JP2017063093A - Wiring board, electronic device, and electronic module - Google Patents

Wiring board, electronic device, and electronic module Download PDF

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JP2017063093A
JP2017063093A JP2015186947A JP2015186947A JP2017063093A JP 2017063093 A JP2017063093 A JP 2017063093A JP 2015186947 A JP2015186947 A JP 2015186947A JP 2015186947 A JP2015186947 A JP 2015186947A JP 2017063093 A JP2017063093 A JP 2017063093A
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notch
wiring board
insulating base
wiring conductor
wiring
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JP6698301B2 (en
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芳弘 中田
Yoshihiro Nakada
芳弘 中田
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Die Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board, an electronic device, and an electronic module.SOLUTION: A wiring board 1 includes: an insulating base substance 11 having a cutout part 12 opening on one major surface and a side surface; an inner surface electrode 13 provided on an inner surface of the cutout part 12; and a wiring conductor 14 positioned between the other major surface of the insulating base substance 11 and the cutout part 12 in a thickness direction of the insulating base substance 11 and disposed in a position that does not overlap with the cutout part 12 in a plane perspective view.SELECTED DRAWING: Figure 2

Description

本発明は、配線基板、電子装置および電子モジュールに関するものである。   The present invention relates to a wiring board, an electronic device, and an electronic module.

従来、配線基板は、複数の絶縁層からなる絶縁基体の内部または表面に配線導体が、また絶縁基体の側面から下面にかけて切欠き部およびその内面に配線導体に接続される内面電極が設けられたものがある。電子部品およびこのような配線基板を含む電子装置を半田等の接合材によって例えばモジュール用基板に接合する場合には、この内面電極が半田等の接合材を介してモジュール用基板に接合される。   Conventionally, a wiring board is provided with a wiring conductor inside or on the surface of an insulating base composed of a plurality of insulating layers, a notch from the side surface to the bottom surface of the insulating base, and an inner surface electrode connected to the wiring conductor on the inner surface. There is something. When an electronic component and an electronic device including such a wiring substrate are bonded to a module substrate, for example, by a bonding material such as solder, the inner surface electrode is bonded to the module substrate via a bonding material such as solder.

特開2002−158509号公報JP 2002-158509 A

近年、電子装置の小型化および薄型化が求められている。このような配線基板において、複数の絶縁層の厚みが小さくなり、配線導体が、絶縁基体の厚み方向において絶縁基体の上面と切欠き部との間に設けられ、平面透視で配線導体の端部を跨ぐように切欠き部と重なっていると、複数の絶縁層を積層する場合に、積層時の応力が配線導体、特に配線導体の端部および配線導体の端部の外側の部分に伝わりにくく、絶縁基体の上面と切欠き部との間における配線導体の端部の周辺に空隙が形成され、配線導体における電気的導通が不十分なものとなり、配線基板の電気的特性を低下させてしまうことが懸念される。   In recent years, there has been a demand for downsizing and thinning electronic devices. In such a wiring board, the thickness of the plurality of insulating layers is reduced, and the wiring conductor is provided between the upper surface of the insulating base and the notch in the thickness direction of the insulating base, and the end of the wiring conductor is seen through in plan view. If it overlaps with the notch so as to straddle, when laminating a plurality of insulating layers, the stress at the time of lamination is difficult to be transmitted to the wiring conductor, especially the end of the wiring conductor and the outside of the end of the wiring conductor In addition, a gap is formed around the end of the wiring conductor between the upper surface of the insulating base and the notch, resulting in insufficient electrical continuity in the wiring conductor, which degrades the electrical characteristics of the wiring board. There is concern.

本発明の一つの態様によれば、配線基板は、一方主面および側面に開口する切欠き部を有している絶縁基体と、前記切欠き部の内面に設けられた内面電極と、前記絶縁基体の厚み方向において前記絶縁基体の他方主面と前記切欠き部との間に位置しており、平面透視で前記切欠き部と重ならない箇所に配置された配線導体とを有している。   According to one aspect of the present invention, the wiring board includes an insulating base having a notch opening on one main surface and side surfaces, an inner surface electrode provided on an inner surface of the notch, and the insulating A wiring conductor is located between the other main surface of the insulating base and the notch in the thickness direction of the base, and is disposed at a location that does not overlap the notch in a plan view.

本発明の一つの態様によれば、電子装置は、上記構成の配線基板と、該配線基板に搭載され、前記内面電極に電気的に接続された電子部品とを有している。   According to one aspect of the present invention, an electronic device includes the wiring board having the above configuration and an electronic component that is mounted on the wiring board and electrically connected to the inner surface electrode.

本発明の一つの態様によれば、電子モジュールは、接続パッドを有するモジュール用基板と、前記接続パッドにはんだを介して接続された上記構成の電子装置とを有している。   According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device configured as described above connected to the connection pad via solder.

本発明の一つの態様による配線基板において、一方主面および側面に開口する切欠き部を有している絶縁基体と、切欠き部の内面に設けられた内面電極と、絶縁基体の厚み方向において絶縁基体の他方主面と切欠き部との間に位置しており、平面透視で切欠き部と重ならない箇所に配置された配線導体とを有している。このような構成により、複数の絶縁層を積層する場合に、積層時の応力が配線導体に良好に伝わり、配線導体の端部の周辺に空隙が形成されるのを抑制し、配線導体における電気的導通が良好なものとなって、配線基板の電気的特性が低下することを抑制することができる。   In a wiring board according to one aspect of the present invention, an insulating base having a notch opening on one main surface and side surfaces, an inner surface electrode provided on the inner surface of the notch, and a thickness direction of the insulating base It has a wiring conductor which is located between the other main surface of the insulating base and the notch, and is arranged at a location which does not overlap with the notch in plan view. With such a configuration, when a plurality of insulating layers are laminated, the stress at the time of lamination is transmitted well to the wiring conductor, and the formation of voids around the ends of the wiring conductor is suppressed. It is possible to suppress the deterioration of the electrical characteristics of the wiring board due to good electrical conduction.

本発明の一つの態様による電子装置は、上記構成の配線基板と、配線基板に搭載され、内面電極に電気的に接続された電子部品とを有していることによって、長期信頼性に優れ
た電子装置とすることができる。 An electronic device according to one aspect of the present invention has excellent long-term reliability by including a wiring board having the above-described configuration and an electronic component mounted on the wiring board and electrically connected to the inner surface electrode. It can be an electronic device.

本発明の一つの態様による電子モジュールは、接続パッドを有するモジュール用基板と、接続パッドにはんだを介して接続された上記構成の電子装置とを有していることによって、長期信頼性に優れたものとできる。   An electronic module according to an aspect of the present invention has excellent long-term reliability by including a module substrate having connection pads and the electronic device having the above-described configuration connected to the connection pads via solder. I can do it.

