JP6813379B2 - Detection element mounting board, detection device and detection module - Google Patents

Description

The present invention relates to a substrate for mounting a detection element, a detection device, and a detection module.

Conventionally, a detection element mounting substrate and a detection device in which an X-ray detection element is mounted on the main surface of an insulating substrate are known (see, for example, Patent Document 1).

In such a substrate for mounting a detection element, it is known that a plurality of vias for attenuating X-rays are arranged inside the insulating substrate.

Japanese Patent Application Laid-Open No. 2009-032936

However, there is a demand for higher accuracy of the detection device. In such a case, it is necessary to arrange more vias in the substrate for mounting the detection element, and a plurality of vias are arranged unevenly and densely on one main surface side of the insulating substrate. Then, there is a concern that the insulating substrate may be deformed during production or cracks may easily occur in the insulating substrate. Therefore, there is a concern that it will be difficult to detect X-rays well.

According to one aspect of the present invention, the detection element mounting substrate includes a first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, and the first main surface. The second main surface facing the surface, the second mounting portion on which the electronic element is mounted on the second main surface, the wiring conductor provided inside, and the connection conductor connected to the wiring conductor form a group. It contains a plurality of vias and has a rectangular insulating substrate in a plan view, and the wiring conductor and the connecting conductor are electrically connected to a detection element or an electronic element, and the thickness of the insulating substrate. In the direction, the plurality of vias are not connected to the wiring conductor and are provided between the first main surface or the second main surface and the wiring conductor.

According to one aspect of the present invention, the detection device includes a detection element mounting substrate having the above configuration, a detection element mounted on the first mounting portion, and an electronic element mounted on the second mounting portion. Have.

According to one aspect of the present invention, the detection module has a module substrate having a connection pad and a detection device having the above configuration connected to the connection pad via solder.

Detecting device mounting board according to one aspect of the present invention, the upper Symbol structure in the thickness direction of the insulating substrate, so that by arranging the wiring conductor so as to face to a plurality of vias, the bias of the plurality of vias In addition, it is possible to reduce the bias of stress due to density, and it is possible to prevent the insulating substrate from being deformed or cracked easily due to stress due to heat shrinkage during firing, for example, when manufacturing a substrate for mounting a detection element. X-rays can be detected well.

Detection device according to one aspect of the present invention, comprises a detection device mounting board having the above structure, the detection element mounted on the first mounting portion, and an electronic device mounted on the second mounting part by there can be provided with excellent reliability.

Detection module according to one embodiment of the present invention includes: a module substrate having a connection pad, by having a detection device connected to the structure via a solder connection pads, and is excellent in reliability can do.

(A) is a top perspective view showing the detection device according to the first embodiment of the present invention, and (b) is a bottom perspective view of (a). (A) is an internal top view of the detection device shown in FIG. 1 (a), and (b) is an enlarged internal top view of a main part in part B of (a). (A) is a vertical cross-sectional view taken along the line AA of the detection device shown in FIG. 1 (a), and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). It is a main part enlarged vertical sectional view which shows the other example of the detection apparatus in 1st Embodiment of this invention. (A) is a vertical cross-sectional view of another example of the detection device according to the first embodiment of the present invention, and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). (A) is a top perspective view showing the detection device according to the second embodiment of the present invention, and (b) is a bottom perspective view of (a). (A) is a first internal top view of the detection device shown in FIG. 6 (a), and (b) is a second internal top view. FIG. 7 (a) is an enlarged internal top perspective view of a main part in part B of FIG. 7 (a). (A) is an enlarged vertical cross-sectional view of a main part of the detection device shown in FIG. 8 along the AA line, and (b) is an enlarged vertical cross-sectional view of the main part of the detection device shown in FIG. 8 on the DD line. is there. (A) is an internal top perspective view of the detection device according to the third embodiment of the present invention, and (b) is an enlarged internal top perspective view of a main part in part B of (a). FIG. 5 is an internal top perspective view showing another example of the detection device according to the third embodiment of the present invention. FIG. 5 is an enlarged internal top perspective view of a main part of the detection device according to the fourth embodiment of the present invention. (A) is a vertical cross-sectional perspective view of the detection device shown in FIG. 12 along the line AA, and (b) is a vertical cross-sectional view taken along the line DD. (A) is an enlarged vertical cross-sectional perspective view of a main part in another example of the detection device in the fourth embodiment, and (b) is an enlarged vertical section of a main part in another example of the detection device in the fourth embodiment. It is a top view. (A) is an enlarged vertical cross-sectional perspective view of a main part in another example of the detection device in the fourth embodiment, and (b) is an enlarged vertical section of a main part in another example of the detection device in the fourth embodiment. It is a top view.

Some exemplary embodiments of the invention will be described with reference to the accompanying drawings.

(First Embodiment)
As shown in FIGS. 1 to 3, the detection device according to the first embodiment of the present invention includes a detection element mounting substrate 1 and a detection element 2 mounted on the first main surface 11a of the detection element mounting substrate 1. And the electronic element 3 mounted on the second main surface 11b of the detection element mounting substrate 1. The detection device is connected using solder, for example, on the module substrate constituting the detection module.

