JP2005340562A - Multiple patterning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning substrate wherein the distance from a splitting groove to a wiring conductor is formed in a prescribed distance. <P>SOLUTION: The multiple patterning substrate 107 is provided with: a mother substrate 101 in which two or more wiring substrate regions 102 and dummy regions 103 are formed; a splitting groove 104 formed in the boundary of the wiring substrate region 102 fellows, and the boundary of the wiring substrate region 102 and the dummy regions 103; wiring conductor 105 formed so that it might extend in the direction of a center section and the direction of a rim (splitting groove 104 direction) of wiring substrate region 102, at the peripheral part in wiring substrate region 102; and an insulating layer 106 formed in the peripheral part in wiring substrate region 102. The insulating layer 106 is formed so that the end by the side of the rim of the wiring conductor 105 (splitting groove 104 side) may be covered. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a multi-cavity wiring board in which a plurality of wiring board regions on which electronic components such as semiconductor elements and surface acoustic wave elements are mounted are arranged vertically and horizontally at the center of a mother board.

  2. Description of the Related Art Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements have been formed on the upper surface of a square plate-like insulating base made of a ceramic material such as an aluminum oxide sintered body (alumina ceramic). It has an electronic component mounting portion for mounting an electronic component, and has a structure in which a plurality of wiring conductors made of a metal material such as tungsten are arranged and formed from the mounting portion or its periphery to the lower surface of the insulating base. .

  Then, the electronic component is mounted and fixed on the mounting portion of the insulating base, and the electrode of the electronic component is electrically connected to the wiring conductor via an electrical connection means such as a bonding wire or solder, and the electronic component is used as necessary. Is hermetically sealed with a resin or a lid to form an electronic device.

  With the recent demand for downsizing of electronic devices, such wiring boards have become extremely small with a size of several millimeters square. In order to efficiently manufacture a substrate and an electronic device, it is manufactured in the form of a so-called multi-cavity wiring substrate in which a large number of wiring substrates are obtained simultaneously from a single large-area mother substrate. Yes. Such multi-cavity wiring boards generally have a wiring board area vertically and horizontally at the center of a rectangular mother board formed by laminating a plurality of insulating layers made of a square plate-shaped ceramic sintered body. A plurality of arrays are formed, and a dummy region is formed on the outer periphery. The dummy area is provided to facilitate handling of the multi-piece wiring board.

  In at least one of the upper and lower surfaces of the wiring board area of the mother board, a dividing groove is formed on the boundary between the wiring board areas and on the boundary between the wiring board area and the dummy area, and on the extension line of these boundaries in the dummy area. Are formed vertically and horizontally. Individual wiring boards can be obtained by dividing the mother board along the dividing grooves. The mother substrate is divided along the dividing groove by applying a bending stress to the mother substrate along the dividing groove and breaking the mother substrate at a portion along the dividing groove having a low mechanical strength.

Each wiring board is mounted with electronic components and hermetically sealed (after being made into an electronic device), and then a predetermined portion of the wiring conductor is electrically connected to the electric circuit of the external circuit board via a connecting material such as solder. Thus, the electronic component and the external electric circuit are electrically connected. Of the wiring conductors, the part connected to the external electric circuit is generally a part along the outer periphery of the lower surface of each wiring board for reasons such as easy alignment at the time of connection. A plurality is arranged in a shape such as a quadrangle whose one side is in contact with the outer periphery of the lower surface.
JP-A-11-54886 JP-A-5-75262

  However, in recent years, in order to increase the functionality of the external circuit board, many wiring boards have been mounted on the external circuit board at a narrow interval. In the case of a structure that extends to the outer edge of the lower surface of the wiring board, there is a risk that an electrical short circuit will occur between the wiring board mounted next to it due to the protruding connection material such as solder. It came out.

  In order to solve this problem, a method of forming a wiring conductor (portion connected to an external electric circuit) at a position away from the outer periphery of the wiring board is conceivable. However, in this case, misalignment is likely to occur in the printing position of the metal paste serving as the wiring conductor, the formation position of the dividing groove, etc., and the edge of the dividing groove (after the division becomes the outer edge of each wiring board) and the wiring conductor The distance to the position varies, making it difficult to align the individual wiring boards when they are mounted on the external circuit board, and part of the wiring conductor is in contact with the outer periphery of the wiring board. There is a possibility that an electrical short circuit may occur with the wiring board mounted on the board.

  The present invention has been completed in view of such conventional problems, and an object of the present invention is to provide a multi-piece wiring board in which the distance from the dividing groove to the exposed portion of the wiring conductor is ensured.

