JP2004152908A - Process for producing multilayer ceramic body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for producing a multilayer ceramic body in which a level difference due to a conductor pattern formed on a ceramic green sheet can be eliminated and variance in the area of the conductor pattern can be suppressed by suppressing a blur even when a low viscosity conductor paste is used. <P>SOLUTION: The process for producing a multilayer ceramic body includes a step for forming a rectangular conductor pattern 5 on the surface of a ceramic green sheet 3a, a step for forming a ceramic pattern 7 in a part surrounding a region for forming the conductor pattern 5, a step for superposing another ceramic green sheet 3b on the upper surface of the ceramic green sheet 3a on which the conductor pattern 5 and the ceramic pattern 7 are formed, and a step for forming a parent multilayer body 13 by repeating these steps. <P>COPYRIGHT: (C)2004,JPO

Description

【００６０】
表１の結果から明らかなように、本発明である導体パターンを形成後にセラミックパターンを形成して逐次積層を行うＡ工程（試料Ｎｏ．１〜３）、およびセラミックパターンを形成後に導体パターンを形成して逐次積層を行うＢ工程（試料Ｎｏ．４〜６）では、耐熱衝撃試験後のデラミ発生数が１００個中最大で５個であったものの、焼成前の密着不良数および焼成後のデラミ発生数が１００個中２個以下でデラミネーションが少なく、静電容量のばらつきが１．６％以下で短絡率も改善された。特に、セラミックパターンを形成後に導体パターンを形成して逐次積層を行うＢ工程では、耐熱衝撃試験後のデラミ発生数が１００個中最大で２個であったものの、焼成前の密着不良数および焼成後のデラミ発生数が無かった。また、静電容量のばらつきが１．１％以下で短絡も無かった。
【００６１】
これに対し、従来の、導体パターンのみを形成して逐次積層を行うＣ工程（試料Ｎｏ．７）、および、従来の一括積層工程（試料Ｎｏ．８）ではデラミネーションや静電容量のばらつき、短絡率の不良が多かった。
【００６２】
【発明の効果】
以上詳述したとおり、本発明によれば、セラミックグリーンシート上に形成した導体パターンに隣接してセラミックパターンを形成し、この上面に再びセラミックグリーンシートを重ね合わせる工程を用いることにより、薄層化されたセラミックグリーンシートを用いる場合であっても、そのセラミックグリーンシートの密着性まで考慮することなく導体パターンによる段差を容易に低減することができる。
【００６３】
また、セラミックグリーンシート上にセラミックパターンを形成した後に導体パターンを形成するという工程を採用することにより、導体パターンの周辺がセラミックパターンに囲まれた状態となり、印刷時のにじみを抑制でき、静電容量のばらつきや短絡を抑制することができる。
【図面の簡単な説明】
【図１】本発明の、導体パターンを形成した後にセラミックパターンを形成し、逐次積層工程を行い、セラミック積層体を製造するための工程図である。
【図２】セラミックグリーンシート上に形成された導体パターンおよびセラミックパターンの配置を示す斜視図である。
【図３】図１のセラミック積層体の製法において、キャリアフィルムのついたセラミックグリーンシートを用い、重ね合わせ後に剥離する工程を具備する工程を示す工程図である。
【図４】本発明の、セラミックパターンを形成した後に導体パターンを形成し、逐次積層を行い、セラミック積層体を製造するための工程図である。
【図５】従来の、セラミックグリーンシート上に導体パターンのみを形成し、逐次積層を行い、セラミック積層体を製造するための工程図である。
【図６】従来の、予めセラミックグリーンシート上に導体パターンおよびセラミックパターンを形成したものを、一括積層を行い、セラミック積層体を製造するための工程図である。
【符号の説明】
１ 支持体
３ａ、３ｂ セラミックグリーンシート
５ 導体パターン
７ セラミックパターン
１３ 母体積層体[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for producing a ceramic laminate, and more particularly to a method for producing a ceramic laminate in which ceramic green sheets and conductor patterns are formed into thin layers, such as a wiring board and a multilayer ceramic capacitor.
[0002]
[Prior art]
2. Description of the Related Art In recent years, with the miniaturization and high-density mounting of electronic devices, a wiring board and a multilayer ceramic capacitor in which a conductor pattern is formed in a ceramic laminate are required to be small and thin and have high dimensional accuracy. For this reason, for example, in multilayer ceramic capacitors, ceramic green sheets and conductor patterns have been made thinner and more multilayered in order to reduce the size and increase the capacitance.
