JP2012253294A - Resin substrate arrangement sheet and method for dividing resin substrates into individual pieces from resin substrate arrangement sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin substrate arrangement sheet which does not cause various inconveniences even when each resin substrate has a smaller area; and a method for dividing resin substrates into individual pieces from the resin substrate arrangement sheet.SOLUTION: A resin substrate arrangement sheet comprises: a plurality of rectangular resin substrates arranged in the longitude and latitude directions; a plurality of inter-line regions functioning as dummy regions which are installed in each space between the resin substrates in each row arrangement arranged in the latitude direction among the plurality of resin substrates, and its adjacent resin substrates in each row arrangement; a frame part region taken by surrounding the whole of the region occupied by the plurality of resin substrates and the plurality of inter-line regions; and alignment mark patterns installed at two places on the extension of both latitudes which separate the resin substrate at the endmost row of the resin substrates in each row arrangement arranged in the latitude direction on the frame part region from the frame part region.

Description

  The present invention relates to a resin substrate array sheet in which a large number of resin substrates, which are the same product, are arrayed in each direction, and a method for separating resin substrates from this resin substrate array sheet, and in particular, The present invention relates to a resin substrate array sheet having a frame region at an edge, and a method for separating resin substrates from the resin substrate array sheet.

  In particular, when the resin substrate is small, a large number of the same products can be manufactured in the form of a sheet arranged in each direction in consideration of the manufacturing efficiency. The same applies to a resin semiconductor package having a resin substrate as a basic component and a component mounting (or built-in) resin module.

  When manufactured as a sheet, it can be distributed in the form of a sheet separated on a dicing tape, and supplied to the assembly of a circuit board constituting an application device. At the time of this assembly, individual resin substrates are picked up from the sheet by the mounter head and can be mounted on a large substrate such as a mother board. By distributing and supplying in sheet form, it is suitable for increasing the production efficiency of applied equipment.

  The resin substrate array sheet used for such a purpose often has a frame region at the edge of the array sheet. This region is a region that can be said to be a buffer region when, for example, a plurality of array sheets are arranged side by side on a large panel in order to manufacture products more efficiently. With this buffer area, when each array sheet is cut out from the panel, for example, with a router, a margin is created between the router bit and the resin substrate that is the product.

  On the other hand, in general, in a resin substrate arrangement sheet in which each resin substrate has a smaller area (for example, several mm square), when each resin substrate is assembled into a component mounting resin module, it is difficult to mount components depending on the mounting device. There is a problem that it becomes difficult to perform testing for diagnosing electrical characteristics. This is because the distance between the mounted components becomes smaller due to the arrangement relationship with the components on the adjacent resin substrate, which may cause the mounting device to become incompatible, and it is difficult to secure a probing area for testing. The reason is that it is not suitable.

JP 2002-246504 A Japanese Patent Laid-Open No. 1-251693 JP-A-2-31490

  The present invention relates to a resin substrate array sheet in which a large number of resin substrates, which are the same product, are arranged in each direction, and a method for separating resin substrates from this resin substrate array sheet, in which each resin substrate has a smaller area. It is an object of the present invention to provide a resin substrate array sheet that does not cause various inconveniences, and a method of separating resin substrates from the resin substrate array sheet.

  In order to solve the above-mentioned problems, a resin substrate array sheet according to one aspect (first aspect) of the present invention includes a plurality of resin substrates each arranged in a respective direction, each having a rectangular shape; As a dummy region provided between each of the resin substrates arranged in the parallel direction of the resin substrate and each of the resin substrates arranged in a row adjacent to the resin substrate of each row arrangement A plurality of inter-line regions that function; a frame region that surrounds the entire area occupied by the plurality of resin substrates and the plurality of inter-line regions; and on the frame region and in the parallel direction Alignment mark patterns provided at two locations on both extensions of the parallels that divide the resin substrate in the outermost row out of the resin substrates arranged in each row and the frame portion region; Features.

  That is, in this sheet, an inter-row region functioning as a dummy region is provided between each of the row-arranged resin substrates and the adjacent row-arranged resin substrate. By utilizing this dummy area, it is possible to eliminate the difficulty of component mounting and the difficulty of testing. Further, a frame region is formed surrounding the entire region occupied by the resin substrate and the dummy region, and an alignment mark pattern is provided at a predetermined position on the frame region.

  If this pattern is used as a reference for alignment, even if the resin substrate and the dummy area are arranged alternately in the meridian direction, the normal dicing machine can perform cutting in the latitude direction with a constant pitch without altering the pitch. Is possible. That is, the “constant pitch” may be the length obtained by adding the length in the meridian direction of each of the plurality of inter-row regions in the meridian direction to the length in the meridian direction of one resin substrate. As a result, from the position of the latitude line passing through the reference pattern, the position of the latitude line obtained by adding an offset corresponding to the length of the length of one resin substrate in the meridian direction was set to the initial position, and cutting in the latitude direction was sequentially performed at this “constant pitch”. After that, it is possible to sequentially perform cutting at a “fixed pitch” again with the latitude position passing through the reference pattern as the initial position.

  Therefore, according to this resin substrate array sheet, the difficulty of component mounting can be eliminated by securing the dummy area, and the difficulty of testing can be eliminated, and the resin board arrangement sheet is provided at a predetermined position in the frame area. By using the alignment mark pattern, it is possible to perform dicing that eliminates the possibility of cutting at a constant pitch by providing a dummy area.

  Further, the resin substrate arrangement sheet according to another (second) aspect of the present invention includes a plurality of rectangular resin substrates arranged in the respective directions, and a latitude line of the plurality of resin substrates. A plurality of inter-row regions functioning as dummy regions provided between the resin substrates in the respective rows arranged in the direction and the resin substrates in the row arranged adjacent to the resin substrates in the respective rows A frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions; and each row disposed on the frame region and in the latitude direction. Provided at two locations on both extensions of the latitude line that divides the resin substrate in the end row of the arranged resin substrates and the inter-row region located next to the resin substrate in the end row of the plurality of inter-row regions. A registered alignment mark pattern; Characterized in that it.

  Also with this resin substrate arrangement sheet, it is possible to eliminate the difficulty of component mounting and the difficulty of testing by securing a dummy area. In addition, it is possible to perform dicing that eliminates the possibility of cutting at a constant pitch by providing a dummy area by utilizing an alignment mark pattern provided at a predetermined position in the frame area. The “constant pitch” is the same as the first aspect in that the length of one resin substrate is added to the length of the meridian in each of the plurality of inter-line regions in the meridian direction. It is. However, in this case, the latitude line position obtained by subtracting the offset corresponding to the length in the meridian direction of one resin substrate from the position of the latitude line passing through the reference pattern is set to the initial position, and cutting in the latitude direction is performed at this "constant pitch". After sequentially performing the cutting, the position of the latitude line passing through the reference pattern is again set to the initial position and cutting is performed sequentially at a “fixed pitch”.