  The multi-cavity wiring board of the present invention includes a rectangular mother board in which a plurality of wiring board areas are arranged vertically and horizontally in the central part and a dummy area is formed in the outer peripheral part, and a boundary between the wiring board areas. And a dividing groove formed at a boundary between the wiring board area and the dummy area, and an outer peripheral portion in the wiring board area so as to extend in a central direction and an outer edge direction of the wiring board area. A wiring conductor and an insulating layer formed so as to cover one end of the wiring conductor on the outer edge side are provided.

  In the multi-cavity wiring board of the present invention, it is preferable that the insulating layer covers the part from the part separated from the parting groove to one end on the outer edge side of the wiring conductor along the parting groove. It is characterized by being formed.

  Further, in the multi-piece wiring board of the present invention, preferably, the wiring board region has a quadrangular shape, the wiring conductor is formed on each side of the wiring board region, and the insulating layer is in the wiring board region. It is formed over the entire circumference of the outer peripheral portion.

  In the multi-piece wiring board according to the present invention, preferably, the insulating layer has a thickness on the outer edge side that is thinner than a thickness on the central part side of the wiring board region.

  According to the multi-cavity wiring board of the present invention, since the insulating layer is formed so as to cover one end on the outer edge side of the wiring conductor, the distance between the dividing groove and the exposed portion of the wiring conductor is increased. The insulation layer can be secured as much as possible, and even if the wiring board is mounted on the external circuit board, an electrical short circuit occurs between the wiring board mounted next to it via a connecting material such as solder. Can be prevented.

  Further, the multi-cavity wiring board of the present invention is preferably formed so as to cover from the part separated from the dividing groove to one end on the outer edge side of the wiring conductor along the dividing groove. The distance between the groove and the exposed portion of the wiring conductor can be equalized between the wiring conductors, and an electrical short circuit at the outer periphery of the wiring board can be more effectively prevented. Moreover, since the formation width of the insulating layer can be made constant, the insulating layer may be formed in a strip shape regardless of the formation position of the wiring conductor, and the productivity of the multi-piece wiring board can be improved. .

  Further, the multi-cavity wiring board of the present invention preferably has an insulating layer formed over the entire circumference of the outer peripheral portion in the wiring board region, so that when the wiring board is mounted on the external circuit board, It is possible to prevent an electrical short circuit with another wiring board or the like mounted on the board.

  Further, the multi-cavity wiring board of the present invention preferably suppresses peeling from the peripheral portion of the insulating layer by having a thickness on the outer edge side smaller than a thickness on the central side of the wiring board region in the insulating layer. It becomes possible.

  The multi-piece wiring board of the present invention will be described in detail with reference to the drawings. FIG. 1A is a bottom view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 1B is an X of the multi-cavity wiring board shown in FIG. It is sectional drawing in the -X 'line. The multi-piece wiring board of the present invention includes a mother board 101 in which a plurality of wiring board areas 102 and dummy areas 103 are formed, a boundary between the wiring board areas 102, and between the wiring board area 102 and the dummy area 103. The formed dividing groove 104, the wiring conductor 105 formed in the wiring substrate region 102, and the insulating layer 106 formed on the outer peripheral portion of the wiring substrate region 102 are provided.

  The mother board 101 has a quadrangular shape such as a flat plate shape, and has a main surface (upper surface) serving as a mounting surface on which electronic components are mounted and a back surface (lower surface) facing the main surface. In the central portion of the mother board 101, a plurality of wiring board regions 102 are arranged vertically and horizontally. The wiring board region 102 has a quadrangular shape. A dummy region 103 is formed on the outer periphery of the mother substrate 101.

  The mother substrate 101 is made of a flat glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body or the like. Made of insulating material. The mother board 101 has a quadrangular shape. When the mother substrate 101 is made of, for example, a glass ceramic sintered body, an appropriate organic binder and solvent are added to and mixed with glass such as borosilicate glass or raw material powder such as aluminum oxide and silicon oxide, and a slurry-like ceramic. A ceramic green sheet (ceramic green sheet) is obtained by using a sheet forming technique such as a doctor blade method or a calender roll method to obtain a ceramic green sheet, and then the ceramic green sheet is cut. It is manufactured by forming a suitable shape by processing or punching, laminating a plurality of sheets as necessary, and finally firing the ceramic green sheet at a temperature of about 1000 ° C. in a reducing atmosphere.

  Each wiring board region 102 is a region that becomes an individual wiring board, and has a mounting portion on which an electronic component (not shown) is mounted at the center of the upper surface (main surface).

