JP2005210028A - Multi-molded wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-molded wiring board that not only enables the location of each circuit board area in a previous matrix array to be detected absolutely even after a mother board is divided, but also enables the mounting of an electronic part or its mounting to an external electric circuit board to be normally conducted. <P>SOLUTION: This multi-molded wiring board is composed of multiple laminated insulating layers. It is provided with a mother board 1 having a plurality of circuit board areas 2 arranged vertically and horizontally at the center of the principal plane and dummy areas 4 at the periphery, a wiring conductor 3 formed in the wiring board area 2, and a symbol pattern formed in the internal layer at the lower side of each circuit board area 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multi-cavity wiring board in which a plurality of regions serving as wiring boards for mounting electronic components such as semiconductor elements, surface acoustic wave elements, and piezoelectric vibrators are arrayed on a mother board.

  In general, a wiring board for mounting electronic components such as semiconductor elements, surface acoustic wave elements, and piezoelectric vibrators is formed by stacking a plurality of insulating layers on which wiring conductors are formed, and electronic components on the main surface of the laminate. It is the structure which provided the mounting part. Such a wiring board is usually in the form of a so-called multi-cavity wiring board in which the length of one side is as small as several millimeters, so that a plurality of wiring board regions that are to be the wiring board are arranged in a matrix on the mother board. It has been produced.

  A multi-piece wiring board is usually formed by laminating a plurality of insulating layers made of a ceramic sintered body, etc., and a rectangular wiring board region is vertically and horizontally arranged in the center of the main surface, and a dummy is formed in the outer periphery. This is a structure including a rectangular mother board in which a region is formed and a wiring conductor formed in a wiring board region of an insulating layer. The dummy area is provided to facilitate handling of the multi-piece wiring board.

  By dividing the multi-piece wiring board into individual wiring boards, a large number of wiring boards are formed, and the electrodes of the electronic components are connected to the exposed portions of the wiring conductors of the individual wiring boards via solder or the like. In some cases, electronic components are mounted on each wiring board area before the multi-piece wiring board is divided into individual wiring boards.

  The manufacturing method of such a multi-piece wiring board is as follows, for example, when each insulating layer is made of an aluminum oxide sintered body. First, raw powders such as alumina and borosilicate glass are formed into a sheet shape together with an organic solvent and a resin binder to form a plurality of ceramic green sheets (hereinafter also referred to as green sheets), and then the center of each green sheet A plurality of wiring board regions serving as wiring boards are arranged vertically and horizontally by partitioning the part vertically and horizontally, and a dummy area is provided on the outer peripheral part.

  Next, if necessary, through holes are formed at predetermined positions on the green sheet. Next, an organic solvent and a binder are added to and kneaded with metal powder such as tungsten and molybdenum to produce a conductor paste. A predetermined pattern is printed and applied on the surface of each wiring board region of the sheet or in the through hole.

A plurality of green sheets are stacked one above the other to obtain a laminate, and the laminate is fired to produce a multi-piece wiring board.
JP 1999-243034 A

  In the conventional multi-cavity wiring board as described above, after electronic components are mounted on each wiring board region to form individual electronic devices, wiring conductors caused by defective printing of the conductor paste that becomes the wiring conductor, etc. There may be problems such as disconnection, electrical short circuit between adjacent wiring conductors, and poor electrical connection of electronic components to the wiring conductor. When such a problem occurs, detecting the position of the wiring board in the vertical and horizontal arrangement in the mother board before the division of the defective circuit board prevents the reoccurrence of the problem, This is very important for early detection of similar defects.

  However, in the conventional multi-cavity wiring board, each wiring board area has the same shape and size, and therefore once divided into individual wiring boards, the original multi-cavity wiring board is aligned vertically and horizontally. There was a problem that the position could not be identified and detected.

  For such a problem, symbols corresponding to the positions of the vertical and horizontal arrays are formed on the surface of each wiring board region using the same conductor paste as that for forming the wiring conductor, A means for enabling individual wiring board regions to be identified is conceivable.

  However, if symbols are formed on the surface of the wiring board, different symbols are assigned to wiring boards and electronic devices having the same shape and characteristics. Therefore, electronic components can be mounted on the wiring board or electronic devices can be connected to external electric circuit boards. For example, problems such as misrecognition by an image processing device for alignment, etc. occur, and electronic components cannot be mounted normally or mounted on an external electric circuit board. May cause problems.