  Further, the resin substrate arrangement sheet according to yet another (third) aspect of the present invention includes a plurality of rectangular resin substrates arranged in the respective directions, and each of the plurality of resin substrates; Between a plurality of rows functioning as a dummy region provided between each of the resin substrates in the respective rows arranged in the direction of the latitude and the resin substrate in the rows arranged adjacent to each of the resin substrates in the respective rows An area; a frame area that surrounds the entire area occupied by the plurality of resin substrates and the plurality of inter-row areas; and the most of the resin substrates in the respective row arrangements arranged in the parallel direction. And an alignment mark pattern provided at two end portions of a line segment in the parallel direction that separates the resin substrate at the end row and the frame region.

  Also with this resin substrate arrangement sheet, it is possible to eliminate the difficulty of component mounting and the difficulty of testing by securing a dummy area. In addition, by using the alignment mark pattern provided at a predetermined position, it is possible to perform dicing that eliminates the possibility of cutting at a constant pitch by providing a dummy area. The “constant pitch” is the same as the first aspect in that the length of one resin substrate is added to the length of the meridian in each of the plurality of inter-line regions in the meridian direction. It is. As a result, from the position of the latitude line passing through the reference pattern, the position of the latitude line obtained by adding an offset corresponding to the length of the length of one resin substrate in the meridian direction was set to the initial position, and cutting in the latitude direction was sequentially performed at this “constant pitch”. Thereafter, it is possible to sequentially perform cutting at a “fixed pitch” again at the initial position of the latitude line passing through the reference pattern.

  In this third aspect, the alignment mark pattern is provided at two end portions of the line segment in the parallel direction that separates the resin substrate and the frame region of the outermost row of the resin substrates arranged in a row. Therefore, this pattern can also be used as a reference mark for cutting in the meridian direction.

  In addition, a resin substrate arrangement sheet according to yet another (fourth) aspect of the present invention includes a plurality of rectangular resin substrates arranged in respective directions, each of which is a rectangular shape; Between a plurality of rows functioning as a dummy region provided between each of the resin substrates in the respective rows arranged in the direction of the latitude and the resin substrate in the rows arranged adjacent to each of the resin substrates in the respective rows An area; a frame area that surrounds the entire area occupied by the plurality of resin substrates and the plurality of inter-row areas; and the most of the resin substrates in the respective row arrangements arranged in the parallel direction. Alignment marks provided at two end portions of a line segment in the parallel direction that separates the resin substrate in the end row and the inter-row region located next to the resin substrate in the endmost row among the plurality of inter-row regions Having a pattern; And butterflies.

  Also with this resin substrate arrangement sheet, it is possible to eliminate the difficulty of component mounting and the difficulty of testing by securing a dummy area. In addition, by using the alignment mark pattern provided at a predetermined position, it is possible to perform dicing that eliminates the possibility of cutting at a constant pitch by providing a dummy area. The “constant pitch” is the same as the first aspect in that the length of one resin substrate is added to the length of the meridian in each of the plurality of inter-line regions in the meridian direction. It is. As a result, the position of the latitude line obtained by subtracting the offset corresponding to the length in the meridian direction of one resin substrate from the position of the latitude line passing through the reference pattern is set as the initial position, and cutting in the latitude direction is sequentially performed at this “constant pitch”. Thereafter, it is possible to sequentially perform cutting at a “fixed pitch” again at the initial position of the latitude line passing through the reference pattern.

  In the fourth aspect, the alignment mark pattern includes a resin substrate in the end row among the resin substrates arranged in a row, and a row region located next to the resin substrate in the end row among the plurality of row regions. Therefore, this pattern can also be used as a reference mark for cutting in the meridian direction, as in the third aspect.

  Further, according to another (fifth) aspect of the present invention, a resin substrate separation method from a resin substrate arrangement sheet includes a plurality of resin substrates arranged in respective directions and each having a rectangular shape. Each of the plurality of resin substrates provided between each of the resin substrates arranged in the direction of the latitude line and the resin substrate arranged in a row adjacent to the resin substrate arranged in each row. A plurality of inter-row regions that function as dummy regions; a frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions; and on the frame region, Alignment mark patterns provided at two locations on both extensions of the latitude line that divides the resin substrate in the end row among the resin substrates in the respective rows arranged in the direction of the latitude line and the frame region; From resin substrate array sheet A method of dividing a resin substrate into a method of cutting along a latitude line offset from the latitude line connecting the alignment mark patterns in a meridian direction by a length in the longitude direction of one of the plurality of resin substrates. After the first step and the first step, the length of the meridian direction of the one resin substrate is added to the length of the meridian direction that each of the plurality of inter-row regions has in the meridian direction, A second step of repeating cutting following the latitude line offset in the meridian direction from the previous cutting position, and a third step of cutting following the latitude line connecting the alignment mark patterns following the second step. Following the step and the third step, the length of the plurality of inter-row regions is increased by the length in the meridian direction of the one resin substrate. A fourth step of repeating cutting along the latitude line offset in the meridian direction from the previous cutting position by an amount corresponding to the length of the meridian direction that each has in the meridian direction; and the resin substrate array sheet in the meridian direction And a fifth step of cutting sequentially.

  This singulation method is a method of dividing a resin substrate into individual pieces from the resin substrate arrangement sheet according to the first aspect. This method is advantageous in that the first and second steps are performed before the third and fourth steps. In other words, since cutting that passes over the alignment mark pattern is not performed depending on the first and second steps, the reference mark without any damage is maintained when the third step is executed. Thereby, since the alignment accuracy in the third and fourth steps can be kept high, the cutting position accuracy can also be kept high.

  Even when the resin substrates are separated from the resin substrate arrangement sheet according to the second, third, and fourth aspects, based on the same idea, depending on the cutting in the first-half latitude direction, the resin substrate array sheet may pass over the alignment mark pattern. It is possible to maintain this alignment mark pattern as a reference mark without any damage when performing cutting in the latter latitude direction in the latter direction.

  According to the present invention, in a resin substrate array sheet in which a large number of resin substrates that are the same product are arrayed in each direction, and in a method for separating resin substrates from this resin substrate array sheet, each resin substrate is more It is possible to provide a resin substrate arrangement sheet that does not cause various inconveniences even in the case of a small area, and a method for separating resin substrates from this resin substrate arrangement sheet.

