JP4789443B2 - Composite sheet manufacturing method, laminated body manufacturing method, and laminated part manufacturing method - Google Patents

Description

The present invention relates to a method of manufacturing a double coupling seat, a manufacturing method of the production method and laminated parts of the laminate.

  In recent years, electronic devices are becoming smaller and lighter and more portable, and the circuit blocks used for them are also becoming smaller and more complex, and the density and size of laminated parts such as ceramic multilayer circuit boards are increasing. Is underway.

A conventional ceramic multilayer substrate is usually manufactured by a manufacturing method called a green sheet method. In this green sheet method, a green sheet made of ceramic powder and a binder is produced by a doctor blade method using a slurry containing ceramic powder to be an insulating layer, and then the green sheet is placed at a position to be a via-hole conductor. A through hole is formed with an NC punch or a mold, a via paste is formed by filling the through hole with a conductor paste, and a conductor pattern is printed on the inside or the surface using the conductor paste, and produced in the same manner. In this manufacturing method, a plurality of green sheets are stacked and the stacked body is simultaneously fired. (See Patent Document 1).

However, in the above method, the method of forming the conductor by screen printing the conductive paste on the green sheet has the problem that the conductor bleeds or becomes dusty and high-precision printing cannot be performed, and the conductor is formed by the screen printing method. In this case, there is a problem that it is difficult to form a pattern having a line / space of 50 μm / 50 μm or less. In order to eliminate this point, a method of forming a conductor material with a copper foil or the like (see Patent Document 2) and a gravure printing method (see Patent Document 3) have been proposed.
Japanese Patent Laid-Open No. 11-066951 JP-A-5-191047 Japanese Patent Laid-Open No. 3-108307

However, in the method described in Patent Document 2, there is a problem that when the copper foil and the ceramic green sheet are simultaneously fired, the firing shrinkage values of the copper foil and the ceramic green sheet are different from each other. In order to suppress this, a technique such as constrained firing has to be used, which increases the number of processes and increases the cost. Further, in the method described in Patent Document 3, gravure printing is printing by intaglio, so it is necessary to scrape excess slurry adhering to the surface of the intaglio with a blade, and it is difficult to completely scrape. If it cannot be scratched, there is a problem that causes a short circuit of the pattern due to slurry adhesion. Moreover, since the intaglio is formed by engraving a rigid roll such as metal with plating, etching or laser, there is a problem that it is expensive and expensive.

The present invention is, for example, and an object thereof is to provide a bleeding Yaho warpage is not high accuracy can be formed of the conductor and the ceramic body to low-cost multi case sheet, method for producing a laminate and laminate device.

The method for producing a composite sheet of the present invention includes a step of preparing a first support having a plurality of concave portions and convex portions formed on at least one main surface, and a conductive slurry comprising at least a metal powder and a solvent. And applying the conductive slurry to the first roller, rotating the first roller, the conductive slurry formed on the surface of the first roller, and the first support Contacting the convex part, applying the conductive slurry to the surface of the convex part of the first support, and forming a conductor on the surface of the convex part of the first support; A second support having a plurality of recesses and protrusions formed on one main surface, the main surface having the recesses and the protrusions formed on the second support, and the first The main part in which the concave part and the convex part are formed When brought into facing the door, a step of preparing said first support the second support a portion corresponding said protrusion and said the concave portion of the second support, at least a ceramic powder and a solvent A ceramic slurry comprising: a ceramic slurry applied to a second roller, the second roller is rotated, and the ceramic slurry formed on the surface of the second roller; The convex portion of the second support is brought into contact with the ceramic slurry, the ceramic slurry is applied to the surface of the convex portion of the second support, and the ceramic is applied to the surface of the convex portion of the second support. Forming the body, on the main surface of the third support, on the surface of the convex portion of the first support, and on the surface of the convex portion of the second support and said ceramic body formed, And transferring so as to fill the ceramic body between the conductors in contact, characterized by comprising a.
Moreover, it is desirable that the first support and the second support are made of any one selected from resin, metal and ceramics. Moreover, it is desirable to transfer the conductor after transferring the ceramic body to the main surface of the third support.

  In the method for producing a composite sheet according to the present invention, the third support is preferably a ceramic green sheet.

In the method for producing a composite sheet of the present invention, it is desirable that the step between the concave portion and the convex portion of each of the first support and the second support is 30 μm or more.

In the method for producing a composite sheet of the present invention, the thickness of the conductor or the ceramic body is 50% of the step between the concave portion and the convex portion of each of the first support body and the second support body. The following is desirable.

