JP4189312B2 - Wiring board - Google Patents

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JP4189312B2
JP4189312B2 JP2003426892A JP2003426892A JP4189312B2 JP 4189312 B2 JP4189312 B2 JP 4189312B2 JP 2003426892 A JP2003426892 A JP 2003426892A JP 2003426892 A JP2003426892 A JP 2003426892A JP 4189312 B2 JP4189312 B2 JP 4189312B2
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groove
insulating substrate
insulating
conductor
insulating frame
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JP2005191042A (en
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雅孝 廣森
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Kyocera Corp
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Kyocera Corp
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Description

本発明は、半導体素子や圧電振動子等の電子部品を搭載するための配線基板に関するものであり、特に、上面に電子部品の搭載部を有する絶縁基板の側面に上下方向に溝が形成された配線基板に関するものである。   The present invention relates to a wiring board for mounting an electronic component such as a semiconductor element or a piezoelectric vibrator, and in particular, a groove is formed in a vertical direction on a side surface of an insulating substrate having an electronic component mounting portion on an upper surface. The present invention relates to a wiring board.

従来、半導体素子や圧電振動子等の電子部品が搭載される配線基板は、一般に、酸化アルミニウム質焼結体,ムライト質焼結体,ガラスセラミックス焼結体等の電気絶縁材料から成り、上面に電子部品の搭載部を有する絶縁基板と、絶縁基板の上面の外周部に搭載部を取り囲むようにして取着された四角枠状の絶縁枠体と、搭載部から絶縁基板の側面および下面の少なくとも一方に導出された配線導体とを具備した構造である。   Conventionally, wiring boards on which electronic components such as semiconductor elements and piezoelectric vibrators are mounted are generally made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, a glass ceramic sintered body, and the like on the upper surface. An insulating substrate having an electronic component mounting portion; a rectangular frame-like insulating frame attached to surround the mounting portion on the outer peripheral portion of the upper surface of the insulating substrate; and at least a side surface and a lower surface of the insulating substrate from the mounting portion The wiring conductor is led to one side.

また、通常、絶縁基板の側面から絶縁枠体の外周面にかけて、上下方向に延びるとともに絶縁基板と絶縁枠体との間で連続するようにして横断面形状が台形状の溝が形成されており、絶縁基板の側面の溝の内面には側面導体が形成されている。   Also, a groove having a trapezoidal cross-sectional shape is usually formed so as to extend vertically from the side surface of the insulating substrate to the outer peripheral surface of the insulating frame and to be continuous between the insulating substrate and the insulating frame. A side conductor is formed on the inner surface of the groove on the side surface of the insulating substrate.

側面導体は配線導体のうち絶縁基板の側面や下面に導出された部位等と接することにより配線導体と電気的に接続されており、搭載部に搭載された電子部品の電極を、配線導体に電気的に接続することにより、配線導体と側面導体とを介して電子部品の電極が外部に導出されることになる。   The side conductor is electrically connected to the wiring conductor by contacting the part of the wiring conductor that is led out to the side or lower surface of the insulating substrate, and the electrode of the electronic component mounted on the mounting portion is electrically connected to the wiring conductor. Thus, the electrodes of the electronic component are led out to the outside through the wiring conductor and the side conductor.

つまり、配線基板の搭載部に電子部品を搭載するとともに電子部品の電極をボンディングワイヤや半田等を介して配線導体のうち搭載部に露出した部位に電気的に接続し、絶縁枠体の上面に鉄−ニッケル−コバルト合金等から成る蓋体を接合して搭載部を塞ぐことにより搭載部に電子部品が気密封止されて電子装置として完成し、側面導体の下端部を外部電気回路基板の電気回路に半田等を介して電気的に接続することにより、電子部品の電極が、配線導体および側面導体を介して外部の電気回路と電気的に接続される。   In other words, the electronic component is mounted on the mounting portion of the wiring board, and the electrode of the electronic component is electrically connected to the portion of the wiring conductor exposed to the mounting portion via a bonding wire, solder, etc., on the upper surface of the insulating frame. By joining a lid made of iron-nickel-cobalt alloy or the like and closing the mounting portion, the electronic component is hermetically sealed in the mounting portion to complete the electronic device, and the lower end of the side conductor is electrically connected to the external electric circuit board. By electrically connecting to the circuit via solder or the like, the electrode of the electronic component is electrically connected to an external electric circuit via the wiring conductor and the side conductor.

