JP2009200073A - Aggregate ceramic laminate, aggregate ceramic multilayer board, and ceramic multilayer board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an aggregate ceramic laminate for preventing characteristic variations, steps, or the like from occurring by a difference in the stretch between a product section and a sacrificial marginal section in crimping, to provide a ceramic multilayer board that can be obtained from the aggregate ceramic laminate and has small variations in characteristics, and to provide an aggregate ceramic multilayer board that is a precursor of the ceramic multilayer board. <P>SOLUTION: In the aggregate ceramic laminate, a ceramic green sheet 1 is laminated, where the ceramic green sheet 1 comprises the product section 10 where a plurality of conductive patterns 11 for products that become conductors of individual products are arranged and the sacrificial marginal section 20 that is a region around the product section. In the ceramic laminate, a dummy conductive pattern 21 in the same shape as the conductive patterns 11 for products arranged at the product section is arranged at the sacrificial marginal section in the same state as the product section. When the conductive pattern 11 for products in the product section 10 includes an electrode pattern 12 for forming a capacity, the dummy conductive pattern 21 in the same shape as the conductive pattern 11 for products including the electrode pattern for forming the capacity is arranged also in the sacrificial marginal section 20 that is a region around the product section in the same state as the product section. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an aggregate ceramic laminated body used for manufacturing a multilayer ceramic electronic component such as a ceramic multilayer substrate, and more particularly, a so-called plural ceramic electronic component capable of efficiently obtaining a plurality of multilayer ceramic electronic components by dividing. Collective ceramic laminate for single-piece production (multi-piece production), ceramic multilayer substrate obtained from the aggregate ceramic laminate, and aggregate ceramic multilayer substrate as a precursor thereof, and further manufacture of sintered ceramic laminate Regarding the method.

  In recent years, electronic components have been miniaturized, and accordingly, a ceramic multilayer substrate in which conductors are three-dimensionally arranged has been widely used as a circuit substrate suitable for miniaturization and high-density mounting.

  By the way, as a manufacturing method of such a ceramic multilayer substrate, for example, a ceramic green provided with a product part in which a plurality of product conductor patterns serving as conductors of individual products are arranged, and a waste part around the product part Sheets are laminated and pressed to form an aggregate ceramic laminate. After firing the aggregate ceramic laminate, chip-type electronic components are mounted on the surface, and the discard margin is removed. A so-called multi-cavity manufacturing method for dividing a ceramic multilayer substrate is known.

  However, in the case of the manufacturing method as described above, the conductor pattern is disposed in the product part, whereas the conductor pattern is not disposed in the disposal allowance part, or the density is significantly lower than the product part. Since the conductor pattern is arranged, the product part and the disposal margin part are different in the degree of elongation and deformation in the process of laminating the ceramic green sheets and then crimping, so the product arranged in the vicinity of the disposal part There is a problem in that the conductor pattern for use is deformed to cause characteristic fluctuations.

  In particular, when an electrode pattern for forming a capacitor is formed in the product part, the deformation directly and greatly affects the characteristics, and therefore, the deformation of the product conductor pattern in the vicinity of the boundary between the product part and the disposal margin part is suppressed. It will be necessary.

  In addition, due to the difference in the arrangement pattern of the conductor pattern between the product portion and the disposal margin portion, a step is formed at the boundary between the product portion and the disposal margin portion of the aggregate ceramic laminate, and the surface on which the chip-type electronic component is mounted There is a problem in that the flatness of the film is impaired or delamination occurs.

In order to solve such a problem, for example, it is suggested that a product conductor pattern is disposed in the product portion and a dummy conductor pattern is disposed in the discarding portion (see paragraph 0005 of Patent Document 1). ).
In addition, the provision of a dummy conductor pattern in the discard margin is also shown in other patent documents (see, for example, FIG. 1 of Patent Document 2).
However, when manufacturing a ceramic multilayer substrate, it is known that a conductor pattern is also provided in the discarding part of the aggregate ceramic laminate, but in the conventional technology, the conductor pattern in the product part and the discarding part is used. Based on the difference in the shape, arrangement mode, arrangement density of the conductor pattern, etc., the product portion and the disposal margin portion have different elongations, and it is difficult to sufficiently suppress the above-described characteristic fluctuations and defects. Is the actual situation.
JP-A-2005-72416 JP 2002-43705 A

  The present invention has been made in order to solve the above-described problems, and is an aggregate ceramic laminate that does not have a characteristic variation or a step due to a difference in elongation between a product portion and a disposal allowance portion during crimping, from the aggregate ceramic laminate. To provide a manufacturing method capable of manufacturing an obtained ceramic multilayer substrate with little variation in characteristics, an aggregate ceramic multilayer substrate as a precursor thereof, and a sintered aggregate ceramic laminate with high dimensional accuracy. With the goal.