[0003]
Usually, such a laminated ceramic capacitor first forms a plurality of rectangular conductor patterns by printing a conductor paste on the surface of the ceramic green sheet, and then superposes a plurality of ceramic green sheets on which the conductor pattern is formed. Then, the base laminate is formed by laminating the base laminate, and further, the base laminate is cut at a predetermined position and fired to be manufactured.
[0004]
However, as described above, in a manufacturing method using a step of forming a conductor pattern on the surface of a ceramic green sheet or a step of laminating a plurality of ceramic green sheets on which a conductor pattern has been formed in advance, the ceramic green sheet to be used is extremely large. Due to the thinness, wrinkles are formed on the ceramic green sheet during printing or lamination, and after lamination, there is a problem that delamination is easily generated between the ceramic green sheet and the conductor pattern due to the space formed by the wrinkles. Was.
[0005]
To cope with such a problem, a device disclosed in Patent Document 1 is known. According to the manufacturing method disclosed in Patent Document 1, as shown in FIG. 5, an extremely thin ceramic green sheet 53b having good adhesion is provided on the surface of a normal ceramic green sheet 53a placed on a support body 51. The conductive pattern is formed by printing a conductive paste on the surface of the very thin ceramic green sheet 53b with good adhesion, and then on the very thin ceramic green sheet 53b with good adhesion. Again, an ultra-thin ceramic green sheet 53b with good adhesion is overlaid so as to cover the conductor pattern 55 formed on the substrate. Then, the step of forming the conductor pattern 55 and the step of overlapping the ultra-thin ceramic green sheets 53b having good adhesion are repeated to form the base laminate 63. In other words, it is described that the use of the sequential laminating step can prevent wrinkles of the ceramic green sheets 53a and 53b and delamination occurring in the base laminate 63, which are problems in the collective laminating step.
[0006]
In recent years, as the ceramic green sheets 53a and 53b are made thinner and more multilayered, measures have been taken to eliminate a step due to the thickness of the conductor pattern 55 formed on the ceramic green sheets 53a and 53b (for example, Patent Document 2).
[0007]
In the method of manufacturing a ceramic laminate disclosed in Patent Document 2, as shown in FIG. 6, a ceramic pattern 85 having the same height as a conductor pattern 83 formed on a main surface of a ceramic green sheet 81 is formed. Accordingly, it is described that a step due to the thickness of the conductor pattern 83 can be substantially eliminated, and the ceramic green sheets 81 can be laminated without being affected by the thickness of the conductor pattern 83. In the method of manufacturing such a ceramic laminate, first, a plurality of conductor patterns 83 are formed on the main surface of the ceramic green sheet 81 at predetermined intervals by printing a conductor paste. Then, a ceramic paste containing a ceramic powder is printed to form a ceramic pattern 85.
[0008]
[Patent Document 1]
Japanese Patent Publication No. 8-4045 [Patent Document 2]
JP 2000-311831 A
[Problems to be solved by the invention]
However, even when the manufacturing method disclosed in Patent Document 1 is used, when the thickness of the ceramic green sheets 53a, 53b is so thin that there is no difference in thickness between the ceramic green sheets 53a, 53b and the conductor pattern 55 to be used. However, there still remains a problem that the increase in the number of layers causes an effect of a step due to the conductor pattern 55, so that delamination occurring in the base laminate 63 and the laminated molded body after cutting cannot be eliminated.
[0010]
Further, in the manufacturing method disclosed in Patent Document 2 described above, the conductive paste used has a reduced content of metal powder and reduced viscosity in order to reduce the thickness of the conductive pattern 83. When the conductive paste is printed, bleeding is likely to occur, and therefore, the area of the conductive pattern 83 varies widely. For example, when a multilayer ceramic capacitor is formed, the variation of the capacitance increases or the short circuit occurs. However, there is a problem that the problem is easily caused.
[0011]
Therefore, the present invention provides a method for manufacturing a ceramic laminate in which a step due to a conductor pattern formed on a ceramic green sheet can be eliminated and variations in the area of the conductor pattern can be suppressed even when a low-viscosity conductor paste is used. The purpose is to do.
