JP4711641B2 - Composite sheet manufacturing method, laminated body manufacturing method, and laminated part manufacturing method - Google Patents

Description

  The present invention relates to a composite suitable for ceramic laminated parts and laminated substrates used in mobile communication devices and the like, a method for producing the composite, and a composite sheet, a laminate, and a method for producing the laminated part.

  In recent years, electronic devices are becoming smaller and lighter and more portable, and the circuit blocks used for them are also becoming smaller and more complex, and the density and size of laminated parts such as ceramic multilayer circuit boards are increasing. Is underway.

  A conventional ceramic multilayer substrate is usually manufactured by a manufacturing method called a green sheet method. In this green sheet method, a green sheet made of ceramic powder and a binder is prepared by a doctor blade method using a slurry containing ceramic powder to be an insulating layer, and then the green sheet is placed at a position to be a via-hole conductor. After forming a through hole with an NC punch or a mold, printing a conductor pattern on the inside or surface using a conductor paste, filling the through hole with a conductor paste to form a via hole conductor, and the like. In this manufacturing method, a plurality of green sheets prepared in the above manner are stacked and the stacked body is simultaneously fired. (See Patent Document 1).

However, in the above method, the method of forming a conductor by screen-printing a conductor paste on a green sheet has a problem that the conductor is smeared or dusted and high-precision printing cannot be performed. When forming, there is a problem that it is difficult to form a pattern having a line / space of 50 μm / 50 μm or less. In order to eliminate this point, a method of forming a conductive material with a copper foil or the like has been proposed (see Patent Document 2).
Japanese Patent Laid-Open No. 11-066951 JP-A-5-191047

  However, in the method described in Patent Document 2, there is a problem that when the copper foil and the ceramic green sheet are fired at the same time, the firing shrinkage values differ from each other. In order to suppress it, a technique such as constrained firing has to be used, and there is a problem that the number of processes increases and the cost increases.

The present invention is, for example, and an object thereof is to provide a bleeding method of manufacturing a double coupling seat that allow formation of Yaho sled is not highly accurate conductor and the ceramic body, the manufacturing method of the production method and laminated parts of the laminate.

The method for producing a composite sheet of the present invention includes a step of preparing a first support plate having a hydrophilic part and a hydrophobic part formed on at least one main surface, and at least one of a metal powder and a hydrophilic solvent or a hydrophobic solvent. The conductor slurry containing the hydrophilic solvent is left on the surface of the hydrophilic portion by applying a conductive slurry containing the solvent to the main surface of the support plate by a screen printing method , or Leaving the conductive slurry containing a hydrophobic solvent on the surface of the hydrophobic portion and drying to form a conductor from the conductive slurry only on the surface of either the hydrophilic portion or the hydrophobic portion; and The conductor is transferred to one main surface of the ceramic green sheet.

The method for producing a composite sheet of the present invention includes a step of preparing a first support plate having a hydrophilic part and a hydrophobic part formed on at least one main surface, and at least one of a metal powder and a hydrophilic solvent or a hydrophobic solvent. By applying a conductive slurry containing one of the solvents to the main surface of the support plate by a screen printing method , the conductive slurry containing the hydrophilic solvent remains on the surface of the hydrophilic portion, or Leaving the conductive slurry containing the hydrophobic solvent on the surface of the hydrophobic portion and drying to form a conductor from the conductive slurry only on one surface of the hydrophilic portion or the hydrophobic portion; and
A step of preparing a second support plate having a hydrophilic portion and a hydrophobic portion formed on at least one main surface; and at least one of an inorganic powder and a hydrophilic solvent or a hydrophobic solvent. The ceramic slurry containing the hydrophilic solvent is left on the surface of the hydrophilic portion by applying the ceramic slurry to the main surface of the support plate by a screen printing method , or the ceramic slurry containing the hydrophobic solvent. Leaving the surface on the surface of the hydrophobic part and drying, to form a ceramic body from a ceramic slurry only on the surface of either the hydrophilic part or the hydrophobic part,
The side forming the conductor of the first support plate, is brought into contact with the side of forming the ceramic body of the second support plate, laminating to fill the ceramic body between the conductors It is characterized by comprising.

  Moreover, as for the manufacturing method of the composite sheet of this invention, it is desirable that the thickness of the said conductor and the said ceramic body is substantially the same.

The method for producing a composite sheet of the present invention includes a step of preparing a first support plate having a hydrophilic part and a hydrophobic part formed on at least one main surface, and at least one of a metal powder and a hydrophilic solvent or a hydrophobic solvent. By applying a conductive slurry containing one of the solvents to the main surface of the support plate by a screen printing method , the conductive slurry containing the hydrophilic solvent remains on the surface of the hydrophilic portion, or Leaving the conductive slurry containing the hydrophobic solvent on the surface of the hydrophobic portion and drying to form a conductor from the conductive slurry only on one surface of the hydrophilic portion or the hydrophobic portion; and
A step of preparing a second support plate having a hydrophilic portion and a hydrophobic portion formed on the main surface; and a ceramic slurry comprising at least one of an inorganic powder and a hydrophilic solvent or a hydrophobic solvent. The ceramic slurry containing the hydrophilic solvent is left on the surface of the hydrophilic portion by coating the main surface of the support plate by a screen printing method , or the ceramic slurry containing the hydrophobic solvent is made hydrophobic. Forming a ceramic body from a ceramic slurry only on the surface of either the hydrophilic part or the hydrophobic part, by allowing the surface to remain on the surface of the part and drying;
The main surface of the third supporting plate, and transferring the ceramic body and then characterized by being equipped with a step of transferring the conductors to fill between the ceramic body.