The top view which shows the structure of the resin board | substrate arrangement | sequence sheet | seat which is one Embodiment of this invention. The top view and sectional drawing which show an example of the preferable distribution | circulation aspect of the resin substrate arrangement | sequence sheet | seat shown in FIG. Sectional drawing which shows the specific structural example of the resin-made semiconductor packages as an example of each piece of the resin substrate arrangement | sequence sheet | seat shown in FIG. Sectional drawing which shows the specific structural example of the resin-made semiconductor packages as an example of each piece of the resin board | substrate arrangement | sequence sheet | seat shown in FIG. 1 different from what was shown in FIG. Sectional drawing which shows the specific structural example of the component built-in resin module as an example of each piece of the resin substrate arrangement | sequence sheet | seat shown in FIG. Process drawing which shows the process of dicing the resin substrate arrangement | sequence sheet | seat shown in FIG. FIG. 4 is a continuation diagram of FIG. 3, and a process diagram showing a process of dicing the resin substrate arrangement sheet shown in FIG. 1. The top view which shows the structure of the resin substrate arrangement | sequence sheet | seat which is another embodiment of this invention, and process drawing which shows a part of process of dicing this. The top view which shows the structure of the resin substrate arrangement | sequence sheet | seat which is another embodiment of this invention, and process drawing which shows a part of process of dicing this. The top view which shows the structure of the resin substrate arrangement | sequence sheet | seat which is another (4th) embodiment of this invention, and process drawing which shows a part of process of dicing this. The top view which shows the structure of the resin board | substrate arrangement | sequence sheet | seat which is another (5th) embodiment of this invention, and process drawing which shows a part of process of dicing this. The top view which shows the structure of the resin substrate arrangement | sequence sheet | seat which is another (6th) embodiment of this invention, and process drawing which shows a part of process of dicing this. The top view which shows the structure of the resin board | substrate arrangement | sequence sheet | seat which is another (seventh) embodiment of this invention.

  As an embodiment of the present invention, on the frame region, the resin substrate at the endmost row and the inter-row region located next to the resin substrate at the endmost row among the plurality of inter-row regions are divided. And a second alignment mark pattern having a pattern shape different from that of the alignment pattern, which is provided at two positions on both of the extended latitude lines. By providing such a second alignment mark pattern, it is possible to obtain a “lattice position obtained by adding an offset corresponding to the length in the meridian direction of one resin substrate from the latitude line position passing through the reference pattern”. No information is needed. The second alignment mark pattern is provided in advance on the latitude line position after the offset is added.

  Also, as an embodiment, the alignment pattern provided on the frame part region and at two places on both extensions of the parallels that divide the resin substrate and the frame part region in the outermost row is a pattern. A second alignment mark pattern having a different shape may be further provided. By providing such a second alignment mark pattern, in order to obtain a “lattice position obtained by subtracting an offset corresponding to the length in the meridian direction of one resin substrate from a latitude line position passing through the reference pattern”, the dimension of the offset No information is needed. The second alignment mark pattern is provided in advance on the latitude line position after subtracting the offset.

  Further, as an embodiment, each of the alignment mark patterns has a full width in the meridian direction larger than the disappearance width generated by cutting in the latitude direction, and larger than the disappearance width generated by cutting in the meridian direction. The pattern can have a full width. According to this, it is easy to confirm the remaining reference mark when performing cutting in the latitude direction and then performing cutting in the meridian direction, and also when cutting in the reverse order, It is easy to check the remaining reference marks in cutting. Therefore, dicing is possible regardless of the order of the latitude direction and the meridian direction.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a configuration of a resin substrate array sheet according to an embodiment of the present invention.

  As shown in the figure, this resin substrate arrangement sheet 1 is formed by arranging and arranging rectangular resin substrates 10 (the length in the latitude direction is j and the length in the longitude direction k) in each direction, and in the direction orthogonal to the paper surface. It is configured as a thin plate. In particular, the array sheet 1 is provided with an inter-row region which is a dummy region between each of the resin substrates 10 arranged in the latitude direction and the resin substrate 10 in the row adjacent to the resin substrate 10 constituting this row. It has been. This inter-row area is allocated as a dummy piece 20 (the length in the meridian direction is k2) for each length in the latitude direction of the resin substrate 10. A broken line in the figure is a cutting line scheduled for dicing (not actually drawn).

  The dummy piece 20 is a region provided in consideration of manufacturing convenience, which is not directly related to the electrical function of the resin substrate 10 as a product. For example, it is a product of the following considerations. When each resin substrate 10 is assembled as a sheet, for example, if it is a small-area component mounting resin module, the interval of component placement becomes too narrow when viewed between the resin substrates 10 during manufacturing, It may be difficult to secure a pad area for testing (probing) electrical characteristics (that is, testing).

  In such a case, if there is an area of the dummy piece 20, there is an area margin between the resin substrates 10, and accordingly, there is a high possibility that the component mounting apparatus can cope. Moreover, it can also be used as an area for arranging a dedicated pad for probing the area of the dummy piece 20.

  Alternatively, in the case where each resin substrate 10 is assembled as a sheet, for example, a semiconductor package made of resin, the dummy piece 20 is obtained by flowing resin in order to embed a component such as a semiconductor chip in the resin layer. It can be utilized as a region for absorbing the thickness variation of the resin layer that occurs. That is, in order to embed a part, it is necessary to make the contact resin flow by that amount to make a close contact structure, and as a result, a design that can absorb the thickness variation of the resin layer due to flow is preferable. Therefore, if the region of the dummy piece 20 is provided in an appropriate area, the thickness of the resin layer after the flow has occurred can be controlled to a predetermined value, thereby processing in the thickness direction for manufacturing each resin substrate 10. The advantage of maintaining high quality without any variation can be obtained.

  If the dummy piece 20 is provided, it can be considered that the number of products (resin substrate 10) is reduced and the production efficiency is lowered. However, since the number of products is greatly increased in the first place, the number of products is greatly increased. The impact is limited. That is, when configured as a sheet, dicing similar to that for a semiconductor wafer can be used for singulation, and the disappearance width due to dicing can be as narrow as about 200 μm.

  On the other hand, in the conventional method of manufacturing a plurality of products on a large panel as a base material and separating them from the base material, a large width is required between the products. This width requires two separation grooves from the base material, which are processing grooves by the router, and a base material as a remaining material after the product is separated remains between the separation groove and the separation groove. Accordingly, this width is 3 mm in total even if the width of the separation groove is 1 mm, for example, and the width of the remaining base material is 1 mm, for example. Therefore, it is much larger than the disappearance width of dicing. In particular, the smaller the area of the product (resin substrate 10), the greater the influence of this element.

  In addition, about the dummy piece 20a of 1 line provided in the edge side of the resin substrate arrangement | sequence sheet | seat 1, this may not be provided. This can depend on the purpose for which the dummy piece is provided. In other words, it can be considered unnecessary if it merely provides a regional margin between the resin substrates 10. If the area of the dummy piece is used as an area for arranging a dedicated pad for probing, the dummy piece 20a is necessary to provide a dummy piece corresponding to each resin substrate 10, respectively. If the dummy piece is provided as an area for absorbing the thickness variation of the resin layer, it is also suitable for design to provide a dummy piece corresponding to each resin substrate 10. However, since the frame portion 30 is provided, this region also functions as a region for absorbing the thickness variation of the resin layer, and may be omitted as appropriate.

  The resin substrate array sheet 1 itself can be manufactured by arranging a plurality on a large panel (not shown) as a base material. The arrangement sheet 1 can be cut out from the large panel using a known router, for example. If manufactured in this way, more efficient manufacturing can be performed. In the cutting by the router in this case, since the resin substrate array sheet 1 has a certain large area, the influence of the width of the base material necessary between the resin substrate array sheets 1 becomes relatively small. Yes.

