the outer edge part of the dummy area arranged on the outer peripheral part The positioning conductor pattern is formed so as to be located on an extension line of the boundary of the wiring board region, and the positioning is performed in the multi-cavity wiring board in which a plating layer is deposited on the wiring conductor and the positioning conductor pattern. The multi-cavity wiring board, wherein the conductor pattern is formed on a bottom surface of a concave portion formed at an outer edge portion of the dummy region. The multi-cavity wiring board according to claim 1, wherein the concave portion is open to an outer edge of the dummy region. The multi-cavity wiring board according to claim 1, wherein the concave portion is formed for each positioning conductor pattern. The multi-cavity wiring board according to claim 1, wherein the concave portion is formed for each of the plurality of positioning conductor patterns. The multi-cavity wiring board according to claim 1, wherein the concave portion is continuous at least on each side of the mother board along an outer edge of the dummy region. A large number of wiring board regions having a wiring conductor connected to the electronic component and having a mounting part for the electronic component in the central part of the mother board are arranged vertically and horizontally, and the outer edge part of the dummy area arranged on the outer peripheral part In the multi-cavity wiring board in which the positioning conductor pattern is formed so as to be positioned on the extended line of the boundary of the wiring board region, and the plating layer is deposited on the wiring conductor and the positioning conductor pattern, the dummy A multi-piece wiring board, wherein a convex portion is formed in the region adjacent to the positioning conductor pattern.

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