JP6798871B2 - Substrate for mounting detection element and detection device - Google Patents

Description

The present invention relates to a substrate for mounting a detection element and a detection device.

Conventionally, a detection element mounting substrate and a detection device on which a detection element for detecting X-rays is mounted on a main surface of an insulating substrate are known (see, for example, Patent Document 1).

The detection element is mainly composed of a large number of photodiodes arranged on the other main surface of the substrate for mounting the detection element and a scintillator formed on the photodiode, and the X-rays applied to the detection element are fluorescent by the scintillator. The voltage and current characteristics of each photodiode change due to this light, and this change is extracted as X-ray image information.

In such a substrate for mounting a detection element, it is known that a plurality of vias for attenuating X-rays are diagonally arranged inside the insulating substrate.

Japanese Patent Application Laid-Open No. 2009-032936

However, there is a demand for miniaturization and high functionality of the detection device. For example, in the case of a conventional detection device, by tilting the via, X-rays that have passed through the non-formed region of the detection element, that is, X-rays that are not converted by the scintillator but are irradiated on the insulating substrate and scattered inside the insulating substrate. Although the line can be attenuated over a wide area, when the thickness of the via per unit area in plan view is thin and high-intensity X-rays are applied to the inside of the insulating substrate, the vias attenuate the X-rays well. There is a concern that it will be difficult to detect X-rays well.

According to one aspect of the present invention, the detection element mounting substrate includes a first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, and the first main surface. A second main surface facing the surface, a second mounting portion for mounting an electronic element on the second main surface, a plurality of vias formed in a group, and the first via so as not to overlap the plurality of vias in a plan perspective. It has an insulating substrate including a plurality of electrodes provided on the main surface, and in plan perspective, the first main surface and the plurality of vias in a portion sandwiched between the plurality of electrodes are the insulating substrate. It has a protruding portion protruding to the outside of the insulating substrate in the thickness direction of the above, and in a plan view, the plurality of electrodes are arranged in a grid pattern, and the four adjacent electrodes among the plurality of electrodes It has the protruding portion in the central portion to be sandwiched . Further, the detection element mounting substrate includes a first main surface, a first mounting portion on which the detection element for detecting X-rays is mounted on the first main surface, and a second main surface facing the first main surface. A second mounting portion for mounting an electronic element on the second main surface, a plurality of vias formed in a group, and a plurality of vias provided on the first main surface so as not to overlap the plurality of vias in a plan perspective. It has an insulating substrate including an electrode, and in plan perspective, the first main surface and the plurality of vias in a portion sandwiched between the plurality of electrodes are formed on the insulating substrate in the thickness direction of the insulating substrate. It has a protruding portion that protrudes outward, and the group has a grid-like shape in plan view, and has a band-shaped portion in which the protruding portion has a band shape in plan view.

According to one aspect of the present invention, it has a detection element mounting substrate having the above configuration, a detection element mounted on the first mounting portion, and an electronic element mounted on the second mounting portion. ..

Detecting device mounting board according to one aspect of the present invention, the upper Symbol arrangement, a plurality of vias protruding becomes larger in the thickness direction of the insulating substrate, and are scattered intense X-ray and radiation inside the insulating substrate It is possible to use a substrate for mounting a detection element capable of satisfactorily attenuating X-rays and satisfactorily detecting X-rays.

A detection device according to one aspect of the present invention includes a detection element mounting substrate having the above configuration, a detection element mounted on the first mounting portion, and an electronic element mounted on the second mounting portion. Therefore, it is possible to obtain a detection device having excellent reliability.