In the method for producing a composite sheet of the present invention, it is desirable that the difference in thickness between the conductor and the ceramic body is 5 μm or less . Further, in the method for producing a composite sheet of the present invention, the thickness of the conductor slurry or the ceramic slurry formed on the surface of the roller is such that the concave portions of the first support and the second support are the It is desirable to apply so that it is below the level difference with the convex part.

The manufacturing method of the laminated body of this invention comprises the process of laminating | stacking multiple composite sheets manufactured by the manufacturing method of the composite sheet demonstrated above , and producing a laminated body .

  The method for producing a laminated part of the present invention is characterized by comprising a step of firing the laminate produced by the laminate production method described above.

Moreover, according to the manufacturing method of the composite sheet of this invention, the conductor formed in the main surface of the 3rd support body on the surface of the convex part of a 1st support body , and the convex part of a 2nd support body By transferring the ceramic body formed on the surface so that the ceramic body is filled between adjacent conductors, the process of forming a through hole is eliminated, so that the process is simplified and the manufacturing method is low cost. . Further, no hole processing is required, and even when a thin green sheet is used, the occurrence of elongation, deformation, and tearing of the ceramic body can be suppressed. Furthermore, by transferring to the main surface of the third support member, and more when a multilayer laminate device, it becomes possible to continue to continuously transferred to the third support member, shorten the tact time The composite sheet can be manufactured at a lower cost. In addition, a high-definition conductor can be formed quickly and easily. Furthermore, by transferring the conductor and the ceramic body to one main surface of the ceramic green sheet, a high-definition conductor and the ceramic body that are free from bleeding and blurring due to a screen mesh or the like are formed on the main surface of the ceramic green sheet. be able to. Furthermore, by using the first support body and the second support body in which the concave portion and the convex portion are formed, and by forming a conductor slurry or a ceramic slurry on the convex portion, an extra slurry compared to the case where the conductor is formed in the concave portion. High-definition conductors and ceramic bodies can be easily formed on the first support and the second support without the need for scratching and the occurrence of bleed or repellency. For example, conventional screen printing, etc. Thus, a conductor having a line / space of 50 μm / 50 μm or less, which has been difficult to form, can be easily and quickly formed.

Further, according to the method for producing a composite sheet of the present invention, for example, when the first support or the second support is formed of a resin, the processing of the concave portion and the convex portion is very easy. Therefore, an inexpensive and high-definition pattern can be formed. In addition, when a highly flexible resin is used, even if the first support or the second support on which the conductor or ceramic body is formed is deformed, it is not easily damaged, and a high-definition pattern can be easily formed. Can be formed. In addition, for example, when the first support or the second support is formed of a metal, the first support or the second support having higher strength and higher rigidity than the resin can be produced. A high-definition pattern can be formed. Further, when the support is formed of ceramics, the rigidity becomes the highest and it is resistant to wear, so that a higher definition pattern can be formed. Further, when the third support is formed of a ceramic green sheet, a flat conductor and a ceramic body can be formed on the ceramic green sheet, so that a flat and high-definition conductor or ceramic body can be formed. It is possible to easily produce a composite sheet comprising

Further, according to the composite sheet of the present invention, when the thickness of the conductor and the ceramic body is substantially the same, the difference in thickness between the ceramic body and the conductor is reduced, so that the flat composite sheet, It is possible to suppress the occurrence of stacking faults (delamination), and to achieve a thinner ceramic body and a thicker conductor. Note that the substantially the same, the difference in thickness is that substantially the value laminate defect is not generated in the delamination, etc., as the value is meant below 5μm or less.

Further, according to the method for producing a composite sheet of the present invention, the first support and the second support are aligned.
The stage difference between the concave portion and the convex portion of the respectively With more than 30 [mu] m, since the conductor and the ceramic body only on the convex portion of the support member can be easily formed, the high definition conductor and ceramic body Can be formed.

Moreover, according to the manufacturing method of the composite sheet of this invention, the thickness of a conductor or a ceramic body shall be 50% or less of the level | step difference of each recessed part and convex part of a 1st support body and a 2nd support body. Since the conductor and the ceramic body can be stably formed on the support, the conductor and the ceramic body can be formed without any other support.