なお、絶縁枠体の外周面にも溝を形成するのは、その溝の内面に側面導体を延出させて蓋体に側面導体を電気的に接続すること等により接地用としたり、側面導体の露出表面にニッケルや金等の保護めっきを施す場合に、めっき液が溝の内部に入り込みやすくなるようにして、めっき欠け等の不良を防止したりするためである。   The groove is also formed on the outer peripheral surface of the insulating frame body by extending the side conductor to the inner surface of the groove and electrically connecting the side conductor to the lid, etc. This is because, when protective plating such as nickel or gold is applied to the exposed surface, the plating solution is likely to enter the inside of the groove to prevent defects such as lack of plating.

また、外部電気回路基板に配線基板を接続する際に、半田等の接合材が側面導体と外部電気回路基板とに渡り形成され、配線基板の外部電気回路基板への接続をより強固なものとすることができる。   Also, when connecting the wiring board to the external electric circuit board, a bonding material such as solder is formed across the side conductor and the external electric circuit board, and the connection of the wiring board to the external electric circuit board is made stronger. can do.

近時、このような電子部品搭載用の配線基板においては、小型化が強く要求されているため、配線基板の外形寸法を搭載される電子部品の外形寸法に極力近づけることが必要になってきている。そのため、絶縁枠体の幅が例えば0.5mm以下と非常に狭くなってきている。このような幅の狭い絶縁枠体の外周面に大きな溝を設けると、溝が形成されている部位で絶縁枠体の幅が非常に狭くなってしまうので、絶縁枠体と蓋体との接合幅を十分に確保することができず、蓋体を強固に接合することが難しくなり、気密封止の信頼性が低下するという問題が生じる。   Recently, in such wiring boards for mounting electronic components, there is a strong demand for downsizing, and it has become necessary to make the external dimensions of the wiring board as close as possible to the external dimensions of the electronic components to be mounted. Yes. Therefore, the width of the insulating frame has become very narrow, for example, 0.5 mm or less. If a large groove is provided on the outer peripheral surface of such a narrow insulating frame, the width of the insulating frame becomes very narrow at the portion where the groove is formed. A sufficient width cannot be secured, it becomes difficult to firmly join the lid, and there arises a problem that the reliability of hermetic sealing is lowered.

このような問題に対しては、絶縁枠体に形成される断面が台形状の溝の幅の半径を、絶縁基板に形成される断面が台形状の溝の半径よりも小さくし、平面視で絶縁基板の溝の外側に絶縁枠体の溝が位置するようにしておくという手段が考えられる。この場合、溝が形成された部位において絶縁枠体の幅が小さくなることを防止できるので、蓋体の絶縁枠体に対する接合幅を確保することができる。
特開1998−335822号公報
To solve this problem, the cross section formed on the insulating frame has a trapezoidal groove whose width radius is smaller than the radius of the trapezoidal groove formed on the insulating substrate. A means is conceivable in which the groove of the insulating frame is positioned outside the groove of the insulating substrate. In this case, since the width of the insulating frame can be prevented from being reduced at the site where the groove is formed, the bonding width of the lid to the insulating frame can be ensured.
JP 1998-335822 A

しかしながら、絶縁枠体に形成される溝の幅の半径を、絶縁基板に形成される溝の半径よりも小さくし、平面視で絶縁基板の溝の外側に絶縁枠体の溝が位置するようにした場合、蓋体と絶縁枠体との接合面積を確保することはできるものの、絶縁基板の側面の溝と絶縁枠体の外周面の溝との間に大きな段差が生じ、この段差の上側部分が比較的薄い絶縁枠体のみで形成されること、絶縁枠体の下面が絶縁基板の溝の上端部と接している部位に沿って、蓋体を絶縁枠体に接合するときの熱応力等の応力が集中しやすいこと等から、絶縁枠体に、特に応力が大きく作用する絶縁基板の溝の上端の両端部との接触部位付近からクラック等が生じ、気密封止の信頼性が大きく低下するという問題が発生してしまう。   However, the radius of the groove formed in the insulating frame is made smaller than the radius of the groove formed in the insulating substrate so that the groove of the insulating frame is positioned outside the groove of the insulating substrate in plan view. In this case, although a bonding area between the lid and the insulating frame can be secured, a large step is generated between the groove on the side surface of the insulating substrate and the groove on the outer peripheral surface of the insulating frame, and the upper portion of the step. Is formed of only a relatively thin insulating frame, thermal stress when the lid is joined to the insulating frame along the portion where the lower surface of the insulating frame is in contact with the upper end of the groove of the insulating substrate, etc. The stress on the insulation frame body is likely to concentrate, and cracks, etc. are generated in the insulating frame body from the vicinity of the contact area between the upper ends of the groove of the insulating substrate, where the stress is particularly large, and the reliability of hermetic sealing is greatly reduced. Problem occurs.