(A) is a top perspective view showing the detection device according to the first embodiment of the present invention, and (b) is a bottom perspective view of (a). (A) is a top view of a substrate for mounting a detection element of the detection device shown in FIG. 1, and (b) is an enlarged top perspective view of a main part of (a). (A) is an internal top view of the detection device shown in FIG. 1 (a), and (b) is an enlarged internal top view of a main part in part B of (a). (A) is a vertical cross-sectional view taken along the line AA of the detection device shown in FIG. 1 (a), and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). It is an enlarged vertical sectional view of the main part which shows the other example of the detection apparatus in 1st Embodiment of this invention. (A) is a top perspective view showing the detection device according to the second embodiment of the present invention, and (b) is a bottom perspective view of (a). (A) is an internal top view of the detection device shown in FIG. 6 (a), and (b) is an enlarged internal top view of a main part in part B of (a). (A) is a vertical cross-sectional view taken along the line AA of the detection device shown in FIG. 6 (a), and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). It is an enlarged vertical sectional view of the main part of the detection apparatus in the 3rd Embodiment of this invention. It is an enlarged vertical sectional view of the main part of the detection apparatus in another example of 3rd Embodiment of this invention.

Some exemplary embodiments of the invention will be described with reference to the accompanying drawings.

(First Embodiment)
As shown in FIGS. 1 to 3, the detection device according to the first embodiment of the present invention includes a detection element mounting substrate 1 and a detection element 2 mounted on the first main surface 11a of the detection element mounting substrate 1. And the electronic element 3 mounted on the second main surface 11b of the detection element mounting substrate 1. The detection element mounting substrate 1 in the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. The second main surface 11b, the second mounting portion 13 for mounting the electronic element 3 on the second main surface 11b, and the plurality of vias 14 forming the group 14G, and the second main surface so as not to overlap with the vias in plan perspective. It has an insulating substrate 11 including a plurality of electrodes 15 provided on the surface. A wiring conductor 16 connected to the electrode 15 is provided on the surface and inside of the insulating substrate 11. In plan perspective, the first main surface 11a and the plurality of vias 14 in the portion sandwiched between the plurality of electrodes 15 have protrusions 11c and 14d protruding outward of the insulating substrate 11 in the thickness direction of the insulating substrate 11. There is. In FIGS. 1 to 3, the detection element mounting substrate 1 and the detection device are mounted on the xy plane in the virtual xyz space. In FIGS. 1 to 3, the upward direction means the positive direction of the virtual z-axis. It should be noted that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the detection element mounting substrate 1 and the like are actually used. Further, the thickness direction of the insulating substrate 11 means the direction of the z-axis in FIGS. 1 to 3.

The protruding portion 11c of the first main surface 11a of the insulating substrate 11 is shaded in the example shown in FIG. The via 14 is shaded in the example shown in FIG. 3 (b).

The insulating substrate 11 has a first main surface 11a (upper surface in FIGS. 1 to 3), a second main surface 11b (lower surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers 11d, and has a rectangular plate-like shape when viewed from a plan view, that is, a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the detection element 2 and the electronic element 3, and the detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a and the second mounting of the second main surface 11b. The electronic element 3 is adhered and fixed on the portion 13 via a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like).

For the insulating substrate 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride material sintered body, a silicon nitride material sintered body, a mulite material sintered body, or a glass ceramics sintered body may be used. it can. In the case where the insulating substrate 11 is, for example, an aluminum oxide sintered body, raw material powders such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO) are used. An appropriate organic binder, solvent, etc. are added and mixed to prepare a muddy syrup. A ceramic green sheet is produced by molding this slurry into a sheet shape by using a conventionally known doctor blade method, a calender roll method, or the like. Next, the insulating substrate 11 is formed by subjecting the ceramic green sheet to an appropriate punching process, laminating a plurality of ceramic green sheets to form a product, and firing the product at a high temperature (about 1600 ° C.). It will be manufactured.

A first mounting portion 12 for mounting the detection element 2 is provided on the first main surface 11a of the insulating substrate 11, and a second mounting portion 13 for mounting the electronic element 3 on the second main surface 11b of the insulating substrate 11. Is provided. An electrode 15 is provided on the first main surface 11a of the insulating substrate 11. Wiring conductors 16 are provided on the surface and inside of the insulating substrate 11. One end of the wiring conductor 16 is connected to the electrode 15, and the other end is led out to the second main surface 11b. The electrode 15 and the wiring conductor 16 are for electrically connecting the detection element 2 and the electronic element 3 mounted on both main surfaces of the detection element mounting substrate 1, respectively. The wiring conductor 16 comprises a wiring layer provided on the surface or inside of the insulating substrate 11 and a penetrating conductor that electrically connects the wiring layers located above and below the insulating layer 11d constituting the insulating substrate 11. Includes.