  The region of the frame portion 30 taken on the edge of the resin substrate array sheet 1 is a buffer region between the resin substrate 10 as a product and the router bit, which is secured for cutting out each array sheet 1 from the panel with a router, for example. This is an area that can be said. Here, the following functions are also given to the region of the frame portion 30. That is, the frame portion 30 is used as an area for pattern formation of the alignment mark patterns 2a, 2b, 3a, and 3b for designating the cutting position. When the array sheet 1 is diced, the dicer reads the mark patterns 2a, 2b, 3a, and 3b, positions the dicing blade, and dices so as to follow the broken line shown.

  As will be described in detail later, since the pitch of the cutting line alternates between k and k2 when cutting the resin substrate array sheet 1 in the parallel direction, such an alternate is used for a normal dicer for dicing a semiconductor wafer or the like. Cannot handle cutting. Therefore, a method that can be cut even by using an ordinary dicer with some ingenuity will be described later (see FIGS. 6 and 7).

  In order to adapt to this method, the alignment mark patterns 2a and 2b are located on the region of the frame portion 30 and are the resin substrates in the outermost row of the row-arranged resin substrates 10 arranged in the latitude direction. 10 and two regions on the extension of the parallels that divide the region of the frame 30. In addition, the alignment mark patterns 3a and 3b are on the region of the frame portion 30 and the region of the resin substrate 10 in the outermost row and the region of the frame portion 30 among the resin substrates 10 arranged in the meridian direction. Are provided at two locations on both extensions of the meridian.

  The alignment mark patterns 2a, 2b, 3a, and 3b can be formed as follows, for example. One is to form a pattern of a predetermined shape by patterning a metal foil layer (copper foil layer) on the insulating layer by a process similar to that for obtaining a wiring pattern on the insulating layer. Alternatively, a solder resist layer is formed on a solid metal layer (copper layer) or a metal plate (copper plate), and the solder resist layer is formed as a pattern extracted in a predetermined shape. One example of the shape of the mark patterns 2a, 2b, 3a, and 3b is a cross shape in the meridian direction and the latitude direction as shown in the figure.

  Once the resin substrate 10 is manufactured in the form of the array sheet 1, the sheet 1 can then be circulated while being diced, and supplied to the assembly of the circuit board used for application equipment ( This will be described with reference to FIG. At the time of this assembly, individual packages can be picked up from the sheet 1 by a mounter head and mounted on a substrate such as a mother board. It is suitable for increasing the production efficiency of applied equipment by being distributed and supplied in sheet form.

  2 is a plan view (FIG. 2 (a)) and a cross-sectional view (FIG. 2 (b)) showing an example of a preferable distribution mode of the resin substrate array sheet 1 shown in FIG. In FIG. 2, the same reference numerals are given to the same components as those shown in the already described drawings.

  As shown in FIG. 2, the arrangement sheet 1 configured as shown in FIG. 1 has a dicing tape (adhesive tape) 31 having adhesiveness on the upper surface and a dicing frame 32 that frames the dicing tape (adhesive tape). In the form of an array sheet 1ddd). Thus, in the form with the dicing tape 31 and the dicing frame 32, the arrangement sheet 1ddd can be supplied to the assembly process of the circuit board used for the application equipment without disposing the resin boards 10 apart. .

  As shown in FIG. 2B, the dicing tape 31 is fixed to the lower surface of the dicing frame 32 with an adhesive, and the array sheet 1ddd is positioned on the adhesive surface of the dicing tape 31 inside the dicing frame 32. is doing. The array sheet 1ddd is diced by a dicer with a register up to the middle thickness of the dicing tape 31, and the resin substrates 10 and the dummy pieces 20 are separated. The dicing tape 31 and the dicing frame 32 are originally configured for dicing the wafer or sheet before dicing.

  When each resin substrate 10 is picked up by the mounter, the round substrate is pressed against the lower surface of the dicing tape 31 at a position corresponding to the resin substrate 10 to be picked up so that the substrate 10 is removed from the adhesiveness of the dicing tape 31. In this state, the upper surface of the substrate 10 is vacuum-sucked by the mounter head.

  It supplements below that the dicing tape 31 and the dicing frame 32 are the structures for dicing the arrangement | sequence sheet | seat 1. FIG. The dicing tape 31 is initially in the form of a tape and is drawn from the roll by a dedicated machine. At this time, the adhesive surface (lower surface) side that is drawn out and is flat is opposed to the dicing frame 32 made of, for example, aluminum. Then, the array sheet 1 before dicing is pressed together with the dicing frame 32 (or in the order of the array sheet 1 and the dicing frame 32) toward the dicing tape 31 in the region inside the dicing frame 32, and the array sheet 1 and the dicing frame 32 are pressed. Is adhered to the dicing tape 31.

  After the arrangement sheet 1 and the dicing frame 32 are adhered to the dicing tape 31, unnecessary areas of the dicing tape 31 spreading outside the dicing frame 32 are cut off. The array sheet 1 is applied to the dicer in this state, and the array sheet 1 is diced and separated into pieces by the dicer with a register up to the middle thickness of the dicing tape 31 (however, the array sheet 1ddd is not separated but maintains the array). Become.

  FIG. 3 is a cross-sectional view showing a specific configuration example of a resin semiconductor package as an example of each piece (resin substrate 10) of the resin substrate array sheet 1 shown in FIG. The resin semiconductor package includes a copper plate (stiffener) 51, an insulating layer 52, an insulating layer 53, a solder resist 54, a semiconductor chip (device) 55, a plating via (vertical conductor) 56, a wiring pattern 57, a plating via 58, A wiring pattern 59 is provided.

  The structure will be briefly described as follows. A semiconductor chip 55 is mounted and fixed face-up on a copper plate 51 that functions as a stiffener, and the semiconductor chip 55 is embedded in close contact with an insulating layer 52.

  The wiring layer 57 provided on the insulating layer 52 and the semiconductor chip 55 are electrically connected by a plating via 56 provided through the insulating layer 52 located on the semiconductor chip 55. Then, another insulating layer 53 is laminated so as to cover the wiring layer 57, and another wiring layer 59 is provided on the insulating layer 53. The wiring layer 59 and the wiring layer 57 are electrically connected by a plating via 58 provided through the insulating layer 53. Further, a solder resist 54 is formed on the upper surface of the insulating layer 53 in a region other than a region where solder is provided.

  In the case of such a configuration, the embodiment shown in FIG. 2 can be applied with the upper side in the drawing as the dicing tape side and the lower side as the pickup side. In addition, although it can also be set as the structure which provides a solder ball (not shown) on the pattern which the wiring layer 59 contains, in this case, an adhesion area on a dicing tape reduces a substantial adhesion area, and it is a little difficult. There seems to be. That is not to say impossible.

  Next, FIG. 4 is a cross-sectional view showing a specific configuration example of a resin-made semiconductor package as an example of each piece (resin substrate 10) of the resin substrate arrangement sheet shown in FIG. 1, which is different from that shown in FIG. FIG. This semiconductor package includes an insulating layer 61, an insulating layer 62, an insulating layer 63, a solder resist 64, a solder resist 65, a wiring pattern 66, a plating via 67, a wiring pattern 68, a plating via 69, an underfill resin 70, a semiconductor chip 71, It has a plating via 72, a wiring pattern 73, a plating via 74, a wiring pattern 75, a surface-mounted passive element component 76, solder 77, and possibly a mold resin 78.