  The present invention has been completed in order to solve such a conventional problem, and an object of the present invention is to provide a mother board in a multi-cavity wiring board in which a large number of wiring board regions are arranged vertically and horizontally on a mother board. Even after the board is divided, it is possible to easily and reliably detect where the individual wiring board areas were located in the original vertical and horizontal arrangement, so that electronic components can be mounted and mounted on external electric circuit boards. An object of the present invention is to provide a multi-piece wiring board that can be normally performed.

  The multi-cavity wiring board of the present invention comprises a mother board in which a plurality of insulating layers are laminated, a plurality of wiring board regions are arranged vertically and horizontally at the center of the main surface, and dummy regions are formed at the outer periphery. And a wiring conductor formed in the wiring board region and a symbol pattern formed in an inner layer below each wiring board region.

  In the multi-piece wiring board according to the present invention, it is preferable that the symbol pattern is composed of a conductor layer.

In the multi-cavity wiring board of the present invention, preferably, the symbol pattern is formed of an insulating layer made of a material different from the insulating layer. Preferably, the symbol pattern is formed of a gap formed between the insulating layers.

  The multi-piece wiring board of the present invention is preferably characterized in that the symbol pattern is different for each wiring board region.

  Further, in the multi-piece wiring board of the present invention, preferably, the symbol pattern has two types of symbols representing a vertical arrangement and a horizontal arrangement in the vertical and horizontal wiring board regions. It is characterized by comprising the symbol.

  According to the multi-cavity wiring board of the present invention, since the symbol pattern is formed in the inner layer below each wiring board area, even if the mother board is divided and each wiring board area is used as an individual wiring board, The symbol pattern of the inner layer can be easily and reliably detected by an analysis method using electrical analysis means such as electromagnetic waves, ultrasonic waves, X-rays, capacitance inspection, etc., for example, the shape and position of the symbol pattern, By distinguishing the electrical characteristics depending on the vertical and horizontal arrangement positions, it is possible to easily and reliably detect where the wiring board was located in the original vertical and horizontal arrangement in each divided wiring board. can do.

  In addition, this symbol pattern is formed in the inner layer below the wiring board area and is not visible from the surface. Therefore, electronic components are mounted on the surface of the wiring board area, or electronic parts formed by individual wiring boards are used. When the device is mounted on the external electric circuit board, the symbol pattern is not hindered, and the electronic component can be normally mounted on the external electric circuit board.

  Further, in the multi-piece wiring board of the present invention, since the symbol pattern is preferably made of a conductor layer, it can be easily and accurately recognized and detected by an analysis apparatus using X-rays. In addition, the arrangement position of the wiring board region can be detected with good workability.

  Further, in the multi-piece wiring board of the present invention, preferably, the symbol pattern is made of an insulating layer made of a material different from that of the insulating layer, so that, for example, the reflectance of sound is made different between the symbol pattern and the insulating layer. Accordingly, the arrangement position of the wiring board region can be easily detected by analysis using an ultrasonic flaw detector or the like. In addition, since the symbol pattern is made of an insulating layer, the symbol pattern does not contact the wiring conductor accidentally in the inner layer, and the electrical characteristics of the wiring conductor are not deteriorated, and the electrical characteristics can be ensured more reliably. .

  Further, in the multi-cavity wiring board of the present invention, preferably, since the symbol pattern is composed of a gap formed between the layers of the insulating layer, the analysis using the ultrasonic flaw detector or the X-ray as described above, The arrangement position of the wiring board region can be detected with certainty.

  Further, in the multi-cavity wiring board of the present invention, preferably, the symbol pattern is different for each wiring board region. Therefore, the symbol pattern is recognized only by, for example, an X-ray apparatus, and the pattern is determined. The original arrangement position of can be detected very easily and reliably.

  Further, in the multi-piece wiring board of the present invention, preferably, the symbol pattern is composed of two types of symbols, ie, a symbol representing each vertical arrangement and a symbol representing each horizontal arrangement in the arrangement of the vertical and horizontal wiring board regions. Therefore, the vertical and horizontal arrangement positions of the wiring board region can be detected very easily by the combination of the symbol patterns.

  In addition, since the symbol pattern can be formed in various patterns, for example, when arranged in a very large number of rows, such as 30 or more in the vertical and horizontal directions, as in a recent multi-cavity wiring board. However, it can easily correspond to each wiring board region and can be identified.

  The multi-piece wiring board of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention. In FIG. 1, 1 is a mother board, 2 is a wiring board area, 3 is a wiring conductor, and 4 is a dummy area. The mother board 1, the wiring board region 2, the wiring conductor 3, and the dummy region 4 mainly form a multi-piece wiring board 9.

  In addition, since it is difficult to draw the individual wiring conductors 3 in detail, the wiring conductors 3 are configured to indicate a schematic region where the wiring conductors 3 are formed.