The electrode 15 and the wiring conductor 16 are metal powder metallized containing, for example, tungsten (W), molybdenum (Mo), manganese (Mn) and the like as main components. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, the metallized paste obtained by adding and mixing an appropriate organic binder and a solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is pre-printed and coated in a predetermined pattern by a screen printing method, and fired at the same time as the ceramic green sheet for the insulating substrate 11 to be adhered and formed at a predetermined position on the insulating substrate 11. For the electrode 15 and the wiring conductor 16, for example, a metallized paste for the electrode 15 or the wiring conductor 16 is printed and applied to a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method, and the ceramic for the insulating substrate 11 is coated. Formed by firing with a green sheet. When the wiring conductor 16 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a processing method such as punching or laser processing by a mold or punching, and the through hole is formed. The holes are filled with a metallized paste for a through conductor by the above printing means, and formed by firing together with a ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adding an appropriate solvent and a binder to the above-mentioned metal powder and kneading the paste to adjust the viscosity to an appropriate level. In addition, in order to increase the bonding strength with the insulating substrate 11, glass powder and ceramic powder may be contained.

A plurality of vias 14 are provided inside the insulating substrate 11 in the thickness direction of the insulating substrate 11 (z direction in FIG. 1). The plurality of vias 14 are provided between the first main surface 11a or the second main surface 11b in the thickness direction of the insulating substrate 11. In the example shown in FIGS. 1 to 3, the via 14 is provided on the second insulating layer 11d from the first main surface 11a side of the three insulating layers 11d constituting the insulating substrate 11. The plurality of vias 14 and electrodes 15 are provided so as not to overlap each other in plan perspective.

The via 14 passes through the non-formed region of the scintillator in the detection element 2, is not converted into fluorescence by the scintillator of the detection element 2, and attenuates the X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1. This is intended to transmit through the second main surface 11b side of the insulating substrate 11 and suppress the irradiation of the electronic element 3. Then, the irradiation of the electronic element 3 with X-rays is suppressed, and it is possible to suppress the occurrence of malfunction or damage of the electronic element 3 such as malfunction. A material mainly made of tungsten or molybdenum is preferably used for the via 14, and the via 14 is formed by the same method as the through conductor of the wiring conductor 16 described above.

The detection element mounting substrate 1 has a plurality of vias 14 inside the insulating substrate 11, and the plurality of vias 14 form a group 14G. Group 14G has a grid portion that is grid-like. Here, the fact that the group 14G has a grid portion indicates that the group 14G of a plurality of vias 14 are arranged in a grid pattern as in the example shown in FIG. In the example shown in FIG. 2, the group 14G of the plurality of vias 14 are arranged in a grid pattern so as to surround the through conductor of the wiring conductor 16 in plan perspective. In this case, the distance between the penetrating conductor of the wiring conductor 16 and the via 14 is larger than the distance between adjacent vias 14 arranged in the vicinity in the plan perspective, and the plurality of vias 14 penetrate the adjacent wiring conductor 16. It is arranged along the central part of the conductors.

