JP2017112270A - Substrate for mounting electronic component, electronic device and electronic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component, an electronic device and an electronic module excellent in longterm reliability.SOLUTION: A substrate 1 for mounting an electronic component has an insulating substrate 11 of rectangular shape, in the plan view, having a first recess 12 opening to the principal surface and mounting an electronic component (first electronic component 21) and a second recess 13 for mounting other electronic component (second electronic component 22). In the plan view, the first recess 12 is provided in the center of the insulating substrate 11, and the second recess 13 is provided at a corner of the insulating substrate 11. The first recess 12 is rectangular, and the second recess 13 is triangular or rectangular. The side surface of the first recess 12 on the second recess 13 side is parallel with the side surface of the second recess 13 on the first recess 12 side.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component mounting substrate, an electronic device, and an electronic module.

  2. Description of the Related Art Conventionally, an electronic component mounting board and an electronic device in which an electronic component and other electronic components are mounted on a main surface of an insulating substrate are known (for example, see Patent Document 1).

  In such an electronic element mounting substrate, the insulating substrate has a recess for storing and mounting electronic components on the upper surface.

JP 2004-363185 A

  However, in recent years, there has been a demand for miniaturization of electronic devices, and the insulating substrate of the electronic element mounting substrate has become smaller. When a plurality of recesses are arranged on the insulating substrate, the thickness of the side wall sandwiched between the recesses Is getting smaller. When the electronic device is operated, the heat of the electronic component is difficult to be transmitted to the outside from the concave portion arranged in the central portion, and the heat is hardly diffused to the outside, and is sandwiched between the concave portion arranged in the central portion and other concave portions. There is a concern that the side wall is distorted, and a crack is generated in the side wall sandwiched between the concave portion disposed in the central portion and the other concave portion.

  According to one aspect of the present invention, the electronic component mounting substrate has a rectangular shape in plan view, having an opening in the main surface and having a first recess for mounting the electronic component and a second recess for mounting the other electronic component. In a plan view, the first recess is provided at the center of the insulating substrate, the second recess is provided at a corner of the insulating substrate, and the first recess is The rectangular shape and the second recess are triangular or rectangular, and the side surface of the first recess on the second recess side is parallel to the side surface of the second recess on the first recess side.

  According to one aspect of the present invention, an electronic device includes an electronic component mounting board having the above-described configuration, an electronic component mounted in the first recess, and another electronic component mounted in the second recess. Have.

  According to one aspect of the present invention, an electronic module includes a module substrate having a connection pad, and the electronic device configured as described above connected to the connection pad via solder.

In the electronic component mounting substrate according to one aspect of the present invention, the insulating substrate having a rectangular shape in plan view, having a first recess for mounting the electronic component and a second recess for mounting the other electronic component on the main surface. In plan view, the first recess is provided at the center of the insulating substrate, the second recess is provided at the corner of the insulating substrate, the first recess is rectangular, and the second recess is triangular. It has a shape or a rectangular shape, and the side surface on the second recess side in the first recess and the side surface on the first recess side in the second recess are parallel. With the above configuration, the corner of the first recess is located on the outer edge side of the insulating substrate in plan view, and when the electronic device is operated, the heat of the electronic component is easily transmitted to the outside through the first recess. It becomes easy to dissipate to the outside and can be excellent in long-term reliability. Also, the thickness of the side wall sandwiched between the first recess and the second recess can be increased, and when the electronic device is operated, the first recess and the second recess are expanded even if the insulating substrate attempts to expand due to the heat of the electronic component. It becomes difficult to produce distortion in the side wall sandwiched between the two recesses, and it is possible to suppress the occurrence of cracks in the side wall sandwiched between the first recess and the second recess.

  In the electronic device according to one aspect of the present invention, the electronic device mounting board having the above-described configuration, the electronic component mounted in the first recess, and the other electronic component mounted in the second recess can be used for a long time. An electronic device with excellent reliability can be obtained.

