JP2005159183A - Manufacturing method of electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic apparatus which can attain an electronic apparatus having higher connection reliability by effectively preventing generation of burrs at the time of dividing a mother substrate. <P>SOLUTION: The manufacturing method of an electronic apparatus comprising the step of preparing for the mother substrate 1 which is defined into a plurality of substrate regions arranged like a matrix, and includes a recess 3 which is formed at least on one main surface bridging over the boundary of adjacent substrate regions and allows deposition, at the internal surface thereof, of a conductor pattern 2 which will become an external terminal, and thereafter mounting an electronic component element 4 to each substrate region of the other main surface of the mother substrate 1; the step of closely depositing one main surface of the mother substrate 1 and a resin material 7 to an adhesive sheet 8 by placing the mother substrate 1 on the adhesive sheet 8; and the step of dividing the mother substrate 1 for a plurality of electronic apparatuses corresponding one to one to the substrate region by cutting the mother substrate 1, together with the conductor pattern 2, from the other main surface of the mother substrate 1 using a dicer 9 along the external circumference of each substrate region. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing an electronic device used by being incorporated in a communication device such as a mobile phone or a personal computer, or an electronic device.

  2. Description of the Related Art Conventionally, electronic devices including various electric circuits have been used in communication devices such as mobile phones, electronic devices, and the like.

  FIG. 3 is a perspective view of the electronic device, and FIG. 4 is a cross-sectional view of the electronic device shown in FIG. This electronic device includes a laminated body 50 formed by laminating a plurality of insulator layers. A wiring pattern 51 for signal wiring and ground wiring is formed in the laminated body 50, and the wiring pattern 51 is electrically connected to the wiring pattern 51. A predetermined electric circuit is configured by mounting the electronic component element 52 connected to the upper surface of the laminate 50.

  In addition, at the four corners of the lower surface of the laminate 50, cutout portions 54 are formed on the inner surface of which a conductor pattern 53 serving as an external electrode terminal is attached. The notch 54 becomes a space for accommodating solder when the electronic device is mounted on an external wiring board such as a mother board and soldered. In addition, a fillet is formed by the solder that melts the conductive pattern 53 attached to the notch 54 rising, so that the bonding strength between the electronic device and the external wiring board can be maintained well. Can be made.

  As the above-described conventional method for manufacturing an electronic device, a multi-piece method is used in which individual electronic devices are obtained by dividing a large mother substrate partitioned into a plurality of substrate regions.

  Specifically, a mother board divided into a plurality of board regions is prepared, and a concave portion is formed on one main surface of the mother board with a conductor pattern serving as an external terminal electrode attached to the inner surface. An electronic component element such as a semiconductor element or a piezoelectric element is mounted on the other main surface of the mother board.

Next, the mother board is placed on the adhesive sheet, and with one main surface of the mother board in close contact with the adhesive sheet, a dicer from the other main surface side of the mother board along the outer periphery of each substrate area. A plurality of electronic devices can be obtained by cutting the mother substrate (see, for example, Patent Document 1).
JP 2003-174258 A

  However, in the above-described conventional method for manufacturing an electronic device, the mother board is placed on the adhesive sheet with the one main surface side where the recess is formed facing the adhesive sheet. An enclosed cavity region will be formed.

  When the dicer reaches the cavity region when the mother substrate is cut from the other main surface side by the dicer, the insulator layer extruded by the dicer and the conductor pattern for the external electrode terminal deposited on the inner surface of the concave portion are dicered. Is bent in the pushing direction, that is, the inner surface side of the recess, thereby forming a burr. When such burrs exist, when soldering the electronic device to the external wiring board, the rising of the molten solder is hindered by the burrs, and the fillet formation is insufficient. As a result, there is a drawback that the bonding strength between the electronic device and the external wiring board cannot be maintained well, and the connection reliability of the electronic device is lowered.