  The mother substrate 1 is a rectangular flat aluminum oxide sintered body, aluminum nitride sintered body, mullite sintered body, silicon nitride sintered body, silicon carbide sintered body, glass ceramic sintered body. It is formed by laminating insulating layers made of an electrically insulating material such as. For example, when each insulating layer is made of an aluminum oxide sintered body, an appropriate organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide to form a slurry ceramic slurry. At the same time, a plurality of green sheets (ceramic raw sheets) are obtained by forming the ceramic slurry into a sheet shape by adopting a sheet forming technique such as a doctor blade method or a calender roll method, and then the green sheet is cut and processed. The green sheet is made into an appropriate shape by punching and laminated to form a laminated body, and finally the laminated body is fired at a temperature of about 1600 ° C. in a reducing atmosphere.

  The mother board 1 is basically rectangular in shape, but each corner is rounded, or each side is not a straight line but has some irregularities. A substantially rectangular shape may be used.

  Further, the mother substrate 1 has dividing grooves 5 formed vertically and horizontally on at least one of its upper and lower main surfaces, and a plurality of rectangular wiring board regions 2 are defined by the dividing grooves 5. The mother substrate 1 can be easily divided along. The dividing groove 5 has a function of concentrating bending stress when the mother substrate 1 is bent along the substrate substrate and the individual wiring substrate regions 2 are divided into the respective wiring substrates 9. It is formed by pressing a metal blade (blade) having a predetermined cross-sectional shape on the main surface of the sheet and allowing the blade edge to enter a predetermined depth.

  Note that the method of dividing the multi-cavity wiring board into the individual wiring board regions 2 is not limited to the method of previously forming the dividing grooves 5 as described above, and other methods such as dicing are used. Also good.

  Each wiring board region 2 has a mounting portion for mounting electronic components at the center of the upper surface, and has a wiring conductor 3 made of a metal material such as tungsten, molybdenum, copper, or silver from the periphery to the lower surface of the mounting portion. doing. When the wiring conductor 3 is made of tungsten, for example, a metal paste obtained by adding and mixing an appropriate organic binder and solvent to tungsten powder is preliminarily screen-printed on the upper surface of the green sheet serving as each insulating layer of the mother substrate 1. For example, it is formed by printing and applying a predetermined pattern.

  An electronic component (not shown) is mounted on each mounting portion, and each electrode of the electronic component is electrically connected to a portion of the wiring conductor 3 exposed to the mounting portion, such as a bonding wire or a solder bump. Then, the electronic component is attached to the upper surface of each wiring board region 2 so as to cover the electronic component, so that the electronic component is more airtight between the wiring board region and the lid. As a result, a large number of electronic devices are arranged vertically and horizontally on the mother board 1. Thereafter, by bending the mother board 1 along the dividing grooves 5, a large number of electronic devices are manufactured simultaneously and collectively. Electronic components may be mounted after the mother board 1 is divided into the respective wiring board regions 2 to form individual wiring boards 9.

  Each formed electronic device has an external electrical connection by connecting a part of the wiring conductor 3 exposed on the lower surface of each wiring board 9 to the circuit conductor of the external electric circuit board via a connecting material such as solder. Mounted on a circuit board, the electrodes of the electronic component are electrically connected to an external circuit conductor.

  In the multi-piece wiring board of the present invention, the symbol pattern 6 is formed in the inner layer below each wiring board region 2.

  According to the present invention, since the symbol pattern 6 is formed in the inner layer below each wiring board region 2, even if the mother board 1 is divided and each wiring board region 2 is used as an individual wiring board 9, The symbol pattern 6 can be easily and reliably detected by an analysis method using electromagnetic waves, sound waves, X-rays, electrical analysis means, etc. For example, the shape, formation position, electrical characteristics, etc. of the symbol pattern 6 can be detected vertically and horizontally. By making them differ according to the arrangement position, it is possible to easily and reliably detect where the wiring board 9 is located in the original vertical and horizontal arrangement in each divided wiring board 9. .

  The symbol pattern 6 is formed in an inner layer below the wiring board region 2 and is not visible from the surface. Therefore, an electronic component can be mounted on the surface of the wiring board region 2, When the formed electronic device is mounted on the external electric circuit board, the symbol pattern 6 is not hindered, and the electronic component can be normally mounted on the external electric circuit board.

  The symbol pattern 6 is preferable because, for example, numbers and characters as shown in FIG. 1 can be easily identified. However, the design convenience such as the formation position of the wiring conductor 3 and the size of the wiring board region, and the detection of the symbol pattern 6 are preferable. Depending on the means or the like, a figure such as a polygon, a circle, an ellipse, or a combination of line segments may be used.