  The electronic module according to one aspect of the present invention has excellent long-term reliability by including the module substrate having connection pads and the electronic device having the above-described configuration connected to the connection pads via solder. Can be.

(A) is a top view which shows the electronic device in the 1st Embodiment of this invention, (b) is a bottom view of (a). (A) is a longitudinal cross-sectional view in the AA line of the electronic device shown to Fig.1 (a), (b) is a longitudinal cross-sectional view in the BB line. It is a longitudinal cross-sectional view which shows the electronic module which mounted the electronic device in FIG. 1 on the board | substrate for modules. (A) is a top view which shows the electronic device in the 2nd Embodiment of this invention, (b) is a bottom view of (a). (A) is sectional drawing in the AA line of the electronic device shown to Fig.4 (a), (b) is sectional drawing in a BB line. It is a principal part enlarged top view in the C section of Drawing 4 (a). (A) And (b) is a longitudinal cross-sectional view of the electronic device in the 3rd Embodiment of this invention. It is a top view which shows the electronic device in the 4th Embodiment of this invention.

  Several exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
As shown in FIGS. 1 to 3, the electronic device according to the first embodiment of the present invention is mounted on the electronic component mounting substrate 1 and the first recess 12 and the second recess 13 of the electronic component mounting substrate 1. Electronic component 2 (first electronic component 21 and second electronic component 22). As shown in FIG. 3, the electronic device is connected to a module substrate 5 constituting an electronic module, for example, using solder 6.

  The electronic component mounting substrate 1 according to the present embodiment has an opening in the main surface (upper surface), and includes a first recess 12 for mounting the electronic component (first electronic component 21) and another electronic component (second electronic component 22). An insulating substrate 11 having a second recess 13 to be mounted and having a rectangular shape in plan view is provided. The first recess 12 has a rectangular shape in plan view, and is provided at the center of the insulating substrate 11. The second recess 13 has a triangular shape or a rectangular shape in plan view, and is provided at a corner of the insulating substrate 11. The electronic component mounting substrate 1 has a wiring conductor 14 provided on the main surface and inside of the insulating substrate 11. 1 to 3, the electronic component mounting board 1 and the electronic device are mounted on an xy plane in a virtual xyz space. 1-3, the upward direction refers to the positive direction of the virtual z-axis. In addition, the upper and lower distinction in the following description is for convenience, and does not limit the upper and lower when the electronic component mounting board 1 or the like is actually used.

The insulating substrate 11 has one main surface (upper surface in FIGS. 1 to 3), the other main surface (lower surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers, and has an opening on one main surface, and mounts a first recess 12 for mounting an electronic component (first electronic component 21) and another electronic component (second electronic component 22). The second concave portion 13 has a rectangular plate shape when seen from a plan view, that is, a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2, and the electronic component 2 is solder bumps and gold bumps on the mounting region on the bottom surface of the first recess 12 and on the mounting region on the bottom surface of the second recess 13. Or it adhere | attaches and fixes through the connection members 3, such as conductive resin (anisotropic conductive resin etc.).

For the insulating substrate 11, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body is used. it can. If the insulating substrate 11 is an aluminum oxide sintered body, for example, a raw material powder such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. A suitable organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this mud into a sheet using a conventionally known doctor blade method or calendar roll method. Next, an appropriate punching process is performed on the ceramic green sheet, and a plurality of ceramic green sheets are laminated to form a generated shape, and the generated shape is fired at a high temperature (about 1600 ° C.), whereby the insulating substrate 11 is formed. Produced.