The detection element mounting substrate 1 in the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. A second main surface 11b, a second mounting portion 13 for mounting an electronic element 3 on the second main surface 11b, a wiring conductor 14 provided inside the insulating substrate 11, and a plurality of vias 15 forming a group 15G. The insulating substrate 11 has a rectangular shape in a plan view. The plurality of vias 15 are arranged unevenly on either the first main surface 11a or the second main surface 11b side in the thickness direction of the insulating substrate 11. It is provided between the first main surface 11a or the second main surface 11b and the wiring conductor 14. The detection element mounting substrate 1 has a connection conductor 16 provided inside the insulating substrate 11 and a wiring pattern 17 provided on the surface of the insulating substrate 11. In FIGS. 1 to 3, the detection element mounting substrate 1 and the detection device are mounted on the xy plane in the virtual xyz space. In FIGS. 1 to 3, the upward direction means the positive direction of the virtual z-axis. It should be noted that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the detection element mounting substrate 1 and the like are actually used. Further, the thickness direction of the insulating substrate 11 means the direction of the z-axis in FIGS. 1 to 3.

The insulating substrate 11 has a first main surface 11a (upper surface in FIGS. 1 to 3), a second main surface 11b (lower surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers 11c, and has a rectangular plate-like shape when viewed in a plan view, that is, in a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the detection element 2 and the electronic element 3, and the detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a and the second mounting of the second main surface 11b. The electronic element 3 is adhered and fixed on the portion 13 via a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like).

For the insulating substrate 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride material sintered body, a silicon nitride material sintered body, a mulite material sintered body, or a glass ceramics sintered body may be used. it can. If the insulating substrate 11 is, for example, an aluminum oxide sintered body, it is a raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO) and the like. An appropriate organic binder, solvent, etc. are added and mixed to prepare a muddy syrup. A ceramic green sheet is produced by molding this slurry into a sheet shape by using a conventionally known doctor blade method, calendar roll method, or the like. Next, the insulating substrate 11 is formed by subjecting the ceramic green sheet to an appropriate punching process, laminating a plurality of ceramic green sheets to form a product, and firing the product at a high temperature (about 1600 ° C.). It will be manufactured.

A first mounting portion 12 for mounting the detection element 2 is provided on the first main surface 11a of the insulating substrate 11, and a second mounting portion 13 for mounting the electronic element 3 on the second main surface 11b of the insulating substrate 11. Is provided. A wiring pattern 17 for electrically connecting to the detection element 2 is provided on the first main surface 11a of the insulating substrate 11. A wiring pattern 17 for electrically connecting to the electronic element 3 is provided on the second main surface 11b of the insulating substrate 11.

The wiring conductor 14 and the connecting conductor 16 are provided inside the insulating substrate 11 and are electrically connected to each other. Further, the wiring conductor 14 and the connecting conductor 16 are electrically connected to the wiring pattern 17. The wiring conductor 14, the connecting conductor 16, and the wiring pattern 17 are for electrically connecting the detection element 2 and the electronic element 3 mounted on the detection element mounting substrate 1 to the module substrate. The wiring conductor 14 electrically connects the wiring conductor 14 provided inside the insulating substrate 11 and the wiring conductors 14 located above and below the insulating layer 11c constituting the insulating substrate 11 or a wiring pattern. Includes a through conductor that electrically connects to 17. In the example shown in FIGS. 1 to 3, the connecting conductor 16 penetrates the plurality of insulating layers 11c of the insulating substrate 11 from the central portion in the thickness direction of the insulating substrate 11 to the second main surface 11b.

The wiring conductor 14, the connecting conductor 16, and the wiring pattern 17 are metal powder metallized containing, for example, tungsten (W), molybdenum (Mo), manganese (Mn), or the like as main components. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing an appropriate organic binder and a solvent to a refractory metal powder such as W, Mo or Mn is insulated. A predetermined pattern is printed and applied to the ceramic green sheet for the substrate 11 in advance by a screen printing method, and the ceramic green sheet for the insulating substrate 11 is fired at the same time to be adhered and formed at a predetermined position on the insulating substrate 11. For the wiring conductor 14 and the wiring pattern 17, for example, a metallized paste for the wiring conductor 14 or the wiring pattern 17 is printed and applied to a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method, and the wiring conductor 14 and the wiring pattern 17 are used for the insulating substrate 11. It is formed by firing together with the ceramic green sheet of. Further, when the wiring conductor 14 is a through conductor, or the connection conductor 16 is a through hole for a through conductor by a processing method such as punching or laser processing on a ceramic green sheet for an insulating substrate 11 by a mold or punching. Is formed, and the through hole is filled with a metallized paste for a through conductor or a connecting conductor 16 by the above printing means and fired together with a ceramic green sheet for an insulating substrate 11. The metallized paste is prepared by adding an appropriate solvent and a binder to the above-mentioned metal powder and kneading the paste to adjust the viscosity to an appropriate level. In addition, in order to increase the bonding strength with the insulating substrate 11, glass powder and ceramic powder may be contained.

A plurality of vias 15 are provided inside the insulating substrate 11 in the thickness direction of the insulating substrate 11 (z direction in FIG. 1). The plurality of vias 15 are provided between the first main surface 11a or the second main surface 11b and the wiring conductor 14 in the thickness direction of the insulating substrate 11. In the example shown in FIG. 2, the plurality of vias 15 are provided on the fourth insulating layer 11c from the first main surface 11a side, and are provided between the second main surface 11b and the wiring conductor 14. ..

The via 15 blocks the X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1, passes through the second main surface 11b side of the insulating substrate 11, and is irradiated to the electronic element 3. It suppresses the problem. A material mainly made of tungsten or molybdenum is preferably used for the via 15, and the via 15 is formed by the same method as the through conductor of the wiring conductor 14 described above. In the example shown in FIGS. 1 to 3, the via 15 is provided unevenly on the insulating layer 11c on the second main surface 11b side of the insulating substrate 11 among the plurality of laminated insulating layers 11c constituting the insulating substrate 11. Has been done. The via 15 has a circular shape in a plan view. In the detection element mounting substrate 1 of the first embodiment, the via 15 is cylindrical.