  The dummy area 103 is provided outside the central portion of the mother board 101 where the plurality of wiring board areas 102 are formed. This dummy region 103 is for facilitating handling of the multi-piece wiring board. In addition, the dummy region 103 is used for facilitating the routing of the wiring conductor 105 (for example, routing for supplying a plating current necessary for depositing the plating layer on the wiring conductor 105 by an electrolytic plating method). Is.

  The dividing groove 104 is used to divide the mother board 101, separate the dummy area 103, and divide the wiring board area 102 into individual rectangular shapes. By applying a bending stress to the mother substrate 101 along the dividing grooves 104, the mother substrate 101 is broken and divided along the dividing grooves 104 having a low mechanical strength. Such a dividing groove 104 is formed, for example, by pressing a blade (metal blade) having a predetermined cross-sectional shape against the back surface of the green sheet laminate to be the mother substrate 101 and intruding to a predetermined depth. The The pressing of the blade can be performed, for example, using a mold in which such a plurality of blades are provided so as to protrude above the mold body. First, a first mold formed by arranging and attaching a plurality of cutter blades to the tip of the mold body corresponding to one of the vertical and horizontal divided grooves in either the vertical or horizontal direction is designated as a ceramic green sheet. Is positioned on the back surface of the mold and pressed with a predetermined pressure to form the split grooves 104 in one direction. Similarly, a plurality of cutter blades are arranged at the tip of the mold body corresponding to the split grooves 104 in the other direction. The second mold formed is positioned on the back surface of the ceramic green sheet and pressed with a predetermined pressure to form the divided grooves 104 in other directions, whereby the divided grooves 104 are formed vertically and horizontally.

  The wiring conductor 105 is formed on each side of the outer peripheral portion in the wiring board region 102. The wiring conductor 105 is formed to extend in the central portion direction and the outer edge direction (in the direction of the dividing grooves 104) of the wiring board region 102. The wiring conductor 105 is electrically connected to an electrode of an electronic component mounted on the mounting portion, and has a function of deriving an electrical path from the electrode of the electronic component to the outside such as the lower surface (back surface) of each wiring board region 102. Make. For example, a semiconductor element such as a semiconductor integrated circuit element or an optical semiconductor element, a surface acoustic wave element, a piezoelectric vibrator such as a crystal vibrator, a capacitive element, a resistor, or the like is mounted on the mounting portion. Is electrically connected to a portion of the wiring conductor 105 exposed to the mounting portion or its periphery via an electrical connection means (not shown) such as a bonding wire or a solder bump, whereby each electrode of the electronic component is wired. It is led out to the lower surface of the wiring board region 102 (each wiring board after the division) via the conductor 105. The lead portion of the wiring conductor 105 is electrically and mechanically connected to the electric circuit of the external circuit board via a connecting material such as solder, so that the electrode of the electronic component is electrically connected to the external electric circuit. . A portion of the wiring conductor 105 that is connected to an external electric circuit is formed on the outer peripheral portion of the lower surface of each wiring board region 102 so as to be adjacent to the dividing groove 104. A portion of the wiring conductor 105 formed so as to be adjacent to the dividing groove 104 functions as an external connection pad connected to an external electric circuit in the divided wiring board.

  The wiring conductor 105 is made of a metal material such as copper, silver, palladium, gold, tungsten, molybdenum, or manganese. For example, when it is made of copper, a metal paste obtained by adding an appropriate organic binder and solvent to the copper powder is mixed. It is formed by printing and applying a predetermined pattern on the surface of the green sheet to be the mother substrate 1 in advance by a screen printing method or the like. The exposed portion of the wiring conductor 105 is coated with a plating layer made of nickel, copper, gold or the like to prevent oxidative corrosion of the wiring conductor 105 and to bond the bonding wire to the wiring conductor 105 or to solder. Bump wettability is improved.

  The insulating layer 106 is formed over the entire outer periphery of the wiring board region 102. The insulating layer 106 is formed so as to cover one end on the outer edge side (dividing groove 104 side) of the wiring conductor 105. In the multi-piece wiring board 107 of the present invention, the insulating layer 106 is formed so as to cover from the periphery of the dividing groove 104 on the main surface of the mother board 101 to a part of the wiring conductor 105 adjacent to the dividing groove 104. With this configuration, it is possible to reliably secure a distance corresponding to the insulating layer 106 between the dividing groove 104 and the exposed portion of the wiring conductor 105 adjacent to the dividing groove 104, and the wiring board is mounted on the external circuit board. For example, even when the connecting material partially protrudes to the outside, it is effective that an electrical short circuit occurs between the adjacent wiring board via the connecting material such as solder. Is prevented.