Moreover, according to the composite sheet of the present invention, a flat composite sheet can be easily produced by making the conductor and the ceramic body have substantially the same thickness. Further, according to the composite sheet of the present invention, the conductive slurry or the ceramic slurry is applied to the roller so that the difference between the concave portion and the convex portion of each of the first support and the second support is equal to or less than the step. Moreover, a high-definition body that is free from bleeding or blurring due to a screen mesh or the like can be formed on the main surface of the ceramic green sheet.

  And the laminated body in which the high-definition conductor and the ceramic body were formed can be easily produced by laminating | stacking multiple composite sheets produced in this way.

  In addition, by firing the laminated body produced in this way, a laminated part on which a high-definition conductor or ceramic body is formed can be easily produced.

Method for producing a double case sheet of the present invention, according to the manufacturing method and manufacturing method of a multilayer component of the laminate, for example, FIG. 1 (a), easily and quickly laminate device 1 as (b), the addition It can be manufactured at low cost.

Laminate device 1 made according to the present invention, for example, intended to be utilized as a ceramic multilayer circuit board, the surface on the back surface and the internal, the conductor 3 to be planar conductors are formed. Further, a chip component 4 such as an IC, an inductor, a resistor or a capacitor is mounted on the conductor 3 formed on the front surface by solder, and the conductor 3 on the back surface functions as a terminal electrode for mounting on a mother board or the like. is there.

Inside, via conductors 5 for connecting the conductor 3 together to form the planar conductors are formed.

Method for producing a double case sheet of the present invention for producing a multilayer component 1, such as such ceramic multilayer circuit board is described in detail below manufacturing method and manufacturing method of a multilayer component laminate.

Also not a, to prepare a support having a recess and a protrusion. Specifically, it is desirable to use any of resin, metal, and ceramic as the support, and considering the cost, it is desirable to use a support made of resin. When the support 7 made of this resin is used, a general resin base material such as PET or polyimide is used as a material as shown in FIG. 2A, and the support 7 as shown in FIG. The surface is irradiated with CO2 laser light, YAG laser light or the like by a laser oscillation device 8 to draw a desired pattern on the surface of the support 7, thereby forming a concave portion 7 a and a convex portion 7 b as shown in FIG. Can be obtained.

In addition, a photosensitive resin support 9 made of a photosensitive resin can also be suitably used. In this case, the photosensitive resin support 9 made of a photosensitive resin shown in FIG. As shown in FIG. 5, using a glass mask 10 having a desired pattern formed, exposure is performed under the condition of 100 mJ using an ultrahigh pressure mercury lamp as a light source (illuminance 30 mW / cm 2), and development processing is performed with a 2.5% aqueous solution of triethanolamine. Thereby, as shown in FIG.3 (c), the photosensitive resin support body 9 which has the recessed part 9a and the convex part 9b can be obtained.

  When using a metal for the support, the concave and convex portions are formed by a method of forming concave and convex portions by plating on a previously prepared plate of Cu, Ni or the like, or a method of forming concave portions by etching or laser. A support in which the part is formed is obtained.

The thicknesses of the support 7 and the photosensitive resin support 9 can be arbitrarily changed, and are preferably 50 μm to 300 μm in consideration of cost, handling property, and pattern transfer process.

Next, a conductive slurry containing at least a metal powder and a solvent such as IPA or a ceramic slurry containing a ceramic powder and a solvent is applied to the support 7 having the concave portions 7a and the convex portions 7b and dried. , double coalescence is obtained forming the conductor and the ceramic body in the convex portion 7b surface of the support 7.

Hereinafter, a method for manufacturing the composite of this.

  First, for example, as shown in FIG. 4, a suitable amount of a conductive slurry 13a containing a conductive powder and a solvent or a ceramic slurry 15a containing a ceramic powder and a solvent is applied to a roller 11 made of rubber, resin, metal or the like, The conductor slurry 13a or the ceramic slurry 15a formed on the surface of the roller 11 while rotating the roller 11 is brought into contact with the support 7 to apply the conductor slurry 13a or the ceramic slurry 15a to the convex portion 7b of the support 7. Can be formed.

  At this time, when the conductor slurry 13a or the ceramic slurry 15a is applied to the roller 11, the conductor slurry 13a or the ceramic slurry is applied so that the conductor slurry 13a or the ceramic slurry 15a is applied and formed only on the convex portion 7b of the support 7. It is desirable that the thickness of the rally 15a be less than or equal to the difference in height between the concave portion 7a and the convex portion 7b of the support 7.