本発明は、上記問題点を解決すべく完成されたものであり、その目的は、絶縁枠体と蓋体との接合面積を確保するとともに、絶縁枠体にクラック等の機械的な破壊が生じることを効果的に防止した、気密封止の信頼性に優れる小型の配線基板を提供することにある。   The present invention has been completed to solve the above-described problems, and its purpose is to secure a bonding area between the insulating frame and the lid and to cause mechanical damage such as cracks in the insulating frame. It is an object of the present invention to provide a small-sized wiring board that effectively prevents this problem and has excellent hermetic sealing reliability.

本発明の配線基板は、上面に電子部品の搭載部を有する四角形状の絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を取り囲むようにして取着された四角枠状の絶縁枠体と、前記搭載部から前記絶縁基板の側面および下面の少なくとも一方に導出された配線導体と、前記絶縁枠体の外周面に上下方向に延びるように形成された横断面形状が台形状の第1の溝と、前記絶縁基板の側面に上下方向に延びるとともに前記第1の溝に連続するように形成された横断面形状が台形状の第2の溝と、該第2の溝の内面に被着されて前記配線導体に電気的に接続された側面導体とを具備しており、前記第1および第2の溝は幅が同じであり、前記第1の溝の前記絶縁基板の側面からの深さが前記第2の溝よりも浅いことを特徴とするものである。   The wiring board of the present invention includes a rectangular insulating substrate having an electronic component mounting portion on the upper surface, and a rectangular frame-shaped insulating frame attached to the outer peripheral portion of the upper surface of the insulating substrate so as to surround the mounting portion. And a wiring conductor led out from the mounting portion to at least one of a side surface and a lower surface of the insulating substrate, and a cross-sectional shape formed on the outer peripheral surface of the insulating frame so as to extend in the vertical direction has a trapezoidal shape. And a second groove having a trapezoidal cross-sectional shape extending in the vertical direction on the side surface of the insulating substrate and continuing to the first groove, and an inner surface of the second groove. A side conductor that is deposited and electrically connected to the wiring conductor, and the first and second grooves have the same width, and the first groove has a side face that is parallel to the insulating substrate. Is shallower than the second groove.

本発明の配線基板によれば、絶縁基板に形成された第2の溝および絶縁枠体に形成された第1の溝は、幅が同じであり、第1の溝の絶縁基板の側面からの深さが第2の溝よりも浅いことから、絶縁基板の側面の第2の溝と、絶縁枠体の外周面の第1の溝との間に若干の段差は生じるものの、この段差は絶縁枠体の幅に比べて小さく、また、応力が大きく作用する溝の上端の両端部に近づくにつれて漸次第1および第2の溝の幅が小さくなるため、段差の上側部分における絶縁枠体の機械的強度の低下を防止し、また、絶縁枠体の下面と絶縁基板の第2の溝の上端部とが接している部位に沿って応力が集中することを防止することができ、絶縁枠体にクラック等が生じることを防ぐことができる。   According to the wiring board of the present invention, the second groove formed in the insulating substrate and the first groove formed in the insulating frame have the same width, and the first groove extends from the side surface of the insulating substrate. Since the depth is shallower than that of the second groove, there is a slight step between the second groove on the side surface of the insulating substrate and the first groove on the outer peripheral surface of the insulating frame. Since the widths of the first and second grooves are gradually reduced as they approach the both ends of the upper end of the groove where the stress is large and the stress is large, the machine of the insulating frame in the upper part of the step The strength of the insulating frame can be prevented from decreasing, and stress can be prevented from concentrating along the portion where the lower surface of the insulating frame is in contact with the upper end of the second groove of the insulating substrate. It is possible to prevent cracks and the like from occurring.