The detection element mounting substrate 1 has a plurality of vias 15 inside the insulating substrate 11, and the plurality of vias 15 form a group 15G. Group 15G has a grid portion that is grid-like. Here, the fact that the group 15G has a grid portion indicates that the group 15G of a plurality of vias 15 are arranged in a grid pattern as in the example shown in FIG. In the example shown in FIG. 2, the group 15G of the plurality of vias 15 are arranged in a grid pattern so as to surround the through conductor of the wiring conductor 14 in plan perspective. In this case, the distance between the penetrating conductor of the wiring conductor 14 and the via 15 is larger than the distance between adjacent vias 15 arranged in the vicinity in plan perspective, and the plurality of vias 15 penetrate the adjacent wiring conductor 14. It is arranged along the central part of the conductors.

The thickness of the via 15 (the length of the insulating substrate 11 in the Z direction) is set by the intensity of X-rays, and is formed to be, for example, about 100 μm to 300 μm. In the example shown in FIG. 3, the via 15 is formed on one insulating layer 11c arranged closer to the second main surface 11b in the thickness direction of the insulating substrate 11, but as in the example shown in FIG. In addition, a plurality of insulating layers 11c may be formed inside the insulating substrate 11. For example, vias 15 having a thickness of 100 μm are formed on two insulating layers 11c, respectively, and these insulating layers 11c are stacked in the thickness direction of the insulating substrate 11 to form vias 15 having a thickness of 200 μm. It doesn't matter. In this case, by reducing the thickness of one insulating layer 11c on which the via 15 is provided, the thickness of the one insulating layer 11c is increased when the substrate 1 for mounting the detection element is manufactured. Since it is possible to make it difficult for cracks to occur between the vias 15 and to reduce the distance between the vias 15 in the same insulating layer 11c, a plurality of vias 15 are densely packed in the insulating substrate 11 in a grid pattern. Even if the heat of the electronic element 3 or the like is transferred to the detection element mounting substrate 1 when the detection device is operated and stress is generated due to the difference in thermal expansion between the insulating layer 11c and the via 15, a plurality of vias 15 are provided. Stress is dispersed in the lattice portion of the group 15G, and it is possible to suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. The thickness of one insulating layer 11c on which the via 15 is provided is preferably not more than the diameter of the via 15. Further, in order to make the effect in each group 15G efficient, it is preferable that the thicknesses of the respective insulating layers 11c are the same, that is, they are provided evenly. Further, the distance between the via 15 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is the stress of the group 15G due to the plurality of vias 15 when the stress is applied to the side surface side of the insulating substrate 11. In order to prevent the dispersion from being out of balance, it is preferable that the arrangement is larger than the distance between adjacent vias 15. More preferably, the distance between the via 15 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is at least twice the distance between the adjacent vias 15.

Further, if the thickness of the insulating layer 11c on the first main surface 11a side and the thickness of the insulating layer 11c on the second main surface 11b side are made larger than the thickness of the insulating layer 11c on which the via 15 is provided, the via 15 is formed. By holding the provided insulating layer 11c so as to sandwich it, it is possible to suppress heat generation during operation of the detection device and distortion of the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. ..

Further, in plan perspective, the group 15G formed by the plurality of vias 15 has an extending portion L extending from the lattice portion. With such a configuration, heat of the electronic element 3 or the like is transferred to the substrate 1 for mounting the detection element when the detection device is operated, and stress is generated due to the difference in thermal expansion between the insulating layer 11c which is an insulator and the via 15 which is a metal conductor. Even if an attempt is made, the stress is dispersed in the lattice portion of the group 15G by the plurality of vias 15 and the extension portion L extending from the lattice portion, and it is possible to suppress the occurrence of distortion even in the vicinity of the outside of the lattice portion. It can detect X-rays well.

In the extending portion L, the distance between the via 15 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is at least twice the distance between the adjacent vias 15 as described above. It is preferable to have.

In the plan perspective, the extending portion L extending from the lattice portion is provided on the peripheral edge portion of the insulating substrate 11. With such a configuration, heat of the electronic element 3 or the like is transferred to the detection element mounting substrate 1 when the detection device is operated, and the insulating layer 11c which is an insulator and the metal are formed on the peripheral edge (outer edge) of the detection element mounting substrate 1. Even if stress due to the difference in thermal expansion with the conductor via 15 is about to be generated, the stress is dispersed by the lattice portion of the group 15G due to the plurality of vias 15 and the extending portion L extending from the lattice portion, and the detection element is detected. It is possible to suppress the occurrence of distortion even at the peripheral edge of the mounting substrate 1, and it is possible to detect X-rays satisfactorily.

A metal plating layer is adhered to the surface of the wiring conductor 14 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, and gold and connectivity with the connecting member 4. For example, a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold plating layer having a thickness of about 0.1 to 3 μm. And are sequentially adhered. by this,
Corrosion of the wiring conductor 14 can be effectively suppressed, and the connection between the wiring conductor 14 and the connecting member 4 and the connection between the wiring conductor 14 and the connection pad for connection formed on the module substrate can be strengthened.

The detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a of the detection element mounting substrate 1, and the electronic element 3 is mounted on the second mounting portion 13 of the second main surface 11b of the detection element mounting substrate 1. A detection device can be manufactured by mounting the device.