  The first recess 12 is provided on one main surface of the insulating substrate 11. The first recess 12 is for mounting the first electronic component 21 on the bottom surface. A wiring conductor 14 for electrical connection with the first electronic component 21 is led out to the bottom surface of the first recess 12. Similarly to the first recess 12, the second recess 13 is provided on one main surface of the insulating substrate 11. The second recess 13 is for mounting the second electronic component 22 on the bottom surface. A wiring conductor 14 for electrical connection with the second electronic component 22 is led out to the bottom surface of the second recess 13. The first recess 12 has a rectangular shape in plan view, and is provided at the center of the insulating substrate 11. The first recess 12 is arranged such that the side surface of the first recess 12 is inclined with respect to the outer side of the insulating substrate 11 in a plan view. In the example shown in FIG. In contrast, it is arranged in a direction inclined by 45 °. Here, the shape of the first recess 12 may be a rectangular shape having corners provided in an arc shape in plan view. The second recess 13 has a triangular shape or a rectangular shape in plan view, and is provided at a corner of the insulating substrate 11. In the example shown in FIG. 1, the second recess 13 has a rectangular shape in plan view, and is provided at the four corners on the right side of the insulating substrate 11. Further, the shape of the second recess 13 may be a triangular shape or a rectangular shape with corners provided in an arc shape in plan view. Further, the triangular shape or the rectangular shape may be a shape having a protruding portion partially in plan view. The side surface of the first recess 12 on the second recess 13 side and the side surface of the second recess 13 on the first recess 12 side are parallel as shown in FIG.

  For example, the first recess 12 and the second recess 13 have through-holes that become the first recess 12 or the second recess 13 formed on some of the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a mold, or the like. It can be formed by forming each ceramic green sheet and laminating this ceramic green sheet on another ceramic green sheet in which no through hole is formed.

  The wiring conductor 14 is provided on the main surface and inside of the insulating substrate 11. The wiring conductor 14, together with the external electrode 12, electrically connects the electronic component 2 (the first electronic component 21 and the second electronic component 22) mounted on the electronic component mounting substrate 1 and the module substrate 5. Is. The wiring conductor 14 includes a wiring conductor 14 provided on the surface or inside of the insulating substrate 11, and a through conductor that electrically connects the wiring conductors 14 positioned above and below through the insulating layer constituting the insulating substrate 11. Is included.

  The wiring conductor 14 is a metal powder metallization mainly composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu), or the like. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing an appropriate organic binder and solvent to a refractory metal powder such as W, Mo or Mn is insulated. The ceramic green sheet for the substrate 11 is preliminarily printed and applied in a predetermined pattern by a screen printing method, and is fired at the same time as the ceramic green sheet for the insulating substrate 11 to be deposited on a predetermined position of the insulating substrate 11. The wiring conductor 14 is formed, for example, by applying a metallized paste for the wiring conductor 14 to a ceramic green sheet for the insulating substrate 11 by printing means such as a screen printing method, and baking together with the ceramic green sheet for the insulating substrate 11. Is done. Further, when the wiring conductor 14 is a through conductor, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a die or punching process using punching or a laser processing method. It is formed by filling the through hole with a metallized paste for through conductors by the printing means and firing together with the ceramic green sheet for the insulating substrate 11. The metallized paste is prepared by adjusting an appropriate viscosity by adding an appropriate solvent and binder to the above metal powder and kneading. In order to increase the bonding strength with the insulating substrate 11, glass powder or ceramic powder may be included.

A metal plating layer is applied to the surface exposed from the insulating substrate 11 of the wiring conductor 14 by electroplating or electroless plating. The metal plating layer is made of a metal excellent in corrosion resistance such as nickel, copper, gold or silver and connectivity with the connection member 3, and has a thickness of 0.5 to 5 μm, for example.
m nickel plating layer and 0.1-3 μm gold plating layer, or thickness 1-10 μm
A nickel plating layer of about m and a silver plating layer of about 0.1 to 1 μm are sequentially deposited. As a result, corrosion of the wiring conductor 14 can be effectively suppressed, the wiring conductor 14 and the electronic component 2 are fixed, the wiring conductor 14 is bonded to the connection member 3 such as a bonding wire, and the wiring conductor 14 and the module. The connection with the connection pads 41 formed on the substrate 4 can be strengthened.