The thickness of the via 14 (the length of the insulating substrate 11 in the Z direction) is set by the intensity of X-rays, and is formed to be, for example, about 100 μm to 300 μm. In the example shown in FIG. 3, the via 14 is formed on one insulating layer 11d arranged closer to the second main surface 11b in the thickness direction of the insulating substrate 11, but as in the example shown in FIG. In addition, a plurality of insulating layers 11d may be formed inside the insulating substrate 11. For example, vias 14 having a thickness of 100 μm are formed on two insulating layers 11d, respectively, and these insulating layers 11d are stacked in the thickness direction of the insulating substrate 11 to form vias 14 having a thickness of 200 μm. It doesn't matter. In this case, by reducing the thickness of one insulating layer 11d provided with the via 14, the thickness of one insulating layer 11d is increased when the substrate 1 for mounting the insulating layer 11d detection element is manufactured. Since it is possible to prevent cracks from occurring between adjacent vias 14 and to reduce the distance between the vias 14 in the same insulating layer 11d, a plurality of vias 14 are arranged in a grid pattern in the insulating substrate 11. Even if the heat of the electronic element 3 or the like is transferred to the substrate 1 for mounting the detection element when the detection device is operated and stress is generated due to the difference in thermal expansion between the insulating layer 11d and the via 14, a plurality of stresses can be generated. Stress is dispersed in the lattice portion of the group 14G due to the via 14, and it is possible to suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. The thickness of one insulating layer 11d on which the via 14 is provided is preferably not more than the diameter of the via 14. Further, in order to make the effect in each group 14G efficient, it is preferable that the thicknesses of the respective insulating layers 11d are the same, that is, they are provided evenly. Further, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is the stress of the group 14G due to the plurality of vias 14 when the stress is applied to the side surface side of the insulating substrate 11. In order to prevent the dispersion from being out of balance, it is preferable that the arrangement is larger than the distance between adjacent vias 14. More preferably, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is at least twice the distance between the adjacent vias 14.

In planar fluoroscopy, as in the example shown in FIGS. 2 (b) and 4 (b), the first main surface 11a and the plurality of vias 14 in the portion sandwiched between the plurality of electrodes 15 are the thickness of the insulating substrate 11. It has protrusions 11c and 14d that project outward from the insulating substrate 11 in the direction. First main surface of the insulating substrate 11
The protrusion 11c of 11a is located on the via group 14G of the plurality of vias 14 in a plan view. In such protrusions 11c and 14d, when the through hole of the ceramic green sheet for the insulating layer 11d is filled with the metallized paste for via 14, the metallized paste for via 14 protrudes in advance from the surface of the green sheet. It can be formed by filling in such a manner. Alternatively, the shrinkage of the metallized paste for the via 14 during firing in the thickness direction of the insulating substrate 11 shrinks more than the shrinkage of the generated form for the insulating substrate 11 and the shrinkage of the metallized paste for the through conductor of the wiring conductor 16. It is made difficult, and the via 14 can be formed by projecting the via 14 from the surface of the insulating layer 11d provided with the via 14.

Further, if the thickness of the insulating layer 11d on the first main surface 11a side and the thickness of the insulating layer 11d on the second main surface 11b side are made larger than the thickness of the insulating layer 11d on which the via 14 is provided, the via 14 is formed. By holding the provided insulating layer 11d so as to sandwich it, it is possible to suppress heat generation during operation of the detection device and distortion of the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. ..

A metal plating layer is adhered to the surfaces of the electrodes 15 and the wiring conductor 16 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal such as nickel, copper, gold, etc., which has excellent corrosion resistance and connectivity with the connecting member 4, and has a thickness of, for example, 0.5 to 5.
A nickel plating layer of about 5 μm and a gold plating layer of about 0.1 to 3 μm are sequentially adhered. As a result, corrosion of the electrode 15 and the wiring conductor 16 can be effectively suppressed, and the joint between the electrode 15 and the wiring conductor 16 and the connecting member 4 can be strengthened.

The detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a of the detection element mounting substrate 1, and the electronic element 3 is mounted on the second mounting portion 13 of the second main surface 11b of the detection element mounting substrate 1. A detection device can be manufactured by mounting the device.

The detection element 2 is an element for converting X-rays incident on the detection element mounting substrate 1 into an electric signal. The detection element 2 has, for example, a scintillator that converts X-rays into light and a photodiode that converts light into an electric signal. The X-rays incident on the detection device are converted into light by a scintillator, and the light is converted into an electric signal by a photodiode. The electronic element 3 is an element for detecting an electric signal output from the detection element 2 and processing it as information, and is, for example, an integrated circuit device. The detection element 2 and the electronic element 3 are, for example, an electrode of the detection element 2 or an electrode and an electrode of the electronic element 3 via a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like). The 15 and the wiring conductor 16 are electrically and mechanically connected to be mounted on the detection element mounting substrate 1.