  Moreover, as for the manufacturing method of the composite sheet of this invention, it is desirable that the thickness of the said conductor and the said ceramic body is substantially the same.

  The manufacturing method of the laminated body of this invention comprises the process of laminating | stacking multiple composite sheets manufactured by the manufacturing method of the composite sheet in any one of the manufacturing methods of the composite sheet demonstrated above.

  The method for producing a laminated part of the present invention is characterized by comprising a step of firing the laminate produced by the laminate production method described above.

According to the composite sheet production method of the present invention, to form a hydrophilic portion and a hydrophobic portion, by using the supporting plate which applies the repulsion of water and oil, for example, conductors slurry with hydrophilic solvent If, because the conductor slurry hydrophobic portion of the support plate for coating does not adhere, it is possible to easily form the bleeding and high definition conductor occurrence is not the repelling on the support plate, for example, a conventional formation difficult Thus, a conductor having a line / space of 50 μm / 50 μm or less can be formed easily and quickly. On the other hand, in the case of a conductive slurry using a hydrophobic solvent, the conductive slurry adheres to the hydrophobic portion, and it is possible to form a high-definition conductor on the hydrophobic portion by drying this conductive slurry. Needless to say.

According to the method for manufacturing a composite sheet of the present invention, when forming a via conductor, a through hole can be provided without using a physical method such as punching. Can solve problems such as deformation and tearing. Further, for example, even when no through hole is provided, there is an advantage that a high-definition ceramic body can be formed in a support plate shape as in the case of a conductor. The ceramic body has a so-called ceramic green sheet or a form in which a through hole is formed in the ceramic green sheet.

According to the composite sheet manufacturing method of the present invention, the conductor formed on the support plate described above is transferred to one main surface of the ceramic green sheet, and compared with the method of directly printing the conductor by the screen printing method. Thus, a high-definition conductor can be easily and quickly formed on the ceramic green sheet.

Further, according to the method for producing a composite sheet of the present invention, a step of preparing a first support plate having a hydrophilic part and a hydrophobic part formed on at least one main surface, at least a metal powder and a hydrophilic solvent or hydrophobicity A conductive slurry containing any one of the solvents is applied to the main surface of the support plate by a screen printing method so that the conductive slurry containing the hydrophilic solvent is applied to the surface of the hydrophilic portion. The conductor slurry containing the hydrophobic solvent is left on the surface of the hydrophobic portion and dried to form a conductor from the conductor slurry only on the surface of either the hydrophilic portion or the hydrophobic portion. And a process of
A step of preparing a second support plate having a hydrophilic portion and a hydrophobic portion formed on at least one main surface; and at least one of an inorganic powder and a hydrophilic solvent or a hydrophobic solvent. The ceramic slurry containing the hydrophilic solvent is left on the surface of the hydrophilic portion by applying the ceramic slurry to the main surface of the support plate by a screen printing method , or the ceramic slurry containing the hydrophobic solvent. Leaving the surface on the surface of the hydrophobic part and drying, to form a ceramic body from a ceramic slurry only on the surface of either the hydrophilic part or the hydrophobic part,
The side forming the conductor of the first support plate, is brought into contact with the side of forming the ceramic body of the second support plate, laminating to fill the ceramic body between the conductors , The through hole forming process for forming the via conductor is eliminated, which simplifies the process and provides a low-cost manufacturing method. Further, since conventional hole processing is not required, even when a thin green sheet is used, the occurrence of elongation, deformation, and tearing of the green sheet can be suppressed. In addition, a high-definition conductor can be formed quickly and easily.

  In particular, when the thickness of the conductor and the ceramic body are substantially the same, the difference in thickness between the green sheet and the conductor is reduced, so that the occurrence of stacking faults (delamination) can be suppressed and the green sheet is made thinner. As a result, a thicker conductor can be achieved. Note that “substantially the same” means that the thickness difference is a value at which stacking failure such as delamination does not substantially occur. The value is 5 μm or less, or the difference in thickness between the conductor and the ceramic body is the conductor. And 50% or less of the thicker of the ceramic bodies.

Further, according to the method for producing a composite sheet of the present invention, a step of preparing a first support plate having a hydrophilic part and a hydrophobic part formed on at least one main surface, at least a metal powder and a hydrophilic solvent or hydrophobicity A conductive slurry containing any one of the solvents is applied to the main surface of the support plate by a screen printing method so that the conductive slurry containing the hydrophilic solvent is applied to the surface of the hydrophilic portion. The conductor slurry containing the hydrophobic solvent is left on the surface of the hydrophobic portion and dried to form a conductor from the conductor slurry only on the surface of either the hydrophilic portion or the hydrophobic portion. A step of preparing, a step of preparing a second support plate having a hydrophilic portion and a hydrophobic portion formed on the main surface, and at least one of an inorganic powder and a hydrophilic solvent or a hydrophobic solvent. Comprising a ceramic slurry that is applied by screen printing on the main surface of the support plate, the said ceramic slurry containing a hydrophilic solvent is remaining on the surface of the hydrophilic part and the ceramic or containing the hydrophobic solvent, Forming a ceramic body from a ceramic slurry only on the surface of either the hydrophilic part or the hydrophobic part by leaving a rally on the surface of the hydrophobic part and drying; and a main surface of the third support plate to the transfer of the ceramic body, followed by providing and a step of transferring the conductors to fill between the ceramic body, since the through hole forming step is eliminated, simplifying the process, low cost Manufacturing method. Further, no hole processing is required, and even when a thin green sheet is used, the occurrence of elongation, deformation, and tearing of the ceramic body can be suppressed. Furthermore, by transferring to the main surface of the third support plate, when it becomes a multi-layered laminated part, it is possible to continuously transfer to the third support plate, so the tact time is shortened. The composite sheet can be manufactured at a lower cost. In addition, a high-definition conductor can be formed quickly and easily.