  In addition, the metal plating layer is not limited to the nickel plating layer / gold plating layer, but may include nickel plating layer / gold plating layer / silver plating layer or other nickel plating layer / palladium plating layer / gold plating layer. It may be a metal plating layer.

  Further, on the wiring conductor 14 on which the electronic component 2 is mounted, for example, a copper plating layer having a thickness of about 10 to 80 μm is deposited as a metal plating layer on the underlayer of the above-described nickel plating layer and gold plating layer, for example. Thus, the heat of the electronic component 2 may be easily radiated to the electronic component mounting substrate 1 side through the copper plating layer.

By mounting the first electronic component 21 on the bottom surface of the first recess 12 of the electronic component mounting substrate 1 and mounting the second electronic component 22 on the bottom surface of the second recess 13 of the electronic component mounting substrate 1, an electronic device is obtained. Can be produced. The first electronic component 21 mounted on the electronic component mounting substrate 1 is a light receiving element, an imaging element, a light emitting element, a semiconductor element such as an IC chip or an LSI chip, and the second electronic component 22 is a light emitting element, a resistor, or the like. An element, a capacitive element, a Zener diode, or the like. For example, when a light receiving element is used as the first electronic component 21, a light emitting element is used as the second electronic component 22. For example, when the electronic component 2 is a flip-chip type semiconductor element, the semiconductor element is connected to the semiconductor element via a connection member 3 such as a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin or the like). The electrode and the wiring conductor 14 are mounted on the electronic component mounting board 1 by being electrically and mechanically connected. For example, when the electronic component 2 is a wire bonding type semiconductor element, the semiconductor element is fixed on the wiring conductor 14 by a bonding member such as a low melting point brazing material or a conductive resin, and then bonded to the bonding wire. The electrode of the semiconductor element and the wiring conductor 14 are electrically connected via the connecting member 3 such as the electronic component mounting board 1. Thereby, the electronic component 2 is electrically connected to the external electrode 12. Moreover, the electronic component 2 is sealed with a lid made of resin, glass, ceramics, metal, or the like, using a sealing material made of resin, glass, or the like, if necessary.

  As shown in FIG. 3, the wiring conductor 14 of the electronic device of this embodiment is connected to the connection pad 41 of the module substrate 4 via the solder 5 as shown in FIG.

  Further, in a plan view, a pair of corners located diagonally in the first recess 12 is provided on a virtual straight line (first virtual straight line 11a) perpendicular to a pair of opposing sides of the insulating substrate 11. Therefore, the corner region of the insulating substrate 11 can be widened without unevenness, and the second recess 13 can be provided in a wide region of the corner of the insulating substrate 11, so that the first recess 12 and the first recess 2 When the distance between the recess 13 is increased and the electronic device is operated, the heat of the second electronic component 22 can be prevented from being transmitted to the first electronic component 21 side of the insulating substrate 11, and the electronic component is mounted. It can suppress that the joint reliability of the board | substrate 1 and the electronic component 2 falls.

  The second recess 13 is provided at each of a plurality of corners of the insulating substrate 11, and is provided at a position where each corner of the first recess 12 is sandwiched between the plurality of second recesses 13 in plan view. Since the distance between the corner of the first recess 12 and the corner of the second recess 13 can be increased, the insulating substrate 11 is heated by the heat of the electronic component 2 when the electronic device is operated. Even if it is going to expand, the portion sandwiched between the corner of the first recess 12 and the corner of the second recess 13 is less likely to be distorted, and is sandwiched between the corner of the first recess 12 and the corner of the second recess 13. It can suppress well that a crack arises in a part.