  When the symbol pattern 6 is formed of characters and numbers, the direction of the characters and numbers is preferably aligned in the same direction between the wiring board regions 2, so that the detection and identification of the symbol pattern 6 is further facilitated. Become.

  In the multi-piece wiring board of the present invention, the symbol pattern 6 is preferably made of a conductor layer. When the symbol pattern 6 is formed of a conductor layer, it can be easily and accurately recognized and detected by an analysis apparatus using X-rays, so that the workability of the wiring board region 2 can be improved with higher accuracy and better workability. Array position can be detected.

  In the multi-piece wiring board of the present invention, it is preferable that the symbol pattern 6 is made of an insulating layer made of a material different from the insulating layer forming the mother board 1. If the symbol pattern 6 is formed of a conductor layer different from the insulating layer forming the mother substrate 1, for example, the sound reflectance is made different between the symbol pattern 6 and the insulating layer forming the mother substrate 1. The arrangement position of the wiring board region 2 can be easily detected by analysis using an ultrasonic flaw detector or the like. Further, since the symbol pattern 6 is made of an insulating layer, the symbol pattern 6 does not accidentally contact the wiring conductor 2 in the inner layer, and the electrical characteristics of the wiring conductor 2 are not deteriorated. can do.

  In the multi-piece wiring board of the present invention, it is preferable that the symbol pattern 6 is composed of a gap formed between the insulating layers. If the symbol pattern 6 is formed by a gap formed between the insulating layers, the arrangement position of the wiring board region 2 is reliably detected by the analysis using the ultrasonic flaw detector or the X-ray as described above. can do.

  In the multi-cavity wiring board of the present invention, the symbol pattern 6 is preferably different for each wiring board region 2. If the symbol pattern 6 is different for each wiring board region 2, the original arrangement position of the wiring board region 2 can be very easily achieved simply by recognizing the symbol pattern 6 with, for example, an X-ray apparatus and determining the pattern. And it can detect reliably.

  Further, in the multi-piece wiring board of the present invention, the symbol pattern 6 includes two types of symbols, that is, a symbol representing each vertical arrangement and a symbol representing each horizontal arrangement in the arrangement of the vertical and horizontal wiring board regions 2. Preferably it consists of: If the symbol pattern 6 is composed of two types of symbols, that is, a symbol representing each arrangement in the vertical direction and a symbol representing each arrangement in the horizontal direction in the arrangement of the vertical and horizontal wiring board regions 2, The vertical and horizontal arrangement positions of the substrate region 2 can be detected very easily.

  Further, since the symbol pattern 6 can be formed in various patterns, for example, it is arranged in a very large number of rows such as 30 or more in the vertical and horizontal directions as in a recent multi-cavity wiring board. Even in this case, each wiring board region 2 can be easily corresponded and identified.

  As a combination of the symbol pattern 6, FIG. 1 shows an example in which the horizontal arrangement is distinguished by numbers and the vertical arrangement is distinguished by alphabets, but kana characters are also used in combinations of numbers and numbers, alphabets and alphabets. It may be what was.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, the mother substrate 1 has a flat plate shape in the above-described example, but may have a concave portion for accommodating an electronic component on the upper surface.

It is a top view which shows an example of embodiment of the multi-piece wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Wiring board area | region 3 ... Wiring conductor 4 ... Dummy area 5 ... Dividing groove 6 ... Symbol pattern 9 ... Wiring board

Claims (6)

A plurality of insulating layers are stacked, and a plurality of wiring board regions are formed in the central portion of the main surface in vertical and horizontal directions and a dummy region is formed in the outer peripheral portion, and wiring formed in the wiring board region A multi-piece wiring board comprising a conductor and a symbol pattern formed in an inner layer below each wiring board region. 2. The multi-piece wiring board according to claim 1, wherein the symbol pattern is made of a conductor layer. 2. The multi-piece wiring board according to claim 1, wherein the symbol pattern is made of an insulating layer made of a material different from that of the insulating layer. 2. The multi-cavity wiring board according to claim 1, wherein the symbol pattern is composed of a gap formed between the insulating layers. 5. The multi-piece wiring board according to claim 1, wherein the symbol pattern is different for each wiring board region. 2. The symbol pattern according to claim 1, wherein the symbol pattern is composed of two types of symbols, a symbol representing each arrangement in the vertical direction and a symbol representing each arrangement in the horizontal direction in the arrangement of the wiring board regions in the vertical and horizontal directions. The multi-piece wiring board according to any one of 5.

Images