The detection element 2 is an element for converting X-rays incident on the detection element mounting substrate 1 into an electric signal. The detection element 2 has, for example, a scintillator that converts X-rays into light and a photodiode that converts light into an electric signal. The X-rays incident on the detection device are converted into light by a scintillator, and the light is converted into an electric signal by a photodiode. The electronic element 3 is an element for detecting an electric signal output from the detection element 2 and processing it as information, and is, for example, an integrated circuit device. The detection element 2 and the electronic element 3 are wired to the electrode of the detection element 2 or the electrode of the electronic element 3 via, for example, a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like). The conductor 14 is electrically and mechanically connected to be mounted on the detection element mounting substrate 1.

In the plane perspective, a plurality of vias 15 form a group 15G so as to cover the non-forming portion of the scintillator that converts X-rays into light, and the vias 15 are provided in a grid pattern in the plane perspective. There is. The group 15G is provided wider than the width of the non-formed portion of the scintillator in planar fluoroscopy. By reducing the irradiation of the X-rays transmitted through the insulating substrate 11 to the electronic element 3 mounted on the second mounting portion 13 of the detection element mounting substrate 1, the functional deterioration of the electronic element 3 is suppressed. It can detect and process electrical signals well.

The wiring conductor 14 of the detection device of this embodiment is connected to the connection pad of the module substrate via solder to form a detection module.

The detection element mounting substrate 1 of the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. A flat surface including a second main surface 11b, a second mounting portion 13 for mounting an electronic element 3 on the second main surface 11b, a wiring conductor 14 provided inside, and a plurality of vias 15 forming a group 15G. A visually rectangular insulating substrate 11 is provided, and a plurality of vias 15 are provided between the first main surface 11a or the second main surface 11b and the wiring conductor 14 in the thickness direction of the insulating substrate 11. There is. With the above configuration, since the wiring conductors 14 are arranged so as to face the plurality of vias 15 in the thickness direction of the insulating substrate 11, it is possible to reduce the bias of the stress due to the deviation and the density of the plurality of vias 15. When manufacturing the substrate 1 for mounting a detection element, it is necessary to prevent the insulating substrate 11 from being deformed or cracked easily due to stress due to heat shrinkage during firing, and to detect X-rays satisfactorily. Can be done.

Further, the plurality of vias 15 are provided between the second main surface 11b and the wiring conductor 14 in the example shown in FIG. 3, but as in the example shown in FIG. 5, the first main surface 11a and the wiring are provided. It may be provided between the conductor 14 and the conductor 14. By blocking X-rays on the first main surface 11a side close to the detection element 2 by the plurality of vias 15, the X-rays are transmitted to the second main surface 11b side of the insulating substrate 11 and irradiated to the electronic element 3. Can be better suppressed. Similarly, in the detection element mounting substrate 1 of the embodiment described later, a plurality of vias 15 may be provided between the first main surface 11a and the wiring conductor 14.

Further, when the group 15G is connected to the metal layer 18 provided in a plane shape as in the example shown in FIGS. 2 and 3, the metal layer 18 is between the plurality of vias 15 in the plan perspective. By covering the non-formed portion of the via 15 in the detection element mounting substrate 1 and blocking X-rays more effectively, the first main surface 11a side of the detection element mounting substrate 1 is irradiated. It is possible to satisfactorily block the generated X-rays, transmit them to the second main surface 11b side of the insulating substrate 11, and satisfactorily suppress the irradiation of the electronic element 3.

Similar to the via 15, the metal layer 18 is provided in a grid pattern so as to overlap the non-forming portion of the scintillator that converts X-rays into light in the plane perspective, and is a group of a plurality of vias 15 in the plane perspective. It is provided so as to overlap with 15G.

Such a metal layer 18 is preferably made of a material containing tungsten or molybdenum as a main raw material, and can be manufactured by the same manufacturing method as that of the wiring conductor 14 described above. When the width of the metal layer 18 is made larger than the width of the lattice portion in the plan view, the metal layer 18 satisfactorily holds a plurality of vias 15 and is attached to the detection element mounting substrate 1 when the detection device is operated. It is possible to suppress the occurrence of distortion, and it is possible to detect X-rays satisfactorily.

The metal layer 18 is provided with a thickness of about 5 to 30 μm. The thickness of the metal layer 18 is preferably larger than the gap between the plurality of vias 15 in plan perspective.

Further, the metal layer 18 may be connected to a plurality of vias 15, that is, may be arranged between the plurality of insulating layers 11c, and may be formed in a plurality in the thickness direction, as in the example shown in FIG. For example, by connecting the metal layer 18 to the group 15G of a plurality of vias 15 in a grid pattern, the plurality of vias 15 are held, and for example, the heat of the electronic element 3 or the like is used for mounting the detection element when the detection device is operated. Even if the stress is transmitted to the substrate 1 and stress is generated due to the difference in thermal expansion between the insulating layer 11c and the via 15, the stress is dispersed in the metal layer 18 to more effectively suppress the distortion of the detection element mounting substrate 1. be able to.

Further, in the plane perspective, if the region of the group 15G is provided so as to include the region of the second mounting portion 13, the first main surface of the detection element mounting substrate 1 is provided with respect to the region of the second mounting portion 13. It is possible to satisfactorily block the X-rays emitted to the 11a side, transmit the X-rays to the second main surface 11b side, and satisfactorily suppress the irradiation to the electronic element 3, and to detect the X-rays satisfactorily. it can.