  At this time, in order to improve the wettability of the conductor slurry 13a or the ceramic slurry 15a on the surface of the convex part 7b, the roughness of the surface of the convex part 7b is set to 5 μm or less in terms of Rmax as shown in FIG. Is desirable. Thereby, the wettability of the conductor slurry 13a or the ceramic slurry 15a on the surface of the convex portion 7b is improved, and the conductor slurry 13a or the ceramic slurry 15a is uniformly formed on the surface of the convex portion 7b, so that a desired pattern can be easily formed. Moreover, it can be formed uniformly.

  Thus, the conductor slurry 13a or the ceramic slurry 15a selectively applied and formed on the convex portion 7b of the support 7 is dried as necessary to become the conductor 13 and the ceramic body 15.

Thus, as shown in FIG. 6 (a), can be high-definition conductor 13 and the ceramic body 15 is manufactured easily double combined 19 formed on the support 7.

In the support 7, it is preferably step between the recess 7a and the projection 7b greater, 30 [mu] m or more, particularly 40μm or more, it is desirable to 50μm or more further. By setting the step between the concave portion 7a and the convex portion 7b to be 50 μm or more, it becomes easy to reduce the adhesion of the conductor slurry 13a or the ceramic slurry 15a into the concave portion 7a.

  In addition, the conductor 13 and the ceramic body are formed on the convex portion 7b of the support 7 stably by setting the thickness of the conductor 13 and the ceramic body to 50% or less with respect to the step between the concave portion 7a and the convex portion 7b. In order to be desirable.

  Next, the manufacturing method of the composite sheet 19 of this invention formed using the composite 19 which formed the conductor 13 and the ceramic body 15 in the convex part 7b of the support body 7 with the manufacturing method demonstrated above is demonstrated.

  For example, as shown in FIG. 6B, a via conductor 25 in which a through hole 23 is formed in advance in a ceramic green sheet 21 containing at least ceramic powder and resin prepared in advance and filled with a conductor paste is provided. After the formed ceramic green sheet 21 and the support 7 on which the conductor 13 is formed face each other and are laminated and pressure-bonded, the support 7 is removed as shown in FIG. The conductor 13 can be transferred to the surface, and the composite sheet 27 in which the high-definition conductor 13 is formed on the main surface of the ceramic green sheet 21 can be manufactured.

Moreover, as shown to Fig.7 (a), the ceramic body 15 formed by apply | coating the ceramic slurry containing a ceramic powder and a solvent to the convex part 7b of the support body 7 and drying is provided in the convex part 7b. After the composite 19 thus formed and the ceramic green sheet 21 are faced to each other and laminated and pressure-bonded as shown in FIG. 7 (b), the support 7 is removed as shown in FIG. 7 (c). the high-definition ceramic body 15 without bleeding can be formed on the main surface of the ceramic green sheet 21 can be manufactured double engagement seat 27. Then, the ceramic body 15 is formed of a composition having a high dielectric constant, and a laminated part is manufactured using the composite sheet 27, whereby a dielectric layer built-in substrate with small characteristic variation can be easily manufactured.

Moreover, as shown to Fig.8 (a), after making the conductor 13 formed in the 1st support body 7-1 and the 3rd support body 7-3 face, as shown to FIG.8 (b). the conductor 13 from the first support body 7-1 is transferred to the third support member 7-3, the conductor 3 on the third support 7-3 by removing the first supporting body 7 -1 Formed.

Further, similarly, as shown in FIG. 8C, the second support 7-2 on which the ceramic body 15 is formed and the third support 7-3 to which the conductor 13 is transferred face each other. is, after transferring the ceramic body 15 from the second support 7-2 third support member 7-3, as shown in FIG. 8 (d), removing the second support member 7 -2 Thus, a flat composite sheet 27 on which the high-definition conductor 13 is formed is obtained. At this time, in particular, the flat composite sheet 27 can be formed by filling the ceramic body 15 between the conductors 13 and making the conductor 13 and the ceramic body 15 have substantially the same thickness. Note that the substantially the same, the difference in thickness is that substantially the value laminate defect is not generated in the delamination, etc., as the value is meant below 5μm or less.

  In this example, the transfer to the third support 7-3 is performed from the conductor 13, but it goes without saying that the transfer may be performed from the ceramic body 15 on the contrary. If the line / space of the conductor 13 is a very fine pattern of 30 μm / 30 μm, it is preferable to transfer the ceramic body 15 first in consideration of the ease of transfer.

  In addition, it is not necessary to provide the recessed part 7a and the convex part 7b in the 3rd support body 7-3, For example, since PET film etc. with a light transmittance are easy to align, it is used suitably.