[0012]
[Means for Solving the Problems]
The method for producing a ceramic laminate of the present invention comprises: (a) placing a ceramic green sheet on a support;
(B) forming a rectangular conductor pattern on the surface of the ceramic green sheet;
(C) superposing another ceramic green sheet on the upper surface of the ceramic green sheet on which the conductor pattern is formed;
(D) a step of repeating steps (b) and (c) to form a matrix laminate in which the ceramic green sheets and the conductor patterns are alternately laminated;
(E) cutting the matrix laminate at a predetermined position to form a laminate molded body;
In a method for producing a ceramic laminate comprising
A step of forming a ceramic pattern on a portion of the matrix laminate surrounding a region where the conductor pattern is formed on the main surface of the ceramic green sheet.
[0013]
According to this manufacturing method, since the ceramic pattern is formed adjacent to the conductor pattern formed on the ceramic green sheet, even when a thin ceramic green sheet is used, the ceramic green sheet adheres tightly. The step due to the conductor pattern can be easily reduced without considering the performance.
[0014]
In the method for manufacturing a ceramic laminate, it is desirable to form a ceramic pattern after forming a conductor pattern. The conductor pattern is colored to contain the metal powder, and usually, since the ceramic powder is white, the color contrast between the conductor pattern and the ceramic green sheet tends to be easily obtained. Positioning of pattern printing of a ceramic pattern to be formed later can be easily performed.
[0015]
In the method for manufacturing a ceramic laminate, the base laminate is formed by forming a ceramic pattern on a portion of the main surface of the ceramic green sheet surrounding a region where the conductor pattern is formed, and then forming the conductor pattern inside the ceramic pattern. It is desirable to be manufactured.
[0016]
That is, by forming the enclosure with the ceramic pattern first, the periphery of the conductor pattern is surrounded by the ceramic pattern, and even if printed using a low-viscosity conductor paste, bleeding can be suppressed, for example, a multilayer ceramic capacitor Of the capacitor and short circuit can be prevented.
[0017]
In the method for producing a ceramic laminate, the ceramic green sheet is obtained by laminating a carrier film, and after laminating the ceramic green sheet on the upper surface of the ceramic green sheet on the support, removing the carrier film. It is desirable to have. That is, when the ceramic green sheets are successively laminated as in the present invention, the ceramic green sheet supported by the carrier film on one side thereof is suitable for printing both patterns, When superimposed on the conductor pattern and the ceramic pattern on the lower layer side, wrinkles due to heating under pressure or the like can be suppressed.
[0018]
Further, when the carrier film is bonded to the pressing surface side in this way, the lamination head used when laminating the ceramic green sheets comes into contact with the ceramic green sheets via the carrier film, and the heat and pressure are further reduced. It can be transmitted gently, and the deterioration of the top surface of the ultra-thin ceramic green sheet with good adhesion due to heat is suppressed, and the homogeneity of the ceramic green sheet can be maintained. Further, adhesion of dust on the ceramic green sheet can be prevented.
[0019]
In the method for manufacturing a ceramic laminate, it is desirable that the relationship of t1 / t2 ≧ 0.5 is satisfied, where t1 is the thickness of the conductor pattern and t2 is the thickness of the ceramic green sheet in the step (c). According to the present invention, it is possible to eliminate a step due to the conductor pattern formed on the ceramic green sheet, but in particular, the ceramic green sheet is thinned so that there is no thickness difference from the thickness of the conductor pattern as described above. It can be suitably used in such cases.
[0020]
In the method of manufacturing a ceramic laminate, it is preferable that the peripheral portion of the ceramic pattern is formed by an inclined surface having an angle of 0.5 ° or more with respect to the main surface of the ceramic green sheet. By setting the angle of the inclined surface of the peripheral portion of the ceramic pattern to the above-mentioned angle or more, it is possible to suppress the bleeding or running up of the conductive paste during printing, and it is possible to further reduce the variation in the effective area of the conductive pattern.
[0021]
In the method for producing a ceramic laminate, it is desirable that the ceramic component in the ceramic green sheet and the ceramic component in the ceramic pattern have substantially the same composition.Furthermore, in the method for producing a ceramic laminate, It is desirable that the conductor pattern be an internal electrode layer of the multilayer ceramic capacitor after firing.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
The method for manufacturing a ceramic laminate of the present invention is suitably applied to, for example, a multilayer ceramic capacitor which is one of electronic components. Therefore, a description will be given below based on a process diagram of a method of manufacturing a ceramic laminate shown in FIG.