  The present invention has been devised in view of the above disadvantages, and an object of the present invention is to effectively prevent the generation of burrs when dividing the mother board, and to obtain an electronic device with high connection reliability. It is to provide a method for manufacturing an apparatus.

  The method for manufacturing an electronic device according to the present invention is divided into a plurality of substrate regions arranged in a matrix, and is formed on at least one main surface so as to straddle a boundary between adjacent substrate regions and on an inner surface. Preparing a mother board having a concave portion to which a conductor pattern to be an external terminal electrode is attached, and then mounting an electronic component element on each board region of the other main surface of the mother board; and Filling and curing the liquid resin material in the recess, placing the mother board on the pressure-sensitive adhesive sheet, and bringing the main surface of the mother board and the resin material into close contact with the pressure-sensitive adhesive sheet; and The mother board is cut with a dicer from the other main surface side of the mother board along the outer periphery of each board area together with the conductor pattern, thereby forming the mother board into a plurality of electronic devices corresponding to the board area. Dividing step C; And it is characterized in Mukoto.

  According to the method for manufacturing an electronic device of the present invention, the recess formed on the mother board is filled with a resin material and cured, and then the mother board is placed on the adhesive sheet. The area surrounded by the sheet is filled with resin. Therefore, when dividing the mother board using a dicer, the conductor layer for the external electrode terminals on the insulator layer and the inner surface of the recess is not bent to the inner surface side of the recess by the dicer, and it is effective to generate burrs in this portion. Can be prevented. Accordingly, when the electronic device is soldered to an external wiring board such as a mother board, the molten solder smoothly crawls along the conductor pattern for the external electrode. As a result, a good fillet can be formed, the connection strength between the electronic device and the external wiring board can be kept high, and the connection reliability of the electronic device can be improved.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 4 is a perspective view of an electronic device manufactured by the manufacturing method of the present invention, and FIG. 2 is a cross-sectional view of the electronic device shown in FIG. The electronic device shown in FIG. 1 includes a laminated body 21 formed by laminating a plurality of insulator layers. The wiring pattern 21 for signal wiring and ground wiring is formed inside the laminated body 21, and the wiring pattern 21 is formed. A predetermined electric circuit is configured by mounting the electronic component element 4 electrically connected to the upper surface of the laminate 21.

  In addition, at the four corners of the lower surface of the laminate 21, notches 24 having external electrode terminals 23 attached to the inner surface are formed. As shown in FIG. 3, the notch 24 becomes a space for accommodating the solder 25 when the electronic device is mounted on an external wiring board 26 such as a mother board and soldered. Also, the solder 25 that melts the conductor pattern 23 deposited on the notch 24 is scooped up so that a fillet 25a is formed. This increases the bonding strength between the electronic device and the external wiring board 26. It can be held well.

  Next, a method for manufacturing the electronic device described above will be described with reference to FIG.

(Process A)
First, as shown in FIG. 4A, the inner surface is partitioned into a plurality of substrate regions arranged in a matrix, and is formed on at least one main surface so as to straddle the boundary between adjacent substrate regions. Then, a mother board 1 having a recess 3 on which a conductor pattern 2 to be an external terminal electrode is attached is prepared, and then an electronic component element 4 is mounted on each board region on the other main surface of the mother board 1.

  The mother board 1 is composed of a large laminate 6 in which a plurality of insulator layers 6a to 6c are laminated with a wiring pattern 5 such as signal wiring or signal wiring interposed therebetween. For example, the large laminate 6 includes a signal wiring and a ground on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic binder, organic solvent, etc. to a ceramic material powder made of glass-ceramic, alumina ceramic or the like. A conductor paste to be a wiring pattern 5 such as wiring is printed and applied in a predetermined pattern by screen printing or the like known in the art, and a plurality of these are laminated, press-molded, and then fired at a high temperature.