  According to the composite sheet 27 of the present invention, since the conductor 13 is selectively formed on the convex portion 7b of the support body 7, it is formed according to a pre-designed circuit pattern and protrudes outside the pre-designed circuit pattern. Therefore, even if the distance between the conductors 13 is small, the conductors 13 are not short-circuited.

  In addition, the slurry is not printed through the mesh plate making unlike screen printing, and the slurry formed on the convex portion 7b of the support 7 is directly transferred to form a pattern. Does not occur, and the conductor 13 does not break. Further, even when the thin ceramic body 15 is formed, an unexpected through-hole other than the designed one is not formed, so that the ceramic body 15 having excellent insulation can be formed.

  By laminating a plurality of composite sheets 27 produced by the method for producing a composite sheet 27 of the present invention described above, for example, a laminate 29 as shown in FIG. 9 is produced, and this laminate 29 is fired. Thus, the laminated component 1 as shown in FIG. 1 can be manufactured with high accuracy and speed.

Also, alternatively, the through conductor further provided multiple coalescing 27, may be formed wired circuit, such as by lamination.

  In this way, the manufactured laminated component 1 has high-density and high-definition conductors 13 and has high reliability since the insulation between the conductors 13 is ensured at a high level.

  1 and 9, the shape of the conductor 13 is described as a rectangle, but for example, the conductor 13 has one main surface larger than the other main surface as shown in FIG. Also good.

  The thickness of the conductor 13 and the ceramic body 15 is preferably as thin as possible in order to speed up the drying time after coating. However, when the thickness of the laminated part 1 is increased, the insulation between the layers is reduced. There is a problem of deterioration. In order to achieve these two items in a well-balanced manner, both are formed by a thin layer of 10 μm or less, particularly 8 μm or less, and further 5 μm or less, and the thickness difference between the ceramic body 15 and the conductor 13 is 50% or less of the thickness of the conductor, in particular By setting the thickness difference to 20% or less, further 10% or less, or by setting the thickness difference to 5 μm or less, particularly 2 μm or less, and further 1 μm or less, the level difference from the ceramic body 15 due to the thickness of the conductor 13 itself can be reduced. It can be substantially suppressed.

The conductor 13 may form a planar circuit by Shin bus ceramic body 15 or the ceramic green sheet 21 in the planar direction. When the composite sheet 27 is laminated

  According to the present invention, the ceramic multilayer circuit board 1 can be formed by laminating, for example, about 20 to 50 layers of the composite sheet 27 in order to form a desired circuit.

The ceramic powder used for the ceramic body 15 and the ceramic green sheet 21 may be, for example, (1) a ceramic material having a firing temperature of 1100 ° C. or higher, mainly composed of Al ₂ O ₃ , AlN, Si ₃ N ₄ , SiC, (2) A ceramic material fired at 1100 ° C. or lower, particularly 1050 ° C. or lower, comprising a mixture of metal oxides containing at least SiO ₂ and an alkaline earth metal oxide such as BaO, CaO, SrO, MgO, etc. (3) At least one selected from the group of low-temperature sinterable ceramic materials which are fired at 1100 ° C. or lower, particularly 1050 ° C. or lower, made of glass powder or a mixture of glass powder and ceramic filler powder is selected.

As the mixture of (2) and the glass composition of (3) used, SiO ₂ —BaO—Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ systems, SiO ₂ —Al ₂ O ₃ —alkali metal oxide systems, and compositions in which alkali metal oxides, ZnO, PbO, Pb, ZrO ₂ , TiO _2, etc. are blended with these systems. Examples of the ceramic filler in (3) include at least one selected from the group consisting of Al ₂ O ₃ , SiO ₂ , forsterite, cordierite, mullite, AlN, Si ₃ N ₄ , SiC, MgTiO ₃ , and CaTiO _3. The glass is preferably mixed at a rate of 20 to 80% by mass with respect to the glass.

  On the other hand, the conductor 13 is variously combined according to the firing temperature of the ceramic material. For example, when the ceramic powder used for the ceramic body 15 or the ceramic green sheet 21 is (1), it is selected from the group of tungsten, molybdenum, and manganese. A conductive material mainly containing at least one selected from the above is preferably used. Moreover, it is good also as a mixture with copper etc. for resistance reduction.

  Moreover, when the ceramic powder used for the ceramic body 15 and the ceramic green sheet 21 is the above (2) and (3), a conductor material mainly containing at least one selected from the group of copper, silver, gold, and aluminum is used. It is suitably used for conductors.