In order to solve the above problems, the aggregate ceramic laminate of the present invention is:
An assembly ceramic laminate in which ceramic green sheets having a product portion in which a plurality of product conductor patterns serving as conductors of individual products are disposed and a disposal portion that is a region around the product portion are laminated. ,
A dummy conductor pattern having the same shape as the product conductor pattern disposed in the product portion is disposed in the discarding portion in the same manner as the product portion.

  Further, in the aggregate ceramic laminate according to claim 2, the product conductor pattern of the product portion includes a capacitance forming electrode pattern, and the capacitor portion is also disposed in a disposal margin portion that is a region around the product portion. A dummy conductor pattern having the same shape as the product conductor pattern including the forming electrode pattern is disposed in the same manner as the product part.

  Further, in the aggregate ceramic laminate of claim 3, the ceramic green sheets are laminated in such a manner that the surface on which the product conductor pattern is disposed is the surface of the aggregate ceramic laminate, and It is characterized in that a position information display mark is attached to the disposal margin part on the surface of the aggregate ceramic laminate.

  Further, the aggregate ceramic laminate according to claim 4 is characterized in that a dummy conductor pattern is not disposed in the discard margin portion provided with the position information display mark on the surface of the aggregate ceramic laminate. Yes.

Moreover, the manufacturing method of the sintered aggregate ceramic laminate according to the present invention is as follows.
A state in which a constraining layer mainly comprising ceramic powder that is not sintered at the sintering temperature of the aggregate ceramic laminate is adhered to at least one main surface of the aggregate ceramic laminate according to any one of claims 1 to 4. In the firing step of firing under the condition that the aggregate ceramic laminate is sintered but the constraining layer is not sintered,
And removing the constraining layer after the firing step to obtain a sintered body of the aggregate ceramic laminate.

  According to a sixth aspect of the present invention, there is provided a multilayer ceramic multilayer substrate obtained by firing the multilayer ceramic laminate according to any one of the first to fourth aspects.

  A ceramic multilayer substrate according to claim 7 is characterized in that the aggregate ceramic laminate according to any one of claims 1 to 4 is fired and divided into sub-substrates that are individual products. Yes.

  The aggregate ceramic laminate of the present invention is a collective ceramic laminate in which a ceramic green sheet having a product part in which a product conductor pattern is disposed and a discard part around the product part is laminated. Since the dummy conductor pattern having the same shape as the product conductor pattern provided in the product part is provided in the same manner as the product part, the product part is discarded in the crimping process after the ceramic green sheets are laminated. It is possible to suppress the difference in elongation of the surrogate portion, and to provide an aggregate ceramic laminate that can efficiently produce individual products with little fluctuation in characteristics by a so-called multiple method. .

  In the present invention, among the ceramic green sheets on which the product conductive patterns are disposed, a dummy conductor pattern is formed in the discarding portion for a predetermined ceramic green sheet, and for other ceramic green sheets, It is possible not to form a dummy conductor pattern in the abandon part, and a dummy conductor pattern is formed in the abandon part for all ceramic green sheets in which the product conductor pattern is arranged in the product part. It is also possible to do.

In addition, when a dummy conductor pattern is formed in the discard margin for a predetermined ceramic green sheet and no dummy conductor pattern is formed in the discard margin for other ceramic green sheets, the ceramic green sheet It has been confirmed that the difference in elongation between the product portion and the disposal allowance portion can be effectively suppressed in the crimping step after laminating the layers.
In addition, for all ceramic green sheets with product conductor patterns in the product area, if a dummy conductor pattern is formed in the disposal area, the difference in elongation between the product area and the disposal area can be more reliably detected. Therefore, it is possible to obtain a product with less variation in characteristics.
The dummy conductor pattern is arranged in the same manner as the product portion, but the same manner means that the dummy conductor pattern is arranged in the same direction, the same interval, and the same density as the product portion.