The insulating substrate 11 has a connecting conductor 16 which is connected to the wiring conductor 14, is led out to the second main surface 11b, and is connected to the electronic element 3, and the outer edge portion of the group 15G is the first in plan perspective. When the two main surfaces 11b are located outside the connecting conductor 16, the X-rays radiated to the first main surface 11a side of the detection element mounting substrate 1 are satisfactorily applied to the region of the second mounting portion 13. It can be blocked, transmitted to the second main surface 11b side, and is satisfactorily suppressed from being irradiated to the electronic element 3, and X-rays can be satisfactorily detected.

In the detection device according to one aspect of the present invention, the detection element mounting substrate 1 having the above configuration, the detection element 2 mounted on the first mounting portion 12, and the electronic element 3 mounted on the second mounting portion 13 are provided. By having it, it is possible to obtain a detection device having excellent reliability.

In the detection module according to one aspect of the present invention, a detection module having an excellent reliability is provided by having a module substrate having a connection pad and a detection device having the above configuration connected to the connection pad via solder. Can be.

(Second Embodiment)
Next, the detection device according to the second embodiment of the present invention will be described with reference to FIGS. 6 to 9.

The detection device according to the second embodiment of the present invention differs from the detection device according to the above-described embodiment in that the auxiliary on the surface between the first main surface 11a and the wiring conductor 14 in the thickness direction of the insulating substrate 11. The point is that the metal layer 19 is provided. In this case, a plurality of vias 15 are provided between the second main surface 11b and the wiring conductor 14.

According to the detection element mounting substrate 1 according to the second embodiment of the present invention, similarly to the detection device substrate 1 of the first embodiment, the insulating substrate 11 is relative to the plurality of vias 15 in the thickness direction. Since the wiring conductor 14 is arranged so as to be used, it is possible to reduce the bias of the stress due to the deviation and the density of the plurality of vias 15, and to insulate the substrate 1 for mounting the detection element by the stress due to heat shrinkage during firing, for example. It is possible to prevent the substrate 11 from being deformed or the insulating substrate 11 from being easily cracked, and to detect X-rays satisfactorily.

Further, in the thickness direction of the insulating substrate 11, a plurality of vias 15 are provided between the second main surface 11b and the wiring conductor 14, and the auxiliary on the surface is provided between the first main surface 11a and the wiring conductor 14. By providing the metal layer 19, even if a plurality of vias 15 are provided on the plurality of insulating layers 11c, the wiring conductor 14 faces the plurality of vias 15 in the thickness direction of the insulating substrate 11. Since the auxiliary metal layer 19 is arranged, the bias of the stress due to the unevenness and the density of the plurality of vias 15 can be further reduced, and the substrate 1 for mounting the detection element is insulated by the stress due to heat shrinkage during firing, for example. It is possible to prevent the substrate 11 from being deformed or the insulating substrate 11 from being easily cracked, and to detect X-rays satisfactorily.

The auxiliary metal layer 19 is preferably formed in an area of 50% or more of the insulating layer 11c in plan perspective. Further, the auxiliary metal layer 19 may be electrically connected to the wiring conductor 14 or may be electrically disconnected from the wiring conductor 14. The auxiliary metal layer 19 may be formed as a power supply layer between the first main surface 11a and the wiring conductor 14, for example.

A material mainly made of tungsten or molybdenum is preferably used for the auxiliary metal layer 19, and the auxiliary metal layer 19 can be manufactured by the same material and method as the above-mentioned wiring conductor 14 or wiring pattern 17. The auxiliary metal layer 19 is provided to have a thickness of about 5 to 30 μm.

Further, in the detection device mounting substrate 1 of the second embodiment, a plurality of vias 15 are provided on the three insulating layers 11c, and the vias 15 (first vias 15a) provided on the three insulating layers 11c are provided. , The second via 15b and the third via 15c) are arranged so as to be offset from each other in plan perspective. By doing so, the number of vias 15 provided in one insulating layer 11c can be reduced, so that cracks may be suppressed between the vias 15 and X-rays can be detected satisfactorily.

Further, the group 15G of the via 15 has a grid-like lattice portion in each insulating layer 11c. The first via 15a, the second via 15b, and the third via 15c are provided on the respective insulating layers 11c with the same diameter and the same thickness. Further, the vias 15 provided in the respective insulating layers 11c are arranged so as to be offset from each other in plan perspective. That is, the first via 15a is provided so as to cover between the second via 15b and the third via 15c in plan perspective. The first via 15a provided on the first insulating layer 11c, the second via 15b provided on the second insulating layer 11c, and the via 15c provided on the third insulating layer 11c are flat surfaces. The virtual lines connecting the centers of the adjacent vias 15 in perspective are arranged so as to form a triangle. With this configuration, in planar perspective, the first via 15a is arranged so as to cover between the second via 15b and the third via 15, and the non-forming portion of the via 15 in the group 15G of the plurality of vias 15 It is good that the X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1 are satisfactorily blocked, transmitted to the second main surface 11b side, and irradiated to the electronic element 3. Can be suppressed. The first via 15a, the second via 15b, and the third via 15c are arranged so that the virtual lines connecting the centers of the respective vias 15 form a regular triangle shape in plan perspective. It is more preferable to be. In the above case, the vias 15 (first via 15a, second via 15b, third via 15c) provided on the three insulating layers 11c are planar perspectives of the vias 15 provided on the same insulating layer 11c. If the distance is set to twice the diameter, the space between the vias 15 can be well covered.