In the plane perspective, a plurality of vias 14 form a group 14G so as to cover the non-forming portion of the scintillator that converts X-rays into light, and the vias 14 are provided in a grid pattern in the plane perspective. There is. The group 14G is provided wider than the width of the non-formed portion of the scintillator in planar fluoroscopy. By reducing the irradiation of the X-rays transmitted through the insulating substrate 11 to the electronic element 3 mounted on the second mounting portion 13 of the detection element mounting substrate 1, the functional deterioration of the electronic element 3 is suppressed. It can detect and process electrical signals well.

The detection element mounting substrate 1 of the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. The second main surface 11b, the second mounting portion 13 for mounting the electronic element 3 on the second main surface 11b, the plurality of vias 14 forming the group 14G, and the plurality of vias 14 in the plan perspective so as not to overlap with each other. It has an insulating substrate 11 including a plurality of electrodes 15 provided on the first main surface 11a, and in plan perspective, the first main surface 11a and the plurality of vias 14 in a portion sandwiched between the plurality of electrodes 15 However, since the insulating substrate 11 has protruding portions 11c and 14d protruding outward in the thickness direction of the insulating substrate 11, a plurality of protruding vias 14 are formed on the insulating substrate 11.
A detection element that becomes larger in the thickness direction of the insulating substrate 11 and can satisfactorily attenuate high-intensity X-rays and scattered X-rays radiated to the inside of the insulating substrate 11 over a wide area and can detect X-rays satisfactorily. It can be used as a mounting board.

The height of the protruding portion 11c of the first main surface 11a is a virtual line connecting the tops of the electrodes 15 adjacent to the protruding portion 11c (upper surfaces of the electrodes 15 in FIG. 5) as in the example shown in FIG. If the height does not exceed the height, it is possible to prevent the protrusion 11c from coming into contact with the detection element mounting substrate 1 when handling the detection element mounting substrate 1 and applying distortion or impact to the detection element mounting substrate 1, so that the detection device can be mounted. Can be used well.

Further, in a plan view, as in the example shown in FIGS. 1 to 5, a plurality of electrodes 15 are arranged in a grid pattern, and a central portion sandwiched between four adjacent electrodes 15 among the plurality of electrodes 15. When the protruding portions 11c and 14d are provided in the above, the protruding portions 11c and 14d are arranged between the plurality of electrodes 15 in a well-balanced manner, the substrate 1 for mounting the detection element is less likely to have distortion, and high-intensity X-rays are obtained. In addition, the scattered X-rays can be satisfactorily attenuated, and the detection element mounting substrate 1 capable of satisfactorily detecting X-rays can be obtained.

Here, the grid point shape means that, as shown in FIG. 2, a plurality of electrodes 15 are arranged in a grid pattern in a plan view. The plurality of electrodes 15 are arranged at the center of each of the grid portions of the group 14G of the via 14.

Further, in the plan view, as in the example shown in FIGS . 2 to 5, the group 14G has a grid pattern, and in the plan view, the protruding portions 11c and 14d have a band shape. When the scintillators in the detection element 2 are arranged in a grid pattern, high-intensity X-rays and scattered X-rays that pass through the non-formed region of the band-shaped scintillator and are irradiated inside the insulating substrate 11 are emitted. It is possible to obtain a detection element mounting substrate 1 that can efficiently and effectively attenuate over a wide area and can detect X-rays satisfactorily.

Further, in a plan view, if the protruding portions 11c and 14d have a grid-like grid portion 11cG, when the scintillators in the detection element 2 are arranged in a grid-like pattern, the scintillators in the grid-like shape are not formed. High-intensity X-rays and scattered X-rays that pass through the formation region and are applied to the inside of the insulating substrate 11 over the entire surface of the detection element mounting substrate 1 can be efficiently and effectively attenuated over a wide region. The detection element mounting substrate 1 can be used as a detection element mounting substrate 1 capable of satisfactorily detecting X-rays over the entire detection element mounting substrate 1.