  In addition, when the conductor pattern for a product of the aggregate ceramic laminate includes a capacitance forming electrode pattern, the elongation of the capacitance forming electrode pattern due to the elongation of the laminate has a great influence on the variation and variation of the capacitance to be formed. However, as in claim 2, the product conductor pattern including the capacitor forming electrode pattern also in the abandon portion around the product portion where the product conductor pattern including the capacitor forming electrode pattern is disposed. It is particularly desirable that a dummy conductor pattern having the same shape as is provided, which makes it possible to obtain a product with little variation in capacitance characteristics.

  Further, as in the aggregate ceramic laminate of claim 3, the ceramic green sheets are laminated in such a manner that the surface on which the product conductor pattern is disposed becomes the surface of the aggregate ceramic laminate, and the aggregate ceramic laminate By adopting a configuration in which a position information display mark is attached to the disposal margin portion on the surface of the body, for example, information display (mounting mark) regarding the mounting position when chip-type electronic components are mounted on the surface of the aggregate ceramic laminate Thus, it becomes possible to display information on the division position (division position mark) when dividing into individual products without providing a special display area. In other words, it may be necessary to display position information such as forming a mounting mark on the surface (main surface) of the aggregate ceramic laminate due to manufacturing needs. By displaying information such as the formation of a mounting mark on the disposal margin part of the main surface of the body, it is possible to display information without causing an increase in the size of the aggregate ceramic laminate. Note that the information display mark is formed by avoiding the dummy conductor pattern of the discard margin, or using a material that can confirm the position information display mark even if it is formed on the dummy conductor pattern. By forming, the function as a position information display mark can be fulfilled.

  In addition, when the dummy conductor pattern is not disposed in the disposal margin portion provided with the position information display mark on the surface of the aggregate ceramic laminate as in claim 4, the position information display mark is high. Ensures visibility and efficiently processes based on the position information display mark (for example, a mounting process when the position information display mark is a mounting mark or a dividing process when the position information display mark is a divided position mark) When implemented well, it is possible to obtain an aggregate ceramic laminate capable of efficiently producing individual products.

  Moreover, the manufacturing method of the sintered aggregate ceramic laminated body concerning this invention is an assembly | attachment in the state which made the constraining layer contact | adhere to at least one main surface of the aggregate ceramic laminated body in any one of Claims 1-4. Since the ceramic laminate is sintered but the constraining layer is fired under conditions that do not sinter, the constraining layer is removed to obtain a sintered body of the aggregate ceramic laminate. Since there is little difference between the shrinkage behavior and the disposal margin, and the shrinkage in the planar direction is suppressed by the constraining layer, individual products with higher dimensional accuracy and less variation in characteristics can be manufactured efficiently. It is possible to obtain a sintered aggregate ceramic laminate that can be obtained.

  Further, since the aggregate ceramic multilayer substrate according to claim 6 is obtained by firing the aggregate ceramic laminate according to any one of claims 1 to 4, after mounting the chip-type electronic component on its main surface, or In particular, by dividing at a predetermined position without mounting chip-type electronic components, it is possible to efficiently obtain a ceramic multilayer substrate by a plurality of methods.

  A ceramic multilayer substrate according to claim 7 is produced by firing the aggregate ceramic laminate according to any one of claims 1 to 4 and dividing it into sub-substrates which are individual products, and is efficiently manufactured. Therefore, it is possible to provide a ceramic multilayer substrate that has less variation in characteristics and is excellent in economy.

  Hereinafter, the features of the present invention will be described in more detail with reference to examples of the present invention.

  In the first embodiment, a ceramic green sheet having a product part in which a plurality of product conductor patterns serving as conductors of individual products are arranged and a disposal margin part around the product part is laminated and pressed. An explanation will be given by taking an aggregate ceramic laminate as an example. The aggregate ceramic laminate can be obtained by, for example, mounting a chip-type electronic component after firing, removing a discard margin and dividing it at a predetermined position to obtain a plurality of ceramic multilayer substrates. This is a collective ceramic laminate used when a ceramic multilayer substrate is manufactured by a so-called multiple method.