[0023]
As shown in FIG. 1A, first, a plurality of ceramic green sheets 3a are placed on a support 1, and an electrodeless portion 4a having a predetermined thickness serving as a margin portion of the multilayer ceramic capacitor is formed.
[0024]
As the ceramic green sheet 3a of the present invention, for example, a mixture of ceramic powder, an organic binder, and a solvent that dissolves the organic binder is preferably used.
[0025]
As the ceramic powder, for example, a ceramic powder mainly containing BaTiO ₃ is preferably used. Further, glass powder may be added as a known additive or sintering aid for increasing the reduction resistance.
[0026]
Further, the thickness of the ceramic green sheet 3a is desirably 5 μm or less, particularly preferably 1.5 to 4 μm, from the viewpoint of miniaturization and large capacity.
[0027]
Next, as shown in FIG. 1B, a plurality of rectangular conductive patterns 5 are formed at equal intervals by printing a conductive paste on one main surface of the uppermost layer of the stacked ceramic green sheets 3a. I do.
[0028]
Here, the thickness of the conductor pattern 5 is desirably 3 μm or less, and particularly desirably 1 μm or less from the viewpoint of miniaturization and high reliability of the capacitor. Further, the relationship between the thickness of the ceramic green sheets 3a and 3b and the thickness of the conductor pattern 5 is t1 / t2 ≧ 0.5, where t1 is the thickness of the conductor pattern and t2 is the thickness of the ceramic green sheets 3a and 3b. The method of the present invention is particularly suitable for forming a thickness difference such that the effect of the step due to the conductor pattern 5 becomes large enough to satisfy the following. And it is more preferable that the t1 / t2 ratio is 0.7 or more.
[0029]
As the conductor paste used in the production method of the present invention, a paste containing metal particles, an organic solvent, and an organic binder soluble in the organic solvent is preferably used.
[0030]
As the metal particles, at least one type of metal particles selected from the group consisting of Ni, Co, and Cu is preferable. However, Ni is preferable because the firing temperature of the metal matches the firing temperature of a general insulator and the cost is low. Is desirable. In addition, as a solid content, it is preferable to use a mixture of fine ceramic powder in addition to the metal particles in order to suppress the sinterability of the conductor pattern 5.
[0031]
Furthermore, the organic binder and the organic solvent of the conductor paste can adopt the same conditions as the printing of the ceramic paste, and the volatilization rate of the organic binder from the surfaces of the ceramic green sheets 3a and 3b is matched. The conductor paste preferably has the same composition as the ceramic paste. In the present invention, it is preferable that the conductor pattern 5 formed in this way be an internal electrode layer of a multilayer ceramic capacitor as one of the electronic components.
[0032]
Next, as shown in FIG. 1C, a ceramic pattern 7 is formed by printing a ceramic paste on a portion surrounding the region of the conductor pattern 5. That is, in the present invention, it is important to form the conductor pattern 5 and the ceramic pattern 7 on the ceramic green sheet 3a. That is, as shown in FIG. 2, a plurality of rectangular conductor patterns 5 are formed on the ceramic green sheet 3a at a predetermined interval L, and a ceramic pattern 7 is formed around the conductor pattern 5.
[0033]
Further, in the manufacturing method of the present invention, the thickness of the conductor pattern 5 and the ceramic pattern 7 formed on the ceramic green sheets 3a and 3b is substantially reduced in that the step due to the conductor pattern on the ceramic green sheets 3a and 3b is reduced as much as possible. It is desirable that they be the same.
[0034]
It is desirable that the conductor pattern 5 and the ceramic pattern 7 are in contact with each other at the peripheral portions thereof, and in that the gap between the two patterns 5 and 7 is reduced to prevent deformation, the ceramic pattern 7 is It is more desirable to overlap with the inclined surface 11 in the peripheral portion of.
[0035]
Here, the ceramic paste for forming the ceramic pattern 5 in the present invention contains ceramic powder, an organic solvent, and an organic binder soluble in the organic solvent.
[0036]
As the composition of the ceramic powder used for the ceramic paste, either the powder composition of the ceramic green sheet 3a or a different powder composition can be applied. However, since the firing shrinkage of the ceramic green sheet 3a and the ceramic pattern 7 are matched, It is desirable that the ceramic paste has substantially the same ceramic powder composition as the ceramic slurry forming the ceramic green sheet 3a. In the present invention, it is desirable that the conductor pattern 5 be formed before the ceramic pattern 7. Since the conductive paste containing the metal powder is colored and has a large color contrast with the ceramic green sheets 3a and 3b, it can be printed with good recognizability based on the conductive pattern.