（ａ）は本発明の第１の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図１に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。(A) is an internal top view in the wiring board of the electronic device shown in FIG. 1, (b) is a principal part enlarged internal top view in the B section of (a). （ａ）は図１（ａ）に示した電子装置のＡ−Ａ線における断面図であり、（ｂ）は（ａ）のＣ部における要部拡大断面図である。(A) is sectional drawing in the AA of the electronic device shown to Fig.1 (a), (b) is a principal part expanded sectional view in the C section of (a). 図１における電子装置をモジュール用基板に実装した電子モジュールを示す縦断面図である。It is a longitudinal cross-sectional view which shows the electronic module which mounted the electronic device in FIG. 1 on the board | substrate for modules. （ａ）は本発明の第２の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). （ａ）は図５に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。(A) is an internal top view in the wiring board of the electronic device shown in FIG. 5, (b) is a principal part enlarged internal top view in the B section of (a). （ａ）は図５に示した電子装置の配線基板における他の絶縁層における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。(A) is an internal top view in the other insulating layer in the wiring board of the electronic device shown in FIG. 5, (b) is a principal part enlarged internal top view in the B section of (a). 図５（ａ）に示した電子装置のＡ−Ａ線における断面図である。It is sectional drawing in the AA of the electronic device shown to Fig.5 (a). （ａ）は、本発明の第３の実施形態における電子装置を示す上面図であり、（ｂ）は（ａ）の下面図である。(A) is a top view which shows the electronic device in the 3rd Embodiment of this invention, (b) is a bottom view of (a). （ａ）は、図９に示した電子装置の配線基板における内部上面図であり、（ｂ）は（ａ）のＢ部における要部拡大内部上面図である。(A) is an internal top view in the wiring board of the electronic device shown in FIG. 9, (b) is a principal part enlarged internal top view in the B section of (a). 図９（ａ）に示した電子装置のＡ−Ａ線における断面図である。It is sectional drawing in the AA of the electronic device shown to Fig.9 (a).

本発明のいくつかの例示的な実施形態について、添付の図面を参照しつつ説明する。   Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

（第１の実施形態）
本発明の第１の実施形態における電子装置は、図１〜図４に示すように、配線基板１と、配線基板１の上面に設けられた電子部品２とを含んでいる。電子装置は、図４に示すように、例えば電子モジュールを構成するモジュール用基板５上に接合材６を用いて接続される。 (First embodiment)
The electronic device according to the first embodiment of the present invention includes a wiring board 1 and an electronic component 2 provided on the upper surface of the wiring board 1 as shown in FIGS. As shown in FIG. 4, the electronic device is connected to a module substrate 5 constituting an electronic module, for example, using a bonding material 6.

本実施形態における配線基板１は、一方主面および側面に開口する切欠き部12を有している絶縁基体11と、切欠き部12の内面に設けられた内面電極13と、絶縁基体11の表面および内部に設けられた配線導体14とを有している。配線導体14は、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置されている。図１〜図３において、配線基板１および電子装置は仮想のｘｙｚ空間におけるｘｙ平面に実装されている。図１〜図３において、上方向とは、仮想のｚ軸の正方向のことをいう。なお、以下の説明における上下の区別は便宜的なものであり、実際に配線基板１等が使用される際の上下を限定するものではない。   The wiring board 1 according to the present embodiment includes an insulating base 11 having a notch 12 opened on one main surface and side surfaces, an inner surface electrode 13 provided on the inner surface of the notch 12, and an insulating base 11. The wiring conductor 14 is provided on the surface and inside. The wiring conductor 14 is located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, and is disposed at a location that does not overlap the notch 12 in a plan view. 1 to 3, the wiring board 1 and the electronic device are mounted on an xy plane in a virtual xyz space. 1-3, the upward direction refers to the positive direction of the virtual z-axis. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the wiring board 1 or the like is actually used.

絶縁基体11は、一方主面（図１〜図３では下面）および他方主面（図１〜図３では上面）と、側面とを有している。絶縁基体11は、複数の絶縁層11ａからなり、電子部品２の搭載領域を含む上面を有しており、平面視すなわち主面に垂直な方向から見ると矩形の板状の形状を有している。絶縁基体11は電子部品２を支持するための支持体として機能し、上
面中央部の搭載領域上に、電子部品２が低融点ろう材または導電性樹脂等の接合部材を介して接着されて固定される。 The insulating base 11 has one main surface (the lower surface in FIGS. 1 to 3), the other main surface (the upper surface in FIGS. 1 to 3), and a side surface. The insulating base 11 is composed of a plurality of insulating layers 11a, has an upper surface including a mounting area for the electronic component 2, and has a rectangular plate shape when viewed from a plan view, that is, a direction perpendicular to the main surface. Yes. The insulating base 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is bonded and fixed to the mounting area at the center of the upper surface via a bonding member such as a low melting point brazing material or a conductive resin. Is done.

絶縁基体11は、例えば、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，窒化珪素質焼結体、ムライト質焼結体またはガラスセラミックス焼結体等のセラミックスを用いることができる。絶縁基体11は、例えば酸化アルミニウム質焼結体である場合であれば、酸化アルミニウム（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダーおよび溶剤等を添加混合して泥漿物を作製する。この泥漿物を、従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを作製する。次に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、セラミックグリーンシートを複数枚積層して生成形体を形成し、この生成形体を高温（約1600℃）で焼成することによって絶縁基体11が製作される。 As the insulating base 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body are used. it can. If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, the ceramic green sheet is appropriately punched, and a plurality of ceramic green sheets are laminated to form a generated shape. The generated shape is fired at a high temperature (about 1600 ° C.), whereby the insulating substrate 11 is formed. Produced.

切欠き部12は、絶縁基体11の一方主面および側面に開口している。切欠き部12は、図１〜図３において、絶縁基体11の下側主面（下面）と側面とに開口しており、上側主面側（上面側）には開口しておらず、閉塞している。切欠き部12は、図１〜図３に示す例においては、平面視にて角部が円弧状の矩形状（四角形状）に形成されており、絶縁基体11の外辺に沿って長く形成されている。なお、切欠き部12は、平面視において、半円形状、半楕円形状または半長円形状、あるいは切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっていても構わない。このような切欠き部12は、絶縁基体11用のセラミックグリーンシートのいくつかに、レーザー加工または金型による打抜き加工等により、切欠き部12となる貫通孔を形成しておくことによって形成される。   The notch 12 opens on one main surface and side surface of the insulating base 11. 1 to 3, the notch 12 is opened on the lower main surface (lower surface) and the side surface of the insulating base 11, and is not opened on the upper main surface side (upper surface side). doing. In the example shown in FIGS. 1 to 3, the notch portion 12 is formed in a rectangular shape (rectangular shape) whose corners are arcuate in plan view, and is formed long along the outer side of the insulating base 11. Has been. The notch 12 is opened through a semicircular shape, a semi-elliptical shape, a semi-oval shape, or a notch having a width larger than the width of the notch 12 in a plan view, that is, a plurality of sizes. It doesn't matter if the notches overlap. Such notches 12 are formed by forming through holes to be the notches 12 in some of the ceramic green sheets for the insulating substrate 11 by laser machining or punching with a mold. The