First, a crystallized glass powder mixed with SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and CaO and alumina powder were mixed at an equal weight ratio to obtain a mixed powder.
Then, 15 parts by weight of polyvinyl butyral, 40 parts by weight of isopropyl alcohol, and 20 parts by weight of troll were added to 100 parts by weight of this mixed powder, and mixed with a ball mill for 24 hours to form a slurry.

  This slurry was extended by a doctor blade method to produce a green sheet having a thickness of 120 μm. Then, the green sheet was cut into 100 mm □ to obtain a ceramic green sheet.

Next, via holes (through holes) for interlayer connection were formed in the ceramic green sheet, and a conductor pattern serving as an inner layer conductor was formed by printing in a region including the via holes.
In Example 1, a ceramic green sheet on which a conductor pattern including a capacitor forming electrode pattern (capacitor electrode pattern) is disposed and a conductor pattern not including the capacitor forming electrode pattern are disposed as inner layer conductors. A ceramic green sheet was formed.

FIG. 1 is a plan view showing an example of a ceramic green sheet on which a conductor pattern including a capacitance forming electrode pattern (capacitance electrode pattern) is arranged. As shown in FIG. 1, in the ceramic green sheet 1, a product conductor pattern 11 serving as a conductor of each product is disposed in a plurality of product portions 10 serving as individual products. 11 includes a capacitance forming electrode pattern 12 and another inner layer conductor pattern 13.
Note that illustration of the ceramic green sheet on which the conductor pattern not including the capacitor forming electrode pattern is disposed is omitted.

  In Example 1, as shown in FIG. 1, the ceramic green sheet 1 on which the product conductive pattern 11 including the capacitor forming electrode pattern 12 is formed is disposed in the disposal allowance portion 20 in the product portion 10. A dummy conductor pattern 21 having the same shape as the disposed product conductor pattern 11 was disposed in the same manner as the product portion 10. However, the via hole was not formed in the abandon part. This is because it is usually preferable not to form a via hole in the disposal allowance portion because a difference in elongation or deformation between the product portion and the disposal allowance portion at the time of crimping can be reduced.

  Further, as shown in FIG. 2, the ceramic green sheet that constitutes one main surface (upper surface) of the aggregate ceramic laminate formed by laminating these ceramic green sheets is shown in FIG. The product conductor pattern 11 includes the capacitance forming electrode pattern 12, but no dummy conductor pattern is provided in the discard margin 20, and only the mounting mark 22 for aligning the chip type electronic component to be mounted is provided. Was formed by printing.

  Furthermore, even if the product green is a ceramic green sheet in which the product conductor pattern is disposed, the dummy conductor pattern is formed in the disposal portion for the product conductor pattern that does not include the capacitance forming electrode pattern. Did not. Also, no via hole was formed in the abandoned part.

Then, the ceramic green sheets produced as described above were laminated in a predetermined order, and pressed and adhered at a pressure of 50 Mpa and a temperature of 60 ° C. to obtain an aggregate ceramic laminate.
Next, after the obtained aggregate ceramic laminate was heated at a temperature of 600 ° C. for 3 hours and then heated at a temperature of 900 ° C. for 1 hour, a sintered aggregate ceramic laminate was obtained.

In Example 2, an aggregate ceramic laminate was produced in a manner substantially similar to that of the aggregate ceramic laminate of Example 1 above.
However, in Example 2, as in Example 1, the ceramic green sheet on which the product conductor pattern including the capacitor forming electrode pattern was formed was disposed in the product part at the disposal portion. A dummy conductor pattern having the same shape as the product conductor pattern is disposed in the same manner as the product part, and the ceramic green sheet in which the product conductor pattern does not include the capacitor forming electrode pattern is also disposed in the disposal part. The dummy conductor pattern having the same shape as the product conductor pattern disposed in the part was disposed in the same manner as the product part.

As for the ceramic green sheet that constitutes one main surface (upper surface) of the aggregate ceramic laminate formed by laminating these ceramic green sheets, the product of the product section 10 is the same as in the first embodiment. The conductor pattern 11 includes the capacitance forming electrode pattern 12, but the dummy conductor pattern is not disposed in the discarding portion 20, and only the mounting mark 22 for positioning the chip-type electronic component is printed and formed. (See FIG. 2).
In addition, in any ceramic green sheet, a via hole was not formed in the discard margin.