また、第1の溝の絶縁基板の側面からの深さが第2の溝よりも浅いことから、第1の溝が形成されている部位で絶縁枠体の幅が狭くなることを防止し、絶縁枠体と蓋体との接合幅を十分に確保することができる。   Further, since the depth of the first groove from the side surface of the insulating substrate is shallower than the second groove, the width of the insulating frame is prevented from being narrowed at the portion where the first groove is formed, A sufficient bonding width between the insulating frame and the lid can be ensured.

本発明の配線基板を添付図面に基づき詳細に説明する。図1および図2は、本発明の配線基板の実施の形態の一例を示す上面図および側面図である。図1および図2において、1は絶縁基板、2は絶縁枠体、3は配線導体、4は第1の溝、5は第2の溝、3aは側面導体である。これらの絶縁基板1,絶縁枠体2,配線導体3,側面導体3a,第1の溝4,第2の溝5により主に配線基板9が構成されている。   The wiring board of the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are a top view and a side view showing an example of an embodiment of a wiring board according to the present invention. 1 and 2, 1 is an insulating substrate, 2 is an insulating frame, 3 is a wiring conductor, 4 is a first groove, 5 is a second groove, and 3a is a side conductor. A wiring substrate 9 is mainly constituted by the insulating substrate 1, the insulating frame 2, the wiring conductor 3, the side conductor 3a, the first groove 4, and the second groove 5.

絶縁基板1は半導体素子や容量素子等の電子部品を搭載し支持するための支持体として機能し、上面に電子部品の搭載部1aを有している。絶縁基板1は、例えば酸化アルミニウム質焼結体やムライト質焼結体,窒化アルミニウム質焼結体,炭化珪素質焼結体等のセラミック絶縁材料やガラスセラミックス焼結体、または絶縁性樹脂、あるいは絶縁性樹脂とセラミックス等の無機絶縁体粉末との混合物等から成る。絶縁基板1が酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダや可塑剤、溶剤等を添加混合して泥漿物を作り、その泥漿物からドクターブレード法やカレンダーロール法によってセラミックグリーンシート(生シートで、以下、グリーンシートともいう)と成し、しかる後、絶縁基体1となるグリーンシートに適当な打ち抜き加工を施すとともにこれらを積層し、約1600℃の温度で焼成することによって作製される。   The insulating substrate 1 functions as a support for mounting and supporting electronic components such as semiconductor elements and capacitive elements, and has an electronic component mounting portion 1a on the upper surface. The insulating substrate 1 is made of, for example, a ceramic insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, an insulating resin, or It consists of a mixture of an insulating resin and an inorganic insulator powder such as ceramics. When the insulating substrate 1 is made of an aluminum oxide sintered body, a suitable organic binder, plasticizer, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to make a slurry. The slurry is formed into a ceramic green sheet (raw sheet, hereinafter also referred to as a green sheet) by a doctor blade method or a calender roll method, and then the green sheet to be the insulating substrate 1 is appropriately punched and processed. Are laminated and fired at a temperature of about 1600 ° C.

絶縁基板1の上面には搭載部1aを取り囲むようにして絶縁枠体2が取着されている。絶縁枠体2は、絶縁基板1と同様の電気絶縁性の材料により形成され、生産性や絶縁基板1に対する取着の強度等を考慮すると、絶縁基板1と同じ材料で形成することが好ましい。絶縁枠体2は、例えば、酸化アルミニウム質焼結体から成る場合、上記絶縁基板1を作製するのと同様のグリーンシートを形成した後、枠状に打ち抜き加工を施して枠状のグリーンシートを形成し、この枠状のグリーンシートを絶縁基板1となるグリーンシートの上面に積層すること等により形成される。   An insulating frame 2 is attached to the upper surface of the insulating substrate 1 so as to surround the mounting portion 1a. The insulating frame 2 is formed of the same electrically insulating material as that of the insulating substrate 1 and is preferably formed of the same material as the insulating substrate 1 in consideration of productivity, the strength of attachment to the insulating substrate 1, and the like. When the insulating frame 2 is made of, for example, an aluminum oxide sintered body, after forming a green sheet similar to that for manufacturing the insulating substrate 1, the frame-shaped green sheet is punched into a frame shape. The frame-like green sheet is formed and laminated on the upper surface of the green sheet to be the insulating substrate 1.