  The structure will be briefly described as follows. Initially, the semiconductor chip 71 is mounted and fixed face-down on the wiring pattern 68, which is a metal layer on one side, via an underfill resin 70. On the back surface (the lower surface in the figure) of this metal foil, a mark corresponding to the terminal pad of the semiconductor chip 71 may be marked. On this metal foil, the semiconductor chip 71 is embedded in close contact with the insulating layer 62.

  The wiring pattern 73 provided on the insulating layer 62 and the wiring pattern 68 are electrically connected by a plating via 72 provided through the insulating layer 62. The semiconductor chip 71 and the wiring pattern 68 are electrically connected by a plating via 69 provided through the underfill resin 70. Since the position of the plating via 69 is specified and formed, a mark attached to the metal foil can be used. The wiring pattern 68 and the wiring pattern 73 are obtained by patterning a metal foil after the formation of the plating vias 69 and 72.

  Then, another insulating layer 61 is laminated so as to cover the wiring pattern 68, and another wiring pattern 66 is provided on the insulating layer 61. The wiring pattern 68 and the wiring pattern 66 are electrically connected by a plating via 67 provided through the insulating layer 61. Furthermore, a solder resist 65 is formed on the upper surface of the insulating layer 61 in a region that is not a region where solder is provided.

  Further, another insulating layer 63 is laminated so as to cover the wiring pattern 73, and another wiring pattern 75 is provided on the insulating layer 63. The wiring pattern 75 and the wiring pattern 73 are electrically connected by a plating via 74 provided through the insulating layer 63. Further, on the upper surface of the insulating layer 63, a solder resist 64 is formed in a region that is not a region where the solder and the surface-mounted passive element component 76 are provided. On the lands included in the wiring pattern 75, the surface mount type passive element component 76 is mounted with solder 77.

  In addition, as a possibility, a mold resin 78 is provided over the entire surface of the insulating layer 63 so as to seal the surface-mounted passive element component 76. The mold resin 78 can be formed on one side at the stage of the array sheet 1 shown in FIG.

  In the case of such a configuration, the embodiment shown in FIG. 2 can be applied with the lower side in the figure as the dicing tape side and the upper side as the pickup side. A configuration in which solder balls (not shown) are provided on the pattern included in the wiring pattern 66 can also be adopted. This is the same as described with reference to FIG.

  Next, FIG. 5 is a cross-sectional view showing a specific configuration example of a component built-in resin module as an example of each piece of the resin substrate arrangement sheet shown in FIG. This component built-in resin module includes insulating layers 211, 212, 213, 214, 215, 216, and 217, wiring layers (wiring patterns) 221, 222, 223, 224, 225, 226, 227, and 228, an interlayer connector (conductive). Conductive bumps 231, 232, 233, 234, 235, 236, 237, surface-mounted passive element component 241, solder 251, and solder resists 261 and 262.

  The structure will be briefly described as follows. The surface mounted passive element component 241 is a chip component for surface mounting, and is, for example, a chip capacitor or a chip resistor. The planar size is, for example, 0.6 mm × 0.3 mm. Terminals are provided at both ends, and the lower side thereof is opposed to the mounting land formed by the wiring layer 222. The terminals of the surface mount type passive element component 241 and the mounting lands are electrically and mechanically connected by solder 251.

  The wiring layers 221 and 228 are wiring layers on both main surfaces as wiring boards and include lands. The land by the wiring layer 221 is, for example, a land as an external connection terminal, and the land by the wiring layer 228 is a land on which another device can be mounted. Solder resists 261 and 262 are formed on both main surfaces except for the land portion where the solder is located, so that the solder melted at the time of solder connection is fixed to the land portion and then functions as a protective layer. A Ni / Au plating layer (not shown) having high corrosion resistance may be formed on the surface layer of the land portion.

  Each of the wiring layers 222 to 227 is an inner wiring layer. In order, the insulating layer 211 is between the wiring layer 221 and the wiring layer 222, and the insulating layer 212 is between the wiring layer 222 and the wiring layer 223. 223 and the wiring layer 224, the insulating layer 214 between the wiring layer 224 and the wiring layer 225, the insulating layer 215 between the wiring layer 225 and the wiring layer 226, and the wiring layer 226. An insulating layer 216 is located between the wiring layer 227 and an insulating layer 217 is located between the wiring layer 227 and the wiring layer 228, respectively, and separates these wiring layers 221 to 228. Each of the wiring layers 221 to 228 is obtained, for example, by pattern formation on a metal (copper) foil.

  Each of the insulating layers 211 to 217 is a rigid material made of, for example, a glass epoxy resin. In particular, the insulating layers 213, 214, and 215 have openings corresponding to the built-in surface-mounted passive element components 241, and provide a space for embedding the passive element components 241. The insulating layers 212 and 216 are deformed so as to fill the openings of the insulating layers 213 to 215 for the built-in passive element component 241, and there is no space serving as a gap inside.

  The wiring layer 221 and the wiring layer 222 can be electrically connected by an interlayer connector 231 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 211. Similarly, the wiring layer 222 and the wiring layer 223 can be conducted by an interlayer connector 232 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 212. The wiring layer 223 and the wiring layer 224 can be electrically connected by an interlayer connector 233 provided through the insulating layer 213. The wiring layer 224 and the wiring layer 225 can be conducted by an interlayer connector 234 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 214.

  Further, similarly, the wiring layer 225 and the wiring layer 226 can be conducted by an interlayer connector 235 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 215. The wiring layer 226 and the wiring layer 227 can be conducted by an interlayer connector 236 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 216. The wiring layer 227 and the wiring layer 228 can be conducted by an interlayer connector 237 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 217.

  The interlayer connectors 231 to 237 are derived from conductive bumps formed by screen printing of a conductive composition, respectively, and depend on the manufacturing process in the axial direction (upper and lower laminations in the illustration of FIG. 5). Direction).

  In the case of the component built-in resin module having such a configuration, either the lower side or the upper side in the figure can be the dicing tape side, and the opposite side can be the pickup side, and the embodiment shown in FIG. 2 can be applied. In addition, it can also be set as the structure which provides a solder ball (not shown) on the pattern which the wiring pattern 221 contains. This is the same as described with reference to FIG.

  Next, FIG. 6 is a process diagram showing a process of dicing the resin substrate array sheet 1 shown in FIG. FIG. 7 is a process diagram following FIG. In these figures, the reference numerals used in the already explained figures are used to indicate the same thing. The dicing tape 31 and the dicing frame 32 are not shown.

  First, as shown in FIG. 6A, cutting in the latitude direction is performed from (1) to (n) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 2a and 2b and specifies the direction of the parallels. Second, cutting is performed with a latitude line offset by k from the latitude line passing through the mark patterns 2a and 2b as the first cutting line. Such an offset setting can be used because it is a function that a normal dicer has. Cutting performed sequentially from (1) to (n) is a constant pitch of k + k2, and can be easily performed using a normal dicer.