Then, the ceramic green sheets produced as described above were laminated in a predetermined order, and pressed and adhered at a pressure of 50 Mpa and a temperature of 60 ° C. to obtain an aggregate ceramic laminate.
Next, after the obtained aggregate ceramic laminate was heated at a temperature of 600 ° C. for 3 hours and then heated at a temperature of 900 ° C. for 1 hour, a sintered aggregate ceramic laminate was obtained.

  In this Example 3, a case where a sintered aggregate ceramic laminate used for manufacturing a ceramic multilayer substrate by a method of taking a plurality of pieces is manufactured by a so-called non-shrinking method will be described.

<Preparation of ceramic green sheet for forming aggregate ceramic laminate>
First, a crystallized glass powder mixed with SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and CaO and alumina powder were mixed at an equal weight ratio to obtain a mixed powder.
Then, 15 parts by weight of polyvinyl butyral, 40 parts by weight of isopropyl alcohol, and 20 parts by weight of troll were added to 100 parts by weight of this mixed powder, and mixed with a ball mill for 24 hours to form a slurry.
This slurry was extended by a doctor blade method to produce a ceramic green sheet having a thickness of 120 μm and cut to 100 mm □ to obtain a ceramic green sheet for forming an aggregate ceramic laminate.

<Preparation of alumina green sheet for constraining layer>
15 parts by weight of polyvinyl butyral, 40 parts by weight of isopropyl alcohol, and 20 parts by weight of troll were added to 100 parts by weight of alumina powder having an average particle diameter of 1.0 μm, and mixed with a ball mill for 24 hours to form a slurry.
Then, the slurry was extended by a doctor blade method to produce a green sheet having a thickness of 120 μm, and cut to 100 mm □ to obtain an alumina green sheet for a constraining layer.

<Preparation of an aggregate ceramic laminate>
Next, via holes (through holes) for interlayer connection are formed in the ceramic green sheet for forming an aggregate ceramic laminate produced as described above, and a conductor pattern serving as an inner layer conductor is printed in a region including the via holes. Formed by.
In Example 3 as well, a ceramic green sheet provided with a conductor pattern including a capacitor forming electrode pattern (capacitive electrode pattern) and a conductor pattern not including the capacitor forming electrode pattern are provided as inner layer conductors. A ceramic green sheet was formed.

  For the ceramic green sheet 1 on which the product conductor pattern 11 including the capacitance forming electrode pattern 12 is formed, a dummy having the same shape as the product conductor pattern 11 disposed in the product part 10 is disposed in the disposal allowance part 20. The conductor pattern 21 was disposed in the same manner as the product portion 10 (see FIG. 1). However, the via hole was not formed in the abandon part.

  In addition, even if the product green is a ceramic green sheet in which the product conductor pattern is disposed in the product part, the dummy conductor pattern is formed in the disposal part when the product conductor pattern does not include the capacitor forming electrode pattern. Did not. Also, no via hole was formed in the abandoned part.

  Further, for the ceramic green sheet that constitutes one main surface (upper surface) of the aggregate ceramic laminate formed by laminating the ceramic green sheets, also in this Example 3, for the product of the product section 10 The conductor pattern 11 includes the capacitance forming electrode pattern 12, but the dummy margin pattern 20 is not disposed in the discarding portion 20, and only the mounting mark 22 for aligning the chip-type electronic component is printed and formed ( (See FIG. 2).

  Then, the alumina green sheet for the constraining layer, each ceramic green sheet on which the product conductor pattern or dummy conductor pattern, the mounting mark, etc. are formed as described above, and the alumina green sheet for the constraining layer are laminated in this order, A composite laminate comprising an aggregate ceramic laminate, which is a laminate of the ceramic green sheets, and alumina green sheets (constraint layers) disposed on both upper and lower sides thereof, and pressed at 50 Mpa and a temperature of 60 ° C. Formed.

Next, the composite laminate having a structure sandwiched by the constraining layers from the upper and lower sides is heated at a temperature of 600 ° C. for 3 hours, and then heated at a temperature of 900 ° C. for 1 hour, thereby forming an assembly that is a laminate of ceramic green sheets. The ceramic laminate was sintered.
Then, the constraining layer was removed from the fired aggregate ceramic laminate to obtain a sintered aggregate ceramic laminate.