  The electronic component mounting substrate 1 of the present embodiment is opened in the main surface, and the first recess 12 for mounting the electronic component (first electronic component 21) and the other electronic component (second electronic component 22) are mounted. It has a rectangular insulating substrate 11 having two recesses 13 in plan view. In plan view, the first recess 12 is provided at the center of the insulating substrate 11, and the second recess 13 is a corner of the insulating substrate 11. The first recess 12 is rectangular and the second recess 13 is triangular or rectangular, the side surface of the first recess 12 on the second recess 13 side, and the first recess in the second recess 13. The side surface on the 12th side is parallel. With the above configuration, the corner of the first recess 12 is positioned on the outer edge side of the insulating substrate 11 in plan view, and when the electronic device is operated, the heat of the electronic component (first electronic component 21) is the first. It becomes easy to be transmitted to the outside through the recess 12 and easily diffused to the outside, and can be excellent in long-term reliability. Further, the thickness of the side wall sandwiched between the first recess 12 and the second recess 13 can be increased, and even if the insulating substrate 11 is expanded due to the heat of the electronic component 2 when the electronic device is operated. The side wall sandwiched between the first recess 12 and the second recess 13 is less likely to be distorted, and the side wall sandwiched between the first recess 12 and the second recess 12 can be prevented from cracking.

  When an optical element such as a light receiving element is used as the first electronic component 21, heat transfer from the second electronic component 22 to the insulating substrate 11 around the first electronic component 21 is suppressed, and the optical element such as the light receiving element Can receive external light well.

  Further, as in the example shown in FIG. 1, the wiring conductor 14 provided on the other main surface of the insulating substrate 11 is larger than the second recess 13 and overlaps with the second recess 13 in plan view. When the electronic device is operated, the heat of the second electronic component 22 mounted in the second recess 13 is transferred to the module substrate 4 side via the wiring conductor 14 when the electronic device is operated. The heat dissipation to the side surface side of the insulating substrate 11 of the first electronic component 21 can be improved, and the insulating substrate 11 around the corner portion of the first recess 12 can be prevented from being distorted, It can suppress that a crack arises in the insulating substrate between the corner | angular part of the recessed part 12, and the 2nd recessed part 12. FIG.

The electronic device according to the present embodiment includes the electronic component mounting substrate 1 having the above-described configuration, an electronic component (first electronic component 21) mounted in the first recess 12, and another electronic component mounted in the second recess 13. By having (second electronic component 22), it is possible to provide an electronic device having excellent long-term reliability.

  The electronic module of the present embodiment has excellent long-term reliability by including the module substrate 4 having the connection pads 41 and the electronic device having the above-described configuration connected to the connection pads 41 via the solder 5. Can be.

  The electronic component mounting board 1 in the present embodiment can be suitably used in a small and high-power electronic device, and the connection reliability in the electronic component mounting board 1 can be enhanced. For example, a light receiving element can be used as the first electronic component 21, and the small electronic component mounting substrate 1 in which a light emitting element can be used as the second electronic component 22.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described with reference to FIGS.

  The electronic device according to the second embodiment of the present invention differs from the electronic device according to the first embodiment described above in that the second recess 13 is triangular in plan view, and the three side surfaces of the second recess 13 are the same. However, it is a point parallel to the side surface of the first recess 12 and the two side surfaces of the insulating substrate 11. In the second embodiment, the second recess 13 has a right triangle shape with corners arcuate in plan view.

  According to the electronic component mounting substrate 1 in the second embodiment of the present invention, the corners of the first recess 12 are on the outer edge side of the insulating substrate 11 in plan view, like the wiring substrate 1 in the first embodiment. When the electronic device is operated, the heat of the electronic component (the first electronic component 21) is easily transmitted to the outside through the first recess 12 and is easily dissipated to the outside. It can be excellent. Further, the thickness of the side wall sandwiched between the first recess 12 and the second recess 13 can be increased, and even if the insulating substrate 11 is expanded due to the heat of the electronic component 2 when the electronic device is operated. The side wall sandwiched between the first recess 12 and the second recess 13 is less likely to be distorted, and the side wall sandwiched between the first recess 12 and the second recess 12 can be prevented from cracking.