[0037]
Next, as shown in FIG. 1D, on the upper surface side of the ceramic green sheet 3a on which the conductor pattern 5 and the ceramic pattern 7 are formed as described above, the conductor pattern 5 and the ceramic pattern 7 are covered. Another ceramic green sheet 3b is overlapped, and the conductor pattern 5 and the ceramic pattern 7 are brought into close contact with the ceramic green sheet 3b.
[0038]
Thereafter, the steps of FIGS. 1B to 1D are repeated so as to obtain a desired number of laminations, and finally, the layers are formed again in the step of FIG. 1A using the ceramic green sheets 3a. The non-electrode portions 4b having the same thickness are formed to form the base laminate 13.
[0039]
Note that, as described above, the present invention is a method in which, after the ceramic green sheets 3a or 3b are overlaid, the conductor pattern 5 and the ceramic pattern 7 are sequentially formed on the upper surface thereof by screen printing. In this respect, compared to the method of preparing a plurality of ceramic green sheets 3a and 3b on which the conductor patterns 5 and the ceramic patterns 7 are formed in advance and laminating them at once, displacement during lamination is less likely to be included. Since the positional accuracy of the conductor pattern 5 and the ceramic pattern 7 in FIG. 13 requires only the positional deviation of only the printing accuracy, the lamination accuracy is improved, the capacitance variation can be reduced, and the side margin and the end margin can be reduced. Can respond to the miniaturization of the ceramic laminate.
[0040]
In the manufacturing method of the present invention, as shown in FIG. 3, the ceramic green sheets 3a and 3b are preferably formed by laminating a carrier film 21. In this case, the ceramic green sheets 3a with the carrier film 21 are attached. 3b, the carrier film 21 is peeled off. According to this method, since the ceramic green sheets 3a and 3b are supported by the carrier film 21, the ceramic green sheets 3a and 3b can be adhered by pressing and heating after being superposed on the upper surface side of the conductor pattern 5 or the ceramic pattern 7. Elongation and deformation of the green sheets 3a and 3b can also be suppressed. Further, in this method, since the ceramic green sheets 3a and 3b are not adsorbed, defects of the ceramic green sheets 3a and 3b can be prevented.
[0041]
In addition, as shown in FIGS. 4A to 4E, in the manufacturing method of the present invention, the base laminate 13 includes a portion surrounding the region where the conductor pattern 5 is formed on the main surfaces of the ceramic green sheets 3a and 3b. After the ceramic pattern 7 is formed, the conductor pattern 5 can be formed inside the ceramic pattern 7 to produce the ceramic pattern 7.
[0042]
In this case, the angle of the inclined surface around the ceramic pattern is set to be smaller than that of the ceramic green sheet because the conductor pattern 5 formed after the ceramic pattern 7 can be prevented from running over during printing and the spread of the pattern due to bleeding can be prevented. It is desirable that the angle is 0.5 ° or more with respect to the main surface, and it is particularly desirable that the angle be 1 ° to 40 °. Also in this case, it is more desirable that the conductor pattern 5 overlaps the inclined surface of the peripheral portion of the ceramic pattern 7.
[0043]
FIG. 1 (e1) is a cross-sectional view on the side margin side of the base laminate 13 and FIG. 1 (e2) is a cross-sectional view on the end margin side. As shown in the figure, after cutting the base laminated body 13 at a dotted line portion C to form a laminated molded body, the laminated molded body is further fired under predetermined atmosphere and temperature conditions to form an external conductor. Thus, a multilayer ceramic capacitor having a ceramic layer and internal electrode layers is formed.
[0044]
Further, according to this manufacturing method, the formation accuracy of the conductor pattern 5 and the ceramic pattern 7 is improved, and the variation in capacitance can be reduced. Also, even if the number of layers is increased, the formation accuracy of the conductor pattern 5 is not affected. It is possible to achieve high lamination and enlargement of the ceramic laminate.
[0045]
【Example】
A multilayer ceramic capacitor, which is one of the ceramic laminates, was manufactured as follows.
[0046]
The ceramic green sheet was prepared by adding an organic binder and an organic solvent to a ceramic powder containing BaTiO ₃ as a main component to prepare a ceramic slurry, and forming a film having a thickness of 2 μm on a carrier film using a die coater method.