Further, in the plan perspective, as shown in the example shown in FIG. 3A, if the group 14G formed by the plurality of vias 14 has an extending portion extending from the lattice portion, the electronic element is operated when the detection device is operated. Even if heat of 3rd magnitude is transferred to the substrate 1 for mounting the detection element and stress is generated due to the difference in thermal expansion between the insulating layer 11a which is an insulator and the via 14 which is a metal conductor, the group 14G due to the plurality of vias 14 has. Stress is dispersed in the lattice portion and the extending portion extending from the lattice portion, and it is possible to suppress the occurrence of distortion even in the vicinity of the outside of the lattice portion, and X-rays can be detected well.

Even in the extending portion, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is more than twice the distance between the adjacent vias 14 as described above. Is preferable.

In the plan perspective, if the extending portion extending from the lattice portion is provided on the peripheral portion of the insulating substrate 11, the heat of the electronic element 3 or the like is transferred to the detecting element mounting substrate 1 when the detection device is operated, and the detection is performed. Even if stress is generated due to the difference in thermal expansion between the insulating layer 11a which is an insulator and the via 14 which is a metal conductor at the peripheral edge (outer edge) of the element mounting substrate 1, the lattice of the group 14G due to the plurality of vias 14 It is possible to prevent the stress from being dispersed in the extending portion extending from the portion and the lattice portion and causing distortion in the peripheral portion of the substrate 1 for mounting the detection element, and to detect X-rays satisfactorily. it can.

In the detection device according to one aspect of the present invention, the detection element mounting substrate 1 having the above configuration, the detection element 2 mounted on the first mounting portion 12, and the electronic element 3 mounted on the second mounting portion 13 are provided. By having it, it is possible to obtain a detection device having excellent reliability.

(Second Embodiment)
Next, the detection device according to the second embodiment of the present invention will be described with reference to FIGS. 6 to 8.

The detection device according to the second embodiment of the present invention differs from the detection device of the first embodiment described above in that it differs from the detection device of the first embodiment described above in that it is a via composed of a plurality of vias 14. 14a is provided on the three insulating layers 11d, and the vias 14 (first via 14a, second via 14b, third via 14c) provided on the three insulating layers 11d are provided in the plan perspective. The point is that the vias 14 are staggered from each other. FIG. 7A is an internal top view showing the first via 14a, and the second via 14b and the third via 14c are provided in the same manner as the first via 14a.

The second via 14b and the third via 14c are shown through by a broken line in the example shown in FIG. 7 (b), and are shaded in the example shown in FIG. 7 (b). Further, the first via 14a and the third via 14c are shown by a broken line in the example shown in FIG.

According to the detection element mounting substrate 1 of the second embodiment of the present invention, high-intensity X-rays and scattered X-rays inside the insulating substrate 11 are spread over a wide area as in the detection device of the first embodiment. It can be attenuated better and X-rays can be detected better.

Further, the group 14G of the via 14 has a grid-like lattice portion in each of the insulating layers 11d. The first via 14a, the second via 14b, and the third via 14c are provided on the respective insulating layers 11d with the same diameter and the same thickness. Further, the vias 14 provided on the respective insulating layers 11d are arranged so as to be offset from each other in plan perspective. That is, the first via 14a is provided so as to cover between the second via 14b and the third via 14c in plan perspective. The first via 14a provided on the first insulating layer 11d, the second via 14b provided on the second insulating layer 11d, and the via 14c provided on the third insulating layer 11d are flat surfaces. In perspective, the virtual lines connecting the centers of the adjacent vias 14 are arranged in a triangular shape. With this configuration, in planar perspective, the first via 14a is arranged so as to cover between the second via 14b and the third via 14c, and the non-forming portion of the via 14 in the group 14G of the plurality of vias 14 X-rays radiated to the first main surface side of the detection element mounting substrate 1 are satisfactorily attenuated, transmitted to the second main surface side, and irradiated to the electronic element 3 is satisfactorily suppressed. can do. The first via 14a, the second via 14b, and the third via 14c are arranged so that the virtual lines connecting the centers of the respective vias 14 form a regular triangle shape in plan perspective. It is more preferable to be. In the above case, the vias 14 (first via 14a, second via 14b, third via 14c) provided on the three insulating layers 11d are planar perspectives of the vias 14 provided on the same insulating layer 11d. If the distance is set to twice the diameter, the space between the vias 14 can be well covered.