Further, even if the vias 15 in one insulating layer 11c in the insulating substrate 11 are reduced, a plurality of grid-like groups 15G can be densely provided in the insulating substrate 11 in plan perspective, so that the detection element can be mounted. At the time of manufacturing the substrate 1, it is possible to prevent the occurrence of cracks between adjacent vias 15 in one insulating layer 11c.

The thickness of each via 15 (15a to 15c) is preferably set to be equal to or larger than the gap between adjacent vias 15 (15a to 15c) in plan perspective.

Further, for example, when the via 15 is provided in each of the plurality of insulating layers 11c as in the example shown in FIG. 7, the extending portion L may be provided in each of the plurality of insulating layers 11c provided with the via 15. preferable.

The thickness of the insulating layer 11c provided with the first via 15a, the second via 15b, and the third via 15c is preferably not more than the diameter of each via 15. Further, in order to make the effect of each group 15G efficient, the thickness of the insulating layer 11c of the insulating layer 11c provided with the first via 15a, the second via 15b, and the third via 15c may be the same. preferable.

Further, when the metal layer 18 is provided, if it is provided between the insulating layers 11c so as to be connected to each via 15, distortion between the vias 15 can be suppressed, and the insulating substrate 11 may be deformed. It is possible to suppress the tendency of cracks to easily occur in the insulating substrate 11 and to detect X-rays satisfactorily.

Further, in the examples shown in FIGS. 6 to 9, a planar auxiliary metal layer 19 is provided between the first main surface 11a and the wiring conductor 14, but a plurality of vias 15 are provided as the first main surface. When the surface 11a and the wiring conductor 14 are unevenly arranged, that is, on the side of the first main surface 11a, a planar auxiliary metal layer 19 is provided between the first main surface 11a and the wiring conductor 14. It doesn't matter if you do. In this case as well, since the wiring conductors 14 are arranged so as to face the plurality of vias 15 as described above, the bias of the stress due to the deviation and the density of the plurality of vias 15 can be reduced and detected. When manufacturing the element mounting substrate 1, for example, it is possible to suppress deformation of the insulating substrate 11 due to stress due to heat shrinkage during firing and cracking of the insulating substrate 11 easily, and to detect X-rays satisfactorily. ..

Further, in the plan perspective, if the region of the auxiliary metal layer 19 is provided so as to include the region of the group 15G, the first main surface 11a of the detection element mounting substrate 1 is provided with respect to the region of the second mounting portion 13. The X-rays radiated to the side can be attenuated by the auxiliary metal layer 19, and the group 15G more reliably blocks the X-rays, transmits them to the second main surface 11b side, and irradiates the electronic element 3 with the effect. X-rays can be detected satisfactorily.

The detection element mounting substrate 1 of the second embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

(Third Embodiment)
Next, the detection device according to the third embodiment of the present invention will be described with reference to FIG. The difference from the detection device of the above-described embodiment is that the dummy metal layer 20 is provided so as to surround the group 15G in planar fluoroscopy.

According to the detection element mounting substrate 1 according to the third embodiment of the present invention, similarly to the detection device substrate 1 of the first embodiment, the insulating substrate 11 is relative to the plurality of vias 15 in the thickness direction. Since the wiring conductor 14 is arranged so as to be used, it is possible to reduce the bias of the stress due to the deviation and the density of the plurality of vias 15, and to insulate the substrate 1 for mounting the detection element by the stress due to heat shrinkage during firing, for example. It is possible to prevent the substrate 11 from being deformed or the insulating substrate 11 from being easily cracked, and to detect X-rays satisfactorily.

Further, by providing the dummy metal layer 20, for example, even if the heat of the electronic element 3 or the like is transferred to the detection element mounting substrate 1 when the detection device is operated, the inside of the insulating substrate 11 provided with the group 15G and the group Distortion of the outer peripheral portion of the insulating substrate 11 due to the difference from the outer peripheral portion of the insulating substrate 11 not provided with 15G is suppressed, and the insulating substrate 11 is easily deformed or cracks are likely to occur. Can be better suppressed and X-rays can be detected well.

The dummy metal layer 20 may be provided on each of the insulating layers 11c on which the vias 15 are provided. For example, when the vias 15 are provided on the plurality of insulating layers 11c, the dummy metal layers 20 may be provided on the surfaces of the plurality of insulating layers 11c in a plan view. It may be provided so as to surround each group 15G.

In the example shown in FIG. 10, the dummy metal layer 20 is formed in a frame shape in a plan view, but it may be divided into a plurality of layers and arranged so as to surround the group 15G as in the example shown in FIG. I do not care. The dummy metal layer 20 is preferably arranged at the corners of the insulating substrate 11 so as to surround the group 15G in order to suppress distortion at the corners of the insulating substrate 11. Further, when the auxiliary metal layer is arranged in the insulating substrate 11, it may be provided so as to overlap with the auxiliary metal layer in plan perspective.

A material mainly made of tungsten or molybdenum is preferably used for the dummy metal layer 20, and the dummy metal layer 20 can be manufactured by the same material and method as the wiring conductor 14 or the wiring pattern 17 described above. It is preferable that the dummy metal layer 20 is made of the same material as the metal layer 18 and is provided with the same thickness as the metal layer 18 (thickness of the metal layer 18 ± 3 μm).