In Example 4, an aggregate ceramic laminate was produced by a method according to the method of Example 1 described above.
However, in Example 4, the ceramic green sheet 1 having the position information display area 30 for attaching the position information display mark (mounting mark) 22 (see FIG. 3) to the outer side of the disposal allowance portion 20 was used.

  As for the ceramic green sheet that constitutes one main surface (upper surface) of the aggregate ceramic laminate formed by laminating the ceramic green sheets, as shown in FIG. The conductor pattern 21 is provided, and a position information display mark (mounting mark) is attached to the position information display area 30 outside the discard margin 20.

Others were laminated and fired in the same procedure as in Example 1 to produce an aggregate ceramic laminate.
In FIG. 3, the parts denoted by the same reference numerals as those in FIGS. 1 and 2 indicate the same or corresponding parts.

<Evaluation>
About the sintered aggregate ceramic laminated body produced as described above in Examples 1 to 4 above, it is formed in the product part in the area located at the outermost peripheral part among the product parts to be divided into a plurality of products. The ratio of the capacitance to be formed and the capacitance formed in the product portion of the area located in the center away from the outermost peripheral portion was examined, and the state of variation in characteristics was examined.
For comparison, samples of Comparative Examples 1, 2, 3 and 4 below were prepared and their characteristics were examined.

<Comparative Example 1>
Of the ceramic green sheets that make up the aggregate ceramic laminate, regardless of whether the product conductor pattern includes a capacitance forming conductor pattern, the ceramic green sheet in which no dummy conductor pattern is formed in any discarded portion Sheet 1 (see FIG. 4) was prepared, and an assembled ceramic laminate was produced using this ceramic green sheet.

<Comparative Example 2>
Among the ceramic green sheets constituting the aggregate ceramic laminate, the product conductor pattern is a ceramic green sheet including a capacitance forming conductor pattern, as shown in FIG. A ceramic green sheet having a pattern was prepared.
Further, as the ceramic green sheet in which the product conductor pattern does not include the capacitance forming conductor pattern, a ceramic green sheet in which the conductor pattern is not formed in the disposal margin portion was prepared.
Then, using these ceramic green sheets, an aggregate ceramic laminate of Comparative Example 2 was produced in the same manner as in Example 1 above.

<Comparative Example 3>
Among the ceramic green sheets constituting the aggregate ceramic laminate, the product conductor pattern is a ceramic green sheet including a capacitance forming conductor pattern, as shown in FIG. A ceramic green sheet printed with a strip-shaped conductor pattern (a conductor pattern having the same area as the product conductor pattern but having a different shape) was prepared.
Further, as the ceramic green sheet in which the product conductor pattern does not include the capacitance forming conductor pattern, a ceramic green sheet in which the conductor pattern is not formed in the disposal margin portion was prepared.
And the aggregate ceramic laminated body of the comparative example 3 was produced by the method similar to the case of the said Example 1 using these ceramic green sheets.

<Comparative example 4>
Among the ceramic green sheets constituting the aggregate ceramic laminate, as a ceramic green sheet in which the product conductor pattern includes a capacitance forming conductor pattern, as shown in FIG. Prepared a ceramic green sheet on which a rectangular conductor pattern without a conductor pattern (a conductor pattern having the same area as the conductor pattern for a product but having a different shape) was printed.
Further, as the ceramic green sheet in which the product conductor pattern does not include the capacitance forming conductor pattern, a ceramic green sheet in which the conductor pattern is not formed in the disposal margin portion was prepared.
And the aggregate ceramic laminated body of the comparative example 4 was produced by the method similar to the case of the said Example 1 using these ceramic green sheets.
In addition, in FIGS. 4-7 which show the ceramic green sheet used by Comparative Examples 1-4, the part which attached | subjected the same code | symbol as FIGS. 1-3 has shown the part which is the same or it corresponds.

  Table 1 shows the measurement results of the characteristics of the samples of Examples 1 to 4 and Comparative Examples 1 to 4.