  Next, as shown in FIG. 6B, using the array sheet 1d that has been cut as described above, cutting in the parallel direction is performed from (1) to (n + 1) at a pitch of k + k2. For this purpose, the latitude line passing through the mark patterns 2a and 2b may be the first cutting line. Also in this case, the cutting performed sequentially from (1) to (n + 1) is a constant pitch of k + k2, and can be easily performed using a normal dicer.

  In principle, the process of FIG. 6A and the process of FIG. 6B can be performed first in the opposite manner to the above description. However, according to the procedure described above, the mark patterns 2a and 2b having no damage are maintained at the time when the subsequent cutting is executed. Thereby, since the positioning accuracy of the dicer in the subsequent cutting can be kept higher, there is an advantage that the cutting positioning accuracy can be kept high.

  By the steps shown in FIGS. 6A and 6B, an array sheet 1dd in which all cutting in the latitude direction has been completed is obtained as shown in FIG. 7A. Therefore, next, as shown in FIG. 7B, using the array sheet 1dd, cutting in the meridian direction is sequentially performed from (1) to (m + 1) at a pitch of j. For this purpose, a meridian passing through the mark patterns 3a and 3b may be used as the first cutting line. This cutting is a normal cutting with a constant pitch j.

  As described above, it is possible to obtain an array sheet 1ddd that has been diced and has a sheet shape as shown in FIG. In addition, cutting in the meridian direction is performed after all the cutting in the latitude direction is completed as described above, and is performed prior to the cutting in the latitude direction, or between the first half and the latter half of the cutting in the latitude direction. Is also possible. This point is the same in each embodiment described below.

  Next, FIG. 8 is a plan view (FIG. 8A) showing a configuration of a resin substrate array sheet according to another embodiment, and a process diagram showing a part of a process of dicing this (FIG. 8B). It is. In FIG. 8, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  In the array sheet 1A of this embodiment, as shown in FIG. 8A, the same 4a and 4b are provided instead of the alignment mark patterns 2a and 2b. The alignment mark patterns 4a and 4b are on the region of the frame 30, and the resin substrate 10 in the end row of the resin substrates 10 arranged in the latitude direction and the resin substrate in the end row It is provided at two places on both extensions of the latitude line that divides the interline region located next to 10. Thus, even if the alignment mark patterns 4a and 4b are provided, cutting can be performed using a normal dicer.

  That is, as shown in FIG. 8B, first, cutting in the latitude direction is performed from (1) to (n + 1) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 4a and 4b and specifies the direction of the latitude line. Secondly, cutting is performed with a latitude line offset by k from the latitude line passing through the mark patterns 4a and 4b as the first cutting line. The cutting performed sequentially from (1) to (n + 1) is a constant pitch of k + k2, and can be handled by a normal dicer. Next, the cutting in the latitude direction and the cutting in the meridian direction to be performed will be omitted because it is easy to understand in consideration of the points described with reference to FIGS.

  Next, FIG. 9 is a plan view (FIG. 9 (a)) showing a configuration of a resin substrate arrangement sheet which is still another embodiment and a process diagram (FIG. 9 (b)) showing a part of a process of dicing the same. ). In FIG. 9, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  In the arrangement sheet 1B of this embodiment, as shown in FIG. 9A, the same 5a and 5b are provided in place of the alignment mark patterns 2a and 2b. Further, 5a and 5c are provided in place of the alignment patterns 3a and 3b. That is, the alignment pattern 5a is an alignment mark pattern that is used for both cutting in the latitude direction and cutting in the meridian direction.

  The alignment patterns 5a and 5b are two end portions of a line segment in the latitude line direction that divides the resin substrate 10 in the outermost row and the region of the frame portion 30 among the resin substrates 10 arranged in the latitude line direction. Is provided. Further, the alignment mark pattern 5c is one end of a line segment in the meridian direction that separates the resin substrate 10 in the outermost row and the region of the frame portion 30 among the resin substrates 10 arranged in the latitude direction. Provided in the department. The alignment mark pattern 5a is located at the opposite end of the meridian line segment. As described above, even if the alignment mark patterns 5a, 5b, and 5c are provided, cutting can be performed using a normal dicer.

  That is, as shown in FIG. 9B, first, cutting in the direction of the latitude is performed from (1) to (n) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 5a and 5b and specifies the direction of the latitude line. Second, cutting is performed with a latitude line offset by k from the latitude line passing through the mark patterns 5a and 5b as the first cutting line. The cutting performed sequentially from (1) to (n) is a constant pitch of k + k2, and can be handled by a normal dicer. Next, the cutting in the latitude direction and the cutting in the meridian direction to be performed will be omitted because it is easy to understand in consideration of the points described with reference to FIGS.

  In this embodiment, when all of the cutting in the latitude direction is completed, disappearance portions due to the cutting in the meridian direction are generated in the mark patterns 5a and 5c for alignment in the meridian direction. Therefore, the mark patterns 5a and 5c are required to be patterns having a full width in the meridian direction larger than the disappearance width generated by cutting in the latitude direction. However, it is different when a mark pattern for alignment in the meridian direction is provided separately on the frame 30.

  In addition, if cutting in the meridian direction is performed first, after this cutting, disappearance portions are generated in the mark patterns 5a and 5b for alignment in the latitude direction. Therefore, the mark patterns 5a and 5b need to be patterns having a full width in the latitude direction larger than the disappearance width generated by cutting in the meridian direction. However, this is not the case when a mark pattern for alignment in the latitude direction is provided separately on the frame portion 30.

  Next, FIG. 10 is a plan view (FIG. 10 (a)) showing a configuration of a resin substrate arrangement sheet which is still another embodiment, and a process diagram (FIG. 10 (b)) showing a part of the dicing process. ). In FIG. 10, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  In the array sheet 1C of this embodiment, as shown in FIG. 10A, the same 6a and 6b are provided instead of the alignment mark patterns 2a and 2b. Further, 6a and 5c are provided in place of the alignment patterns 3a and 3b. That is, the alignment pattern 6a is an alignment mark pattern that is used for both cutting in the latitude direction and cutting in the meridian direction.

  The alignment patterns 6a and 6b divide the resin substrate 10 in the end row of the resin substrates 10 arranged in the latitude direction and the inter-row region located next to the resin substrate 10 in the end row. It is provided at two places on the edge of the line in the latitude direction. As for the alignment mark pattern 5 c, as in the description with reference to FIG. 9, the meridian that divides the resin substrate 10 in the end row of the resin substrates 10 arranged in the latitude direction and the region of the frame portion 30. It is provided at the end of the direction line segment. Even if the alignment mark patterns 6a, 6b, and 5c are provided as described above, cutting can be performed using a normal dicer.

  That is, as shown in FIG. 10B, first, the cutting in the latitude direction is performed from (1) to (n + 1) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 6a and 6b and specifies the direction of the latitude line. Secondly, cutting is performed using a latitude line offset by k from the latitude line passing through the mark patterns 6a and 6b as the first cutting line. The cutting performed sequentially from (1) to (n + 1) is a constant pitch of k + k2, and can be handled by a normal dicer. Next, the cutting in the latitude direction and the cutting in the meridian direction to be performed will be omitted because it is easy to understand in consideration of the points described with reference to FIGS.