(Fourth Embodiment)
Next, the detection device according to the fourth embodiment of the present invention will be described with reference to FIGS. 12 and 13. The difference from the detection device of the first embodiment described above is that the plurality of vias 15 have inclined portions 15S whose side surfaces are inclined, and a part of the inclined portions 15S facing each other overlap each other in plan perspective. It is a point. In the detection device of the fifth embodiment, the inclined portion 15S of the via 15 provided on the first main surface 11a side of the insulating substrate 11 and the inclined portion 15S of the via 15 provided on the second main surface 11b side of the insulating substrate 11 The portion 15S and the portion 15S overlap each other in a plane perspective.

According to the detection element mounting substrate 1 according to the fourth embodiment of the present invention, X-rays are satisfactorily blocked by overlapping some of the inclined portions 15S in a plurality of vias 15 arranged one above the other, and an insulating substrate is provided. The insulating layer 11c is compared with the case where a plurality of columnar vias having a large diameter are provided in the insulating layer 11a while satisfactorily suppressing the irradiation to the electronic element 3 by transmitting through the second main surface side of 1. The stress due to the difference in thermal expansion between the via 15 and the via 15 can be suppressed, the distortion of the detection element mounting substrate 1 can be suppressed, and X-rays can be detected satisfactorily.

In the thickness direction of the insulating substrate 11, the diameter of one end of the via 15 (the first main surface side in FIG. 13) is the diameter of the other end of the via 15 (the second main surface side in FIG. 13) in the example shown in FIG. ) Is larger in plan view. The diameter of one end of the via 15 is provided so as to be about 5% to 20% larger than the diameter of the other end of the via 15, and is provided on one main surface side of the via 15 (the first main surface side in FIG. 13). ) Is inclined at an acute angle from the plane direction of one end of the via 15 on the first main surface side, and the inclined portion 15S on the other main surface side of the via 15 (the second main surface side in FIG. 13) is It is inclined at an acute angle from the plane direction. In the examples shown in FIGS. 12 and 13, the via 15 has an inclined portion 15S over the entire circumference of the side surface and has a truncated cone shape.

Further, the inclination angle of the inclined portion 15S of the via 15 in the vertical cross-sectional view is 60 ° or more and 89 ° or less with respect to one end surface of the via 15 when it is an acute angle, and with respect to the other end surface of the via 15 when it is obtuse. When the temperature is 91 ° or more and 120 ° or less, the stress due to the difference in thermal expansion between the insulating layer 11c and the via 15 is suppressed as compared with the case where a plurality of columnar vias having a large diameter are provided in the insulating layer 11a. It is possible to suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. In the following, the inclined portion 15S inclined from the plane direction is a via in the vertical cross-sectional view.
The angle between the end surface on the first main surface side and the inclined side surface in 15 is defined as the angle of the inclined portion 15S.

The via 15 preferably has an inclined portion 15S over the entire lattice-shaped lattice portion, and when the via 15 has an extending portion L, the extending portion L also has an inclined portion 15S. That is, if it is provided over the entire detection element mounting substrate 1, it is possible to further suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays more effectively and satisfactorily.

Further, in the via 15, if each via 15 has an inclined portion 15S over the entire thickness direction of the insulating substrate 11, a plurality of vias 15 arranged above and below overlap each other, so that X It is possible to satisfactorily block the line, transmit it to the second main surface side of the insulating substrate 11, satisfactorily suppress the irradiation of the electronic element 3, and satisfactorily detect the X-ray.

One of the vias 15 has an opening diameter when, for example, a through hole for the via 15 is formed in a ceramic green sheet for the insulating substrate 11 by a processing method such as punching or laser processing by a die or punching. A through hole is formed so as to be larger than the other opening diameter, the through hole is filled with metallized paste for via 15 by a printing means such as a screen printing method, and fired together with a ceramic green sheet for the insulating substrate 11. It is formed by doing.

Further, as in the example shown in FIG. 14, the via 15 may have an inclined portion 15S inclined from the middle of the via 15 in the thickness direction of the insulating substrate 11. In this case, as compared with the case where a plurality of large vias are provided, the stress due to the difference in thermal expansion between the insulating layer 11c and the vias 15 can be suppressed, and the distortion of the detection element mounting substrate 1 can be suppressed. The line can be detected well. Further, by making the inclined portion 15S inclined from the middle of the via 15 overlap with the non-inclined portion, X-rays are effectively blocked and transmitted to the second main surface side of the insulating substrate 11, and the electronic element 3 It is possible to effectively suppress the irradiation of X-rays and detect X-rays better.

Further, the via 15 may be an inclined portion 15S having a convex curved surface on the center side of the via 15 in the thickness direction of the insulating substrate 11. In this case, it is preferable that the virtual line connecting both ends of the inclined portion 15S has the above-mentioned inclination angle.

Further, as shown in the example shown in FIG. 14, the plurality of vias 15 have a first via 15a having an inclined portion 15S inclined at an obtuse angle from the plane direction and a second via 15a having an inclined portion 15S inclined at an acute angle from the plane direction. When the via 15b is included, the large diameter portions overlap each other so as to be in contact with each other. Therefore, X-rays are well blocked, transmitted to the second main surface side of the insulating substrate 1, and irradiated to the electronic element 3. It can be suppressed well and X-rays can be detected well.

Further, the plurality of vias 15 include a plurality of first vias 15a having an inclined portion 15S inclined at an obtuse angle from the plane direction or a plurality of second vias 15b having an inclined portion 15S inclined at an acute angle from the plane direction. If this is the case, since the large diameter portions overlap in the plan view, the X-rays are blocked well, transmitted to the second main surface side of the insulating substrate 11, and the irradiation to the electronic element 3 is well suppressed, and the X-rays are suppressed. Can be detected well.