  In particular, when the thicknesses of the conductor and the ceramic body are substantially the same, the difference in thickness between the ceramic body and the conductor is reduced, resulting in a flat composite sheet, which may cause stacking faults (delamination). In addition to being able to suppress, it is possible to achieve a thinner ceramic body and a thicker conductor. Note that “substantially the same” means that the thickness difference is a value at which stacking failure such as delamination does not substantially occur. The value is 5 μm or less, or the difference in thickness between the conductor and the ceramic body is the conductor. And 50% or less of the thicker of the ceramic bodies.

  Then, the composite sheet produced in this manner is laminated to produce a laminate, and further fired to provide a laminated component comprising a thin ceramic body and a thick film conductor having low resistance. Can be easily manufactured.

Method for producing a multi-polymer of the present invention, a method of manufacturing a composite sheet, according to the manufacturing method and manufacturing method of a multilayer component of the laminate, for example, FIG. 1 (a), facilitates the multilayer part 1 as shown in (b) And can be manufactured quickly and inexpensively.

  The laminated component 1 manufactured according to the present invention is used as, for example, the ceramic multilayer circuit board 1, and a conductor 29 serving as a planar conductor is formed on the front surface, the back surface, and the inside. Further, a chip component 4 such as an IC, an inductor, a resistor or a capacitor is mounted on the conductor 29 formed on the front surface by solder, and the conductor 29 on the back surface functions as a terminal electrode for mounting on a mother board or the like. is there.

  In addition, a via conductor 5 that connects the conductors 29 that form the planar conductor is formed inside.

  The production method of the composite and composite, composite sheet, laminate, and multilayer component of the present invention for manufacturing the multilayer component 1 such as the ceramic multilayer circuit board 1 will be described in detail below.

  First, a support plate in which a hydrophilic part and a hydrophobic part are formed is prepared. Specifically, it is desirable to use a PS plate generally used in offset printing or the like. The PS plate is, for example, a sheet 25 obtained by applying a photocurable resin 23 to the main surface of an aluminum plate 21 having a thickness of about 0.2 mm, as shown in FIG. Thus, by exposing and developing the photocurable resin 23 of the PS plate 25 using the glass mask 27, the photocurable resin 23 is formed on the main surface of the aluminum plate 21 as shown in FIG. A portion 23a (aluminum background) from which the light is removed and a portion 23b where the photocurable resin 23 exists are formed. A portion 23a of the aluminum background of the PS plate 25 thus formed becomes a hydrophilic portion 23a, a photocurable resin 23b becomes a hydrophobic portion 23b, and a PS plate 25 which is a support plate 25 having the hydrophilic portion 23a and the hydrophobic portion 23b is provided. can get.

  The thickness of the photocurable resin 23 can be arbitrarily changed, and is desirably as thin as possible. Considering the transfer process described later, it is 30 μm or less, particularly 10 μm or less, and further 5 μm or less, 2 μm. The following is desirable.

  Next, as shown in FIGS. 3D and 3E, when a conductive slurry 28a using metal powder and water as a solvent is applied to the PS plate 25 having the hydrophilic portion 23a and the hydrophobic portion 23b, The conductor slurry 28a remains only in the hydrophilic portion 23a of the PS plate 25. By drying this, the conductor 29a can be formed on the PS plate 25, and the composite of the present invention is obtained.

  Further, as shown in FIGS. 3 (f) and 3 (g), a conductive slurry 28b using a metal powder and a hydrophobic solvent such as toluene is applied to the PS plate 25 having the hydrophilic portion 23a and the hydrophobic portion 23b. When applied, the conductor slurry 28b remains only in the hydrophobic portion 23b of the PS plate 25, and the conductor slurry 28b can be formed on the main surface of the PS plate 25 by drying it. A complex of

  According to the method for forming a composite described above, even when the conductive slurry 28a using a hydrophilic solvent is used or when the hydrophobic conductive slurry 28b is used, bleeding and dusting are performed. High-definition conductors 29a and 29b that are not present can be easily and quickly formed on the PS plate 25.

  Further, it goes without saying that even when an inorganic powder is used instead of the metal powder, a composite in which a high-definition ceramic body is formed on the PS plate 25 can be obtained by the same process.

  As a method of using the support plate 25 other than the PS plate 25, on a resin film such as PET, paraffin, stearic acid, silicone resin as a hydrophobic portion 23b, and a fluorine compound having a perfluoroalkyl group as a hydrophilic portion 23a are screen-printed. Alternatively, the hydrophilic portion 23a (roughened) can be obtained by a chemical method such as coating with an ink jet printer or a physical method by roughening the surface of only a desired portion using a sandblast to a silicone-treated PET film. Forming portion) and the hydrophobic portion 23b can be formed.