  Also in this embodiment, as in the embodiment shown in FIG. 9, when all of the cutting in the latitude direction is completed, the disappearance portion due to the cutting in the meridian direction is generated in the mark patterns 6 a and 5 c for alignment in the meridian direction. Therefore, the mark patterns 6a and 5c need to be patterns having a full width in the meridian direction larger than the disappearance width generated by cutting in the latitude direction. However, it is different when a mark pattern for alignment in the meridian direction is provided separately on the frame 30.

  Further, even when cutting in the meridian direction is performed first, as in the embodiment shown in FIG. 9, after this cutting, disappearance portions are generated in the mark patterns 6a and 6b for alignment in the latitude direction. Therefore, the mark patterns 6a and 6b need to be patterns having a full width in the latitude direction larger than the disappearance width generated by cutting in the meridian direction. However, this is not the case when a mark pattern for alignment in the latitude direction is provided separately on the frame portion 30.

  Next, FIG. 11 is a plan view (FIG. 11 (a)) showing a configuration of a resin substrate arrangement sheet which is still another embodiment, and a process diagram (FIG. 11 (b)) showing a part of the dicing process. ). In FIG. 11, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  In the array sheet 1D of this embodiment, as shown in FIG. 11A, in addition to the alignment mark patterns 2a and 2b, the same 7a and 7b having different pattern shapes are provided. The alignment mark patterns 7a and 7b are patterns provided at the same positions as the mark patterns 4a and 4b (see FIG. 8). That is, it is possible to directly specify the latitude line passing through the mark patterns 7a and 7b without having to offset by k from the latitude line passing through the mark patterns 2a and 2b.

  First, as shown in FIG. 11B, cutting in the direction of the latitude is performed from (1) to (n + 1) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 2a and 2b and specifies the direction of the parallels. Second, cutting is performed sequentially with the latitude line passing through the mark patterns 2a and 2b as the first cutting line. Cutting performed sequentially from (1) to (n + 1) is a constant pitch of k + k2, and can be easily performed using a normal dicer.

  Next, using the array sheet that has been cut as described above, cutting in the latitude direction is performed n times at a pitch of k + k2. For this purpose, a latitude line passing through the mark patterns 7a and 7b may be set as the first cutting line. Also in this case, the cutting performed sequentially is a constant pitch of k + k2, and can be easily performed using a normal dicer. The meridian cutting to be performed next will be omitted because it is easy to understand in consideration of the points described with reference to FIG.

  As a modified example of the array sheet 1D, in addition to the mark patterns 2a and 2b, a mark pattern similar to these may be provided in the region of the frame portion 30 on the latitude line that is an integer multiple of k + k2 from the latitude line where they are located. It may be. Similarly, in addition to the mark patterns 7a and 7b, a mark pattern similar to these may be provided in the region of the frame 30 on the latitude line that is an integer multiple of k + k2 from the latitude line where they are located.

  When the mark pattern is increased in this way, it is possible to avoid cumulative accumulation of errors in the cutting position in cutting at a constant pitch of k + k2. That is, since the position of the latitude line separated by an integral multiple of k + k2 is again indicated to the dicer by the mark pattern, the dicer can finely adjust the cutting position. Therefore, the cutting position accuracy can be further improved.

  Next, FIG. 12 is a plan view (FIG. 12 (a)) showing a configuration of a resin substrate arrangement sheet which is still another embodiment, and a process diagram (FIG. 12 (b)) showing a part of the dicing process. ). In FIG. 12, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  In the array sheet 1E of this embodiment, in addition to the mark patterns 5a, 5b, and 5c included in the array sheet 1B shown in FIG. The alignment mark patterns 8a and 8b are patterns provided at the same positions as the mark patterns 6a and 6b (see FIG. 10).

  Therefore, in this embodiment, the description in FIG. 9 (particularly, the alignment pattern 5a is an alignment mark pattern that is used both for cutting in the latitude direction and for cutting in the meridian direction) is established. In addition, the explanation in the explanation of FIG. 11 (a point in which it is possible to directly specify the latitude line passing through the mark patterns 8a and 8b without having to offset by k from the latitude line passing through the mark patterns 5a and 5b). Is established.

  First, as shown in FIG. 12B, cutting in the direction of the latitude is performed from (1) to (n) at a pitch of k + k2. For this purpose, first, the dicer reads the positions of the mark patterns 8a and 8b and specifies the direction of the latitude line. Secondly, cutting is performed sequentially with the latitude line passing through the mark patterns 8a and 8b as the first cutting line. Cutting performed sequentially from (1) to (n) is a constant pitch of k + k2, and can be easily performed using a normal dicer.

  Next, using the array sheet that has been cut as described above, cutting in the latitude direction is performed n + 1 times at a pitch of k + k2. For this purpose, a latitude line passing through the mark patterns 5a and 5b may be set as the first cutting line. Also in this case, the cutting performed sequentially is a constant pitch of k + k2, and can be easily performed using a normal dicer. The meridian cutting to be performed next will be omitted because it is easy to understand in consideration of the points described with reference to FIG.

  As a modification of the array sheet 1E, under the same idea as the array sheet 1D shown in FIG. 11, in addition to the mark patterns 5a and 5b, a mark on a latitude line that is an integer multiple of k + k2 away from the latitude line where these are located. Mark patterns similar to these may be provided at the same meridian position as the patterns 5a and 5b. Similarly, in addition to the mark patterns 8a and 8b, a mark pattern similar to the mark patterns 8a and 8b is also provided at the same meridian position as the mark patterns 8a and 8b on the latitude line that is an integer multiple of k + k2 from the latitude line where they are located. It may be.

  Next, FIG. 13 is a plan view showing a configuration of a resin substrate arrangement sheet which is still another embodiment. In FIG. 13, the same elements as those shown in the already described drawings are denoted by the same reference numerals, and the description thereof is omitted unless there is a matter to be added.

  The array sheet 1F of this embodiment is similar to the array sheets 1 and 1A to 1E described above, and is a resin substrate 10 in one row arranged in the latitude direction and a resin in a row adjacent to the resin substrate 10 constituting this row. Inter-row regions, which are dummy regions, are provided between the substrate 10 and the substrate 10 (dummy pieces 20e and 20f). In addition, unlike the array sheets 1, 1A to 1E, a dummy region is also provided between each of the resin substrates 10 arranged in the meridian direction and the resin substrate 10 in the next row of the resin substrates 10 constituting this row. Are provided (dummy pieces 20d, 20f). The length in the parallel direction of the region between the columns is j2.

  As described above, the arrangement sheet 1F is provided with a dummy region both when viewed in the meridian direction and when viewed in the latitude direction. The purpose of the provision is the same as that already described with reference to FIG. . The frame portion 30A also exists for the same reason as the frame portion 30 (see FIG. 1).