  In addition, the conductive slurry 13a may be added to the metal powder described above with an organic binder such as ethyl cellulose or acrylic resin, if necessary, and further dibutyl phthalate, α-terpineol, butyl carbitol, or 2,2,4-trimethyl. -3 · 3-pentadiol monoisobutyrate, a suitable solvent such as water is mixed, and the mixture is homogeneously kneaded with a three-roller or a ball mill.

  The conductive material preferably contains ceramic powder constituting the ceramic body 15 and the ceramic green sheet 21 when fired simultaneously with the ceramic body 15 and the ceramic green sheet 21.

Also, in the preparation of ceramic slurry over used to form the ceramic body 15, preferably, the ceramic powder, an organic binder as a resin and a plasticizer are mixed in water or an organic solvent, and kneaded in a ball mill Prepare. The organic binder is made of isobutyl methacrylate, methyl methacrylate, methyl acrylate, or the like, and DBP, DOP, or the like is suitably used as the plasticizer. When an organic solvent is used, toluene, IPA, acetone, butyl cellosolve or the like is used.

  Further, in the step of laminating and pressing the composite sheet 27, it is desirable to form a laminate at a pressure of 0.2 to 10 MPa by aligning and superimposing the composite sheet 27 while aligning them. Further, it is desirable to perform the pressure bonding while applying a temperature higher than the glass transition point of the resin contained in the composite sheet 27. By doing so, the resin component is softened by heat, and the composite sheets 27 can be easily pressure-bonded even at a low pressure.

The coating of the conductive slurry over and ceramics rally to the support 7, if necessary, may be performed plural times, it is possible to arbitrarily change the thickness of the conductor 13, the ceramic body 15 by the number of applications. In addition, by doing so, it is possible to reduce the stacking process, and it is possible to further reduce the cost.

  In the example shown in FIG. 6 in which only the conductor 13 is formed on the support 7 or the example shown in FIG. 7 in which only the ceramic body is formed on the support 7, a normal ceramic multilayer circuit board is thereafter used. It is also possible to produce the ceramic multilayer circuit board 1 by the above manufacturing method. At this time, finer conductors 13 and ceramic bodies 15 can be formed as compared with a conductor and ceramic body forming method by a normal screen printing method.

  Further, in firing the laminate 29, the organic binder contained in the laminate 29 is eliminated in the binder removal step, and the conductor 13 used in the atmosphere or in an inert atmosphere such as nitrogen in the firing step, It is desirable that the ceramic body 15 and the ceramic green sheet 2121 be fired at a temperature at which the ceramic body 15 and the ceramic green sheet 2121 can be sufficiently fired to be densified to a relative density of 90% or more.

  Further, if necessary, as a surface treatment, a ceramic can be obtained by further printing / baking a thick film resistance film or a thick film protective film on the surface of the multilayer component 1, plating, and further joining an electronic component including an IC chip. The circuit board 1 can be manufactured.

  In addition, a conductive paste may be printed and dried on the surface of the fired laminated body and baked in a predetermined atmosphere to form a wiring pattern. Alternatively, a wiring pattern may be formed by evaporating metal. Good.

  Further, on the surface of the conductor and terminal electrode formed on the surface of the ceramic multilayer circuit board 1, a plating layer of nickel, gold or the like is formed with a thickness of 1 to 3 μm in order to improve wettability with solder. Also good.

  Needless to say, drying of the ceramic slurry and the conductor slurry can be performed using infrared rays, far infrared rays, and ultraviolet rays in addition to drying by heat using a heater or warm air.

First, 100 parts by mass of ceramic powder, 15 parts by mass of an organic binder (isobutyl methacrylate), and 70 parts by mass of toluene were kneaded in a ball mill for 24 hours to prepare a ceramic slurry. The ceramic powder is 10 parts by mass in terms of B ₂ O ₃ and Li in terms of LiCO ₃ with respect to 100 parts by mass of the main component represented by 0.95 mol MgTiO ₃ -0.05 mol CaTiO _3. 5 parts by mass was added and mixed, and the mixed raw material having an average particle size of 1 μm was used.

  Further, 5 parts by mass of ethyl cellulose and 60 parts by mass of IPA are added to 98 parts by mass of Ag powder having an average particle diameter of 1 μm and 100 parts by mass of 2% by mass of barium borosilicate glass powder. A conductor slurry was prepared.

Next, a PET film having a thickness of 200 μm and a thickness of 100 μm was prepared, and a support body in which concave portions and convex portions having a predetermined pattern were formed using a YAG laser was obtained. The concave and convex parts at that time
Step between are set to be values shown in Table 1.