絶縁基板1の搭載部1aから絶縁基板1の側面および下面の少なくとも一方に配線導体3が導出されている。この配線導体3は、絶縁基板1が酸化アルミニウム質焼結体等のセラミックスから成る場合はメタライズ層から成り、また、絶縁基板1が樹脂や樹脂と無機絶縁材料粉末とから成る場合は金属ペーストの焼結体から成り、電子部品が搭載される搭載部1aの周辺から絶縁基板1の側面にかけて複数の配線導体4が被着形成されて、あるいはビア導体等の貫通導体として形成されて導出される。   A wiring conductor 3 is led out from the mounting portion 1 a of the insulating substrate 1 to at least one of the side surface and the lower surface of the insulating substrate 1. The wiring conductor 3 is made of a metallized layer when the insulating substrate 1 is made of ceramics such as an aluminum oxide sintered body, and is made of a metal paste when the insulating substrate 1 is made of resin, resin and inorganic insulating material powder. A plurality of wiring conductors 4 are formed from the periphery of the mounting portion 1a on which the electronic component is mounted to the side surface of the insulating substrate 1, or are formed as through conductors such as via conductors and are led out. .

配線導体3の材料としては金,銅,モリブデン,タングステン,マンガン,白金,パラジウム,ロジウムやこれらの合金等を用いることができ、例えば、タングステンの粉末に適当な有機バインダや可塑剤、溶剤等を添加混合して得た金属ペーストを、絶縁基体1となるグリーンシートの表面または側面等に、スクリーン印刷法等により所定パターンに印刷塗布しておくことにより、焼成後に絶縁基体1の所定位置に所定パターンの配線導体3が形成される。   As the material of the wiring conductor 3, gold, copper, molybdenum, tungsten, manganese, platinum, palladium, rhodium, alloys thereof, and the like can be used. The metal paste obtained by addition and mixing is printed and applied in a predetermined pattern on the surface or side surface of the green sheet to be the insulating substrate 1 by a screen printing method or the like, so that it is predetermined at a predetermined position on the insulating substrate 1 after firing. A patterned wiring conductor 3 is formed.

また、本発明の配線基板において、絶縁枠体2の外周面に上下方向に延びるように横断面形状が台形状の第1の溝4が形成され、絶縁基板1の側面に上下方向に延びるとともに第1の溝4に連続するように横断面形状が台形状の第2の溝5が形成されており、第2の溝5の内面には配線導体3に電気的に接続された側面導体3aが被着されている。   In the wiring board of the present invention, a first groove 4 having a trapezoidal cross section is formed on the outer peripheral surface of the insulating frame 2 so as to extend in the vertical direction, and extends in the vertical direction on the side surface of the insulating substrate 1. A second groove 5 having a trapezoidal cross-sectional shape is formed so as to be continuous with the first groove 4, and a side conductor 3 a electrically connected to the wiring conductor 3 on the inner surface of the second groove 5. Is attached.

なお、第1の溝4および第2の溝5は、台形状の下底(長い方の底辺)が外側に位置し、上底(短いほうの底辺)が内側に位置するように形成される。この場合、第1の溝4および第2の溝5の横断面形状は、完全な台形状に限らず、角部分を円弧状に成形した、楕円弧状に近いような形状でもよい。   The first groove 4 and the second groove 5 are formed such that the lower base (longer base) of the trapezoid is located outside and the upper base (shorter base) is located inside. . In this case, the cross-sectional shape of the first groove 4 and the second groove 5 is not limited to a complete trapezoidal shape, and may be a shape close to an elliptical arc shape with a corner portion formed into an arc shape.

側面導体3aは、配線導体4と同様の金属材料から成り、例えば、配線導体3を形成するのと同様の金属ペーストを、絶縁基体1となるグリーンシートの側面に予め上下方向に延びるようにして設けておいた第2の溝5の内面に印刷することにより形成される。側面導体3aは、例えば、配線導体3のうち絶縁基板1の側面や下面に導出された部位等と接することにより配線導体3と電気的に接続されており、搭載部1aに搭載された電子部品(図示せず)の電極を、配線導体3に電気的に接続することにより、配線導体3と側面導体3aとを介して電子部品の電極が外部に導出されることになる。   The side conductor 3a is made of the same metal material as that of the wiring conductor 4. For example, a metal paste similar to that for forming the wiring conductor 3 is previously extended in the vertical direction on the side surface of the green sheet to be the insulating base 1. It is formed by printing on the inner surface of the second groove 5 provided. For example, the side conductor 3a is electrically connected to the wiring conductor 3 by contacting a portion of the wiring conductor 3 that is led out to the side surface or the lower surface of the insulating substrate 1, and the electronic component mounted on the mounting portion 1a. By electrically connecting the electrode (not shown) to the wiring conductor 3, the electrode of the electronic component is led out to the outside through the wiring conductor 3 and the side conductor 3a.