[0047]
On the other hand, a part contained in the ceramic slurry was pulverized, and these ceramic powders, an organic binder for paste and an organic solvent were kneaded with three rolls to prepare a ceramic paste.
[0048]
The conductor paste was prepared by forming Ni powder having an average particle size of 0.2 μm, the organic binder and the organic solvent used in the ceramic paste into a paste in the same manner as the ceramic paste.
[0049]
Next, a plurality of the obtained ceramic green sheets are placed on a support, and a conductor pattern is printed on the main surface thereof as a step A using a screen printing apparatus. A ceramic pattern was formed around the periphery. Thus, a ceramic green sheet on which the ceramic pattern was applied and formed together with the conductor pattern was produced. In this case, the thickness of the conductor pattern was 1.1 μm. The slope of the ceramic pattern was adjusted by the viscosity of the ceramic paste and the slope of the resist.
[0050]
Next, the ceramic green sheet was again overlaid on the upper surface of the ceramic green sheet on which the ceramic pattern was applied together with the conductor pattern, and this was repeated 300 times, so that the number of layers expressing capacitance was 300. Further, 10 ceramic green sheets each having no conductor pattern and no ceramic pattern formed thereon were laminated, and the first press was performed to form a base laminate.
[0051]
Next, as a step B, a ceramic pattern was printed first, and then a conductor pattern was formed around the ceramic pattern, and lamination was performed in the same manner as in the step A to produce a mother laminate. In each of the steps A and B, a method of peeling the carrier film every time the ceramic green sheets are laminated was used.
[0052]
Next, each of the matrix laminates manufactured in the steps A and B was cut into a lattice to obtain a laminate molded body. Thereafter, heating was performed at 250 ° C. in the air or 500 ° C. in a weakly reducing atmosphere to perform a de-buying treatment.
[0053]
Further, the laminated molded body after de-buying is fired at 1250 ° C. for 2 hours in a reducing atmosphere, and further re-oxidized at 900 ° C. for 4 hours in a weakly oxidizing atmosphere to obtain a ceramic laminated body. Got the body. After the firing, a Cu paste was baked at 900 ° C. on the end face of the ceramic laminate body, and further, Ni / Sn plating was performed to form external conductors alternately connected to the internal electrode layers.
[0054]
For evaluation, first, the thickness t1 of the printed conductor pattern was measured using a non-contact surface roughness meter (laser displacement meter), and the ratio t1 / t2 to the thickness t2 of the ceramic green sheet was determined. The angle of the inclined surface of the ceramic pattern was measured using a stylus type surface roughness meter.
[0055]
In addition, each of the 100 laminated molded bodies before firing was observed using a stereoscopic microscope to evaluate poor adhesion.
[0056]
Further, regarding the delamination, 100 pieces of each of the multilayer ceramic capacitors after firing and after the thermal shock test (280 ° C., immersion for 2 seconds) were polished from the end face and side face, respectively, and the number of delaminations generated in the peripheral portion of the inner conductor was measured Was evaluated.
[0057]
Next, the variation in the capacitance was calculated from the measured value of the capacitance of 100 laminated ceramic capacitors after firing. At the same time, the short-circuit (short) rate was determined from the measurement of the capacitance.
[0058]
On the other hand, as comparative examples, a mother laminate was formed by successive lamination using ceramic conductors on which only a conductor pattern was formed and no ceramic pattern was formed (step C), and a ceramic green sheet. Using a pattern on which both a conductor pattern and a ceramic pattern had been formed in advance, 300 layers were formed in the same manner as in the present example, and a mother body laminated body was fabricated by batch lamination (Step D). Laminated and fired samples were prepared and evaluated in the same manner as in the present invention.
[0059]
[Table 1]

[0060]
As is evident from the results in Table 1, step A (sample Nos. 1 to 3) in which a ceramic pattern is formed after the formation of the conductor pattern according to the present invention and successive lamination is performed, and a conductor pattern is formed after the formation of the ceramic pattern In the step B (samples Nos. 4 to 6) of successive lamination, the number of delaminations generated after the thermal shock test was a maximum of 5 out of 100. The number of occurrences was 2 or less out of 100, the delamination was small, the variation in capacitance was 1.6% or less, and the short circuit rate was improved. In particular, in the B step in which the conductor pattern is formed after the ceramic pattern is formed and the layers are successively laminated, the number of delaminations generated after the thermal shock test is a maximum of two out of 100, There were no later occurrences of delamination. In addition, there was no short circuit when the variation in capacitance was 1.1% or less.