  As shown in FIGS. 10 (a) and 10 (b), this pattern is a comb in which the width W is changed in the range of 30 to 100 μm and the interval L is changed in the range of 30 to 100 μm. Two types, a tooth-like pattern (a) and a comb-like pattern (b) in which the concave and convex portions were reversed, were produced.

Next, the conductive slurry is applied on the support of the pattern (a), and the ceramic slurry is applied on the support of the pattern (b) with a roller made of silicone rubber. and conductor thickness indicating, by a ceramic body formed respectively, to prepare a multi-coalescence.

  Ten composites were prepared, and the conductors and ceramic bodies were observed with a microscope magnified 100 to 1000 times. The spacing L was less than 50% of the set spacing L. The one with the part was regarded as defective. Moreover, the thing whose width W was less than 30% was also determined to be defective.

  Table 1 shows the set intervals of the conductor and the ceramic body and the incidence of defects.

Further, the conductor thus formed and the ceramic body are transferred to a conventionally known ceramic green sheet under conditions of 50 ° C., 2 MPa, 1 minute, the support is peeled off, and the conductor, to form a ceramic body, to prepare a multi focus sheet.

  The same evaluation as that performed before transferring the conductor and the ceramic body to the ceramic green sheet was performed.

Further, as a comparative example, the same evaluation was performed by printing the same pattern on the aluminum plate, the PET film, and the ceramic green sheet by the screen printing method by the conventional screen printing. The results are shown in Table 1.

  As shown in Table 1, a sample No. 1 that is outside the scope of the present invention in which a conductor and a ceramic body are formed by a conventional screen printing method. In Nos. 19 to 21, bleeding or dusting of the conductor or ceramic body was confirmed, and a fine pattern with a line / space of 30 μm could not be formed.

On the other hand, specimen No. In Nos. 1 to 8, neither blur nor dust was confirmed, and a composite in which a conductor and a ceramic body were formed on the convex portion of the support with high definition could be produced.

  In addition, sample No. in which the level difference between the concave portion and the convex portion is less than 30 μm. In No. 6, since the conductor slurry or ceramic slurry adhered to the recess, it is considered that it is disadvantageous when a high-definition pattern is formed when repeated printing is performed. In addition, sample No. in which the thickness of the conductor and the ceramic body exceeds 50% of the step between the concave and convex portions. In No. 8, although there was no practical problem, a portion where the thickness of the conductor and the ceramic body became uneven was observed in part.

In addition, specimen No. 1-8 of the conductor, which is double if sheet transferring the ceramic body in a ceramic green sheet sample No. In 9-18, neither blur nor dust was confirmed, and a composite sheet in which a high-definition conductor and ceramic body were formed on a ceramic green sheet could be produced.

  First, a conductor slurry and a ceramic slurry were prepared in the same manner as in Example 1.

  Next, the support body which has a recessed part and a convex part by the process similar to Example 1 was produced.

  And the support body-1 which formed the pattern of predetermined wiring circuit pattern with a convex part, the surface in which the recessed part and convex part of the support body-1 were formed, and the recessed part of another support body-2 When the surface where the convex part was formed was made to face, the support body-2 which made the part which corresponds to the convex part of the support body-1 into the recessed part was produced. And conductor slurry is apply | coated to the support body 1 by the method similar to Example 1, the conductor of thickness 8 micrometers of a predetermined pattern is formed in the support body 1, and ceramic slurry is used for the support body-2 in Example 1. The ceramic body with a predetermined pattern thickness of 8 μm was formed on the support 2 by the same method as that described above.

  The conductor thus formed was transferred to a PET film under the conditions of 50 ° C., 2 MPa, and 1 minute. Further, the PET film on which the conductor was formed and the support-2 on which the ceramic body was formed were aligned, and between the conductors A ceramic body was formed to produce a composite sheet.

  In addition, the ceramic body is first transferred to the PET film, the PET film on which the ceramic body is formed, and the support 1 on which the conductor is formed are aligned, and a conductor is formed between the ceramic bodies, A composite sheet was produced.

  At this time, the width of the conductor and the interval between the conductors were changed in the range of 30 to 100 μm. In this way, a composite sheet was produced in which the conductor and the ceramic body having different widths and intervals were integrated.

  30 layers each of these composite sheets were laminated under the conditions of 50 ° C., 10 MPa, and 2 minutes to prepare a laminate.