内面電極13は、切欠き部12の内面に設けられている。配線導体14は、絶縁基体11の表面および内部に設けられている。主面電極15は、絶縁基体11の一方主面（図１〜図３では下面）に設けられている。なお、内面電極13と主面電極15とを含む構成で外部電極となっている。内面電極13と配線導体14とは、図３に示した例では、切欠き部12の奥底部で接続されている。内面電極13は、配線導体14との接続部において、断面視で内面電極13の端部を絶縁基体11の内部に0.05〜0.1ｍｍ程度の長さで延出させ、内面電極13と配線導体14とが
重なるように設けていても構わない。なお、内面電極13は、配線導体14との接続部だけでなく、平面視で切欠き部12を囲むように絶縁基体11の内部に内面電極13の端部を延出させてもよい。また、配線導体14は、内面電極13との接続部において、断面視で配線導体14の端部を切欠き部12の内面に0.01〜0.5ｍｍ程度の長さで延出させ、切欠き部12の奥底部に
おいて、内面電極13と配線導体14とが重なるように設けていても構わない。また、内面電極13と配線導体14とを互いに絶縁基体11の内部と切欠き部12とにそれぞれ延出させ、絶縁基体11の内部と切欠き部12の奥底部において内面電極13と配線導体14とが互いに重なるように設けていても構わない。このように、内面電極13または配線導体14を延出させ、内面電極13と配線導体14とが重なるように設けておくと、切欠き部12の奥底部近傍における内面電極13と配線導体14との接続を良好なものとし、内面電極13と配線導体14との間の電気的接続を良好なものとすることができる。内面電極13と主面電極15とを含む外部電極は、モジュール用基板５に接合するためのものである。内面電極13、配線導体14および主面電極15は、配線基板１に搭載された電子部品２とモジュール用基板５とを電気的に接続するためのものである。配線導体14は、絶縁基体11の表面または内部に設けられた配線導体14と、絶縁基体11を構成する絶縁層11ａを貫通して上下に位置する配線導体同士を電気的に接続する貫通導体とを含んでいる。 The inner surface electrode 13 is provided on the inner surface of the notch 12. The wiring conductor 14 is provided on the surface and inside of the insulating base 11. The main surface electrode 15 is provided on one main surface (the lower surface in FIGS. 1 to 3) of the insulating substrate 11. Note that the structure includes the inner surface electrode 13 and the main surface electrode 15 to form an outer electrode. In the example shown in FIG. 3, the inner surface electrode 13 and the wiring conductor 14 are connected at the bottom of the notch 12. The inner surface electrode 13 has an end portion of the inner surface electrode 13 extended to the inside of the insulating base 11 with a length of about 0.05 to 0.1 mm in a cross-sectional view at the connection portion with the wiring conductor 14, and the inner surface electrode 13 and the wiring conductor 14. And may be provided so as to overlap with each other. The inner surface electrode 13 may extend not only at the connection portion with the wiring conductor 14 but also at the end of the inner surface electrode 13 inside the insulating base 11 so as to surround the notch portion 12 in plan view. In addition, the wiring conductor 14 extends from the inner surface of the cutout portion 12 to the inner surface of the cutout portion 12 at a length of about 0.01 to 0.5 mm in the connection portion with the inner surface electrode 13. The inner surface electrode 13 and the wiring conductor 14 may be provided so as to overlap with each other at the bottom. Further, the inner surface electrode 13 and the wiring conductor 14 are extended to the inside of the insulating base 11 and the notch 12 respectively, and the inner surface electrode 13 and the wiring conductor 14 are formed inside the insulating base 11 and at the bottom of the notch 12. May be provided so as to overlap each other. Thus, if the inner surface electrode 13 or the wiring conductor 14 is extended so that the inner surface electrode 13 and the wiring conductor 14 overlap with each other, the inner surface electrode 13 and the wiring conductor 14 in the vicinity of the bottom of the notch 12 The electrical connection between the inner surface electrode 13 and the wiring conductor 14 can be improved. External electrodes including the inner surface electrode 13 and the main surface electrode 15 are for bonding to the module substrate 5. The inner surface electrode 13, the wiring conductor 14 and the main surface electrode 15 are for electrically connecting the electronic component 2 mounted on the wiring substrate 1 and the module substrate 5. The wiring conductor 14 includes a wiring conductor 14 provided on the surface or inside of the insulating base 11, and a through conductor that electrically connects the wiring conductors that are positioned above and below the insulating layer 11a constituting the insulating base 11. Is included.

内面電極13、配線導体14、主面電極15の材料は、例えばタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銀（Ａｇ）または銅（Ｃｕ）等を主成分とする金属粉末
メタライズである。例えば、絶縁基体11が酸化アルミニウム質焼結体から成る場合であれば、Ｗ，ＭｏまたはＭｎ等の高融点金属粉末に適当な有機バインダーおよび溶媒等を添加混合して得たメタライズペーストを、絶縁基体11用のセラミックグリーンシートに予めスクリーン印刷法によって所定のパターンに印刷塗布して、絶縁基体11用のセラミックグリーンシートと同時に焼成することによって、絶縁基体11の所定位置に被着形成される。内面電極13は、例えば、切欠き部12となる貫通孔の内側面となる領域に内面電極13用のメタライズペーストを印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。主面電極15は、絶縁基体11となるセラミックグリーンシートに主面電極15となるメタライズペーストを印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。配線導体14は、例えば、絶縁基体11用のセラミックグリーンシートに配線導体14用のメタライズペーストをスクリーン印刷法等の印刷手段によって印刷塗布し、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。また、配線導体14が貫通導体である場合は、例えば、絶縁基体11用のセラミックグリーンシートに金型またはパンチングによる打ち抜き加工またはレーザー加工等の加工方法によって貫通導体用の貫通孔を形成し、この貫通孔に貫通導体用のメタライズペーストを上記印刷手段によって充填しておき、絶縁基体11用のセラミックグリーンシートとともに焼成することによって形成される。メタライズペーストは、上述の金属粉末に適当な溶剤およびバインダーを加えて混練することによって、適度な粘度に調整して作製される。なお、絶縁基体11との接合強度を高めるために、ガラス粉末、セラミック粉末を含んでいても構わない。 The material of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 is, for example, metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu) or the like. It is. For example, if the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing an appropriate organic binder and solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired simultaneously with the ceramic green sheet for the insulating substrate 11 to be deposited on a predetermined position of the insulating substrate 11. The inner surface electrode 13 is formed, for example, by printing and applying a metallized paste for the inner surface electrode 13 in a region that becomes the inner surface of the through hole that becomes the notch 12 and firing it together with the ceramic green sheet for the insulating substrate 11. . The main surface electrode 15 is formed by printing and applying a metallized paste to be the main surface electrode 15 on the ceramic green sheet to be the insulating base 11, and firing it together with the ceramic green sheet for the insulating base 11. The wiring conductor 14 is formed, for example, by applying a metallized paste for the wiring conductor 14 to a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and baking it together with the ceramic green sheet for the insulating substrate 11. Is done. When the wiring conductor 14 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a die or punching process using punching or a laser processing method, and the like. The through hole is filled with a metallized paste for a through conductor by the above printing means and fired together with a ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