Further, even if the number of vias 14 in one insulating layer 11d in the insulating substrate 11 is reduced, a plurality of grid-like groups 14G can be efficiently and densely provided in the insulating substrate 11 in plan perspective, so that the detection element can be detected. At the time of manufacturing the mounting substrate 1, it is possible to prevent the occurrence of cracks between adjacent vias 14 in one insulating layer 11d.

The thickness of the insulating layer 11d provided with the first via 14a, the second via 14b, and the third via 14c is preferably not more than the diameter of each via 14. Further, in order to make the effect of each group 14G efficient, the thickness of the insulating layer 11d of the insulating layer 11d provided with the first via 14a, the second via 14b, and the third via 14c may be the same. preferable.

Further, in the vias 14 (first via 14a, second via 14b, third via 14c) provided on the three insulating layers 11d, each via 14 of the insulating substrate 11 is formed in the thickness direction of the insulating substrate 11. The protruding portion 14d may be provided only on the first via 14 arranged on the first main surface 11a side among the plurality of vias 14. As in the example shown in FIG. 9, when each of the vias 14 provided on the three insulating layers 11d is projected, the individual vias 14 on the first main surface 11a side (first vias 14a, second vias 14a, second). Even if the height of the protruding portion 14d of the via 14b and the third via 14c) is reduced, the first main surface 11a of the insulating substrate 11 can be easily projected as a whole.

By gradually projecting each of the insulating layers 11d of the insulating substrate 11 toward the 1 main surface 11a, the stress applied to the individual insulating layers 11a is less likely to increase, so that the insulating layers 11d project satisfactorily to the first main surface 11a of the insulating substrate 11. Part 11c can be formed.

The detection element mounting substrate 1 of the second embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

(Third Embodiment)
Next, the electronic device according to the third embodiment of the present invention will be described with reference to FIG. The difference from the detection device of the first embodiment described above is that it has a metal layer 17 provided so as to cover the lattice portion in the group 14G of the plurality of vias 14 in planar fluoroscopy.

According to the detection element mounting substrate 1 of the third embodiment of the present invention, high-intensity X-rays and scattered X-rays inside the insulating substrate 11 are spread over a wide area as in the detection device of the first embodiment. There is a demand for a substrate for mounting a detection element that can be attenuated satisfactorily and can detect X-rays satisfactorily.

The metal layer 17 fills the space between the plurality of vias 14 to fill the non-formed portion of the vias 14 in the detection element mounting substrate 1, and more effectively attenuates the X-rays to detect the detection element. To satisfactorily attenuate the X-rays emitted to the first main surface side of the mounting substrate 1, transmit the X-rays to the second main surface side of the insulating substrate 11, and satisfactorily suppress the irradiation to the electronic element 3. Can be done.

In the example shown in FIG. 10, the metal layer 17 is a grid on the upper surface side and the lower surface side of the insulating layer 11d provided with the group 14G of the via 14 so as to overlap the non-forming portion of the scintillator that converts X-rays into light. It is provided so as to overlap with a group 14 of a plurality of vias 14 in a plan view. Similar to the via 14, the metal layer 17 attenuates X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1, and transmits X-rays to the second main surface 11b side of the insulating substrate 11. , It suppresses the irradiation of the electronic element 3. The metal layer 17 is formed on the upper surface and the lower surface of the insulating layer 11d to a thickness of about 5 to 30 μm.

When the width of the metal layer 17 is made larger than the width of the grid portion of the via group 14G of the via 14 in the plan view, the metal layer 17 holds a plurality of vias 14 well, and when the detection device is operated, It is possible to suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. When the grid portion of the group 14G of the via 14 is provided on the entire substrate 1 for mounting the detection element by planar fluoroscopy, the metal layer 17 is transparent to the plane so as to cover the entire lattice portion of the group 14G of the via 14. It is more effective if it is provided over the entire substrate 1 for mounting the detection element.