つまり、配線基板9の搭載部1aに電子部品(図示せず)を搭載するとともに、電子部品の電極をボンディングワイヤや半田等を介して配線導体3のうち搭載部1aに露出した部位に電気的に接続し、絶縁枠体2の上面に蓋体(図示せず)を接合して搭載部1aを塞ぐことにより、搭載部1aに電子部品が気密封止されて電子装置として完成し、側面導体3aの下端部分を外部電気回路基板の電気回路(図示せず)に半田等の接合材を介して電気的に接続することにより、電子部品の電極が配線導体3および側面導体3aを介して外部の電気回路と電気的に接続される。この場合、半田等の接合材が側面導体3aと外部電気回路基板の電気回路とに渡り形成され、配線基板9の外部電気回路基板への接続をより強固なものとすることができる。   In other words, an electronic component (not shown) is mounted on the mounting portion 1a of the wiring board 9, and the electrode of the electronic component is electrically connected to a portion of the wiring conductor 3 exposed to the mounting portion 1a via a bonding wire, solder, or the like. And a lid (not shown) is joined to the upper surface of the insulating frame 2 to close the mounting portion 1a, whereby an electronic component is hermetically sealed in the mounting portion 1a to complete the electronic device. By electrically connecting the lower end portion of 3a to an electric circuit (not shown) of an external electric circuit board via a bonding material such as solder, the electrode of the electronic component is externally connected via the wiring conductor 3 and the side conductor 3a. It is electrically connected to the electrical circuit. In this case, a bonding material such as solder is formed over the side conductor 3a and the electric circuit of the external electric circuit board, and the connection of the wiring board 9 to the external electric circuit board can be made stronger.

側面導体3aの半田等の接合材との接合面積を確保するうえで、第2の溝5はその半径を300μm以上とすることが好ましい。また、接合材の広がり過ぎを防いで接合材に一定のメニスカスを形成して接合強度を確保するために、第2の溝5の半径は300μm乃至600μmとすることがより一層好ましい。   In order to secure a bonding area between the side conductor 3a and a bonding material such as solder, the radius of the second groove 5 is preferably set to 300 μm or more. Further, in order to prevent the bonding material from spreading too much and form a certain meniscus in the bonding material to ensure the bonding strength, the radius of the second groove 5 is more preferably set to 300 μm to 600 μm.

なお、絶縁枠体1の外周面にも第1の溝4を形成するのは、その内面に側面導体3aを延出させて蓋体に側面導体3aを電気的に接続すること等により接地用としたり、側面導体3aの露出表面にニッケルや金等の保護めっきを施す場合に、めっき液が第1の溝4の内部に入り込みやすくなるようにして、めっき欠け等の不良を防止したりするためである。   The first groove 4 is also formed on the outer peripheral surface of the insulating frame 1 for grounding by extending the side conductor 3a on the inner surface and electrically connecting the side conductor 3a to the lid. In the case where protective plating such as nickel or gold is applied to the exposed surface of the side conductor 3a, the plating solution can easily enter the first groove 4 to prevent defects such as lack of plating. Because.

配線導体3や側面導体3aの露出表面にニッケルや金等のめっき層を被着させておくと、配線導体3に対するボンディングワイヤのボンディング性や、側面導体3aを外部の電気回路に接続するための半田の濡れ性等を向上させることができる。   If a plating layer such as nickel or gold is applied to the exposed surface of the wiring conductor 3 or the side conductor 3a, the bonding property of the bonding wire to the wiring conductor 3 or the connection of the side conductor 3a to an external electric circuit is achieved. Solder wettability and the like can be improved.