  From Table 1, the ratio of the capacity formed in the product part of the area located in the outermost peripheral part to the capacity formed in the product part of the area located in the center away from the outermost peripheral part (in Table 1, the capacity As for the ratio (abbreviated as the capacity of the outermost peripheral area / capacity of the central area), in Examples 1 to 4, the ratio of the capacity of the outermost peripheral area / the capacity of the central area is 1.0, There is no difference between the capacity formed in the product part of the area located at the outermost peripheral part of the aggregate ceramic laminate and the capacity formed in the product part of the area located in the center away from this outermost peripheral part, It was confirmed that an aggregate ceramic laminate with little variation in capacity in each product part was obtained.

  However, in the case of Example 4 in which the position information display area for disposing the position information display mark is provided on the further outer side of the disposal margin part, the dimensions of the aggregate ceramic laminate are increased. As for the ceramic green sheet that constitutes one main surface (upper surface) of the aggregate ceramic laminate, a dummy conductor pattern is not disposed in the abandon part, but a position information display mark is disposed here. It is desirable to adopt a configuration that does this.

On the other hand, in the case of Comparative Example 1 in which no dummy conductor pattern is formed in any discard margin, the capacity ratio (capacity of the outermost peripheral area / capacity of the central area) is 1.08. It was confirmed that the capacity variation was large.
This is because the dummy conductor pattern is not formed in the discard margin part in the process of crimping after laminating the ceramic green sheets, so the discard margin part is easier to extend than the product part, and the product part in the outermost peripheral area is This is thought to be the result of the influence.

Also, in the case of Comparative Example 2 in which the conductor pattern is printed on the entire surface of the discard margin as the dummy conductor pattern, the capacity ratio (capacity of the outermost peripheral area / capacity of the central area) is 1.04. It was confirmed that the capacity variation was large.
The disposal margin portion where the dummy conductor pattern having the shape of this comparative example is formed has less elongation than the product portion. In this case, after laminating the ceramic green sheets, the product part to be stretched is thrown inward in the process of crimping, and the product part is distorted, resulting in increased capacity variation. It is done.

Further, the area of the dummy conductor pattern is the same as that of the product conductor pattern, but a thin strip conductor pattern having a different shape is used as a dummy conductor pattern, and the area of the dummy conductor pattern is the same as that of the product conductor pattern. In the case of Comparative Example 4 in which a hollow rectangular conductor pattern having a different shape is a dummy conductor pattern, the capacitance ratio (capacity of the outermost peripheral area / capacity of the central area) is 1.02 (Comparative Example 3). ), 1.02 (Comparative Example 4), it was confirmed that capacity variation occurred.
From these results, as in Comparative Examples 3 and 4, even if the area of the dummy conductor pattern is the same as that of the product conductor pattern, if the shape is different, the state of elongation differs. If not, it can be seen that capacity variation occurs.

  From the above results, as in the present invention, the dummy conductor pattern having the same shape as the product conductor pattern disposed in the product part is the same as the product part in the disposal part as at least a part of the ceramic green sheet. By using the ceramic green sheet disposed in the mode, the difference in elongation between the product portion and the disposal margin portion is suppressed in the crimping process after the ceramic green sheets are laminated, and the characteristics of It was confirmed that an aggregate ceramic laminate capable of efficiently producing individual products with little fluctuation was obtained.

  In addition, after mounting the chip-type electronic component on the surface of the aggregate ceramic laminate of each of the above embodiments, the discard margin is removed and divided at a predetermined position, so that there is little variation in characteristics and high reliability. A ceramic multilayer substrate can be efficiently obtained by a so-called multiple-chip method.

  Further, in the above embodiment, the description has been given by taking as an example a collective ceramic laminate for producing a ceramic multilayer substrate by a method of taking a plurality of pieces. The present invention can be applied not only to a body but also to an aggregate ceramic multilayer body required in the manufacturing process of various multilayer ceramic electronic components such as a multilayer capacitor, a multilayer LC composite component, and a multilayer coil component.

  Further, in the above embodiment, an example of an aggregate ceramic laminate used when the aggregate ceramic laminate is fired and then divided into individual products is described as an example. However, depending on the type of product, an unfired aggregate ceramic is described. Although the laminate may be fired after being divided, the present invention can also be applied to such applications.

  The present invention is not limited to the above-described embodiments in other points, and various applications and modifications can be made within the scope of the invention.