  The second recess 13 has three side surfaces. One side surface of the second concave portion 13 is formed in parallel to the side surface of the first concave portion 13 on the second concave portion 13 side, and the two side surfaces of the second concave portion 13 are respectively connected to the outer side surface of the insulating substrate 11. They are formed in parallel. With this configuration, in addition to the above, the thickness of the portion sandwiched between the second recess 13 and the side surface of the insulating substrate 11 can be increased, and when the electronic device is operated, the electronic component 2, particularly the second recess Even if the insulating substrate 11 is about to expand due to the heat of the second electronic component 22 mounted on the base plate 13, the second recess 13 and the insulating substrate 11 are less likely to be distorted. It is possible to suppress the occurrence of cracks in the portion sandwiched between the 11 side surfaces.

Further, as in the example shown in FIGS. 4 and 6, in a plan view, the second recess 13 is located on the inner side of the virtual straight line (second virtual straight line 11 b) connecting the respective side surfaces on the outer edge side of the insulating substrate 11. Since the respective corners of the first recess 12 are positioned, the first recess 12 and the first electronic component 21 mounted in the first recess 12 in the plan view are large in size. The thickness of the portion sandwiched between the corner of the first recess 12 and the side surface of the insulating substrate 11 can be increased, and is mounted on the electronic component 2, particularly the first recess 12 when the electronic device is operated. Even if the insulating substrate 11 expands due to the heat of the first electronic component 21, the corner of the first recess 12 and the portion sandwiched between the side surfaces of the insulating substrate 11 are less likely to be distorted. Suppresses the occurrence of cracks in the portion sandwiched between the sides of the insulating substrate 11 It is possible. In this case, the side surface of the first recess 12 on the second recess 13 side is formed longer than the side surface of the second recess 13 on the first recess 12 side.

  The electronic component mounting board 1 of the second embodiment can be manufactured using the same manufacturing method as the electronic component mounting board 1 of the first embodiment described above.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described with reference to FIG. FIG. 7A is a longitudinal sectional view corresponding to the same position as the line AA of the electronic device of the above-described embodiment, and FIG. 7B is a line BB of the electronic device of the above-described embodiment. It is a longitudinal cross-sectional view equivalent to the same position.

  The electronic device according to the third embodiment of the present invention differs from the electronic device according to the above-described embodiment in that the depth of the first recess 12 and the depth of the second recess 13 are different.

  According to the electronic component mounting substrate 1 in the third embodiment of the present invention, the corners of the first recess 12 are located on the outer edge side of the insulating substrate 11 in plan view, as in the first embodiment. When the electronic device is operated, the heat of the electronic component (first electronic component 21) is easily transmitted to the outside through the first recess 12 and easily dissipated to the outside, and has excellent long-term reliability. can do. Further, the thickness of the side wall sandwiched between the first recess 12 and the second recess 13 can be increased, and even if the insulating substrate 11 is expanded due to the heat of the electronic component 2 when the electronic device is operated. The side wall sandwiched between the first recess 12 and the second recess 13 is less likely to be distorted, and the side wall sandwiched between the first recess 12 and the second recess 12 can be prevented from cracking.

  Further, as in the example shown in FIG. 7, when the second recess 13 disposed at the corner of the insulating substrate 11 is smaller in depth than the first recess 12, when the electronic device is operated, Even if the insulating substrate 11 tends to expand due to the heat of the electronic component 2, the distortion on the outer peripheral side of the insulating substrate 11 is reduced, and between the first recess 12 and the second recess 12 or between the second recess 13 and the insulating substrate 11. It can suppress that a crack arises between.

  The electronic component mounting substrate 1 of the third embodiment can be manufactured using the same manufacturing method as the electronic component mounting substrate 1 of the first embodiment described above.

(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described with reference to FIG.