  The recess 3 formed on one main surface of the mother board 1 has a through hole formed in advance in the ceramic green sheet to be the lowermost insulator layer 6c of the large laminate 6 by punching or the like. It is formed by laminating. Furthermore, a conductor pattern 2 to be an external terminal electrode is formed by printing and applying a conductor paste on the inner surface of the recess 3 and firing it simultaneously with the ceramic green sheet.

  Examples of the conductive paste material for the wiring pattern 5 and the conductive pattern 2 include Ag-based powders such as Ag, Ag-Pd, and Ag-Pt, borosilicate-based low-melting glass frit, organic binders such as ethyl cellulose, organic A mixture of solvents is used.

  The large laminate 6 thus obtained has a substrate region arranged in a matrix, that is, in a matrix of vertical m columns × horizontal n rows (m and n are natural numbers of 2 or more), The mother board 1 is completed by mounting various electronic component elements 4 such as semiconductor elements and crystal vibration elements on each substrate region of the other main surface of the large laminate 6.

  In the present embodiment, as shown in FIG. 5, a predetermined discard area 10 is provided between the substrate areas arranged in a matrix, and a marking 11 is provided at a predetermined position of the discard area. Has been. This marking 11 is for recognizing the cutting position when cutting the mother substrate 1 in step C described later.

(Process B)
Next, as shown in FIG. 4 (b), the liquid resin material 7 is filled in the recess 3 of the mother board 1 and cured, and the mother board is placed on the adhesive sheet 8 to be cured. And the resin material 7 are adhered to the pressure-sensitive adhesive sheet 8.

  As the resin material 7, for example, an acrylic resin or the like is used, and a liquid resin material obtained by adding and mixing a curing agent, a curing accelerator, and other inorganic fillers as necessary to the precursor is used. It is formed in the recess by applying it in the recess by a screen printing method or the like, and curing and polymerizing it by heat treatment. In addition, when apply | coating a liquid resin material by printing as mentioned above, it is preferable to set the viscosity to 200-300 dPa * s.

  Further, before the liquid resin material 7 is cured, air mixed in the resin or between the resin material 7 and the recess 3 is removed in a vacuum state so that the inner surface of the recess 3 and the resin material 7 are more closely adhered to each other. Can be made. At that time, since a dent may be formed on the exposed surface of the resin material, in this case, the exposed surface of the resin material 7 and the main surface of the mother board 1 are filled first so that they are flush with each other. It is preferable to apply the liquid resin material 7 once more on the resin material 7. The mother substrate 1 is stably placed on the adhesive sheet 8 by filling the recess 3 with the resin material 7 so that the exposed surface of the resin material 7 and one main surface of the mother substrate 1 are on the same plane. Can be made.

  In this way, the mother board 1 coated with the resin material 7 in the recess 3 is fixed to the pressure-sensitive adhesive sheet 8 with one main surface thereof being in close contact with the pressure-sensitive adhesive sheet 8. The pressure-sensitive adhesive sheet 8 has adhesiveness, and fixes the mother substrate 1 on the stage of the dicing apparatus, and prevents the divided pieces from scattering when the mother substrate 1 is divided in the process C described later. It is for keeping.

(Process C)
Finally, as shown in FIG. 4 (c), the mother board 1 is cut by the dicer 9 from the other main surface side of the mother board 1 along the outer periphery of each board area together with the conductor pattern 2. 1 is divided into a plurality of electronic devices corresponding one-to-one with the substrate region.

  The mother substrate 1 is cut by recognizing the cutting position by reading the marking attached to the surrogate area 10 with an image recognition device, and then cutting the matrix board 1 in a matrix along the outer periphery of each substrate area. Thus, a plurality of electronic devices as shown in FIG. 1 can be obtained simultaneously.