As described above, according to the present invention, in the crimping process after laminating the ceramic green sheets, the difference in elongation between the product portion and the disposal allowance portion is suppressed, and the variation in characteristics can be reduced by a so-called multiple removal method. An aggregate ceramic laminate capable of efficiently producing a small number of individual products can be obtained. Moreover, by using the aggregate ceramic laminate of the present invention, an aggregate ceramic multilayer substrate that is a precursor of the ceramic multilayer substrate and a ceramic multilayer substrate obtained by dividing the multilayer ceramic substrate can be efficiently manufactured.
Therefore, the present invention can be widely applied to technical fields related to various multilayer ceramic electronic components such as ceramic multilayer substrates, multilayer capacitors, multilayer LC composite components, multilayer coil components and the like.

It is a top view which shows the ceramic green sheet by which the conductor pattern containing the electrode pattern for capacity | capacitances used for producing the aggregate ceramic laminated body concerning Example 1 of this invention was arrange | positioned. 1 is a ceramic green sheet constituting one main surface of an aggregate ceramic laminate used for producing an aggregate ceramic laminate according to Example 1 of the present invention, in which a dummy conductor pattern is formed at a disposal margin It is a top view which shows the ceramic green sheet in which only the mounting mark for aligning the chip-type electronic component which should be mounted was formed. It is a top view which shows the ceramic green sheet which has the area for attaching a positional information display mark (mounting mark) to the further outer side of the disposal margin part used in Example 4 of this invention. It is a top view which shows the ceramic green sheet in which the conductor pattern was not formed in the discard margin part used for producing the aggregate ceramic laminated body of the comparative example 1. FIG. It is a top view which shows the ceramic green sheet which printed the conductor pattern on the whole surface of the discard part as a dummy conductor pattern used for producing the aggregate ceramic laminated body of the comparative example 2. It is a top view which shows the ceramic green sheet which printed the thin strip | belt-shaped conductor pattern as the dummy conductor pattern used for producing the aggregate ceramic laminated body of the comparative example 3 in the discard margin part. As a dummy conductor pattern used to produce the aggregate ceramic laminate of Comparative Example 4, a ceramic green sheet having a rectangular conductor pattern with no conductor pattern printed on the inside is disposed as the dummy conductor pattern. It is a top view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Ceramic green sheet 10 Product part 11 Conductor pattern for products 12 Electrode pattern for capacity | capacitance formation 13 Inner layer conductor patterns other than the electrode pattern for capacity | capacitance formation 20 Disposal allowance part 21 Dummy conductor pattern 22 Position information display mark (mounting mark)
30 Location information display area

Claims (7)

An assembly ceramic laminate in which ceramic green sheets having a product portion in which a plurality of product conductor patterns serving as conductors of individual products are disposed and a disposal portion that is a region around the product portion are laminated. ,
The aggregate ceramic laminate, wherein a dummy conductor pattern having the same shape as the product conductor pattern disposed in the product portion is disposed in the discarding portion in the same manner as the product portion. .   The product conductor pattern of the product part includes a capacitor forming electrode pattern, and the product conductor pattern including the capacitor forming electrode pattern also in the abandon part which is an area around the product part; 2. The aggregate ceramic laminate according to claim 1, wherein dummy conductor patterns having the same shape are arranged in the same manner as the product portion.   The ceramic green sheet is laminated in such a manner that the surface on which the product conductor pattern is disposed is the surface of the aggregate ceramic laminate, and the disposal margin portion on the surface of the aggregate ceramic laminate is 3. The aggregate ceramic laminate according to claim 1, wherein a position information display mark is attached.   4. The aggregate ceramic laminate according to claim 3, wherein a dummy conductor pattern is not disposed in the discard margin portion to which the position information display mark is attached on the surface of the aggregate ceramic laminate. A state in which a constraining layer mainly comprising ceramic powder that is not sintered at the sintering temperature of the aggregate ceramic laminate is adhered to at least one main surface of the aggregate ceramic laminate according to any one of claims 1 to 4. In the firing step of firing under the condition that the aggregate ceramic laminate is sintered but the constraining layer is not sintered,
And a step of obtaining the sintered body of the aggregate ceramic laminate by removing the constraining layer after completion of the firing step.   An aggregate ceramic multilayer substrate, wherein the aggregate ceramic laminate according to any one of claims 1 to 4 is fired.   A ceramic multilayer substrate, wherein the aggregate ceramic laminate according to any one of claims 1 to 4 is fired and divided into sub-substrates that are individual products.

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