  Even in such a case, it is desirable that the step between the hydrophilic portion 23a and the hydrophobic portion 23b is small, and it is desirable that the difference be 30 μm or less, particularly 10 μm or less, and further 5 μm or less and 2 μm or less. In particular, if necessary, the step between the hydrophilic portion 23a and the hydrophobic portion 23b is set to 1 μm or less, for example, the side on which the conductor 29 of the PS plate 25 on which the conductor 29 is formed and the PS on which the ceramic body is formed. A particularly flat composite sheet can be produced by facing the side of the plate 25 on which the ceramic body is formed and laminating and pressing.

  Next, the manufacturing method of the composite sheet of this invention formed using the composite body which formed conductor 29a, 29d and the ceramic body in the main surface of PS plate 25 with the manufacturing method demonstrated above is demonstrated.

  For example, as shown in FIG. 4A, a ceramic green sheet 31 containing at least an inorganic powder and a resin prepared in advance and a PS plate 25 on which a conductor 29a is formed face each other, and FIG. 4), the conductor 29a can be transferred to the main surface of the ceramic green sheet 31 by removing the PS plate 25 as shown in FIG. In addition, the composite sheet 33 on which the high-definition conductor 29a is formed can be manufactured.

  In the example of FIGS. 4A to 4C, an example in which the through conductor 35 is formed in advance in the ceramic green sheet 31 is described.

  Further, as shown in FIG. 5 (a), a PS plate comprising a ceramic body 37 formed by applying and drying a ceramic slurry containing at least an inorganic powder and a hydrophilic solvent in a hydrophilic portion 23a. 25 and the ceramic green sheet 31 face each other, and as shown in FIG. 5B, after laminating and pressure bonding, the PS plate 25 is removed as shown in FIG. A simple ceramic body 37 can be formed on the main surface of the ceramic green sheet 31. Then, the ceramic body 37 is formed of a composition having a high dielectric constant, and a laminated part is manufactured using the composite sheet 33, whereby a dielectric layer built-in substrate with small characteristic variation can be easily manufactured.

Further, as shown in FIG. 6 (a), for example, by the method for producing a composite having a conductive body 29a described in FIG. 4, the composite sheet 33 forming the conductor 29a to the main surface of the ceramic green sheet 31 Then, the PS plate 25 on which the ceramic body 37 is formed is faced, laminated and pressure-bonded as shown in FIG. 6B, and then the PS green plate 25 is removed as shown in FIG. The composite sheet 33 having the flat, high-definition conductor 29a formed so that the conductor 29a is formed on the main surface 31 and the ceramic body 37 fills the space between the conductors 29a is obtained.

  Further, as shown in FIG. 7 (a), a PS plate 25a on which the conductor 29b which is a composite of the present invention is formed, and a PS plate on which a ceramic body 37 which is a composite of another embodiment of the present invention is formed. The PS plates 25a and 25b are removed after facing and laminating 25b, and the flat composite sheet 33 on which the high-definition conductor 29b is formed is obtained. At this time, in particular, the flat composite sheet 33 can be formed by filling the ceramic body 37 between the conductors 29 so that the conductors 29 and the ceramic body 37 have substantially the same thickness.

Further, as shown in FIGS. 8A and 8B, the conductor 29b formed on the PS plate 25a which is the first support plate is transferred to another support plate 21c which is the third support plate, and the PS plate In the same manner, as shown in FIGS. 8C and 8D, the ceramic body 37 formed on the PS plate 25b as the second support plate is transferred to the third conductor 29b. The flat composite sheet 33 on which the high-definition conductor 29b as described in FIG. 7 is formed is transferred to the support plate 25c, which is the second support plate, and the PS plate 25b, which is the second support plate, is removed. can get. At this time, in particular, the flat composite sheet 33 can be formed by filling the ceramic body 37 between the conductors 29 so that the conductors 29 and the ceramic body 37 have substantially the same thickness.

In this example, the transfer to the support plate 21c is performed from the conductor 29 b, to transfer from the ceramic body 37 in the opposite. Incidentally, the conductor 29b is, when the line / space of very fine patterns with 30 [mu] m / 30 [mu] m, in consideration of the transfer ease, you transfer a ceramic body 37 first.

In addition, it is not necessary to provide a hydrophilic part and a hydrophobic part in the support plate 21c which is the third support plate, and a light-transmitting material such as a PET film is preferably used because it can be easily aligned. .

Then, according to the composite sheet 33, the conductor 29 is to be selectively formed only in the hydrophilic portion 23a or the hydrophobic part 23b of the support plate 25, is formed on the circuit patterns as a previously designed, designed circuit patterns in advance Since it does not protrude or ooze out to the outside, even if the distance between the conductors 29 is high-definition and the distance between the conductors 29 is reduced, problems such as short-circuiting between the conductors 29 do not occur.

  Further, since the conductive slurry 28 that easily wets each other and the hydrophilic portion 23a and the hydrophobic portion 23b are combined, and the ceramic slurry that easily wets each other and the hydrophilic portion 23a and the hydrophobic portion 23b are combined, dust is generated on the conductor 28 or the ceramic body 37. And the conductor 29 is not broken. Even when the thin ceramic body 37 is formed, an unexpected through hole other than the designed one is not formed, so that the ceramic body 37 having excellent insulation can be formed.

  By laminating a plurality of composite sheets 33 produced by the method for producing a composite sheet 33 of the present invention described above, for example, a laminate 41 as shown in FIG. 9 is produced, and this laminate 41 is fired. Thus, the laminated component 1 as shown in FIG. 1 can be manufactured with high accuracy and speed.