  In such an array sheet 1F, the same method as the above-described array sheets 1 and 1A to 1E can be used for cutting in the direction of the latitude when dicing. At the same time, the same method can be used for cutting in the meridian direction by considering the latitude direction and the meridian direction interchanged. As for the alignment mark pattern, the illustration in FIG. 13 shows the same case as that in FIG. 1, but the mark pattern can be provided in the same way as that shown in FIG. Similarly, a mark pattern can be provided based on the same idea as shown in FIGS. 9, 10, 11, and 12.

  1, 1A, 1B, 1C, 1D, 1E, 1F ... resin substrate array sheet, 1d ... resin substrate array sheet (on the way of dicing), 1dd ... resin substrate array sheet (on the next dicing), 1dd ... resin substrate array sheet ( 2a, 2b, 3a, 3b, 4a, 4b, 5a, 5b, 5c, 6a, 6b, 7a, 7b, 8a, 8b ... alignment mark pattern, 10 ... resin substrate, 20, 20a, 20d, 20e, 20f ... dummy piece, 30, 30A ... frame part, 31 ... dicing tape, 32 ... dicing frame, 51 ... copper plate (stiffener), 52 ... insulating layer, 53 ... insulating layer, 54 ... solder resist, 55 ... semiconductor chip 56 ... Plating via (vertical conductor), 57 ... wiring pattern, 58 ... plating via, 59 ... wiring pattern, 61 ... insulating layer, 62 ... insulating 63 ... Insulating layer, 64 ... Solder resist, 65 ... Solder resist, 66 ... Wiring pattern, 67 ... Plating via, 68 ... Wiring pattern, 69 ... Plating via, 70 ... Underfill resin, 71 ... Semiconductor chip, 72 ... Plating Via, 73 ... wiring pattern, 74 ... plating via, 75 ... wiring pattern, 76 ... surface mount passive element component, 77 ... solder, 78 ... mold resin, 211, 212, 213, 214, 215, 216, 217 ... insulation Layer, 221, 222, 223, 224, 225, 226, 227, 228 ... Wiring layer (wiring pattern), 231, 232, 233, 234, 235, 236, 237 ... Interlayer connector (conductivity by printing conductive composition) 241... Surface mounted passive element parts, 251... Solder, 261 and 262.

Claims (8)

A plurality of resin substrates each arranged in a rectangular direction, each having a rectangular shape,
Of each of the plurality of resin substrates, provided between each of the resin substrates in the row arrangement arranged in the direction of the latitude line, and each of the resin substrates in the row arrangement located next to the resin substrate in each row arrangement, A plurality of inter-line areas that function as dummy areas;
A frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions;
Provided at two locations on both extensions of the latitude line on the frame part region, the resin substrate in the row of the respective rows arranged in the direction of the latitude line, and the latitude line dividing the frame part region. A resin substrate array sheet comprising: an alignment mark pattern formed on the substrate. A plurality of resin substrates each arranged in a rectangular direction, each having a rectangular shape,
Of each of the plurality of resin substrates, provided between each of the resin substrates in the row arrangement arranged in the direction of the latitude line, and each of the resin substrates in the row arrangement located next to the resin substrate in each row arrangement, A plurality of inter-line areas that function as dummy areas;
A frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions;
On the frame region, the resin substrate in the end row among the resin substrates in the respective rows arranged in the latitude direction, and the resin substrate in the end row in the plurality of row regions A resin substrate arrangement sheet comprising: alignment mark patterns provided at two places on both extensions of parallels that divide adjacent line spacing regions.   On the frame region, both extension lines 2 of the latitude line dividing the resin substrate in the endmost row and the inter-row region located next to the resin substrate in the endmost row of the plurality of inter-row regions 2 The resin substrate arrangement sheet according to claim 1, further comprising a second alignment mark pattern provided at a location and having a pattern shape different from that of the alignment pattern.   A second pattern having a pattern shape different from that of the alignment pattern provided on the frame region and provided at two positions on both the extended lines of the latitude line dividing the outermost resin substrate and the frame region. The resin substrate array sheet according to claim 2, further comprising an alignment mark pattern. A plurality of resin substrates each arranged in a rectangular direction, each having a rectangular shape,
Of each of the plurality of resin substrates, provided between each of the resin substrates in the row arrangement arranged in the direction of the latitude line, and each of the resin substrates in the row arrangement located next to the resin substrate in each row arrangement, A plurality of inter-line areas that function as dummy areas;
A frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions;
Alignment mark patterns provided at two end portions of a line segment in the parallel direction that separates the frame region from the resin substrate in the outermost row of the resin substrates arranged in the respective parallel directions. And a resin substrate array sheet. A plurality of resin substrates each arranged in a rectangular direction, each having a rectangular shape,
Of each of the plurality of resin substrates, provided between each of the resin substrates in the row arrangement arranged in the direction of the latitude line, and each of the resin substrates in the row arrangement located next to the resin substrate in each row arrangement, A plurality of inter-line areas that function as dummy areas;
A frame region that surrounds the entire region occupied by the plurality of resin substrates and the plurality of inter-row regions;
The resin substrate in the end row among the resin substrates in the respective rows arranged in the direction of the latitude line and the inter-row region located next to the resin substrate in the end row among the plurality of inter-row regions are divided. And a positioning mark pattern provided at two end portions of the line segment in the parallel direction.   Each of the alignment mark patterns is a pattern having a full width in the meridian direction larger than the disappearance width generated by cutting in the latitude direction and a full width in the latitude direction larger than the disappearance width generated by cutting in the meridian direction. The resin substrate array sheet according to claim 5 or 6, wherein A plurality of resin substrates each having a rectangular shape arranged in each direction; a resin substrate in each row arrangement arranged in the direction of the latitude of the plurality of resin substrates; and a resin in each row arrangement A plurality of inter-row regions functioning as dummy regions provided between each of the resin substrates arranged in a row located next to the substrate; and an entire region occupied by the plurality of resin substrates and the plurality of inter-row regions A frame region that is surrounded, and a resin substrate in the end row among the resin substrates arranged in the parallel direction on the frame region and the frame region is divided An alignment mark pattern provided at two locations on both extensions of the latitude line to be divided into individual pieces of the resin substrate from the resin substrate array sheet,
A first step of cutting along a latitude line offset from the latitude line connecting the alignment mark patterns in the meridian direction by a length in the longitude direction of one of the plurality of resin substrates; and
Subsequent to the first step, the meridian direction from the previous cutting position by an amount corresponding to the meridian length of each of the plurality of inter-row regions in the meridian direction to the meridian direction length of the one resin substrate. A second step of repeatedly cutting along the latitude line offset to
Subsequent to the second step, a third step of cutting following the latitude line connecting the alignment mark patterns;
Subsequent to the third step, the meridian from the previous cutting position is obtained by adding the meridian length of each of the plurality of inter-row regions in the meridian direction to the meridian length of the one resin substrate. Following a latitude line offset in the direction, and a fourth step of cutting repeatedly;
And a fifth step of sequentially cutting the resin substrate arrangement sheet in the meridian direction. The method for separating the resin substrates from the resin substrate arrangement sheet.

Images