  Furthermore, these laminates were debindered in the atmosphere at 300 ° C. for 2 hours, and then fired in the atmosphere at 900 ° C. for 1 hour to produce 30-layer laminated parts.

For these laminated parts, continuity evaluation was performed using a tester in order to confirm the disconnection of the surface layer pattern, the presence or absence of a short circuit, and the connectivity of vias. A sample in which 10 or more continuity failures occurred with respect to 50 samples was determined to be defective. The results are shown in Table 2.

  As shown in Table 2, Sample No. In Nos. 22 to 27, there was no disconnection or electrical short circuit, and a laminated part having excellent reliability was obtained.

As an example of the multilayer component of the present invention, (a) a schematic perspective view of a ceramic multilayer circuit board and (b) a schematic cross-sectional view of the ceramic multilayer circuit board are shown. It is process drawing for demonstrating the manufacturing method of the support plate used by this invention. It is process drawing for demonstrating the other manufacturing method of the support plate used by this invention. It is process drawing for demonstrating the application | coating method of the slurry to a support body. It is the figure which showed the surface roughness of the convex part surface of the support body used by this invention It is a process diagram for explaining the manufacturing method of the double focus sheet. It is a process diagram for explaining the manufacturing method of the double focus sheet. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the laminated body and laminated component of this invention. It is a schematic diagram for demonstrating the comb-tooth pattern used by the evaluation test.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Laminated component, ceramic multilayer circuit board 6 ... Composite sheet 7 ... Support body 7a ... Concave part 7b ... Convex part 7-1 ... 1st support body 7-2 ... Second support 7-3 ... third support 13a ... conductor slurry 13 ... conductor 15a ... ceramic slurry 15 ... ceramic body 19 ... composite 21 ... Ceramic green sheet 27 ... Composite sheet 29 ... Laminate

Claims (10)

Preparing a first support having a plurality of concave portions and convex portions formed on at least one main surface;
Producing a conductive slurry containing at least a metal powder and a solvent;
The conductor slurry is applied to a first roller, the first roller is rotated, and the conductor slurry formed on the surface of the first roller is brought into contact with the convex portion of the first support. Applying the conductive slurry to the surface of the convex portion of the first support, and forming a conductor on the surface of the convex portion of the first support;
A second support forming a plurality of concave portions and convex portions on at least one major surface, said main surface and said recess of said second support and said protrusion is formed, the first When the concave portion in one support and the main surface on which the convex portion is formed face each other, a portion corresponding to the convex portion of the first support is defined as the concave portion of the second support. Preparing the second support , and
Producing a ceramic slurry comprising at least a ceramic powder and a solvent;
The ceramic slurry is applied to a second roller, the second roller is rotated, and the ceramic slurry formed on the surface of the second roller is brought into contact with the convex portion of the second support. Applying the ceramic slurry to the surface of the convex portion of the second support, and forming a ceramic body on the surface of the convex portion of the second support;
The conductor formed on the surface of the convex portion of the first support on the main surface of the third support, and the ceramic body formed on the surface of the convex portion of the second support. Transferring the ceramic body between adjacent conductors, and
A method for producing a composite sheet, comprising: 2. The method for producing a composite sheet according to claim 1 , wherein the first support and the second support are made of any one selected from resin, metal, and ceramic. Wherein the main surface of the third support after transferring the ceramic body, the composite sheet manufacturing method according to claim 1 or 2, characterized in that transferring the conductor. Said third support, to claim 1, characterized in that a ceramic green sheet
The method for producing a composite sheet according to any one of 3 . Composite sheet according to the step of each of the concave and the convex portion of the first support and the second support, any one of claims 1 to 4, characterized in that at 30μm or more Manufacturing method. The thickness of the conductor or the ceramic body, 1 to claim, characterized in that said first support and said second support is not more than 50% of the level difference of each of the concave and the convex portion A method for producing a composite sheet according to any one of 5 . Composite sheet manufacturing method according to claim 1, wherein the difference in thickness of the conductor and the ceramic body is 5μm or less. The conductive slurry or the ceramic slurry formed on the surface of the roller is applied so that the thickness of each of the first support and the second support is equal to or less than the step between the concave portion and the convex portion. The method for producing a composite sheet according to any one of claims 1 to 7 , A method for producing a laminate, comprising a step of laminating a plurality of composite sheets produced by the method for producing a composite sheet according to any one of claims 1 to 8 to produce a laminate. A method for producing a laminated part, comprising the step of firing the laminate according to claim 9 .

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