[0061]
On the other hand, in the conventional step C (sample No. 7) in which only a conductor pattern is formed and successive lamination is performed, and in the conventional batch lamination step (sample No. 8), delamination and variation in capacitance are caused. There were many short circuit rate defects.
[0062]
【The invention's effect】
As described above in detail, according to the present invention, a ceramic pattern is formed adjacent to a conductor pattern formed on a ceramic green sheet, and a step of laminating the ceramic green sheet on the upper surface again is used to reduce the thickness. Even when the ceramic green sheet is used, the step due to the conductor pattern can be easily reduced without considering the adhesion of the ceramic green sheet.
[0063]
In addition, by adopting the process of forming the conductor pattern after forming the ceramic pattern on the ceramic green sheet, the periphery of the conductor pattern is surrounded by the ceramic pattern, and it is possible to suppress bleeding at the time of printing, and to reduce static electricity. Variations in capacitance and short circuits can be suppressed.
[Brief description of the drawings]
FIG. 1 is a process diagram for manufacturing a ceramic laminate by forming a ceramic pattern after forming a conductor pattern and sequentially performing a lamination process according to the present invention.
FIG. 2 is a perspective view showing an arrangement of a conductor pattern and a ceramic pattern formed on a ceramic green sheet.
FIG. 3 is a process chart showing a step of using a ceramic green sheet provided with a carrier film in the method for producing the ceramic laminate of FIG.
FIG. 4 is a process diagram of the present invention for forming a conductor pattern after forming a ceramic pattern, sequentially performing lamination, and manufacturing a ceramic laminate.
FIG. 5 is a conventional process diagram for manufacturing a ceramic laminate by forming only a conductor pattern on a ceramic green sheet and sequentially laminating the conductor patterns.
FIG. 6 is a conventional process diagram for manufacturing a ceramic laminate by collectively laminating conductor patterns and ceramic patterns on ceramic green sheets in advance.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Support 3a, 3b Ceramic green sheet 5 Conductive pattern 7 Ceramic pattern 13 Base laminate

Claims (8)

(A) placing a ceramic green sheet on a support; and (b) forming a rectangular conductor pattern on the surface of the ceramic green sheet.
(C) superposing another ceramic green sheet on the upper surface of the ceramic green sheet on which the conductor pattern is formed;
(D) a step of repeating steps (b) and (c) to form a matrix laminate in which the ceramic green sheets and the conductor patterns are alternately laminated;
(E) cutting the matrix laminate at a predetermined position to form a laminate molded body;
In a method for producing a ceramic laminate comprising
A method of manufacturing a ceramic laminate, comprising a step of forming a ceramic pattern on a portion of a main surface of the ceramic green sheet of the mother laminate that surrounds a region where the conductor pattern is formed. The method for producing a ceramic laminate according to claim 1, wherein the ceramic pattern is formed after the conductor pattern is formed. The mother laminate is formed by forming a ceramic pattern in a portion surrounding a region where a conductor pattern is formed on the main surface of the ceramic green sheet, and then forming the conductor pattern inside the ceramic pattern. The method for producing a ceramic laminate according to claim 1. The ceramic green sheet is obtained by laminating a carrier film, and after the ceramic green sheet is overlaid on the upper surface of the ceramic green sheet on the support, a step of peeling the carrier film is provided. A method for producing a ceramic laminate according to any one of claims 1 to 3. 5. The method according to claim 1, wherein the relationship of t1 / t2 ≧ 0.5 is satisfied, where t1 is the thickness of the conductor pattern and t2 is the thickness of the ceramic green sheet in the step (c). A method for producing the ceramic laminate described in the above. The ceramic laminate according to any one of claims 1 to 5, wherein a peripheral portion of the ceramic pattern is formed by an inclined surface having an angle of 0.5 ° or more with respect to a main surface of the ceramic green sheet. Recipe. 7. The method according to claim 1, wherein the ceramic component contained in the ceramic green sheet and the ceramic component contained in the ceramic pattern are substantially composed of the same composition. The method according to any one of claims 1 to 7, wherein the conductive pattern becomes an internal electrode layer of the multilayer ceramic capacitor after firing.

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