Further, alternatively, may be provided through conductors in the multilayer polymer may be formed wired circuit, such as by lamination.

  In this way, the manufactured laminated part 1 has high-density and high-definition conductors 29 and has high reliability because the insulation between the conductors 29 is ensured at a high level.

  1 and 9, the shape of the conductor is described as a rectangle, but the conductor 29 has, for example, one main surface larger than the other main surface as shown in FIG. Nor.

  In the example described above, only a specific combination has been described. For example, a ceramic slurry containing a hydrophobic solvent may be applied to the hydrophobic portion 23b, and the hydrophilic portion 23a and the hydrophobic portion of the PS plate 25 may be applied. It goes without saying that various combinations can be made as necessary as to how the portion 23b, the conductor slurry 28, and the ceramic slurry are combined.

  The thickness of the conductor 29 and the ceramic body 37 is preferably as thin as possible in order to speed up the drying time after coating. However, when the laminated component 1 is formed when the layer thickness is excessively thin, the insulation between the layers is improved. There is a problem of deterioration. In order to achieve these two items in a well-balanced manner, both are formed by a thin layer of 10 μm or less, particularly 8 μm or less, and further 5 μm or less, and the thickness difference between the ceramic body 37 and the conductor 29 is 50% or less of the thickness of the conductor 29, The difference from the ceramic body 37 due to the thickness of the conductor 29 itself is particularly 20% or less, further 10% or less, or the thickness difference is 5 μm or less, particularly 2 μm or less, further 1 μm or less. Can be substantially suppressed.

  The conductor 29 can form a planar circuit by extending the ceramic body 37 or the ceramic green sheet 31 in the planar direction. In addition, the via conductor 5 can be formed by partially stacking the conductor 29 in the thickness direction when the composite sheet 33 is laminated.

  According to the present invention, the ceramic multilayer circuit board 1 can be formed by laminating, for example, about 20 to 50 layers of the composite sheet 33 in order to form a desired circuit.

The inorganic powder used for the ceramic body 37 is, for example, (1) a ceramic material whose main component is Al ₂ O ₃ , AlN, Si ₃ N ₄ , SiC and having a firing temperature of 1100 ° C. or higher, and (2) at least SiO. ₂ and a ceramic material fired at 1100 ° C. or less, particularly 1050 ° C. or less, comprising a mixture of metal oxides containing alkaline earth metal oxides such as BaO, CaO, SrO and MgO, (3) glass powder, or glass At least one selected from the group of low-temperature sinterable ceramic materials fired at 1100 ° C. or less, particularly 1050 ° C. or less, comprising a mixture of powder and ceramic filler powder is selected.

As the mixture of (2) and the glass composition of (3) used, SiO ₂ —BaO—Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ systems, SiO ₂ —Al ₂ O ₃ —alkali metal oxide systems, and compositions in which alkali metal oxides, ZnO, PbO, Pb, ZrO ₂ , TiO _2, etc. are blended with these systems. Examples of the ceramic filler in (3) include at least one selected from the group consisting of Al ₂ O ₃ , SiO ₂ , forsterite, cordierite, mullite, AlN, Si ₃ N ₄ , SiC, MgTiO ₃ , and CaTiO _3. The glass is preferably mixed at a rate of 20 to 80% by mass with respect to the glass.

  On the other hand, the conductor 29 is variously combined according to the firing temperature of the ceramic material. For example, when the inorganic powder used for the ceramic body 37 is (1), at least one selected from the group consisting of tungsten, molybdenum, and manganese is used. A conductor material having a main component is preferably used. Moreover, it is good also as a mixture with copper etc. for resistance reduction.

  When the inorganic powder used for the ceramic body 37 is (2) or (3), a conductor material mainly composed of at least one selected from the group consisting of copper, silver, gold, and aluminum is suitable for the conductor 29. Used.

  The conductive material preferably contains an inorganic powder constituting the ceramic body 37 and the ceramic green sheet 31 when fired simultaneously with the ceramic body 37 and the ceramic green sheet 31.

  In addition, the conductive slurry 28 may be added to the metal powder described above with an organic binder such as ethyl cellulose or acrylic resin, if necessary, and further dibutyl phthalate, α-terpineol, butyl carbitol, or 2,2,4-trimethyl. -3 · 3-pentadiol monoisobutyrate, a suitable solvent such as water is mixed, and the mixture is homogeneously kneaded with a three-roller or a ball mill.

  In preparing the ceramic slurry used to form the ceramic body 37, desirably, the inorganic powder is mixed with an organic binder as a resin and a plasticizer in water or an organic solvent and kneaded with a ball mill. To do. The organic binder is made of isobutyl methacrylate, methyl methacrylate, methyl acrylate, or the like, and DBP, DOP, or the like is suitably used as the plasticizer. When an organic solvent is used, toluene, IPA, acetone, butyl cellosolve or the like is used.

  When the resin film 21 is used as the support plate 25, paraffin, stearic acid, a silicone resin, and a fluorine compound having a perfluoroalkyl group as a hydrophilic portion are applied as a hydrophobic portion 23b by screen printing or an ink jet printer, A method of forming a desired pattern comprising a hydrophilic portion 23a and a hydrophobic portion 23b on a resin film 21, or a PET film 21 whose surface is treated with silicone is prepared, and roughened with a desired pattern, for example, by sandblasting Thus, a pattern including the hydrophilic portion 23a and the hydrophobic portion 23b may be formed on the resin film 21.