配線導体14は、図２および図３に示すように、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置されている。このような構成とすることによって、複数の絶縁層11ａを積層する場合に、積層時の応力が配線導体14に良好に伝わり、配線導体14の端部の周辺に空隙が形成されるのを抑制し、配線導体14における電気的導通が良好なものとなって、配線基板１の電気的特性が低下することを抑制することができる。すなわち、絶縁基体11用のセラミックグリーンシート同士を積層する際に、配線導体14用のメタライズペーストが平面透視で切欠き部12に重ならないように配置されているので、配線導体14用のメタライズペーストの周囲のセラミックグリーンシート同士の密着を良好なものとし、配線導体14の端部の周辺に空隙が形成されるのを抑制することができる。   As shown in FIGS. 2 and 3, the wiring conductor 14 is located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, and the notch 12 is seen through in plan view. It is placed in a place where it does not overlap. By adopting such a configuration, when a plurality of insulating layers 11a are laminated, the stress at the time of lamination is satisfactorily transmitted to the wiring conductor 14, and the formation of voids around the ends of the wiring conductor 14 is suppressed. In addition, the electrical continuity in the wiring conductor 14 is improved, and the electrical characteristics of the wiring board 1 can be prevented from deteriorating. That is, when the ceramic green sheets for the insulating substrate 11 are laminated, the metallized paste for the wiring conductor 14 is disposed so as not to overlap the notch 12 in a plan view. It is possible to improve the close contact between the surrounding ceramic green sheets and to suppress the formation of voids around the ends of the wiring conductors 14.

なお、配線導体14が絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置するとは、配線導体14が絶縁基体11の他方主面と切欠き12が設けられた絶縁層11ａとに挟まれた部分、すなわち切欠き部12が設けられていない絶縁層11ａ（絶縁基体11）の内部に設けられていることを示しており、他方主面に設けられた配線導体14については、平面透視で切欠き部12と重なる箇所に配置されていても構わない。絶縁基体11ａは、絶縁基体11の他方主面と切欠き部12との間に少なくとも２つの絶縁層11ａを有している。また、切欠き部12が設けられた絶縁層11ａ、あるいはこの絶縁層11ａに積層する絶縁層11ａに配線導体14が設けられた場合において、配線導体14は、内面電極13と接続するために平面透視で切欠き部12と重なる位置に設けられていても構わない。   Note that the wiring conductor 14 is located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, so that the wiring conductor 14 is provided with the other main surface of the insulating base 11 and the notch 12. The portion sandwiched between the insulating layers 11a, that is, the insulating layer 11a (insulating base 11) where the notch 12 is not provided is shown, and the other main surface is provided. The wiring conductor 14 may be disposed at a location that overlaps the notch portion 12 in plan perspective. The insulating base 11 a has at least two insulating layers 11 a between the other main surface of the insulating base 11 and the notch 12. Further, when the wiring conductor 14 is provided in the insulating layer 11a provided with the notch 12 or the insulating layer 11a laminated on the insulating layer 11a, the wiring conductor 14 is planar for connection with the inner surface electrode 13. You may provide in the position which overlaps with the notch part 12 by fluoroscopy.

また、配線導体14は、図２に示すように、平面透視で切欠き部12に沿った形状を有していると、配線導体14用のメタライズペーストと切欠き部12との間の配線導体14用のメタライズペーストの周囲のセラミックグリーンシート同士の密着を良好なものとし、絶縁基体11の他方主面と切欠き部12との間における配線導体14の端部の周辺に空隙が形成されるのを良好に抑制することができる。なお、平面透視で切欠き部12に沿った形状とは、平面透視において、切欠き部12の内壁と配線導体14の外縁とが平行に配置されていることを示している。なお、配線導体14が、図２に示すように、平面透視で切欠き部12の一部を取り囲む形状を有していると、配線導体14を配置する領域がより大きいものとなり、配線基板１
の電気的特性が向上しやすいものとなり好ましい。 In addition, as shown in FIG. 2, when the wiring conductor 14 has a shape along the cutout portion 12 in a plan view, the wiring conductor between the metallized paste for the wiring conductor 14 and the cutout portion 12 is used. The adhesion of the ceramic green sheets around the metallized paste for 14 is good, and a gap is formed around the end of the wiring conductor 14 between the other main surface of the insulating substrate 11 and the notch 12. Can be satisfactorily suppressed. In addition, the shape along the notch 12 in the plan view indicates that the inner wall of the notch 12 and the outer edge of the wiring conductor 14 are arranged in parallel in the plan view. As shown in FIG. 2, when the wiring conductor 14 has a shape surrounding a part of the notch 12 in a plan view, the area in which the wiring conductor 14 is disposed becomes larger, and the wiring board 1
It is preferable because the electrical characteristics of the material are easily improved.

なお、配線導体14と切欠き部12との間隔Ｗは、Ｗ≧50μｍとしておくと、配線導体14の端部の周辺に空隙が形成されるのをより良好に抑制することができる。なお、切欠き部12と配線導体14との間の絶縁層の厚みが150μｍ以下の場合に、良好に空隙が発生すること
を抑制することができる。 In addition, if the interval W between the wiring conductor 14 and the notch 12 is set to be W ≧ 50 μm, it is possible to better suppress the formation of a gap around the end of the wiring conductor 14. In addition, when the thickness of the insulating layer between the notch 12 and the wiring conductor 14 is 150 μm or less, it is possible to suppress the generation of a favorable gap.

内面電極13、配線導体14、主面電極15の絶縁基体11から露出する表面には、電気めっき法または無電解めっき法によって金属めっき層が被着される。金属めっき層は、ニッケル，銅，金または銀等の耐食性および接続部材との接続性に優れる金属から成るものであり、例えば厚さ0.5〜５μｍ程度のニッケルめっき層と0.1〜３μｍ程度の金めっき層とが、あるいは厚さ１〜10μｍ程度のニッケルめっき層と0.1〜１μｍ程度の銀めっき層とが、
順次被着される。これによって、内面電極13および配線導体14、主面電極15が腐食することを効果的に抑制できるとともに、配線導体14と電子部品２との固着および配線導体14とボンディングワイヤ等の接続部材３との接合、ならびに内面電極13および主面電極15とモジュール用基板５に形成された接続用の接続パッド51との接合を強固にできる。 A metal plating layer is applied to the surfaces of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 exposed from the insulating base 11 by electroplating or electroless plating. The metal plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, gold or silver and connectivity with the connection member. For example, a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold plating having a thickness of about 0.1 to 3 μm. A nickel plating layer having a thickness of about 1 to 10 μm and a silver plating layer having a thickness of about 0.1 to 1 μm,
Sequentially deposited. As a result, corrosion of the inner surface electrode 13, the wiring conductor 14, and the main surface electrode 15 can be effectively suppressed, and the wiring conductor 14 and the electronic component 2 can be fixed and the wiring conductor 14 and the connecting member 3 such as a bonding wire can be connected. And the connection between the inner surface electrode 13 and the main surface electrode 15 and the connection pad 51 for connection formed on the module substrate 5 can be strengthened.