また、本発明の配線基板において、第1および第2の溝4,5は幅が同じであり、第1の溝4の絶縁基板2の側面からの深さが第2の溝5よりも浅い。これにより、第2の溝5と第1の溝4との間に若干の段差は生じるものの、この段差は絶縁枠体2の幅に比べて小さく、また、応力が大きく作用する第1の溝4の両端部に近づくにつれて漸次第1および第2の溝4,5の間の段差が小さくなるため、段差の上側部分における絶縁枠体2の機械的強度の低下を防止し、また、絶縁枠体2の下面と第2の溝5の上端部とが接している部位に沿って応力が集中することを防止することができ、絶縁枠体2にクラック等が生じることを防いで気密封止の信頼性を優れたものとすることができる。   In the wiring board of the present invention, the first and second grooves 4 and 5 have the same width, and the depth of the first groove 4 from the side surface of the insulating substrate 2 is shallower than that of the second groove 5. . As a result, although a slight step is generated between the second groove 5 and the first groove 4, the step is smaller than the width of the insulating frame 2, and the first groove on which a large amount of stress acts. 4, the step between the first and second grooves 4 and 5 gradually decreases as the distance between the two ends increases, so that the mechanical strength of the insulating frame 2 at the upper portion of the step is prevented from being lowered. It is possible to prevent stress from being concentrated along the portion where the lower surface of the body 2 and the upper end portion of the second groove 5 are in contact with each other, and prevent the occurrence of cracks in the insulating frame 2 and hermetic sealing. The reliability can be made excellent.

また、第1の溝4は絶縁枠体2の外周面からの深さが浅いので、溝4が形成された部位においても絶縁枠体2の幅を十分に確保し、絶縁枠体2と蓋体とを強固に接合することができる。   Further, since the depth of the first groove 4 from the outer peripheral surface of the insulating frame 2 is shallow, a sufficient width of the insulating frame 2 is secured even in the portion where the groove 4 is formed, and the insulating frame 2 and the lid The body can be firmly joined.

その結果、絶縁枠体2と蓋体との接合面積を確保するとともに、絶縁枠体2にクラック等の機械的な破壊が生じることを効果的に防止した、気密封止の信頼性に優れるとともに小型の配線基板9を提供することができる。   As a result, the bonding area between the insulating frame 2 and the lid is ensured, and the insulating frame 2 is effectively prevented from being mechanically broken such as cracks. A small wiring board 9 can be provided.

第1の溝4および第2の溝5は、例えば、配線基板領域がセラミック母基板に多数個縦横に配列形成されて成る、いわゆる多数個取りの形態で配線基板を製作するものとし、配線基板領域の境界に沿って横断面が円形状の貫通孔を形成し、その後、配線基板領域の境界に沿ってセラミック母基板を分割することにより形成される。分割された円形状の貫通孔が各配線基板9の側面に形成された断面が台形状の第2の溝5になる。   The first groove 4 and the second groove 5 are formed, for example, in a so-called multi-chip form in which a large number of wiring board regions are arranged in a matrix on a ceramic mother board. A through hole having a circular cross section is formed along the boundary of the region, and then the ceramic mother substrate is divided along the boundary of the wiring substrate region. A cross section in which the divided circular through-holes are formed on the side surface of each wiring board 9 is the trapezoidal second groove 5.

また、このときの貫通孔の半径および打ち抜き位置を、グリーンシートを積層したときに上下に連続する、第1の溝4となる貫通孔および第2の溝5となる貫通孔について、上記境界における幅を同じとし、第1の溝4となる貫通孔の上記境界からのグリーンシート主面方向での深さを、第2の溝となる貫通孔の深さよりも浅くしておく。   Further, the radius and the punching position of the through hole at this time are as follows at the above boundary for the through hole to be the first groove 4 and the through hole to be the second groove 5 that are continuous up and down when the green sheets are laminated. The width is the same, and the depth in the green sheet main surface direction from the boundary of the through hole serving as the first groove 4 is set smaller than the depth of the through hole serving as the second groove.

なお、第1の溝4の内面に側面導体3aを延出させる場合、配線導体3が接地用のものであれば、絶縁枠体2の上面にまで達するように延出させるとともに、絶縁枠体2の上面にもメタライズ層等の金属層を形成しておくことが好ましい。その場合、電子部品の接地をより一層確実に行わせることができる。   When the side conductor 3a is extended to the inner surface of the first groove 4, if the wiring conductor 3 is for grounding, the side conductor 3a is extended to reach the upper surface of the insulating frame 2, and the insulating frame It is preferable to form a metal layer such as a metallized layer on the upper surface of 2. In that case, the grounding of the electronic component can be more reliably performed.