  Further, in the step of laminating and press-bonding the composite sheet 33, it is desirable to form a laminate at a pressure of 0.2 to 10 MPa in a lump while aligning the composite sheet 33. In addition, it is desirable to perform the pressure bonding while applying a temperature equal to or higher than the glass transition point of the resin contained in the composite sheet 33. By doing so, the resin component is softened by heat, and the composite sheets 33 can be easily bonded to each other even at a low pressure.

  The application of the conductor slurry 28 or the ceramic slurry to the support plate 25 may be performed a plurality of times as necessary, and the thicknesses of the conductor 29 and the ceramic body 37 can be arbitrarily changed depending on the number of times of application. In addition, by doing so, it is possible to reduce the stacking process, and it is possible to further reduce the cost.

  Further, in the example shown in FIG. 4 in which only the conductor 29 is formed on the PS plate 25, the ceramic multilayer circuit board 1 can be manufactured thereafter by a normal method for manufacturing a ceramic multilayer circuit board. At this time, finer conductors 29 and ceramic bodies 37 can be formed as compared with a conductor forming method by a normal screen printing method.

  In firing the laminate 41, the organic binder contained in the laminate 41 is eliminated in the binder removal step, and the conductor 29 used in the firing step in air or an inert atmosphere such as nitrogen, It is desirable that the ceramic body 37 and the ceramic green sheet 31 are fired at a temperature at which the ceramic body 37 and the ceramic green sheet 31 can be sufficiently fired to be densified to a relative density of 90% or more.

  Further, as necessary, as a surface treatment, further, by printing / baking a thick film resistance film or a thick film protective film on the surface of the multilayer component 1, plating, and further joining an electronic component 4 including an IC chip The ceramic circuit board 1 can be produced.

  In addition, a conductive paste may be printed and dried on the surface of the fired laminate 41 and baked in a predetermined atmosphere to form a wiring pattern, or a wiring pattern may be formed by evaporating metal or the like. Also good.

  Further, on the surface of the conductor 29 and the terminal electrode formed on the surface of the ceramic multilayer circuit board 1, a plating layer of nickel, gold or the like is formed to a thickness of 1 to 3 μm in order to improve wettability with solder. May be.

  Needless to say, the ceramic slurry and the conductor slurry 28 can be dried using infrared rays, far-infrared rays, and ultraviolet rays, in addition to drying with heat using a heater or warm air.

First, 100 parts by weight of an inorganic powder, 15 parts by weight of an organic binder (isobutyl methacrylate), and 70 parts by weight of pure water were kneaded for 24 hours with a ball mill to prepare a hydrophilic ceramic slurry. Further, in place of pure water, 70 parts by weight of toluene was added to the above inorganic powder and 15 parts by weight of an organic binder (isobutyl methacrylate) to prepare a hydrophobic ceramic slurry. In addition, the inorganic powder is 10 parts by mass in terms of B ₂ O ₃ and Li in terms of LiCO ₃ with respect to 100 parts by weight of the main component represented by 0.95 mol MgTiO ₃ -0.05 mol CaTiO _3. 5 parts by mass was added and mixed, and the mixed raw material having an average particle size of 1 μm was used.

  Further, a barium borosilicate glass powder, ethyl cellulose, and pure water were added to an Ag powder having an average particle diameter of 1 μm and mixed with a three roll mill to prepare a hydrophilic conductor slurry. In addition, 2,2,4-trimethyl-3,3-pentadiol monoisobutyrate was added instead of pure water to prepare a hydrophobic conductor slurry.

Next, a PS plate having a thickness of 200 μm to be used for offset printing or the like is prepared, and a glass mask on which a predetermined negative pattern is formed in advance is prepared, and placed close to the PS plate at intervals of 50 to 200 μm. Then, exposure was performed under the condition of 100 mJ using an ultra-high pressure mercury lamp as a light source (illuminance 30 mW / cm ² ). Then, spray development was performed for 45 seconds using a 2.5% aqueous solution of triethanolamine as a developer. Thereafter, washing and drying were performed to form a predetermined pattern comprising a hydrophilic portion and a hydrophobic portion on the PS plate.

  As shown in FIGS. 10A and 10B, this pattern has a hydrophilic portion 23a and a hydrophobic portion 23b, each having a width W of 30 to 100 μm and an interval L of 30 to 100 μm. A comb-like pattern was obtained.

Next, a hydrophilic conductive slurry and a hydrophilic ceramic slurry are applied to a PS plate having a comb-like pattern formed by the hydrophilic portion 23a, for example, as shown in FIG. each was coated, and dried at 70 ° C., on the PS plate, and conductor thickness 5 [mu] m, to form respectively a ceramic having a thickness of 5 [mu] m, to prepare a multi-coalescence.

  10 pieces of each sample were prepared, and between the conductors and between the ceramic bodies were enlarged 100 to 1000 times, and there was a part where the interval L was less than 50% with respect to the set interval L. Defective. Moreover, the thing whose width W was less than 30% was also determined to be defective.

  Table 1 shows the set intervals of the conductor and the ceramic body and the incidence of defects.

Further, the conductor thus formed and the ceramic body are transferred to a conventionally known ceramic green sheet under conditions of 50 ° C., 2 MPa, 1 minute, the support is peeled off, and the conductor, to form a ceramic body, to prepare a multi focus sheet.

  The same evaluation as that performed before transferring the conductor or the ceramic body to the ceramic green sheet was performed.