また、金属めっき層は、ニッケルめっき層／金めっき層に限られるものではなく、ニッケルめっき層／金めっき層／銀めっき層、あるいはニッケルめっき層／パラジウムめっき層／金めっき層等を含むその他の金属めっき層であっても構わない。   In addition, the metal plating layer is not limited to the nickel plating layer / gold plating layer, but may include nickel plating layer / gold plating layer / silver plating layer or other nickel plating layer / palladium plating layer / gold plating layer. It may be a metal plating layer.

また、電子部品２が搭載される配線導体14上では、例えば上述のニッケルめっき層と金めっき層の下地層に、例えば、厚さ10〜80μｍ程度の銅めっき層を金属めっき層として被着させておくことにより、電子部品２の熱を銅めっき層を介して配線基板１側に良好に放熱させやすくしてもよい。   Further, on the wiring conductor 14 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of about 10 to 80 μm is deposited as a metal plating layer on the underlayer of the above-described nickel plating layer and gold plating layer, for example. Thus, the heat of the electronic component 2 may be easily radiated to the wiring substrate 1 side through the copper plating layer.

配線基板１の上面に電子部品２を搭載することによって、電子装置を作製できる。配線基板１に搭載される電子部品２は、ＩＣチップまたはＬＳＩチップ等の半導体素子，発光素子，水晶振動子または圧電振動子等の圧電素子および各種センサ等である。例えば、電子部品２がワイヤボンディング型の半導体素子である場合には、半導体素子は、低融点ろう材または導電性樹脂等の接合部材によって、配線導体14上に固定された後、ボンディングワイヤ等の接続部材３を介して半導体素子の電極と配線導体14とが電気的に接続されることによって配線基板１に搭載される。これにより、電子部品２は内面電極13に電気的に接続される。また、例えば電子部品２がフリップチップ型の半導体素子である場合には、半導体素子は、はんだバンプ、金バンプまたは導電性樹脂（異方性導電樹脂等）等の接続部材３を介して、半導体素子の電極と配線導体14とが電気的および機械的に接続されることによって配線基板１に搭載される。また、配線基板１には、複数の電子部品２を搭載してもよいし、必要に応じて、抵抗素子または容量素子等の小型の電子部品を搭載してもよい。また、電子部品２は必要に応じて、樹脂またはガラス等からなる封止材４を用いて、樹脂、ガラス、セラミックスまたは金属等からなる蓋体等により封止される。   By mounting the electronic component 2 on the upper surface of the wiring board 1, an electronic device can be manufactured. The electronic component 2 mounted on the wiring board 1 is a semiconductor element such as an IC chip or an LSI chip, a light emitting element, a piezoelectric element such as a crystal vibrator or a piezoelectric vibrator, and various sensors. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed onto the wiring conductor 14 by a bonding member such as a low melting point brazing material or a conductive resin, and then bonded to a bonding wire or the like. The electrode of the semiconductor element and the wiring conductor 14 are electrically connected via the connecting member 3 to be mounted on the wiring board 1. As a result, the electronic component 2 is electrically connected to the inner surface electrode 13. For example, when the electronic component 2 is a flip chip type semiconductor element, the semiconductor element is a semiconductor via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). The electrode of the element and the wiring conductor 14 are mounted on the wiring board 1 by being electrically and mechanically connected. In addition, a plurality of electronic components 2 may be mounted on the wiring board 1, or small electronic components such as a resistance element or a capacitor element may be mounted as necessary. Moreover, the electronic component 2 is sealed with a lid made of resin, glass, ceramics, metal, or the like, using a sealing material 4 made of resin, glass, or the like, as necessary.

本実施形態の電子装置の内面電極13を含む外部電極が、図４に示すように、モジュール用基板５の接続パッド51に半田等の接合材６を介して接続されて、電子モジュールとなる。接合材６は、切欠き部12内にて内面電極13に、また、絶縁基体11の下面にて主面電極15に接合されていることから、外部からの応力が加わった場合に、外部電極または接合材６にかかる応力を分散することが可能となる。また、接合材６は内面電極13の切欠き部12の内側の端部から接続パッド51の外側の端部にかけて広がるように傾斜している。このような構成とすることにより、取り扱い時の外力等によって電子装置に応力が発生しても、広がるように傾斜している接合材６によって応力が分散されるものとなり、電子装置がモジュール用基板５に強固に接続されるものとなって、接続信頼性が向上した電子モジュール
とすることができる。この場合に、平面透視すなわち他方主面に垂直な方向から透視すると、接続パッド51の外側の端部は内面電極13の切欠き部12の内側の端部よりも外側に位置している。また、接続パッド51の内側の端部は主面電極15の内側の端部と同等の箇所に位置している。 As shown in FIG. 4, the external electrodes including the inner surface electrode 13 of the electronic device of this embodiment are connected to the connection pads 51 of the module substrate 5 via the bonding material 6 such as solder to form an electronic module. Since the bonding material 6 is bonded to the inner surface electrode 13 in the notch 12 and to the main surface electrode 15 on the lower surface of the insulating base 11, the external electrode is applied when an external stress is applied. Alternatively, the stress applied to the bonding material 6 can be dispersed. The bonding material 6 is inclined so as to spread from the inner end of the notch 12 of the inner surface electrode 13 to the outer end of the connection pad 51. By adopting such a configuration, even if stress is generated in the electronic device due to an external force or the like during handling, the stress is dispersed by the bonding material 6 that is inclined so as to spread. Thus, an electronic module with improved connection reliability can be obtained. In this case, when seen through in a plan view, that is, seen from a direction perpendicular to the other main surface, the outer end portion of the connection pad 51 is positioned outside the inner end portion of the notch portion 12 of the inner surface electrode 13. Further, the inner end of the connection pad 51 is located at the same position as the inner end of the main surface electrode 15.

本実施形態の配線基板１によれば、一方主面および側面に開口する切欠き部12を有している絶縁基体11と、切欠き部12の内面に設けられ、内面電極13と、絶縁基体11の厚み方向において、絶縁基体11の他方主面と切欠き部12との間に位置しており、平面透視で切欠き部12と重ならない箇所に配置された配線導体14とを有している。このような構成により、複数の絶縁層11ａを積層する場合に、積層時の応力が配線導体14に良好に伝わり、配線導体14の端部の周辺に空隙が形成されるのを抑制し、配線導体14における電気的導通が良好なものとなって、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring board 1 of the present embodiment, the insulating base 11 having the cutout portion 12 opened on one main surface and the side surface, the inner surface electrode 13 provided on the inner surface of the cutout portion 12, the insulating base 11 in the thickness direction, between the other main surface of the insulating base 11 and the notch 12, and having a wiring conductor 14 disposed at a location that does not overlap the notch 12 in a plan view. Yes. With such a configuration, when laminating a plurality of insulating layers 11a, the stress during lamination is satisfactorily transmitted to the wiring conductor 14, and the formation of voids around the ends of the wiring conductor 14 is suppressed. It is possible to suppress the electrical characteristics of the wiring board 1 from being deteriorated due to good electrical continuity in the conductor 14.