また、第1の溝4の深さは200μm以下であることが好ましい。深さが200μmを超えると、絶縁枠体2の上面の蓋体との接合幅を確保することが難しくなり、気密封止の信頼性が劣化するおそれがある。   Moreover, it is preferable that the depth of the 1st groove | channel 4 is 200 micrometers or less. When the depth exceeds 200 μm, it becomes difficult to ensure a bonding width with the lid on the upper surface of the insulating frame 2, and the reliability of hermetic sealing may be deteriorated.

また、第1の溝4は、上端から下端にかけて幅および深さの少なくとも一方が漸次大きくなるような形状として、上述したようなめっき液の入り込みやすさ等を確保するとともに、絶縁枠体2における上端部の占有面積を小さくするようにして、蓋体の接合幅をより有効に確保し、気密封止の信頼性をより一層高くするようにしてもよい。   Further, the first groove 4 has a shape in which at least one of the width and the depth is gradually increased from the upper end to the lower end to ensure the ease of entering the plating solution as described above and the like in the insulating frame 2. The area occupied by the upper end portion may be reduced so that the joining width of the lid body is more effectively secured and the reliability of the hermetic sealing is further increased.

なお、本発明は以上の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更、改良を施すことは何ら差し支えない。例えば、絶縁基板1の側面の第2の溝5について、その内面の一部に凸部や凹部を設けておいて、側面導体3aに対する接合面積をより大きく確保し、配線基板9の外部電気回路基板に対する接続の信頼性をより良好とするようにしてもよい。   Note that the present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention. For example, the second groove 5 on the side surface of the insulating substrate 1 is provided with a convex portion or a concave portion on a part of its inner surface to ensure a larger bonding area with respect to the side conductor 3a, so You may make it make the reliability of the connection with respect to a board | substrate more favorable.

本発明の配線基板の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the wiring board of this invention. 本発明の配線基板の実施の形態の一例を示す側面図である。It is a side view which shows an example of embodiment of the wiring board of this invention.

符号の説明Explanation of symbols

1・・・絶縁基体
1a・・・搭載部
2・・・絶縁枠体
3・・・配線導体
3a・・・側面導体
4・・・第1の溝
5・・・第2の溝
9・・・配線基板
DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Mounting part 2 ... Insulation frame 3 ... Wiring conductor 3a ... Side conductor 4 ... 1st groove | channel 5 ... 2nd groove | channel 9 ...・ Wiring board

Claims (1)

上面に電子部品の搭載部を有する四角形状の絶縁基板と、該絶縁基板の上面の外周部に前記搭載部を取り囲むようにして取着された四角枠状の絶縁枠体と、前記搭載部から前記絶縁基板の側面および下面の少なくとも一方に導出された配線導体と、前記絶縁枠体の外周面に上下方向に延びるように形成された横断面形状が台形状の第1の溝と、前記絶縁基板の側面に上下方向に延びるとともに前記第1の溝に連続するように形成された横断面形状が台形状の第2の溝と、該第2の溝の内面に被着されて前記配線導体に電気的に接続された側面導体とを具備しており、前記第1および第2の溝は幅が同じであり、前記第1の溝の前記絶縁基板の側面からの深さが前記第2の溝よりも浅いことを特徴とする配線基板。 A rectangular insulating substrate having an electronic component mounting portion on the upper surface, a rectangular frame-shaped insulating frame attached to the outer peripheral portion of the upper surface of the insulating substrate so as to surround the mounting portion, and the mounting portion A wiring conductor led out to at least one of a side surface and a lower surface of the insulating substrate; a first groove having a trapezoidal cross-sectional shape formed on the outer peripheral surface of the insulating frame so as to extend vertically; The wiring conductor is attached to the inner surface of the second groove having a trapezoidal cross-sectional shape formed so as to extend in the vertical direction on the side surface of the substrate and to be continuous with the first groove. And the first and second grooves have the same width, and the depth of the first groove from the side surface of the insulating substrate is the second conductor. A wiring board characterized in that it is shallower than the groove.
JP2003426892A 2003-12-24 2003-12-24 Wiring board Expired - Fee Related JP4189312B2 (en)

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