Further, as a comparative example, the same evaluation was performed by printing a hydrophilic or hydrophobic conductive slurry, a hydrophilic or hydrophobic ceramic slurry on an aluminum plate, a PET film, or a ceramic green sheet by a screen printing method by conventional screen printing. Went. The results are shown in Table 1.

  As shown in Table 1, Sample No. which is outside the scope of the present invention. In Nos. 13 to 24, bleeding or dusting of the conductor or ceramic body was confirmed, and it was not determined as a good product.

On the other hand, specimen No. In Nos. 1 to 6, neither blur nor dust was observed, and a high-definition composite could be produced. In addition, the specimen was transferred a multi incorporated into ceramic green sheet No. Also in 7-12, neither blur nor dust was confirmed, and a high-definition composite sheet could be produced.

  First, in the same manner as in Example 1, a hydrophilic conductor slurry, a hydrophobic conductor slurry, a hydrophilic ceramic slurry, and a hydrophobic ceramic slurry were prepared.

  Next, a PS plate having a hydrophilic part and a hydrophobic part was produced in the same process as in Example 1.

  The PS plate-1 in which a predetermined wiring circuit pattern is formed by the hydrophilic portion, the surface on which the hydrophilic portion and the hydrophobic portion of the PS plate-1 are formed, and the hydrophilicity of the other PS plate-2 When the part and the surface on which the hydrophobic part was formed faced each other, a PS plate-2 having a hydrophilic portion as a portion corresponding to the hydrophobic part of the PS plate-1 was produced. Then, a hydrophilic conductor slurry is applied to PS plate-1 with a screen printer and dried at 70 ° C. to form a conductor with a predetermined pattern thickness of 5 μm on PS plate-1, and hydrophilic to PS plate-2. Was applied by a screen printer and dried at 70 ° C. to form a ceramic body having a predetermined pattern thickness of 5 μm on PS plate-2.

  Next, the side of the PS plate-1 on which the conductor is formed and the side on which the ceramic body of the PS plate-2 on which the ceramic body is formed are faced to each other, laminated, 50 ° C., 2 MPa Crimping was performed for 1 minute.

  Further, PS plate-3 having a portion corresponding to the hydrophilic portion of PS plate-1 as a hydrophobic portion and PS plate-4 having a portion corresponding to the hydrophilic portion of PS plate-2 as a hydrophobic portion were prepared, and PS plate-3 was obtained. A hydrophobic conductor slurry was applied and dried to form a conductor on PS plate-3, and a hydrophobic ceramic slurry was applied to PS plate-4 and dried to form a ceramic body on PS plate-4. Then, the lamination pressing was performed in the same manner as in the case of PS plate-1 and PS plate-2.

  At this time, the width of the conductor and the interval between the conductors were changed in the range of 30 to 100 μm. In this way, a composite sheet was produced in which the conductor and the ceramic body having different widths and intervals were integrated.

  30 layers each of these composite sheets were laminated under the conditions of 50 ° C., 10 MPa, and 2 minutes to prepare a laminate.

  Furthermore, these laminates were debindered in the atmosphere at 300 ° C. for 2 hours, and then fired in the atmosphere at 900 ° C. for 1 hour to produce 30-layer laminated parts.

For these laminated parts, continuity evaluation was performed using a tester in order to confirm the disconnection of the surface layer pattern, the presence or absence of a short circuit, and the connectivity of vias. A sample in which 10 or more continuity failures occurred with respect to 50 samples was determined to be defective. The results are shown in Table 2.

As shown in Table 2, specimen No. In 25-30, there was absolutely no disconnection or electrical short circuit, and a laminated part having excellent reliability was obtained.

  First, in the same manner as in Examples 1 and 2, a hydrophilic conductor slurry, a hydrophobic conductor slurry, a hydrophilic ceramic slurry, and a hydrophobic ceramic slurry were prepared.

  Next, a PS plate having a hydrophilic part and a hydrophobic part was produced in the same process as in Example 1.

  First, a hydrophilic conductor slurry was applied to PS plate-5 on which a predetermined wiring circuit pattern was formed by a hydrophilic portion, and dried at 70 ° C. to form a conductor.

  Next, a hydrophobic ceramic slurry was applied to the PS plate-5 and dried at 70 ° C. to form a ceramic body having a shape of a conductor, positive and negative.

  The conductor thus formed was transferred to a resin film under the conditions of 50 ° C., 2 MPa, and 1 minute, and the resin film on which the conductor was formed and the PS plate-5 on which the ceramic body was formed were aligned, and between the conductors A ceramic body was formed to produce a composite sheet.

  Further, the ceramic body is first transferred to the resin film, the resin film on which the ceramic body is formed, and the PS plate-5 on which the conductor is formed are aligned, and a conductor is formed between the ceramic bodies, A composite sheet was produced.

  Contrary to the above example, a composite sheet is produced using a hydrophobic conductive slurry and a hydrophilic ceramic slurry for PS plate-6 in which a wiring circuit pattern is formed by a hydrophobic portion. did.

  And 30 layers of these composite sheets were each laminated | stacked on the conditions of 50 degreeC, 10 Mpa, and 2 minutes, and the laminated body was produced.

  Furthermore, these laminates were debindered in the atmosphere at 300 ° C. for 2 hours, and then fired in the atmosphere at 900 ° C. for 1 hour to produce 30-layer laminated parts.