本実施形態における配線基板１は、小型で高出力の電子装置において好適に使用することができ、配線基板１における電気的接続を良好に図ることができる。例えば、電子部品２として、高発光の発光素子を搭載する発光素子搭載用の小型の配線基板１として好適に用いることができる。   The wiring board 1 in the present embodiment can be suitably used in a small and high-power electronic device, and electrical connection in the wiring board 1 can be favorably achieved. For example, the electronic component 2 can be suitably used as a small-sized wiring board 1 for mounting a light emitting element on which a high light emitting element is mounted.

（第２の実施形態）
次に、本発明の第２の実施形態による電子装置について、図５〜図８を参照しつつ説明する。 (Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

本発明の第２の実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる点は、配線導体14は、絶縁基体11の厚み方向に複数の箇所で設けられており、これらの配線導体14は、切欠き部12側の外縁が平面透視で互いに重ならない箇所に配置されている点である。なお、本発明の第２の実施形態における配線基板１では、図６に示した絶縁層11ａは、図７に示した絶縁層11ａよりも絶縁基体11の上面側に設けられている。   The electronic device according to the second embodiment of the present invention is different from the electronic device according to the first embodiment described above in that the wiring conductor 14 is provided at a plurality of locations in the thickness direction of the insulating base 11. The wiring conductor 14 is arranged at a location where the outer edges on the side of the notch 12 do not overlap each other in a plan view. In the wiring substrate 1 according to the second embodiment of the present invention, the insulating layer 11a shown in FIG. 6 is provided on the upper surface side of the insulating base 11 with respect to the insulating layer 11a shown in FIG.

本発明の第２の実施形態における配線基板１によれば、第１の実施形態の配線基板１と同様に、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring substrate 1 in the second embodiment of the present invention, it is possible to suppress the formation of a gap around the end portion of the wiring conductor 14 as in the case of the wiring substrate 1 in the first embodiment. It can suppress that the electrical property of the wiring board 1 falls.

なお、これらの配線導体14において、切欠き部12側の外縁が平面透視で互いに重ならない箇所に配置されているとは、それぞれの配線導体14の切欠き部12側の外縁が平面透視で重ならないようにずれて配置されているものであり、切欠き部12に沿って設けられているとより好ましい。配線導体14は、図６では、平面透視において、切欠き部12の長辺側の内壁に沿って設けている。   In these wiring conductors 14, the outer edges on the notch portion 12 side are arranged at positions where they do not overlap with each other in a plan view. This means that the outer edges on the notch portion 12 side of each wiring conductor 14 overlap in a plan view. More preferably, they are arranged so as not to become misaligned and are provided along the notch 12. In FIG. 6, the wiring conductor 14 is provided along the inner wall on the long side of the notch 12 in a plan view.

第２の実施形態の配線基板１において、切欠き部12は、図５に示すように、切欠き部12が切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっている。このような場合においても、配線導体14は、絶縁基体11の厚み方向において絶縁基体11の一方主面と切欠き部12との間に位置しており、平面透視で切欠き部12を含む切欠きと重ならない箇所に配置されている。   In the wiring substrate 1 of the second embodiment, the notch 12 is opened through the notch having a width larger than the width of the notch 12, as shown in FIG. Notches of multiple sizes overlap. Even in such a case, the wiring conductor 14 is located between the one main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, and includes the notch 12 in plan view. It is placed in a place that does not overlap with the notch.

また、絶縁基体11の厚み方向において絶縁基体11の他方主面と切欠き部12との間に位置しており、絶縁基体11の厚み方向に複数の箇所で設けられている配線導体14のうち、絶縁基体11の厚み方向において切欠き部12に近い側の配線導体14は、切欠き部12側から離れている側の配線導体14よりも、平面透視にて切欠き部12との間隔が離れて切欠き部12に沿って設けられていると、配線導体14が絶縁基体11の厚み方向に複数の箇所で設けられている場合においても、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、
配線基板１の電気的特性が低下することを抑制することができる。 Among the wiring conductors 14 that are located between the other main surface of the insulating base 11 and the notch 12 in the thickness direction of the insulating base 11, and are provided at a plurality of locations in the thickness direction of the insulating base 11 The wiring conductor 14 on the side close to the notch 12 in the thickness direction of the insulating base 11 has a larger distance from the notch 12 in plan perspective than the wiring conductor 14 on the side far from the notch 12. If the wiring conductor 14 is provided along the notch 12 at a distance, a gap is formed around the end of the wiring conductor 14 even when the wiring conductor 14 is provided at a plurality of locations in the thickness direction of the insulating base 11. Can be suppressed,
It can suppress that the electrical property of the wiring board 1 falls.

第２の実施形態の配線基板１は、上述の第１の実施形態の配線基板１と同様の製造方法を用いて製作することができる。   The wiring board 1 of the second embodiment can be manufactured using the same manufacturing method as the wiring board 1 of the first embodiment described above.

（第３の実施形態）
次に、本発明の第３の実施形態による電子装置について、図９〜図11を参照しつつ説明する。 (Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIGS.

本発明の第３の実施形態における電子装置において、上記した第１の実施形態の電子装置と異なる点は、電子部品２の搭載面と同じ他方主面（以下、上面ともいう）と側面とに開口している切欠き部12（12ａ）と配線基板１の一方主面（以下、下面）と側面とに開口している切欠き部12（12ｂ）を有している点である。第３の実施形態の配線基板１において、絶縁基体11の内部に設けられた配線導体14は、平面透視で切欠き部12と重ならない箇所に設けられている。   The electronic device according to the third embodiment of the present invention differs from the electronic device according to the first embodiment described above in the other main surface (hereinafter also referred to as the upper surface) and side surfaces that are the same as the mounting surface of the electronic component 2. The notch 12 (12a) that is open and the notch 12 (12b) that is open on one main surface (hereinafter, lower surface) and side surface of the wiring board 1 are provided. In the wiring board 1 of the third embodiment, the wiring conductor 14 provided inside the insulating base 11 is provided at a location that does not overlap the notch portion 12 in a plan view.

本発明の第３の実施形態における配線基板１によれば、第１の実施形態の配線基板１と同様に、配線導体14の端部の周辺に空隙が形成されるのを抑制することができ、配線基板１の電気的特性が低下することを抑制することができる。   According to the wiring substrate 1 in the third embodiment of the present invention, it is possible to suppress the formation of a gap around the end portion of the wiring conductor 14 as in the case of the wiring substrate 1 in the first embodiment. It can suppress that the electrical property of the wiring board 1 falls.