In the detection element mounting substrate 1 of the fourth embodiment, the three insulating layers 11c provided with the vias 15 are formed as one set 11G, and a plurality of these one set 11G are laminated in the thickness direction of the insulating substrate 11. That is, a plurality of sets of 11G may be arranged in the thickness direction of the insulating substrate 11. In this case, as compared with the case where the vias 15 are continuously provided in the thickness direction of the insulating substrate 11, the effect in the group 15G can be made more efficient by arranging the groups 15G in a dispersed manner. Further, as described above, it is preferable that the respective insulating layers 11c have the same thickness, that is, they are provided evenly.

As shown in FIGS. 13 to 15, the via 15 has a diameter of the via 15 on one side of the insulating layer 11c over the entire lattice portion in the one insulating layer 11c, which is the other side of the insulating layer 11c. It is preferable that the surfaces in which the diameter of the via 15 is larger than the diameter of the via 15 on the side, that is, in one insulating layer 11c, are in the same direction.

Further, also in the detection element mounting substrate 1 of the fourth embodiment, for the same reason as described above, all the insulating layers 11c provided with the first via 15a, the second via 15b, and the third via 15c are provided. It is preferable to provide an extension portion L in each of the above.

The detection element mounting substrate 1 of the fourth embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

The present invention is not limited to the examples of the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner portion in a plan view.

Further, in the first embodiment, as in the example shown in FIG. 4, an example in which the vias 15 are arranged on a plurality of insulating layers 11c and the vias 15 are provided so as to overlap each other in plan perspective is shown. However, even in the detection element mounting substrate 1 of the second and third embodiments, the vias 15 may be arranged on the plurality of insulating layers 11c so that the vias 15 may overlap each other in plan perspective. I do not care.

Further, the metal layer 18, the auxiliary metal layer 19, and the dummy metal layer 20 may be used for the detection element mounting substrate 1 according to any one of the first to fourth embodiments.

Further, the detection element mounting substrate 1 may be manufactured in the form of a large number of detection element mounting substrates.

1 ... Substrate for mounting detection elements
11 ... Insulated substrate
11a ・ ・ ・ First main surface
11b ・ ・ ・ 2nd main surface
12 ... 1st mounting part
13 ... 2nd mounting part
14 ... Wiring conductor
15 ... Via
15a ・ ・ ・ First beer
15b ・ ・ ・ Second via
15c ・ ・ ・ Third beer
15G ... (of multiple vias) group
15S ・ ・ ・ Inclined part
16 ... Connecting conductor
17 ... Wiring pattern
18 ... Metal layer
19 ... Auxiliary metal layer
20 ... Dummy metal layer 2 ... Detection element 3 ... Electronic element 4 ... Connection member

Claims (13)

A first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, a second main surface facing the first main surface, and an electronic element on the second main surface. It has a rectangular insulating substrate in a plan view, including a second mounting portion for mounting, a wiring conductor provided inside, a connecting conductor connected to the wiring conductor, and a plurality of vias formed in a group. And
The wiring conductor and the connecting conductor are electrically connected to a detection element or an electronic element.
The plurality of vias are not connected to the wiring conductor in the thickness direction of the insulating substrate, and are provided between the first main surface or the second main surface and the wiring conductor. Substrate for mounting the detection element. The substrate for mounting a detection element according to claim 1, wherein the group is connected to a metal layer provided in a planar shape. The substrate for mounting a detection element according to claim 1 or 2, wherein the region of the group is provided so as to include a region of the second mounting portion in planar fluoroscopy. The connection conductor is led before Symbol second major surface,
The substrate for mounting a detection element according to any one of claims 1 to 3, wherein the outer edge portion of the group is located outside the connecting conductor of the second main surface in plan perspective. In the thickness direction of the insulating substrate
The plurality of vias are provided between the second main surface and the wiring conductor.
The substrate for mounting a detection element according to any one of claims 1 to 4, wherein a planar auxiliary metal layer is provided between the first main surface and the wiring conductor. In the thickness direction of the insulating substrate
The plurality of vias are provided between the first main surface and the wiring conductor.
The substrate for mounting a detection element according to any one of claims 1 to 4, wherein a planar auxiliary metal layer is provided between the second main surface and the wiring conductor. The substrate for mounting a detection element according to claim 5 or 6, wherein the region of the auxiliary metal layer is provided so as to include the region of the group in the plan perspective. The substrate for mounting a detection element according to any one of claims 1 to 7, wherein a dummy metal layer is provided so as to surround the group in plan perspective. The plurality of vias have an inclined portion whose side surface is inclined.
The substrate for mounting a detection element according to any one of claims 1 to 8, wherein a part of the inclined portions facing each other overlaps each other in plan perspective. The plurality of vias are claimed to include a first via having the inclined portion inclined at an obtuse angle from the plane direction and a second via having the inclined portion inclined at an acute angle from the plane direction. Item 9. The substrate for mounting the detection element according to Item 9. The plurality of vias are characterized by including a plurality of first vias having the inclined portion inclined at an obtuse angle from the plane direction or a plurality of second vias having the inclined portion inclined at an acute angle from the plane direction. The substrate for mounting the detection element according to claim 9. The substrate for mounting the detection element according to any one of claims 1 to 11.
The detection element mounted on the first mounting portion and
A detection device having an electronic element mounted on the second mounting portion. Module board with connection pad and
The detection module according to claim 12, further comprising the detection device according to claim 12, which is connected to the connection pad via solder.

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