  In this cutting operation, when the dicer 9 reaches the region surrounded by the concave portion 3 and the adhesive sheet 8, the region is filled with the resin material 7, so that the insulation pushed out by the dicer 9 is used. Since the conductor pattern for the external electrode terminal attached to the inner surface of the body layer or the recess is scraped by the dicer without being bent toward the inner surface of the recess, it is possible to effectively prevent the occurrence of burrs. Thus, when soldering the electronic device to an external wiring substrate such as a mother board, the fillet can be satisfactorily formed without hindering the rising of the molten solder. As a result, the connection strength between the electronic device and the external wiring board is maintained in a good state, and an electronic device with high connection reliability can be provided.

  Further, when the electronic device is peeled from the adhesive sheet 8, the resin material 7 is attached to the adhesive sheet 8 side and is removed from the concave portion 3 of the electronic device.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, after mounting the electronic component element 4 in the above-described step A, a shield cover may be attached so as to cover the electronic component element 4 in each substrate region. When attaching the shield cover, the shield cover may be individually attached to each substrate region, but it is preferable to use a large mother cover in consideration of productivity. Specifically, first, as shown in FIG. 6 (a), the mother cover 12 having a plurality of receiving recesses 13 corresponding to the substrate region is placed in the receiving recesses in the electronic component elements 4 of each substrate region. Is attached to the mother board 1 in such a manner as to be arranged. Next, as shown in FIG. 6B, the mother cover 12 and the mother cover 12 together with the mother substrate 1 are simultaneously cut using a dicer 9, whereby the electronic device with the shield cover 14 attached thereto is manufactured.

  In addition to attaching the shield cover 14 in the process A as described above, the electronic component element 4 may be covered with a resin material. In this case, after the electronic component element 4 is mounted on the mother board 1, a liquid resin material is applied so as to cover the electronic component element 4 over the entire substrate area, and the resin material applied together with the mother board 1 is used with the dicer 9. By cutting, an electronic device in which the electronic component element 4 is covered with a resin material is manufactured.

  In the above-described embodiment, the large laminate 6 is manufactured using a ceramic material. Instead, the large laminate 6 may be manufactured using a resin material such as a photosensitive resin. Absent. In this case, since the insulating layer made of a resin material has a lower hardness than the insulating layer made of ceramic and can be cut relatively easily, there is an advantage that the workability of the cutting work is improved.

It is a perspective view of the electronic device manufactured by the manufacturing method of this invention. FIG. 2 is a cross-sectional view of the electronic device shown in FIG. FIG. 2 is a cross-sectional view showing a state where the electronic device shown in FIG. 1 is mounted on an external wiring board. (A)-(c) is sectional drawing for demonstrating the manufacturing method which concerns on one Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning one Embodiment of this invention. (A) And (b) is sectional drawing for demonstrating the manufacturing method concerning other embodiment of this invention. It is a perspective view of the conventional electronic device. FIG. 8 is a cross-sectional view of the electronic device shown in FIG. 7.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board 2 ... Conductor pattern 3 ... Recessed part 4 ... Electronic component element 5 ... Wiring pattern 6 ... Large-sized laminated body 6a-6c ... Insulator layer 7 ... Resin material 8 ... Adhesive sheet 9 ... Dicer 10 ... Disposal area 11 ... Marking

Claims (1)

It is divided into a plurality of substrate regions arranged in a matrix, and is formed on at least one main surface so as to straddle the boundary between adjacent substrate regions, and a conductor pattern serving as an external terminal electrode is attached to the inner surface. Preparing a mother board having a concave portion formed, and then mounting the electronic component element on each substrate region of the other main surface of the mother board, and
The concave portion of the mother board is filled with a liquid resin material and cured, and the mother board is placed on the adhesive sheet so that the main surface of the mother board and the resin material are in close contact with the adhesive sheet. Step B,
The mother board is cut with a dicer from the other principal surface side of the mother board along the outer periphery of each board area together with the conductor pattern, thereby forming the mother board into a plurality of electronic devices corresponding to the board area. A method for manufacturing an electronic device, comprising: a step C of dividing.

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