For these laminated parts, continuity evaluation was performed using a tester in order to confirm the disconnection of the surface layer pattern, the presence or absence of a short circuit, and the connectivity of vias. A sample in which 10 or more continuity failures occurred with respect to 50 samples was determined to be defective. The results are shown in Table 3.

As shown in Table 3 , Sample No. In 31 to 42, either completely disconnected even without electrical short, was obtained laminate device having excellent reliability.

Shows (a) a schematic perspective view of a ceramic multilayer circuit board, a schematic cross-sectional view of (b) a ceramic multilayer circuit board as an example of a product layer components. It is process drawing for demonstrating the manufacturing method of the support plate used by this invention. It is process drawing for demonstrating the manufacturing method of the composite_body | complex of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the composite sheet of this invention. It is process drawing for demonstrating the manufacturing method of the laminated body of this invention, and the manufacturing method of laminated components. It is a schematic diagram for demonstrating the comb-tooth pattern used by the evaluation test.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Laminated component, ceramic multilayer circuit board 23a ... hydrophilic part 23b ... hydrophobic part 21 ... 3rd support plate, aluminum plate, resin film, PET film 25 ... support plate, PS plate , First support plate, second support plate 28 ... conductor slurry 29 ... conductor 31 ... ceramic green sheet 33 ... composite sheet 37 ... ceramic body 41 ... laminated body

Claims (7)

A step of preparing a support plate made of an aluminum plate on which at least one main surface is formed with a hydrophilic portion of an aluminum background and a hydrophobic portion of a photocurable resin, and at least one of a metal powder and a hydrophilic solvent or a hydrophobic solvent By applying a conductive slurry containing one of the solvents to the main surface of the support plate by a screen printing method , the conductive slurry containing the hydrophilic solvent remains on the surface of the hydrophilic portion, or Leaving the conductive slurry containing the hydrophobic solvent on the surface of the hydrophobic portion and drying to form a conductor from the conductive slurry only on one surface of the hydrophilic portion or the hydrophobic portion; and And a step of transferring the conductor to one main surface of the ceramic green sheet. A step of preparing a first support plate made of an aluminum plate on which at least one main surface is formed with a hydrophilic portion of an aluminum background and a hydrophobic portion of a photocurable resin; at least a metal powder and a hydrophilic solvent or a hydrophobic solvent; Is applied to the main surface of the first support plate by a screen printing method , whereby the conductive slurry containing the hydrophilic solvent is applied to the hydrophilic portion. Or the conductive slurry containing the hydrophobic solvent is allowed to remain on the surface of the hydrophobic portion and dried, so that only the surface of either the hydrophilic portion or the hydrophobic portion is exposed to the conductive slurry. Forming a conductor;
Preparing a second support plate made of an aluminum plate having at least one main surface formed with a hydrophilic portion of an aluminum background and a hydrophobic portion of a photocurable resin; and at least an inorganic powder and a hydrophilic or hydrophobic solvent The ceramic slurry containing any one of the solvents is applied to the main surface of the second support plate by a screen printing method , whereby the ceramic slurry containing the hydrophilic solvent is applied to the hydrophilic portion. Or the ceramic slurry containing the hydrophobic solvent is allowed to remain on the surface of the hydrophobic portion and dried, and the ceramic slurry is applied only to the surface of either the hydrophilic portion or the hydrophobic portion. Forming a ceramic body;
The side forming the conductor of the first support plate, is brought into contact with the side of forming the ceramic body of the second support plate, laminating to fill the ceramic body between the conductors The manufacturing method of the composite sheet characterized by comprising. The method for producing a composite sheet according to claim 2 , wherein the conductor and the ceramic body have substantially the same thickness. A step of preparing a first support plate made of an aluminum plate on which at least one main surface is formed with a hydrophilic portion of an aluminum background and a hydrophobic portion of a photocurable resin; at least a metal powder and a hydrophilic solvent or a hydrophobic solvent; Is applied to the main surface of the first support plate by a screen printing method , whereby the conductive slurry containing the hydrophilic solvent is applied to the hydrophilic portion. Or the conductive slurry containing the hydrophobic solvent is allowed to remain on the surface of the hydrophobic portion and dried, so that only the surface of either the hydrophilic portion or the hydrophobic portion is exposed to the conductive slurry. Forming a conductor;
A step of preparing a second support plate made of an aluminum plate having a main surface formed with a hydrophilic portion of an aluminum background and a hydrophobic portion of a photocurable resin, and at least one of an inorganic powder and a hydrophilic solvent or a hydrophobic solvent. By applying a ceramic slurry containing one of the solvents to the main surface of the second support plate by a screen printing method , the ceramic slurry containing the hydrophilic solvent is applied to the surface of the hydrophilic portion. The ceramic slurry containing the hydrophobic solvent is left on the surface of the hydrophobic portion and dried, and the ceramic body is formed from the ceramic slurry only on one surface of the hydrophilic portion or the hydrophobic portion. Forming, and
The main surface of the third supporting plate consists of a ceramic green sheet, the transfer of the ceramic body, and then characterized by being provided with a step of transferring the conductors to fill between the ceramic body A method for producing a composite sheet. The method for producing a composite sheet according to claim 4 , wherein the conductor and the ceramic body have substantially the same thickness. A method for producing a laminate comprising a step of laminating a plurality of composite sheets produced by the method for producing a composite sheet according to any one of claims 1 to 5 . A method for producing a laminated part, comprising the step of firing the laminate according to claim 6 .

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