  The electronic device according to the third embodiment of the present invention is different from the electronic device according to the above-described embodiment in that the first recess 12 has protrusions 121 at the corners in plan view.

  According to the electronic component mounting substrate 1 of the fourth embodiment of the present invention, the corners of the first recess 12 are on the outer edge side of the insulating substrate 11 in a plan view, like the wiring substrate 1 of the first embodiment. When the electronic device is operated, the heat of the electronic component (the first electronic component 21) is easily transmitted to the outside through the first recess 12 and is easily dissipated to the outside. It can be excellent. Further, the thickness of the side wall sandwiched between the first recess 12 and the second recess 13 can be increased, and even if the insulating substrate 11 is expanded due to the heat of the electronic component 2 when the electronic device is operated. The side wall sandwiched between the first recess 12 and the second recess 13 is less likely to be distorted, and the side wall sandwiched between the first recess 12 and the second recess 12 can be prevented from cracking.

Further, as in the example shown in FIG. 8, the first recess 12 has the first recess 12 without substantially increasing the outer shape of the first recess 12 if the first recess 12 has a protrusion 121 at a corner in plan view. The first electronic component 21 having a large outer shape can be mounted as a device that easily suppresses contact between the corner of the electronic component 21 and the corner of the first recess 12.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner when viewed in a plan view. For example, a notch may be provided between the side surface of the insulating substrate 11 and the one main surface, and a so-called castellation conductor in which the wiring conductor 14 is extended to the inner surface of the notch may be provided.

  Moreover, in the example shown in FIGS. 1-7, although the 1st recessed part 12 and the 2nd recessed part 13 have the side wall formed in the vertical shape in the longitudinal cross sectional view, the 1st recessed part 12 or the 2nd recessed part 13 is In the longitudinal sectional view, the side wall may be a stepped recess having an opening side wider than the bottom side. Further, the first recess 12 or the second recess 13 may be a recess whose size on the opening side of the recess is smaller than the size on the bottom surface side of the recess when seen in a plan view.

  The electronic component mounting board 1 may be manufactured in the form of a multi-piece electronic component mounting board.

1 .... Electronic component mounting board
11 ... Insulating substrate
11a ... 1st virtual straight line
11b ... 2nd virtual straight line
12 ··· First recess
13 ... Second recess
14 ... Wiring conductor 2 ... Electronic components
21 ... 1st electronic component
22 ... Second electronic component 3 ... Connection member 4 ... Module substrate
41 ... Connection pads 5 ... Solder

Claims (6)

It has a rectangular insulating substrate in plan view, having a first recess for mounting an electronic component and a second recess for mounting another electronic component, which is open on the main surface.
In a plan view, the first recess is provided at a central portion of the insulating substrate, and the second recess is provided at a corner of the insulating substrate,
The first recess has a rectangular shape and the second recess has a triangular shape or a rectangular shape, and a side surface of the first recess on the second recess side is parallel to a side surface of the second recess on the first recess side. An electronic component mounting board characterized by the above.   The pair of corners positioned diagonally in the first recess in a plan view is provided on a virtual straight line that intersects perpendicularly with a pair of opposing sides of the insulating substrate. Item 2. The electronic component mounting board according to Item 1. The second recess is provided in each of a plurality of corners of the insulating substrate;
3. The electronic component mounting substrate according to claim 1, wherein each of the corners of the first recess is provided at a position sandwiched between the plurality of second recesses in a plan view.   Each of the corners of the first recess is located inside the imaginary straight line connecting the side surfaces on the outer edge side of the insulating substrate in the second recess in plan view. Item 4. The electronic component mounting board according to Item 3. An electronic component mounting substrate according to any one of claims 1 to 4,
An electronic component mounted in the first recess;
An electronic device comprising: another electronic component mounted in the second recess. A module substrate having connection pads;
An electronic module comprising: the electronic device according to claim 5 connected to the connection pad via solder.

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