  The insulating layer 106 is formed using an electrically insulating material such as an insulating material having the same composition as the mother substrate 101. For example, when the base substrate 101 is made of an aluminum oxide sintered body, an organic solvent, a resin binder or the like is added to a raw material powder such as alumina or glass having the same composition as the ceramic green sheet used as the base substrate 101, and the paste is kneaded. The ceramic paste produced by forming the shape is printed so as to cover a part of the conductor paste that becomes the wiring conductor 105 adjacent to the dividing groove 104 from the portion around the dividing groove 104 on the back surface of the ceramic green sheet. It is formed by doing. In this case, it is desirable to first print the conductor paste to be the wiring conductor 105, then laminate each ceramic green sheet, and then form the divided grooves 104, and finally print the ceramic paste. If the wiring conductor 105 is printed first and the ceramic green sheets are laminated, and then the insulating layer 106 is printed, the ceramic green sheets may be stretched during lamination, which may reduce the alignment accuracy. On the other hand, if the processing is performed in the above-described order, even if the ceramic green sheet is distorted and stretched during lamination, the ceramic paste is printed so as to cover the conductor paste that becomes the wiring conductor 105 in a desired range. be able to.

  The insulating layer 106 is preferably formed so as to cover the wiring conductor 105 in the range of 5 μm to 50 μm from the edge of the dividing groove 104. As a result, when the multi-piece wiring board 107 is divided into individual wiring boards (electronic devices) and then mounted on the external circuit board, problems such as an electrical short circuit between the adjacent wiring boards via the connecting material are further reduced. This can be surely prevented, and the wiring conductor 105 can be easily confirmed from the outside, so that the mounting operation such as alignment with the electric circuit outside the wiring conductor 105 can be performed more reliably and easily. The insulating layer 106 preferably has a thickness in the range of 10 to 35 μm. If the thickness is less than 10 μm, it tends to be difficult to effectively cover the wiring conductor 105. If the thickness exceeds 35 μm, it is difficult to form connection solder on the wiring conductor 105 when the wiring board obtained by dividing the multi-piece wiring board 107 is mounted on the external circuit board via solder or the like. Become.

  In addition, in the multi-piece wiring board 107 of the present invention, the insulating layer 106 is a part of the wiring conductor 105 adjacent to the dividing groove 104 from a part separated from the edge of the dividing groove 104 on the back surface along the dividing groove 104. It is preferable to be formed so as to cover. Thereby, the distance between the division | segmentation groove | channel 104 and the exposed part of the wiring conductor 105 adjacent to the division | segmentation groove | channel 104 can be arrange | equalized with the same distance between each wiring conductor 105, and an individual wiring board (electronic device) An electrical short circuit at the outer side can be prevented more effectively. Further, since the formation width of the insulating layer 106 can be made constant, the insulating layer 106 may be formed in a strip shape regardless of the position where the wiring conductor 105 is formed, and the productivity of the multi-piece wiring board 107 is improved. be able to.

  In addition, the insulating layer 106 may be configured such that the thickness at the peripheral portion is made thinner than the thickness at the central portion to suppress the occurrence of problems such as peeling from the peripheral portion.

(A) is a bottom view showing an example of an embodiment of a multi-cavity wiring board of the present invention, and (b) is a cross-sectional view taken along line XX ′ of the multi-cavity wiring board shown in (a). is there.

Explanation of symbols

101 ... Mother board 102 ... Wiring board area 103 ... Dummy area 104 ... Dividing groove 105 ... Wiring conductor 106 ... Insulating layer 107 ... Multi-cavity wiring board

Claims (4)

A plurality of wiring board regions arranged vertically and horizontally in the center portion and a rectangular mother board in which dummy regions are formed on the outer periphery; a boundary between the wiring board regions; and the wiring board region and the dummy region A dividing groove formed at the boundary of the wiring board, a wiring conductor formed on the outer periphery of the wiring board area so as to extend in a central direction and an outer edge direction of the wiring board area, and the outer side of the wiring conductor. A multi-piece wiring board comprising: an insulating layer formed to cover one end of the edge side. 2. The insulating layer according to claim 1, wherein the insulating layer is formed so as to cover from the part separated from the dividing groove to one end on the outer edge side of the wiring conductor along the dividing groove. Multi-piece wiring board. The wiring board region has a quadrangular shape, the wiring conductor is formed on each side of the wiring board region, and the insulating layer is formed over the entire outer periphery of the wiring board region. The multi-cavity wiring board according to claim 1 or 2. 4. The multi-piece wiring board according to claim 1, wherein the insulating layer has a thickness on the outer edge side thinner than a thickness on the central part side of the wiring board region. 5.

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