第３の実施形態の配線基板１において、絶縁基体11の上面側に設けられた切欠き部12ａと下面側に設けられた切欠き部12ｂは、平面視において同じ大きさおよび同じ形状であっても良いし、図９〜図11に示すように、平面視において、大きさを異ならせても良い。また、平面視において切欠き部12ａの形状と切欠き部12ｂの形状とを異ならせても良い。例えば、一方の切欠き部12を、平面視にて角部が円弧状の矩形状（四角形状）に形成し、他方の切欠き部12を、切欠き部12が切欠き部12の幅より大きい幅の切欠きを介して開口されている、すなわち複数の大きさの切欠きが重なっている形状に形成してもよい。なお、一方の切欠き部12が、平面視において、他方の切欠き部12よりも大きくなるようにしておき、互いの切欠き部12の内壁同士が重ならないようにしておくことが好ましい。例えば、図９および図10に示した例では、絶縁基体11の下面側の切欠き部12ｂが、絶縁基体11の上面側の切欠き部12ａよりも大きくなっている。 第３の実施形態の配線基板１のように、絶縁基体11の上面側および下面側とに切欠き部12が設けられている場合、絶縁基体11内部に設けられている配線導体14は、平面透視にて大きい形状の切欠き部12に沿って設けられることが好ましい。   In the wiring board 1 of the third embodiment, the notch 12a provided on the upper surface side of the insulating base 11 and the notch 12b provided on the lower surface side have the same size and the same shape in plan view. Alternatively, as shown in FIGS. 9 to 11, the sizes may be different in plan view. Further, the shape of the notch 12a and the shape of the notch 12b may be different in plan view. For example, one notch portion 12 is formed in a rectangular shape (rectangular shape) with corners arcuate in plan view, and the other notch portion 12 is formed so that the notch portion 12 is larger than the width of the notch portion 12. You may form in the shape opened through the notch of a large width, ie, the shape where the notch of a some size has overlapped. In addition, it is preferable that one notch portion 12 is larger than the other notch portion 12 in plan view so that inner walls of the notch portions 12 do not overlap each other. For example, in the example shown in FIGS. 9 and 10, the notch 12 b on the lower surface side of the insulating base 11 is larger than the notch 12 a on the upper surface side of the insulating base 11. When the cutout portions 12 are provided on the upper surface side and the lower surface side of the insulating base 11 as in the wiring substrate 1 of the third embodiment, the wiring conductor 14 provided in the insulating base 11 is planar. It is preferably provided along the notch 12 having a large shape as seen through.

また、図９〜図11に示した例では、絶縁基体11の上面側に設けられた切欠き部12ａと絶縁基体11の下面側に設けられた切欠き部12ｂのそれぞれに内面電極13を設けているが、絶縁基体11の上面側の切欠き部12のみまたは絶縁基体11の下面側の切欠き部12のみに内面電極13を設けた配線基板１であっても構わない。   Further, in the example shown in FIGS. 9 to 11, the inner surface electrode 13 is provided in each of the notch portion 12 a provided on the upper surface side of the insulating substrate 11 and the notch portion 12 b provided on the lower surface side of the insulating substrate 11. However, it may be the wiring board 1 in which the inner surface electrode 13 is provided only in the notch 12 on the upper surface side of the insulating base 11 or only in the notch 12 on the lower surface side of the insulating base 11.

第３の実施形態の配線基板１は、第１の実施形態と同様に、小型で高出力の電子装置において好適に使用することができ、配線基板１における電気的接続を良好に図ることができる。例えば、電子部品２として、高発光の発光素子を搭載する発光素子搭載用の小型の配線基板１として好適に用いることができる。   Similar to the first embodiment, the wiring board 1 of the third embodiment can be suitably used in a small and high-power electronic device, and electrical connection in the wiring board 1 can be favorably achieved. . For example, the electronic component 2 can be suitably used as a small-sized wiring board 1 for mounting a light emitting element on which a high light emitting element is mounted.

第３の実施形態の配線基板１は、上述の第１の製造方法または第２の製造方法と同様の製造方法を用いて製作することができる。   The wiring board 1 of the third embodiment can be manufactured using a manufacturing method similar to the first manufacturing method or the second manufacturing method described above.

本発明は、上述の実施の形態の例に限定されるものではなく、種々の変更は可能である。上述の例では、切欠き部12および内面電極13は、絶縁基体11の対向する２側面にそれぞ
れ１つずつ設けた例を示しているが、切欠き部12および内面電極13を絶縁基体11の４側面全てに設けた配線基板１、あるいは複数の切欠き部12および内面電極13をそれぞれの辺に設けた配線基板１であってもよい。また、図１〜図11に示す例では、絶縁基体11は、３層または４層の絶縁層11ａから形成しているが、５層以上の絶縁層11ａからなるものであっても構わない。 The present invention is not limited to the above-described embodiments, and various modifications can be made. In the above-described example, the notch portion 12 and the inner surface electrode 13 are each provided on the two opposing side surfaces of the insulating base 11, but the notch portion 12 and the inner surface electrode 13 are provided on the insulating base 11. The wiring board 1 may be provided on all four side surfaces, or the wiring board 1 may be provided with a plurality of notches 12 and inner surface electrodes 13 on each side. In the example shown in FIGS. 1 to 11, the insulating base 11 is formed of three or four insulating layers 11a, but may be formed of five or more insulating layers 11a.

また、図９および図10に示すように、配線基板１は、配線導体14に挟まれるように設けられた金属層16、電子部品搭載層17および中央端子層18等の配線以外の導体を有していても構わない。例えば、これらの導体は、上述の内面電極13、配線電極14および主面電極15と同様の材料および方法によって製作することができ、露出する表面には、内面電極13、配線導体14および主面電極15と同様の金属めっき層が被着されている。電子部品搭載層17は、例えば電子部品２の搭載用に用いられ、中央端子層18は、例えば内面電極13および主面電極15と同様に、モジュール用基板５との接合に用いられる。また、図９に示すように、中央端子層18についても、切欠き部12の内面に設けられた内面電極13に接続させていても構わない。   9 and 10, the wiring board 1 has conductors other than wiring such as a metal layer 16, an electronic component mounting layer 17 and a central terminal layer 18 provided so as to be sandwiched between the wiring conductors 14. It does not matter. For example, these conductors can be manufactured by the same material and method as the above-described inner surface electrode 13, wiring electrode 14, and main surface electrode 15, and the exposed surface includes the inner surface electrode 13, wiring conductor 14, and main surface. A metal plating layer similar to the electrode 15 is applied. The electronic component mounting layer 17 is used for mounting the electronic component 2, for example, and the central terminal layer 18 is used for bonding to the module substrate 5 similarly to the inner surface electrode 13 and the main surface electrode 15, for example. Further, as shown in FIG. 9, the center terminal layer 18 may also be connected to the inner surface electrode 13 provided on the inner surface of the notch 12.