The metal layer 17 can be manufactured by the same method as the wiring layer of the wiring conductor 16 described above.

The detection element mounting substrate 1 of the third embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the above-described embodiment.

The present invention is not limited to the examples of the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner portion in a plan view.

Further, in the detection element mounting substrate 1 of the third embodiment, the three insulating layers 11d provided with the via 14 are provided, and the three insulating layers 11d provided with the via 14 are combined into one set 11G. Then, a plurality of these sets of 11G may be laminated in the thickness direction of the insulating substrate 11, that is, a plurality of sets of 11G may be arranged in the thickness direction of the insulating substrate 11. In this case, as compared with the case where the vias 14 are continuously provided in the thickness direction of the insulating substrate 11, the effect in the group 14G can be made more efficient by arranging the groups 14G in a dispersed manner. Further, as described above, it is preferable that the thicknesses of the respective insulating layers 11d are the same, that is, they are provided evenly.

The detection element mounting substrate 1 of the third embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

Further, in the first embodiment, as in the example shown in FIG. 5, the vias 14 are arranged on the plurality of insulating layers 11d, and the vias 14 are provided so as to overlap each other in the plan perspective. However, even in the detection element mounting substrate 1 of the second and third embodiments, the vias 14 may be arranged on the plurality of insulating layers 11d so that the vias 14 may overlap each other in the plan perspective. I do not care.

Further, as shown in the example of FIG. 10, the detection element mounting substrate 1 in which the wiring conductor 16 (wiring layer) is provided between the insulating layer 11d between the second main surface and the via 14 may be used. ..

Further, the detection element mounting substrate 1 may be manufactured in the form of a large number of detection element mounting substrates.

1 ... Substrate for mounting detection elements
11 ... Insulation substrate
11a ・ ・ ・ First main surface
11b ・ ・ ・ 2nd main surface
11c ... Protruding part (on the first main surface)
11cG ... Lattice (of the protrusion)
12 ... 1st mounting part
13 ... 2nd mounting part
14 ... Via
14d ... (via) protrusion
14G ... (of multiple vias) group
15 ... Electrode
16 ... Wiring conductor
17 ... Metal layer 2 ... Detection element 3 ... Electronic element 4 ... Connecting member

Claims (5)

A first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, a second main surface facing the first main surface, and an electronic element on the second main surface. With the second mounting part to mount
With multiple vias in a group,
It has an insulating substrate including a plurality of electrodes provided on the first main surface so as not to overlap the plurality of vias in a plane perspective.
In planar fluoroscopy, the first main surface and the plurality of vias in the portion sandwiched between the plurality of electrodes have a protruding portion protruding outward of the insulating substrate in the thickness direction of the insulating substrate .
A substrate for mounting a detection element , wherein the plurality of electrodes are arranged in a grid pattern in a plan view, and the plurality of electrodes have a protrusion at a central portion sandwiched between four adjacent electrodes . In planar fluoroscopy, the group is in a grid pattern.
In plan view, the protruding portion has a strip portion that became a strip, the detection device mounting board according to claim 1. A first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, a second main surface facing the first main surface, and an electronic element on the second main surface. And the second mounting part to mount
With multiple vias in a group,
It has an insulating substrate including a plurality of electrodes provided on the first main surface so as not to overlap the plurality of vias in a plane perspective.
In planar fluoroscopy, the first main surface and the plurality of vias in the portion sandwiched between the plurality of electrodes have a protruding portion protruding outward of the insulating substrate in the thickness direction of the insulating substrate.
In planar fluoroscopy, the group is in a grid pattern.
A substrate for mounting a detection element, which has a strip-shaped protruding portion in a plan view. The substrate for mounting a detection element according to claim 2 or 3, wherein the projecting portion has a grid portion having a grid shape in a plan view. The substrate for mounting the detection element according to any one of claims 1 to 4,
The detection element mounted on the first mounting portion and
A detection device having an electronic element mounted on the second mounting portion.

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