また、絶縁基体11の他方主面と切欠き部12との間に、絶縁基体11の厚み方向において配線導体14が設けられた絶縁層11ａ間とは異なる絶縁層11ａ間に、配線導体14と同様な方法により製作された金属層が設けられている場合、金属層は、配線導体14と同様に、平面透視で切欠き部12と重ならない箇所に配置されていることが好ましい。また、第２の実施形態の配線基板１のように、配線導体14の切欠き部12側の外縁と金属層の切欠き部12側の外縁とが平面透視で重ならないようにずれて配置されていると好ましい。なお、この場合においても、絶縁基体11の厚み方向において、配線導体14または金属層のうち、切欠き部12に近く設けられている導体が、平面透視にて切欠き部12との間隔が離れて切欠き部12に沿って設けられていると好ましい。   In addition, between the other main surface of the insulating base 11 and the notch 12, between the insulating layer 11 a different from the insulating layer 11 a provided with the wiring conductor 14 in the thickness direction of the insulating base 11, When the metal layer manufactured by the same method is provided, it is preferable that the metal layer is disposed at a location that does not overlap the notch portion 12 in a plan view as in the case of the wiring conductor 14. Further, like the wiring board 1 of the second embodiment, the outer edge of the wiring conductor 14 on the side of the notch 12 and the outer edge of the metal layer on the side of the notch 12 are shifted so as not to overlap with each other in a plan view. It is preferable. Even in this case, in the thickness direction of the insulating base 11, the conductor provided near the notch 12 in the wiring conductor 14 or the metal layer is spaced apart from the notch 12 in a plan view. It is preferable that the groove is provided along the notch 12.

また、第２の実施形態の配線基板１においては、配線導体14は、絶縁層11ａを貫通する貫通導体により主面電極15に直接接続されている。このような構成を、第１、第３の実施形態の配線基板１に適用しても構わない。   In the wiring substrate 1 of the second embodiment, the wiring conductor 14 is directly connected to the main surface electrode 15 by a through conductor that penetrates the insulating layer 11a. Such a configuration may be applied to the wiring board 1 of the first and third embodiments.

また、第１〜第３の実施形態における配線基板１は、それぞれ平板状の配線基板１であっても構わないし、主面に電子部品２が収容されるキャビティを有する配線基板１であっても構わない。また、第１、第３の実施形態における配線基板１においては、第２の実施形態における配線基板１のように、切欠き部12を複数の大きさの切欠き部12が重なった形状としても構わないし、金属層16、電子部品搭載層17および中央端子層18を備えていても構わない。   Moreover, the wiring board 1 in the first to third embodiments may be a flat wiring board 1 or a wiring board 1 having a cavity in which the electronic component 2 is accommodated in the main surface. I do not care. Further, in the wiring substrate 1 in the first and third embodiments, the notch portion 12 may have a shape in which the notch portions 12 having a plurality of sizes overlap each other as in the wiring substrate 1 in the second embodiment. Alternatively, the metal layer 16, the electronic component mounting layer 17, and the central terminal layer 18 may be provided.

また、上述の例では、配線基板１には、１つの電子部品２が搭載されているが、複数の電子部品２、例えば、複数の発光素子が搭載される発光素子搭載用の配線基板１であっても構わない。   In the above example, one electronic component 2 is mounted on the wiring board 1, but the wiring board 1 for mounting a plurality of electronic components 2, for example, a plurality of light emitting elements, is mounted. It does not matter.

また、配線基板１は多数個取り配線基板の形態で製作されていてもよい。   Further, the wiring board 1 may be manufactured in the form of a multi-piece wiring board.

１・・・・配線基板
11・・・・絶縁基体
11ａ・・・絶縁層
12・・・・切欠き部
13・・・・内面電極
14・・・・配線導体
15・・・・主面電極
16・・・・金属層
17・・・・電子部品搭載層
18・・・・中央端子層
２・・・・電子部品
３・・・・接続部材
４・・・・封止材
５・・・・モジュール用基板
51・・・・接続パッド
６・・・・接合材 1 ... Wiring board
11 ... Insulating substrate
11a ... Insulating layer
12 .... Notch
13 ... Inner electrode
14 ... Wiring conductor
15 ... Main surface electrode
16 ... Metal layer
17 ... Electronic component mounting layer
18 ... Central terminal layer 2 ... Electronic component 3 ... Connection member 4 ... Sealing material 5 ... Module substrate
51 ··· Connection pad 6 ··· Bonding material

Claims (5)

一方主面および側面に開口する切欠き部を有している絶縁基体と、
前記切欠き部の内面に設けられた内面電極と、
前記絶縁基体の厚み方向において前記絶縁基体の他方主面と前記切欠き部との間に位置しており、平面透視で前記切欠き部と重ならない箇所に配置された配線導体とを有していることを特徴とする配線基板。 On the other hand, an insulating substrate having a notch opening on the main surface and side surfaces;
An inner surface electrode provided on the inner surface of the notch,
A wiring conductor located between the other main surface of the insulating base and the notch in the thickness direction of the insulating base and arranged at a location not overlapping the notch in a plan view. A wiring board characterized by comprising: 前記配線導体は、平面透視で前記切欠き部に沿った形状を有していることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the wiring conductor has a shape along the notch in a plan view. 前記配線導体は、前記絶縁基体の厚み方向に複数の箇所で設けられており、
前記切欠き部側の外縁が平面透視で互いに重ならない箇所に配置されていることを特徴とする請求項１に記載の配線基板。 The wiring conductor is provided at a plurality of locations in the thickness direction of the insulating base,
The wiring board according to claim 1, wherein the outer edge on the side of the notch is disposed at a location where the outer edges do not overlap with each other in a plan view. 請求項１に記載の配線基板と、
該配線基板に搭載され、前記内面電極に電気的に接続された電子部品とを有することを特徴とする電子装置。 The wiring board according to claim 1;
And an electronic component mounted on the wiring board and electrically connected to the inner surface electrode. 接続パッドを有するモジュール用基板と、
前記接続パッドにはんだを介して接続された請求項４に記載の電子装置とを有することを特徴とする電子モジュール。 A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 4, wherein the electronic device is connected to the connection pad via solder.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110622300A (en) * 2017-05-26 2019-12-27 京瓷株式会社 Electronic component mounting substrate, electronic device, and electronic module
CN112586092A (en) * 2018-08-28 2021-03-30 京瓷株式会社 Wiring substrate and electronic device

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JP2005159183A (en) * 2003-11-27 2005-06-16 Kyocera Corp Manufacturing method of electronic apparatus
JP2013247337A (en) * 2012-05-29 2013-12-09 Kyocera Corp Coil built-in wiring board and electronic apparatus
JP2014127678A (en) * 2012-12-27 2014-07-07 Kyocera Corp Wiring board and electronic device

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Publication number Priority date Publication date Assignee Title
JP2005159183A (en) * 2003-11-27 2005-06-16 Kyocera Corp Manufacturing method of electronic apparatus
JP2013247337A (en) * 2012-05-29 2013-12-09 Kyocera Corp Coil built-in wiring board and electronic apparatus
JP2014127678A (en) * 2012-12-27 2014-07-07 Kyocera Corp Wiring board and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110622300A (en) * 2017-05-26 2019-12-27 京瓷株式会社 Electronic component mounting substrate, electronic device, and electronic module
CN110622300B (en) * 2017-05-26 2024-03-12 京瓷株式会社 Substrate for mounting electronic component, electronic device, and electronic module
CN112586092A (en) * 2018-08-28 2021-03-30 京瓷株式会社 Wiring substrate and electronic device

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